Hi3516 DataBrief(产品简介)

Technical Assistance (800) 343-1391 110kV and 15kV DigitalMegohmmetersModels 6550 & 6555► Insulation measurementup to 30T Ω► Test voltages up to 15,000V► Step, ramp & fixed voltagetesting► Multiple test modes: voltageramp and step with “Burn-In”, “Early-Break” and “I-Limit” modes► 3 filter choices to optimize measurement stability► Selectable voltage from40V to 10,000 / 15,000V ► Storage of up to 80,000 measurements► Optically-isolated USBcommunication for data transfer to PC and report generation using DataView ® softwareExpert tools for testing insulation safely & accuratelyIP 54Our products are backed by over 130 years of experience in test and measurement equipment, and encompass the latest international standards for quality and safety.Technical Hotline: (800) 343-13912 Technical Assistance (800) 343-1391Models 6550 & 6555HIGH-END & PORTABLEThe Megohmmeter Models 6550 and 6555 are high-end portable instruments intended for measuring a wide variety of electrical insulation resistance values oncables and devices operating at high voltage. They are packaged in a rugged case that is IP54 rated (cover closed). Test results and configuration information is provided on a graphical LCD screen, as well as exportable throughthe use of the DataView ® software provided. TheMegohmmeters can operate on battery or AC power while testing.These Megohmmeters contribute to the safety ofelectrical installations and equipment. Their operation is managed by microprocessors that acquire, process, display and store the measurements.The Model 6550 makes insulation measurements at voltages up to 10,000 V , the Model 6555 up to 15,000 V .Main Functions:• Detection and measurement of input voltage, frequency, and current prior to running a test.• Quantitative and qualitative insulation measurements.• Measurements at a fixed test voltage of 500, 1000, 2500, 5000, 10,000 or 15,000 V dc .• Measurements at an adjustable test voltagebetween 40 and 15,000 V dc preselected by the user prior to the test. Three preselected test voltages can be stored in the instrument and can be modified as needed prior to starting a test.IP 54• Ramp voltage measurements with a ramp from 40 to 10,000 V or 15,000 V , model dependent. Three ramp profiles can be stored in the instrument. Each ramp profile includes the starting and ending test voltage and the ramp time between the two.• Step voltage measurements with steps from 40 to 10,000 V or 15,000 V , model dependent.Three step voltage profiles can be stored in the instrument. Each contains up to 10 steps that include test voltage and duration.• Three test current choices: Burn-In, Early-Break and I-Limit provide qualitative analysis tools for detection breaks in insulation.• Quality ratio calculations for DAR, PI, and DD are calculated and displayed.• Temperature correction of the measured resistance to a reference temperature.• Capacitance measurement of the device tested.• Residual current measurement.Model 6555 checking insulation resistance on feed cables to a three-phase motor.Technical Assistance (800) 3►► SELECTABLE VOLTAGE FROM 40V TO 10kV / 15kV MODELSINSULATION TESTSTest VoltageAPPLICATIONS► Acceptance testing and preventive maintenance ► Test motors, cables, switchgears and wiring installations4 Technical Assistance (800) 343-1391CONTROL FEATURESFront Panel Features for Models 6550 & 6555Socket for connection to the ACpower and recharging of thebuilt-in batteriesmeasurementbuttonsUSB connector forcommunicationto a PC Seven position access to the fixed voltage, adjustable voltage,ramp and stepLarge, digital, backlit, Models 6550 and 6555 have the same front panel with differences in the display only .5Measurement Results Display AreaDisplay ofResultsTechnical Assistance (800) 5FUNCTIONSModels 6550 & 65556 Technical Assistance (800) 343-1391bargraphterminalsExample of display during measurement.resistanceresistance referred to the reference temperature.cursor Resistance versus time graph.This curve is useful primarily in the case of a measurement in V-RAMP mode.When Timed Run (test with programmed duration) or Timed Run + DD is