场发射扫描电子显微镜

场发射扫描电镜的样品制备和操作步骤场发射扫描电镜（Field Emission Scanning Electron Microscopy）是一种高分辨率的电子显微镜技术，可用于观察和分析各种材料的表面形貌和微观结构。

为了获得清晰的显微图像，样品制备和操作步骤非常重要。

一、样品制备1. 样品的选择：场发射扫描电镜适用于不同种类的材料，如金属、陶瓷、聚合物等。

选择合适的样品很关键，它应具备研究对象的特性，并且能够承受电子束的辐照。

2. 样品的固定：为了保持样品的形状和结构不变，通常需要将其进行固定。

对于固态材料，可以使用金属夹片或导电胶进行固定。

对于液态材料，可以将其冷冻或凝胶化，以保持其形状。

3. 样品的切割和打磨：有时候，需要将样品切割成适当的尺寸，以便放入样品架中。

这可以通过使用金刚石切割机、电解或机械研磨仪器等设备来完成。

4. 样品的真空处理：在将样品放入场发射扫描电镜前，通常需要将其进行真空处理。

这可以通过将样品放入真空干燥器中、在低压下进行加热或冷冻干燥来完成。

真空处理有助于去除空气中的水分和气体，以减小背景干扰。

二、操作步骤1. 打开电镜系统：在开始操作前，需要将场发射扫描电镜系统打开并进行预热。

预热时间通常需要几十分钟，以保证系统内部达到稳定的工作温度。

2. 放置样品：将样品放置在样品架上，并确保其良好接触。

对于粉末状样品，可以使用导电胶将其固定在样品支架上。

对于固态样品，可以使用金属夹片固定在样品架上。

3. 调整显微镜参数：通过调整电子束能量、聚焦、工作距离等参数，来优化扫描电子显微镜的成像质量。

这些参数的选择取决于样品的特性和所需的分辨率。

4. 开始观察：一切准备就绪后，可以开始观察样品。

通过控制电子束的扫描和探测系统，可以获得样品的表面形貌和微观结构的信息。

在观察过程中，要注意避免样品表面的污染和损坏。

5. 数据分析：场发射扫描电镜获得的图像可以进一步进行数据分析。

可以通过对图像进行增强、测量尺寸和形状、进行结构分析等手段，来得到更详细的样品信息。

场发射电子显微镜技术指标1．产品配置要求1.1 场发射扫描电镜主机1套1.2 X射线能谱仪(电制冷) 1套1.3标准附件及工具1套1.4离子溅射仪 1套1.5导电胶带 2卷1.6 场发射灯丝 1根1.7电脑 2台1.8彩色激光打印机 1台2．技术规格2.1 组成：该设备由主机(包括真空系统、电子光学系统、检测器)，自动变压器，冷却循环水系统，X射线能谱仪(SDD)，计算机，标准工具及附件组成。

*2.2 分辨率：1.0nm (15kV，WD=4mm);2.0nm (1kV，WD=1.5mm)常规模式1.4nm(1KV，WD=1.5mm)电子减速功能2.3 加速电压：0.5 ~ 30kV，0.1kV/步2.4 放大倍率：×20 ~ ×800,000*2.5 物镜光栏：加热自清洁式、四孔、可移动物镜光栏2.6 样品室：2.6.1移动范围：X：0~50mm；Y：0~50mm；Z：1.5~30mm；T：-5~70°；R：360°2.6.2最大样品尺寸：100mm*2.7 全自动五轴马达台样品台2.8 电子光学系统具有多种工作模式，可实现高分辨、大束流、大工作距离及磁性样品观测2.9探测器: 具有高位和低位二次电子探头高位探头可选择接受二次电子像或背散射像，并混合*2.10 扫描模式：TV扫描(扫描速度不低于25帧/秒)，慢扫描，用于观察和记录2.11 操作/显示：PC/AT兼容，WindowsXP操作系统2.12 图像储存：640×480，1280×960，2560×1920，5120×3480像素图像文件格式：BMP，JPEG，TIFF2.13数据记录：胶卷号，加速电压，微米标尺，放大倍率，日期，时间，工作距离*2.14电子图像移动：±12μm (WD=8mm)2.15真空系统：2.15.1全自动真空系统2.15.2真空度：10-7Pa (电子枪)；10-4Pa (样品室)*2.15.3真空泵：分子泵×1台；机械泵1台；离子泵×3台2.15.4保护：断电、漏电、真空保护2.16 X射线能谱仪2.16.1探测器制冷方式：电制冷型。

场发射扫描电子显微镜（S-4800）操作规程开机1. 检查真空、循环水状态。

2. 开启“Display”电源。

3. 根据提示输入用户名和密码，启动电镜程序。

样品放置、撤出、交换1. 严格按照高度规定高样品台，制样，固定。

2. 按交换舱上“Air”键放气，蜂鸣器响后将样品台放入，旋转样品杆至“Lock”位，合上交换舱，按“Evac”键抽气，蜂鸣器响后按“Open”键打开样品舱门，推入样品台，旋转样品杆至“Unlock”位后抽出，按“Close”键。

观察与拍照1. 根据样品特性与观察要求，在操作面板上选择合适的加速电压与束流，按“On”键加高压。

2. 用滚轮将样品台定位至观察点，拧Z轴旋钮（3轴马达台）。

3. 选择合适的放大倍数，点击“Align”键，调节旋钮盘，逐步调整电子束位置、物镜光阑对中、消像散基准。

4. 在“TV”或“Fast”扫描模式下定位观察区域，在“Red”扫描模式下聚焦、消像散，在“Slow”或“Cssc”扫描模式下拍照。

5. 选择合适的图像大小与拍摄方法，按“Capture”拍照。

6. 根据要求选择照片注释内容，保存照片。

关机1. 将样品台高度调回80mm。

2. 按“Home”键使样品台回到初始状态。

3. “Home”指示灯停止闪烁后，撤出样品台，合上样品舱。

4. 退出程序，关闭“Display”电源。

注意1. 每天第一次加高压后，进行灯丝Flashing去除污染。

2. 冷场发射电镜一般不断电，如遇特殊情况需要大关机时，依次关闭主机正面的“Stage”电源、“Evac”电源，半小时后关闭离子泵开关和显示单元背面的三个空气开关，关闭循环水。

开机时顺序相反。

3. 每半个月旋开空压机底阀放水一次。

4. 待测样品需烘干处理，不能带有强磁性，不能采用铁磁性材料做衬底制样。

5．实验室温度限定在25±5℃，相对湿度小于70% 。

仪器维护1. 每月进行电镜离子泵及灯丝镜筒烘烤。

2. 每半年进行一次机械泵油维护或更新。

场发射扫描电镜工作原理场发射扫描电镜（Field Emission Scanning Electron Microscope，FE-SEM）是一种利用电子束扫描样品表面并通过信号与图像处理系统来重现样品表面微观结构的高分辨率电子显微技术。

