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真空离子镀英文介绍Vacuum ion plating, also known as PVD (Physical Vapor Deposition), is a state-of-the-art technology widely used in various industries for the deposition of thin films on different substrates. It is considered a highly advanced and efficient process in the field of surface engineering.Vacuum ion plating is a process that takes place in a vacuum chamber where materials are evaporated and then deposited onto the substrate. The vacuum environment ensures the absence of air and other impurities that may interfere with the coating process. Unlike traditional coating methods, vacuum ion plating allows for precise control of the coating thickness and composition, resulting in high quality and uniform coatings.The process of vacuum ion plating starts with the cleaning and preparation of the substrate surface. This is crucial to ensure good adhesion of the deposited film. Once the surface is prepared, the substrate is placed inside the vacuum chamber. The chamber is then sealed and pumped down to create a high vacuum environment.Next, the material to be evaporated, known as the target, is heated using an electron beam or a resistive heating source. As the target is heated, atoms or molecules are released from its surface, forming a vapor cloud above the target. These atoms or molecules then travel to the substrate and condense on its surface to form the desired thin film.During the deposition process, the substrate can be biased with a voltage to enhance film adhesion and improve film properties. This is known as substrate biasing. By applying a voltage to the substrate, ions are attracted to its surface, bombarding it and improving the adhesion of the deposited film.One of the major advantages of vacuum ion plating is the ability to deposit various types of films with different properties. By selecting different target materials, coatings with different characteristics can be achieved. For example, by using metallic targets such as titanium or stainless steel, coatings with excellent wear resistance and corrosion resistance properties can be obtained. Alternatively, by using ceramic targets such as titanium nitride or aluminum oxide, coatings with high hardness and thermal stability can be achieved.Vacuum ion plating finds extensive applications in various industries. In the automotive industry, it is used for the deposition of decorative and protective coatings on automotive parts, such as wheels, trims, and badges. These coatings not only enhance the appearance of the parts but also provide excellent resistance to wear, corrosion, and UV radiation.In the electronics industry, vacuum ion plating is used for the deposition of thin films on semiconductor devices and electronic components. These films can be conductive, insulating, or semiconducting, depending on the specific requirements of the device. The ability to precisely control the film properties makes vacuum ion plating an ideal choice for microelectronics applications.In the aerospace industry, vacuum ion plating is employed for the deposition of coatings on aircraft components. These coatings provide protection against extreme temperatures, erosion, and oxidation,thereby improving the longevity and reliability of the components.Furthermore, vacuum ion plating also finds applications in the medical, optical, and packaging industries, where the deposition of thin films with specific properties is essential for the functionality and performance of the products.In conclusion, vacuum ion plating is a highly advanced and versatile technology used for the deposition of thin films on various substrates. It offers precise control over film thickness and composition, resulting in high-quality coatings with superior properties. Its applications can be found in numerous industries, ranging from automotive and electronics to aerospace and medical. Vacuum ion plating is continually evolving, with ongoing research and development aimed at further improving the process and expanding its capabilities.。