selected, the duration of the measurement (m:s) can be set.The number of measurements that can be recorded depends on the number of samples stored for each measurement.quality ofof memory white).indicated.T est with programmed durationExample of display before measurement.FUNCTIONAL DISPLAYSSOFTWARE & ANALYSIS SCREENSEasy identification of all stored test results.Real-time display of measurement results.Step voltage set up screen.Technical Assistance (800) 7ORDERING INFORMATION M egohmmeter Model 6550 Ramp, StepV , Variable, Auto DAR/PI/DD, USB w/DataView Megohmmeter Model 6555 Ramp, StepV , Variable, Auto DAR/PI/DD, USB w/DataView AEMC ® Instruments • 15 Faraday Dr. • Dover, NH 03820 USA • (800) 343-1391•Fax(603)742-2346•E-mail:**************Export Department: +1 (603) 749-6434 x520 • Fax +1(603)742-2346•E-mail:***************© Chauvin Arnoux ®, Inc. d.b.a. AEMC ®Instruments Call the AEMC ® Instruments Technical Assistance Hotline for immediate consultation with an applications engineer: (800) 343-1391950.BR-6550-6555_0323 • Printed in the USA M u lt i-p u r p o s e C la m p -O n M e t e r s ca o tl in M E G O H MM E T E R SFo r a ll of y ou r I ns ul at io n Te st in g ne ed s...ch ni ca l H o tl in e: (800) 343-1391.a em c.co mP O W E R Q U A L I T Y Fo rA ll Y ou r Po w er Q ua li ty N ee ds ...Te 43-1391w w w ( Fo r a ll of yo ur G ro un d In te gr ity T es tin g ne ed s...G R O U N D R E S IS TA N C E T E S TE R S Te ch ni ca l H ot lin e: (800) 343-1391w w w .a em c.co mTEST & MEA SUREM ENT INSTR UMEN TSVOLUM E 23WWW.AEM TECHNICA L HOTLINE : (800) 343-1391Family of ProductsTo learn more, visit 。

35 SERIES HN35 PROFULL Y-FEATURED NVRS• View 16/32/64 channels simultaneously with synchronized real-time playback on your monitor (depending on your model) .32/64CH support 16 channels simultaneously with synchronizedreal-time playback.• Up to 8 MP (4K) resolution live view and playback.• Supports H.265 HEVC, H.264, Smart Codec.• Notify on triggering built-in video analytic alarms from 35S cameras: Crowd, Multi Loitering, Intrusion, Tampering, Motion and SmartMotion Detection (SMD).• Two-way audio/push notification.• Supports up to 16 alarm input channels and 6 alarm relay output channels. (8 SATA).• Maximum incoming bandwidth is 400 Mbps,and Maximum outgoing bandwidth is 400 Mbps.*• Supports redundancy Failover N+1 (Maximum N =10).• Supports people counter feature to accurately automate the gathering of data relating to people entering and exiting a certainarea.DYNAMIC, ACCESSIBLE MONITORING• Global P2P/TUTK service with reliable connection and mobile apps for both Apple® and Android™ devices for anytime, anywhere access.• P2P integration to manage remote configuration and firmware updating.CONVENIENT, FLEXIBLE, REDUNDANT STORAGE OPTIONS• Internal storage supports 8 HDDs expandable up to 80 TB (8 bays) of internal storage.• Store video clips and snapshots to external storage, such as USB device on local side or PC client on web side.• Supports RAID** 1/5/6 storage options.EASY TO SETUP AND USE• Plug and play feature together with 35 Series cameras for rapid and simple setup.• Dual network ports, making it easy to connect local IPCs and remote control.• Intuitive NVR design, quick installation wizard and easy-to-understand installation guide for fast and easy setup.Introducing Honeywell’s 35 Series HN35 PRO NVRs, a robustly-featured, cost-effective, NDAA Section 889 compliant NVR solution delivering 4K HD (UHD) video resolution perfect for small/medium businesses and enterprises. Choose a 16 , 32 or 64 channelNVR with multiple hard drive options and up to 80 TB (8 bays) of internal storage with fail-over and RAID redundancy features fora flexible and reliable solution that grows with your business.• H.265/H.264• HDMI/VGAsimultaneous videooutput• USB ports support Keyboard andMouse• Supports recording avideo clip of events fordistribution• Supports uploadingstill images at the timeof the event throughemail• Supports visual orauditory notificationssuch as a flashinglight, bell, or siren• Support RAID ** 1/5/6 • Supports alarm inputand alarm output• Supports sendingevents through email,FTP, alarm out or pushnotification• Configurable toautomatically detectand respond tomotion in the scene,alarm inputs, andnetwork failure ortamperingFEATURES SECURE AND COMPLIANT SOLUTION• For use as part of video systems which comply with NDAA Section 889.