FE-SEM是目前最常用、最成熟的电子显微技术之一，具有分辨率高、对样品厚度敏感度低、对材料表面信息获取能力强等优点。

FE-SEM的工作原理非常复杂，下面简要介绍其基本原理。

FE-SEM主要由以下几个部分组成：电子枪、聚焦系统、扫描系统、检测系统和成像系统。

其中电子枪和聚焦系统是电子束发射和聚焦的部分，扫描和检测系统则负责扫描样品表面并收集反射的电子信号，最后成像系统则将信号转化为图像。

电子枪通过引入高压电场和热发射，产生一个极小尺寸的电子束。

聚焦系统的作用是将电子束聚焦到样品表面上，使其成为一束高能量、小尺寸的电子束。

这个过程中，电子束会出现能量弥散，需要进行补偿，以形成更加稳定的电子束。

扫描系统的作用是将电子束在样品表面进行扫描，构建出样品表面的形貌和结构信息。

这个过程中，扫描器会通过在x和y方向上推动电子束来进行扫描，电子束与样品表面会产生相互作用，产生不同的信号。

这些信号经过检测系统的收集，可以分为两种类型：二次电子信号和背散射电子信号。

二次电子信号主要反映的是样品表面的形貌和镜像信息，而背散射电子信号则主要反映样品表面的成分和晶体结构信息。

检测系统可以通过检测这些信号并转化为图像，将样品表面的形貌和结构再现出来。

不同的检测系统可以处理的信号类型不同，有些可以处理二次电子信号，有些则只能处理背散射电子信号。

一般情况下，将这两种信号进行叠加可以获得更加完整的样品信息。

总的来说，FE-SEM的工作原理基于电子枪和聚焦系统形成高能量、小尺寸的电子束，扫描系统进行扫描和信号收集，检测系统将信号转化为图像再进行成像的整个过程。

在这个过程中，电子束与样品表面的相互作用是最核心的。

Fig. 1　External appearance of SU5000 FE-SEM New Schottky FE-SEM, SU5000Shigeaki Tachibana *1 William Podrazky *2Introduction1.　Scanning Electron Microscopes (SEM) are used for observation and analysis in various fields. Since Field Emission SEM (FE-SEM) equipped with a field emission electron gun source provide higher resolution than those equipped with a thermionic emission electron gun source, the user base for FE-SEM has broadened significantly due to the need to observe specimen features continually decreasing in size. FE-SEMs are increasingly recognized as a tool for performing various surface analyses, however detection technologies for various signals generated from specimens have advanced beyond topographic observation alone. Typically the operator must utilize previous knowledge, training, and skill in microscopy to generate desirable results; therefore, optimal performance may vary based on experience level.　For example, optimal performance may not be realized as a result of improper optical axis alignment or astigmatism correction, utilizing unsuitable accelerating voltage(s), or other parameters. Integrating an automated solution for these problems would allow the user to focus on obtaining comprehensive results under the best possible conditions at all times.　Hitachi High-Technologies has developed a novel user interface which augments conventional SEM techniques to assist these problems. The “EM Wizard” user interface was developed to bring “new usability” to EM operators of various levels of experience. This Schottky FE-SEM, the SU5000, incorporated with EM Wizard interface, launched in August 2014 (Fig. 1).Fig. 2　EM Wizard, objectives selection screen.New Interface: EM Wizard2.　With EM Wizard, rather than setting individual conditions such as the accelerating voltage, working distance, detector, and other parameters, the operator can select an “Observation Purpose,” such as “Surface Information” or “Elemental Information,” from a selection menu (*2). On the screen, a Radar Chart displays the type of content that will be acquired (resolution, surface information, elemental composition), and a simulated SEM image representing how a specimen will appear under each observational objective. This information provides a visual understanding of SEM image characteristics that can guide the operator in selecting these objectives (Fig. 2).　When an “Observation Purpose” is selected, related system parameters are set automatically (e.g., accelerating voltage, working distance, detector), and optical axis parameters as well as astigmatism corrections are adjusted to optimal values. Simply by adjusting the brightness/contrast and focus, the operator can easily acquire high quality images at consistent resolution.　In addition to an applications selection menu, what makes these functions possible are high-precision automation technologies initially developed for Critical Dimension (CD) SEM. CD-SEM are entirely automated, and must provide highly reproducible measurements, optical axis alignments, and other adjustments; EM Wizard has been designed to use these automation technologies to reproduce and maintain highly precise adjustments invariably. Because optical axis alignment and astigmatism correction values change with lens conditions over time, they cannot be maintained for long periods, even if stored in the system. However, EM Wizard includes an auto-calibration function which automatically restores parameters to optimal values responsive to long-term changes in lens conditions (*3), eliminating any need for proficiency in readjustment procedures. This feature makes it easier for the operator to obtain images in focus, maintain high reproducibility, and acquire data efficiently.　Figure 3 is an example of a catalyst observed at 200,000× magnification after auto-calibration with the use of EM Wizard. Metal particles several nm in size are discernible during operation without complex adjustment.Fig. 4　Observation of lithium ion battery positive electrode. Left: Secondary electron image. Right: Backscattered electron image.Magnification: 25,000×.Fig. 3.　Catalyst observation. Magnification: 200,000×Low-energy observation3.　In addition to the assistance functions provided by automation as shown above, the SU5000 is equipped with optical and detection systems suitable for any variety of analysis required.　The emitter used is a Schottky-type device which delivers a spatial resolution of 2.0 nm at 1 kV (*4) and high probe current (>200 nA). Figure 4 is an example of the positive electrode of a lithium-ion battery observed at a landing voltage of 0.3 kV.　The positive electrode of Lithium ion batteries is comprised of an active substance consisting of conductors, binders, and other elements. However, some binder materials cannot withstand electron beam irradiation and must be observed at the lowest possible energy.　The left image in Fig. 4 was produced by a secondary electron detector mounted inside the electron column, and the right image was produced by a backscattered electron detector inserted below the lens. In the secondary electron image, the binder appears dark by voltage contrast, while the backscattered electron image allows for distribution of contrast based on each material. In this example, multiple signals are used to evaluate different components of the electrode including topographic and compositional distributions.　It is inferred that the enhanced voltage contrast in the secondary electron image is attributed to differences in the charge effect of each material due to the secondary electron generation efficiency when irradiated by very low-energy incident electrons.4.Concluding RemarksThe SU5000 was developed to address the various needs of SEM users in materials science, biomedicine, and many other fields. As the FE-SEM grows in popularity, Hitachi will continually place importance on functions such as EM Wizard, which are capable of providing high-resolution and optimized contrast images with high reproducibility, regardless of the user experience level.（*2）Patent No. 5416319（*3）Patent No. 5464534（*4）With use of deceleration mode (optional)ReferencesSato M., History of Technologies in high resolution SEM, Kobunshi, 9 (2014)(Japanese).Authors*1 Shigeaki Tachibana, Hitachi High-Technologies Corp., Marketing Department*2 William Podrazky, Hitachi High-Technologies America, Inc.。

