Block Lock FeatureThe block lock feature protects either the entire device or ranges of blocks from beingprogrammed and erased. Using the block lock feature is preferable to using WP# to pre-vent PROGRAM and ERASE operations.Block lock is enabled and disabled at power-on through the LOCK pin. At power-on, ifLOCK is LOW, all BLOCK LOCK commands are disabled. However if LOCK is HIGH atpower-on, the BLOCK LOCK commands are enabled and, by default, all the blocks onthe device are protected, or locked, from PROGRAM and ERASE operations, even if WP#is HIGH.Before the contents of the device can be modified, the device must first be unlocked.Either a range of blocks or the entire device may be unlocked. PROGRAM and ERASEoperations complete successfully only in the block ranges that have been unlocked.Blocks, once unlocked, can be locked again to protect them from further PROGRAMand ERASE operations.Blocks that are locked can be protected further, or locked tight. When locked tight, thedevice’s blocks can no longer be locked or unlocked until the device is power cycled. WP# and Block LockThe following is true when the block lock feature is enabled:•Holding WP# LOW locks all blocks, provided the blocks are not locked tight.•If WP# is held LOW to lock blocks, then returned to HIGH, a new UNLOCK commandmust be issued to unlock blocks.UNLOCK (23h-24h)By default at power-on, if LOCK is HIGH, all the blocks are locked and protected fromPROGRAM and ERASE operations. The UNLOCK (23h) command is used to unlock arange of blocks. Unlocked blocks have no protection and can be programmed or erased.The UNLOCK command uses two registers, a lower boundary block address register andan upper boundary block address register, and the invert area bit to determine whatrange of blocks are unlocked. When the invert area bit = 0, the range of blocks withinthe lower and upper boundary address registers are unlocked. When the invert area bit= 1, the range of blocks outside the boundaries of the lower and upper boundary ad-dress registers are unlocked. The lower boundary block address must be less than theupper boundary block address. The figures below show examples of how the lower andupper boundary address registers work with the invert area bit.To unlock a range of blocks, issue the UNLOCK (23h) command followed by the appro-priate address cycles that indicate the lower boundary block address. Then issue the24h command followed by the appropriate address cycles that indicate the upper boun-dary block address. The least significant page address bit, PA0, should be set to 1 if set-ting the invert area bit; otherwise, it should be 0. The other page address bits should be0.Only one range of blocks can be specified in the lower and upper boundary block ad-dress registers. If