陶瓷led封装 Ceramic LED PKG

* Calculatedvalue value * Calculated
--resulted resultedfrom from ultra ultra small hickness thickness (World’s Shortest Thermal Path) (World’s Shortest Thermal Path)
Product Ceratech Type I (5x5) Ceratech Type II (5x5) Ceratech Type III (5x5) LumiLEDs Rth (only PKG, T3Ster) 5~6K/W 9~10K/W 9~10K/W 4K/W Same Test Condition Remark > 1.30K/W*
PPA
2. 2. Ceramic Ceramic Material Material Properties Properties
Ceramic
PPA
Color Dielectric Constant
White 7~8 2~4
White 3.68
Thermal Conductivity (W/mK) > 50 (with thermal via, Ag)* Thermal Expansion Coefficient (CTE) Mechanical Strength Specific gravity 5~6(x10-6/K)
Standard Standard
1 1 2 2 3 3
High HighPower Power
Θ Θ
7 7
Heat Sink
4 4
5
8
6
Typical 1 2 3 4 5 6 7 8 A Block B Block C Block PAD Spacing Internal via to part etch Via pitch (Thermal via) Cavity angle (Θ) Internal via diameter Customer (>14mil) 2~4mil Customer (>14mil) > 8mil 10mil 3x Via Dia 60~90 degree 8~80mil (Heat Sink, 5x5 size)
Item
Test Condition
Requirement
No
Result
Vibration
Frequency : 41→ 55→ 10Hz Direction : x, y, z Time : 2hr
No Mechanical Damage Inspect with Scope
10ea
OK
Thermal Shock
Special 12mil 12mil 4mil 5mil 1.8x Via Dia 50 degree > 80mil possible (PKG Size Consideration)
6. 6. Figure Figure of of PKG PKG
Standard Standard High HighPower Power
Thermal ThermalVia ViaMetal MetalCoverage-sensitivity Coverage-sensitivityStudy Study
Description Peak Stage Temp. (℃) Thermal Resistance (℃/W)
A
No Silver Paste-filled thermal via
-. -.The Thematerial materialof ofelectrode, electrode,reflector, reflector,via viaand andthermal thermalvia viais ispure puresilver(Ag). silver(Ag).
5. 5. Design Design Rule Rule
**Thermal ThermalVia ViaDiameter Diameter::1.5~2.0mm 1.5~2.0mm(5x5 (5x5size), size),the thelarger largerthermal thermalvia viadiameter diameteris ispossible possible(PKG (PKGsize sizeconsideration) consideration)
1 e -6 0 10 20 30 40 50 60 70 80
RRth th [K/W] [K /W ]
10. 10. Thermal Thermal Expansion Expansion
TMA TMACurve Curve(Type (TypeI) I)
TMA TMAData Data
Coefficient of thermal expansion (CTE, x10-6/K) Ceramic Only Type I (Ceramic+Metal) 5.384
0.47
10~25x10-6 /K
> 200MPa 3.0±0.5
> 190MPa 1.58
-. -. The The above above values valuesare are typical typical values. values. In case of thermal conductivity, ** In case of thermal conductivity, the the value value can canvary varyby bythe the design design of of LED LEDPKG PKGwith withthermal thermal via. via. (50~max. (50~max. 400 400 W/mK, W/mK, refer refer to to Appendix Appendix of of this this Brochure) Brochure)
5.366
▪ CTE of the Type I is very similar to the value of the LED substrate (ex. GaN 5.5ppm) ▪ Highly Reliable for the Thermal Stress
11. 11. Appendix Appendix
Comparison Comparisonof ofMaterial Materialcharacteristics characteristicsof ofCeramic Ceramicand andResin Resin(PPA) (PPA)
Thermal Conductivity Ceramic Thermal Expansion Coefficient Size Cost Dimension Accuracy
K [W2s/K2]
K[W2s/K2] K[W2s/K2]
1
0 .0 1
Type II Ceratech LED
1 e -4
▪R Rth : 5~6K/W 5~6K/W (only (only PKG, PKG, Type Type I) I) ▪ th : ▪ PKG PKG Designer Designer can can result result in in best best ▪ efficiency from from CTC CTC Type Type I I efficiency (LED chip, chip, Ag Ag Epoxy Epoxy and and Silicone Silicone die die (LED bond, etc. etc. must must be be considered considered for for Rth(j-a)) Rth(j-a)) bond,
3. 3. Manufacturing Manufacturing Process Process
Sheet casting
Sheet punching
Printing
Coating
Stacking
Cutting
Firing
Breaking
4. 4. Exploded Exploded Diagram Diagram
Type I
Type II
Type III
High High Power Power PKG PKG
TYPE_3
TYPE_2
TYPE_1
7. -Tool Dimension 7. Open Open-Tool Dimension
4x4 Size
5x5 Size
8. 8. Reliability Reliability Test Test
Ceramic LED PKG
1. 1. Features Features of of Ceramic Ceramic LED LED PKG PKG
••Compactness Compactness(Small, (Small,Low Lowprofile) profile) ••High Reliability High Reliability ••Good GoodThermal ThermalProperties Properties ••Surface SurfaceMountable Mountable ••Pb Free (RoHS Pb Free (RoHSCompliant) Compliant) ••Design can be changed Design can be changedeasily easily - -Module type available Module type available
100 cycle (-40℃*20min → 85℃ *20min)
No Mechanical Damage Inspect with Scope
10ea
OK
Reflow Soldering
Preheat Temp : 150℃ Preheat Time : 1min. Solder Temp : 230±10℃ Soldering Time : 10sec (max.)
203.3
34.9
B
25 thermal vias 150㎛ diameter each 14 thermal vias 250㎛ diameter each Silver-paste filled thermal via Covering 100% the die area
Standard (open-tool)
High Power Flash Type
World’s First Ceramic and Silver World’s First Ceramic and Silver Metal Hybrid Type Metal Hybrid Type Thermal Via * Ceramic
10000
100
package
chip Die attach
Result from low thermal conductivity of applied silicone die bond (0.5W/mK)
Type I Ceratech LED Oil Type III Ceratech LED
L Rth = K·A
Type I
9. 9. Thermal Thermal Analysis Analysis
T3 S te r Ma s te r: d iffe re n tia l s tru c tu re fu n c tio n (s )
1e6 1 2 3
Rth Measurement : T3Ster (in Oil Bath)
Inspect with Scope
10ea
OK
Wire Bondability
Au Wire Temp 160℃ ( Au Wire 1mil)
Pull Strength : >3gr
10ea
OK
9. 9. Thermal Thermal Analysis Analysis
Thermal ThermalResistance Resistanceof ofvarious variousproducts products