金属膜型制作工艺流程英文回答：Metal film fabrication processes can vary depending on the specific requirements and materials involved. However, I will provide a general overview of the typical steps involved in the production of metal films.1. Substrate Preparation: The first step is to prepare the substrate on which the metal film will be deposited. This typically involves cleaning the substrate surface to remove any contaminants or oxides that may interfere with the adhesion of the metal film.2. Deposition Method: There are several methods available for depositing metal films, including physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating. Each method has its own advantages and limitations, and the choice of deposition method depends on factors such as film thickness, material compatibility, anddesired film properties.3. Masking: In some cases, a masking technique may be used to selectively deposit the metal film on specific areas of the substrate. This is often done using a photoresist mask, which is patterned using lithography techniques. The masked areas protect the substrate from the metal deposition process, allowing for precise control over the film's placement.4. Film Deposition: The metal film is then deposited onto the substrate using the chosen deposition method. For example, in PVD, a metal source material is heated or evaporated in a vacuum chamber, and the metal atoms condense onto the substrate surface to form a thin film. In CVD, the metal film is formed by a chemical reaction between a precursor gas and the substrate surface. Electroplating involves the immersion of the substrate into an electrolyte solution containing metal ions, with the metal ions being reduced onto the substrate surface to form the film.5. Film Characterization: After the deposition process, the metal film is typically characterized to ensure that it meets the desired specifications. This may involve measuring the film thickness, surface roughness, adhesion strength, and other properties using techniques such as scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray diffraction (XRD).6. Post-Processing: Depending on the application, additional post-processing steps may be required to enhance the performance or functionality of the metal film. This could include annealing to improve film crystallinity, surface treatments to modify the film's properties, or encapsulation to protect the film from environmental degradation.中文回答：金属膜的制备工艺流程可以根据具体要求和材料的不同而有所不同。
pvd溅射镀膜技术英语Physical Vapor Deposition (PVD) Sputtering Coating Technology.Physical vapor deposition (PVD) sputtering is aversatile thin-film deposition technique that utilizes a physical process to transfer material from a target to a substrate. In PVD sputtering, the target material is bombarded with energetic ions, causing the target atoms to be ejected and deposited onto the substrate. This process enables the deposition of a wide range of materials, including metals, alloys, ceramics, and polymers, with precise control over film thickness, composition, and properties.Process Mechanism.The PVD sputtering process involves the following steps:1. Target Preparation: The target, which is the sourceof the deposited material, is typically a solid or powdered form of the desired material.2. Vacuum Chamber: The deposition process takes place in a vacuum chamber to minimize contamination and ensure a clean deposition environment.3. Plasma Generation: The vacuum chamber is filled with an inert gas, such as