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ETM28E-02Real Time Clock ModuleRX-8571LCuse the products for such prohibited purposes.• These products are intended for general use in electronic equipment. When using them in specific applications that require extremely high reliability such as applications stated below, it is required to obtain the permission from Epson Toyocom in advance./ Space equipment (artificial satellites, rockets, etc) / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc) / Medical instruments to sustain life / Submarine transmitters/ Power stations and related / Fire work equipment and security equipment / traffic control equipment / and others requiring equivalent reliability.• In this manual for Epson Tyocom, product code and marking will still remain as previouslyidentified prior to the merger.Due to the on going strategy of gradual unification of part numbers, please review product code and marking as they will change during the course of the coming months.We apologize for the inconvenience, but we will eventually have a unified part numbering system for Epson Toyocom which will be user friendly.RX − 8571LCContents1. Overview (1)2. Block Diagram (1)3. Terminal description (2)3.1. Terminal connections (2)3.2. Pin Functions (2)4. External Dimensions / Marking Layout (3)5. Absolute Maximum Ratings (4)6. Recommended Operating Conditions (4)7. Frequency Characteristics (4)8. Electrical Characteristics (5)8.1. DC characteristics (5)8.2. AC characteristics (6)9. Matters that demand special attention on use (7)9.1. About data when communication is stopped (7)9.2. Migrating to backup, and returning (7)9.3. Restrictions on Access Operations During Power-on Initialization and Recovery from Backup (8)10.1. Reference information (9)10.1. Reference Data (9)10.2. External connection example (9)11. Application notes (10)12. Overview of Functions and Description of Registers (11)12.1. Overview of Functions (11)12.2. Register table (12)12.3. Description of Functions (13)13.1. How to use (14)13.1. Description of Clock & Calendar function (14)13.2. Fixed-cycle Timer Interrupt Function (15)13.3. Alarm Interrupt Function (18)13.4. Time Update Interrupt Function (20)13.5. /IRQ "L" Interrupt Output When Interrupt Function Operates (21)13.6. Voltage detection function (VLF) (21)13.7. FOUT function [clock output function] (22)13.8. Flow-chart (23)13.9. Reading/Writing Data via the I2C Bus Interface (27)LOW BACKUP CURRENTI2C-BUS-INTERFACE REAL TIME CLOCK MODULERX − 8571LC• Built-in 32.768-kHz crystal resonator(with controlled frequency precision).• Interface type : I2C-BUS• Interface voltage range : 1.6V to5.5V• Voltage when during hold (timer hold) : 1.3V to5.5V• Low current consumption during backup : 220nA(Typ.)/3V• 32.768-kHz output function with output control : C-MOS output With Control Pin• User register : Built in 128 bit RAM• Real-time clock functionClock/calendar function, auto leap year correction function, alarm interrupt function, etc.1. OverviewThis is a real-time clock module of the I2C-BUS interface system that incorporates a 32.768 kHz crystal oscillator.The real-time clock function incorporates not only a calendar and clock counter for the year, month, day, day of the week, hour, minute, and second, but also a time alarm, interval timer, and time update interruption, among other features.All of these many functions are implemented in a thin, compact SOP package, which makes it suitable for various kinds of mobile telephones and other small electronic devices.2. Block Diagram3. Terminal descriptionNote : Be sure to connect a bypass capacitor rated at least 0.1 μF between V DD and GND.4. External Dimensions / Marking Layout5. Absolute Maximum RatingsGND=0V Item Symbol Condition Rating Unit Supply voltage V DD Between V DD and GND −0.3 to +6.5 V Input voltage VIN DAS, SCLK,SDA, /BM,(FOE pins GND−0.3 to +6.5 V Output voltage (1) VOUT1 FOUT pins GND−0.3 to V DD+0.3 V Output voltage (2) VOUT2 SDA, /IRQ pin GND−0.3 to +6.5 VStorage temperature T STG When stored separately,without packaging−55 to +125 °C6. Recommended Operating ConditionsGND=0V Item Symbol Condition Min. Typ. Max. Unit Operating supply voltage V DD− 1.6 3.0 5.5 V Clock supply voltage V CLK−V LOW 3.0 5.5 V Low voltage detection V LOW− 1.3 VApplied voltage when OFF V PUP DAS, SCLK,SDA, /BM,FOE, /IRQ pin5.5 VOperating temperature T OPR No condensation −40 +25 +85 °C7. Frequency CharacteristicsGND=0V Item Symbol Condition Rating Unit Output frequency fo 32.768 (Typ.) kHzFrequency/voltage characteristics Δ f/fTa=+25 °CV DD=3.0V5 ± 23(∗1)× 10−6Frequency/voltage characteristics f/VTa=+25 °CV DD=2.0V ∼ 5.0V−2 +2 × 10−6/VFrequency/temperature characteristics Top Ta= −20 °C to+70 °C,V DD=3.0V;+25 °C reference−120 +10 × 10−6 Ta=+25 °C,V DD=1.6V0.2 1.0 sOscillation start time t STATa= − 40 °C to+85 °CV DD=1.6V3.0 sAging fa Ta=+25 °C,V DD=3.0V;first year−5 +5× 10−6/year∗1 ) This difference is 1 minute by 1 month. ( excluding offset )8. Electrical Characteristics8.1. DC characteristics8.1.1. DC characteristics ( 1 )* Unless otherwise specified, GND = 0 V , V DD = 1.6 V to 5.5 V, Ta = −40 °C to +85 °CItemSymbol ConditionMin. Typ. Max. Unit Currentconsumption (1) I DD1 /BM=FOE=”L”, /IRQ = OFF f SCL =0Hz, Ta = +25 °C V DD = 3 V 220 400 nACurrentconsumption (2) I DD2 V DD = 5 V 240 450Currentconsumption (3) I DD3 /BM=FOE=”L” /IRQ = OFF f SCL = 0 HzTa = ±0 °C to +50 °C V DD = 3 V 220 420 nACurrentconsumption (4) I DD4 V DD = 5 V 600Currentconsumption (5) I DD5 /BM=FOE=”L” /IRQ = OFF f SCL = 0 HzTa = -40 °C to +85 °C V DD = 3 V 550 nACurrentconsumption (6) I DD6 V DD = 5 V 360 800Currentconsumption (7) I DD7 /BM=H, FOE=”L” /IRQ = OFF f SCL = 0 HzTa = -40 °C to +85 °C V DD = 3 V 340 700 nACurrentconsumption (8) I DD8 V DD = 5 V 1.6 3.3Currentconsumption (9) I DD9 /BM=FOE=”H”, /IRQ = OFF f SCL = 0 HzFOUT : 32.768 kHz ON, C L = 0 pFTa = -40 °C to +85 °CV DD = 3 V 1.0 2.1 μACurrentconsumption (10) I DD10 V DD = 5 V 4.0 7.0Currentconsumption (11) I DD11 /BM=FOE=”H”, /IRQ = OFF f SCL = 0 HzFOUT : 32.768 kHz ON, C L = 15 pFTa = -40 °C to +85 °C V DD = 3 V2.54.0μAV IH1 FOE, DAS, /BM pin 0.8 × V DD 6.5 V High-level input voltage V IH2SCL, SDA pin0.8 × V DD 6.5 V Low-level input voltage V IL Input pin GND − 0.30.2 × V DDVV OH1 V DD =5 V, I OH =−1 mA4.55.0 V OH2 V DD =3 V, I OH =−0.5 mA 2.7 3.0 High-level output voltageV OH3 FOUT pinV DD =3 V, I OH =−100 μA 2.9 3.0 V V OL1 V DD =5 V, I OL =1 mAGND GND+0.5V OL2V DD =3 V, I OL =0.5 mA GNDGND+0.3V OL3 FOUT pinV DD =3 V, I OL =100 μAGND GND+0.1VV OL4 V DD =5 V, I OL =1 mA GND GND+0.25V OL5/IRQ pinV DD =3 V, I OL =1 mA GNDGND+0.4V Low-leveloutput voltageV OL6 SDA pinV DD ≥2 V, I OL =3 mAGND GND+0.4V Inputleakage current I LK Input pin, V IN = V DD or GND −0.1 0.1 μA Outputleakage currentI OZInput pin, V OUT = V DD or GND−0.10.1μA8.2. AC characteristics*Unless otherwise specified, GND=0V,Ta= −40 °C to+85 °CStandard-Mode (f SCL=100kHz)Fast-Mode (f SCL=400kHz)Item SymbolMin. Max. Min. Max.Unit SCL clock frequency f SCL100 400 kHz Start condition setup time t SU;STA 4.7 0.6 μs Start condition hold time t HD;STA 4.0 0.6 μs Data setup time t SU;DAT250 100 ns Data hold time t HD;DAT0 0 ns Stop condition setup time t SU;STO 4.0 0.6 μsBus idle time betweenstart condition and stop conditiont BUF 4.7 1.3 μs Time when SCL = "L"t LOW 4.7 1.3 μs Time when SCL = "H" t HIGH 4.0 0.6 μs Rise time for SCL and SDA t r 1.0 0.3 μsFall time for SCL and SDA t f0.3 0.3 μscondition after access should be completed within 0.95 seconds.If such communication requires 0.95 seconds or longer, the I2C bus interface is reset by the internal bus timeout function.9. Matters that demand special attention on use9.1. About data when communication is stopped(1) If access is interrupted with timing in transmission of acknowledge signal and timing except in checking(following drawing (1), (2)), up to data that passed and confirmed just before acknowledge signal is available.(2) If access is interrupted with timing in transmission of acknowledge signal and in checking (following drawing (3),(4)), up to data that passed and confirmed last acknowledge signal is available.9.2. Migrating to backup, and returningRX −8571 LC9.3. Restrictions on Access Operations During Power-on Initialization and Recovery from Backup• RTC-register ( Reg - 00[h] ∼ 0F[h] ) operations are linked to the internal quartz oscillator's clock signal, so normal operation is not possible if there is no internal oscillation (= oscillation is stopped). Therefore, we recommend that the initial setting to be set during power-on initialization or backup and restore operations (i.e., when the power supply voltage is recovered after oscillation has stopped due to a voltage drop, etc.) should be "first start internal oscillation, then wait for the oscillation stabilization time (see tSTA standard) to elapse". • Note the following caution points concerning access operations during power-on initialization or when restoring the power supply voltage from backup mode (hereafter referred to as "switching to the operating voltage"). 1) Before switching to the operating voltage, read the VLF-bit (which indicates the RTC error status). 