光宏24MIL兰光芯片规格书

information on the applications如产品需要用在有特殊质量要求及可靠性要求的地LEDs without having consentinform Refond in writinganalysis.在取得瑞丰的同意前，客户不应该对产品进行拆解分析，如发现失效产品，请直Features 特征Extremelywide viewing angle.发光角度大Suitable for all SMT assembly and solder process.适用于所有的SMT 组装和焊接工艺 Moisture sensitivity level:Level 3.防潮等级Level 3 Package:3000pcs/reel.包装每卷3000pcs RoHS compliant.满足RoHS 要求Description 描述The Colour LED which was fabricated using blue ,green and red chip 该产品为三色光LED ，是由蓝光、绿光和红光晶片封装形成Applications 应用Optical indicator.光学指示Switch and Symbol,Display.开关和标识、显示器等 General use.其他应用RF-W2S155TS-A41Package Dimension外观尺寸NOTES:1.All dimensions units are millimeters.(所有尺寸标注单位为毫米)2.All dimensions tolerances are 0.2mm unless otherwise noted.(除特别标注外，所有尺寸公差为±0.2毫米)----140------------Note:备注Vr=5V For test conditions.Vr=5v为测试分选条件。

Absolute Maximum Ratings at Ts=25°C 绝对最大值1.2.3.4.5.6.Typical optical characteristics curves典型光学特性曲线Packaging Specifications⏹Carrier Tape Dimensions载带尺寸FEEDING DIRECTIONNote:Thetolerances unless mentioned±0.1mm.Unit:mm注：未注公差为±0.1毫米，尺寸单位：毫米。

新世纪LED芯片45mil规格书V.990105BCONTROLLEDDOCUMENTAPPROVAL SHEETProduct Type:Blue InGaN/ GaN LED DP5 (45X45) ChipsPart No: B4545ECD0Doc ID: MK-QA-010 Rev: E.Date : January 05, 2010Created By: Approved By:Heaven HsuO scar Chan Heaven HsuV.990105B 1.Scope：This specification applies to Blue InGaN/GaN LED chips,DP5(45X45) of Genesis Photonics Inc.。