argon or nitrogen, which is ionized by an electrical discharge to create a plasma.4. Ion Bombardment: The ions in the plasma are accelerated towards the target, where they impact the surface and physically sputter the target atoms.5. Film Deposition: The sputtered atoms travel through the plasma and deposit onto the substrate, forming a thin film.Advantages of PVD Sputtering.PVD sputtering offers several advantages over otherthin-film deposition techniques:High Deposition Rates: PVD sputtering can achieve high deposition rates, allowing for rapid coating of large surfaces.Excellent Adhesion: The sputtered atoms have high kinetic energy, which promotes strong adhesion between the film and the substrate.Uniform Coatings: PVD sputtering produces uniform and conformal coatings, even on complex surfaces.Wide Material Compatibility: PVD sputtering is compatible with a wide range of materials, including metals, alloys, ceramics, and polymers.Precise Control: PVD sputtering allows for precise control over film thickness, composition, and properties by adjusting process parameters such as deposition time, power, and gas pressure.Applications of PVD Sputtering.PVD sputtering is used in a variety of applications, including:Hard Coatings: Wear-resistant, corrosion-resistant, and low-friction coatings for cutting tools, bearings, and medical devices.Optical Coatings: Anti-reflection coatings, reflective coatings, and filters for lenses, mirrors, and optical devices.Electronic Coatings: Conductive, insulating, and semiconducting coatings for microelectronics, solar cells, and displays.Biocompatible Coatings: Biocompatible coatings for medical implants, dental prosthetics, and drug delivery systems.Decorative Coatings: Decorative finishes for jewelry,home appliances, and automotive parts.Conclusion.Physical vapor deposition (PVD) sputtering is a widely used and versatile thin-film deposition technique that offers a range of advantages, including high deposition rates, excellent adhesion, uniform coatings, wide material compatibility, and precise control. PVD sputtering is used in diverse applications, from hard coatings and optical coatings to electronic coatings and biocompatible coatings.。
高一英语大学实验室安全规范练习题40题(带答案)1. In the laboratory, when using a microscope, you should ______ it with a soft cloth after use.A. cleanB. breakC. ignoreD. throw答案：A。
解析：A选项clean表示清洁，使用显微镜后用软布清洁是正确的实验室设备保护方式。
B选项break是破坏，这违反了设备保护的安全规范。
C选项ignore是忽视，在实验室不应忽视对仪器的保养。
D选项throw是扔掉，这是对仪器的破坏行为，不符合安全规范。
2. When operating the chemical balance in the lab, you must ______ it on a stable table.A. placeB. shakeC. hideD. drop答案：A。
解析：A选项place表示放置，将化学天平放置在稳定的桌子上是正确的操作，这样能保证仪器正常使用且安全。
B选项shake是摇晃，会损坏仪器且影响测量准确性。
C选项hide是隐藏，这不是正常的操作且不利于仪器保护。
D选项drop是掉落，会损坏仪器，不符合安全规范。
3. Before using the Bunsen burner, you should check if the gas ______ is properly connected.A. pipeB. wireC. stringD. rope答案：A。
解析：A选项pipe管道，煤气管道与本生灯连接是合理的，使用前检查连接是否正确是重要的安全规范。
B选项wire是电线，与煤气设备无关。
C选项string是细绳，D选项rope是粗绳，都不能用于连接煤气设备。
4. In the lab, if you find the test tube holder is a bit dirty, you should ______.A. wash it gentlyB. continue using itC. throw it awayD. break it答案：A。
.外贸函电常用缩略语A =first quality,first grade,first classA.A.R =agianst all risksABV =aboveABT =aboutA/C,AC=accountACCES =accessory,accessoriesACDG =accordingACDGLY=accordinglyACEPT,ACPT=acceptACEPTD,ACPTD=acceptedACPTBL=acceptableACPTC =acceptanceACK =acknowledge,acknowledged,acknowledgementACOMN,ACCOMDN=accommodationAD =advertisementADDL,ADDNL=additionalADDN =additionADDS,ADS=addressADJ =adjust〔ment〕ADV =advice,adviseAFRN =afternoonAGCY =agencyAGNT =agentAGNST,AGST=againstAGR =agreeAGRD =agreedAGRMT =agreementAIR =airmailAIRD =airmailedAIRG =airmailingAIRML =airmailAIRFRT=airfreightALRDY =alreadyAM =AmericaAMAP =as many〔much〕as