Application of an ESD-MOS Compact Model for IC Design

Product features• Protects up to 4 separate lines with one device •ESD protection for high frequency, low voltage applications•Exceeds testing requirements outlined in IEC 61000-4-2• Extremely low capacitance•1206 (3216 metric) compact design utilizes less board space • Fast response time • Bi-directional•41206ESDA-TR1 Ceramic substrate, 41206ESDA2-TR2 Alumina substrateApplications•computers and computer-related equip-ment, such as modems, keyboards, and printers. ESDA family is also well suited for portable electronic equipment such as mobile tele-phones, test equipment, and card scanners nfotainment and telematics • Computers •Printers• Portable electronics • Mobile phones • Test equipment •Card scannersEnvironmental compliance41206ESDA(2)-TRESD suppressor four-channel4 1206 ESD A -TR14 channel device Size designatorCharacteristics Packaging suffixOrdering part numberPackage suffix-TR1 and -TR2: 5000 parts on a 7” diameter reelTypeCharacteristicA= Standard A2= 2nd GenerationHALOGENHF FREE41206ESDA-TR1 not Halogen free2Technical Data DS41206Effective January 202341206ESDA(2)-TRESD suppressor four-channel/electronics1. The product is 100% tested for 30 V operating voltage at +25°C. Continuous operation with higher than 12 Vdc under extreme temperature and humidity may cause increasing leakage current and/or shifting device resistance. However, even under severe environmental test, characteristics of the device did not change up to 12 Vdc operation.2. Some shifting in characteristics may occur when tested over several hundred ESD pulses at very rapid rate of 1 pulse per second or faster.Dimensions—mm/(inch)Recommended pad layout (per IPC-7351)Part marking : No marking Termination finish: Tin over nickelColor: Green: 41206ESDA-TR1; Black: 41206ESDA2-TR2Product specificationsPerformance CharacteristicsUnitsMinTypMaxContinuous operating voltage 1Vdc 12Clamping voltage 3V 3560Trigger voltage 4V 500ESD Threat voltage capability 5kV 815Capacitance (@ 1 kHz to 1.8 GHz)pF 0.151Leakage current (@ 12 Vdc)nA 100Peak current 3A 3045Operating temperature °C -40+25+105ESD pulse withstand 3,2# pulses20>500-3, Per IEC 61000-4-2, 30 A @ 8 kV, level 4, clamp measurement made 30 ns after initiation of pulse, all tests in contact discharge mode.4, Trigger measurement made using Transmission line pulse (TLP) method.5. PolySurg™ devices are capable of withstanding up to a 15 kV, 45 A ESD pulse. Device ratings are given at 8 kV per Note 1, unless otherwise specified.Circuit symbolL W H A B C D E F I X3.2 ± 0.2 (0.126 ± 0.008) 1.6 ± 0.2 (0.063 ± 0.008)0.8 max (0.032 max)0.38 ± 0.05 (0.015 ± 0.002)0.2 min, 0.4 typ (0.008 min, 0.16 typ )0.4 Typ (0.016 Typ)0.2 ± 0.1 (0.008 ± 0.004)0.2 Typ (0.008 typ)0.38 ± 0.20 (0.015 ± 0.008)0.80 ± 0.02 (0.03 ± 0.0008)0.45 ± 0.02 (0.017 ± 0.0008)3Technical Data DS41206Effective January 202341206ESDA(2)-TRESD suppressor four-channel /electronics General specificationsMoisture resistance: MIL-STD-202 Method 103, +85 °C, 85%R.H., 240 hoursThermal shock: MIL-STD-202, Method 107G, -65 °C to +125 °C, 30 minutes per cycle, 5 cycles Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 minute per cycle, 2 hours each in X-Y-Z)Chemical resistance: ASTM D-543, 24 hours @ +50 °C, 3 solutions (H2O, detergent solution, de_fluxer)Full load voltage: Up to 24 Vdc, 1000 hours, +25°C Resistance to solder heat: Per MIL-STD-202 Method 210Solderability: MIL-STD-202, Method 208 (95% coverage)Packaging information - mm5,000 parts on a 7 inch tape and reel (EIA Standard 481 compliant)DimensionMillimeterW 8.00±0.30F 3.50±0.05E1 1.75±0.10E2 6.25±0.30P0 4.00±0.10P1 4.00±0.10P2 2.00±0.05D0 1.5±0.10A0 3.62±0.02B0 2.02±0.02K00.75±0.054Technical Data DS41206Effective January 202341206ESDA(2)-TRESD suppressor four-channel/electronicsDevice application41206ESDA(2) family are applicable to most signal line circuits. It is applied in a shunt-connected manner. They are not suitable for use on lines where lighting or load-switching transients are present. 41206ESDA(2) family is ideal for use in computers and computer related equipment, such as modems, keyboards, and printers. 