Hitach〔日立〕S-4800 型扫描电子显微镜培训材料一、留意事项：1、严禁没有操作资格的人员操作电镜；2、操作人员要严格依据操作规程进展操作，在仪器产生特别时要准时报告全部事实；3、样品制备严格依据要求进展，特别是磁性样品；4、严禁在试验室吃东西，保持试验室清洁卫生；5、不允许在试验室内使用水槽；6、制止在试验室内使用产生大量粉尘的物质；7、不得在试验室内大声喧哗、扰乱正常工作；8、留意试验室内湿度应当在60%以下，留意下水管漏水状况。

培训加考核共6个半天。

必需按时到场，认真学习，不允许半途离开。

培训考核完毕之后，每人进展操作的前两次必需有娴熟人员伴随，并要求伴随人员在使用登记表上签字。

电镜操作的第一前提是要保证人身安全，其次前提是保证仪器设备安全。

第一次培训内容：生疏S-4800的开机、进样、取样、关机等主要步骤。

1、介绍冷热场放射的扫描电镜〔附件一及附件二〕。

冷场放射电镜特点，灯丝不加热，引出电场，束流小，能量分散小，但需要高真空，有气体分子吸附。

扫描电镜的根本原理。

2、介绍S-4800 及能谱的组成局部、电源掌握。

3、先翻开循环水开关，再翻开主机Display 开关。

4、检查离子泵IP1、IP2、IP3 的数据并记录。

5、进入掌握主机桌面，双击图标进入S-4800 的掌握软件。

6、每天开头工作前做Flashing 2 一次，加电压，观看vext 数值〔例如3.8KV〕，假设跟上一次做完flashing 之后的数值〔例如3.7KV〕差异小于0.2KV，则记录此值。

假设与上次相比差异大于0.2KV〔例如本次做完flashing 后vext 数值为4.0KV〕，则需再做一次flashing2，差值应当减小到0.2KV 以内，记录此vext数值。

7、检查样品高度，样品台粘好样后，肯定要用气枪把未粘牢的样品吹掉，并确定被测样品的最高处在标准范围内，不能超出标准高度，也不能低太多；8、如何进样：（1）按交换舱上的AIR〔放气〕按钮，向交换舱充气，听到“嘀——”的声音，可以翻开交换舱。

场发射扫描电子显微镜安全操作及保养规程1. 引言场发射扫描电子显微镜（Field Emission Scanning Electron Microscope，FE-SEM）是现代科学研究中常用的一种实验设备。

