PCB专业英语培训内部教材(2)

PCB英语培训资料一. 流程英语及相关词汇❖PCB(Printed Circuit Board) 印制线路板❖Marketing Department市场部❖PE – Product Engineering Department 产品工程部❖MI - Manufacturing Instruction生产制作指示/生产流程单❖CAD/CAM - Computer Aided Design计算机辅助设计/制造❖TQ—Engineering Technical Query 工程问题1. Inner board cutting: 内层开料-1❖Sheet Size大料尺寸❖Panel Size拼板尺寸❖Material Type材料类型❖Supplier供应商❖Base material基材❖Thickness厚度❖Board Thickness板厚❖Laminate Thickness材料厚度❖inner core 芯板/内层板料❖Comparative Tracking Index 比较漏电痕迹指数CTI❖Glass Transition Temperature玻璃态转化温度Tg1. Inner board cutting: 内层开料-2❖Dielectric Thickness介电层厚度❖Dielectric constant介电常数Er❖Base Copper底铜/基铜❖Delamination分层❖Flammability可燃性❖Baking烘板❖Single/double单层/双面❖Double sided board双面板❖Multilayer board 多层板❖Bare board裸板(board without copper)2. Inner Image Transfer:内层图像转移/内光成像3. Inner Etching 内层蚀板4. Inner AOI—Automatic Optical Inspection自动光学检查5. Pressing 层压❖Lamination 压板❖Lay-up structure压板结构❖PP - Prepreg半固化片❖Copper clad/ Copper foil铜箔Cu foil❖Resin树脂❖After Pressed Thickness压板后之厚度6. Drilling 钻孔-1❖Hole孔❖Hole Type孔类型❖Hole Tolerance 孔径公差❖Hole chart 孔表/分孔图❖Plated Though Hole 金属化孔PTH❖Non-Plated Though Hole 非金属化孔NPTH❖Drill tape钻带❖Blind via hole盲孔❖Buried hole埋孔❖Hole Diameter孔径6. Drilling 钻孔-2❖Hole location孔位❖Hole Position Tolerance孔位误差❖Hole Position Deviation孔位置偏差❖2nd Drilling 重钻❖Mounting hole安装孔❖Pin hole销定孔❖Target Hole目标孔❖Slot 槽,坑❖No. of holes孔数❖Laser via hole激光穿孔❖Roughness粗糙度7. Plate Through Hole (PTH)沉铜/孔化❖Hole wall copper thick 孔壁铜厚❖Defect缺陷❖Cracking裂缝8. Outer Dry Film 外层干菲林/外光成像-1❖Dry Film干菲林/干膜D/F❖External layer外层❖Internal layer内层❖Component Side 零件面C/S❖Solder Side焊接面S/S❖Top side/ layer 顶层❖Bottom side/layer底层❖Primary side首面❖Secondary side第二面❖(提示: 层的写法尽量按客户的习惯书写)8. Outer Dry Film 外光成像-2❖Power plane电源层❖Ground 接地层❖Layer层❖Dry-film tenting D/F封孔❖Surface mounting Device表面粘贴装置SMD❖Line Width线宽—LW❖Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad❖Conductor导体❖Circuit线路❖Pattern线路❖Artwork菲林❖Master drawing菲林图形❖Artwork Modification菲林修改❖Outer Dry Film外光成像-3❖Annular ring锡圈❖Min.Annular Ring最小环宽/焊盘宽❖Hole breakout 破环/崩孔❖Pad焊盘❖Round pad圆盘❖Teardrop泪珠❖Clearance/space间距/间隙❖Minimum 最小---Min.❖Maximum 最大---Max.❖Min.Spacing between Line to Line线与线间的最小距离❖Test coupon图样❖Registration Deviation 对位偏差9. Pattern Plating 线路电镀/图形电镀❖Plating电镀❖Chemical corrosion化学腐蚀❖Copper plating电镀铜❖Copper thickness on hole wall 孔内铜厚❖Max.Board Thickness After Plating电镀后总板厚度之上限10. Outer Etching 外蚀板❖Undercut侧蚀11. Solder Resist 湿绿油/阻焊-1❖S/M(Solder Mask) 阻焊❖Solder resist film阻焊菲林❖SM print SM印油菲林❖SM imaging SM曝光菲林❖Solder Mask opening 阻焊开窗/曝光窗❖Solder Mask material/Type 绿油材料/类型❖Color颜色❖Shiny有光泽的,发光的(光亮油,)❖Matte哑光油的❖Matte Green 哑光绿油❖Liquid Photo-Imaginable (LPI)液态光固化剂11. Solder Mask 湿绿油/阻焊-2❖W/F(Wet Film) 湿膜/湿绿油❖Ball Grid Array (BGA) 球栅阵列❖S/M