And Includes the inspection of electro-optical characteristics。

2.Materials：2.1 P-contact：ITO。

2.2 P-pad：Au。

2.3 N-pad：Au。

3.Mechanical specifications ：3.1 Chip size：1143×1143μm ( ± 10μm )。

3.2 P-pad：φ 110μm ( ± 10μm )。

3.3 N-pad：φ 110μm ( ± 10μm )。

3.4 Chip thickness：150μm ( ± 10μm )。

3.5 Chip diagramTop view Cross section4.Electro-optical characteristics and specification：4.1 Test condition：Parameter Symbol Condition UnitDominant wavelength Wd If = 350 mA nmLuminous intensity Iv If = 350 mA mWForward voltage Vf If = 350 mA VReverse current Ir Vr = - 5 V μAV.990105B4.2 Characteristics:Maximum Ratings at T a=25℃Symbol Conditions RatingsDC Forward Current I F T j=125℃700mAJunction Temperature T j150℃Reverse Voltage V r T a=25℃-5VReverse Current I r V r=-5V<2μAAssembly Process Temp. 325℃(<5sec)Notes：Maximum ratings were measured in an integrating sphere using Au plated TO-39 headers without an encapsulate, and may differ with different package types..4.3 Model No：Part No : A B C D E F G H IBin ： 1 2 3 4 5 6 7 – 8 9Exp：Part No: B4545ECD0Bin : V33 P45A-294.3.1 Code A B C D E F G H I ：Product code: A B C D E F G H IProduct code4.3.2 Code 1 2 3 ：Vf range（V）： 1 2 3V31 3.1~3.2 V32 3.2~3.3 V33 3.3~3.4 V34 3.4~3.54.3.3 Code 4 ：Electrical spec： 4P Vf<3.5 ; Ir<2μAV.990105B4.3.4 Code 5 6 7 ：Wd range（nm）： 5 6 744B 442.5~445.0 45A 450.0~452.5 45D 457.5~460.044C 445.0~447.5 45B 452.5~455.0 46A 460.0~462.544D 447.5~450.0 45C 455.0~457.5 46B 462.5~465.04.3.5 Code 8 9 ：Iv range (mW)： 8 926 180~20027 200~22028 220~24029 240～26030 260~28031 280~300Lot No：L/N： A B C D E – F G H I J – K L MExp：L/N：61621-18183-0015.Bin description：Below is a table which defines the specific part numbers or “bins” which are within the B4545ECD0 kit. Each tape will contain chips from only one bin, and a customer order for kit B4545ECD0 will befulfilled with a shipment of production devices which may contain any combination of tapesconsisting of any or all bins in the table.Wd Grade Iv Grade45A -29 -30 -3145B -29 -30 -3145C -29 -30 -3145D -28 -29 -30 -3146A -28 -29 -30 -3146B -28 -2946C -27 -28 -2946D -27 -28V.990105B6. Packing specification ：6.1 LED chips are placed on the blue adhesive tape with the bonding pads facing up (i.e. sapphireis adhered to the tape) and covered with a glossy paper (See Figure 6-1)6.2 Chip array must be placed within the center of the blue adhesive tape and the bar code label islocated on the back of the blue tape at the left lower corner (See Figure. 6-2).6.3 Label specification ：MIN AVG MAX STD Vf (V) -- actual spec actual Iv (mW) spec actual spec actual Wd (nm) spec actual spec actual6.4 Packaging dimensions (See table 6-1)ItemDimensionBlue adhesive tape 200 mm × 200 mm (±10mm) Mesh curtain 70 mm × 70 mm (±10mm) Backing glossy paper 200 mm × 210 mm (±10mm) Label location on blu e tapeLower left corner; 10 ± 2 mmFig 6-1 Chip on tapeFig 6-2 Location of labelTable 6-1 Package dimensionsV.990105B6.5 Packaging for shipment6.5.1 The sheet (blue adhesion tape +mesh curtain+ glossy paper) must be packed in ananti-electrostatic bag and paper box for shipment(See Fig 6-3)6.5.2 The max numbers of blue tapes in a bag is 20 pieces 6.5.3 The ESD attention label is stamped on bag6.5.4 Each box and each sheet should be labeled with information describing its content.BagShipping AddressPacking ListESD labelV.990105BCriteria of Defective Chip1. Inspection Equipment and Method Inspecting Chip by Microscope Magnification: 30X2. Figure of ExampleItemDefective itemCriteria of Defect ChipExample1 Active Area Broken Rejected2 Active Area Dirty (1)Dirty Area≥ 10% of Active Area3Active Layer Breakage and Scratched1. Breakage and scratch must not cross active layer2. Breakage and Scratch ≥ 10% of Active Layer4Pad DirtyDirty Area≥ 10% of Pad AreaV.990105BItem Defective item Criteria of Defect Chip Example 5 Pad Scratched1.Scratched Area ≥ 20% of Pad Area2.Scratched Length ≥ 1/3 of Pad Diameter3.Exposed Sub-tract6 Remnant Metal1. Remnant Area≥ 10% of Active Area2. Remnant metal ≥ 3 Spots and Spot Length ≥ 20 μm3. Remnant metal over active area7 Defective Scribe1. Double Chips2. Scribed on active area or N-pad3. Racked or Chipped Area ≥ 10% of the Original Area4. Un-scribed Area≥ 110% of the Original Area9Wrong LabelRejected --10 Inverse Protective Paper Rejected-- 11 The Amount of ChipsAmount per Blue T ape ≥ 50 pcs--V.990105BDominant wavelength shift vs Forward currentRelative luminous intensity vs Forward currentV.990105B Led Chip View angle Measurement1.Package typeChip on TO-39 Without Cap2.Measurement ConditionMeasurement Distance: 100mmOperating Angle From -900 to 9003.ResultRelative Intensity vs. Off Axis Angle ( View Angle)50% Power Angle:122.5 degreeNotes:The above diagram is measured with the current at 200mA using Au plated To39 headers without an encapsulate.。

