q1-1汽车使用条件

《热力学第一定律应用举例》讲义一、热力学第一定律简介热力学第一定律，也称为能量守恒定律，是热力学的基本定律之一。

它表明，在一个封闭系统中，能量可以在不同形式之间转换，但总能量保持不变。

简单来说，就是输入系统的能量等于系统输出的能量与系统内部能量变化的总和。

这个定律的数学表达式为：ΔU ＝ Q W ，其中ΔU 表示系统内能的变化，Q 表示系统吸收的热量，W 表示系统对外所做的功。

二、热力学第一定律的应用领域热力学第一定律在许多领域都有着广泛的应用，以下是一些常见的例子：1、热机热机是将热能转化为机械能的装置，如蒸汽机、内燃机和燃气轮机等。

在热机的工作过程中，燃料燃烧产生的热能被输入到系统中，一部分热能通过做功转化为机械能输出，另一部分则以废热的形式排放到环境中。

根据热力学第一定律，输入热机的热能等于输出的机械能与排放的废热之和。

通过对热机效率的研究，可以不断改进热机的设计，提高能源的利用效率。

2、制冷与空调系统制冷和空调系统的工作原理是通过消耗外界的功或电能，将热量从低温物体转移到高温物体。

在这个过程中，系统吸收低温物体的热量Q1，同时向高温环境排放热量 Q2，并且消耗外界的功 W 。

根据热力学第一定律，Q2 ＝ Q1 ＋ W 。

通过对制冷和空调系统的性能分析，可以优化系统的运行参数，降低能耗，提高制冷和空调效果。

3、化学反应在化学反应中，往往伴随着能量的吸收或释放。

例如，燃烧反应会释放大量的热能，而一些吸热反应则需要从外界吸收热量才能进行。

通过对化学反应中能量变化的研究，可以预测反应的热效应，为化学工艺的设计和优化提供依据。

4、能源储存与转换随着可再生能源的发展，如太阳能和风能，能源的储存和转换成为了重要的研究课题。

例如，在电池中，电能和化学能之间的相互转换遵循热力学第一定律。

在太阳能热水器中，太阳能被转化为热能储存起来。

通过对能源储存和转换过程的分析，可以提高能源的利用效率和稳定性。

三、具体应用举例1、汽车发动机汽车发动机是一个典型的热机。

ICS13.020.40Z 60 DB37 山东省地方标准DB37/ 2801.1—2016挥发性有机物排放标准第1部分：汽车制造业Emission standard of volatile organic compounds ——Part 1：Automobile manufacturing industry2016-07-06发布2017-01-01实施山东省环境保护厅目次前言 (II)1 范围 (1)2 规范性引用文件 (1)3 术语和定义 (1)4 挥发性有机物排放控制要求 (3)5 监测要求 (5)6 实施与监督 (5)附录A（规范性附录）确定某排气筒最高允许排放速率的外推法 (7)附录B（规范性附录）等效排气筒有关参数计算方法 (8)附录C（规范性附录）单位涂装面积挥发性有机物排放总量核算 (9)前言DB37/ 2801 《挥发性有机物排放标准》已经或计划发布以下部分：——第1部分：汽车制造业；第2部分：铝型材工业；第3部分：家具制造业；第4部分：印刷业。

本部分为DB37/ 2801的第1部分。

本部分规定了山东省汽车制造业挥发性有机物排放控制和监测要求，以及标准的实施与监督等有关要求。

山东省汽车制造业排放水污染物、除挥发性有机物外的其他大气污染物、恶臭污染物、环境噪声适用相应的国家和地方标准，产生固体废物的鉴别、处理和处置适用相应的国家固体废物污染控制标准。

