PCBA检验规范

PCBA检验规范编号：版本：V1.0生效日期：1．修订情况表2．术语表目录1.目的(PURPOSE) (1)2.范围(SCOPE) (1)3.名词解释(WORDS EXPLANATION) (1)4.参考文件(REFERENCE DOCUMENT) (1)5. 职责(RESPONSIBILITY).............................................................................. . (1)6. 作业流程及内容(Flow chart and content) (1)7. 修订权限(AUTHORITY OF MODIFI CATION) (2)8. 附件(ATTACHMENT) (2)8.1 附件一(PCBA) (4)8.2 附件二(机构类) (42)8.3 附件三(其它) (52)PCBA检验规范1目的(Purpose)建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的workmanship,防止不良之发生.To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.2范围(Scope)本规范适用于所有产品(含半成品及成品PCBA)的外观目视检验, 包含自行生产制造之PCBA, 委托外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA等.It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.3名词解释(Words explanation)无(None)4参考文件(Reference document)ANS/IPC-A-610D5职责(Responsibility)5.1 生产单位(Production unit):5.2 负责产品检验之执行.5.3 Be responsible for doing product inspection5.4 质量管理部(Quality unit):5.5 负责产品规格之制定及产品品质之抽样检验管制5.6 Be responsible for making product specification and controlling the spot check ofproduct quality6作业流程及内容(Flow chart and content )6.1检验前的准备(preparation for inspecting):检验前须先确认所使用的工具,材料,胶,清洁剂等,是否合乎规定. 检验PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限.Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but thefinished good with。

6.2若有检验标准未规范的异常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。

It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm.6.3检验环境要求光线充足,以目视为主,辅以放大镜和卡尺6.4外观检验项目基准参见附件一~三。

The item of cosmetic inspection standard reference Appendix 1 to 3.7修订权限(Authority of modification)本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同.This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as the same above.8附件Attachment ( 含记录表单)8.1 附件一：PCBAAppendix 1: PCBA8.2 附件二：机构类Appendix 2: Mechanical8.3 附件三：其它Appendix 3: Other附件预览总表附件一: PCBA类1 SMT零件(SMT component)1-1 焊点规格(Soldering SPEC)1-1-1 Chip 零件(Chip component)DefectSide overhang (D) is greater than 50% componenttermination width (W) or 50% land width (P) whichever isless零件偏移D>50% W 或D>50% P 拒收DefectSide overhang (D) is greater than 50% componenttermination width (W) or 50% land width (P) whichever isless零件偏移D>50% W 或D>50% P 拒收DefectAny end overhang (B)零件超出pad 拒收DefectComponent in reserved to lacquer to go to circuit to forma short circuit零件在有保护漆之线路上造成短路拒收AcceptableEnd joint width (C) is minimum 50% of componenttermination width (W) or 50% land width (P) whichever isless零件焊点宽度C>50%W or C>50% P 允收AcceptableMaximum fillet height (E) may overhang the lend orextend onto the of the end cap metallization, but notextend further onto the component body锡高超过金属端,但未延伸至零件本体允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收DefectMinimum fillet high (F) is less than 25% terminationhigh (H), or fillet high (F) is less than 0.5mmHigh voltage capacitance minimum fillet high (F) is lessthan 50% termination high (H), or fillet high (F) is lessthan 0.75mm爬锡高度F<25% H 或F<0.5mm 拒收高压电容爬锡高度F<50% H 或F<0.75mm 拒收DefectInsufficient solder锡不足拒收DefectInsufficient end overlap空焊拒收1-1-2 圆柱体零件(Cylindrical End Cap Termination)DefectSide overhang (A) is greater than 50% of component diameter,(W),or land width (P),whichever is less零件直径突出A>50% W or >50% P. 