頁次 1 of 5文件名稱24*24 Blue GaN LED Chip StandardSpecifications (C-C4XXQQXXXX 制定部門晶粒廠修訂紀錄修訂日期頁次版次制修記要修改者簽章生效日期2009.03.19 All 01 新制定李孟信頁次 2 of 5 文件名稱24*24 Blue GaN LED Chip Standard Specifications (C-C4XXQQXXXX制定部門晶粒廠1. ScopeThis specification sheet is only for Blue GaN CMLT C-C4□□QQ □□□□ product.2. Material Structure & DimensionsMaterial structure: Sapphire P electrode (anode: Au alloy N electrode (cathode : Au alloy Chip thickness: 4 ± 1 mil3. Electro-Optical CharacteristicsTypical Iv table※Luminous intensity is measured with CMLT’S standard chip probing equipment. Iv m ※easure specification is ± 10% , λd measure specification is ± 1 nm Please contact us for available product ※Value ParameterSymbolTest ConditionMin.Typ.Max.UnitDomin ant Wavelength λd If= 100 mA450 - 465 nm Luminous Intensity Iv If= 100 mA Refer to the Typical Iv table Refer to the Typical Iv table mw Forward Voltage Vf If= 100 mA 2.8 3.3 3.8 V Reverse Current Ir Vr= -5V- - 1.0 uA Spectral Width at Half- maximum ΔλΔλIf= 100 mA22nmValueSymbol Test Condition Min.Typ.Max.UnitD 40 50E 50 60F 60 70G 70 80H 80 95 I 95 110 Iv grade J If= 100 mA 110 125 Po600 ± 20 um90 ± 10 umP90 ± 10 umN600 ± 20 um頁次 3 of 5 文件名稱24*24 Blue GaN LED Chip Standard Specifications (C-C4XXQQXXXX制定部門晶粒廠4. Product Type No. Explanation for C-C4XXQQXXXXExample : C - C 4X 0 QQ G 1 0 0 (A. Standard chip product(B. Dominant Wavelength : 430 nm ≦λd <490 nm with 2.5 nm interval when sorting, Other Wavelength are as follow table43 430 nm≦λd<440 nm 44 440 nm≦λd<450 nm 45 450 nm≦λd<460 nm 46 460 nm≦λd<470 nm 47 470 nm≦λd<480 nm 48 480 nm≦λd<490 nm(C .CMLT process code(D.Chip Dimension : ( 24 mil x (24 milA B C D E F G H I J K L M 891011121314151617181920N O P Q R S T U V W X Y Z 21 22 23 24 26 28 30 32 34 36 38 40 45 (E. Luminous Intensity Grade : refer to the following tableFor Chip Size : 400400 mil 2 < Chip Size < 16001600 mil 2ABCDEFGH I J K LM0~3030~35 35~40 40~50 50~60 60~70 70~80 80~95 95~110 110~125 110~125 125~145NOPQRSTUVWXYZ(F. Wavelength bin grade : 1 : 0~2.5nm, 2 : 2.5~5nm, 3 : 5~7.5nm, 4 : 7.5~10nm(G.CMLT process code (H.CMLT project code(G (A (B (C (E(D (F (H頁次 4 of 5 文件名稱24*24 Blue GaN LED Chip Standard Specifications (C-C4XXQQXXXX制定部門晶粒廠5.Typical Electrical and Optical characteristic curves Test condition :Measured bare chip under Ta = 23℃±2℃Fig.1 Forward current vs. Forward voltage Fig.2 Relative Intensity vs. Forward CurrentFig.3 Spectrum vs. Wavelengt頁次 5 of 5 文件名稱24*24 Blue GaN LED Chip Standard Specifications (C-C4XXQQXXXX制定部門晶粒廠6. Label SheetA label sheet containing the detailed manufacturing information, such as Lot. number, type number, chip quantity, electro-optical characteristics, is pasted at the upper-left corner on blue tape . Standard dimension of the blue tape is equal to (190 ±10mm ×(190 ±10mm.7. Inspection ProcessAll of the chips are sorted into an array form on the blue sheet after 100% testing for electro-optical characteristics. Furthermore, 100% chip appearance inspection by optical microscope was performed in the standard manufacturing flow.333Po70.6 76.1 79.3 1.18 3.10 450 3.12 451.4 3.18 0.66 452.4 0.02。