possibleAMDT =amendmentAMDD =amendedAMND =amendAMNDMT=amendmentAMNT,AMT=amountANS =answerA/O =account ofA/OR =and/orAPPLCTN=applicationAPPROX,APPR=approximate〔ly〕APVD =approvedARFRT =airfreightA.R. =all risksARNGMTS=arrangementsAPR =AprilARR,ARV=arriveART =articleARVD =arrivedARVL =arrivalA/S =at sight,after sightASA =as soon asASAP =as soon as possibleASRTMT,ASTMT=assortment〔for textiles BIZ〕ASST =assistantASSTANCE=assistanceASSTD =assorted〔for textiles BIZ〕ATCH =attach〔ed〕〔ment〕ATN,ATTN=attentionAUG =AugustAUTH =authorizeAVBL,AVLBL=availableAVTG =averageA.W.B, AWB=air way billAWTG =awaitingAM,A/M=above mentioneda.k.a.=also known asa.s.o.=and so onB =beBG =bagBAL,BALCE =balanceB/B =bed and breakfast〔for hotel BIZ〕BCOS,BCOZ =becauseB/D =bank draftBEF,BFR =beforeBGN =beginBIBI =byebyeBIZ =businessBK =bank,bookBKFST =breakfast〔for hotel business〕BKBLE,BKBL =bookableBKG =bookingB/L =Bill of LadingBLCH =bleachBLDG =buildingBLNDD =blended〔for textile BIZ〕BP =British PharmacopoeiaBR =BritainBRS =brassBSNS =businessBSR =basic service rate〔for ocean transportation BIZ〕BTM =bottomBTN =buttonBTWN =betweenBUS =businessBXS =boxesBYR =buyerCA =CanadaCAAC =Civil Aviation Adiministration of ChinaCAD =Canadian dollar,Cash against DocumentsCALIF =CaliforniaCAND =Canadian dollarCAPT =captainCAT =catalogueCBL =cableCCIB =China CoMModity Inspection BureauCERT =certificateCFM =confirmCFMD =confirmedCFMG =confirmingCFMN,CFMTN =confirmationCFS =container feight stationCFT〔CBFT〕=cubic feetCHNG =changeCHNGD =changedCHQ =chequeCHRGS =chargesC.I.C.,CIC =China Insurance ClauseCK =checkCLR =colorCLRWY =colourway〔for textiles BIZ〕CLSD =closedCMOS =complementary metal-oxide semiconductorC/N =credit noteCNCL =cancelCMT =cutting,making〔manufacturing〕and trimming CNCLN =cancellationCNT,CANT =can't,cannotCNTR =counterC/O =in care of=certificate of originC/OFR =counter offerCOL =collationCOL-CARD =colour card〔for textiles BIZ〕CLOWAY =colorwayCOMM =commission. COMP =completeCONC =concerningCOND,CONDI =conditionCONSGNT,CONSGT=consignmentCONSR =consumerCONT =continueCONT,CONTR =contractCONTD =continuedCONTR,CTNR,CNTR=containerCOOP =co-operationCORP =cooperationCORR,CRT =correctCOSCO =China Ocean Shipping Co.C/P =Charter partyCR,CRED =creditCRT〔S〕=crate,cratesC/S =case,casesC/SMPL =counter sampleCST〔S〕=chest〔s〕CSTMR =customerCTF =correction to followCTLG =catalogueCTN〔S〕=carton〔s〕CU,CUB =cubic. CUTG =cuttingCVC =cheif value cotton〔for garments BIZ〕CWT =hundred weightCY =container yardCY/CY =container yard to container yard DALPO =do all possibleDBL =doubleDBLB =double〔room〕with bathDBT =debitD/C =documentary credit〔for banking BIZ〕DCRE =decreaseDD,DTD =datedD/D =demand draftDEC =DecemberDELY =deliveryDEPT =departmentDESTN =destinationDFRN =different,differenceDIFF =differenceDIR =directorDIRTLY =directlyDIS,DISC =discountDISAPV =disapprove〔al〕DISHD =dishonored.DISRGD =disregardDIV =dividendDLRS,DLS =dollarsDLVR =deliverDLVD =deliveredDLVRY =deliveryDLY =delyD/N =debit noteDO =dittoDOC =documentsDOZ =dozenDPT =departureDR =debit,debitorDRG,DRWG=drawingDS =daysD/S =days sight=days after sightDSGN =designDT =dateDTL =detail〔s〕DUP,DUPLCT=duplicateDWN =downD.W.T.,DWT=deadweight ton〔s〕DZ =dozenE/D=expire date. EDF=estimated date of flightE.E.C=European Economic CommunityEEE,ERR=errorEELCE=L/CEL,E/L=export licenceEMGNCY=emergencyENC,ENCL=enclosureENQURY,ENQRY=enquiryE.&O.E=errors and omissions exceptedERLY=earlyEQL=equalEQUI=equivalentESTABG=establishingETA=estimated time of arrivalETD=estimated time of departureEXAM=examineEXCH,EXCHG=exchangeEXPLN=explainEXP=export,expireEXT=extend,extensionFACTRY=factoryFAQ=fair average qualityFAV=favourFAVRBL=favourable. F/B=full board〔for hotel BIZ〕FCL=full container loadFDA=Food and Drug Adiministration〔U.S.A.