本文档旨在说明使用FE-SEM的安全操作规程以及设备的保养方法，保障使用人员的安全并延长设备的使用寿命。

2. 安全操作规程2.1 个人安全 - 在使用FE-SEM之前，使用人员应接受相关培训，了解设备的基本操作方式和安全注意事项。

- 在操作过程中，使用人员应佩戴适当的个人防护装备，包括防护眼镜、手套和实验服等。

- 在进行样品处理和加载时，应注意避免接触有毒或腐蚀性物质，并采取适当的防护措施。

- 若出现设备故障或异常情况，应立即停止操作并向相关人员报告。

2.2 设备安全 - 在操作之前，应检查设备的电源、冷却系统和真空系统是否正常工作。

- 禁止在离设备太近的地方放置易燃、易爆物品。

- 避免使用金属工具或其他尖锐物品直接接触设备，以免损坏设备外壳或导致电气短路。

- 在操作时，确保设备周围没有杂物或其他障碍物，以免影响操作或造成伤害。

2.3 样品处理与装载 - 检查待测样品是否符合FE-SEM的尺寸和材料要求。

- 在进行样品处理和装载时，避免给样品带来静电或其他污染源，保持样品表面干净。

- 使用合适的工具和技术进行样品装载，确保样品与设备接触良好。

3. 设备保养规程3.1 日常清洁 - 定期清洁设备外壳和工作区域，避免尘埃和杂物积累。

- 使用清洁棉布或软刷，避免使用酸性、碱性或腐蚀性溶剂来清洁设备。

- 定期清理样品台和探针，确保设备在正常工作状态下进行观察。

3.2 真空系统维护 - 定期检查真空泵和真空管路的密封性能，确保系统处于正常工作状态。

- 定期更换真空泵的油封、滤芯等易损件，延长设备使用寿命。

- 注意监测真空度的稳定性，如发现异常应及时处理。

3.3 电子枪维护 - 定期检查电子枪的工作状况，清洁电子发射区域，避免灰尘和污垢的堆积。

Instructions f or o perating J EOL J SM-­‐7500FA a nalytical field e mission s canning e lectron m icroscope a t Nanomicroscopy C enterVersion 2.1 (April 2011)Juuso K orhonen (***********************)Latest v ersion o f t his d ocument c an a lways b e d ownloaded f rom:k.fi/en/instruments/sem/jsm-­‐7500fa/SEM-­‐instructions.pdfOfficial i nformationNew u ser t rainingInexperienced u sers h ave a c ouple o f o ptions, l isted b elow i n t he o rder o f preference.1.Ask f or t raining f rom t he m ost e xperienced S EM u ser o f y ourresearch g roup.2.Attend t o t he c ourses T fy-­‐125.4313 a nd T fy-­‐125.4314 M icroscopyof n anomaterials (5+5 c r). T hey a re l ectured e ach s pring b y P rof.Janne R uokolainen.3.Ask o ne o f t he a dministrators t o a rrange a t raining s ession.a.Small g roups o f 2-­‐3 p eople a re p referred f or t he t rainings.Allow s ome t ime t o g ather e nough p eople f or t he g roup.b.Training i s d one u sing a p ractice s ample a nd p ersonalsamples a re u sually n ot i maged.Experienced u sers c an c ontact o ne o f t he a dministrators f or a s hort introduction t o t he e quipment.Every n ew u ser h as t o b e a pproved b y o ne o f t he a dministrators b efore t hey are a llowed t o u se t he S EM o n t heir o wn. T he a dministrator k eeps a s hort (15-­‐30 m in) s ession w here t he e ssential s kills o f t he u ser a re c hecked. User a pplicationUser a pplication h as t o b e f illed i n o rder t o g ain r eservation a ccess t o a ny o f the N MC e quipment. T he f orm c an b e f ound f romk.fi/en/documents/nmc_user_application_form.pdf a nd i t i s returned t o o ne o f t he a dministrators f or a pproval.PricingBilling i s d one u sing t he c urrent N MC p rice l ist. C ontact P rof. J anne Ruokolainen f or t he m ost c urrent l ist. P lease n ote t hat i ndividual t raining given b y t he a dministrators w ill a lso b e c harged.Precautions – r ead c arefully•Always c heck t he l iquid n itrogen l evel a nd f ill i f n ecessary.o First u ser o f t he d ay a lways f ills t he t ank.•Keep a ll p arts c lean a nd c lean t hem i f n ecessary w ith e thanol.o Wear g loves w hen h andling h olders.•Fill t he l og b ook o n t he c omputer.o Mark a ny s trange b ehavior o r p roblems t o t he l og b ook.•If s omething i s m issing f rom t he S EM o r f rom t he s ample p reparation room (e.g. g loves, e thanol, h olders, c arbon t ape), p lease i nform o ne o fthe a dministrators (send e mail o r c all).•Use o nly f eatures y ou a re t rained t o u se. F or e xample, d o n ot u se EDS o r R BEI i f y ou d on’t k now h ow t o o perate t hem s afely.•Use o f U SB s ticks i s s trictly p rohibited d ue t o s ecurity i ssues a nd hardware i ncompatibility.•Stay c alm a nd u se y our c ommon s ense.•Contact a dministrators i f y ou a re i n d oubt. C ontact i nformation i s found o n t he l ast p age o f t hese i nstructions.Quick s tartup p rocedure1.Turn o n b oth m onitors a nd c heck t hat S EM s oftware a nd u sage l og(Excel) a re r unning. S tart t hem i f n ecessary. L og i n a s G uest (nopassword).2.Check t he l iquid n itrogen l evel a nd f ill i f n ecessary. T he f irst u serof t he d ay a lways f ills t he t ank.3.Fill t he u sage l og:a.Date, s tart t ime (and e nd t ime).b.Your n ame (and t he n ame o f y our h ost i f y ou d o n ot h avereservation p ermissions).c.Vacuum l evels b efore s tarting.d.Amount o f f illed l iquid n itrogen (write “0” i f y ou o nlychecked t he l evel).e.Write n otes a nd c omments t o t he l ast f ield i s n ecessary.f.Save t he f ile (Ctrl-­‐S).4.Prepare y our s ample.5.Insert s ample i nto m icroscope:a.Press E xchange p osition.b.Press a nd h old V ENT f or c a. 1 s ec. O pen s ecuring l atch. W ait.c.Open c hamber a nd i nsert h older a long t he d irection o f t hearrows.d.Close c hamber.e.Press a nd h old E VAC f or c a. 1 s ec. W ait u ntil b linking s tops.f.Operate t he r od t o m ove t he s ample t o t he s tage. I f y ou’re n otabsolutely c ertain h ow t o d o t his, r ead t he d etailedinstructions!g.Take o ut t he r od.6.Wait u ntil v acuum l evel r eaches l ess t han 5⋅10-­‐4 P a.7.Set E mission c urrent t o 10 μA.8.Select A cceleration v oltage.9.Press O bservation O N.Shutdown p rocedure1.Press O bservation O FF t o t urn o ff a cceleration v oltage.2.Press E xchange p osition.3.Take o ut h older u sing t he r od.4.Press a nd h old V ENT f or c a. 1 s ec. O pen s ecuring l atch. W ait.5.Open c hamber a nd t ake o ut t he h older.6.Close c hamber.7.Press a nd h old E VAC f or c a. 1 s ec.8.Mark e nding t ime a nd o bservations t o U sage l og a nd s ave f ile (Ctrl-­‐S).9.Set S EM M onitor s oftware t o n ormal s ettings:a.Exchange p osition p ressed (green).b.Mode: S EMc.Magnification: m inimum f or b oth S EM a nd L Md.Probe c urrent: 810.Turn o ff s pecial f eatures y ou h ave u sed: I mage r otation, d ynamicfocus, e tc.11.If y ou m ade a ny c hanges i n t he O peration S ettings m enu, c hangethem t o n ormal v alues (scan s peeds, i mage f unction, e tc.).12.Clean t he h olders w ith e thanol i f n ecessary.13.Clean t ables. I f y ou w ant t o s tore y our s amples, m ark t hem w ith y ourname a nd p ut t hem o nto a s helf. T hings l eft o n t he t able a re t hrowninto t he t rash.14.Transfer y our i mages f rom t he s mall c omputer o n t he b ack t able.You c an f ind y our f iles a t t he n etwork d rive c alled H arley.e U SB s tick, S SH, e mail, o r b urn a C D.b.The f iles c annot b e t ransferred d irectly f rom t he S EMcomputer d ue t o s ecurity r easons.15.Turn o ff m onitors. D o n ot l og o ut f rom t he s oftware o r c lose t heExcel l og b ook.Changing s ample1.Press O bservation O FF t o t urn o ff a cceleration v oltage.2.Press E xchange P osition t o m ove t he s tage t o c orrect p osition.3.Take s ample o ut b y o perating t he r od.4.Press a nd h old V ENT f or c a. 1 s ec. t o f lush c hamber a nd o pen l atch.Wait.5.Open c hamber a nd t ake o ut s ample (pull a long t he a rrows, n ot u p).6.Change s ample a nd i nsert h older a long t he a rrows.7.Close c hamber a nd s ecure w ith l atch.8.Press a nd h old E VAC f or c a. 1 s ec. W ait u ntil b linking s tops.9.Insert s ample b y o perating t he r od. T ake o ut r od.10.Wait u ntil c hamber v acuum r eaches 5⋅10-­‐4 P a b efore t urning o nacceleration v oltage.Special f eaturesThis i s o nly a q uick r eference. S pecial t raining i s r equired t o u se R BEI o r E DS, because o f s afety i ssues.Infrared c ameraYou c an s ee i nside t he c hamber u sing t he i nfrared c amera.1.Switch c amera o n f rom t he b utton o n t he t able.2.From S EM s oftware s elect N avigator -­‐> I nfrared c amera3.Turn c amera o ff w hen u sing R BEI o r E DS.Probe c urrent m eterProbe c urrent m eter c an b e u sed t o c heck t he c urrent g oing t o t he s ample. I t is m ost i mportant i n E DS a nalysis.1.Insert t he d etector b y c hecking P CD f rom t he b ottom r ight c orner o fSEM s oftware.2.Take o ut d etector a fter y ou h ave r ead t he c urrent f rom t he S EMsoftware.Retractable b ackscattering d etector (RBEI)Backscattering d etector i s u sed t o d istinguish b etween e lements o n t he sample.1.Set w orking d istance t o 8 m m o r m ore.a.Inserting R BEI w ith l ess t han 8 m m b etween t he s ample a ndthe o bjective l ens w ill r esult i n s erious d amage.2.Turn o ff i nfrared c amera.3.Insert d etector b y c hecking R BEI f rom t he b ottom r ight c orner o f t heSEM s oftware.4.Select C OMPO o r T OPO f or i mage m ode (same m enu a s S EM a nd L M)and u ser a s low s canning s peed f or o bservation.X-­‐ray a nalysis (EDS)This g uide i s n ot a dequate f or p roper o peration o f E DS, b ut i s o nly a q uick reference f or t rained u sers.1.Set w orking d istance t o e xactly 8 m m.a.Focus w ith Z h eight u sing t he r ing o f t he s croll w heel i nsteadof F OCUS.2.Insert R BEI.3.Turn o n b ias v oltage b y c licking t he l ightning i ndicator.a.Wait u ntil c ount r ate s tabilizes.4.Select A nalysis f rom t he r ight s ide o f S EM s oftware.5.Click D T (dead t ime) a nd s elect T4 f rom t he l ist.6.Adjust p robe c urrent s o D T b ecomes g reen (around 20-­‐30 %) a ndcount r ate i s c a. 2000-­‐3000 c ps.7.Take s pectra, l ine s can, o r m apping u sing t he a ppropriate b uttons.8.When a sked a bout s aving t o a n etwork d rive, s