• The TPM (Trusted Platform Module) provides end-to-end stream and command encryption through integrated cryptographic keys.• Together with 35 Series cameras, provides an end-to-end encrypted solution with video streaming and control encryptedbetween NVR and web client / viewer / mobile app.• PCI-DSS compliance.• Secure boot feature combined with Honeywell cybersecurity standards helps ensure data protection.•Support secure NTP.HN351604xxR/HN353204xxNR/HN356404xxNRHN356408xxDRHN353208xxNR/HN356408xxNR16 / 32 /64 Ch 4K Embedded NVR*400Mbps is achievable when video streams are not encrypted. It is needed to split the HDD array into at least two equal storage groups.* * For optimum performance, RAID functionality requires models with Enterprise Hard Disk Drives.35 SERIES HN35 PRO, 16 / 32 / 64 CH 4KHard Disk Drives.**400Mbps is achievable when video streams are not encrypted. It is needed to split the HDD array into at least two equal storage groups.SYSTEM DIAGRAMHN351604XXR1. PoE Ports2. Audio Out3. Audio In4. eSATA Port5. LAN Port6. WAN Port7. RS232 Port8. HDMI 2 Port9. HDMI 1 Port 10. VGA Port 11. USB Port 12. Alarm Input/Output 13. Power Input 14. Power SwitchHN353204xxNR1. Alarm Input/Output2. Audio Out3. Audio In4. LAN Port5. WAN Port6. HDMI 2 Port7.VGA Port8. HDMI 1 Port9. RS232 Port 10. USB Port 11. eSATA Port 12. Power Input 13. Power SwitchHN356404xxNR1. Audio Out2. Audio In3. LAN Port4. WAN Port5. HDMI 1 Port6. HDMI 2 Port7.VGA Port8. RS232 Port9. USB Port 10. eSATA Port 11. Alarm Input/Output 12. Power Input 13. Power SwitchHN353208xxNR/HN356408xxNRHN356408xxDR (Dual Power Supply)1. Audio Out2. Audio In3. LAN Port4. WAN Port5. HDMI 1 Port6. HDMI 2 Port7.VGA Port8. RS232 Port9. USB Port 10. eSATA Port 11. Alarm Input/Output 12. Power Input 13. Power Switch1. Audio Out2. Audio In3. LAN Port4. WAN Port5. HDMI 1 Port6. HDMI 2 Port7.VGA Port8. RS232 Port9. USB Port 10. eSATA Port 11. Alarm Input/Output 12. Power Switch 13. Power InputSYSTEM DIAGRAMHN351604xxR/HN353204xxNR/HN356404xxNR”))”)DIMENSIONSDIMENSIONS HN353208xxNR/HN356408xxNRFor More Information/uk /securityHoneywell Commercial Security Building 5 Carlton ParkKing Edward Avenue Narborough, LeicesterLE19 0ALTel: +44 (0)1163 500714 HBT-SEC-HN35ENVRPRO-01-UK(0923)DS-Y© 2023 Honeywell International Inc.ONVIF and the ONVIF logo are trademarks of ONVIF Inc.HEVC Advance logo is a trademark of HEVC AdvanceHoneywell reserves the right, without notification, tomake changes in product design or specifications.HN35 16 04 00 xR16 = 16 CHANNELS32 = 32 CHANNELS64=64 CHANNELS00 = 0 TB35 = 35 SERIES04 = 4 SATA08= 8 SATA x=N, N means non-PoEx=D, D means redundant power supply R Suffix = Fail-over and RAID software*PART NUMBER LOOKUP* For optimum performance, RAID functionality requires models with Enterprise Hard Disk Drives.。

Bluetooth Low EnergyProduct Brief v2.0OverviewBluetooth version 4.0 introduced Bluetooth with low energy functionality. Bluetooth low energy technology allows for short bursts of long-range radio connections, making it ideal for applications that depend on long battery life and don’t need high throughput streaming data. Developers are now able to create sensors that can run on coin-cell batteries for months and even years. Bluetooth low energy technology is built on an entirely new development framework using GATT (Generic Attributes). Silicon Labs supports the latest version of the Bluetooth ® Core Specification, Bluetooth™ LE 5.4. This enables customers to claim compliance with the latest Bluetooth spec.Bluetooth Low Energy ArchitectureThe Bluetooth Low Energy architecture components are as follows: Physical Layer: Controls radio transmission/receiving.Link Layer: Defines packet structure, includes the state machine and radio control, and provides link layer-level encryption.HCI: A Host-to-Controller interface (HCI) standardizes communication