PECO劈刀资料

碳弧气刨基本知识目录一、碳弧气刨基本概念 (2)1.1 碳弧气刨的定义 (2)1.2 碳弧气刨的应用领域 (3)二、碳弧气刨设备与工具 (4)三、碳弧气刨工艺原理 (5)3.1 碳弧气刨的原理 (6)3.2 碳弧气刨的工艺流程 (7)四、碳弧气刨操作技巧 (8)4.1 碳弧气刨的准备工作 (9)4.2 碳弧气刨的操作步骤 (10)4.3 碳弧气刨的安全注意事项 (11)五、碳弧气刨在实际工作中的应用案例 (12)5.1 碳弧气刨在金属切割中的应用 (13)5.2 碳弧气刨在焊接修复中的应用 (14)5.3 碳弧气刨在其他领域的应用 (15)六、碳弧气刨的优缺点及发展趋势 (16)6.1 碳弧气刨的优点 (18)6.2 碳弧气刨的缺点 (19)6.3 碳弧气刨的发展趋势 (20)一、碳弧气刨基本概念碳弧气刨是一种利用碳极电弧产生的高温，使金属表面局部熔化，从而实现表面清理和焊接的一种高效工艺方法。

在碳弧气刨过程中，电弧产生的高温足以使金属熔化并蒸发，形成一定的气体保护效果。

由于电弧的吹力作用，可以将熔化的金属及其氧化物吹掉，实现表面的清理效果。

碳弧气刨具有操作简便、生产效率高、适用范围广等优点。

它可以在各种金属材料上使用，包括碳钢、不锈钢、合金钢等。

碳弧气刨还可以用于焊接前的表面清理和预处理工作，以及缺陷的检测和修复工作。

需要注意的是，碳弧气刨过程中会产生大量的烟尘和有害气体，对环境和人体健康造成一定的影响。

在使用碳弧气刨时，需要采取必要的防护措施，如佩戴防护眼镜、口罩和手套等。

1.1 碳弧气刨的定义碳弧气刨是一种利用碳极电弧产生的高温，使电极和基体金属熔化，同时用压缩空气的气流来吹除熔化金属，从而实现表面清理和局部加热加工的方法。

这种工艺在金属加工领域中被广泛应用，特别是在钢铁制造、化工设备制造等行业中，用于清除焊缝、毛刺、旧漆层以及进行局部热处理等。

在碳弧气刨过程中，一般将碳棒作为电极，通过调整电流和电压来控制电弧的温度和能量。

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【隐形冠军】三环集团：陶瓷劈⼑陶瓷劈⼑三环集团2016年成功开发出⽤于半导体封装的陶瓷劈⼑，简称为劈⼑，并在2017年12⽉21-23⽇的深圳国际电⼦展⾸次展⽰。

下⾯是对三环研究得很透的⽩杨先⽣在深圳展会现场拍的照⽚。

随后在2018年的上海慕尼⿊电⼦展上也有展出。

简单地说，劈⼑是邦机(BondingMachine)的⼀个焊接针头，⽤于半导体封装中⾦线、银线、铜线、合⾦线的键合焊接，是半导体封装中的消耗品，⼴泛⽤于可控硅，声表⾯波，LED，⼆极管，三极管，IC芯⽚等线路的键合焊接。

劈⼑材质主要有三种：碳化钨，钛⾦和陶瓷，碳化钨最便宜，陶瓷劈⼑最贵。

陶瓷是制作劈⼑的绝佳材料，具有硬度⼤、⽐重⾼、晶粒细⼩、外表光洁度⾼、尺⼨精度⾼等⼀系列优点，⽽且使⽤寿命较长。

键合⼯艺半导体封装中⼀个很关键的步骤是引线键合，也就是先把芯⽚电极⾯朝上粘帖在封装基座上，然后⽤⾦属丝将芯⽚电极(Pad)与引线框架上对应的电极(Lead)通过焊接⽅式连接起来，实现芯⽚与封装框架的电⽓连接。

