VISHAY 产品介绍

IR Receiver Modules for Remote Control SystemsDESIGN SUPPORT TOOLS MECHANICAL DATAPinning1 = GND,2 = N.C.,3 = V S,4 = OUT ORDERING CODETaping:TSOP6...TT - top view taped TSOP6...TR - side view taped FEATURES•Improved immunity against HF and RF noise•Low supply current•Photo detector and preamplifier in one package•Internal filter for PCM frequency•Improved shielding against EMI•Supply voltage: 2.5 V to 5.5 V•Improved immunity against ambient light•Insensitive to supply voltage ripple and noise•Taping available for top view and side view assembly•Material categorization: for definitions of compliance please see /doc?99912 DESCRIPTIONThe TSOP61.., TSOP63.. series are miniaturized SMD IR receivers for infrared remote control systems. A PIN diode and a preamplifier are assembled on a lead frame, the epoxy package contains an IR filter. The demodulated output signal can be directly connected to a microprocessor for decoding.The TSOP63.. series devices are optimized to suppress almost all spurious pulses from Wi-Fi and CFL sources. They may suppress some data signals if continuously transmitted.The TSOP61.. series devices are provided primarily for compatibility with old AGC1 designs. New designs should prefer the TSOP63.. series containing the newer AGC3. The TSOP65.. series are useful to suppress even extreme levels of optical noise, but may also suppress some data signals. Please check compatibility with your codes.These components have not been qualified according to automotive specifications.PARTS TABLEAGC LEGACY, FOR SHORT BURSTREMOTE CONTROLS (AGC1)NOISY ENVIRONMENTSAND SHORT BURSTS (AGC3)VERY NOISY ENVIRONMENTSAND SHORT BURSTS (AGC5)Carrier frequency 30 kHz TSOP6130TSOP6330TSOP6530 33 kHz TSOP6133TSOP6333TSOP6533 36 kHz TSOP6136TSOP6336 (1)TSOP6536 (1) 38 kHz TSOP6138TSOP6338 (2)(3)(4)(5)TSOP6538 (2)(3)(4) 40 kHz TSOP6140TSOP6340TSOP6540 56 kHz TSOP6156TSOP6356TSOP6556Package PanheadPinning 1 = GND, 2 = N.C., 3 = V S, 4 = OUTDimensions (mm)7.5 W x 5.3 H x 4.0 DMounting SMDApplication Remote controlBest choice for(1) MCIR (2) Mitsubishi (3) RECS-80 Code (4) r-map (5) XMP-1, XMP-2BLOCK DIAGRAMAPPLICATION CIRCUITNote•Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliabilityABSOLUTE MAXIMUM RATINGSPARAMETER TEST CONDITIONSYMBOLVALUE UNIT Supply voltage V S -0.3 to +6V Supply current I S 5mA Output voltage V O -0.3 to (V S + 0.3)V Output current I O 5mA Junction temperature T j 100°C Storage temperature range T stg -25 to +85°C Operating temperature range T amb -25 to +85°C Power consumptionT amb ≤ 85 °C P tot10mWELECTRICAL AND OPTICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)PARAMETER TEST CONDITIONSYMBOLMIN.TYP.MAX.UNIT Supply voltage V S 2.5- 5.5V Supply current V S = 5 V, E v = 0I SD 0.550.70.9mA E v = 40 klx, sunlightI SH -0.8-mA Transmission distance E v = 0, IR diode TSAL6200, I F = 250 mA, test signal see Fig. 1d -40-m Output voltage low I OSL = 0.5 mA, E e = 0.7 mW/m 2, test signal see Fig. 1V OSL --100mV Minimum irradiance Pulse width tolerance:t pi - 5/f o < t po < t pi + 6/f o, test signal see Fig. 1E e min.-0.20.4mW/m 2Maximum irradiance t pi - 5/f o < t po < t pi + 6/f o , test signal see Fig. 1E e max.50--W/m 2DirectivityAngle of half transmission distanceϕ1/2-± 50-degTYPICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)Fig. 1 - Output Active LowFig. 2 - Pulse Length and Sensitivity in Dark AmbientFig. 3 - Output Function Fig. 4 - Output Pulse DiagramFig. 5 - Frequency Dependence of ResponsivityFig. 6 - Sensitivity in Bright AmbientE eV O V OH V OLFig. 7 - Sensitivity vs. Supply Voltage Disturbances Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length Fig. 9 - Sensitivity vs. Ambient Temperature Fig. 10 - Relative Spectral Sensitivity vs. Wavelength Fig. 11 - Horizontal DirectivityFig. 12 - Sensitivity vs. Supply VoltageSUITABLE DATA FORMATThis series is designed to suppress spurious output pulses due to noise or disturbance signals. The devices can distinguish data signals from noise due to differences in frequency, burst length, and envelope duty cycle. The data signal should be close to the device’s band-pass center frequency (e.g. 38 kHz) and fulfill the conditions in the table below.When a data signal is applied to the product in the presence of a disturbance, the sensitivity of the receiver is automatically reduced by the AGC to insure that no spurious pulses are present at the receiver’s output.Some examples which are suppressed are:•DC light (e.g. from tungsten bulbs sunlight)•Continuous signals at any frequency•Strongly or weakly modulated patterns from fluorescent lamps with electronic ballasts (see Fig. 13 or Fig. 14)•2.4 G Hz and 5 G Hz Wi-FiFig. 13 - IR Disturbance from Fluorescent Lampwith Low ModulationFig. 14 - IR Disturbance from Fluorescent Lampwith High ModulationNote•For data formats with long bursts (more than 10 carrier cycles) please see the datasheet for TSOP62.., TSOP64..169205101520I R S i g n a l A m p l i t u d eTime (ms)169215101520I R S i g n a l A m p l i t u d eTime (ms)TSOP61..TSOP63..TSOP65..Minimum burst length 6 cycles/burst 6 cycles/burst 6 cycles/burst After each burst of length A gap time is required of 6 to 70 cycles ≥ 10 cycles 6 to 35 cycles ≥ 10 cycles 6 to 24 cycles ≥ 10 cycles For bursts greater than a minimum gap time in the data stream is needed of 70 cycles > 1.2 x burst length35 cycles > 6 x burst length24 cycles > 25 ms Maximum number of continuous short bursts/second 200020002000MCIR codeYes Preferred Yes XMP-1, XMP-2 code YesPreferredYesSuppression of interference from fluorescent lampsMild disturbance patterns are suppressed (example:signal pattern of Fig. 13)Complex disturbance patterns are suppressed (example:signal pattern of Fig. 14)Critical disturbance patterns are suppressed,e.g. highly dimmed LCDsASSEMBLY INSTRUCTIONSReflow Soldering•Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope•Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured•Handling after reflow should be done only after the work surface has been cooled off Manual Soldering•Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C•Finish soldering within 3 s•Handle products only after the temperature has cooled offVISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILETAPING VERSION TSOP..TR DIMENSIONS in millimetersREEL DIMENSIONS in millimetersLEADER AND TRAILER DIMENSIONS in millimetersCOVER TAPE PEEL STRENGTH According to DIN EN 60286-30.1 N to 1.3 N300 ± 10 mm/min.165° to 180° peel angle LABELStandard bar code labels for finished goodsThe standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.DRY PACKINGThe reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.FINAL PACKINGThe sealed reel is packed into a cardboard box. RECOMMENDED METHOF OF STORAGEDry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available:•Storage temperature 10 °C to 30 °C•Storage humidity ≤ 60 % RH max.After more than 72 h under these conditions moisture content will be too high for reflow soldering.In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or96 h at 60 °C + 5 °C and < 5 % RH for all device containers or24 h at 125 °C + 5 °C not suitable for reel or tubes.An EIA JEDEC® standard J-STD-020 level 4 label is included on all dry bags.EIA JEDEC standard J-STD-020 level 4 label is includedon all dry bagsVISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTHItem-description-18Item-number INO8Selection-code SEL3LOT-/serial-number BATCH10Data-code COD 3 (YWW)Plant-code PTC2Quantity QTY8Accepted by ACC-Packed by PCK-Mixed code indicator MIXED CODE-Origin xxxxxxx+Company logo LONG BAR CODE TOP TYPE LENGTHItem-number N8Plant-code N2Sequence-number X3 Quantity N8 Total length-21 SHORT BAR CODE BOTTOM TYPE LENGTH Selection-code X3 Data-code N3 Batch-number X10 Filter-1 Total length-17TSOP61.., TSOP63.., TSOP65.. Vishay SemiconductorsESD PRECAUTIONProper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging.VISHAY SEMICONDUCTORS STANDARDBAR CODE LABELSThe Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.22645Tape and Reel Standards for Surface-Mount IR Receiver ModulesVishay Semiconductor surface-mount IR receivers are packaged on tape and reel. The following specification is based on IEC publication 286, which takes the industrial requirements for automatic insertion into account.Absolute maximum ratings, mechanical dimensions, optical and electrical characteristics for taped devices are identical to the basic catalog types and can be found in the specifications for untaped devices.PACKAGINGThe tapes of components are available on reels. Each reel is marked with labels which contain the following information: - Vishay- Type- Group- Tape code, normally part of type name- Production code- QuantityMISSING COMPONENTSUp to 3 consecutive components may be missing if the gap is followed by at least 6 components. A maximum of 0.5 % of the components per reel quantity may be missing. At least 5 empty positions are present at the start and the end of the tape to enable tape insertion.Tensile strength of the tape: > 15 N NUMBER OF COMPONENTSA. Panhead: quantity per reel:TT, top view package, 1190 pcsTR, side view package, 1120 pcsB. Heimdall: quantity per reel:TT, top view package, 2200 pcsTR, side view package, 2300 pcsC. Heimdall without lens: quantity per reel:WTT, top view package, 2200 pcsWTR, side view package, 2300 pcsD. Belobog: quantity per reel:TT1, top view package, 1800 pcsE. Belobog with shield: quantity per reel:TT1, top view package, 1500 pcsF. Minimold DF1P: quantity per reel:DF1P, 1100 pcsG. TVCastSMD TR1: quantity per reel:TR1, side view package, 2000 pcsORDER DESIGNATIONThe type designation of the device is extended by TT or TT1 for top view or TR for side view.Example:TSOP6238TR (reel packing)TSOP75238TR (reel packing)TSOP75338WTT (reel packing)TSOP57438TT1 (reel packing)TSOP57238HTT1 (reel packing)TSOP39438TR1 (reel packing)REEL DIMENSIONS FOR PANHEAD, HEIMDALL, AND TVCASTSMD TR in millimetersNote•The body structure of the reel can varyTAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters A. Panhead (TSOP36...TT, TSSP....TT, TSOP6...TT, TSOP16...TT, TSOP96...TT)TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters B. Heimdall (TSOP75...TT, TSOP77...TT, TSSP77...TT, TSOP15...TT, TSOP95...TT)TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimetersC.Heimdall without lens (TSOP75...WTT, TSOP77...WTT, TSSP77...WTT, TSOP15...WTT, TSOP95...WTT)TAPING VERSION TSOP..TT1 (TOP VIEW) DIMENSIONS in millimeters D.Belobog (TSOP37...TT1, TSOP57...TT1, TSOP17...TT1, TSOP97...TT1)TAPING VERSION TSOP..TT1 (TOP VIEW) DIMENSIONS in millimetersE.Belobog with shield (TSOP37...HTT1, TSOP57...HTT1, TSOP17...HTT1, TSOP97...HTT1)TAPING VERSION TSOP..DF1P (SIDE VIEW) DIMENSIONS in millimetersF. Minimold DF1P (TSOP33...DF1P, TSOP53...DF1P, TSOP13...DF1P, TSOP93...DF1P)(6.08)(1.5 min.)(12)(1.75)(11.5)(24)(2)(4)(1.55)(0.4)(5.25)BBAAB - BA - ATAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters G. TVCastSMD TR1 (TSOP59...TR1, TSOP39...TR1, TSOP19...TR1, TSOP99...TR1)TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters A. Panhead (TSOP36...TR, TSSP6...TR, TSOP6...TR, TSOP16...TR, TSOP96...TR)TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimetersB. Heimdall (TSSP7...., TSOP75...TR, TSOP77...TR, TSSP7....TR, TSOP15...TR, TSOP95...TR)TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimetersC. Heimdall without lens (TSOP75...WTR, TSOP77...WTR, TSSP...WTR, TSOP15...WTR, TSOP95...WTR)LEADER AND TRAILER DIMENSIONS in millimetersCOVER TAPE REEL STRENGTH According to DIN EN 60286-30.1 N to 1.3 N300 mm/min. ± 10 mm/min.165° to 180° peel angle LABELStandard bar code labels for finished goodsThe standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unitand contain Vishay Semiconductor GmbH specific data. VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)PLAIN WRITING ABBREVIATION LENGTHItem-description-18Item-number INO8Selection-code SEL3LOT-/serial-number BATCH10Data-code COD 3 (YWW)Plant-code PTC2Quantity QTY8Accepted by ACC-Packed by PCK-Mixed code indicator MIXED CODE-Origin xxxxxxx+Company logoLONG BAR CODE TOP TYPE LENGTHItem-number N8Plant-code N2Sequence-number X3Quantity N8Total length-21SHORT BAR CODE TOP TYPE LENGTHSelection-code X3Data-code N3Batch-number X10Filter-1Total length-17DRY PACKAGINGThe reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.RECOMMENDED METHOD OF STORAGEDry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available:•Storage temperature 10 °C to 30 °C •Storage humidity ≤ 60 % RH max.After more than 72 h under these conditions moisture content will be too high for reflow soldering.In case of moisture absorption, the devices will recover to the former condition by drying under the following condition:192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or96 h at 60 °C + 5 °C and < 5 % RH for all device containers or24 h at 125 °C + 5 °C not suitable for reel or tubes.An EIA JEDEC ® standard JSTD-020 level 4 label is included on all dry bags.EIA JEDEC standard JSTD-020 level 4 label is includedon all dry bagsESD PRECAUTIONProper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging.VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELSThe Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.OUTER PACKAGINGThe sealed reel is packed into a pizza box.16962Legal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICAT IONS AND DAT A ARE SUBJECT T O CHANGE WIT HOUT NOT ICE T O IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED。