elect O K.9.Save t he a nalysis b efore e xiting a nalysis m ode i n o rder t o b e a ble t oreturn t o t he a nalysis l ater.a.Exporting o nly s aves t he i mage a nd y ou c annot r eturn t omake m ore a nalysis o n t he d ata.10.When y ou a re f inished w ith a nalysis, t urn o ff t he b ias v oltage a ndtake o ut R BEI.Saving E DS s pectraIf y ou w ant t o b e a ble t o p lot y our E DS s pectrum, s elect E xport a nd t hen select M SA f ile. I t w ill s ave t he s pectrum i n a c ompatible f ile f or u se i n O rigin, Excel, o r s ome o ther p lotting p rogram.Detailed i nstructionsOperating t he r od (sample e xchange m echanism)This p rocedure d escribes h ow t o u se t he s ample e xchange m echanism i norder t o e ither r emove o r i nsert a s ample h older i nto/from t he m icroscope.Read t his s ection c ompletely t hrough b efore p roceeding a nd m ake s ure t hatyou u nderstand e very s tep.Precondition: T he e xchange c hamber i s i n v acuum a nd t he d oor s eparatingit f rom t he m icroscope i s o pen. C onfirm t hat E VAC l ight i s l it a nd n otblinking. D epending o n w hether y ou a re i nserting o r t aking o ut a s ample, t heholder m ight b e i n t he e xchange c ompartment (HLDR l ight i s o ff) o r i nsidethe m icroscope (HLDR l ight i s o n).See t he v ideo o n t he c omputer d esktop f or a d emonstration. U PDATE: T hefigures a re f rom a n o ld v ersion o f r od.1.Push t he b ar i nside t he m icroscope b y f ollowing t he p rocedure:a.Lower t he r od t o h orizontal l evel, w hile l ightly h olding i tback.b.Let t he r od b e p ulled i n s lowly.c.Push t he b ar g ently a ll t he w ay i nside u ntil i t s tops (d).•There i s a l ittle r esistance a t t he f inal c ouple o fcentimeters.•The s ample s hould b e n ow e ither r eleased f romthe b ar o r a ttached t o i t (depending o n w hetheryou a re i nserting o r r emoving t he h older).•If y ou h ave n ot p ushed t he s ample a ll t he w ayinside a nd s tart t o p ull b ackwards t here i s adanger t hat t he s ample h older w ill f all t o t hebottom t he s ample c ompartment. I f t his h appens,the w hole s ample c ompartment h as t o b e o pened.Contact S EM a dministrators i n t his c ase.2.Pull t he b ar o ut f rom t he m icroscope u sing t he f ollowingprocedure:a.Pull t he b ar o ut a s f ar a s i t c omes (e).•The t wo a rrows o n t he h older s hould a lign w iththe p ipe e nd.•If y ou h ave n ot p ulled f ar e nough, t he r od m ightbe d amaged d uring t he l ift.b.Lift t he r od u pwards t o v ertical.•Now y ou s hould e ither h ave t he s ample i nside t hemicroscope o r i n t he e xchange c ompartment a ndthe e xchange c ompartment i s i n v acuum.Opening t he s ample e xchange c ompartmentThe f ollowing p rocedure d escribes h ow t o b ring t he e xchangecompartment t o a tmospheric p ressure.Precondition: T here i s n o s ample i nside t he m icroscope o r i t h as b eenbrought t o t he e xchange c ompartment, a nd t he e xchange c ompartment i sin v acuum. F irst c heck t hat H LDR l ight i s o ff o n t he s ample e xchangecompartment (i.e. t here i s n o s ample i nside t he s ample c ompartment).Figure. S ample e xchange r od1.Pressurize t he e xchange c ompartment:a.Press a nd h old (for a bout 1 s econd) t he V ENT b utton o n t heexchange c ompartment.i.The b utton s tarts t o b link a nd y ou h ear s ome s ounds.ii.In a f ew s econds, t he d oor b etween t he e xchangecompartment a nd t he s ample c ompartment c loses.You c an o bserve t his b y e ar a nd b y l ooking a t t hebottom r ight c orner o f t he S EM M onitor.2.Open t he l atch a s s oon a s y ou h ear t he c lick.3.Open t he e xchange c ompartment d oor (it s hould o pen a lmost b yitself).a.You d o n ot n eed t o w ait u ntil t he p umping h as s topped.b.The c ompartment w ill c ontinue p urging f or a f ixed a mount o ftime. Y ou d o n ot h ave t o w ait u ntil i t s tops a nd y ou c anevacuate i t a s s oon a s y ou l ike.4.Now y ou h ave t he s ample c ompartment o pen a nd r eady f orloading/unloading t he s ample h older.Inserting a s amplePrecondition: T here i s n o s ample i nside t he s pecimen c hamber a nd exchange c ompartment i s i n v acuum. F irst c heck t hat H LDR l ight i s o ff o n the e xchange c ompartment (i.e. t here i s n o s ample i nside).1.Move t he s tage t o e xchange p osition:a.Click E xchange P osition o n t he S EM M onitor.i.If b utton i s n ot v isible, c lick "Specimen" f rom t herightmost e dge o f S EM M onitor.ii.Make s ure t hat E XCH P OSN i s l it o n t he e xchangecompartment, b efore p roceeding.2.Bring t he e xchange c ompartment t o a tmospheric p ressure b yfollowing p rocedure i n s ection “Opening t he s ample e xchangecompartment”. Q uick n otes:a.Press a nd h old V ENT f or c a. 1 s ec.b.Open l atch. W ait.c.Open c hamber d oor.3.Put o n g loves i f y ou d o n ot h ave t hem a lready o n.a.Parts t hat a re i n c ontact w ith t he v acuum s hould b e k eptabsolutely c lean. I f y ou h ave t ouched s ome p art, c lean t he p artwith e thanol (not a cetone).4.Insert h older t o t he s pecimen c huck:a.Slide t he s pecimen h older i nto t he s pecimen c huck a long t hearrow d irection o n t he s pecimen h older.5.Check t hat t he O-­‐ring s eal o n t he d oor i s O K a nd w ipe i t w ith a c leanglove i f n eeded t o g et r id o f a ny d ust.a.If t he r ing i s r eally d irty, w ipe i t w ith e thanol o r i sopropanol(do n ot u se a cetone o r m ethanol).6.Close t he c hamber d oor a nd s ecure i t w ith t he l atch.7.Evacuate t he c ompartment b y p ressing a nd h olding E VAC (forabout 1 s econd). T he l ight w ill s tart b linking.a.Wait u ntil t he l ight s tops b linking a nd t he d oor s eparatingthe e xchange c ompartment i s c losed. Y ou c an o bserve t hisfrom t he b ottom r ight p art o f t he S EM M onitor.8.Insert t he s ample h older i nside t he m icroscopea.Refer t o s ection “Operating t he r od” i f i n d oubt.9.A p opup w indow s hould a ppear o n t he S EM M onitor. N ow s elect t heappropriate h older a nd s et t he o ffset v alue.a.If p opup d oes n ot a ppear, t ake o ut t he h older a nd i nsert i tagain.10.Wait u ntil t he v acuum l evel r eaches 9.6·10-­‐5 P a (if t hat i s n otpossible, w ait a t l east u ntil 5·10-­‐4 P a).Taking o ut s amplePrecondition: T here i s a s ample i nside t he m icroscope a nd e xchange compartment i s i n v acuum. F irst c heck t hat H LDR l ight i s o n o n t he s ample exchange c ompartment (i.e. t here i s a s ample i nside) a nd E VAC l ight i s o n and n ot b linking.1.Click O bservation O FF t o t urn o ff a cceleration v oltage.2.Click E xchange P osition t o m ove t he s ample h older t o t he e xchangeposition.a.Make s ure t hat E XCH P OSN i s l it o n t he e xchangecompartment b efore p roceeding.3.Bring t he s ample t o t he e xchange c ompartment b y o perating t herod.a.Refer t o s ection “Operating t he r od” i f y ou a re n ot a bsolutelycertain h ow t o d o t his.4.Pressurize t he e xchange c ompartment:a.Press a nd h old V ENT f or c a. 1 s ec u ntil i t s tarts t o b link.b.Open s ecuring l atch. W ait.c.Open c hamber d oor.5.Now y ou h ave t he s ample c ompartment o pen a nd y ou a re r eady t akeout y our s ample. I f y ou a re d one w ith t he i maging, j ust c lose t heexchange c hamber a nd e vacuate i t o therwise c ontinue w ith i nsertinga n ew s ample. D o n ot l eave t he c hamber o pen f or a l ong p eriod o ftime, b ut e vacuate i t i f n eeded.Sample h oldersSample h olders c onsist o f a b ase p art a nd a n a dapter p art (show o n t he f igure right). T here a re t hree d ifferent a dapters f or d ifferent s pecimen s tubs s hown in t he f igure b elow (a, b , c , d ).The m ost b asic h olders a re t he 12.5 m m (b-­‐1) a nd 25 m m (c-­‐1) a luminum “JEOL” s tubs . T hey s hould b e u sed w henever p ossible. S tubs s hould a lways b e available a t t he s ample p reparation r oom, b ut y ou c an a lso o rder y our o wn ones e .g. f rom E MS (order n umbers 75730, a nd 75700). T he u se o f r egular holders i s i ncluded i n t he o peration p rice o f t he m icroscope.Also “mini-­‐stubs” a re a vailable f or u se w ith a p rovided a dapter. T hey a re preferred f or s mall s amples. T hey c an b e o rdered f rom T ed P ella (order numbers 16180, a nd 16181).For s pecial o ccasions, a H itachi a dapter (a) c an b e u sed. S pecial c are m ust b e taken w hen u sing t hese h olders, b ecause t hey l ack s ome s afety f eatures. Ask a dministrators, i f y ou h ave s pecial r equests f or h olders. T here a re a lso different k inds o f c ross-­‐section h olders a vailable. A sk t he a dministrators f or more i nformation.Attaching a dapter t o b ase p arta) Make s ure t hat p arts a re n ot d irty, c lean i f n ecessary. b) Place a dapter o n t he b ase p art.c) Tighten s crew o n t he b ase p art l ightly.Figure. A ttaching a dapter t o base p art.Figure. 