74LS373[1]
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74hc373跟74ls373区别
LS即(Low Speed),HC即(Highspeed CMOS)从名字上很容易理解,前者是低速芯片,后都是高速CMOS芯片,后者可以在更高的频率下工作,两者在功能上是一样的。
HC373是5V的,LS373可以做到3V和5V兼容,平时用时就那么点区别,也就是说你的单片机如果使用3.3V,那就用LS的,当然稍微贵一点点了。
LS与HC的区别
1、LS是低功耗肖特基,HC是高速COMS。
LS的速度比HC略快。
HCT输入输出与LS兼容,但是功耗低;F 是高速肖特基电路;
2、LS是TTL电平,HC是COMS电平
3、LS输入开路为高电平,HC输入不允许开路,hc 一般都要求有上下拉电阻来确定输入端无效时的电平。
LS 却没有这个要求
4、LS输出下拉强上拉弱,HC上拉下拉相同。
5、工作电压不同,LS只能用5V,而HC一般为2V 到6V;
6、电平不同。
LS是TTL电平,其低电平和高电平分别为0.8和V2.4,而CMOS在工作电压为5V时分别为0.3V
和3.6V,所以CMOS可以驱动TTL,但反过来是不行的
7、驱动能力不同,LS一般高电平的驱动能力为5mA,低电平为20mA;而CMOS的高低电平均为5mA;
8、CMOS器件抗静电能力差,易发生栓锁问题,所以CMOS的输入脚不能直接接电源。
74ls373引脚图管脚功能表74ls373是常用的地址锁存器芯片,它实质是一个是带三态缓冲输出的8D触发器,在单片机系统中为了扩展外部存储器,通常需要一块74ls373芯片,(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时,输出端8 位信息被锁存,直到LE 端再次有效。
当三态门使能信号OE为低电平时,三态门导通,允许Q0~Q7输出,OE为高电平时,输出悬空。
当74LS373用作地址锁存器时,应使OE为低电平,此时锁存使能端C为高电平时,输出Q0~Q7 状态与输入端D1~D7状态相同;当C发生负的跳变时,输入端D0~D7 数据锁入Q0~Q7。
51单片机的ALE信号可以直接与74LS373的C连接。
74ls373与单片机接口:1D~8D为8个输入端。
1Q~8Q为8个输出端。
G是数据锁存控制端;当G=1时,锁存器输出端同输入端;当G由“1”变为“0”时,数据输入锁存器中。
OE为输出允许端;当OE=“0”时,三态门打开;当OE=“1”时,三态门关闭,输出呈高阻状态。
在MCS-51单片机系统中,常采用74LS373作为地址锁存器使用,其连接方法如上图所示。
其中输入端1D~8D接至单片机的P0口,输出端提供的是低8位地址,G端接至单片机的地址锁存允许信号ALE。
输出允许端OE接地,表示输出三态门一直打开。
74LS373在抢答器中的应用
孙小军
【期刊名称】《电子与自动化》
【年(卷),期】1994(023)003
【摘要】74LS373在抢答器中的应用孙小军(南京林业大学,210037)74LS373是透明的带有三态门八D销存器,其原理结构如图1所示,当三态门的使能信号线CE为低电平时,三态门处于导通状态,允许Q端输出;CE为高电平时,输出三态间断开,输出哪忏浦路是高...