SPWVishay Dale碳膜电阻，特殊用途高频负载(管状)特点∙高稳定性和优异的高频特性∙特别适用于高频应用，包括高功率，高精度射频测量∙碳膜构造∙符合RoHS指令 2002/95/EC应用用于无线电、电视和雷达发射器、电介质加热和类似rf发电设备上的输出测量的高频电表。

是非反应性无线电频率终端的理想选择。

可提供带内部水冷却的高功率特殊设计。

请联系工厂。

标准电规格全球型号历史型号额定功率(WATTAGE FREE AIR)P25 ℃W公差± %线性公差± %阻值范围Ω温度系数± ppm/℃SPW236SPW-2361202, 51050 Ω标准值. 特殊订单可提供.其他阻值200 (平均值) 250 (最大值)SPW227SPW-227552, 510 SPW210SPW-210402, 510 SPW214SPW-214102, 510 SPW212SPW-21222, 510冷却当采用强制空气冷却时瓦特数大致显示增加3倍，当采用液体冷却时(带热交换器)瓦特数显示大致为60倍。

就此电阻而言考虑的限制因素为薄膜温度。

此处不应超过+200 ℃，最大稳定温度不应超过+150℃。

机械规格身份识别型号指定阻值、公差和制造日期代码都印刷在每个器件上。

端子除SPW-212外全部型号都是电镀铜。

SPW-212 采用银涂层端子。

标识- Dale- 型号- 阻值- 公差- 日期代码如有技术问题，请联络：************************Document Number: 31082 2Revision: 19-Nov-10Document Number: 31082如有技术问题，请联络：************************Revision: 19-Nov-103SPW碳膜电阻，特殊用途高频负载(管状)Vishay Dale注释：•功率等级不允许安装硬件。

(1)仅列出代表性类型。

Vishay SiliconixSi7117DNP-Channel 150 V (D-S) MOSFETFEATURES•Halogen-free According to IEC 61249-2-21Definition•TrenchFET ® Power MOSFETs •PowerPAK ® Package- Low Thermal Resistance - Low 1.07 mm Profile•Compliant to RoHS Directive 2002/95/ECAPPLICATIONS•Active Clamp circiuts in DC/DC Power SuppliesNotes:a.Surface mounted on 1" x 1" FR4 board.b.t = 5 s.c.See solder profile (/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.d.Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.PRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (A)Q g (Typ.)- 1501.2 at V GS = - 10 V -2.177.7 nC1.3 at V GS = - 6 V- 2.1ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)Parameter Symbol Limit UnitDrain-Source Voltage V DS - 150VGate-Source VoltageV GS± 20Continuous Drain Current (T J = 150 °C)a, bT C = 25 °CI D- 2.17cA T C = 70 °C - 1.7T A = 25 °C - 1.1a, b T A = 70 °C- 0.9a, bPulsed Drain CurrentI DM - 2.2Continuous Source-Drain Diode Current a, b T C = 25 °C I S - 10.4T A = 25 °C - 2.6a, b Single Pulse Avalanche Current L ≤ 0.1 mH I AS 4.5Single Pulse Avalanche EnergyE AS1.01mJ Maximum Power Dissipationa, bT C = 25 °CP D12.5W T C = 70 °C 8T A = 25 °C 3.2a, b T A = 70 °C2a, bOperating Junction and Storage T emperature Range T J , T stg- 55 to 150°C Soldering Recommendations (Peak Temperature)c260Vishay SiliconixSi7117DNNotes:a. Surface mounted on 1" x 1" FR4 board.b. Maximum under steady state conditions is 81 °C/W.Notes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.b. Guaranteed by design, not subject to production testing.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.THERMAL RESISTANCE RATINGSParameter Symbol Typical Maximum UnitMaximum Junction-to-Ambient a, b t ≤ 10 s R thJA 3139°C/WMaximum Junction-to-Case (Drain)Steady StateR thJC810SPECIFICATIONS (T J = 25 °C, unless otherwise noted)Parameter Symbol Test Conditions Min.Typ.Max.UnitStaticDrain-Source Breakdown Voltage V DS V GS = 0 V , I D = - 250 µA- 150V V DS Temperature Coefficient ∆V DS /T J I D = - 250 µA 145mV/°C V GS(th) Temperature Coefficient ∆V GS(th)/T J 6.7Gate-Source Threshold Voltage V GS(th) V DS = V GS , I D = - 250 µA - 2.5- 4.5V Gate-Source LeakageI GSS V DS = 0 V, V GS = ± 20 V - 100ns Zero Gate Voltage Drain Current I DSS V DS = - 150 V , V GS = 0 V - 1µA V DS = - 150 V , V GS = 0 V , T J = 55 °C- 10On-State Drain Current aI D(on) V DS ≤ 15 V , V GS = - 10 V - 1.6A Drain-Source On-State Resistance a R DS(on) V GS = - 10 V , I D = - 0.5 A 1 1.2ΩV GS = - 6 V , I D = - 0.5 A 1.05 1.3Forward T ransconductance a g fsV DS = - 15 V , I D = - 0.5 A2.2SDynamic bInput Capacitance C iss V DS = - 25 V , V GS = 0 V , f = 1 MHz340510pFOutput CapacitanceC oss 30Reverse Transfer Capacitance C rss 16Total Gate Charge Q g V DS = - 75 V, V GS = - 10 V , ID = - 0.5 A 7.712nCGate-Source Charge Q gs 1.5Gate-Drain Charge Q gd 2.5Gate Resistance R g f = 1 MHz9ΩTurn-On Delay Time t d(on) V DD = - 75 V , R L = 7.5 Ω I D ≅ - 1 A, V GEN = - 10 V , R g = 6 Ω711ns Rise Timet r 1117Turn-Off Delay Time t d(off) 1625Fall Timet f1117Drain-Source Body Diode Characteristics Continuous Source-Drain Diode CurrentI S T C = 25 °C- 12APulse Diode Forward Current I SM - 12Body Diode VoltageV SD I S = - 1 A, V GS = 0 V- 0.7- 1.2V Body Diode Reverse Recovery Time t rr I F = - 0.5 A, dI/dt = 100 A/µs, T J = 25 °C4265ns Body Diode Reverse Recovery Charge Q rr 90135nC Reverse Recovery Fall Time t a 35ns Reverse Recovery Rise Timet b7Vishay SiliconixSi7117DN TYPICAL CHARACTERISTICS (25°C, unless otherwise noted)Output CharacteristicsTransfer CharacteristicsCapacitanceDocument Number: Document Number: 73478Source-Drain Diode Forward VoltageOn-Resistance vs. Gate-to-Source VoltageSingle Pulse Power, Junction-to-AmbientAVishay SiliconixSi7117DNTYPICAL CHARACTERISTICS (25°C, unless otherwise noted)* The power dissipation P D is based on T J(max) = 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.Max Current vs. Case TemperatureSi7117DNVishay SiliconixTYPICAL CHARACTERISTICS 25°C, unless otherwise notedNormalized Thermal Transient Impedance, Junction-to-CaseVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?73478.Revison: 06-Jun-161Document Number: 71656Vishay SiliconixAN822Document Number PowerPAK ® 1212 Mounting and Thermal ConsiderationsJohnson ZhaoMOSFETs for switching applications are now available with die on resistances around 1 m Ω and with the capability to handle 85 A. While these die capabilities represent a major advance over what was available just a few years ago, it is important for power MOSFET packaging technology to keep pace. It should be obvi-ous that degradation of a high performance die by the package is undesirable. PowerPAK is a new package technology that addresses these issues. The PowerPAK 1212-8 provides ultra-low thermal impedance in a small package that is ideal for space-constrained applications. In this application note, the PowerPAK 1212-8’s construction is described. Following this,mounting information is presented. Finally, thermal and electrical performance is discussed.THE PowerPAK PACKAGEThe PowerPAK 1212-8 package (Figure 1) is a deriva-tive of PowerPAK SO-8. It utilizes the same packaging technology, maximizing the die area. The bottom of the die attach pad is exposed to provide a direct, low resis-tance thermal path to the substrate the device is mounted on. The PowerPAK 1212-8 thus translates the benefits of the PowerPAK SO-8 into a smaller package, with the same level of thermal performance.