12.5 m m a nd 25 m m "JEOL" stubs.Figure. "Mini-­‐stubs" a nd 12.5 m m a dapter.Figure. C ross-­‐section holders.Sample h eightAlign t he t op o f t he s ample w ith t he g roove i nside t he J EOL a dapter p art. U se the s crew o n b ottom t o r aise o f l ower t he s ample. W hen u sing a nother holder, m ake s ure t hat h eight f rom t able t op l evel i s e xactly 25 m m.CoatingFor n on-­‐conductive s amples a c oating i s u sually n eeded f or o bservation i n SEM. T his c an b e e asily p erformed b y u sing s putter c oating o f g old, p latinum, or g old-­‐palladium. T here i s a s putter c oater a t N MC, w hich c an b e u sed f or this p urpose. R esolution l imiting f actor i s t he g rain s ize, w hich i s u sually 5-­‐20 nm d epending o n t he c onditions o f s puttering.Also c arbon c oating c an b e u sed t o m ake s amples c onductive. I t i s a nappealing m ethod, w hen d oing X -­‐ray a nalysis. I t c reates a v ery u niform l ayer without n oticeable grains.Figure. A lign t op o f stub w ith t he g roove on t he s ample holder.Basic m icroscope o perationBasic c onceptsWorking d istance a nd Z v alueWorking d istance (WD) v alue s ets t he e ffective f ocal l ength o f t he o bjective lens.Z h eight v alue s ets t he d istance o f t he (supposed) s urface l evel o f t he s ample from t he o bjective l ens.These t wo v alues a re e qual, w hen t op o f s ample i s a ligned w ith t he t op o f the h older (ie. 25 m m h igh f rom t able l evel, s ee f igure). W D > Z, i f y our sample i s l ower t han t he c orrect l evel a nd v ice v ersa. I f W D < Z y ou n eed t o set t he S ample O ffset v alue a ccordingly.Sample o ffsetThe h eight o f t he t op l evel o f t he s ample m easured f rom t able t op l evel should b e e xactly 25 m m. T he s ample c an b e s et a lso 0-­‐4 m m h igher t han t he nominal l evel, b ut t hen t he S ample O ffset v alue h as t o b e s et a fter i nserting sample. I t i s l ocated a t t he b ottom o f t he s ample h older s elect w indow, w hich pops u p a utomatically a fter h older i nsert.Acceleration v oltage, e mission c urrent, p robe c urrent…The f irst t hing t o t hink a bout w hen s tarting i maging i s t he s election o f acceleration v oltage. T he c hoice d epends o n t he t ype o f t he s ample. S ee table b elow f or s ome e xamples.Sample Observation c ondition NotesGold p articles o n conductive s urface 5-­‐30 k V, p robe c urrent a t c a. 10, working d istance 1.5-­‐8 m mCoated p orous polymer 1-­‐5 k V, p robe c urrent 6-­‐10, w orking distance 4.5-­‐8 m mUncoated p olymer 0.5-­‐1 k V, p robe c urrent < 8, g entlebeam m ode, w orking d istance c a. 8mmCoated b iological sample 1-­‐5 k V, p robe c urrent c a. 10, w orking distance 4.5-­‐25 m m d epending o n feature s izeUncoated p aper 1-­‐2 k V, g entle b eam (GB-­‐L) m ode,working d istance 4.5 m m, p robecurrent 6-­‐10.Coated p aper 5 k V, w orking d istance 4.5-­‐25 m m,probe c urrent c a. 10X-­‐ray a nalysis o f conductive s ample 15-­‐30 k V, w orking d istance e xactly 8mm, h igh p robe c urrentRetractable B EIdetector i nsertedX-­‐ray a nalysis o f poorly c onductive sample 5 k V, w orking d istance e xactly 8 m m,probe c urrent a s h igh a s p ossibleRetractable B EIdetector i nsertedThe e mission c urrent i s t he c urrent d rawn f rom t he e mitter. S et i t a lways t o 10 μA. Figure. S ample height s hould b e exactly 25 m m measured f rom t able top l evel.Probe c urrent i s t he c urrent d irected a t t he s ample. H igher v alues g ive better s ignal t o n oise r atio, b ut c ause m ore c harging a rtefacts i n p oorly conducting s amples. V alue o f 8-­‐10 i s u sually a g ood c hoice.AligningUsually t he m icroscope i s a ligned w ell e nough f or m icrometer s cale operation. I n t his c ase, o nly f ocusing i s n ecessary. F or h igher m agnification work, t he e lectron b eam n eeds t o b e a ligned a nd a stigmatism o f t he o bjective lens h as t o b e c orrected.FocusThe f irst l evel o f a ligning i s a lways f ocusing. F ocusing i s d one u sing t he FOCUS k nob o n t he o peration c onsole. C lockwise r otation i s u nder f ocus (weaker l ens) a nd c ounterclockwise i s o ver f ocus (stronger l ens).If p ossible s elect s ome f eature, w hich y ou c an u se i n t he m agnification r ange from c a. 1000 t o 20000.Start f rom a l ow m agnification a nd w hen y ou g et g ood e nough i mage m ove on t o h igher m agnification f or f ocusing. I t t he a lignments a re r eally o ff, y ou might n ot g et a c lear i mage a t a ll.Beam a lignBeam a lign i s a lways d one a t p robe c urrent 8. S elect t he c orrect p robe current v alue f rom t he s oftware.Press A LIGN o n o peration c onsole. T he i mage s tarts t o m ove o n t he s creen. Use t he X a nd Y k nobs t o m inimize t he m ovement. P ress A LIGN O FF (STIG) button w hen i mage h as s topped. R epeat f or m agnifications u p t o c a. 20000. Focus t he i mage w henever n ecessary.Astigmatism c orrectionTo c orrect t he o bjective l ens a stigmatism p ress t he S TIG b utton o n t he operation c onsole (it i s u sually a lready s elected a t t his p oint). M ove o n t o a spherical f eature, w hich y ou a re a ble t o o bserve a t m agnification 10000 o r more.Move t he F OCUS k nob s o t hat y ou g o f rom u nderfocus t o o verfocus a nd b ack several t imes. W hen y ou h ave a stigmatism, t he i mage g ets e longated i n diagonal d irections w hen m oving a round t he f ocal p oint. S elect t he f ocal point w here n o e longation o ccurs.Adjust t he X a nd Y k nobs s o t hat y ou g et t he c learest i mage p ossible. F ocus whenever n ecessary.Other c orrectionsThere a re a lso o ther a lignments, s uch a s s ource a lign, c ondenser l ens astigmator, l ow m agnification c enter, a nd s tigmator c enter c orrections. These v alues s hould n ot u sually b e c hanged a nd t heir u se i s n ot d escribed here.Problems a nd t roubleshootingAnswers t o c ommon p roblemsI w ant t o u se U SB s tick t o t ransfer m y f iles!You c an t ransfer y our f iles t o a U SB s tick f rom t he s mall c omputer a t t he b ack wall. Y ou’ll f ind y our f iles u nder t he n etwork d rive H arley.Help! T here i s n o i mage.Follow t he c hecklist t o f ind t he c ause:1.Are y our Z a nd W D v alues t he s ame? I f n ot p ress W D t o s et c orrectdistance.2.What d etector a re y ou u sing? I f W D<8 m m y ou u sually d o n ot g etimage w ith L EI d etector; a nd i f W D>8 m m S EI g ives o nly s tatic n oise.LM m ode s hould w ork f ine i n t his c ase.3.What i s y our p robe c urrent v alue? I f i t i s l ow, t ry i ncreasing i t.4.If n one o f t he a bove i s t rue, t ry r esetting a lignment. G o t o A lignmentpanel a nd c lick R eset A ll.a.In a r eally b ad c ase t he s ource a lignment h as g one b ad.Contact a n a dministrator t o a lign i t.If t here i s n o i mage w hen s tarting o perationFirst, p ress A CB (auto c ontrast & b rightness). I f y ou e ven s ee s ome s tatic noise, y ou o nly n eed t o f ind t he c orrect f ocal p oint. S ee p revious s ection.In c ase y ou h ave c ompletely b lack s creen w hen y ou s tart i maging, f ollow t he list u ntil y ou h ave i mage.1.Restart o f S EM s oftware:a.File-­‐>Exit t o g o t o l ogin s creen.b.Close l ogin s creen f rom E xit b utton.c.Wait o ne m inute.d.Start S EM_Monitor s oftware.e.Log i n a s G uest.2.Restart c omputer:a.Close S EM s oftware.b.Save E xcel l og b ook a nd e xit.c.Restart W indows.d.Start S EM s oftware a nd E xcel l og b ook.3.Restart o peration c onsole:a.Read i nstructions b elow.If v acuum b reaks d uring s ample e xchangeVacuum u sually b reaks i f t he l ever i s p ushed o r t wisted d uring t he s ample insertion. T he c omputer w ill r aise a m aintenance w indow s howing e rror messages. T he m icroscope w ill a utomatically s hut d ownsome p arts a nd t he v acuum p umps h ave t o b e r estarted. B ring t he microscope b ack t o i ts n ormal c ondition b efore p roceeding. F or e xample, lift t he r od b ack t o i ts u pright p osition.1.Locate t he t wo V AC S W b uttons b elow t he t able. T here a re a lso M AINSW b uttons, b ut d o n ot t ouch t hem.2.Shut d own v acuum p umps b y p ressing V AC O FF (0=OFF, 1=ON)button. T he p umps s hould n ow s top, i f t hey w ere n ot s hut d ownalready.3.Wait a m oment a nd r estart p umps b y p ushing V AC O N b utton.a.There i s a 20 m in t imer f or s tarting t he p umps s o y ou w illhave t o w ait a t l east 20 m inutes b efore p roceeding.4.After a ll o f t he e rror m essages h ave d isappeared f rom t he d isplay,you c an c ontinue o perating.Turning o ff c omputer1.Log o ut f rom t he S EM s oftware (File-­‐>Exit).2.Save t he E xcel l og b ook (File-­‐>Save o r C trl-­‐S).3.Close t he E xcel l og b ook.4.Select S hutdown f rom S tart m enu.Powering o n c omputer1.Start c omputer f rom t he p ower s witch.2.Log i n a s S EMUser (password: S EMUser).3.Start E xcel l og b ook b y d ouble c licking “SEM U sage L og” o n t he r ightmonitor d esktop.4.Start S EM s oftware b y d ouble c licking S EM_Monitor.5.Log i n a s G uest.Restarting o peration c onsole1.Turn o ff c omputer.2.Press O P S W O FF f rom b elow t he t able.3.Wait c a. 10 s econds.4.Press O P S W O N.5.Turn o f c omputer.6.Wait a c ouple o f m inutes b efore s tarting S EM_Monitor s oftware.。