2) Initialization is required when the value read from the VLF-bit is "VLF = 1 (error status)". Before initializing in response to this VLF = "1" result, we recommend first waiting for the internal oscillation stabilization time (see the tSTA standard) to elapse. Initialization is required when the status after reading a VLF-bit value of "1" is either of the following. (Status 1) During power-on initialization (Status 2) When the clock setting is invalid, such as due to a voltage drop during backup ∗ Access timing during power-on initialization and when recovering the power supply voltage after a drop in the voltage used to maintain the clockVDDOscillation start voltage [v] Minimum voltage for clock maintenance VCLK ( Min. ) [ V ]During power-on initialization or power supply voltage recovery after drop in clock maintenance voltageInternal oscillation (illustration)tSTA [ s ] Oscillation start time (internal oscillation wait time)• Normal access is enabled • Normal operation is enabled30 [ ms ] Note: After 30 (ms) has elapsed, access is enabled. However, access guarantee range is address 07h and 10h ∼1Fh.3) When the read VLF-bit value is "VLF = 0 (normal status)", access is enabled without waiting for stabilization of oscillation. Normal operation is enabled under the following two statuses when "0" is read as the VLF-bit value. (Status 1) When correct operation is enabled (except for settings errors while in use) (Status 2) When data is retained normally while switching to the operating voltage from backup modePage - 8ETM28E-02RX −8571 LC 10.1. Reference information10.1. Reference Data(1) Example of frequency and temperature characteristics× 100-6[ Finding the frequency stability ] 1. Frequency and temperature characteristics can be approximated using the following equations. ΔfT = α ( θT − θX ) 2 ΔfT α [ 1 / °C2 ] θT [ °C ] θX [ °C ] : Frequency deviation in any temperature : Coefficient of secondary temperature ( −0.035 ± 0.005 ) × 10−6 / °C2 : Ultimate temperature ( +25 ± 5 °C ) : Any temperatureθT = +25 °C Typ. -6 Typ. α = -0.035 × 10Frequency ΔfT-50-100-150 -500501002. To determine overall clock accuracy, add the frequency precision and voltage characteristics. Δf/f = Δf/fo + ΔfT + ΔfV Δf/f Δf/fo ΔfT ΔfV : Clock accuracy (stable frequency) in any temperature and voltage. : Frequency precision : Frequency deviation in any temperature. : Frequency deviation in any voltage.Temperature [°C]3. How to find the date difference Date Difference = Δf/f × 86400(Sec) ∗ For example: Δf/f = 11.574 × 10 is an error of approximately 1 second/day.-610.2. External connection exampleVDDNote : It uses the secondary battery or a lithium battery. When using the seconding battery, the diode is not required. When using the lithium battery, the diode is required. For detailed value on the resistance, please consult a battery maker.D1: Schottky Barrier DiodeNoteSCLI C-BUS MasterVDD VDD /BM SCL SDA2RX-8571SLAVE ADRS = 1010001DAS GNDVDD SDA Pull up RegistorR=tr C BUSSCL SDA( I C Bus )2Page - 9ETM28E-02RX −8571 LC 11. Application notes1) Notes on handlingThis module uses a C-MOS IC to realize low power consumption. Carefully note the following cautions when handling.(1) Static electricity While this module has built-in circuitry designed to protect it against electrostatic discharge, the chip could still be damaged by a large discharge of static electricity. Containers used for packing and transport should be constructed of conductive materials. In addition, only soldering irons, measurement circuits, and other such devices which do not leak high voltage should be used with this module, which should also be grounded when such devices are being used. (2) Noise If a signal with excessive external noise is applied to the power supply or input pins, the device may malfunction or "latch up." In order to ensure stable operation, connect a filter capacitor (preferably ceramic) of greater that 0.1 μF as close as possible to the power supply pins (between VDD and GNDs). Also, avoid placing any device that generates high level of electronic noise near this module. * Do not connect signal lines to the shaded area in the figure shown in Fig. 1 and, if possible, embed this area in a GND land. (3) Voltage levels of input pins When the input pins are at the mid-level, this will cause increased current consumption and a reduced noise margin, and can impair the functioning of the device. Therefore, try as much as possible to apply the voltage level close to VDD or GND. (4) Handling of unused pins Since the input impedance of the input pins is extremely high, operating the device with these pins in the open circuit state can lead to unstable voltage level and malfunctions due to noise. Therefore, pull-up or pull-down resistors should be provided for all unused input pins.2) Notes on packaging(1) Soldering heat resistance. If the temperature within the package exceeds +260 °C, the characteristics of the crystal oscillator will be degraded and it may be