between the controller and the host.L2CAP: Logical Link Control and Adaptation Protocol acts as a protocol multiplexer and handles segmentation and reassembly of packets. ATT: Attribute protocol provides means to transmit data between Bluetooth low energy devices.SM: Security Manager provides means for bonding devices, encrypting and decrypting data, and enabling device privacyGAP: Generic Access Profile layer provides means for Bluetooth low energy devices to advertise themselves or other devices, make device discovery, open and manage connections, and broadcast data.GATT: GATT is used to group individual attributes into logical services GATT also provides information about the attributes, that is, how they can be accessed and what security level is needed.Key Features of Silicon Labs Bluetooth Low Energy StackFeature BenefitCore FeaturesDirection finding, Periodic Advertising with Responses (PAwR), Encrypted Advertising Data (EAD),Advertisement Extensions, Periodic Advertising, LE secure connections, 2M PHY , Long Range, AFH, LE Privacy 1.2 (peripheral), LE packet length extensions, Accept List (central side), GATT, & GATT Caching Scalable AoA Scale to AoA to few hundred devices simultaneouslyCertificate Based Authentication and Pairing (CBAP) Use certificates to authenticate devices before provisioning, thus saving cost and time. Also, prevents counterfeit devices from being provisioned into the networkSilicon Labs Bluetooth stack supports three modes:Standalone mode: Bluetooth stack and the application run in an EFR32SoC or moduleNetwork Co-Processor mode: Bluetooth stack runs on the EFR32, and the application runs on a separate host MCU. API is exposed over a serial interface such as UART.Radio Co-Processor mode: Link layer of the Bluetooth stack runs on the EFR32, and the Host Layer of the stack, as well as the application runs on a separate host MCU or PC. Link Layer and Host Layer communicate via HCI.Technical ResourcesBluetooth Low Energy xG24 Technical Library Data Sheets, App Notes, and moreBluetooth Low Energy xG21 Technical Library Data Sheets, App Notes, and moreBluetooth Low Energy xG22 Technical Library Data Sheets, App Notes, and moreBluetooth Low Energy xG27 Data ShortBluetooth Low Energy API Documentation Bluetooth Low Energy API documentationSilicon Labs’ Bluetooth Low Energy HW supportHigh Performance device for Bluetooth LE and Bluetooth mesh applications thatrequire advance features and more Flash and RAMIndustry-leading, energyefficient device for Bluetooth LE applicationsOptimized for line-powered devices including LED bulbs, and gateways for Bluetooth LE and Bluetooth meshMost Battery Versatile SoC for Connected Health, Smart Home, Portable Products1536kB Flash 256kB RAM TX power 19.5dBm -105.7dBm @ 125kbps -97.6dBm @ 1Mbit/s -94.8dBm @ 2Mbit/s RX current 4.4mA @ 1MbpsTX current 5.0mA @ 0dBm1.3 µA Sleep current (16kB )Robust peripheral set AI/ML hardware accelerator Secure Vault High QFN40 5x5 (26) QFN48 6x6 (32)512kB Flash 32kB RAM TX power 6dBm -106.7dBm @ 125kbps -98.9dBm @ 1Mbit/s -96.2dBm @ 2Mbit/s RX current 3.6mA @ 1MbpsTX current 4.1mA @ 0dBm1.26µA Sleep current (16kB )Lowest Power Bluetooth LESecure Vault Mid QFN40 5x5 (26) QFN32 4x4 (18) TQFN32 4x4 (18)1024kB Flash 96kB RAM TX power 20dBm -104.9dBm @ 125kbps -97.5dBm @ 1Mbit/s -94.4dBm @ 2Mbit/s RX current 8.8mA @ 1MbpsTX current 9.3mA @ 0dBm+135 Junc. Temperature Secure Vault High Line-Powered Bluetooth LE QFN32 4x4 (20)768kB Flash 64kB RAM TX power 8dBm -106.9dBm @ 125kbps -99.2dBm @ 1Mbit/s -96.3dBm @ 2Mbit/s RX current 3.6mA @ 1Mbps TX current 4.1mA @ 0dBm 1.26µA Sleep current (16kB ) Secure Vault Mid QFN40 5x5 (26) QFN32 4x4 (18) TQFN32 4x4 (18)Bluetooth LE Target Applications• ESL • Medical• Direction Finding • Smart Home • Smart Tags • Sensors • Switches• Building Automation • HVACBluetooth LE Software / ToolsSilicon Labs Bluetooth Low Energy SDK helps you build smooth, reliable, and secure wireless connectivity for your IoT applications. Software and Tools features • Supports Bluetooth™ LE 5.4 • Wi-Fi Coexistence • Simplicity Studio IDE • GATT Configurator • Network