after unlocking a range of blocks the UNLOCK command is again is-sued, the new block address range determines which blocks are unlocked. The previousunlocked block address range is not retained.Figure 78: TWO-PLANE BLOCK ERASERE#CE#ALECLEI/Ox R/B#WE#Figure 79: TWO-PLANE/MULTIPLE-DIE READ STATUS CycleCE#CLEALERE#I/Ox 4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Two-Plane OperationsInterleaved Die (Multi-LUN) Operations4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Interleaved Die (Multi-LUN) OperationsInternal ECC and Spare Area Mapping for ECCInternal ECC enables 5-bit detection and 4-bit error correction in 512 bytes (x8) or 256words (x16) of the main area and 4 bytes (x8) or 2 words (x16) of metadata I in the sparearea. The metadata II area, which consists of two bytes (x8) and one word (x16), is notECC protected. During the busy time for PROGRAM operations, internal ECC generatesparity bits when error detection is complete.During READ operations the device executes the internal ECC engine (5-bit detectionand 4-bit error correction). When the READ operaton is complete, read status bit 0 mustbe checked to determine whether errors larger than four bits have occurred.Following the READ STATUS command, the device must be returned to read mode byissuing the 00h command.Limitations of internal ECC include the spare area, defined in the figures below, andECC parity areas that cannot be written to. Each ECC user area (referred to as main andspare) must be written within one partial-page program so that the NAND device cancalculate the proper ECC parity. The number of partial-page programs within a pagecannot exceed four.Figure 80: Spare Area Mapping (x8)Figure 81: Spare Area Mapping (x16)。
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义隆电子股份有限公司 总公司:地址: 30076新竹科学工业园区创新一路12号电话: +886 3 563-9977 传真: +886 3 563-9966 *****************.tw http :// 香港分公司:义隆电子(香港)股份有限公司 地址:九龙观塘巧明街95号世达 中心19楼A 室电话: +852 2723-3376 传真: +852 2723-7780美国:Elan InformationTechnology Group (U.S.A.) 地址: 10268 Bandley Drive Suite 101 , Cupertino , CA 95014,USA 电话: +1 408 366-8225 传真: +1 408 366-8225深圳分公司:义隆电子(深圳)有限公司地址:518057深圳市南山区高新技术产业园南区高新南六道迈科龙大厦8A电话: +86 755 2601-0565 传真: +86 755 2601-0500 ******************.cn上海分公司:义隆电子(上海)有限公司地址:上海市浦东新区盛荣路88弄3号703室(盛大天地源创谷内)电话：+86 21 5080-3866 ******************.cn目录目录1 综述 (1)2 特性 (1)3 引脚配置 (2)3.1 10-Pin MSOP (2)3.2 16-Pin DIP/SOP (2)3.3 14-Pin SOP (2)4 引脚描述 (3)5 系统概述 (5)5.1 内存图 (5)5.2 模块图 (6)6 功能描述 (7)6.1 操作寄存器 (7)6.1.1 R0:IAR (间接寻址寄存器) (7)6.1.2 R1 :TCC(定时器时钟) (7)6.1.3 R2:PC (程序计数器和堆栈) (7)6.1.4 R3 :SR(状态寄存器) (10)6.1.5 R4 :RSR(RAM选择寄存器) (10)6.1.6 Bank 0 R5 ~ R6, R8 (Port 5 ~ Port 6, Port 8) (10)6.1.7 Bank 0 R9:TBLP (指令TBRD表指针寄存器) (11)6.1.8 Bank 0 RA:WUPC (唤醒控制寄存器) (11)6.1.9 Bank 0 RB:EECR (EEPROM控制寄存器) (12)6.1.10 