〕F/E/C=foreign exchange certificatef.i.=for instance, free inFIG〔S〕=figure〔s〕FIO,F.I.O.=free in,out and stowedF.I.O.S.T=free in,out,stowed and trimmedFLT=flightFLW=followFLWG,FOLG=followingFEB=FebruaryFLWS=followsFM=fromFNL=finalF.O.=free outFOA=FOB airportFOC=free of chargeFOR=free on railFOT=free on truckFPA=free of particular averageF.R.E.C=Fire Risk Extension ClauseFRI=FridayFRT=freight.FRZ=frozenFWD,FORWD=forwardFYI=for your informationFYG=for your guidanceFYR=for your referenceG/A=general averageGAL,GALL=gallonGBP=Great Britain PoundGD=goodGEN=generalGF=gold francGLD=goldGM〔S〕=gram〔s〕GMQ=Good Merchantable QualityGMT=Greenwich Mean TimeGNRL=generalG.O.H=garments on hangGOVT=governmentGR=grain,gram〔me〕G.R.T.=gross registered tonnageGR WT=gross,weightGSP=Generalized System of PreferencesGT=gross tonGV=give.GUAR,GURANTE=guaranteeG/W=gross weightH/B=half board〔for hotel BIZ〕HGT=heightHK=HongKongHKD=HongKong dollarHk〔S〕=hand〔s〕〔for textile BIZ〕H.O=head officeHOLDY=holidayHR=here,hourHP=high pressure,horsepowerHRWITH=herewithHV=haveHVB=have been,has been,had beenHVY=heavyHWEVR,HWVR=howeverIAW=in accordance withI.C.C.=institute cargo clauses, International Chamber of CoMMerceICW=in connection withIFMN=infomationIL.,I/L=import licenceIMM,IMMED=immediate〔ly〕IMMD,IMMET=immediateIMMDLY,IMDTLY=immediately. IMP=importIMPRV=improveIMPS=impossibleIMPT=importantIMPVD=improvedIN=inchINCD,INCLDD=includedINCDG=includingINCL,INCLD=includeINCL=inclusiveINCR,INCRE=increaseINCRCT,INCOR=incorrectINDIV=individualINF,INFM=informINFMD=informedINFMG=informingINFMTN,INFN,IFMN=informationINFO=infomationINP=if not possibleINQ=inquireINQRY=inquiryINS=insuranceINST=installmentINSTRCTN,INSTN=instruction.INSUR=insuranceINTL=internationalINTRST〔D〕=interest〔ed〕INTST=interestINV,IVO=invoiceINVEST,INVSGT=investigateINVSGN=investigationI/O=instead ofI.O.P=irrespective of percentageIOT=in order toIOU=I owe youIRRESP=irrespectiveIRREV,IRVCBL=irrevocableISO=International Standards OrganizationIVO=in view ofJAL=Japan Air LinesJAN=JanuaryJAP=JapanJCQD=jacquard〔for textiles BIZ〕JKT=jacketJUL=JulyJUN=JuneKANS=KansasKC〔S〕=kilocycle〔s〕. KG〔S〕=kilogram〔s〕KL=kiloliterKM=kilometerKP=keepKV=kilovoltKW=kilowattKWH=kilowatt-hourKY=KentuckyL=letter,large,sterlingLAB,Lab=laboratoryLB〔S〕=pound〔s〕LCD=liquid-crystal diodeLCL=less than cartload lot,less than container load LDN=LondonLDT=light displacementLED=light emitting diodeLET=letterL/G=letter of guaranteeLIT=litreLMT=local mean timeLNTH=lengthLST=local standard timeLT,L/T=long tonLTE=late.LTR,LTTR=letterLVE=leaveO/A =on or aboutO/B =on boardOBLD=obligedOBS =observeOBT =obtainOC =our cableOC5 =our cable dated 5thOCC =occupiedO.C.P,OCP=overland common pointOCT =OctoberODR =orderOFC =officeOFCL=officialOFF =officeOFA,OFR〔S〕=offer〔s〕OK =all right or agreedOL =our letterOPEC=Organization of the Petroleum=Exporting countriesOPN =openOPND=openedOPNG=openingOPT =optionORD =ordinaryORIG,ORGNL=originalOT =our telex,our telegramOTLX=our telexOTHWS=otherwiseOURSLVS=ourselvesOZ =ounceOZWS=otherwisePA =PennsylvaniaPACKG=packingPAMP,PAM=pamphletPAT =patentPATTN=patternPAYMT,PAYT=paymentPCE,PC=piecePCT =percentPCTG=percentagePENN=PennsylvaniaPHLN=PhilippinePIA =Pakistan Air LinesP/INV=proforma invoiceP.I.C.C.=The People's Insurance Co. of China PKG =packing,packagePKTS=packetsPLS,PL=pleasePLT〔S〕=plate〔s〕POLY=polyesterPOSN=positionPOSS,POSSBL=possiblePRC =pricePREV=previousPROB=probablePROBM=problemPROD=produtionPROX=proximoPRVS=previousPRVT=privateP.S.T.,PST=Pacific Standard Time〔U.S.A.〕PUR =purchasePURCHS=purchasePURP=purposePVC=polyvinyl chloridePYMT=paymentQLTY =qualityQNTY =quantityQOT =quoteQSTN =question. 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高一英语大学实验室安全规范要点总结单选题50题1. In the laboratory, you should handle the test tubes _____.A. carefullyB. carelesslyC. quicklyD. slowly答案：A。