拒收DefectAny end overhang (B)零件超出pad 拒收AcceptableEnd joint width (C) is minimum 50% component diameter (W) or land width (P),whichever is less零件连接直径宽度C≧50% W or 50% P 允收AcceptableSide joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less侧面焊点长度D≧50%T or 50%S 允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收AcceptableMinimum fillet heitht(F) is solder thickness(G) plus 25%diameter(W) of the component end cap焊锡高度F≧25%(G+W) 允收AcceptableEnd overlap(J) between the component termination andthe land is minimum 50% the length of the componenttermination(T)零件末端与PAD重叠部分J≧50%T 允收DefectEnd overlap(J) is less than 50% of the length ofcomponent零件末端与PAD重叠部分J<50%T 拒收1-1-3 Leadless chipDefectSide overhang (A) exceeds 50%castellation width (W)侧面偏移A>50% W 拒收DefectEnd joint width (C) is less than 50% castellation width(W)零件末端焊点宽度C<50% W 拒收DefectMinimum side joint length (D) is less than 50% minimumfillet height (F) or land length external to package(S),whichever is less零件末端焊点长度D<50% S 或50% F 拒收DefectMinimum fillet height (F) is 25% castellation height (H)焊锡高度F<25% H 拒收DefectAny end overhang (B)零件超出pad 拒收DefectMinimum fillet height (F) is 25% castellation height (H)焊锡高度F<25% H 拒收1-1-4 扁平、L 型和翼型引脚(Flat Ribbon, L, and Gull Wing Leads)AcceptableMaximum overhang (A) is not greater than 50% lead width (W)侧面偏移A≦50% W 允收DefectSide overhang (A) is greater than 50% lead width (W)侧面偏移A>50% W 拒收DefectMinimum end joint width (C) is less 50% lead Width (W) 焊点宽度C<50% W 拒收DefectSide joint length(D) is less than 80% of lead length (L)焊锡长度D<4/5 L 拒收Solder touches the body or end seal of high-lead configuration component焊锡延伸至零件本体上或封装末端拒收Acceptable爬锡高度: Fillet 接触到正面吃锡面允收DefectSolder touches package body锡延伸到零件本体上拒收AcceptableTransformer high voltage pin’s solder is over the A corner portion ,but ex no function pin (for all inverters, except special case)变压器高压Pin吃锡度已达到A 处(第一弯角处) 允收AcceptableSolder is over the B portion(for all inverters, except special case)吃锡度超出B 处允收DefectSolder is already over the B portion, and bobbin had Been damaged by iron .Bobbin 被烙铁烫伤拒收DefectMinimum heel fillet height (F) is less than 25% lead thickness (T)焊锡高度F< 25% T 拒收Side overhang (A) is greater than 50% lead width/diameter (W)零件偏移A>50% W 拒收DefectMinimum end joint width (C) is less than 50% leadwidth/diameter (W)焊锡宽度C<50% W 拒收DefectSide joint length (D) is less than 80% lead length焊锡长度D 小于4/5 引脚长度拒收DefectSolder touches the package or end seal焊锡延伸至零件本体上或封装末端拒收DefectMinimum side joint height (Q) is less than solderthickness (G) plus 50% diameter (W) of round lead or50% thickness of lead at joint side (T) for coined lead焊锡高度Q<G+50% W or Q<G+50% T 拒收1-1-6 J形引脚(J Leads)Side overhang (A) is greater than 50% W偏移宽度A>50% W 拒收AcceptableMinimum end joint width (C) is 50% lead width (W)焊锡宽度C≧50%W 允收DefectSide