damaged. The reflow conditions within our reflow profile is recommended. Therefore, always check the mounting temperature and time before mounting this device. Also, check again if the mounting conditions are later changed. * See Fig. 2 profile for our evaluation of Soldering heat resistance for reference. (2) Packaging equipment This product uses a molded package whose back contains glass. Therefore, it is possible for shocks during packaging to cause product breakage, depending on the packaging machinery and conditions. Please be sure to check that the load placed on products during packaging is as low as possible (low speeds during loading onto the substrate, low chuck forces, etc.) before using packaging equipment. Carry out the same checks when changing packaging conditions. The presence of foreign objects between this product and the packaging substrate may result in product breakage. Guard against introduction of foreign objects during packaging. Also, carry out measures to eliminate static electricity during packaging of and operations with this product. (3) Ultrasonic cleaning Depending on the usage conditions, there is a possibility that the crystal oscillator will be damaged by resonance during ultrasonic cleaning. Since the conditions under which ultrasonic cleaning is carried out (the type of cleaner, power level, time, state of the inside of the cleaning vessel, etc.) vary widely, this device is not warranted against damage during ultrasonic cleaning. (4) Mounting orientation This device can be damaged if it is mounted in the wrong orientation. Always confirm the orientation of the device before mounting. (5) Leakage between pins Leakage between pins may occur if the power is turned on while the device has condensation or dirt on it. Make sure the device is dry and clean before supplying power to it. (6) Stop using the glue Any glue must never use it after soldering RTC to a circuit board. This product has glass on the back side of a package. When glue invasions between circuit board side and glass side, then glass cracks by thermal expansion of glue. In this case a crystal oscillation stops. Consider glue abolition or glue do not touch to RTC.Fig. 1 : Example GND Pattern RX − 8571 LC( VSOJ − 12 pin )Fig. 2 : Reference profile for our evaluation of Soldering heat resistance.Temperature [ °C ] 300 250 200 TL ; +217 °C Ts max ; +200 °C Ts min ; +150 °C TP ; +260 °C +255 °CAvg. Ramp-up +3 °C / s Max.tp ; 20 s tL60 s to 150 s( +217 °C over )to 40 s −6 °C / s Max.∗ The shaded part ( ) indicates where a GND pattern should be set without getting too close to a signal line150 100 50ts60 s to 180 s( +150 °C to +200 °C )Time +25 °C to Peak 0 60 120 180 240 300 360 420 480 540 600 660 720 780 Time [ s ]Page - 10ETM28E-02RX −8571 LC 12. Overview of Functions and Description of Registers12.1. Overview of Functions1) Clock functionsThis function is used to set and read out month, day, hour, date, minute, second, and year (last two digits) data. Any (two-digit) year that is a multiple of 4 is treated as a leap year and calculated automatically as such until the year 2099. At the time of a communication start, the Clock & Calendar data are fixed (hold the carry operation), and it is automatically revised at the time of the communication end.2) Fixed-cycle Timer Interrupt functionThe fixed-cycle timer interrupt function generates an interrupt event periodically at any fixed cycle set between 244.14 μs and 65535 hours. When an interrupt event is generated, the /TIRQ pin goes to low level ("L") and "1" is set to the TF bit to report that an event has occurred..3) Long-Timer functionIt is able to use fixed cycle timer interrupt function as Long-Timer that deals with for approx. 7.5 years.∗ For details, see "13.2. Fixed-cycle Interrupt Function".4) Alarm interrupt functionThe alarm interrupt function generates interrupt events for alarm settings such as date, day, hour, and minute settings. When an interrupt event occurs, the AF bit value is set to "1" and the /IRQ pin goes to low level to indicate that an event has occurred.5) Time update interrupt functionThe time update interrupt function generates interrupt events at one-second or one-minute intervals, according to the timing of the internal clock. When an interrupt event occurs, the UF bit value becomes "1" and the /INT pin goes to low level to indicate that an event has occurred.6) Voltage detection function (VLF)This function indicates the retained status of clock operations or internal data.7) Clock output functionA clock with the same frequency (32.768 kHz) as the built-in crystal resonator can be output from the FOUT pin (CMOS output).8) User RAMRAM register is read/write accessible for any data. Up to max. 