场发射扫描电子显微镜系统技术参数一、货物名称及数量：场发射扫描电子显微镜系统一台二、主要技术规格及要求2.1 基本要求2.1.1发射源：热场发射电子枪*2.1.2物镜系统：电磁/静电式物镜系统，电子束无交叉光路设计*2.1.3分辨率：0.8 nm @ 15kV1.6 nm @ 1kV*2.1.4加速电压范围：20V－30kV，连续可调*2.1.5放大倍数范围：12X－1,000,000X，连续可调2.1.6探针电流：范围 4pA-20nA，连续可调稳定度优于 0.2 %/h2.1.7减震方式：自动水平系统2.2 真空系统2.2.1样品室极限真空度：≤2×10-4 Pa2.2.2换样抽真空时间：小于3 min。

2.3 样品室及样品台*2.3.1样品室尺寸（不小于）：内部直径520mm，高度300mm2.3.2 集成8英寸样品交换室*2.3.3 配备四个探测器：环形高效完全内置式In-lens二次电子探测器样品室内ET SE二次电子探测器4QBSD AsB背散射电子探测器样品室内红外CCD摄像机*2.3.4 样品台：类型 6轴全自动马达驱动超优中心样品台安装抽屉式控制双操纵杆控制盒*2.3.5 样品台马达移动范围（不小于）： 152mm（X方向），152mm（Y方向），43mm（Z方向），10mm（Z’方向），-15 - 60°（倾斜），360°（旋转）2.3.6 能谱仪工作条件：工作距离8.5 mm，X射线出射角35°*2.3.7 物镜光栏：数量不少于 6孔更换与对中方式电磁式2.4 图像处理系统2.4.1配套计算机系统（不低于）：CPU Intel Pentium 2 Quad;2.33 GHz Quad Core，RAM 4 Gb，硬盘 1TB，光盘刻录机，19″TFT显示屏，键盘，鼠标，USB接口。