(Please refer to application note “PowerPAK SO-8Mounting and Thermal Considerations.”)The PowerPAK 1212-8 has a footprint area compara-ble to TSOP-6. It is over 40 % smaller than standard TSSOP-8. Its die capacity is more than twice the size of the standard TSOP-6’s. It has thermal performance an order of magnitude better than the SO-8, and 20times better than TSSOP-8. Its thermal performance is better than all current SMT packages in the market. It will take the advantage of any PC board heat sink capability. Bringing the junction temperature down also increases the die efficiency by around 20 % compared with TSSOP-8. For applications where bigger pack-ages are typically required solely for thermal consider-ation, the PowerPAK 1212-8 is a good option.Both the single and dual PowerPAK 1212-8 utilize the same pin-outs as the single and dual PowerPAK SO-8.The low 1.05 mm PowerPAK height profile makes both versions an excellent choice for applications with space constraints.PowerPAK 1212 SINGLE MOUNTINGTo take the advantage of the single PowerPAK 1212-8’s thermal performance see Application Note 826,Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 single in the index of this document.In this figure, the drain land pattern is given to make full contact to the drain pad on the PowerPAK package.This land pattern can be extended to the left, right, and top of the drawn pattern. This extension will serve to increase the heat dissipation by decreasing the ther-mal resistance from the foot of the PowerPAK to the PC board and therefore to the ambient. Note that increasing the drain land area beyond a certain point will yield little decrease in foot-to-board and foot-to-ambient thermal resistance. Under specific conditions of board configuration, copper weight, and layer stack,experiments have found that adding copper beyond an area of about 0.3 to 0.5 in 2 of will yield little improve-ment in thermal performance.Figure 1.PowerPAK 1212 Devices Document Number 71681Vishay SiliconixAN822PowerPAK 1212 DUALTo take the advantage of the dual PowerPAK 1212-8’s thermal performance, the minimum recommended land pattern can be found in Application Note 826,Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs . Click on the PowerPAK 1212-8 dual in the index of this doc-ument.The gap between the two drain pads is 10 mils. This matches the spacing of the two drain pads on the Pow-erPAK 1212-8 dual package.This land pattern can be extended to the left, right, and top of the drawn pattern. This extension will serve to increase the heat dissipation by decreasing the ther-mal resistance from the foot of the PowerPAK to the PC board and therefore to the ambient. Note that increasing the drain land area beyond a certain point will yield little decrease in foot-to-board and foot-to-ambient thermal resistance. Under specific conditions of board configuration, copper weight, and layer stack,experiments have found that adding copper beyond an area of about 0.3 to 0.5 in 2 of will yield little improve-ment in thermal performance.REFLOW SOLDERINGVishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humid-ity, HAST, or pressure pot. The solder reflow tempera-ture profile used, and the temperatures and time duration, are shown in Figures 2 and 3. For the lead (Pb)-free solder profile, see /doc?73257.Ramp-Up Rate+ 6°C /Second Maximum Temperature at 155 ± 15 °C 120 Seconds Maximum Temperature Above 180 °C 70 - 180 Seconds Maximum T emperature240 + 5/- 0 °CTime at Maximum T emperature 20 - 40 Seconds Ramp-Down Rate+ 6 °C/Second MaximumFigure 2. Solder Reflow Temperature ProfileFigure 3.Solder Reflow Temperatures and Time DurationsVishay SiliconixAN822Document Number THERMAL PERFORMANCE IntroductionA basic measure of a device’s thermal performance is the junction-to-case thermal resistance, R θjc, or the junction to- foot thermal resistance, R θjf. This parameter is measured for the device mounted to an infinite heat sink and is therefore a characterization of the device only, in other words, independent of the properties of the object to which the device is mounted. Table 1 shows a comparison of the PowerPAK 1212-8, PowerPAK SO-8,standard TSSOP-8 and SO-8 equivalent steady state performance.By minimizing the junction-to-foot thermal resistance, the MOSFET die temperature is very close to the tempera-ture of the PC board. Consider four devices mounted on a PC board with a board temperature of 45 °C (Figure 4). Suppose each device is dissipating 2 W. Using the junc-tion-to-foot thermal resistance characteristics of the PowerPAK 1212-8 and the other SMT packages, die temperatures are determined to be 49.8 °C for the Pow-erPAK 1212-8, 85 °C for the standard SO-8, 149 °C for standard TSSOP-8, and 125 °C for TSOP-6. This is a 4.8 °C rise above the board temperature for the Power-PAK 1212-8, and over 40 °C for other SMT packages. A 4.8 °C rise has minimal effect on r DS(ON) whereas a rise of over 40 °C will cause an increase in r DS(ON) as high as 20 %.Spreading CopperDesigners add additional copper, spreading copper, to the drain pad to aid in conducting heat from a device. It is helpful to have some information about the thermal performance for a given area of spreading copper.Figure 5 and Figure 6 show the thermal resistance of a PowerPAK 1212-8 single and dual devices mounted on a 2-in. x 2-in., four-layer FR-4 PC boards. The two inter-nal layers and the backside layer are solid copper. The internal layers were chosen as solid copper to model the large power and ground planes common in many appli-cations. The top layer was cut back to a smaller area and at each step junction-to-ambient thermal resistance measurements were taken. The results indicate that an area above 0.2 to 0.3 square inches of spreading copper gives no additional thermal performance improvement.A subsequent experiment was run where the copper on the back-side was reduced, first to 50 % in stripes to mimic circuit traces, and then totally removed. No signif-icant effect was observed.TABLE 1: EQIVALENT STEADY STATE PERFORMANCEPackage SO-8TSSOP-8TSOP-8PPAK 1212PPAK SO-8ConfigurationSingleDual Single Dual Single Dual Single Dual Single Dual Thermal Resiatance R thJC (C/W)2040528340902.45.51.85.5Figure 4. Temperature of Devices on a PC Board 4Document Number 7168103-Mar-06Vishay SiliconixAN822CONCLUSIONSAs a derivative of the PowerPAK SO-8, the PowerPAK 1212-8 uses the same packaging technology and has been shown to have the same level of thermal perfor-mance while having a footprint that is more than 40 %smaller than the standard TSSOP-8.Recommended PowerPAK 1212-8 land patterns are provided to aid in PC board layout for designs using this new package.The PowerPAK 1212-8 combines small size with attrac-tive thermal characteristics. By minimizing the thermal rise above the board temperature, PowerPAK simplifies thermal design considerations, allows the device to run cooler, keeps r DS(ON) low, and permits the device to handle more current than a same- or larger-size MOS-FET die in the standard TSSOP-8 or SO-8 packages.Figure 5. Spreading Copper - Si7401DNFigure 6. Spreading Copper - Junction-to-Ambient PerformanceApplication Note 826Vishay SiliconixDocument Number: Revision: 21-Jan-087A P P L I C A T I O NN O T ERECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 SingleLegal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICAT IONS AND DAT A ARE SUBJECT T O CHANGE WIT HOUT NOT ICE T O IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-161Document Number: 91000。