176 bits can be expanded.9) Block diagram( 32.768 kHz )OSCDIVIDER FOUT CONTROLLER INTERRUPTS CONTROLLERFOE FOUT / IRQCLOCK and CALENDARTIMER REGISTERALARM REGISTER BAK-UP MODE CONTROLLER CONTROL REGISTER and BUS INTERFACE CIRCUIT SYSTEM CONTROLLER/BMDAS SDA SCLUSER REGISTER 8 Byte ( 128 bit )Page - 11ETM28E-02RX −8571 LC12.2. Register table FunctionSEC MIN HOUR WEEK DAY MONTH YEAR 80 • AE AE AE 128 40 • 40 • 6 • 64 20 • 20 20 5 20 32 8192 6Address [h] 00 01 02 03 04 05 06bit 7bit 640 40bit 520 20 20 5 20bit 410 10 10 4 10 10 10 • 10 10 4 10 16 4096 TE TF TIEbit 38 8 8 3 8 8 8 • 8 8 3 8 8 2048bit 24 4 4 2 4 4 4 • 4 4 2 4 4 1024bit 12 2 2 1 2 2 2 • 2 2 1 2 2 512bit 01 1 1 0 1 1 1 • 1 1 0 1 1 256 ∗2 ∗3 ∗3 ∗2 ∗2 ∗2 ∗2 ∗2 ∗2note0708 09 0A 0B 0C 0D 0E 0F Address [h]RAMMIN Alarm HOUR Alarm WEEK Alarm DAY Alarm Timer Counter 0 Timer Counter 1 Extension Register Flag Register Control Register∗3, ∗432768 16384FSEL1 FSEL0 USELTEST1 TEST2WADA TSEL2 TSEL1 TSEL0 AF AIETEST3UF UIEVLF∗1, ∗2 ∗2TSTP STOP bit 2 bit 1 bit 0Functionbit 7bit 6bit 5bit 4bit 3note10 | 1FRAMUser Register 128 bit ( 16 word x 8 bit )∗3, ∗4, ∗5NoteDuring the initial power-on (from 0 V) and if the value of the VLF bit is "1" when the VLF bit is read, be sure to initialize all registers before using them. When doing this, be careful to avoid setting incorrect data as the date or time, as timed operations cannot be guaranteed if incorrect date or time data has been set. The TEST1, TEST2, TEST3 bits are Epson Toyocom test bits. ∗ Be sure to write "0" by initializing before using the clock module. Afterward, be sure to set "0" when writing. ∗ The four TEST* bits are undefined when read. Those bits should be masked after being read. The ' ' mark indicates a write-prohibited bit, which returns a "0" when read. The ' • ' mark indicates a read/write-accessible RAM bit for any data. As for Address 07[h] and User Register, R/W is enabled after 30ms after arrival the VDD voltage in a Operating voltage range at initial power-on (from 0 V). The User Register is read/write accessible for any data in the range from 00 h to FF h.∗1.∗2. ∗3. ∗4.∗5Page - 12ETM28E-02RX −8571 LC12.3. Description of Functions12.3.1. Clock & Calendar Register ( Reg - 00[h] ∼ 06[h] ) The clock and the calendar consists of seconds, minutes, hours, day of the week, day, month, and year.∗ For details, see "13.1. Clock functions".12.3.2. RAM Register ( Reg - 07[h] and Reg - 10[h] ∼ 1F[h] ) This RAM register is read/write accessible for any data in the range from 00 h to FF h. R/W is enabled after 30ms after arrival the VDD voltage in an Operating voltage range at initial power-on. 12.3.3. Alarm Register ( Reg - 08[h] ∼ 0A[h] ) The alarm interrupt function is used, along with the AE, AF, and WADA bits, to set alarms for specified date, day, hour, and minute values. When the settings in the alarm registers and the WADA bit match the current time, the /IRQ pin goes to low level and "1" is set to the AF bit to report that and alarm interrupt event has occurred. When this function is not used, this register is read/write accessible for any data by setting to AIE=”0”.∗ For details, see "13.2. Alarm Interrupt Function".12.3.4. Timer setting and Timer counter register ( Reg - 0B[h] ∼ 0C[h] ) To use the fixed-cycle timer interrupt function, the TE, TF, TIE, TSEL0, TSEL1 and TSEL2 bits are set and used. When this down counter's count value changes from 0001h to 0000h, when TF bit = "1", or when the /IRQ pin is at low level ("L"), it indicates that a fixed-cycle timer interrupt event has occurred. When this function is not used, This register is read/write accessible for any data by writing "0" to the TE and TIE bits.∗ For details, see "13.3. Fixed-cycle Timer Interrupt Function.12.3.5. Extension-related register ( Reg - 0D[h] ∼ 0F[h] ) Address [h] Function bit 7 bit 6 0D 0E 0F Extension Register Flag Register Control Register FSEL1TEST1bit 5 USEL UF UIEbit 4 TE TF TIEbit 3 WADA AF AIEbit 2 TSEL2TEST3bit 1 TSEL1 VLF STOPbit 0 TSEL0FSEL0TEST2TSTP1) FSEL1, FSEL0 bits ( Frequency Select ) A combination of the FSEL1 and FSEL0 bits is used to select the frequency to be output. The choice is possible by a combination of FSEL-bits and FOE-pin, select the frequency of clock output or inhibit the clock output. Setting example when a this function is not used. (The FOE terminal is connected to GND, FSEL0,1 = “0” ) ∗ For details, see "13.7. Fout Function. 