本部分按照GB/T 1.1—2009给出的规则起草。

本部分由山东省环境保护厅提出。

本部分由山东省环境保护标准化专业技术委员会归口。

本部分起草单位：山东省环境规划研究院、济南市环境保护规划设计研究院、济南颐华环保有限公司。

本部分主要起草人：史会剑、谢刚、马召坤、袁琦、吴彤、赵红、胡欣欣、李玄、孙辉。

挥发性有机物排放标准第1部分：汽车制造业1 范围本标准规定了山东省汽车制造业挥发性有机物排放控制和监测要求，以及标准的实施与监督等有关规定。

LG T672, LP T672Super TOPLED ®High-Current LED Abgek ündigt nach PD_078_02 - werden durch LG_LP T676 ersetzt werdenObsolete acc. to PD_078_02 - will be replaced by LG_LP T6762003-09-041Besondere Merkmale•Geh äusetyp: wei ßes P-LCC-2 Geh äuse, farbloser klarer Verguss•Besonderheit des Bauteils: extrem breite Abstrahlcharakteristik, ideal f ürHinterleuchtungen und Einkopplungen in Lichtleiter; h öherer zul ässiger Betriebsstrom •Wellenl änge: 570 nm (gr ün), 560nm (pure green)•Abstrahlwinkel: Lambertscher Strahler (120°)•Technologie: GaAsP (gr ün), GaP (pure green)•optischer Wirkungsgrad: 1,5lm/W (gr ün), 0,6lm/W (pure green)•Gruppierungsparameter: Lichtst ärke •Verarbeitungsmethode: f ür alle SMT-Best ücktechniken geeignet •L ötmethode: IR Reflow L öten und Wellenl öten (TTW)•Vorbehandlung: nach JEDEC Level 2•Gurtung: 8-mm Gurt mit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Anwendungen•optischer Indikator•Hinterleuchtung (LCD, Handy, Schalter, Tasten, Displays)•Innenbeleuchtung im Automobilbereich (z.B.Instrumentenbeleuchtung u. ä.)Features•package: white P-LCC-2 package, colorless clear•feature of the device: extremely wide viewing angle, ideal for backlighting and coupling in light guides; higher permissible current •wavelength: 570nm (green), 560nm (pure green)•viewing angle: Lambertian Emitter (120°)•technology: GaAsP (green), GaP (pure green)•optical efficiency: 1.5lm/W (green), 0.6lm/W (pure green)•grouping parameter: luminous intensity •assembly methods: suitable for all SMT assembly methods•soldering methods: IR reflow soldering and TTW soldering•preconditioning: acc. to JEDEC Level 2•taping: 8mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mmApplications•optical indicators•backlighting (LCD, cellular phones, switches, keys, displays)•interior automotive lighting (e.g. dashboard backlighting)2003-09-042s Abgek ündigt nach PD_078_02 - werden durch LG_LP T676 ersetzt werden Obsolete acc. to PD_078_02 - will be replaced by LG_LP T676Letzte Bestellung / Last Order: 30.09.2003Letzte Lieferung / Last Delivery: 31.03.2004Anm.:-1 gesamter Farbbereich (siehe Seite 4)Die Standardlieferform von Serientypen beinhaltet eine untere bzw. obere Familiengruppe. Diese besteht aus 3bzw.4Helligkeitshalbgruppen. Einzelne Helligkeitshalbgruppen sind nicht bestellbar.In einer Verpackungseinheit /Gurt ist immer nur eine Helligkeitshalbgruppe enthalten.Note:-1 Total color tolerance range (see page 4)The standard shipping format for serial types includes a lower or upper family group of 3or 4individual luminous intensity half groups. Individual luminous intensity half groups cannot be ordered.No packing unit /tape ever contains more than one luminous intensity half group.TypTypeEmissions-farbe Color of EmissionLichtst ärkeLuminous Intensity I