RQK0201QGDQA中文资料

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Rev.3.00 Jun 12, 2006 page 1 of 6

RQK0201QGDQA

Silicon N Channel MOS FET Power Switching REJ03G1321-0300 Rev.3.00 Jun 12, 2006 Features • Low on-resistance RDS(on) = 25 mΩ typ (VGS = 4.5 V, ID = 2.4 A) • Low drive current • High speed switching • 2.5 V gate drive Outline RENESAS Package code: PLSP0003ZB-A(Package name: MPAK)

1. Source2. Gate3. Drain

SD

G221

133

Note: Marking is “QG”. Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Drain to source voltage VDSS 20 V Gate to source voltage VGSS ±12 V Drain current ID 4.5 A Drain peak current ID(pulse) Note1 15 A Body - drain diode reverse drain current IDR 4.5 A Channel dissipation Pch Note2 0.8 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1% 2. When using the glass epoxy board (FR-4: 40 x 40 x 1 mm) 元器件交易网www.cecb2b.comRQK0201QGDQA Rev.3.00 Jun 12, 2006 page 2 of 6 Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Drain to source breakdown voltage V(BR)DSS 20 — — V ID = 10 mA, VGS = 0 Gate to source breakdown voltage V(BR)GSS ±12 — — V IG = ±100 µA, VDS = 0 Gate to source leak current IGSS — — ±10 µA VGS = ±10 V, VDS = 0 Drain to source leak current IDSS — — 1 µA VDS = 20 V, VGS = 0 Gate to source cutoff voltage VGS(off) 0.4 — 1.4 V VDS = 10 V, ID = 1 mA RDS(on) — 30 39 mΩ ID = 2.4A, VGS = 4.5 VNote3 Drain to source on state resistance RDS(on) — 38 53 mΩ ID = 2.4A, VGS = 2.5 VNote3 Forward transfer admittance |yfs| 9 12 — S ID = 2.4A, VDS = 10 VNote3 Input capacitance Ciss — 479 — pF Output capacitance Coss — 106 — pF Reverse transfer capacitance Crss — 48 — pF VDS = 10 V VGS = 0 f = 1 MHz Turn - on delay time td(on) — 14 — ns Rise time tr — 53 — ns Turn - off delay time td(off) — 35 — ns Fall time tf — 6 — ns ID = 2.4 A VGS = 4.5 V RL = 5.50 Ω Rg = 4.7 Ω Total gate charge Qg — 4.6 — nC Gate to source charge Qgs — 0.9 — nC Gate to drain charge Qgd — 1.3 — nC VDD = 10 V VGS = 4.5 V ID = 4.5 A Body - drain diode forward voltage VDF — 0.85 1.1 V IF = 4.5 A, VGS = 0 Note3 Notes: 3. Pulse test 元器件交易网www.cecb2b.comRQK0201QGDQA Rev.3.00 Jun 12, 2006 page 3 of 6 Main Characteristics

108642006

3915

12

0.00010.0010.011

0.1

00.511.522.5300.20.40.60.81

050100150

03691215

00.511.522.533.54Tc = 75°C–25°C25°CVDS = 10 VPulse Test

011.5

0.5

–250255075100125150VDS = 10 VPulse TestVDS = 10 VPulse Test

Tc = 75°C25°C

–25°CVGS = 0 VPulse TestTc = 25°C

1.6 V1.8 V2.0 V10 V2.2 V3 V

1.4 V0.010.1110100

0.010.1110100Ta = 25°C1 Shot Pulse100 µs

PW = 100 ms1 ms10 msDC Operation

ID = 10 mA

1 mA0.1 mAAmbient Temperature Ta (°C)Channel Dissipation Pch (W)Maximum Channel PowerDissipation CurveMaximum Safe Operation Area

Drain to Source Voltage VDS (V)Drain Current ID (A)

Drain Current ID (A)Typical Output Characteristics

Drain to Source Voltage VDS (V)Typical Transfer Characteristics (1)

Gate to Source Voltage VGS (V)Drain Current ID (A)

Typical Transfer Characteristics (2)

Gate to Source Voltage VGS (V)Drain Current ID (A)Gate to Source Cutoff Voltage vs.Case Temperature

Case Temperature Tc (°C)Gate to Source Cutoff Voltage VGS(off) (V)*When using the glass epoxy board (FR-4: 40 × 40 × 1 mm)Operation in this areais limited by RDS(on)

元器件交易网www.cecb2b.comRQK0201QGDQA Rev.3.00 Jun 12, 2006 page 4 of 6

0100200300400

0246810101001000

0.1110100

20304050

203040506070

–250255075100125150

–250255075100125150–250255075100125150

0.010.1110100

0.010.1110010110100100010000Pulse TestTc = 25°C

2.4 A

1 A10 V4.5 V

0.5 AID = 4.5 APulse TestVGS = 4.5 V

Pulse TestVGS = 2.5 VVGS = 2.5 VPulse TestTc = 25°C

–25°C

Tc = 75°C25°CPulse TestVDS = 10 VPulse TestVGS = 0 VVDS = 20 V2.4 A0.5 A1 A4.5 A

2.4 A

1 A0.5 AID = 4.5 ADrain to Source Saturation Voltage vs.Gate to Source Voltage

Gate to Source Voltage VGS (V)Drain to Source Saturation Voltage VDS(on) (mV)Static Drain to Source on State Resistancevs. Drain Current

Drain Current ID (A)Drain to Source on State Resistance

RDS(on) (mΩ)

Static Drain to Source on State Resistancevs. Case Temperature

Case Temperature Tc (°C)Drain to Source on State Resistance

RDS(on) (mΩ)Static Drain to Source on State Resistancevs. Case Temperature

Case Temperature Tc (°C)Drain to Source on State Resistance

RDS(on) (mΩ)

Forward Transfer Admittance vs.Drain Current

Drain Current ID (A)Forward Transfer Admittance |yfs| (S)Zero Gate Voltage Drain current vs.Case Temperature

Case Temperature Tc (°C)Zero Gate Voltage Drain current IDSS (nA)

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