2) USEL, UF, UIE bits ( Time update Interrupt ) These are bits to control an action of the Time update interrupt function. Setting example when a time this function is not used. (USEL , UIE = “0”, Ignore UF )∗ For details, see "13.4. Time update interrupt Function.3) TE, TF, TIE, TSEL2, TSEL1, TSEL0, TSTP bit ( Fixed-cycle timer interrupt ) These are bits to control an action of the Fixed-cycle timer interrupt function. Setting example when a time this function is not used. (TE,TIE,TSTP, TSEL1,TSEL0=“0”, TSEL2=”1”, Ignore TF)∗ For details, see "13.3. Fixed-cycle Timer Interrupt Function ".4) WADA, AF, AIE bit ( Alarm interrupt) These are bits to control an action of the Alarm interrupt function. Setting example when a time this function is not used. (WADA, AIE = “0”, Ignore AF )∗ For details, see "13.2. Alarm Interrupt Function".5) TEST bit Those bits are the manufacturer's test bit. Always leave this bit value as "0" except when testing. Be careful to avoid writing to this bit when writing "1" to other bits in this register. 6) VLF bit( Voltage Low Flag ) This flag bit indicates the retained status of clock operations or internal data. Its value changes from "0" to "1" when data loss occurs, such as due to a supply voltage drop. Once this flag bit's value is "1", its value is retained until a "0" is written to it.∗ For details, see "13.6. Voltage detection function".7) STOP bit This bit is used to stop functions related to the RTC's internal counter operations. Writing a "1" to this bit stops the counter operations. There is the following influence at the time of STOP bit “1”. ∗ 1) All the update of a clock and a calendar action stops. With it, an alarm interrupt and time update interrupt events does not occur. ∗ 2) One part of a fixed-cycle timer function stops. A count stops at the time of 64Hz, 1Hz, 1min, 1h source clock setting of a fixed-cycle timer. (A fixed-cycle timer can work only in 4096Hz.) ∗ 3) The effect of STOP bit to FOUT functions. When STOP = "1", 32768Hz and 1024Hz output is possible. But 1Hz output is disabled.Page - 13ETM28E-02RX −8571 LC 13.1. How to use13.1. Description of Clock & Calendar functionAt the time of a communication start, the Clock & Calendar data are fixed (hold the carry operation), and it is automatically revised at the time of the communication end. Therefore it recommends that the access to a clock calendar has continuous access by the auto increment function. Setting example: Sun, 29-Feb-88 17:39:45 (leap year) Function bit 7 bit 6 Address [h] 00 01 02 03 04 05 06 SEC MIN HOUR WEEK DAY MONTH YEAR 0 0 0 0 0 0 1 1 0 0 0 0 0 0 bit 5 0 1 0 0 1 0 0 bit 4 0 1 1 0 0 0 0 bit 3 0 1 0 0 1 0 1 bit 2 1 0 1 0 0 0 0 bit 1 0 0 1 0 0 1 0 bit 0 1 1 1 1 1 0 0∗ Note with caution that writing non-existent time data may interfere with normal operation of the clock counter. 13.1.1. Clock counter ( Reg - 00[h] ∼ 02[h] ) 1) [SEC] & [MIN] counter ( Reg - 00[h] ∼ 01[h] ) These registers are 60-base BCD counters. These registers are incremented at the timing when carry is generated from a lower register. At the timing when the lower register changes from 59 to 00, carry is generated to the higher register and thus incremented. When writing is performed to [SEC] register, Internal-count-down-chain less than one second ( 512Hz ∼ 1 Hz ) is cleared to 0. 2) Hour counter ( Reg - 02[h] ) This register is a 24-base BCD counter (24 hour format).These registers are incremented at the timing when carry is generated from a lower register. 13.1.2. . Week counter ( Reg - 03[h] ) The day (of the week) is indicated by 7 bits, bit 0 to bit 6. The day data values are counted as: Day 01h → Day 02h → Day 04h → Day 08h → Day 10h → Day 20h → Day 40h → Day 01h → Day 02h, etc. It is incremented when carry is generated from the HOUR register. This register does not generate carry to a higher register. Since this register is not connected with the YEAR, MONTH and DAY registers, it needs to be set again with the matching day of the week if any of the YEAR, MONTH or DAY registers have been changed. • The correspondence between days and count values is shown below. Day bit 7 bit 6 bit 5 bit 4 bit 3 bit 20 0 0 0 0 0 Sunday 0 0 0 0 0 0 Monday 0 0 0 0 0 Tuesday 1 0 0 0 0 0 Wednesday 1 0 0 0 0 0 Thursday 1 0 0 0 0 0 Friday 1 0 0 0 0 0 Saturday 1 ∗ Do not set "1" to more than one day at the same time.bit 1 0 10 0 0 0 0bit 0 10 0 0 0 0 0Data [h] 01 h 02 h 04 h 08 h 10 h 20 h 40 h13.1.3. Calendar counter ( Reg - 04[h] ∼ 06[h] ) 1) [ DAY ] & [MONTH] register ( Reg - 04 [h] ) The DAY register is a variable (between 28-base and 31-base) BCD counter that is influenced by the month and the leap year. The MONTH register is 12-base BCD counter. when carry is generated from a lower register.Jan. Days Normal year Leap year 31 Feb. 28 29 Mar 31 Apr. 30 May 31 June 30 July 31 Aug. 31 Sep. 30 Oct. 31 Nov. 30 Dec. 312) [ YEAR ] register ( Reg - 06 [h] ) This register is a BCD counter for years 00 to 99. The leap year is automatically determined, which reflects in the DAY register.Page - 14ETM28E-02。