Dimensions: [mm]11Scale - 35:115404094BA47015404094BA47015404094BA47015404094BA47015404094BA470T e m p e r a t u r eT pT L15404094BA470Cautions and Warnings:The following conditions apply to all goods within the product series of Optoelectronic Components of Würth Elektronik eiSos GmbH & Co. KG:General:•This optoelectronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Optoelectronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer.•The optoelectronic component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.•Unless Würth Elektroik has given its express consent, the customer is under no circumstances entitled to reverse engineer, disassemble or otherwise attempt to extract knowledge or design information from the optoelectronic componentProduct specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.•The soldering pad pattern shown above is a general recommendation for the easy assembly of optoelectronic component. If a high degree of precision is required for the selected application (i.e. high density assembly), the customer must ensure that the soldering pad pattern is optimized accordingly.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the optoelectronic component body, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.•Using a brush during the cleaning process may break the optoelectronic component body. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:• If the product is potted in the customer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the optoelectronic component body, pins or termination. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the optoelectronic component to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•For a moisture sensitive component, the storage condition in the original packaging is defined according to IPC/JEDEC-J-STD-033. It is also recommended to return the optoelectronic component to the original moisture proof bag and reseal the moisture proof bag again.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current, will void the warranty.•The product design may influence the automatic optical inspection.•Certain optoelectronic component surfaces consist of soft material. Pressure on the top surface has to be handled carefully to prevent negative influence to the function and reliability of the optoelectronic components.•ESD prevention methods need to be applied for manual handling and processing by machinery.•Resistors for protection are obligatory.•Luminaires in operation may harm human vision or skin on a photo-biological level. Therefore direct light impact shall be avoided.•In addition to optoelectronic components testing, products incorporating these devices have to comply with the safety precautions given in IEC 60825-1, IEC 62471 and IEC 62778•Please be aware that Products provided in bulk packaging may get bent and might lead to derivations from the mechanicalmanufacturing tolerances mentioned in our datasheet, which is not considered to be a material defect.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODZAn001.0012021-03-17DIN ISO 2768-1mDESCRIPTIONWL-SISW SMT Infrared SideviewLED Waterclear ORDER CODE15404094BA470SIZE/TYPE BUSINESS UNIT STATUS PAGETechnical specification:•The typical and/or calculated values and graphics of technical parameters can only reflect statistical figures. The actual parameters of each single product, may differ from the typical and/or calculated values or the typical characteristic line.•On each reel, only one bin is sorted and taped. The bin is defined on intensity, chromaticity coordinate or wavelength and forward voltage.•In order to ensure highest availability, the reel binning of standard deliveries can vary. A single bin cannot be ordered. Please contact us in advance, if you need a particular bin sorting before placing your order.•Test conditions are measured at the typical current with pulse duration < 30ms. •Optical properties are measured according the CIE 127:2007 standard.•Wavelength tolerance under measurement conditions ± 2nm.•Optical intensity tolerance under measurement conditions ±15%.•Forward voltage tolerance under measurement conditions ± 0.1V.•CCT tolerance of x and y coordinate of ± 0.01and CRI tolerance of ± 2 is allowed In the characteristics curves, all values given in dotted lines may show a higher deviation than the parameters mentioned above.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.The customer has the sole responsibility to ensure that he uses the latest version of this datasheet, which is available on Würth Elektronik’s homepage. Unless otherwise agreed in writing (i.e. customer specific specification), changes to the content of this datasheet may occurwithout notice, provided that the changes do not have a significant effect on the usability of the optoelectronic componentsWürth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg GermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCEPROJECTION METHODZAn001.0012021-03-17DIN ISO 2768-1mDESCRIPTIONWL-SISW SMT Infrared Sideview LED WaterclearORDER CODE15404094BA470SIZE/TYPEBUSINESS UNITSTATUSPAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODZAn001.0012021-03-17DIN ISO 2768-1mDESCRIPTIONWL-SISW SMT Infrared SideviewLED Waterclear ORDER CODE15404094BA470SIZE/TYPE BUSINESS UNIT STATUS PAGE。