41206ESDA(2) family is also well suited for portable electronic equipment such as mobile telephones, test equipment, and card scanners.Processing recommendations41206ESDA(2) family currently have a convex profile on the top surface of the part. This profile is a result of the construction of the device. They can be processed using standard pick-and-place equipment. The placement and processing techniques for 41206ESDA(2) family are similar to those used for chip resistors and chip capacitorsDesign considerationsThe location in the circuit for the 41206ESDA(2) has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).Typical applicationsEatonElectronics Division 1000 Eaton Boulevard Cleveland, OH 44122United States/electronics © 2023 EatonAll Rights Reserved Printed in USAPublication No. DS41206 January 2023Technical Data DS41206Effective January 202341206ESDA(2)-TRESD suppressor four-channel Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express writtenapproval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.Solder reflow profileT e m p e r a t u r eT LTPEaton is a registered trademark.All other trademarks are property of their respective owners.Follow us on social media to get the latest product and support information.Reference J-STD-020Profile featureStandard SnPb solderLead (Pb) free solderPreheat and soak • Temperature min. (T smin )100 °C 150 °C • Temperature max. (T smax )150 °C 200 °C • Time (T smin to T smax ) (t s )60-120 seconds 60-120 seconds Ramp up rate T L to T p3 °C/ second max. 3 °C/ second max.Liquidous temperature (T l ) Time (t L ) maintained above T L183 °C60-150 seconds 217 °C60-150 seconds Peak package body temperature (T P )*Table 1Table 2Time (t p )* within 5 °C of the specified classification temperature (T c )20 seconds*30 seconds*Ramp-down rate (T p to T L ) 6 °C/ second max. 6 °C/ second max.Time 25 °C to peak temperature6 minutes max.8 minutes max.* Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.Table 1 - Standard SnPb solder (T c )Package thicknessVolume mm3 <350Volume mm3 ≥350<2.5 mm)235 °C 220 °C ≥2.5 mm220 °C220 °CTable 2 - Lead (Pb) free solder (T c )Package thicknessVolume mm 3 <350Volume mm 3350 - 2000Volume mm 3 >2000<1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm250 °C245 °C245 °C。

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Product features• AEC-Q200 qualifed• Ultra-low capacitance (0.05 pF) ideal for high speed data applications• Provides Electro static discharge (ESD) protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 Level 4 test and ISO10605.• Single-line, bi-directional device• Low leakage current (<0.1 nA typ.) reduces power consumption• 0402 (1005 metric) compact design utilizes less board space Applications• I nfotainment and telematics• In-vehicle infotainment (IVI) and navigation • Audio subsytems• USB and Ethernet hubs• Active noise cancellation (ANC)• High speed data ports and interface• RF Antenna• Ethernet• USB• HDMI• Automotive body electronics• Central body control unit• Vehicle access control system• Advanced driver assistance systems• Rear and front view cameras• Automatic parking control• Adaptive cruise control (ACC)• Satellite navigation systemsOrdering• Specify part number and termination suffix (e.g. 0402ESDA-AEC1)0402ESDA-AEC=part number,1=Termination suffixT ermination suffixes• 1 (Dip termination, Packaged:Tape and reel, 10 000 parts per 7” diameter reel)0402ESDA-AEC Automotive grade ESD suppressorPb HALOGENHFFREE2Technical Data 10763Effective September 20200402ESDA-AECAutomotive grade ESD suppressor/electronicsProduct specificationsPart number 4Rated voltage (V dc )maximumClamping voltage 1(V) typicalTrigger voltage 2(V) typicalCapacitance @ 1 MHz (pF)typicalCapacitance @ 1 MHz (pF)maximumAttenuation change (0–6GHz) (dB)typicalLeakage current @12 V dc (nA)typicalESD capability IEC61000-4-2 Direct discharge (kV) typicalESD capability IEC61000-4-2 Air discharge (kV) typicalESD capability ISO10605Direct discharge (kV) typicalESD pulse withstand 1,3typical0402ESDA-AEC 30353000.050.15-0.2<0.112258>10001. Clamping voltage: Per IEC61000-4-2, Level 4 waveform (8 kV direct 30 A) measured 30 ns after initial pulse.2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method.Dimensions—mm [in]3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate.4. Part Number Definition: 0402ESDA-AEC 0402ESDA= Product code and size -AEC= Form designationDesign considerationsThe