【总页数】1页(P37)
【作者】孙小军
【作者单位】无
【正文语种】中文
【中图分类】TN873
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74ls373是常用的地址锁存器芯片,它实质是一个是带三态缓冲输出的8D触发器,在单片机系统中为了扩展外部存储器,通常需要一块74ls373芯片.本文将介绍74ls373的工作原理,引脚图(管脚图),内结构图、主要参数及在单片机系统中的典型应用电路.74ls373工作原理简述:(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时,输出端8 位信息被锁存,直到LE 端再次有效。
当三态门使能信号OE为低电平时,三态门导通,允许Q0~Q7输出,OE为高电平时,输出悬空。
74ls373内部逻辑结构图74LS373的真值表(功能表),表中:L——低电平;H——高电平;X——不定态;Q0——建立稳态前Q的电平;G——输入端,与8031ALE连高电平:畅通无阻低电平:关门锁存。
图中OE——使能端,接地。
当G=“1”时,74LS373输出端1Q—8Q与输入端1D—8D相同;当G为下降沿时,将输入数据锁存。
74ls373引脚(管脚)排列图:74ls373电气特性74ls373推荐工作条件74ls373在单片机系统中的应用电路图:当74LS373用作地址锁存器时,应使OE为低电平,此时锁存使能端C为高电平时,输出Q0~Q7 状态与输入端D1~D7状态相同;当C发生负的跳变时,输入端D0~D7 数据锁入Q0~Q7。
51单片机的ALE信号可以直接与74LS373的C连接。
74HC373锁存器作用什么是74HC373锁存器?74HC373是一种集成电路芯片,属于高速CMOS逻辑系列,由意法半导体公司生产。
它是一种8位锁存器,可用于在数字电路中存储8位数据。
锁存器是数电中常见的一个功能模块,用于存储和保持信号。
74HC373锁存器的作用74HC373锁存器在数字电路中起到重要的作用,以下是几个典型的应用场景:1. 数据缓存在某些情况下,需要将某个电平的信号保持一段时间,并在需要时输出。
74HC373锁存器可以用作数据缓存,将输入信号锁存,并在需要时输出。
这在通信系统、计算机存储和控制电路中经常使用。
通过将数据输入到锁存器中,可以防止数据丢失,确保在更合适的时机进行处理。
2. 数据传输74HC373锁存器通常被用作数据传输的工具。
当需要将数据从一个电路传输到另一个电路时,可以使用锁存器来暂存待传输的数据。
通过将数据输入到锁存器中,并在需要传输时将数据输出,可以确保数据传输的可靠性和稳定性。
3. 地址寄存器在微处理器系统中,锁存器经常被用作地址寄存器。
地址寄存器用于存储指令的地址,以便微处理器能够从存储器中读取指令。
通过使用74HC373锁存器作为地址寄存器,可以实现高效的地址存储和解码。
4. 控制信号在数字电路中,锁存器也可以用于存储和控制信号的生成。
通过将控制信号输入到锁存器中,并根据需要输出,可以实现复杂的控制逻辑。
锁存器可以存储不同的控制状态,并在需要时将相应的控制信号输出到其他电路中,从而实现对数字系统的控制。
5. 边沿检测锁存器还可以用于边沿检测。
在数字信号处理中,有时需要检测信号的上升沿或下降沿。
通过将信号输入到锁存器中,并与之前的状态进行比较,可以检测到信号的边沿。
这对于时序控制和触发器电路非常有用。
总结74HC373锁存器是一种常见的集成电路芯片,用于存储和保持信号。
它的作用多种多样,可以用于数据缓存、数据传输、地址寄存器、控制信号和边沿检测等场景。
锁存器在数字电路中起到重要的作用,对于数字系统的设计和控制至关重要。
74ls377和74LS373的区别74ls377和74LS373的区别 1、输出:373输出是三态输出(OE控制),377输出只有两态,要么0要么1。
这个。
这个区别结果就是373可以应用于某些多个驱动源共同控制的场合(比如数据总线)。
而377不行。
2、输入:373的输入是用LE(高有效)控制的,。
377的输入除了受LE控制(低有效)外,还受到CP(上升沿)控制。
373适合用电平锁存数据,而377适合应用于时钟锁存数据。
373更适合于异步应用,377适合于同步应用。
74ls377和74LS373都是八D触发器,其实本没有什么区别,但是373是三态门的。
当不片选它他的数据输出口是高阻状态,而377是只保持原先的状态不变/74LS377是一种8D触发器,它可以实现数据的保持或锁存,当它片选信号E为低电平且时钟CLK端输入正跳变时,D0~D7端的数据北锁存到8D触发器中。
其引脚说明如下:D0~D7:锁存器8位数据输入线Q0~Q7:锁存器8位数据输出线GND:接地引脚Vcc:电源引脚,+5V有效E :片选信号引脚CLK:锁存控制信号输入引脚。
74LS373是带有三态门的八D锁存器,当使能信号线OE为低电平时,三态门处于导通状态,允许1Q-8Q输出到OUT1-OUT8,当OE端为高电平时,输出三态门断开,输出线OUT1-OUT8处于浮空状态。
G称为数据打入线,当74LS373用作地址锁存器时,首先应使三态门的使能信号OE为低电平,这时,当G端输入端为高电平时,锁存器输出(1Q-8Q)状态和输入端(1D-8D)状态相同;当G端从高电平返回到低电平(下降沿)时,输入端(1D-8D)的数据锁入1Q-8Q的八位锁存器中。
当用74LS373作为地址锁存器时,它们的G端可直接与单片机的锁存控制信号端ALE相连,在ALE下降沿进行地址锁存。
引脚说明如下:D0~D7:锁存器8位数据输入线Q0~Q7:锁存器8位数据输出线 GND:接地引脚Vcc:电源引脚,+5V有效OE :片选信号引脚 G:锁存控制信号输入引脚。
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801102VRA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type 5962-7801102VSA ACTIVE CFP W201TBD A42N/A for Pkg Type 78011022A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 7801102RA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type 7801102SA ACTIVE CFP W201TBD A42N/A for Pkg Type JM38510/32502B2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type JM38510/32502BRA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type JM38510/32502BSA ACTIVE CFP W201TBD A42N/A