Analyzer • Direction Finding Tool Suite • Bluetooth NCP Commander • Proprietary Radio Configurator • Energy Profiler • Tool Chain – GCC and IARLinks: Bluetooth Low Energy SDKLearning CenterReady for Bluetooth 5.4?Learn more about the latest specification Bluetooth Direction FindingBluetooth Location Services: AoA/AoD Why EFR?Silicon Labs EFR32 FeaturesSilicon Labs Secure Vault accreditations Product security certificationsBluetooth SoC and Module Selector Guide Bluetooth Low Energy Selector Guide Case Study: Rethinking Epilepsy Management EFR32 Portable Medical DeviceBluetooth BeaconsBluetooth Beacons and AdvertisingSilicon Labs’ Bluetooth LE Development KitsSilicon Labs’ Bluetooth development kits are divided into three categories based on your development need:• Rapid Prototyping • Proof of Concept• Advanced RF DevelopmentFor more information on the portfolio, check the link: https:///bluetooth-kitsBG22 BG21 BG24 BG27Disclaimer: Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available forsystem and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Ty pical ” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “L ife Support System ” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit /about-us/inclusive-lexicon-projectTrademark InformationSilicon Laboratories Inc.®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, EFM ®, EFM32®, EFR, Ember ®, Energy Micro, Energy Micro logo and combinations thereof, “the world ’s most energy friendly microcontroller s”, Redpine Signals ®, WiSeConnect , n-Link, ThreadArch ®, EZLink ®, EZRadio ®, EZRadioPRO ®, Gecko ®, Gecko OS, Gecko OS Studio, Precision32®, Simplicity Studio ®, Telegesis, the Telegesis Logo ®,USBXpress ®, Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701IoT PortfolioQualitySupport & Community/products/quality/community。

Confidentiality levelProduct version Huawei Technologies Co. Ltd.机密华为技术有限公司产品版本Hi3516C内部公开V100R001C01SPC040Total pages: 共4页Hi3516C V100R001C01SPC040 Version Description DocumentHi3516C V100R001C01SPC040 版本描述文件Date Prepared by 2012-1-18 曾文许吉林日期拟制Date Reviewed by 审核日期Date Approved by 日期批准Huawei Technologies Co., Ltd.华为技术有限公司All rights reserved版权所有侵权必究）PCM04T02 V1.0/ IPD-SE（．levelthe confidentiality Hi3516C V100R001C01SPC040 Version Description Please inputDocument内部公开Hi3516C V100R001C01SPC040 版本描述文件Hi3516C V100R001C01SPC040 Version Description Document版本描述文Hi3516CV100R001C01SPC040件摘要：Abstract正式版本，主要解决了上的uClibcHi3516C V100R001C01SPC040版本为Hi3516C IPCamera 强日光下过曝、图像模糊场景码率过冲等问题，同时增加了部分功一版本的部分问题，如OV9712 IMX122 sensor的支持等。

能，如新增对Hi3518C。

该版本描述文件同样适用于Hi3518A和List of abbreviations 缩略语清单：Abbreviations缩略语Full spelling 英文全名Chinese explanation 中文解释s Kit SDK 'Software Developer软件开发工具包Media Processing Platform MPP 媒体处理平台Internet Protocol Camera IPC 网络摄像机Image Signal Pipeline ISP 图像信号处理Lens Distortion Correction LDC 镜头畸变校正Auto Iris Control AI 自动光圈控制Video Input VI 视频输入Video OutputVO 视频输出Video Process Sub-System VPSS 视频前处理单元Video Encode Unit VEDU 视频编码单元Video Detect AnalyseVDA 视频侦测分析Intelligent Video Engineering IVE 智能加速引擎Presentation Time Stamp PTS 时间戳Double-Data Rate Controller DDRC DDR 控制器Media Memory Zone MMZ 媒体内存区域Region Of Interest ROI 感兴趣区域Wide Dynamic RangeWDR宽动态范围All rights reserved 版权所有，侵权必究Page 2 , Total 5 第2页，共5页levelconfidentiality input the Please Hi3516C V100R001C01SPC040 Version DescriptionDocument内部公开版本描述文件Hi3516C V100R001C01SPC0401Version Information 版本信息Product Prepare date Version name Version number编译日期版本名称所属产品版本号BVTV100R001C01SPC0402012-1-28Hi3516C版本使用限制说明2Restriction to Version Use Timerestriction V100R001C01SPC05版本时间限制Area/site restriction 无地域/局点限制Other restriction 无其他限制条件Condition of versiontermination V100R001C01SPC050版本发布版本终止条件对前一版本所有不足之处的改进3Improvement on All Defects in the Previous Version主要解决了前一个版本中发现的问题，以及部分前期版本的遗留问题。