小学教师读书活动方案小学教师读书活动方案1为提高广大教师的综合素质，促进教师专业成长，努力造就一支高素质的教师队伍，打造书香校园，特制定我校教师读书活动方案。

一、指导思想以提升教师的专业素养为重点，以营造浓郁校园书香文化氛围为目的，引导广大教师“多读书，读好书，好读书”，不断更新教育理念，真正以实际行动改进自身教学行为，进一步促进教师的专业化发展，全面推进学校素质教育。

二、活动目标1．营造读书氛围，让广大教师从优秀作品中汲取营养，开阔视野，丰富知识，全面提升教师素养，使教师成为“有思想的教育者”。

2．突出学习教育名著、原著，提高教育理论水平，更新教育观念，丰富教育智慧，促进教育创新，从而提高学校教育质量。

3．搭建教师交流平台，切实解决教育教学中的问题，实现教师专业水平提升。

4．通过实施读书工程，加强教师队伍的建设，努力建设一支充满生机和活力、与现代化教育相适应的教师队伍。

三、读书活动领导小组为保障教师读书活动的有序有效开展，学校特成立读书活动领导小组。

组长：副组长：成员：各校区主任，各教研组组长四、读书活动的对象全体教师。

五、活动时间9月——6月六、必读书目《教学勇气——漫步教师心灵》七、读书活动的方法和步骤1．制订读书计划每位老师和教研组结合实际，制订读书活动计划2．读书活动方式在全面推进全校读书活动中，积极引导以教研组为单位的组内读书活动，以读书为抓手促进教研、科研活动的开展，推进课堂教学方式的改进，有效提高教育质量。