joint fillet (D) less than 150% lead width焊锡宽度(D) 小于150% 引脚宽度(W) 拒收DefectSolder fillet touches package body焊锡延伸至零件本体上拒收1-1-7 I形引脚(Butt/I Joints)DefectAny toe overhang (B)侧边突出拒收End joint width (C) is less than 75% lead width (W)焊锡宽度C<75%W 拒收DefectSolder touches package body焊锡延伸至零件本体上拒收DefectFillet height (F) is less than 0.5mm[0.02inch]焊锡高度(F)小于0.5mm 拒收1-1-8 向内L型引脚(Inward formed L-shaped ribbon leads)DefectEnd joint width(C) is less than 50% leadwith(W)Side overhang(A) is greater than 50%WMinimum fillet height(F) is less than 25% E焊锡宽度C<50%W 拒收偏移宽度A>50%W 拒收焊锡高度F<25% 拒收AcceptableMinimum end joint width(C) is greater than 50% leadwith(W)焊锡宽度C≧50%W 允收1-1-9 BGA 零件(Area array/Ball grid array )More than 50% overhang偏移50% 拒收DefectSolder bridge锡桥拒收Dark spots in X-Ray view the bridge between solderjoints在X-Ray下焊点间桥接或拒收Solder open锡散开拒收Missing solder漏锡拒收Solder ball(S) that bridge more than 25% of the distancebetween the leads锡珠超出焊点间距25% 拒收DefectFracture solder connection锡裂拒收1-2 焊点异常(Soldering abnormal)1-2-1 侧立(Mounting on side)DefectChip resistance mounting on side电阻侧立拒收AcceptableChip capacitance & Inductance minimum type is lessthan 1206, mounting on side and no more than five(5)chip on each assembly are mounted side ways电容,电感类零件小于1206(含)以下, 且单面少于5pcs允收1-2-2 翻件(Mounting upside down)AcceptableElement of chip component with exposed depositedelectrical Element is mounted toward board能导通允收1-2-3 墓碑(Tombstone)DefectChip component standing on their terminalend(Tombstone)墓碑拒收1-2-4 共平面(Coplanarity)DefectOne lead or series of leads on component is outalignment and fails to make proper contact with theland零件的一个或多个引脚变形，不能与pad 正常接触拒收1-2-5 锡未完全熔化(Reflow not complete)DefectIncomplete reflow of solder paste锡未完全熔化拒收1-2-6 空焊(Nonwetting)DefectSolder has not wetted to the land or termination空焊拒收1-2-7 冷焊(Dewetting, Disturbed solder)DefectCharacterized by stress lines from movement in theconnection while solidifying冷焊拒收1-2-8 锡裂(Fractured solder)DefectFractured or crack solder焊锡断裂或破裂拒收1-2-9 针孔/吹孔(Pinholes/Blowholes)DefectBlowholes, pinholes, voids, etc焊锡连接出现气泡,气泡,空白,流出物等拒收Acceptable焊点上紧临零件脚的气孔/针孔,一个焊点只允许有一个,且其大小须小于零件脚面积的1/4 允收Acceptable焊点上未紧临零件脚的气孔/针孔,一个焊点容许有不超过两个(含),且其大小须小于零件脚面积的1/4允收1-2-10 锡桥(短路)[Solder bridge(short)]DefectA solder connection across conductors that should not bejoined锡桥(短路) 拒收AcceptableOn the same PAD, solder bridge(short) across conductors同PAD上两焊点短路允收On the same trace(Visualization) but not same PAD, solderbridge(short) across conductors目视同线路不同PAD短路允收1-2-11 锡珠(Solder ball)DefectSolder ball dislodge非附着性锡珠拒收Entrapped or encapsulated solder balls that areexceed 0.2mm in diameter附着性锡珠但锡珠直径大小为0.2mm （含）以上变压器高压端及高压电容旁有附着性锡珠拒收Solder ball attached on high voltage side oftransformer or around high voltage capacitorMore than 5 solder balls (diameter less than0.2mm) per 600mm2锡珠直径大小为0.2mm 以下但锡珠数量多于 5颗/ 6 平方公分（含）拒收PS:锡珠以静电毛刷刷不掉者,判为附着性锡珠1-2-12 锡渣(Solder splash)DefectSolder splashes that are exceed 0.2mm in length锡渣长度最长边0.2mm（含）以上拒收Solder splashes attached