Bridge 绿油桥❖Cover 盖(油入孔)❖Tenting封孔/盖油❖Via Plugging 封孔❖Plug Hole塞孔❖Filled with solder resist 塞孔❖Solder mask on bare copper (SMOBC) 裸铜覆盖阻焊膜❖Encroach 侵占, 蚕食❖Encroach into holes 入孔12. Carbon Ink 印碳油❖Carbon ink碳油❖Carbon Resistance 碳油电阻13. Component Mark 印字符❖Silk Screen丝印❖Component Marking 元件字符C/M❖Legend字符❖Corner mark板角记号❖Logo标记❖Date Code周期代号❖Cust. P/N: customer part number客户型号❖Revision/Version:版本号14. Gold Finger Plating 金手指❖Bevelling斜边❖Gold Finger(G/F) 金手指❖Chamfer倒角❖Key slot槽孔❖Au/Ni 金/镍15. Hot Air Leveling 喷锡❖HAL(Hot Air Leveling) 热风整平❖HASL Hot Air Solder Leveling❖Impedance阻抗IMP❖Surface Treatment表面处理16. Immersion Silver 沉银17. OSP抗氧化处理18. Immersion Tin 沉锡19. Immersion Gold/Imm Au 沉金20. Solder/Tin/Lead Stripping 退锡❖ENIG----Electroless Nickel/Immersion Gold 沉金(工艺) ❖Ag银21. V-Cutting V-坑❖V-Cut V - 坑❖Remain Thickness 保留厚度❖Scoring==V-CUT刻槽❖Scratch划痕❖V-groove V- 坑22. Routing (铣/锣板)/ Punching 啤板❖Profiling外围成型❖Engineering drawing工程图纸❖Fiducial mark基准点❖Dimension尺寸❖Length 长度❖Width 宽度❖Breakaway tab/area板边位❖Datum hole基准参考孔❖Punching die /Punch 啤模❖Offset偏移量❖Outline外形❖Shape 外形23. Electrical Testing 电测试❖E-test fixture E-T 夹具❖Electrical Test Fixture电测试夹具❖V oltage电压❖Open/short开路/短路❖Probe point测试点24. Outer Final QC 最后检查❖Warpage翘曲度❖Bow and twist 板弯曲25. Peelable Mask 印蓝胶❖Peelable Mask/Blue Mask蓝胶❖Peelable可剥性26. Packing&Shipment 包装出货❖Vacunm Pack真空包装❖No.of Pcs Per Bag每包数量❖Packing包装27. Other其它相关-1❖Gerber Data 客户资料打包文件❖Checklist检查表❖production film 生产菲林❖Paste film粘贴/贴键菲林/钢网❖Solder coating上锡❖Reliability可靠性❖Assembly安装性❖Correspondance符合性❖Pin gauge 针规❖Backplane背板❖Customer客户27. Other其它相关-2❖Customer P/N客户产品编号❖Delivery交货❖Description说明❖Golden board金板❖Missing 缺少❖Mother board 主机板❖Ionic cleanliness离子清洁度/离子污染度❖Location位置❖Max. X-out坏板上限/最大允许报废板数❖No.of Array/Panel每个拼板套板数❖Negative反面的❖Positive正的27. Other其它相关-3❖Production生产板❖Sample样板❖Remark备注❖Special requirement特殊要求❖Specification详细说明，制作规范❖Wiring线路❖Square方形的❖View From…观察方向由…❖Lead free process 无铅处理❖Dummy Pad 为圆形或方形的PAD(加在板边位/标位或空白处起平衡电镀作用)❖Dummy copper实心的铜皮❖Thermal Pad 散热盘❖Fibre纤维面二. 问题之基本模式❖Title: Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Hello Ye jian,❖Nice to contact with you! I'm Jack, an Engineer from Engineering department in Jove.❖For the captioned project, we found some questions need you to confirm with customer.❖Question 1: As there are PTH (plated-hole) between the edge of unit, after doing V-cut, the holes will be scratched, and after customer divide them into two parts along the v-cut line, the copper showing in A part on the hole wall and that on the board may be picked off, which will lead to solder failure. Please refer to fig01❖Suggestion: a)To avoid this potential fault, we will modify the cad data: to add two PTH holes as position B to insure the connection between top and bottom sides. And to add two NPTH holes as position C (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to cut the copper off so as to avoid copper being picked off. Please kindly confirm this modification can be acceptable.