2.4.2显示图像分辨率：不小于 1024×768像素2.4.3最大存储图像分辨率：不小于3072×2304像素2.4.4存储图象格式：TIFF、BMP与JPEG2.4.5降噪方式：像素平均、帧/行平均、帧/行叠加2.5 控制系统2.5.1操作系统Windows XP，电镜操作控制软件。

场发射扫描电子显微镜参数：1．工作条件:1.1电源: 230V (-6%/+10%) / 50Hz (±1%)1.2 主机功耗：< 3.0 kV A1.3运行环境温度: 17-23 C1.4运行环境：相对湿度< 80% (无冷凝)1.5残余交流磁场<100nT (非同步频率)；<300nT (同步频率)1.6噪音：< 60 dBC1.7干燥无油压缩空气4-6 bar1.8仪器运行的持久性：可连续运行2．设备用途：2.1高分辨扫描电子显微分析系统主要用于纳米材料的超高分辨微观形貌观察和微区分析。

独特的双物镜设计以及低电压成像技术，对导电性不好的样品等适用性更强。

具有低真空功能，对不导电样品进行更全面的分析。

3．技术规格3.1 电子光学系统3.1.1 分辨率：二次电子（SE）像*3.1.1.1高真空模式：15 kV时优于1.0 nm；1 kV时优于1.4 nm（非减速模式）*3.1.1.2 低真空模式：30kV时优于1.5nm*3.1.2背散射（BSE）像：100V时优于3.5 nm3.1.3 放大倍率范围：1 ～1,000,000倍(根据加速电压和工作距离的改变，放大倍数自动校准)3.1.4 着陆电压：50V 至30 kV3.1.5 电子枪：高稳定度Schottky肖特基场发射电子枪*3.1.6电子束流：0.6pA ～200 nA，连续可调，既保证对高分子纳米材料高分辨成像所需的低速流，也要保证EDS和EBSD分析所需的高束流高效率。

3.1.7 束流稳定性：每10小时< 0.4%*3.1.8 具有双物镜系统（电磁透镜和静电透镜），保证对纳米材料、不导电有机无机材料、合金、磁性材料的全方位分析*3.1.9 物镜光阑：物镜光栏应能自加热自清洁；无需拆卸镜筒即可更换物镜光阑。

至少6孔光阑设计3.1.10 电子束位移范围：不小于±110um3.2 样品室和样品台3.2.1 样品室尺寸：不小于360mm×360mm*3.2.2 抽屉式大开门结构，样品台安装在仓门上，全方位观察，方便取放样品，防止碰撞3.2.3样品台：五轴运动全对中样品台，有效移动范围：X /Y ≧110mm，Z ≧25mm，T = -10°to +70°，R= 360°连续旋转3.2.4样品台最大承重量不小于2.0 kg3.2.5最大样品高度不小于65mm，分析工作距离不小于5mm3.2.6重复精度：2um (X/Y 方向)，步进进度优于100nm3.2.7至少15个探测器/附件接口（所有端口程序均免费开放，可安装能谱、波谱、EBSD、CL、STEM探头、红外探头、拉曼等），方便后期升级*3.3 探测器：3.3.1 电子探头：样品室二次电子检测器极靴内二次电子探测器极靴内背散射电子探测器低真空二次电子探测器3.3.2 样品室镜头安装背散射电子探测器3.3.3 样品室IR-CCD相机3.3.4样品室光学显微镜导航相机探头3.4 真空系统*3.4.1完全无油真空系统（标配高真空模式和低真空模式，要求有验收指标）3.4.2 一个220L/S的涡旋干泵和一个分子泵3.4.3 两个离子泵*3.4.4 穿过透镜的压差真空系统（列出原理），保证真空条件下避免对系统的污染。