Silicon PIN PhotodiodeDESCRIPTIONBPW34 is a PIN photodiode with high speed and high radiant sensitivity in miniature, flat, top view, clear plastic package. It is sensitive to visible and near infrared radiation.BPW34S is packed in tubes, specifications like BPW34.FEATURES•Package type: leaded •Package form: top view•Dimensions (L x W x H in mm): 5.4 x 4.3 x 3.2•Radiant sensitive area (in mm 2): 7.5 •High photo sensitivity •High radiant sensitivity•Suitable for visible and near infrared radiation •Fast response times•Angle of half sensitivity: ϕ = ± 65°•Compliant to RoH S Directive 2002/95/EC and in accordance to WEEE 2002/96/ECNote**Please see document “Vishay Material Category Policy”:/doc?99902APPLICATIONS•High speed photo detectorNote•Test condition see table “Basic Characteristics”Note•MOQ: minimum order quantity94 8583PRODUCT SUMMARYCOMPONENT I ra (μA)ϕ (deg)λ0.1 (nm)BPW3450± 65430 to 1100BPW34S50± 65430 to 1100ORDERING INFORMATIONORDERING CODE PACKAGINGREMARKSPACKAGE FORMBPW34Bulk MOQ: 3000 pcs, 3000 pcs/bulk Top view BPW34STubeMOQ: 1800 pcs, 45 pcs/tubeTop viewABSOLUTE MAXIMUM RATINGS (T amb = 25 °C, unless otherwise specified)PARAMETER TEST CONDITIONSYMBOLVALUE UNIT Reverse voltage V R 60V Power dissipation T amb ≤ 25 °C P V 215mW Junction temperature T j 100°C Operating temperature range T amb - 40 to + 100°C Storage temperature range T stg - 40 to + 100°C Soldering temperaturet ≤ 3 sT sd 260°C Thermal resistance junction/ambientConnected with Cu wire, 0.14 mm 2R thJA350K/WBASIC CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)Fig. 1 - Reverse Dark Current vs. Ambient Temperature Fig. 2 - Relative Reverse Light Current vs. Ambient TemperatureBASIC CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)PARAMETER TEST CONDITION SYMBOL MIN.TYP.MAX.UNIT Breakdown voltage I R = 100 μA, E = 0V (BR)60V Reverse dark current V R = 10 V, E = 0I ro 230nA Diode capacitance V R = 0 V, f = 1 MHz, E = 0C D 70pF V R = 3 V, f = 1 MHz, E = 0C D 2540pF Open circuit voltageE e = 1 mW/cm 2, λ = 950 nm V o 350mV Temperature coefficient of V o E e = 1 mW/cm 2, λ = 950 nmTK Vo - 2.6mV/K Short circuit currentE A = 1 klxI k 70μA E e = 1 mW/cm 2, λ = 950 nm I k 47μA Temperature coefficient of I k E e = 1 mW/cm 2, λ = 950 nmTK Ik 0.1%/K Reverse light current E A = 1 klx, V R = 5 V I ra 75μA E e = 1 mW/cm 2, λ = 950 nm,V R = 5 VI ra4050μA Angle of half sensitivity ϕ± 65deg Wavelength of peak sensitivity λp 900nm Range of spectral bandwidth λ0.1430 to 1100nm Noise equivalent power V R = 10 V, λ = 950 nm NEP4 x 10-14W/√Hz Rise time V R = 10 V, R L = 1 k Ω, λ = 820 nm t r 100ns Fall timeV R = 10 V, R L = 1 k Ω, λ = 820 nmt f100nsFig. 3 - Reverse Light Current vs. IrradianceFig. 4 - Reverse Light Current vs. Illuminance Fig. 5 - Reverse Light Current vs. Reverse VoltageFig. 6 - Diode Capacitance vs. Reverse VoltageFig. 7 - Relative Spectral Sensitivity vs. WavelengthFig. 8 - Relative Radiant Sensitivity vs. Angular DisplacementPACKAGE DIMENSIONS in millimetersTUBE PACKAGING DIMENSIONS in millimetersFig. 9 - Drawing Proportions not scaled 18800Stopper10.79.5214.5Q u antity per t ub e: 45 pcsQ u antity per b ox: 1800 pcsLegal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROV E RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.V ishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein.Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.© 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED。