实现这种键合的设备称为邦机(BondingMachine)。

键合时采⽤的焊接⼯艺有三种：热压焊、超声焊和⾦丝球焊。

其中最具代表性的是⾦丝球焊。

⾦丝球焊的主要流程（如下图所⽰）是：将底座加热到摄⽒300度，把⾦丝穿过劈⼑的⽑细管，⽤氢⽓⽕焰将⾦丝端部烧成球状，再⽤劈⼑将⾦丝球压到电极上实现电极键合；然后劈⼑提起，将⾦线牵引到要键合的框架电极，下压到300度⾼温的框架电极上，并⽤劈⼑侧向切断⾦丝，完成⼀根引线的键合。

陶瓷劈⼑是精密微结构陶瓷部件。

劈⼑主要尺⼨参数包括HOLE(孔径)、TIP (嘴尖直径)、CD(chamber Dia.)、OR(outer radius)、FA(face angle)、ICA(inner chamber angle)、CA(chamber angle)等，具体见下图。

总之，影响第⼀焊点的劈⼑尺⼨参数包括H、CD和CA；影响第⼆焊点的劈⼑尺⼨参数是OR、FA。

MC901、MC801、MC703HL、MC602ST、MC501CD、U-PEMC901机械强度：其机械强度与耐久性比以往使用的尼龙树脂更优良。

耐磨性：具有自润性，是润滑性能优异的材料，尤其在高荷重下其耐磨耗性非常优异。

耐热性：能具有连续使用温度120度的高温。

耐药品性：具有不被有机熔剂油脂强碱性药品侵蚀的耐药品性。

机械强度：车轮，齿轮，链轮，滚轮，轴承，里衬板。

耐磨性：滑板，星型轮，导轮，栈板。

电气绝缘性：绝缘材。

MC801耐候性：添加了特殊石墨的MC801产品呈铁黑色。

遮断紫外线表现耐候性。

可以在室外长期使用。

耐候性：牵引盘，滚轮，轨道飞车轮。

耐磨性：导轮，星型轮，轴承，滑轮。

MC703HL防止卡住与打滑：MC701HL比起以往地MC701SL更加强了润滑性能。

适用于解决机械运转不顺畅与发生振动等卡住与打滑问题。

低磨擦系数：MC901是工程塑胶当中摩擦系数甚低的素材之一而MC701HL更提高了这个特性。

耐磨耗性：MC703HL除了耐摩擦系数低外也是耐磨耗性地优良素材。

滑动性能、耐磨耗性：吊车等的滑板、里衬板、阀片。

摩擦系数：导板、凸轮。

可无给油运转：齿轮、滚轮、轴承。

MC602ST机械强度：与具有高机械强度的MC901比较，MC601ST在常温下可提高倍，50度时可提高倍。

耐热性：热安定性甚为优异，可在150度的环境下使用。

耐荷重性：荷重很大的车轮，滚轮齿轮，里衬板。

耐热性：高温制品的零件，附件板状冶具，高温范围地车轮，滚轮轴承，里衬板。

MC501CD抵抗值极低，性能均匀：MC501CD的充填材分散很均匀，任何部分的抵抗值都相同，机械加工后也可以放心使用。

没有抵抗值的经时变化：炭系填充材与使用导电性涂料以及填充界面活性剂地塑胶不一样，不会经常改变抵抗值，即使表面有磨耗，抵抗值也不会改变。

U-PE超高分子量聚乙烯U-PE100是POL YPENCO的U-PE产品的自然等级。

特点：1、耐磨耗性2、耐冲击性3、耐药品性4、机械加工性5、适合FDA规格6、非常低的吸水性用途：具有耐磨耗性的通用机械零件食品加工机械，医疗机械零件等卫生用途低吸水性的用途注意：U-PE是指定可燃物，根据消防法和火灾预防条例来保管。