中之光电科技有限公司ZT3528W0S1-****(0.06W)规格书3.5 mm SMD Hyper White Top LED 3.5 mm 贴片超亮白色发光二极管Features 特征• Package Size ：3.5 (L) ×2.8(W) × 1.2 (T) mm封装尺寸： 3.5 (长) ×2.8 (宽) ×1.2 (厚) mm •Silicone Packed 采用硅胶封装•Super long lifetime超长寿命 •Anti UV 防紫外线•White colors are available in(1800K-15000K) 可供白光(1800K-15000K) •High CRI products 高显色性产品 •Wide viewing angle (2θ1/2=120°) 宽角度 (2θ1/2=120°)Applications •产品应用•Indoor lighting : Fluorescent lamp, tube •室内照明：日光灯管、灯条•Commercial illumination and displays : •商业照明显示：广告字、广告灯箱 Advertising words, light box•LCD Backlighting •LCD 背光源•Decorative lighting : light strip •装饰照明：柔性灯条•Automotive interior auxiliary lighting •Other illumination and displays •其它照明和显示类OOTop View 顶视Side View 侧视OOBin Range of Forward Voltage电压等级代码(at I F = 20 mA, T a = 25 O C )Part No. Description产品型号说明Color Bin Limit色度代码;(at I F = 20 mA, T a = 25 O C )Color Bin色坐标常用BIN区(Common Bin)可选BIN区（Optional Bin）Typical Electro-Optical Characteristics Curves 典型光-电特性曲线图Solder Pad一、PRECAUTONS IN USE LED/使用LED注意事项；LED Soldering condition/ LED焊接条件；1：烙铁焊接：烙铁最高30W尖端温度不超过300℃；焊接时不超过3秒；Manual soldering：iron Maximum 30W，iron bit temperature can not over 300 degree；soldering time should not be more than 3 seconds；Cleanout/清洗；当用化学品清洗LED胶体时须特别小心，因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮，可用乙醇擦拭浸渍，时间在常温下不超过2分钟。

版本变更记录目录1. 特性 (1)2. 描述 (1)3. 应用领域 (1)4. 引脚 (2)4.1 引脚定义 (2)4.2 引脚描述 (3)5. 结构框图 (4)6. 典型应用电路 (5)7. 电气特性 (5)7.1 极限参数 (5)7.2 典型参数 (6)7.3 开关时间特性及死区时间波形图 (8)8. 应用设计 (8)8.1 VCC端电源电压 (8)8.2 输入逻辑信号要求和输出驱动器特性 (8)8.3 自举电路 (10)9. 封装尺寸 (11)9.1 TSSOP20封装尺寸 (11)9.2 QFN24封装尺寸 (12)EG2124A芯片数据手册V1.01. 特性◼高端悬浮自举电源设计，耐压可达260V◼集成三路独立半桥驱动◼适应5V、3.3V输入电压◼最高频率支持500KHZ◼低端VCC电压范围7V-20V◼输出电流能力IO +0.8A/-1.2A◼VCC和VB带欠压保护◼内建死区控制电路◼自带闭锁功能，彻底杜绝上、下管输出同时导通◼HIN输入通道高电平有效，控制高端HO输出◼LIN输入通道高电平有效，控制低端LO输出◼封装形式：TSSOP20和QFN24◼无铅无卤符合RHOS标准2. 描述EG2124A是一款高性价比的大功率MOS管、IGBT管栅极驱动专用芯片，内部集成了逻辑信号输入处理电路、死区时控制电路、欠压保护电路、闭锁电路、电平位移电路、脉冲滤波电路及输出驱动电路。

EG2124A高端的工作电压可达260V，低端VCC的电源电压范围宽7V～20V。

该芯片具有闭锁功能防止输出功率管同时导通，输入通道HIN和LIN 内建了下拉电阻，在输入悬空时使上、下功率MOS管处于关闭状态，输出电流能力IO +0.8A/-1.2A，采用TSSOP20和QFN24封装。

3. 应用领域◼三相直流无刷电机驱动器4. 引脚4.1 引脚定义图4-1. EG2124A管脚定义图4-2. EG2124管脚定义4.2 引脚描述5. 结构框图VB1HO1VS1VCCLO1VB2HO2VS2LO2VB3HO3VS3LO3GND图5-1. EG2124A内部电路图6. 典型应用电路图6-1. EG2124A典型应用电路图7. 电气特性7.1 极限参数7.2 典型参数无另外说明，在T A=25℃，Vcc=12V，负载电容C L=1nF条件下7.3 开关时间特性及死区时间波形图图7-1. 低端输出LO 开关时间波形图图7-2. 高端输出HO 开关时间波形图50%50%LOH INLINHO 50%50%图7-3. 死区时间波形图8. 应用设计8.1 VCC 端电源电压针对不同的MOS 管，选择不同的驱动电压，开启MOS 管推荐电源VCC 工作电压典型值为7V-15V 。