R e fl e c ti v eS e ns o r sW i t hA n a l o gO u tp u tT r i p l e an dQ u ad C ha n ne lT r a n s mi s s iv e Se n so r sA m b i e nt L i gh t Se n so r sW i t hA n a l o ga n dD i gi t a lO u tp u tI n t e g r at e dP r ox i mi t y an db i en t Li g h tS e ns o r sW i t hu t pu tS e ns o r sW i t hA n al o gO u tp u tI n t eg r at e dM ul t i pl e Ba n dS e ns o r sS i ng l ea n dD u alC h an n el T ra n sm i ss i v eS e ns o r sH i gh Re s ol u t io n Se n so r sf o rU V Aa n dU V BM e as u r em e nt sU VS E NS O RST C XT13X0X01C O LO RS E NS O RST R AN S MI S S IV ES E NS O RSV C NL F AM I LYA M BI E NT L IG H TS E NS O RST C UT1630X01T C UT1800X01R E FL E CT I V ES E NS O RSNotes: (1) All optical sensors have phototransistor output except where noted (2) Relative collector current > 20 % (3) TCND5000 has a PIN photodiode outputNotes: (1) All optical sensors have phototransistor output (2) Dual channel (3) Triple channel (4) Quad channel (5) Products ending in “X01” are AEC-Q101 qualified(1)1206, SMD 5 mm, flat top5 mm 3 mmNotes: (1) E v = 100 lux, V CE = 5 V , CIE illuminant A, typical (2)Products ending in “X01” are AEC-Q101 qualifiedPackageNotes:(1)Products ending in “X01” are AEC-Q101 qualifiedNo matter what car you drive,optical sensors are close by.Think automotive, think Vishay! Vishay’s proximity, reflective,transmissive, and ambient lightsensors put the “smart” intosmart devices with best-in-class performanceUseful Links • Optical Sensors gateway/optical-sensors/• Transmissive Sensors infograph/doc?48352• Proximity Sensors infograph/doc?49820• Current Estimator calculator/optoelectronics/opto-sensors-calculator/• Vishay Automotive Grade Optoelectronics selector guide /doc?49071• Sensor starter kit/moreinfo/SensorXplorer/。

1.5KE160CA-E3/54 1.5KE47CA-E3/541.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303AVishay General SemiconductorT RANS Z ORB ® Transient Voltage SuppressorsDEVICES FOR BI-DIRECTION APPLICATIONSFor bi-directional types, use CA suffix (e.g. 1.5KE220CA) Electrical characteristics apply in both directions.FEATURES•Glass passivated chip junction•Available in uni-directional and bi-directional •1500 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %•Excellent clamping capability •Very fast response time•Low incremental surge resistance•AEC-Q101 qualified•Solder dip 275 °C max. 10 s, per JESD 22-B106•Material categorization: for definitions of compliance please see /doc?99912TYPICAL APPLICATIONSUse in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive, and telecommunication.MECHANICAL DATACase: molded epoxy body over passivated junction Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, commercial gradeBase P/NHE3_X - RoHS compliant, and AEC-Q101 qualified (“X” denotes revision code e.g. A, B, ...)Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix meets JESD 201 class 2 whisker testNote• 1.5KE250A to 1.5KE540A are commercial grade only•Bi-directional is available from 1.5KE6.8CA to 1.5KE220CA onlyPolarity: For uni-directional types the color band denotes cathode end, no marking on bi-directional typesNotes(1)Non-repetitive current pulse, per fig. 3 and derated above T A= 25 °C per fig. 2(2)Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum (3)V F = 3.5 V for 1.5KE220A and below; V F= 5.0 V for 1.5KE250A and above PRIMARY CHARACTERISTICSV BR uni-directional 6.8 V to 540 V V BR bi-directional 6.8 V to 220 V V WM uni-directional 5.8 V to 459 V V WM bi-directional5.8 V to 185 V P PPM 1500 W P D6.5 W I FSM (uni-directional only)200 A T J max.175 °CPolarity Uni-directional, bi-directionalPackage1.5KEMAXIMUM RATINGS (T A = 25 °C unless otherwise noted)PARAMETERSYMBOL VALUE UNIT Peak pulse power dissipation with a 10/1000 μs waveform (1) (fig. 1)P PPM 1500W Peak pulse current with a 10/1000 μs waveform (1) I PPM See next tableA Power dissipation on infinite heatsink at T L = 75 °C (fig. 5)P D 6.5W Peak forward surge current 8.3 ms single half sine-wave uni-directional only (2)I FSM 200A Maximum instantaneous forward voltage at 100 A for uni-directional only (3) V F 3.5/5.0V Operating junction and storage temperature rangeT J , T STG-55 to +175°C1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303AVishay General SemiconductorNotes(1) Pulse test: t p≤ 50 ms (2) S urge current waveform per fig. 3 and derate per fig. 2(3) All terms and symbols are consistent with ANSI/IEEE CA62.35(4) For bi-directional types with V R 10 V and less the I Dlimit is doubled (+) Underwriters laboratory recognition for the classification of protectors (QVGQ2) under the UL standard for safety 497B and file number E136766 for both uni-directional and bi-directional devicesELECTRICAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)JEDEC ® TYPE NUMBER GENERAL SEMICONDUCTOR PART NUMBER BREAKDOWN VOLTAGE V BR AT I T (1)(V) TEST CURRENT I T (mA)STAND-OFF VOLTAGE V WM (V)MAXIMUM REVERSE LEAKAGE AT V WM I D (4) (μA) MAXIMUM PEAKPULSECURRENT I PPM (2)(A)MAXIMUM CLAMPING VOLTAGE AT I PPM V C (V) MAXIMUM TEMPERATURE COEFFICIENTOF V BR (%/°C)MIN.MAX.1N6267A (+)1.5KE6.8A 6.457.1410 5.80100014310.50.0571N6268A (+)1.5KE7.5A 7.137.8810 6.4050013311.30.0611N6269A (+)1.5KE8.2A 7.798.61107.022*******.10.0651N6270A (+)1.5KE9.1A 8.659.55 1.07.785011213.40.0681N6271A (+)1.5KE10A 9.5010.5 1.08.551010314.50.0731N6272A (+)1.5KE11A 10.511.6 1.09.40 5.096.215.60.0751N6273A (+)1.5KE12A 11.412.6 1.010.2 5.089.816.70.0781N6274A (+)1.5KE13A 12.413.7 1.011.1 5.082.418.20.0811N6275A (+)1.5KE15A 14.315.8 1.012.8 1.070.821.20.0841N6276A (+)1.5KE16A 15.216.8 1.013.6 1.066.722.50.0861N6277A (+)1.5KE18A 17.118.9 1.015.3 1.059.525.20.0891N6278A (+)1.5KE20A 19.021.0 1.017.1 1.054.227.70.0901N6279A (+)1.5KE22A 20.923.1 1.018.8 1.049.030.60.0921N6280A (+)1.5KE24A 22.825.2 1.020.5 1.045.233.20.0941N6281A (+)1.5KE27A 25.728.4 1.023.1 1.040.037.50.0961N6282A (+)1.5KE30A 28.531.5 1.025.6 1.036.241.40.0971N6283A (+)1.5KE33A 31.434.7 1.028.2 1.032.845.70.0981N6284A (+)1.5KE36A 34.237.8 1.030.8 1.030.149.90.0991N6285A (+)1.5KE39A 37.141.0 1.033.3 1.027.853.90.1001N6286A (+)1.5KE43A 40.945.2 1.036.8 1.025.359.30.1011N6287A (+)1.5KE47A 44.749.4 1.040.2 1.023.164.80.1011N6288A (+)1.5KE51A 48.553.6 1.043.6 1.021.470.10.1021N6289A (+)1.5KE56A 53.258.8 1.047.8 1.019.577.00.1031N6290A (+)1.5KE62A 58.965.1 1.053.0 1.017.685.00.1041N6291A (+)1.5KE68A 64.671.4 1.058.1 1.016.392.00.1041N6292A (+)1.5KE75A 71.378.8 1.064.1 1.014.61040.1051N6293A (+)1.5KE82A 77.986.1 1.070.1 1.013.31130.1051N6294A (+)1.5KE91A 86.595.5 1.077.8 1.012.01250.1061N6295A (+)1.5KE100A 95.0105 1.085.5 1.010.91370.1061N6296A (+)1.5KE110A 105116 1.094.0 1.09.91520.1071N6297A (+)1.5KE120A 114126 1.0102 1.09.11650.1071N6298A (+)1.5KE130A 124137 1.0111 1.08.41790.1071N6299A (+)1.5KE150A 143158 1.0128 1.07.22070.1061N6300A (+)1.5KE160A 152168 1.0136 1.0 6.82190.1081N6301A (+)1.5KE170A 162179 1.0145 1.0 6.42340.1081N6302A (+)1.5KE180A 171189 1.0154 1.0 6.12460.1081N6303A (+)1.5KE200A 190210 1.0171 1.0 5.52740.108-(+)1.5KE220A 209231 1.0185 1.0 4.63280.108- 1.5KE250A 237263 1.0214 1.0 4.43440.110- 1.5KE300A 285315 1.0256 1.0 3.64140.110- 1.5KE350A 333368 1.0300 1.0 3.14820.110- 1.5KE400A 380420 1.0342 1.0 2.75480.110- 1.5KE440A 418462 1.0376 1.0 2.56020.110- 1.5KE480A 456504 1.0408 1.0 2.286580.110- 1.5KE510A 485535 1.0434 1.0 2.156980.110- 1.5KE540A 513567 1.0459 1.0 2.037400.1101.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A Vishay General Semiconductor Notes(1)AEC-Q101 qualified(2)Applied for 1.5KE6.8AHE3_A to 1.5KE220AHE3_A, and 1.5KE6.8CAHE3_A to 1.5KE220CAHE3_ARATINGS AND CHARACTERISTICS CURVES (T A = 25 °C unless otherwise noted)Fig. 1 - Peak Pulse Power Rating CurveFig. 2 - Pulse Power or Current vs. Initial Junction TemperatureFig. 3 - Pulse WaveformFig. 4 - Typical Junction CapacitanceTHERMAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)PARAMETER SYMBOL VALUE UNIT Typical thermal resistance, junction to ambient RθJA75°C/ W Typical thermal resistance, junction to lead RθJL15.4ORDERING INFORMATION (Example)PREFERRED PIN UNIT WEIGHT (g)PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE1.5KE6.8A-E3/540.96854140013" diameter paper tape and reel 1.5KE6.8AHE3_A/C (1)(2)0.968C140013" diameter paper tape and reel1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A Vishay General SemiconductorFig. 5 - Power Derating CurveFig. 6 - Maximum Non-Repetitive Forward Surge CurrentUni-Directional onlyFig. 7 - Incremental Clamping Voltage Curve (Uni-Directional)Fig. 8 - Incremental Clamping Voltage Curve (Uni-directional) Fig. 9 - Incremental Clamping Voltage Curve (Bi-directional) Fig. 10 - Incremental Clamping Voltage Curve (Bi-Directional)1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A Vishay General SemiconductorFig. 11 - Instantaneous Forward Voltage Characteristics Curve Fig. 12 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters)APPLICATION NOTES•This series of Silicon Transient Suppressors is used in applications where large voltage transients can permanently damage voltage-sensitive components.•The TVS diode can be used in applications where induced lightning on rural or remote transmission lines presents a hazard to electronic circuitry (ref: R.E.A. specification P.E. 60). •This Transient Voltage Suppressor diode has a pulse power rating of 1500 W for 1 ms. The response time of TVS diode clamping action is effectively instantaneous (1 x 10-9 s bi-directional); therefore, they can protect integrated circuits, MOS devices, hybrids, and other voltage sensitive semiconductors and components. TVS diodes can also be used in series or parallel to increase the peak power ratings.Legal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICAT IONS AND DAT A ARE SUBJECT T O CHANGE WIT HOUT NOT ICE T O IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED1.5KE160CA-E3/54 1.5KE47CA-E3/54。