on high voltage side oftransformer or around high voltage capacitor变压器高压端及高压电容旁有锡渣拒收More than 5 solder splashes (diameter less than0.2mm) per 600mm2锡渣直径大小为0.2mm 以下但锡渣数量多于 5 颗/ 6平方公分（含）拒收PCB 铜箔PAD 沾锡直径大于0.7MM 拒收1-3 零件损坏(Component damage)1-3-1 裂缝与缺口(Cracks and chip-outs)AcceptableCracks or chip-outs not greater than dimensions L<50%,W<25%, T<25%缺口的尺寸L<50%, W<25%, T<25%可接受DefectAny nick or chip-out that exposes the electrodes任何电极上的裂缝或缺口拒收Cracks, nicks or any type of damage bodied components玻璃组件本体上的裂缝、刻痕或任何损伤拒收Any chip-outs in resistive elements任何电阻质的缺口拒收Any cracks or stress fractures任何裂缝或压痕拒收1-3-2 金属镀层(Metallization)AcceptableMaximum of 50% of metallization loss of top end area (foreach terminal end)顶部金属镀层损失不大于50%,侧面金属镀层不得漏底材允收DefectMetallization loss exceeds 50% of top area顶部金属镀层损失大于50% 拒收1-3-3 剥落(Leaching)DefectLeaching of the terminal ead face exposing ceramic.剥落导致陶瓷暴露拒收Leaching exceeding 25% of component width (W) orcomponent thickness (T)零件剥落宽度(W)或厚度(T)超出25% 拒收1-3-4 点胶(Staking adhesive & gluing)DefectAdhesive is present in the solder connection area thatreduces solder contact to less than 50% of the componenttermination width点胶位于待焊区域，造成焊锡宽度小于50% 拒收DefectThe glue height above A or below B of crystal振荡器点胶之高度: 高于A或低于B 拒收DefectThe glue height above A or below B of ICIC点胶之高度: 高于A或低于B 拒收2 插件零件(DIP component)2-1 焊点规格(Soldering SPEC)2-1-1 焊点可接受性要求(Soldering acceptance)DefectNonwetting which results in the solder forming a ball orbead on the surface, much as water beads form on amaxed surface. The fillet will be convex; No featherededge apparent不润湿导致焊点表面形成粗糙,灰暗或颗粒状,无光滑表面焊点移位拒收Disturbed solder connection or Cold solder connection空,冷焊拒收2-2 焊点凸出(Lead protrusion)DefectThe leads protrusion over 2.2 mm背面脚长大于2.2 mm 拒收脚直径大于1.0mm, Connector, 变压器Pin无短路及组装干涉问题者脚长可适当放宽DefectComponent to give to conduct electricity a circuit a shortcircuit零件与导电线路短路拒收2-3 通孔[Plated-through holes(PTH)]2-3-1 通孔的填充(PTH-vertical fill of hole)DefectVertical fill of hole is less than 75%通孔的填充小于75% 拒收2-3-2 通孔的外围焊点-正面(PTH-circumferential wetting-primary side)DefectLess than 180° wetting on lead or barrel引脚和孔壁焊接不足180°拒收2-3-3 通孔的外围焊点-背面(PTH-circumferential wetting-secondary side)DefectMinimum 270°fillet and wetting (lead, barrel andtermination area)引脚和孔壁焊接不足270°拒收2-3-4 包焊(Lead not discernible)DefectFillet convex, lead not discernible due to excess solder,providing visual evidence of the lead in the hole can bedetermined on the primary side由于焊锡过多导致包焊拒收DefectLead not discernible due to bent lead由于引脚弯曲导致包焊拒收2-3-5 引脚折弯处的焊锡(Solder in lead bent)DefectSolder in bend area comes in contact with theComponent body or end seal引脚折弯处的焊锡接触组件本体或密封端拒收2-3-6 陷入焊锡的绝缘层(Meniscus in solder)AcceptableExhibit good wetting and lead coating meniscus is notdiscernible within connection on secondary side背面焊点需完整,不可空/冷焊且零件脚Coating 不超出背面焊点允收2-3-7 焊接后的引脚剪切(Lead cutting after soldering)DefectEvidence of fracture between lead and solder fillet锡裂拒收2-4 插件外观(Appearance)2-4-1 定位-水平(Orientation-Horizontal)DefectComponent