安莹34mil 安莹22*42mil 安莹26mil 上海蓝宝50mil 华上40mil红光华稼40mil红光华上40mil红光（双）晶科45mil 奇力24mil 隆达45mil 隆达38mil 璨圆45mil 安莹45mil
光宏38mil红黄光光宏24mil 奇力45/36mil老制程奇力45mil新制程璨圆40mil绿光
晶元42mil绿光光宏45mil 光宏45mil绿光光宏38mil 奇力20*38
科瑞54mil 科瑞38-35mil 普瑞60mil 普瑞50mil 普瑞45mil
光宏38mil绿光
各品牌芯片外观及纹路
普瑞33mil 晶元35/45mil 晶元45mil绿光台湾晶元38mil 晶元42mil红光
上海蓝宝38mil
华新丽华35mil 迪源3845mil
光宏32mil红黄光晶发45mil 晶发38mil 泰谷45mil（新）泰谷45mil（老）
泰谷40mil 泰谷22*42mil 华新丽华45mil 山东华光45mil 长沙华磊45mil 光宏40mil 光宏42mil红黄光光宏30mil
连胜40mil红/黄光新世纪45mil 新世纪38mil白/绿光新世纪30mil（新）新世纪24mil
普瑞24mil 欧斯朗40mil 旭明新制成45mil 旭明老制成45mil 日本OBL60mil
迪源30mil（老）迪源24mil 迪源30mil（新）迪源45mil高压芯片韩国LG24mil
韩国LG22*42mil 安莹40mil 晶元35mil（新）晶元50mil 晶元60mil（高压）
光磊40mil红光光磊40mil植物红光光磊42mil红光厦门三安50/45/38mil
厦门三安20*38mil。