❖b) Or we will do sample board to let our customer to approve. Please have one, a) or b)? ❖Question 2: Same case as question 1 except that the PTH holes is only on one edge of unit. Please refer to fig02❖Suggestion: a) We will do them NPTH holes and will shave the copper around holes to get about 8 mil clearance.❖ b) We only add two NPTH holes (use 2nd drill) at the end-point of V-cut line whichclosed to that big PTH hole to avoid that potential fault. Please kindly confirm these modification can be acceptable.❖❖Have a nice day!❖B.Regards❖Ding, you de**********************❖Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Dear John(名字)❖Hello Mr Smith(姓)❖Hi Miss Green❖Nice day John❖Good Morning Jack❖Nice to contact with you! / I’m glad to cooperate with you!❖I'm Jack, an Engineer from Engineering department in Jove.❖1) After checking the captioned new project/updated gerber data, we have some questions as below. Would you please help to settle them. 在检查完此新板后，我们有如下问题。

Whirlpool W/C 生产线员工英文培训教材( Unit 2 )一. 公司所用基本单词1.厂区公司: company 工厂factory 宿舍:dormitory 车间: workshop 办公室:office 饭堂: canteen 小商店: Mini-store 医务室: clinic 演讲室: auditorium 篮球场basketball ground 北大门: North Gate 保安:security 建筑物: building 清洁工: cleaner 一楼: the first floor 公交车: bus 房间: room 电视: television 热水器: water heater 桌子：desk 椅子: chair 衣柜: wardrobe 被子: quilt2. 公司各部门制造部: manufacturing 工程部: engineering 质量保证部:QA(Quality Assurance) 计划部：planning 采购部:purchasing 测试部: testing 人事部: HR(human resource) 设施工程部: Facility 财务部:Finance 电脑部:IT(Information Technology)3. 公司各职务名称营运经理: Operation Manager 事业部总监:Business Unit Director(BUD) 事业部经理:Business Unit Manager(BUM) 工作坊经理: Workcell Manager 功能部经理: Functional Manager经理: manager主任: officer 生产线经理: Line Manager 生产线主管: Line Supervisor 工程师: engineer 技术员:technician 高级助理: senior line leader 助理: line leader 替位: floater 物料员:material handler 工人: worker 计划员: planner 采购员: buyer4. 常用的缩写IQC: Incoming Quality Control来料质量控制IPQA: In Process Quality Audit 过程中质量稽核OBA :Out of Box Audit 开箱检查AVL :Approved Vendor List 批准的供应商清单BOM: Bill Of Material 物料清单CAR: Corrective Action Report纠正措施报告CRD :Component Reference Designator元件参考指定DPM: Defects Per Million每百万的坏点DL :Direct Labor直接生产工人IL :Indirect Labor间接生产工人ECN: engineer change notice工程更改通知ESD :electro-static discharge静电放电FPY: first pass yield 第一次通过率FVT: functional verification test功能确认测试ICT: in-circuit test在线测试PCB: printed circuit board印刷线路板PLV: part to line verification system生产线上元件确认系统RMA: returned material authorization授权返回物料SMT: surface mount technology 表面贴装技术MI: manual insertion 手动插件AI: automatic insertion自动插件5.