F = 50mA I V (mcd)LichtstromLuminous Flux I F = 50mA ΦV (mlm)BestellnummerOrdering Codes LG T672-P1Q1-1s LG T672-Q1R2-1green 45.0 ...90.071.0 ...180.0190 (typ.)350 (typ.)Q62703Q5014Q62703Q5015s LP T672-L2M2-1s LP T672-M2P1-1pure green14.0 ...28.022.4 ...56.062 (typ.)110 (typ.)Q65110Q0325Q65110Q03262003-09-043GrenzwerteMaximum Ratings Bezeichnung ParameterSymbol Symbol Wert Value Einheit Unit BetriebstemperaturOperating temperature range T op – 40 … + 100°C LagertemperaturStorage temperature range T stg – 40 … + 100°C Sperrschichttemperatur Junction temperature T j + 100°C DurchlassstromForward current (T A =25°C)I F 50mA Sto ßstrom Surge currentt ≤ 10 µs, D = 0.005, T A =25°C I FM1ASperrspannung 1)Reverse voltage (T A =25°C)V R 12V LeistungsaufnahmePower consumption (T A =25°C)P tot160mWW ärmewiderstand Thermal resistanceSperrschicht/Umgebung 2)Junction/ambient 2)Sperrschicht/L ötpad Junction/solder pointR th JA R th JS30080K/W K/W1)f ür kurzzeitigen Betrieb geeignet / suitable for short term application 2)Montage auf PC-Board FR 4 (Padgr öße ≥ 16mm 2)mounted on PC board FR 4 (pad size ≥ 16mm 2)2003-09-044Kennwerte (T A = 25 °C)Characteristics Bezeichnung ParameterSymbol SymbolWerte ValuesEinheit Unit LGLP Wellenl änge des emittierten Lichtes (typ.)Wavelength at peak emission I F = 50mAλpeak572557nmDominantwellenl änge 1)Dominant wavelength I F = 50mAλdom570560nmSpektrale Bandbreite bei 50 % I rel max (typ.)Spectral bandwidth at 50 % I rel max I F = 50mA∆λ2522nmAbstrahlwinkel bei 50 % I V (Vollwinkel)(typ.) Viewing angle at 50 % I V (typ.) 2ϕ120120Grad deg.Durchlassspannung 2)(typ.)Forward voltage (max.)I F = 50mA V F V F 2.63.5 2.62.7V VSperrstrom(typ.)Reverse current (max.)V R = 12 VI R I R 0.01100.0110µA µATemperaturkoeffizient von λpeak (typ.)Temperature coefficient of λpeak I F = 50mA; –10°C ≤ T ≤ 100°C TC λpeak0.110.11nm/KTemperaturkoeffizient von λdom (typ.)Temperature coefficient of λdom I F = 50mA; –10°C ≤ T ≤ 100°C TC λdom0.070.05nm/KTemperaturkoeffizient von V F (typ.)Temperature coefficient of V F I F = 50mA; –10°C ≤ T ≤ 100°C TC V– 2.0– 2.0mV/KOptischer Wirkungsgrad (typ.)Optical efficiency I F = 50mAηopt1.50.6lm/W1)Wellenl ängen werden mit einer Stromeinpr ägedauer von 25ms und einer Genauigkeit von ±1nm ermittelt.Wavelengths are tested at a current pulse duration of 25ms and a tolerance of ±1nm.2)Spannungswerte werden mit einer Stromeinpr ägedauer von 1ms und einer Genauigkeit von ±0,1V ermittelt.Voltages are tested at a current pulse duration of 1ms and a tolerance of ±0.1V.2003-09-045Helligkeitswerte werden mit einer Stromeinpr ägedauer von 25ms und einer Genauigkeit von ±11% ermittelt.Luminous intensity is tested at a current pulse duration of 25ms and a tolerance of ±11%.Helligkeits-Gruppierungsschema Luminous Intensity Groups LichtgruppeLuminous Intensity Group Lichtst ärkeLuminous Intensity I V (mcd)Lichtstrom Luminous Flux ΦV (mlm)L2M1M2N1N2P1P2Q1Q2R1R214.0 …18.018.0 …22.422.4 …28.028.0 …35.535.5 …45.045.0 …56.056.0 …71.071.0 …90.090.0 …112.0112.0 …140.0140.0 …180.050 (typ.)60 (typ.)75 (typ.)95 (typ.)120 (typ.)150 (typ.)190 (typ.)240 (typ.)300 (typ.)380 (typ.)480 (typ.Relative spektrale Emission I rel = f (λ), T A = 25 °C, I F = 50mA Relative Spectral EmissionV(λ) = spektrale AugenempfindlichkeitStandard eye response curveAbstrahlcharakteristik I rel = f (ϕ)2003-09-046Durchlassstrom I F = f (V F)Forward CurrentMaximal zulässiger Durchlassstrom I F = f (T) Max. Permissible Forward Current Relative Lichtstärke I V/I V(50mA) = f (I F) Relative Luminous IntensityMaximal zulässiger Durchlassstrom I F = f (T)Max. Permissible Forward Current2003-09-047Relative Lichtstärke I V/I V(25 °C) = f (T A) Relative Luminous IntensityZulässige Impulsbelastbarkeit I F = f (t p) Permissible Pulse Handling Capability2003-09-048MaßzeichnungPackage OutlinesMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Kathodenkennung:abgeschrägte EckeCathode mark:bevelled edgeGewicht / Approx. weight:35mg2003-09-049Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil(nach IPC 9501)IR Reflow Soldering Profile(acc. to IPC 9501)2003-09-0410Wellenlöten (TTW)(nach CECC 00802)TTW Soldering(acc. to CECC 00802)2003-09-0411Empfohlenes Lötpaddesign IR-Reflow LötenRecommended Solder Pad IR Reflow SolderingMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat2003-09-0412Empfohlenes Lötpaddesign verwendbar für TOPLED® und Power TOPLED®IR Reflow LötenRecommended Solder Pad useable for TOPLED® and Power TOPLED®IR Reflow SolderingMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2003-09-0413Gurtung / Polarität und Lage Verpackungseinheit2000/Rolle, ø180 mmoder 8000/Rolle, ø330 mmMethod of Taping / Polarity and Orientation Packing unit2000/reel, ø180 mmor 8000/reel, ø330 mmMaße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).Anm.:Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten.Note:Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC.2003-09-04142003-09-0415Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved.Attention please!The information describes the type of component and shall not be considered as assured characteristics.All typical data and graphs are basing on representative samples, but don ’t represent the production range. If requested,e.g. because of technical improvements, these typ. data will be changed without any further notice.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the Internet.PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.1A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system.2Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.Revision History:2003-09-04Date of changePrevious Version:2003-08-04Page Subjects (major changes since last revision)9change of weight from 40mg to 35mg 2002-06-2814annotations2002-07-2313recomm. solder pad for TOPLED ® and Power TOPLED ® (OHLPY440)2002-08-053, 4value (reverse voltage from 5V to 12V)2002-09-182Ordering Code 2002-09-16all nor for new designs 2002-11-181, 2Obsolete 2003-08-0414note: dry pack 2003-09-043ambient temperature2003-09-04。