is not as specified(wrong part)零件插错件拒收Component not mounted I correct holes零件插错洞拒收Polarized component mounted backwards零件极性反拒收Multileaded component not oriented correctly零件方向错误拒收DefectComponents required to be mounted above the boardsurface D>1.6mm or H>2.1mm零件浮起D>1.6mm 或H>2.1mm 拒收2-4-2 定位-垂直(Orientation-Vertical)DefectPolarized component is mounted backwards零件极性反拒收AcceptableThe height of the component body above the H is 0.4mmto 3.2mm零件高度H不得超出0.4mm~3.2mm 拒收The angle θof the component lead does not greater the45o零件倾斜度不大于45度允收2-4-3 DIP & SIPDefectTitle of the component exceeds max component heightlimits or lead protrusion does not meet acceptancerequirement组件倾斜超出高度上限或引脚未出拒收2-4-4 引脚跨越导线(Leads crossing conductors)AcceptableSleeve does not extend into solder connection绝缘套管不可碰到焊点DefectSplitting and/or unraveling of sleeving绝缘套管裂开或断裂拒收A component lead crossing an electrically noncommonconductor with a clearance of less than 0.5mm with noseparating insulator (lead sleeving or surface coating)零件脚与线路距离小于0.5mm 拒收2-4-5 引脚成形(Leads forming)AcceptableLeads for through-hole mounting extend at least onelead diameter or thickness but not less than 0.8mm formthe body, solder bead, or lead weld零件本体、球状连接部分或引脚焊接部分到零件引脚折弯处的距离L≧0.8mm 允收DefectLead forming as a right angle引脚成形成直角拒收DefectDamage or fracture of component body to lead seal零件的本体或引脚封装处有损伤或裂痕拒收DefectLead is damaged more than 10% of the lead diameterLead deformed零件引脚损伤超过引脚半径10% 或引脚变形拒收2-4-6 IC 损伤(IC damage)Chip out enters into the seal密封处有缺口拒收Chip out exposes the lead in an area not normallyexposedIC脚连接处破损拒收There are cracks leading from the chip out.缺口造成芯片外露拒收2-4-7 轴向引脚和玻璃封装体损伤(Axial lead and glass body/seal damage)AcceptableVisible chip in surface coating of component body andinternal functional element is not exposed组件表面有损伤,但未暴露出组件内部材质允收DefectThe insulating cover is damaged to the extent that theinternal functional element is exposed or the componentshape is deformed组件表面的绝缘层受到损伤,造成组件内部材质外露,或组件严重形变拒收DefectCrack in glass insulator/seal玻璃封装上的残缺引起的裂痕延伸至引脚的密封处拒收Cracked or damaged glass bead玻璃体破裂拒收DefectFractured lead weld, solder bead or component bodylead零件焊接处裂缝或锡珠拒收2-4-8 径向又引脚损伤[Radial (two lead) damage]AcceptableMinor surface scratches, cuts or chips that do notexpose the component substrate or active area零件表面有损伤但未暴露出零件内部材质拒收Structural integrity is not compromised零件的结构完整性未受到破坏允收DefectActive area is exposed or structural integrity iscompromised零件内部材质外露或零件严重形变拒收2-5 点胶(Adhesive bonding)Less than 25% of the circumference or equivalentamount of board surface is wetted and adhered to bythe adhesive点胶范围小于周长25% 拒收On a horizontally mounted component, adhesiveadheres to less than 25% component diameter水平安装零件粘着小于25%直径拒收On a vertically mounted component, adhesive adheresto less than 50% of the component length垂直安装零件粘着小于50%长度拒收2-6 DIP零件高翘IC(插入PCB), SOCKET, ARRAY 高翘≥0.8mm 拒收电阻,电容,电感高翘≥1.6mm 拒收IC插入SOCKET未压至底高翘≥0.5mm 拒收Slot, header高翘≥1.0mm 拒收Switch, Connector, speaker 高翘≥0.5mm 拒收无绝缘包装之导线,跳线(含本体)高翘≥2.2mm 拒收3 