Bank 0 RC: EEPA (128 字节 EEPROM 地址) (12)6.1.11 Bank 0 RD: EEPD (128字节EEPROM 数据) (12)6.1.12 Bank 0 RE: OMCR (模式选择寄存器) (12)6.1.13 Bank 0 RF: ISR1 (中断状态寄存器 1) (15)6.1.14 R10 ~ R3F (15)6.1.15 Bank 1 R5~R7 (16)6.1.16 Bank 1 R8 (IRC 选择寄存器) (16)6.1.17 Bank 1 R9: TM1CR1 (定时器/计数器 1控制寄存器1) (16)6.1.18 Bank 1 RA: TM1CR2(定时器/计数器 1控制寄存器 2) (17)6.1.19 Bank 1 RB: TM1DAH (定时器/计数器 1数据缓冲A高字节) (18)6.1.20 Bank 1 RC: TM1DAL (定时器/计数器 1数据缓冲A低字节) (18)6.1.21 Bank 1 RD: TM1DBH (定时器/计数器 1数据缓冲B高字节) (18)6.1.22 Bank 1 RE: TM1DBL (定时器/计数器 1数据缓冲B低字节) (18)6.1.23 Bank 1 RF: ISR2 (中断状态寄存器 2) (19)6.1.24 Bank 2 R5:AISR (ADC输入选择寄存器) (19)6.1.25 Bank 2 R6: ADCON (A/D控制寄存器) (20)6.1.26 Bank 2 R7: ADCON2 (A/D控制寄存器2) (21)6.1.27 Bank 2 R8 : ADDH (AD高 8位数据缓存) (22)6.1.28 Bank 2 R9 : ADDL (AD低4位数据缓存) (22)6.1.29 Bank 2 RA: URCR (UART控制寄存器) (22)6.1.30 Bank 2 RB: URS (UART 状态寄存器) (23)6.1.31 Bank 2 RC: URTD (UART 发送数据缓冲寄存器) (24)6.1.32 Bank 2 RD: URRDL (UART 接收数据低位缓冲寄存器) (24)目录6.1.33 Bank 2 RE: URRDH (UART 接收数据高位缓冲寄存器) (24)6.1.34 Bank 2 RF (24)6.1.35 Bank 3 R5 (24)6.1.36 Bank 3 R6 : TBHP(指令TBRD的表指针寄存器) (24)6.1.37 Bank 3 R7: CMP2CON(比较器2控制寄存器) (25)6.1.38 Bank 3 R8 ~ RC (25)6.1.39 Bank 3 RD :TC3CR (定时器3控制) (25)6.1.40 Bank 3 RE :TC3D (定时器 3 数据缓存) (27)6.1.41 Bank 3 RF (27)6.2 特殊功能寄存器 (28)6.2.1 A (累加器) (28)6.2.2 CONT (控制寄存器) (28)6.2.3 IOC5 ~ IOC6, IOC8 (I/O端口控制寄存器) (28)6.2.4 IOC7, IOC9 (28)6.2.5 IOCA:WDTCR (WDT 控制寄存器) (29)6.2.6 IOCB: P6PDCR (下拉控制寄存器2) (29)6.2.7 IOCC: P6ODCR (漏极开路控制寄存器) (30)6.2.8 IOCD: P9PHCR (上拉控制寄存器2) (30)6.2.9 IOCE:IMR2 (中断屏蔽寄存器2) (31)6.2.10 IOCF: IMR1(中断屏蔽寄存器1) (31)6.3 TCC/WDT 与预分频器 (33)6.4 I/O 端口 (34)6.4.1 使用端口6输入状态改变唤醒/中断功能 (36)6.5 复位和唤醒 (37)6.5.1 复位 (37)6.5.2 总结唤醒和中断模式操作 (39)6.5.3 寄存器初始值的总结 (42)6.5.4 状态寄存器的T和P状态 (49)6.6 中断 (50)6.7 数据EEPROM (52)6.7.1 数据EEPROM控制寄存器 (52)6.7.2 编程步骤 / 举例示范 (52)6.8 模拟数字转换器(ADC) (53)6.8.1 A/D 取样时间 (53)6.8.2 A/D 转换时间 (54)6.8.3 睡眠期间的A/D转换 (54)6.8.4 编程步骤/注意事项 (55)6.9 定时器/计数器1 (TM1) (58)6.9.1 定时器/计数器模式 (58)6.9.2 窗口模式 (59)6.9.3 捕捉模式 (60)6.9.4 可编程分频输出模式和脉冲宽度调制模式 (62)6.9.5 蜂鸣器 (63)6.10 定时器/计数器3 (63)6.11 UART (65)6.11.1 UART 模式 (66)6.11.2 发送 (67)目录6.11.3 接收 (67)6.11.4 波特率发生器 (68)6.11 .5 UART 时序 (68)6.12 比较器 (69)6.12.1 外部参考信号 (69)6.12.2 内部参考电压 (70)6.12.3 比较器输出 (70)6.12.4 中断 (70)6.12.5 从睡眠至唤醒 (70)6.12.6 比较器初始化步骤 (71)6.13 振荡器 (71)6.13.1 振荡模式 (71)6.13.2 晶振 / 陶瓷谐振器(晶体) (72)6.13.3 外部RC振荡模式 (73)6.13.4 内部 RC 振荡模式 (74)6.14 代码选项寄存器 (75)6.14.1 代码选项寄存器 (Word 0) (75)6.14.2 代码选项寄存器(Word 1) (77)6.14.3 客户ID寄存器(Word 2) (78)6.15 上电注意事项 (79)6.16 外部上电复位电路 (79)6.17 残留电压保护 (80)6.18 指令集 (81)7片上调试系统(OCDS) (84)7.1 片上调试的限制 (84)8 时序图 (85)9 绝对最大额定参数 (86)10 DC电气特性 (87)11 AC电气特性 (92)A 编码与制造信息 (93)B 封装类型 (94)C 封装结构 (95)C.1 EM78F811NMS10 (95)C.2 EM78F811NSO14 (96)C.3 EM78F811NAD16 (97)C.4 EM78F811NASO16A (98)D 品质保证和可靠性 (99)D.1 地址缺陷检测 (99)目录规格修订历史目录用户应用注意事项(使用此IC前，应注意如下描述的注意事项，它包含重要信息)1. 如果IRC频率从A频率变为B频率，MCU需要等待一些时间才可以工作。