数据手册DATASHEET8022WS单键单输出LED调光触摸芯片(Rev:1.3)一、概述8022WS触摸感应IC是为实现人体触摸界面而设计的集成电路。

可替代机械式轻触按键，实现防水防尘、密封隔离、坚固美观的操作界面。

使用该芯片可以实现LED 灯光的触摸开关控制和亮度调节。

方案所需的外围电路简单，操作方便。

确定好灵敏度选择电容，IC就可以自动克服由于环境温度、湿度、表面杂物等造成的各种干扰，避免由于电阻、电容误差造成的按键差异。

二、特性1、工作电压范围：2.2～5.5V。

2、待机功耗低：V DD=5V，待机电流14uA；V DD=3V，待机电流7uA。

3、工作温度：-25℃～85℃。

4、HBM ESD：±4KV以上。

5、按键响应时间：小于100ms。

6、灯光亮度可根据需要随意调节，选择范围宽，操作简单方便。

7、控制信号输出频率达32KHz，无频闪现象。

8、封装类型：SOP8。

9、内置稳压源、上电复位、低压复位、环境自适应算法等多种措施，可靠性高。

10、抗电源干扰及手机干扰特性好，近距离、多角度手机干扰情况下触摸响应灵敏度及可靠性不受影响。

11、高灵敏度(用户可自行调节)。

12、高防水性能。

13、应用电路简单，外围器件少，成本低。

14、按键感应盘大小：大于3mm*3mm,根据不同面板材质跟厚度而定，可以直接用大面积金属片。

15、按键感应盘间距：大于2mm。

16、按键感应盘形状：任意形状(必须保证与面板的接触面积)。

17、按键感应盘材料：PCB铜箔，金属片，平顶圆柱弹簧，导电橡胶，导电油墨，导电玻璃的ITO层等。

18、面板厚度：0～12mm，根据不同的面板材质有所不同。

19、面板材质：绝缘材料，如有机玻璃，普通玻璃，钢化玻璃，塑胶，木材，纸张，陶瓷，石材等。

20、芯片内置防水工作模式。

在防水模式下，无论面板上有溅水、漫水甚至完全被水淹没，按键都可以正确快速的响应。

不同于目前一般感应按键在面板溅水、漫水时容易误动作，积水后反应迟钝或误响应的情况。

产品承认书产品名称：0603-T0.6冰蓝贴片式发光二极管产品型号：XL-1608BGWC-06客户名称：客户料号：承认日期：深圳市成兴光电子科技有限公司制定审核核准客户承认栏确认审核核准一、产品描述：●外观尺寸(L/W/H): 1.6x0.8x0.6mm●颜色:高亮度冰蓝白●胶体:绿色胶体●EIA规范标准包装●环保产品，符合ROHS要求●适用于自动贴片机●适用于红外线回流焊制程二、外形尺寸及建议焊盘尺寸：C athode A nodeG reen m ark建议焊盘尺寸备注：1.单位:毫米（mm）2.公差：如无特别标注则为±0.10mm三、建议焊接温度曲线：有铅制程无铅制程四、最大绝对额定值（Ta=25℃）：参数符号最大额定值单位消耗功率Pd80mW最大脉冲电流(1/10占空比,0.1ms脉宽)I FP100mA正向直流工作电流I F25mA 反向电压V R5V 工作环境温度Topr-30°C~+85°C存储环境温度Tstg-40°C~+90°C焊接条件Tsol 回流焊:260°C,10s 手动焊:300°C,3s五、光电参数（Ta=25℃）：参数符号最小值代表值最大值单位测试条件光强IV 150---320mcd IF =5mA 半光强视角2θ1/2---120---deg IF =5mA 正向电压VF 2.7--- 3.1V IF =5mA 反向电流IR------1uAVR=5V亮度分档：代码最小值最大值单位测试条件X0150180mcdIF=5mAX1180220X2220260X3260320电压分档：代码最小值最大值单位测试条件W11 2.7 2.8V IF=5mAW12 2.8 2.9W13 2.9 3.0W143.03.1色温分档：代码代表值单位测试条件BN3BN3KIF=5mABN4BN4BN5BN5BN6BN6BN7BN7六、光电参数代表值特征曲线：注:如无另外注明，测试环境温度为25+3 Cφ60七、标签标识：CAT ：光强（mcd ）HUE ：XY REF ：电压（V ）误差范围a.Luminous Intensity:±15%b.HUE:±0.004c.Forward Voltage:±0.1V八、包装载带与圆盘尺寸：φ13.0U ser Feed D irection备注:1.尺寸单位为毫米(mm)；2.尺寸公差如无标注，为±0.15mm ；AAA-A剖面图九、圆盘及载带卷出方向及空穴规格：尾端空壳载带的组合开始端空壳载带的组合盖带与空壳载带的组合十、内包装及外包装：内标签圆盘干燥剂防潮防静电袋5cartons/box外标签抽真空、热封10bags/carton至少160mm盖带和装有零件部分至少160mm盖带和至少160mm独立盖带或十一、信赖性实验：测试项目测试条件测试次数参考标准失效判定标准失效LED数量（PCS）防潮等级1.回流焊最高温度=260℃,10秒，2次回流焊；2.回流焊之前存储条件：30℃，相对湿度=70%，168H；-JEITAED-4701300.301﹟10/22焊接信赖性（无铅回流焊）回流焊最高温度=245±5℃，5秒（无铅回流焊）-JEITAED-4701303303A﹟20/22冷热循环-40℃30分钟~25℃5分钟~100℃30分钟~25℃5分钟300个循环JESD22-A104﹟10/22冷热冲击-35℃15分钟转换时间3分钟85℃15分钟300个循环JESD22-A106﹟10/22高温存储Ta=100℃1000小时JESD22-A103﹟10/22低温存储Ta=-40℃1000小时JESD22-A119﹟10/22常温老化Ta=25℃IF=20mA1000小时JESD22-A108﹟10/22（2）失效标准标准﹟项目测试条件失效标准﹟1正向电压(V F)I F=20mA＞U.S.L*1.1光强（IV）I F=20mA＜L.S.L*0.7反向电流(I R)V R=5V＞U.S.L*2.0﹟2焊接可靠性/锡膏覆盖焊盘比例小于95%★U.S.L:规格上限L.S.L:规格下限十二、使用注意事项：◆使用：1.过高的温度会影响LED的亮度以及其他性能，所以为使LED有较好的性能表现，应将LED远离热源。