PCB3-1 MarkingDefectMissing or illegible characters in the markingsMarking 字符缺损或模糊造成字体无法辨识拒收Open areas of characters are filled and not legible, orare likely to be confused with another number or letterMarking 字符笔画缺损、间断或沾污致使字体无法辨识拒收Lines forming a character are missing, broken orsmeared to the extent that the character is not legible oris likely to be confused with another characterMarking 字符内容错误拒收The depth of the marking adversely affects the functionof the partMarking 重影造成无法辨识拒收3-2 外观(Surface appearance)DefectDiscernible residue from cleanable fluxes, or anyactivated flux residues on electrical contact surfaces有需清洗焊剂的残留物,或者在焊点有助焊剂残留物拒收Dirt and particulate matter on assembly, e.g., dirt, lint,dross, metallic particles, etc表面沾污残留颗粒物质、纤维丝、残渣、金属颗粒等不属于产品物质之异物拒收DefectTransformer 高压端20MM 内露铜直径超过0.5MM拒收Acceptable其余位置露铜直径不超过2MM 且不造成短路允收DefectWhite residue on PWB surface白色残留物于PCB 表面拒收White residues on or around the soldered termination白色残留物于焊点四周拒收Metallic areas exhibit crystalline white deposit白色结晶状于金属表面拒收DefectFlux residue inhibits visual inspection助焊剂残留造成焦黑拒收3-2-1 腐蚀(Corrosion)DefectEvidence of corrosion有明显腐蚀现象拒收3-3-2 烧焦(Burn)Burns which physically damage surface or the assembly烧焦拒收3-2-3 印刷电路及焊点损伤(Conductor/Land damage)DefectReduction in width of printed conductor by more than 20%印刷电路宽度减少大于20% 拒收Reduction in width of length of lands by more than 20%焊点长度或宽度减少大于20% 拒收3-2-4 PCB板弯DefectPCB板弯超过板长1.5% 拒收3-3 焊锡性(Solderability)DefectSolder projection violates assembly maximum heightrequirements锡尖高于零件拒收DefectSeparation between conductor, PAD or land andlaminate surface is greater than on pad thicknessPAD剥离拒收4 Connector, Pin & 金手指(Golden finger)DefectBack edge of connector is not flush to PCB A>0.8mm, orB>0.4mm长轴高翘(A)大于0.8mm or短轴高翘(B)大于0.4mm 拒收Connector not contact with PCBConnector 未接触PCB 拒收Contact is above insulatorPin 超出connector 拒收Contacts are twisted or otherwise deformedPin 歪曲或变形拒收Land is damaged焊点损伤拒收Contact is broken接触簧片断裂拒收Gap between contact shoulder and land is greater specified接触簧片下陷拒收DefectAny functional annular ring which is lifted more than 75% of the width (W)Pin 脚底部翘起或龟裂宽度大于75% W 拒收DefectPin is bent out of alignment. (Pin is bent off center greater than 50% pin thickness.)Pin 脚倾斜度超出一个直径拒收DefectPin visibly twistedPin脚扭曲拒收Pin height is out of tolerance as to SpecificationPin脚凸出或下陷超过0.5mm 拒收DefectDamaged pin as a result of handling or insertionPin脚尖端电镀脱落拒收MushroomedPin脚尖端呈晕状拒收BentPin脚弯曲拒收DefectDamaged PIN(Exposed basis metal)Pin脚损伤/露铜拒收金手指外观检验品质要求DefectSolder or any other metal than gold in the critical contactarea of the fingers金手指金属接触面有焊锡,沾污,沾胶,氧化,露底材,残留铜屑拒收Scratching and exposed basis material or scratching butnot exposed basis material quantity exceed 1/5 goldfinger quantity each side刮伤露底材或刮伤未露底材在单面超过1/5金手指数拒收Concave dots in the 80% from edge of board, exceed0.2mm for Mini PCI or exceed 0.4mm for PCI, and abovetwo dots凹陷点离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上拒收Solder dots in the 80% from edge of board, exceed0.2mm