WXSHigh-Precision Weigh ModulesThe sum of all advantages • Avoid cross-contaminationwith an additional pre-load of up to 78 g.A u t o m a t e d P r e c i s i o n W e i g h i n g2A u t o m a t e d P r e c i s i o n W e i g h i n gModel Specific Weighing DataType informationWXS205WXS205DU WXS204Nominal capacity (nominal load)200 g 200 g 200 g Maximum capacity220 g 220 g 220 g Maximum capacity, fine range -111 g -Maximum preload M1)78 g 78 g 78 g Readability0.01 mg0.1 mg 0.1 mg Readability, fine range -0.01 mg-Internal adjustment333Limit Values M2)Repeatability (σ) (nominal load) ≤ M3) 0.04 mg 0.07 mg 0.1 mg Linearity deviation ≤0.15 mg 0.2 mg 0.25 mgRepeatability, fine range (σ) ≤ M3)-0.03 mg (100 g)-Eccentric load deviation (test load) ≤0.3 mg (100 g)0.3 mg (100 g)0.4 mg (100 g)Sensitivity temperature drift ≤ M4)0.3 mg/°C 0.3 mg/°C 0.3 mg/°CTypical Values M5)Repeatability (σ) (nominal load) ≤0.031 mg0.064 mg 0.08 mgRepeatability, fine range (σ) ≤-0.03 mg -Settling time ≤3 s2 s 2 sAmbient ConditionsCompensated temperature range M6)10 °C to 30 °C Operating temperature range 5 °C to 40 °C Storage temperature range -20 °C to 70 °C Relative air humidity range M6)20% to 80%Warm-up time after power-on M6)60 minutesMaximum preload on top of “preload reference” weighing pan to maintain maximum capacity. Applicable for stationary conditions within compensated temperature and relative air humidity range. σ = standard deviation (99.7 % of weighing results within ± 3 σ). Weighing tests according to OIML R76 A.5.3 at stationary condi-tions. Applicable for stable environmental conditions and optimal filter settings. Condition to meet the specified limit values.General DataElectrical connection Power supplyInput: 100–240 V AC, 50/60 Hz, 0.5 A; Output: 12 V DC, 2 ACommunication interface RS232Ethernet (optional)Maximum weight update rate92 values/s and 23 values/s G1)IP protectionModule during weighing IP30Module during cleaning G2)IP45Electronic unitIP40MaterialsWeighing pan/platform Stainless steel (1.4404 / 316L); plasticWeigh module housing Stainless steel (1.4404 / 316L)Electronic unit housingStainless steel (1.4404 / 316L)In combination with a terminal. With plastic cover mounted.Scope of DeliveryItem Description Item NumberWXSLoad cellWeighing panØ = 50 mm, without threaded holes, approx. 68.5 g Adapter weighing pan (preload reference)Ø = 36 mm, with threaded holes, approx. 