ProductFolderSample &BuyTechnical Documents Tools &SoftwareSupport &CommunityTPS65917-Q1SLVSD22–JULY 2015TPS65917-Q1Power Management Unit (PMU)for Processor1Device Overview1.1Features•Qualified for Automotive Applications•Five Low-Dropout (LDO)Linear Regulators:•AEC-Q100Qualified With the Following Results:–0.9-to 3.3-V Output Range in 50-mV steps –Device Temperature Grade 2:–40°C to +105°C –Two With 300-mA Capability and Bypass Mode Ambient Operating Temperature Range –One With 100-mA Capability and Capable of –Device HBM Classification Level 2Low-Noise Performance up to 50mA –Device CDM Classification Level C4B–Two Other LDOs With 200-mA Current Capability•System Voltage Range from 3.135V to 5.25V –Short-Circuit Protection•Low-Power Consumption •12-Bit Sigma-Delta General-Purpose ADC –20μA in Off Mode(GPADC)With 8Input Channels (2external)–90μA in Sleep Mode With Two SMPSs Active •Thermal Monitoring With High Temperature •Five Step-Down Switched-Mode Power Supply Warning and Thermal Shutdown (SMPS)Regulators:•Power Sequence Control:–0.7-to 3.3-V Output Range in 10-or 20-mV –Configurable Power-Up and Power-Down StepsSequences (OTP)–Two SMPS Regulators With 3.5-A Capability,–Configurable Sequences Between the SLEEP With the Ability to Combine into 7-A Output in and ACTIVE State Transition (OTP)Dual-Phase Configuration,With Differential Remote Sensing (Output and Ground)–Three Digital Output Signals that can be Included in the Startup Sequence –Three Other SMPS Regulators with 3-A,2-A,and 1.5-A Capabilities•Selectable Control Interface:–Dynamic Voltage Scaling (DVS)Control and –One SPI for Resource Configurations and DVS Output Current Measurement in 3.5-A and 3-A ControlSMPS Regulators–Two I 2C Interfaces.–Hardware and Software Controlled Eco-mode™•One Dedicated for DVS ControlSupplying up to 5mA •One General Purpose I 2C Interface for –Short-Circuit ProtectionResource Configuration and DVS Control–Power-Good Indication (Voltage and •OTP Bit-Integrity Error Detection With Options to Overcurrent Indication)Proceed or Hold Power-Up Sequence and –Internal Soft-Start for In-Rush Current Limitation RESET_OUT Release –Ability to Synchronize to External Clock between •Package Option:1.7MHz and2.7MHz–7-×7-mm 48-pin VQFN With 0.5-mm Pitch 1.2Applications•Automotive Infotainment •Automotive Advanced Driver Assistance System (ADAS)•Automotive Digital Cluster•Automotive Navigation Systems1.3DescriptionThe TPS65917-Q1device is an integrated PMIC with AEC-Q100qualification.The device provides 5configurable step-down converters with up to 3.5A of output current for memory,processor core,I/O,or preregulation of LDOs.These step-down converters can be synchronized to an external clock between 1.7MHz and 2.7MHz,or an internal fallback clock at 2.2MHz.Two of these configurable step-down converters can be combined together to allow up to 7A of output current.The device also contains 5LDO regulators for external use.These LDOs can be supplied from either the system supply or an external preregulated supply.An IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.TPS65917-Q1SLVSD22– The power-up and power-down controller is configurable and can support any power-up and power-down sequences(OTP based).As an additional safety feature,the OTP bit-integrity error-detection feature provides the option to stop the power-up sequence if an error is detected.The TPS65917-Q1device includes an internal32-kHz RC oscillator to sequence all resources during power up and power down.All LDOs and SMPS converters can be controlled by the SPI or I2C interface,or by power request signals.In addition,voltage scaling registers allow transition of the SMPS to different voltages by SPI,I2C,or roof-and-floor control.GPIO functionality is available and3GPIOs can be configured as part of the power-up sequence to control external resources.The fallback clock of the step-down converters can be output through the SYNCCLKOUT pin to provide synchronization clock to external resources.Power request signals enable power mode control for power optimization.The device includes a general-purpose sigma-delta analog-to-digital converter(ADC)with8channels(2with external access).The TPS65917-Q1device is available in a48-pin VQFN package with a0.5-mm pitch.Device Information(1)PART NUMBER PACKAGE BODY SIZE(NOM)TPS65917-Q1VQFN(48)7.00mm×7.00mm(1)For all available packages,see the orderable addendum at the end of the data sheet.2Device Overview Copyright©2015,Texas Instruments IncorporatedSubmit Documentation FeedbackProduct Folder Links:TPS65917-Q1TPS65917-Q1 SLVSD22–JULY20151.4Functional DiagramFigure1-1.Functional DiagramCopyright©2015,Texas Instruments Incorporated Device Overview3Submit Documentation FeedbackProduct Folder Links:TPS65917-Q1TPS65917-Q1SLVSD22– 2Device and Documentation Support2.1Documentation Support2.1.1Related DocumentationFor related documentation see the following:Guide to Using the GPADC in TPS65903x and TPS6591x Devices,SLIA0872.2Community ResourcesThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and help solve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.2.3TrademarksEco-mode,E2E are trademarks of Texas Instruments.All other trademarks are the property of their respective owners.2.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.2.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.3Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.4Mechanical,Packaging,and Orderable Information Copyright©2015,Texas Instruments IncorporatedSubmit Documentation FeedbackProduct Folder Links:TPS65917-Q1IMPORTANT NOTICETexas Instruments Incorporated(TI)reserves the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should 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