1Network visualisation software• GridVis ®-Basic (in the scope of supply)3 digital inputs/outputs•Usable as either inputs or outputs•Switch output•Threshold value output •Logic output•Remote via Modbus / ProfibusT emperature measurement •PT100, PT1000, KTY83, KTY84Interfaces •RS485•Ethernet•SNTP •TFTP•BACnet (optional)Networks• T N, T T , IT networks•3 and 4-phase networks•Up to 4 single-phase networksMeasured data memory •256 MB Flash• H armonics up to 40th harmonic •Rotary field components•Distortion factor T HD-U / T HD-I2 analogue inputs • A nalogue, temperature or residual current input (RCM)Residual current measurement BACnet (optional)HomepageAlarm managementMemory 256 MB Ethernet-Modbus gateway2• M easurement, monitoring and checking of electrical characteristics in energy distribution systems • R ecording of load profiles in energy management systems (e.g. ISO 50001)• Acquisition of the energy consumption for cost centre analysis • M easured value transducer for building management systems or PLC (Modbus)• M onitoring of power quality characteristics, e.g. harmonics up to 40th harmonic • R esidual current monitoring (RCM)Areas of applicationMain featuresUniversal meter• O perating current monitoring for general electrical parameters • H igh transparency through a multi-stage and scalable measurement system in the field of energy measurement • A cquisition of events through continuous measurement with 200 ms high resolutionRCM device• C ontinuous monitoring of residual currents (Residual Current Monitor, RCM)• A larming in case a preset threshold fault current reached • N ear-realtime reactions for triggering countermeasures • P ermanent RCM measurement for systems in permanent operation without the opportunity to switch offEnergy measurement device•Continuous acquisition of the energy data and load profiles • E ssential both in relation to energy efficiency and for the safe design of power distribution systemsHarmonics analyser / event recorder• Analysis of individual harmonics for current and voltage •Prevention of production downtimes•Significantly longer service life for equipment • R apid identification and analysis of power quality fluctuations by means of user-friendly tools (GridVis ®)Fig.: UMG 96RM-E with residual current monitoring via measuring inputs I5 / I6Fig.: Event logger: Voltage dip in the low voltage distribution system3Extensive selection of tariffs• 7 tariffs each for effective energy (consumption, delivery and without backstop)• 7 tariffs each for reactive energy (inductive, capacitive and without backstop)•7 tariffs for apparent energy •L1, L2 and L3, for each phaseHighest possible degree of reliability•Continuous leakage current measurement • H istorical data: Long-term monitoring of the residual current allows changes to be identified in good time, e.g. insulation faults•Time characteristics: Recognition of time relationships •Prevention of neutral conductor carryover • R CM threshold values can be optimized for each individual case: Fixed, dynamic and stepped RCM threshold value • M onitoring of the CGP (central ground point) and the sub-distribution panelsAnalysis of fault current events• E vent list with time stamp and values•Presentation of fault currents with characteristic and duration • R eproduction of phase currents during the fault current surge • P resentation of the phase voltages during the fault current surgeAnalysis of the harmonic fault current components•Frequencies of the fault currents (fault type)•Current peaks of the individual frequency components in A and %•Harmonics analysis up to 40th harmonic •Maximum values with real-time bar displayDigital IOs• E xtensive configuration of IOs for intelligent integration, alarmand control tasksFig.: Continuous leakage current measurementFig.: Analysis of fault current eventsFig.: Analysis of the harmonic fault current components4Dimension diagramsAll dimensions in mmSide viewRear viewEthernet (TCP/IP)- / Homepage- / Ethernet-Modbus gateway functionality•Simple integration into the network •More rapid and reliable data transfer •Modern homepage • W orld-wide access to measured values by means of standard web browsers via the device's inbuilt homepage • Access to measurement data via various channels • R eliable saving of measurement data possible over a very long periods of time in the 256 MByte measurement data memory • C onnection of Modbus slave devices via Ethernet-ModbusgatewayFig.: Ethernet-Modbus gateway functionalityMeasuring