for Mini PCI or exceed 0.4mm for PCI, and abovetwo dots沾锡点离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上拒收Solder polluted of gold finger in the 80% from edge ofboard, exceed 0.2mm for Mini PCI or exceed 0.4mm forPCI, and above two dots沾污离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上拒收Oxidized in the gold finger金手指有氧化现象拒收Exposed basis material in the gold finger金手指露底材拒收Copper left or pulled in the edge of gold finger金手指端点有残留铜屑或拉离拒收Glue polluted in the gold finger金手指有残胶拒收Aperture in the one gold finger exceed 20% or above onedot each side缺口在单一金手指面积超过20%或每面超过两处(含两处)拒收Convex in the side of gold finger is equal to the decreaseof gap about wire. If the gap decrease 20%侧向突出视同线路间距的减少,线路间距减少超过20%拒收AcceptableThe marks of insert and draw in the gold finger but notexposed basis material金手指插拔痕未露底材允收Repaired products should be smooth but differentcolor are accept修护品应平整但有色差允收5 其它(含螺丝及跳线)5-1 螺丝DefectHardware(1)contact with conductive path(2)螺丝与导电线路接触拒收DefectHardware fabricate aperture on to have spare tin ,tobeready to make fabricate question螺丝组装孔上有多余的锡,将造成组装问题拒收DefectLock washer against nonmetal/laminate垫片伤到主基板拒收Flat washer missing无垫片拒收Hardware missing or improperly installed螺丝垫片陷落螺丝孔拒收DefectLock washer not compressed螺丝垫片高翘拒收DefectWire not wrapped around screw body线未环绕螺丝拒收Wire is overlapped线重叠拒收Solid wire wrapped in wrong direction线方向错误拒收Stranded wire wrapped in wrong direction (tighteningthe screw unwinds the twisted wire)线超出螺丝拒收Insulation in the contact area塑料部份锁入螺丝拒收DefectHardware has burrs or frayed edges螺丝滑牙拒收5-2 跳线DefectWire routed under or over components跳线跨越零件拒收DefectThe wire is loose and can extend above the height ofadjacent components when pulled taut跳线未固定且超过邻近零件高度拒收Insulation is in the solder焊点中夹杂塑料部分拒收Wire overhangs the land and/or violates minimum electrical clearance跳线(cable 线)末端超出零件引脚范围拒收DefectSolder connection length is less than 50% of land width (L)焊接长度小于50% L (PAD) 拒收AcceptableMinimum length of the solder connection is 75% of the length (L)(from toe to knee of lead)The wire end does not extend past the top of the component body跳线与零件脚之焊接长度需75% 且未超出L 允收DefectWire or component connection D<75%跳线与零件连接D 小于75% 拒收DefectWire or component connection the opposite direction跳线与零件焊接反向拒收DefectWire or component connection D>L跳线与零件连接D 大于L 拒收DefectCharred insulation线材绝缘部分烧焦拒收Insulation damaged exposing wire线材绝缘部分损坏拒收Birdcaging has caused wire strands to extend beyondthe insulation diameter多蕊导线呈不规则状并超出绝缘层 拒收The general spiral lay of the strands has not beenmaintained多蕊导线的螺旋状被破坏 拒收附件二: 机构类(Mechanical)Inspection area defined:(1) 检查面依零件组装后之位置可分为A 、B 、C 、三区:The inspection surface according to component assembly location grouping A, B, C:A 区:产品于使用者正面可见部份,如面板上盖,前面.Zone A: Product of consumer face seeing part example faceplate top, front.B 区:产品于使用者正面不可见部份,如左右侧面上盖.Zone B: Product of consumer face invisible part example left and starboard top,C 区:产品底面及背面.Zone C: Product underside & rear.面板有Door 之设计时，Door 覆盖部位视为B 区，Door 背面(公模)视为B 区。