10 g Electronic unit Including mounting bracket and DIN clipCable WX 90/1.5Connection cable weigh module to electronic unit (90°/1.5 m) 111 214 40Power supplyIncluding country specific power cableProduction certificate Declaration of conformity Quick guide Terminal SWT S1)Monochrome touch screen display (including 0.575 m and 2.0 m terminal cables, protective cover)111 210 57Cable terminal S1)2 m111 321 33Only with WXSS versions.3Typical ConfigurationTerminal PWTTerminal SWT incl. cable WXS Cable WX Electronic unitAccessories from METTLER TOLEDOScope of deliveryTerminal SWT incl. cable (included in WXSS orders)For more informationMETTLER TOLEDO Group Industrial DivisionLocal contact: /contactsSubject to technical changes© 01/2019 METTLER TOLEDO. All rights reserved Document No. 30313184 A MarCom Industrial/ind-WXSOrder InformationWXS Model 205205DU204Standard SI Units *Standard SI Units *Standard SI Units *No terminalWXS205S/15111 210 03WXS205SV/15111 213 03WXS205SDU/15111 210 08WXS205SDUV/15111 213 08WXS204S/15111 210 23WXS204SV/15111 213 23Monochrome terminal SWTWXSS205111 210 01WXSS205V 111 213 01WXSS205DU 111 210 06WXSS205DUV 111 213 06WXSS204111 210 21WXSS204V 111 213 21“EU” legal-for-trade version.With SWT terminal.WXSS205/M 111 212 61WXSS205DU/M 111 212 66WXSS204/M 111 212 81* Only SI units are displayed: g, mg, ctAccessoriesItemDescriptionItem number PictureCable WX 90/0.5Connection cable weigh module to electronic unit (90°/0.5 m)111 214 42Cable WX 90/5Connection cable weigh module to electronic unit (90°/5 m)111 214 41Terminal PWT Color touch screen display, multi-user functionalities 111 210 58Cable terminal 0.575 m 111 321 24Cable terminal0.945 m111 321 29Interface second RS232CAdditional RS232C interface in electronic unit111 32500Interface Ethernet Additional Ethernet interface in electronic unit 111 325 15Weighing below adapter Adapter for below weighing applications 111 21081Draft shield Glass draft shield with sliding door 111 21071。
SPECIFICATION No.: BH-08060901DATE: Jun.09, 2008■ 新规□ 变更产 品 规 格 书PRODUCT SPECIFICATION产品名称（PRODUCT ）: Mobile Flash Mould客户型号（PART No.）:我方型号（OUR PART No.）: BH-M80-S试作型号（OUR TRIAL No.）:请在上方签署后将其中一份送还我方Please return 1 copy after your approval博 涵 科 技 有 限 公 司Bohan Technology Co.,Ltd公司地址：中国深圳南山区南山数字文化产业基地西座1808 Office Add ：1808,Building West,Nanshan Digital CultureIndustry Base,Nanshan District,Shenzhen, China 电话 Tel ：86-755-26470047 26470064传真 Fax ：86-755-86218080网址 APPROVED CHECKED ISSUED guoguo yuhong变更记录表 / ALTERNATION HISTORY记日 期设计编号项目（变更内容）变更理由变更页 变更表示预定实施日设计者号Date Design No.Item(Content)Reason Page Marking Estimate Designer Jun.11 新规发行2008NEW ISSUEjorkeyNAME 闪光灯模块Customer's Part No.:Mobile Flash MouldOur Part No.:BH-M80-S客户型号：本公司型号：1.范围 / SCOPE该规格书适用于手机、数码相机产品使用的照相闪光灯单元。
THIS SPECIFICATION APPLIES TO THE FLASH MOULD, MOBILE AND DIGITAL CAMERA.2.型号/ PART No.客户型号 / CUSTOMER’S PART No. :本公司型号 / OUR PART No. : BH-M80-S3.类型/ TYPEBH-S 普通型 / BH-S COMMONLY TYPE4.尺寸与重量 / DIMENSION & WEIGHT尺寸:参考外观图面DIMENSION : REFER TO THE APPEARANCE DRAWING重量:11.5±1 gWEIGHT: 11.5±1 g5.标准测试条件 / STANDARD TEST CONDITION在没有其他特别指定时，测试应在如下所记的标准测试条件下进行。