本题考查副词的词义。
A 选项“carefully”意为“小心地”，在实验室中处理试管应该小心，符合安全规则。
B 选项“carelessly”意为“粗心地”，不符合实验室安全要求。
C 选项“quickly”意为“快速地”，强调速度，与安全处理无关。
D 选项“slowly”意为“缓慢地”，强调速度慢，也不是处理试管时应重点关注的。
2. The ______ in the laboratory is very important for experiments.A. balanceB. thermometerC. microscopeD. calculator答案：B。
本题考查实验室仪器词汇。
A 选项“balance”意为“天平”，常用于称重。
B 选项“thermometer”意为“温度计”，对实验中的温度测量很重要。
C 选项“microscope”意为“显微镜”，用于观察微小物体。
D 选项“calculator”意为“计算器”，在实验中一般不常用。
3. When you leave the laboratory, you must ______ all the lights.A. turn onB. turn offC. turn upD. turn down答案：B。
本题考查动词短语的词义。
A 选项“turn on”意为“打开”。
B 选项“turn off”意为“关闭”，离开实验室应关闭所有灯，符合安全节能要求。
C 选项“turn up”意为“调高”，常指音量等。
D 选项“turn down”意为“调低”，也常指音量等。
4. In the laboratory, you can't ______ the chemicals without permission.A. useB. reuseC. refuseD. lose答案：A。
真空电镀工艺流程和原理英文回答：Vacuum Plating: Process and Principle.Vacuum plating is a physical vapor deposition (PVD) technique that involves vaporizing a metal or other material in a vacuum chamber and depositing it as a thin film onto a substrate. This process is commonly used in various industries, including automotive, electronics, aerospace, and decorative applications.The vacuum plating process consists of the following steps:1. Chamber Preparation: The vacuum chamber is first prepared by cleaning and removing any contaminants. The substrate is then placed inside the chamber and secured.2. Vacuum Creation: A vacuum is created inside thechamber using a vacuum pump. This reduces the pressure to a very low level, typically in the range of 10^-5 to 10^-6 Torr.3. Material Evaporation: The material to be depositedis placed in an evaporation source, which is typically a crucible or filament. The evaporation source is heated to a high temperature, causing the material to vaporize.4. Vapor Deposition: The vaporized material travels through the vacuum and condenses on the substrate, forminga thin film. The thickness and properties of the film canbe controlled by adjusting the deposition time, temperature, and pressure.5. Post-Treatment: After the deposition process is complete, the substrate may undergo post-treatment processes such as annealing, heat treatment, or chemical etching to enhance its properties.The principle behind vacuum plating is based on the phenomenon of sublimation, where a solid material directlytransforms into a gas without passing through the liquid phase. In the vacuum chamber, the evaporated material atoms or molecules travel in straight lines until they encounter the substrate, where they condense and adhere to the surface.中文回答：真空电镀工艺流程和原理。
Alfa Laval ALDRUM Drum Thickeners are ideal for mechanical thickening of sludge prior to digestion or dewatering, and for reducing sludge volume prior to storage or transportation.The ALDRUM Drum Thickener comes in two sizes, Mini and Midi, for capacities from 4- 22 m3/h (18-97 GPM on the basis of 1% dry solids waste activated sludge). They are available as separate components or as complete sludge thickening modules. They are designed to handle sludge extremely gently, providing exceptionally high recovery for nearly all sludge types.Applications• All municipal wastewater sludge types• A wide variety of industrial separation applications, such as paper, solid waste and food• Fresh water production at waterworksBenefits• Compact and robust design• Long life time filter cloth• Intermittent flushing saves water• Very gentle treatment of flocculated feed saves polymer and gives high recovery• Safe design with bolted, hinged cover• Clean, enclosed, odour-free solution Working principlesALDRUM Drum Thickeners work on the principle of conveying polyelectrolyte treated (flocculated) sludge through a slowly rotating drum filter. The sludge remains in the