ASVMP• Storage Area Networks(SATA, SAS, Fiber Channel)• Passive Optical Networks (EPON, 10G-EPON, GPON, 10G-PON)• Ethernet (1G, 10GBASE-T,/KR/LR/SR, FCoE • PCI Express • Display port• Low Power Consumption for high speed communication • Exceptional Stability Over Temp. at -40 to +85°C, ±15ppm• Extended Automotive Grade Temp. stability at -55 to +125°C, ±25ppm • Available in 50kG Shock Resistance Configuration upon request • MIL-STD-883 shock and vibration compliant • Durable QFN Plastic Compact Packaging • Standby or Disable Tri-state function• Low jitter (Period jitter RMS and Phase jitter RMS)• High power supply noise reduction, -50dBcLow Jitter High Performance Moisture Sensitivity Level – MSL 1Common Key Electrical Specifications – CMOS, LVPECL, LVDS, and HCSL* For 2.3000MHz < F0 < 9.9999MHz, 6-8 weeks lead-time applies Key Electrical Specifications – CMOSFrequency RangeCMOS 2.3000* 170.0000 MHzCMOS3.3000* 170.0000 LVPECL 2.3000* 460.0000 Commercial, Industrial temp. rangeLVDS 2.3000* 460.0000 Commercial, Industrial temp rangeHCSL2.3000*460.0000Commercial, Industrial temp. rangeOperating Temperature -20 +70 °C See optionsC ° 051+ 55-e r u t a r e p m e T e g a r o t S Overall Frequency Stability -50 +50 ppm See options Supply Voltage (Vdd) +2.25 +3.6 Vs m 5 e m i T p u t r a t S Enable Time 20 ns STD (Tri-state)5 ms PD option (Power Down)s n 5 e m i T e l b a s i D Disable Current20 22 mA STD (Tri-state)0.095 PD option (Power Down)Tri-state Function (Standby/Disable) "1" (VIH 0.75*Vdd) or Open: Oscillation "0" (VIL<0.25*Vdd) : Hi ZV 40k pull-up resister embeddedr a e y t s r i F m p p0.5+ 0.5-g n i g A Supply Current (I dd ) 31 35 mA CL=15pF, 125MHz Output Logic Level V OH 0.9*V ddV I=±6mA V OL 0.1*V dd V Rise Time Tr 1.1 2.0 ns CL=15pF 20% to 80%Fall Time Tf1.32.0 ns% 55 54e l c y C y t u D Integrated Phase Jitter (J PH ) 0.30 2 ps 200kHz ~ 20MHz@125MHz 0.38 2 100kHz ~ 20MHz@125MHz 1.70 2 12kHz ~ 20MHz@125MHzPeriod Jitter RMS (J PERs p0.3)PbRoHS/RoHS II compliant7.0 x 5.0 x 0.85mm-20 ~ +70°C -40 ~ +85°C -40 ~ +105°C -55 ~ +125°CKey Electrical Specifications – LVPECLKey Electrical Specifications – LVDS NotesSupply Current (I dd)56.5 58 mA RL=50 Output Logic Level V OH V dd-1.08 V RL=50V OL V dd-1.55 VPeak to Peak Output Swing (V pp) 800 mV Single endedRise Time Tr 250ps RL=50 , CL=0pFFall Time Tf 250l a i t n e r e f f i D%2584e l c y Cy t u DIntegrated Phase Jitter (J PH) 0.25 2ps200kHz ~ 20MHz@156.25MHz0.38 2 100kHz ~ 20MHz@156.25MHz1.70 2 12kHz ~ 20MHz@156.25MHzPeriod Jitter RMS (J PER s p5.2)Notes Supply Current (I dd)29 32 mA RL=100Output Offset Voltage (V OS) 1.125 1.4 V RL=100 differential Delta Offset Voltage (V OS) 50 mVPeak to Peak Output Swing (V pp) 350 mV Single endedRise Time Tr 200ps RL=50 , CL=2pFFall Time Tf 200l a i t n e r e f f i D%2584e l c y Cy t u DIntegrated Phase Jitter (J PH) 0.28 2ps200kHz ~ 20MHz@156.25MHz0.40 2 100kHz ~ 20MHz@156.25MHz1.70 2 12kHz ~ 20MHz@156.25MHzPeriod Jitter RMS (J PER s p5.2)Key Electrical Specifications – HCSLNotes Supply Current (I dd)40 42 mA RL=50Output Logic Level V OH0.725 V RL=50V OL0.1 V Peak to Peak Output Swing (V pp) 750 mV Single endedRise Time Tr 200 400ps RL=50 , CL=2pFFall Time Tf 200 400l a i t n e r e f f i D%2584e l c y Cy t u DIntegrated Phase Jitter (J PH) 0.25 2ps200kHz ~ 20MHz@156.25MHz0.37 2 100kHz ~ 20MHz@156.25MHz1.70 2 12kHz ~ 20MHz@156.25MHzPeriod Jitter RMS (J PER s p5.2)20% to 80% 20% to 80% 20% to 80%Absolute Maximum RatingsSupply Voltage -0.3 +4.0 VInput Voltage -0.3 V dd+0.3 VJunction Temp. +150 °CStorage Temp. -55 +150 °CSoldering Temp. +260 °C 40sec maxESDHBM MM CDM 4,0004001,500VCMOS OUTPUTTest Circuit(Unless specified otherwise: T=25° C, VDD=3.3 V) LVPECL outputTest CircuitASVMPTest CircuitLVDS OUTPUTHCSL OUTPUTASVMPPbRoHS/RoHS II compliantTest Circuit7.0 x 5.0 x 0.85mmASVMPASVMPFunction Tri-state NC GND Output NC (CMOS)Output (LVPECL, LVDS, HCSL)VddNote: Recommend using an approximately 0.01uF bypass capacitor between PIN 6and 3.Center pad: NC / GNDRecommended Land Pattern for CMOSRecommended Land Pattern for LVPECL, LVDS, HCSLPbRoHS/RoHS II compliant7.0 x 5.0 x 0.85mm6413ASVMPTube: 50pcs/tubeUnit orientation in tube:Dimensions: mmPbRoHS/RoHS II compliant7.0 x 5.0 x 0.85mm。