location in the circuit for the 0402ESDA-AEC has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it isrecommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).3Technical Data 10763Effective September 20200402ESDA-AECAutomotive grade ESD suppressor /electronics Environmental dataOperating temperature: - 55 °C to +125 °CStorage temperature (component): - 55 °C to +125 °COperational life: MIL-STD-202, method 108 (1000 hours at +125 °C, bias 85% of rated voltage)Temperature cycling: JESD-22, method JA-104 (-55 °C to +125 °C, 1000 cycles)High temperature exposure: MIL-STD-202, method 108 (1000 hours at +150 °C unpow-ered)Packaging information—mmSupplied in tape-and-reel packaging, 10,000 parts per reel, 7” diameter reel.Mechanical shock: MIL-STD-202, method 213 Mechanical vibration: MIL-STD-202, method 204Biased humidity: MIL-STD-202, method 103 (1000 hours at 85% RH/85 °C, 85% of rated voltage)Endurance test: IEC6100-4-2 standrd ESD pulse: 8 kV contact, 1000 pulses, 1 second intervalSolderability: J-STD-002, method B14Technical Data 10763Effective September 20200402ESDA-AECAutomotive grade ESD suppressor/electronicsT e m p e r a t u r eTimeT T T T Wave solder profileReference EN 61760-1:2006Profile featureStandard SnPb solderLead (Pb) free solderPreheat • Temperature min. (T smin )100 °C 100 °C • Temperature typ. (T styp )120 °C 120 °C • Temperature max. (T smax )130 °C 130 °C • Time (T smin to T smax ) (t s )70 seconds 70 seconds D preheat to max Temperature150 °C max.150 °C max.Peak temperature (T P )*235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (t p )10 seconds max5 seconds max each wave 10 seconds max5 seconds max each wave Ramp-down rate~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C4 minutes4 minutesManual solder+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended.EatonElectronics Division 1000 Eaton Boulevard Cleveland, OH 44122United States/electronics © 2020 EatonAll Rights Reserved Printed in USAPublication No. 10763September 2020Technical Data 10763Effective September 20200402ESDA-AECAutomotive grade ESD suppressor Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express writtenapproval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.Solder reflow profileT e m p e r a t u r eT LT PEaton is a registered trademark.All other trademarks are property of their respective owners.Follow us on social media to get the latest product and support information.Reference J-STD-020Profile featureStandard SnPb solderLead (Pb) free solderPreheat and soak • Temperature min. (T smin )100 °C 150 °C • Temperature max. (T smax )150 °C 200 °C • Time (T smin to T smax ) (t s )60-120 seconds 60-120 seconds Ramp up rate T L to T p 3 °C/ second max. 3 °C/ second max.Liquidous temperature (T l ) Time (t L ) maintained above T L183 °C60-150 seconds 217 °C60-150 seconds Peak package body temperature (T P )*Table 1Table 2Time (t p )* within 5 °C of the specified classification temperature (T c )20 seconds*30 seconds*Ramp-down rate (T p to T L ) 6 °C/ second max. 6 °C/ second max.Time 25 °C to peak temperature6 minutes max.8 minutes max.* Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.Table 1 - Standard SnPb solder (T c )Package thicknessVolume mm3 <350Volume mm3 ≥350<2.5 mm 235 °C 220 °C ≥2.5 mm220 °C220 °CTable 2 - Lead (Pb) free solder (T c )Package thicknessVolume mm 3 <350Volume mm 3350 - 2000Volume mm 3 >2000<1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm250 °C245 °C245 °C。

PHASE Switch node pin for bootstrap capacitor routing. Electrically shorted to VSWH pin. NC VIN
Switch node input. Provides return for high-side bootstrapped driver and acts as a sense point VSWH for the adaptive shoot-through protection. PGND GL THWN# DISB# PWM Power ground. Output stage ground. Source pin of the low-side MOSFET. For manufacturing test only. This pin must float; it must not be connected to any pin. Thermal warning flag, open collector output. When temperature exceeds the trip limit, the output is pulled LOW. THWN# does not disable the module. Output disable. When LOW, this pin disables the power MOSFET switching (GH and GL are held LOW). This pin has a 10µA internal pull-down current source. Do not add a noise filter capacitor. PWM signal input. This pin accepts a three-state 3.3V PWM signal from the controller.