PCBA检验规范
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PCBA检验规范 编 号: 版 本: 生效日期: 1.修订情况表 修订历史 版本 说明 作者 审核 批准 生效日期
2.术语表 术语表 名称 说明 目 录 1
5. 职责(RESPONSIBILITY)…………………………………………………………………… ….……………1 6. 作业流程及内容(Flow chart and content)……………………………………………………………..….1 7. 修订权限(AUTHORITY OF MODIFICATION)………………………………………………………………2 8. 附件(ATTACHMENT)………………………………………………………………………………………….2 附件一(PCBA)……………………………………………………………………………………...4 附件二(机构类)…………………………………………………………………………………….42 附件三(其它)……………………………………………………………………………………….52
PCBA检验规范
1 目的(Purpose) 建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的workmanship,防止不良之发生. To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.
2 范围(Scope)
本规范适用于所有产品(含半成品及成品PCBA)的外观目视检验, 包含自行生产制造之PCBA, 委托外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA等. It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.
3 名词解释(Words explanation)
无(None) 4 参考文件(Reference document) ANS/IPC-A-610D 5 职责(Responsibility)
5.1 生产单位(Production unit): 5.2 负责产品检验之执行.
5.3 Be responsible for doing product inspection
5.4 质量管理部(Quality unit): 5.5 负责产品规格之制定及产品品质之抽样检验管制
5.6 Be responsible for making product specification and controlling the spot check of
product quality 6 作业流程及内容(Flow chart and content ) 检验前的准备(preparation for inspecting): 检验前须先确认所使用的工具,材料,胶,清洁剂等,是否合乎规定. 检验PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限. Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but the
finished good with。
若有检验标准未规范的异常现象发生时,不代表该产品允收或拒收,应向值班工程师询问。 It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm.
检验环境要求光线充足,以目视为主,辅以放大镜和卡尺
外观检验项目基准参见附件一~三。
The item of cosmetic inspection standard reference Appendix 1 to 3.
7 修订权限(Authority of modification)
本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同. This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as the same above.
8 附件Attachment ( 含记录表单)
附件一:PCBA Appendix 1: PCBA 附件二:机构类 Appendix 2: Mechanical 附件三:其它 Appendix 3: Other 附 件 预 览 总 表
附件一: PCBA类 附件二: 机构类(Mechanical) 附件三: 其它(Other) 1 SMT零件(SMT component) 1-1 焊点规格(Soldering SPEC) 1-2 焊点异常(Soldering abnormal) 1-3 零件损坏(Component damage) 1-4 点胶(Staking adhesive gluing) 1 外壳(Housing) 1 标签(Label) 2 托架,承座(Chassis) 2 Barcode 3 铭板(Overlay) 3 包装袋(PE bag) 4 散热片(Heat sink) 4 外箱(Carton) 5 绝缘片(Insulator) 5 Housing 6 螺丝,螺帽,垫片(Screw nut) 7 DC series converter 系列成品外观检验标准 2 Dip 零件(DIP component) 2-1 焊点规格(DIP SPEC) 2-2 引脚突出(Lead protrusion) 2-3 通孔(PTH) 2-4 插件外观(Appearance) 2-5 点胶(Adhesive gluing) 2-6 DIP高翘(DIP component lifted)
8 Transformer 9 Shielding cover 外观检验标准
3 PCB 3-1 marking 3-2 外观(Surface appearance) 3-3 焊锡性(Solderability) 4 Connector, PIN & 金手 指(Golden finger) 5 其它(Other) 5-1 螺丝(Screw) 5-2 跳线(Jump) 附件一: PCBA类 1 SMT零件(SMT component) 1-1 焊点规格(Soldering SPEC) 1-1-1 Chip 零件(Chip component) Defect Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less 零件偏移D>50% W 或D>50% P 拒收
Defect Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less 零件偏移D>50% W 或D>50% P 拒收
Defect Any end overhang (B) 零件超出pad 拒收
Defect Component in reserved to lacquer to go to circuit to form a short circuit 零件在有保护漆之线路上造成短路拒收
Acceptable End joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less 零件焊点宽度C>50%W or C>50% P 允收 Acceptable Maximum fillet height (E) may overhang the lend or extend onto the of the end cap metallization, but not extend further onto the component body 锡高超过金属端,但未延伸至零件本体允收
Defect Solder fillet extends onto the component body 锡延伸到零件本体上拒收
Defect Minimum fillet high (F) is less than 25% termination high (H), or fillet high (F) is less than 0.5mm High voltage capacitance minimum fillet high (F) is less than 50% termination high (H), or fillet high (F) is less than 0.75mm 爬锡高度 F<25% H 或 F<0.5mm 拒收 高压电容爬锡高度 F<50% H 或 F<0.75mm 拒收
Defect Insufficient solder 锡不足拒收
Defect Insufficient end overlap 空焊拒收
1-1-2 圆柱体零件(Cylindrical End Cap Termination)