生产线所用的各种文件1> visual aids 直观教具Material & tooling &equipment list 物料/工具/设备清单P/N: part number: 物料编号Description:描述quantity: 数量history tracking of VA changes VA改变历史跟踪2>DA: deviation authorization 授权的背离Initiated by:起草人customer:客户effective date:执行日期expiry date:过期日期Affected product/assembly: 影响的产品/组装affected process:影响的工序Reason for change: 改变的原因description of change 改变的描述Originator:创作者signature:签名approval: 批准3> First Article Build 首件报告Line no 生产线名initiator:填写人model name: 型号名start time: 开始时间Complete time:完成时间process:工序accept:接受reject:拒收comment:意见Approved to run 批准运行not approved to run 不准运行4> Output tracking report 产量跟踪报表time in hour:时间(小时) target qty: 目标数量machine packout qty:机器生产数downtime: 停机时间problem:问题root cause/action 根本原因/采措施PIC :person in charge: 负责人5> model change over time tracking 转机时间跟踪表Normal run 正常生产trial run: 试运行NPI: new product instruction:新产品引进Loading material: 装料start time: 开始时间end time:结束时间spend time:花费时间Machines/Process Change over:机器/过程转换remark:备注Start time: Time of final board SMT(testing) for last model. 开始时间指的是上一产品最后一块板完成SMT的时间End of time: time of first board SMT(testing) for running model. 结束时间指的是正在运行的产品第一块板完成SMT的时间Model change over time:(max of processes’ change over time) 转拉时间指的是在转拉过程中最长工序所花费的时间二.口语训练Nice to Meet You很高兴认识你听下列对话，练习自读跟读。

皆利士电脑版广州有限公司准备赖海娇2002年6月7日VIA SYSTEMS– Kalex (GZ)VIA ASIA皆利士电脑版广州有限公司印制电路板大纲.印制电路板概述.印制电路板加工流程.印制板缺陷及原因分析.印制电路技术现状与发展VIA ASIAVIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层制作Inner BoardCutting内层开料AOI自动光学检测Inner Dry Film内层干菲林Black Oxide(Oxide Replacement)黑氧化(棕化VIA SYSTEMS– Kalex (GZ)VIA ASIA Inner Etching(DES)内层蚀刻Laying- up/Pressing排板/压板皆利士电脑版广州有限公司外层制作流程Drilling钻孔Pattern Plating /Etching图电/蚀刻PTH/PanelPlating沉铜/板电Middle Inspection中检VIA SYSTEMS– Kalex (GZ)VIA ASIADry Film干菲林Solder Mask湿绿油皆利士电脑版广州有限公司外层制作流程ComponentMark白字FQC最后品质控制Hot AirLevelling喷锡FA最后稽查VIA SYSTEMS– Kalex (GZ)VIA ASIA Profiling 外形加工 Packing包装皆利士电脑版广州有限公司内层制作Inner Dry Film 内层干菲林Black Oxide黑氧化Inner Etching内层蚀板Laying- Up排板AOI自动光学检测Pressing压板orOxide Replacement棕化VIA SYSTEMS – Kalex (GZ)皆利士电脑版广州有限公司内层干菲林内层干菲林化学清洗辘干膜停放15分钟曝光停放15分钟显影VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层干菲林化学清洗用碱溶液去除铜表面的油污指印及其它有机污物然后用酸性溶液去除氧化层和原铜基材上为防止铜被氧化的保护涂层最后再进行微蚀处理以得到与干膜具有优良粘附性能的充分粗化的表面VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层干菲林辘干膜贴膜先从干膜上剥下聚乙烯保护膜然后在加热加压的条件下将干膜抗蚀剂粘贴在覆铜箔板上干膜中的抗蚀剂层受热后变软流动性增加借助于热压辊的压力和抗蚀剂中粘结剂的作用完成贴膜辘干膜三要素压力温度传送速度VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层干菲林干膜曝光原理在紫外光照射下光引发剂吸收了光能分解成游离基游离基再引发光聚合单体进行聚合交联反应反应后形成不溶于稀碱溶液的立体型大分子结构VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层干菲林显影的原理感光膜中未曝光部分的活性基团与稀碱溶液反应生成可溶性物质而溶解下来从而把未曝光的部分溶解下来而曝光部分的干膜不被溶解VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层蚀刻内层蚀刻内层图形转移制程中D/F或油墨是作为抗蚀刻有抗电镀之用或抗蚀刻之用因此大部份选择酸性蚀刻VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层蚀刻常见问题·蚀刻不尽·线幼·开路·短路VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层蚀刻内层设计最小线宽/线距底铜 