采用教研组每周教研活动日安排一定时间集中学习和课余教师自学相结合，采用寒暑假学校统一规定和教师自主选择相结合，学校定期安排教师进行交流学习心得。

3．交流研讨反思以教研组为单位组织学习小组，开展研讨，定地点、定时间、定主题，互相启发，共同提高，要从研讨教育名著过程中获得的理论、思想、观点与自己的认识和做法相对照，反思提高。

（活动中各教研组必须开展读书沙龙活动一次。

认真做好活动记录，相关资料及时上传至校园网。

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链建设孙健敏：人力资源管理吴连支：开门八极拳杨杰：成长型企业留住和使用人才的策略南怀谨：如何静坐薪酬管理以业绩为导向的人力资源管理优秀员工的选育用留方法赵理明：掌纹诊病员工监控技巧分解员工离职原因及解决方案张锡明：企业如何有效激励员工职业生涯规划与自我管理周昌湘：部门经理人人力资源管理技能训练专业秘书训练教程欧洲商学院：生产管理全面质量管理TQM如何打造企业极速供应链如何发现与解决生产问题生产计划六步法尚丰：金牌营销团队建设与掌控生产主管职业化训练教程中国式执行：海尔高绩效的OEC管理方法杨朝辉：E-LEARNING团队实践如何打造坚实的基层团队周云：削减工厂成本的五个方法吴娟瑜：如何提高员工EQ与团队EQ章哲：让下属100%执行的领导艺术组织管理与变革：提升组织执行能力付遥：大客户销售策略如何成为卓越的销售经理孙晓歧：专业销售—顾问式销售孙晓歧：专业销售—专业销售易子：最成功的推销技巧赊销与风险控制世界第一营销大师亚伯拉罕课程说明会。

让精读『精』起来
金彦
【期刊名称】《黑龙江教育（小学教学案例与研究）》
【年(卷),期】2009(000)004
【摘要】@@ [案例]rn近日,笔者听了我校一位教师上<水>一课.在教学过程中,教者围绕教学重点,抓住重点句子引导学生精读,和文本深入对话.这引起了笔者对精读的深思.
【总页数】1页(P36)
【作者】金彦
【作者单位】江苏省通州市纱场小学
【正文语种】中文
【相关文献】
1.精读课应如何"精"读——浅谈精读课上的教与学 [J], 雷蕾
2.让精读课真正“精”起来 [J], 蒋丽萍
3.让中国企业精益起来——访精益企业中国总裁赵克强博士 [J], 朱敏慧;朱海霞
4.精读教师应该有多"精"——英语专业基础阶段精读教师素质探讨 [J], 龙友元;万丽
5.让精读课堂“活”起来——三本院校英语专业精读课堂话轮沉默现象分析 [J], 宋晓焕;王晓静
因版权原因，仅展示原文概要，查看原文内容请购买。

兼顾,就在平衡和细化之中
朱小平
【期刊名称】《小学教学》
【年(卷),期】2006(000)020
【摘要】@@ 一、要平衡认识rn新课程标准中明确提出情感与态度的培养目标.可以说,学生情感与态度的培养是基于"双基"达成的过程来展开和实现的,而不是游离于"双基",否则,只会冲淡甚至覆盖了"数学味".
【总页数】1页(P52)
【作者】朱小平
【作者单位】江苏江都市吴桥中心小学
【正文语种】中文
【相关文献】
1.兼顾,就在平衡和细化之中 [J], 朱小平;
2.迷茫与逆境的转折就在我们的坚持之中——2014年中国铸造再生铝合金产业链发展论坛暨第十一届冶炼加工技术升级研修班在重庆落下帷幕 [J], 佘英英
3.有一种美,就在你的发现之中 [J], 季伟譞
4.有一种美,就在你的发现之中 [J], 季伟譞;哈皮黑儿(图)
5.邹贤莲:教育就在千千万万的小事之中 [J], 陈大庆;邹贤莲
因版权原因，仅展示原文概要，查看原文内容请购买。