drum, while the water phase passes through the filter cloth. The sludge concen-tration can thus be regulated by adjusting the feed rate, angle and speed of the drum.The drums are equipped with a cleaning system consisting of a spray bar for water. The water consumption is low due to intermittent cleaning of the drum using either potable water, final effluent or treated filtrate.Optional extras for optimum mixing and separationAn ALDRUM Drum Thickener is usually combined with a polymer mixing valve for thorough mixing and minimum polymer con-sumption, and/or a flocculation reactor.Another option is a sludge hopper which comes with an outlet adaptorALDRUM Mini and Midi can also be delivered with a basic control panel for straightforward, user-friendly control of the drum thickener, including level monitoring in the flocculation reactor (if fitted).ALDRUM Midi Drum Thickener with an Outlet Adapter (optional) for sludge hopper and tilting mechanism• Advanced control: All-in-one control solution. Control of the plant’s feed pump, sludge pump and polymer pump, as well as the drum thickener, and level monitoring in the flocculation reactor and the sludge hopper.A l f a L a v a l i s a t r a d e m a r k r e g i s t e r e d a n d o w n e d b y A l f a L a v a l C o r p o r a t e AB . [P r o d u c t n a m e ] i s a t r a d e m a r k o w n e d b y A l f a L a v a lC o r p o r a t e A B .P W W 00022E N 1612Alfa Laval reserves the right to change specifications without prior notification.How to contact Alfa LavalContact details for all countries are continually updated on our website. Please visit toaccess the information direct.DimensionsOptimisationThe ALDRUM Drum Thickeners can be adjusted to suit individual sludge thickening needs. Optimal thickening is found by varying the feed rate, the polymer type and dosage, flocculation mixer speed, drum speed, angle of the drum and the spraying interval.ALDRUM Mini ALDRUM Midi Length 2,233 mm/88” 3175 mm/125”Width 18”/480 mm/18”750 mm/30”Height795 mm/31” 1100 mm/43”Weight (dry) 300 kg/660 lb. 600 kg/1320 lb.MaterialsCover (Colour, RAL 5002) GRP Bearings HDPE Casing AISI316 Flanges Symalit Drum AISI316 Spray nozzles AISI 303Base frame AISI304 Filter cloths PolyesterMaterials of other non-wetted parts include:, cast iron, steel, brassTypical performance*Type of sludge Discharge DS (%) Filtrate quality (mg/l SS) Polymer consumption (kg/tDS)Primary 4-12 <400 1-3Mixed (50% Primary/50% Secondary) 4-10 <400 1-4WAS (Waste Activated Sludge) 4-8 <400 2-5* Examples of expected results from an ALDRUM Drum Thickener used on municipal sludge. The results can vary due to a lot of reasons, such as sludge age and the ratio of industrial load. Regarding the filtrate quality, it is not unusual with less than 50 mg/l SS.Typical layout of an Alfa Laval ALDRUM Mini and Midi Drum Thickener.。
高一英语大学实验室设备单选题50题1. In the university laboratory, we often use a(n) _____ to measure the temperature.A. microscopeB. thermometerC. balanceD. telescope答案：B。
本题考查实验室常见设备的名称和用途。
选项A“microscope”意为显微镜，用于观察微小物体；选项B“thermometer”意为温度计，用于测量温度，符合题意；选项C“balance”意为天平，用于称量物体质量；选项D“telescope”意为望远镜，用于观测远处物体。
2. The device which is used to observe tiny objects in the laboratory is called a _____.A. beakerB. flaskC. petri dishD. microscope答案：D。
本题考查实验室设备的用途。
选项A“beaker”是烧杯；选项B“flask”是烧瓶；选项C“petri dish”是培养皿；选项D“microscope”是显微镜，用于观察微小物体。
3. We can use a _____ to hold and heat liquids in the laboratory.A. test tubeB. buretteC. crucibleD. pipette答案：A。
本题考查实验室设备的功能。
选项A“test tube”是试管，可以用来盛放和加热液体；选项B“burette”是滴定管，用于精确测量液体体积；选项C“crucible”是坩埚，用于高温加热固体；选项D“pipette”是移液管，用于精确量取液体体积。
4. Which of the following is used to measure the volume of a liquid accurately in the laboratory?A. Graduated cylinderB. V olumetric flaskC. Measuring cupD. Flask答案：B。