最小线宽/线距量产最小线宽/线距 小批量 H/Hoz 1/1oz 2/2oz 3/3oz3/3mil44mil5/5mil6/6mil 2/2mil 3/3mil 4.5/4.5mil 5.5/5.5milVIA SYSTEMS – Kalex (GZ)皆利士电脑版广州有限公司内层氧化黑化/棕化原理对铜表面进行化学氧化或黑化使其表面生成一层氧化物黑色的氧化铜或棕色的氧化亚铜或两者的混合物)以进一步增加比表面提高粘结力VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层氧化棕化与黑化的比较黑化层较厚, 经PTH后常会发生粉红圈(Pink ring),这是因PTH中的微蚀或活化或速化液攻入黑化层而将之还原露出原铜色之故棕化层则因厚度很薄.较不会生成粉红圈VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层排板定位系统· PIN LAM有销钉定位·MASS LAM无销钉定位1. X射线打靶定位法2.熔合定位法VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层排板Pin Lam理论此方法的原理极为简单内层预先冲出4个Slot孔见图4.5 包括底片prepreq都沿用此冲孔系统此4 个SLOT孔相对两组有一组不对称可防止套反每个SLOT孔当置放圆PIN后因受温压会有变形时仍能自由的左右上下伸展但中心不变故不会有应力产生待冷却压力释放后又回复原尺寸是一颇佳的对位系统VIA ASIAVIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司内层排板VIA SYSTEMS– Kalex (GZ) VIA ASIA皆利士电脑版广州有限公司内层排板排板(以6层板为例Foil LaminationCore Lamination 表示基材VIA ASIA表示P 片VIA SYSTEMS – Kalex (GZ)皆利士电脑版广州有限公司内层排板排板压板方式一般区分两种:一是Core-lamination,一是Foil-laminationVIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司压板压板将铜箔(Copper Foil),胶片(Prepreg)与氧化处理(Oxidation)后的内层线路板按客户要求排板, 压合成多层板VIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司压板曲翘产生原因·排板结构不对称因芯板与P片的张数及厚度上下不对称的应力·结构应力多层板P/P与芯板之经纬方向未按经对经产生不平衡纬对纬的原则叠压则结构应力会造成板翘曲·热应力造成板翘压合后冷却速度过快板内之热应力无法释放完全而造成板翘值过大VIA ASIAVIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司压板·板子外部应力此种状况是发生在压合后各种制程,如钻孔,电镀,烘烤, 喷锡等流程·玻纤布的结构玻纤布织造均匀度纬纱歪斜张力大小对基板的板弯板翘会造成影响VIA ASIAVIA SYSTEMS– Kalex (GZ)皆利士电脑版广州有限公司PCB收藏天地资料收藏联系邮件 killmai@VIA SYSTEMS–Kalex(GZ)VIA ASIA。

培训教材文件编号DOCUMENT NO：发行版本VERSION：页数PAGINATION: 69可修改欢送精品WordAPPROVAL核准REVIEW/CHECK审核DRAFTING拟制ISSUE DATE发行日期可修改欢送精品Word培训教材目录第一章根底培训教材第一节常用术语解释〔一〕 (1)1．组装图 (1)2．轴向引线元件 (1)3．单端引线元件 (1)4．印刷电路板 (1)5．成品电路板 (1)6．单面板 (1)7．双面板 (1)8．层板 (2)9．焊盘 (2)10．元件面 (2)11．焊接面 (2)12．元件符号 (2)13．母板 (2)14．金属化孔〔PTH〕 (2)15．连接孔 (2)16．极性元件 (2)17．极性标志 (2)18．导体 (2)19．绝缘体 (2)20．半导体 (3)21．双面直插 (3)22．套管 (3)23．阻脚 (3)24．管脚打弯 (3)25．预面型 (3)第一节常用术语解释〔二〕 (4)1．空焊 (4)2．假焊 (4)3．冷焊 (4)4．桥接 (4)5．错件 (4)6．缺件 (4)7．极性反向 (4)8．零件倒置 (4)9．零件偏位 (4)10．锡垫损伤 (4)11．污染不洁 (4)12．爆板 (4)13．包焊 (4)可修改欢送精品Word14．锡球 (4)15．异物 (4)16．污染 (4)17．跷皮 (4)18板弯变形 (4)19．撞角、板伤 (4)20．爆板 (4)21．跪脚 (4)22．浮高 (4)23．刮伤 (4)24．PCB板异物 (4)25．修补不良 (4)26．实体 (5)27．过程 (5)28．程序 (5)29．检验 (5)30．合格 (5)31．不合格 (5)32．缺陷 (5)33．质量要求 (5)34．自检 (5)35．效劳 (5)第二节电子元件根底知识 (6)〔一〕阻器和电容器 (6)1．种类 (6)2．电阻的单位 (6)3．功率 (6)4．误差 (6)5．电阻的标识方法 ··············································································6-86．功率电阻 (8)7．电阻网络 ·······················································································8-98．