VLHW4100VLHW4100.VLHW4100, VLHW4101-YLWU Vishay SemiconductorsUltrabright White LED, Ø 3 mmDESCRIPTIONThe VLHW41 series is a clear, untinted 3 mm LED for high end applications where supreme luminous intensity is required.These lamps utilize the highly developed ultrabright InGaN technologies.The lens and the viewing angle is optimized to achieve best performance of light output and visibility.PRODUCT GROUP AND PACKAGE DATA •Product group: LED•Package:3mm•Product series: standard•Angle of half intensity: ± 22.5°FEATURES•Clear, untinted lens•Utilizing ultrabright InGaN technology•High luminous intensity•Luminous intensity and color categorized foreach packing unit•ESD-withstand voltage: Up to 2 kV accordingto JESD22-A114-B•Material categorization: For definitions of compliance please see /doc?99912 APPLICATIONS•Interior and exterior lighting•Outdoor LED panels•Instrumentation and front panel indicators•Replaces incandescent lamps•Light guide compatible19222 PARTS TABLEPART COLOR LUMINOUS INTENSITY(mcd)at I F(mA)COORDINATE(x, y)at I F(mA)FORWARD VOLTAGE(V)at I F(mA)TECHNOLOGY MIN.TYP.MAX.MIN.TYP.MAX.MIN.TYP.MAX.VLHW4100White4500715011 25020-0.33,0.33-20 2.8 3.2 3.820InGaN andconverterVLHW4101-YLWU White5600840011 25020-0.31,0.32-20 2.8 3.2 3.820InGaN andconverterABSOLUTE MAXIMUM RATINGS (T amb = 25 °C, unless otherwise specified)VLHW4100, VLHW4101-YLWUPARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R5V DC forward current I F25mA Peak forward current at 1 kHz, t p/T = 0.1I FSM0.1A Power dissipation P V95mW Junction temperature T j+ 120°C Operating temperature range T amb- 40 to + 85°C Storage temperature range T stg- 40 to + 85°C Soldering temperature t ≤ 5 s T sd260°C Thermal resistance junction/ambient R thJA400K/WVLHW4100, VLHW4101-YLWUVishay SemiconductorsNote•Chromaticity coordinate groups are tested at a current pulse direction of 25 ms and a tolerance of ± 0.01.Note•Luminous intensity is tested with an accuracy of ± 15 %.The above type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable.In a similar manner for colors where color groups are measured and binned, single color groups will be shipped on any one reel. In order to ensure availability, single color groups will not be orderable.OPTICAL AND ELECTRICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified) VLHW4100, VLHW4101-YLWU, WHITEPARAMETER TEST CONDITIONPART SYMBOLMIN.TYP.MAX.UNIT Luminous intensityI F = 20 mA VLHW4100I V 4500715011 250mcd VLHW4101-YLWUI V 5600840011 250mcdChromatically coordinate x acc. to CIE 1931I F = 20 mA VLHW4100x -0.33-VLHW4101-YLWUx -0.31-Chromatically coordinate y acc. to CIE 1931I F = 20 mA VLHW4100y -0.33-VLHW4101-YLWUy -0.32-Angle of half intensity I F = 20 mA ϕ-± 22.5-deg Forward voltage I F = 20 mA V F 2.8 3.2 3.8V Reverse currentV R = 5 V I R --50μA Temperature coefficient of V F I F = 20 mA TC VF -- 4-mV/K Temperature coefficient of I VI F = 20 mATC IV-- 0.5-%/K CHROMATICALLY COORDINATED CLASSIFICATIONX Y X Y YU0.2740.301WL0.3170.3250.2830.2840.3190.3100.3070.3160.3290.3190.3030.3330.3290.336YL0.2830.284VU 0.3290.3540.2900.2700.3290.3360.3100.2990.3450.3500.3070.3160.3470.368XU0.3030.333VL 0.3290.3360.3070.3160.3290.3190.3170.3250.3430.3310.3150.3430.3450.350XL0.3070.316UU 0.3470.3680.3100.2990.3450.3500.3190.3100.3610.3650.3170.3250.3640.383WU0.3150.343UL 0.3450.3500.3170.3250.3430.3310.3290.3360.3570.3430.3290.3540.3610.365LUMINOUS INTENSITY CLASSIFICATIONGROUP LIGHT INTENSITY (mcd)STANDARDMIN.MAX.Z145005600Z256007150AA 71509000AB900011 250VLHW4100, VLHW4101-YLWU Vishay SemiconductorsTYPICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)Fig. 1 - Forward Current vs. Ambient TemperatureFig. 2 - Relative Luminous Intensity vs. Angular Displacement Fig. 3 - Relative Intensity vs. WavelengthFig. 4 - Forward Current vs. Forward VoltageFig. 5 - Relative Luminous Intensity vs. Forward Current Fig. 6 - Coordinates of ColorgroupsVLHW4100, VLHW4101-YLWUVishay SemiconductorsPACKAGE DIMENSIONS in millimetersBAR CODE PRODUCT LABEL (example)A.Type of componentB.Manufacturing plantC.SEL - selection code (bin):e.g.:EA = code for luminous intensity group4C = code for chromaticity coordinate 1= code for forward voltage D.Date code year/week E.Day code (e.g. 1: Monday)F.Batch no.G.Total quantity pany codeVISHAYBCDEFGEA4C124Legal Disclaimer Notice VishayDisclaimerALL PRODU CT, PRODU CT SPECIFICATIONS AND DATA ARE SU BJECT TO CHANGE WITHOU T NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyVishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards.VLHW4100VLHW4100.。