for Pkg Type JM38510/32502SRA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type JM38510/32502SSA ACTIVE CFP W201TBD A42N/A for Pkg Type JM38510/32503B2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type JM38510/32503BRA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type JM38510/32503BSA ACTIVE CFP W201TBD A42N/A for Pkg Type SN54LS373J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SN54LS374J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SN54S373J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SN54S374J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SN74LS373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74LS373N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS373NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74LS373NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374J OBSOLETE CDIP J20TBD Call TI Call TISN74LS374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74LS374N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74LS374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373J OBSOLETE CDIP J20TBD Call TI Call TISN74S373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74S373N3OBSOLETE PDIP N20TBD Call TI Call TISN74S373NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74S374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374J OBSOLETE CDIP J20TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74S374N3OBSOLETE PDIP N20TBD Call TI Call TISN74S374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74S374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS373FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54LS373J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54LS373W ACTIVE CFP W201TBD A42N/A for Pkg Type SNJ54LS374FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54LS374J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54LS374W ACTIVE CFP W201TBD A42N/A for Pkg Type SNJ54S373FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54S373J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54S374FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54S374J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54S374W ACTIVE CFP W201TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN74LS373DWR DW20MLA3302410.813.0 2.71224Q1 SN74LS373NSR NS20MLA330248.213.0 2.51224Q1 SN74LS374DBR DB20MLA330168.27.5 2.51216Q1 SN74LS374DWR DW20MLA3302410.813.0 2.71224Q1 SN74LS374NSR NS20MLA330248.213.0 2.51224Q1 SN74S373DWR DW20MLA3302410.813.0 2.71224Q1 SN74S374DWR DW20MLA3302410.813.0 2.71224Q1 SN74S374NSR NS20MLA330248.213.0 2.51224Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm) SN74LS373DWR DW20MLA333.2333.231.75SN74LS373NSR NS20MLA333.2333.231.75SN74LS374DBR DB20MLA342.9336.628.58SN74LS374DWR DW20MLA333.2333.231.75SN74LS374NSR NS20MLA333.2333.231.75SN74S373DWR DW20MLA333.2333.231.75SN74S374DWR DW20MLA333.2333.231.75SN74S374NSR NS20MLA333.2333.231.75IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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