电位器 (9)9．热敏电阻器 (9)10．可变电阻器 (9)〔二〕电容器 (10)1．概念和作用 (10)2．电路符号 (10)3．类型 (10)4．电容量 (10)5．直流工作电压 (10)6．电容器上的工程编码 (10)7．习题 ..........................................................................................11-12 二、变压器〔Transformer〕和电感器〔Inductor〕.. (13)〔一〕变压器 (13)〔二〕电感器 (13)三、二极管(diodc) (14)可修改欢送精品Word1．稳压二极管 (14)2．发光二极管(LED) (14)四、三极管(triode) (15)1．习题 (16)五、晶体〔crystal〕 (17)六、晶振〔振荡器〕 (17)七、集成电路〔IC〕 (17)八、稳压器 (18)九、IC插座〔Socket〕 (18)十、其它各种元件 (19)1．开关(Rwitch) (19)2．继电器(Relayo) (20)3．连接器(Connector) (20)4．混合电(mixed circuit) (20)5．延迟器 (20)6．篇程连接器 (20)7．保险丝(fuse) (20)8．光学显示器(optic monitor) (20)9．信号灯(signal lamp) (20)十一、静电防护知识 (20)1．手带 (21)2．脚带 (21)3．工作台表层材料 (21)4．导电地板胶和导电腊 (21)5．导电框 (21)6．防静电袋 (22)7．空气电离器 (22)8．抗静电链 (22)十二、储蓄过程 (23)十三、元件符号归类 (23)一、公司产品生产工艺流程 (24)二、插件技术 (24)1．电阻的安装 (24)2．电容的插装 ·····················································································25-263．二极管的插装 (27)4．三极管的安装 (27)5．晶体的安装 (27)6．振荡器的安装 (27)7．IC的安装 (27)8．电感器的发装 (27)9．变压器的安装 (27)三、补焊技术 (28)四、测试技术 .............................................................................................28-29 第二章品质管制的演进史 (30)第一节、品质管制演进史 (30)一、品质管制的进化史 (30)可修改欢送精品Word第二节、品管教育之实施 (31)一、品质意识的灌输 (31)二、品管方法的训练及导入 (32)三、全员参与，全员改善 (33)第三节品管应用手法 (34)一、层别法 (34)二、柏拉图法 ·······························································································35/36三、特性要因图法 (37)（一）特性要因图使用步骤 (37)（二）特性要因图与柏拉图之使用 (38)（三）特性要因图再分析 (38)四、散布图法 (39)五、直方图法 (40)六、管制图法 (41)（一）管制图的实施循环 (41)（二）管制图分类 (42)1．计量值管制图 (42)2．计数值管制图 (42)〔三〕X—R管制图 (43)七、查核表〔Check Sheet〕 ··············································································44/45第四节品管抽样检验 (46)（一）抽样检验的由来 (46)（二）抽样检验的定义 (46)（三）用语说明 (46)1．交货者及检验收者 (46)2．检验群体 (46)3．样本 (46)4．合格判定个数 (46)5．合格判定值 (46)6．缺点 (46)7．不良品 (47)四、抽样检验的型态分类 (47)1．规准型抽样检验 (47)2．选别型抽样检验 (47)3．调整型的抽样检验 (47)4．连续生产型抽样检验 (47)五、抽样检验与全数检验之采用 (48)1．检验的场合 (48)2．适应全数检验的场合 (48)六、抽样检验的优劣 (48)1．优点 (48)2．缺点 (48)七、规准型抽样检验 (48)可修改欢送精品Word1．允收水准〔Acceptable Quality Level〕 (48)2．AQL型抽样检验 (49)八、MIL-STD-105EⅡ抽样步骤·······································································49/50九、抽取样本的方法 (50)第三章5S 活动与ISO9000知识第一节5S活动 (51)一、5S活动的兴起 (51)二、定义 (51)三、整理整顿与5S活动 ····················································································52/53四、推行5S活动的心得 (54)五、5S活动的作用 (54)第二节ISO9000根底知识 (55)一、前言 (55)二、ISO9000：94版标准的构成 (55)三、重要的术语 (5556)四、现场质量管理 (56)1．目标 (56)2．精髓 (56)3．任务 (56)4．要求 (57)ISO9001：2000版 (58)1．范围 (58)2．参考标准 (58)3．名词与定义 (58)4．品质管理系统 ··································································································58/69可修改欢送精品Word景新科技〔深圳〕培训教材文件编码:JX-3-SOP-P-020页数：1 OF 69标题第一章根底培训教材第一节常用术语解释(一)修订日期：可修改欢送精品Word第一节常用术语解释〔一〕1.组装图——是一种工艺文件，图上有一些元件的目录，告诉我们每一程序中所需的元件及元件所插的位置。