∫2N9 Au Wire BondingChallenging SubstratesEnhanced Stitch Bondabilitysmall precision toolsJ a n 2008Au WireBond Surface∫As we are aggressively pursuing new technologies to improve the performance of packages and product miniaturization,the current problems associated with wire bonding remains. Bonding issues due to NSOP , NSOL, pad peeling have constantly been a nightmare for wire bond engineers. Theseissues became more severe with the pressure to reduce the cost of products.Although it is commonly known that the stitch bond reliability can be improved by increasing thetip diameter and FA/OR optimization of the capillary profile, the limitation lies with fine-pitch and ultra-fine pitch bonding. The restriction with the bond pad pitch limits the flexibility of using a larger tip diameter. The use of a smaller FA helps to improve the stitch bondability but at the expense of lower stitch pull reading and possibly, shorter tool life. Working within these limitations, a new capillary design is today developed to improve the stitch bondability.Small Precision Tools (SPT) Stitch Integrator capillary has been developed with the objective to improve the bondability of the stitch bond through better coupling effect between thebonding tool and the wire during bonding. Through extensive studies and optimizations, the Stitch Integratorcapillary has been derived and has proven to enhance the stitch bondability as compared to non SIcapillary designinmany field applications.Features:• Improved stitch integrationwith the substrate with better ultrasonic energy transfer.• Enhanced coupling effect between the capillary and the wirewith better stitch bondability.• Higher MTBA with fewer machine down time and higher product output.Today, the Stitch Integrator capillary has been tested, proven and qualified by major assembly houses and MNCs and usedin volume production for a broad range of bonding applications with improved yield performance and less bonder stoppages. Depending on the specific bonding application, the Stitch Integrator capillary can be used together with any existing design feature, such as the DFX (for small ball large wire bonding), Infinity (for extended tool life), etc. Indeed, the Stitch Integratorcapillary has proven to be a new revolution for enhanced stitch bondability.SI 33090435F ZB 34T P122N9 Au WireChallenging SubstratesEnhanced Stitch BondabilityThe use of 2N9 Alloyed Au wire is becoming popular for fine-pitch and ultra-fine pitch bonding. These wires consist of 99% Au purity with 1% Pd and are formulated with dopant to enhance the looping capability and ball bond reliability. However, these wires are generally harder and more prone to wire breakage and non-sticking problem during stitch bond formation resulting in higher yield loss during production, especially for leaded devices. The nature of the lead frame design with certain degree of bouncing effect during bonding further complicates the robustness of the bonding process.The challenge is to be able to improve the stitch bondability for 2N Alloyed Au wire. The Stitch Integrator capillary helps to improve the bonding performance as shown in the following application.Key Notes:●The enhanced coupling effect between the SI capillary and the alloyed wire has proven to improve the bondability of the stitch bond with minimum interruption to the bonder.At 600K bonds, the load-up condition on the capillary is satisfactory with no excessive load-up accumulation at the tip of the capillary.(Note: standard tool life is set at 500K bonds)Destructive test performed through wire pull @ 1/3 wire length at 1K and 600K bonds did not reveal any abnormality with the stitch bonds as all the wires break @ neck location. This indicates that the stitch bond adhesion is satisfactory with no bond reliability issue. Sample size = 1500 wires.Bonder stoppages due to wire open and short tail defect rate were recorded at less than 1000ppm while regular bonder stoppages was encountered with non-SI capillary.●●●32N9 Au Wire Bondin g How To OrderThe pressure to reduce the cost of products has indirectly instilled certain elements of inconsistency to the lead frame and substrate materials, which directly affect the bond reliability of the stitch bonds. Inconsistent lead frame and substrate quality often results in NSOL, short tail or low stitch pull readings during wire bond. Most of the time, the problem is only known after die attach and during wire bond.The challenge is to be able to improve the stitch bondability for these types of lead frames/substrates. The Stitch Integrator capillary helps to improve the bonding performance as shown in the following application.Key Notes:●Destructive test for both ball shear and wire pull has shown that the bondability for the ball and stitch bonds was within the manufacturing specification with good Cpk control.Visually, the ball and stitch bonds at 800K bonds did not show any symptoms of golf ball, irregular ball squashed out or damaged stitch bonds. Bonder stoppages throughout the tool life of the SI capillary was recorded at, NSOL: 614ppm, short tail: 512ppm. No EFO open was encountered.During the O/S test, device failure bonded using the SI capillary showed a substantial reduction in ppm as compared to non-SI capillary on the same device type. Overall, the SI capillary showed an improvement of more than 70% with reduced second bond failure. This indicates that the stitch bondability has improved using the SI capillary.●●●Challenging Substrates。