device homepage• W ebserver on the measuring device, i.e. device's own homepage •Remote operation of the device display via the homepage •Comprehensive measurement data incl. PQ • O nline data directly available via the homepage, historic data optional via the APP measured value monitor, 51.00.246Fig.: Illustration of the online data via the device's inbuilt homepageCut out: 92+0,8 x 92+0,8 mm5Typical connectionDevice overview and technical dataFig.: Connection example residual currentmeasurement and PE monitoringFig.: Connection example with temperature and residual current measurementS2S1S2S2S1S1Digital-Eingänge/Ausgänge UMG 96RM-E (RCM)L1L2L3Spannungsmessung 3456StrommessungVersorgungs-spannung12RS4851617BAB AV e r b r a u c h e r230V/400V 50HzI 41918N282930313233343536Analog-Eingänge13141524V DC K1K2=E t h e r n e t10/100B a s e -TPCK3K4K5==37R J 450-30 mAS2S1I DIFFI 5I 6PT100S1S2S3Gruppe 1Gruppe 2V 1V 2V 3V N N/-L/+2)1)2)2)3)3)3)3)Digital inputs/outputs Power supply voltage Current measurement Measuring voltage Analog inputs L o d s Group 1Group 2Comment:For detailed technical information please refer to the operation manual and the Modbus address list.•= included - = not included *1 Inclusive UL certification.6Fig.: GridVis ®software, configuration menuComment:For detailed technical information please refer to the operation manual and the Modbus address list.• = included - = not included*2 O ptional additional functions with the packages GridVis ®-Professional, GridVis ®-Service and GridVis ®-Ultimate.7Fig.: RCM configuration, e.g. dynamicthreshold value formation, for load-dependent threshold value adaptationFig.: Summation current transformer for the acquisition of residual currents. Wide range with different configurations and sizes allow use in almost all applicationsMeasurement surge voltage Power consumption Overload for 1 sec.Sampling frequency per channel (50 / 60 Hz)Residual current inputAnalogue inputsMeasurement range, residual current input*Digital outputsSwitching voltage Switching current Response timePulse output (energy pulse)Comment:For detailed technical information please refer to the operation manual and the Modbus address list.•= included - = not included*3 E xample of residual current input 30 mA with 600/1 residual current transformer: 600 x 30 mA = 18,000 mA *4A ccurate device dimensions can be found in the operation manual.8Comment:For detailed technical information please refer to the operation manual and the Modbus address list.• = included - = not included。

HD356 Service PartsThis parts list contains the service parts for theHD356 dispenser.Use caution when ordering parts.Double-checkthe model number to be certain that the partsordered are the ones for that machine.Table Of Contents Panels..............................................Page 2Cabinet.............................................Page 3Lower Cabinet Parts......................................Page 4Hopper and Rotor........................................Page 5Dispensing Components....................................Page 6Gear Drive............................................Page 7Control Box...........................................Page 8Coin and Card Mechanisms..................................Page 9Wiring Diagrams.......................................Page 1012123456789866461110Item Part Number Number Description102-3773-01Push button switch 2KCARD Card kit 302-3114-01Coin mech 403-1531-01Screw5A32625-015Grey upper front panel A32625-002SS upper front panel 603-1638-03Screw 712-1276-01Switch 803-1419-28Screw9A32620-015Grey panel, bottom A32620-002SS panel,bottom 10A32622-015Grey left side panel A32622-002SS left side panel - A series A37638-001SS left side panel - C seriesItem Part Number Number Description 1112-0629-01Strain relief12A37393-015Grey right side panel for coin or card kit A37393-002SS right side panel for coin or card kit - A series A37637-001SS right side panel for coin or card kit - C series A37393-016Grey right side panel for button only A series A37393-003SS right side panel for button only A series A37637-002SS right side panel for button,C series 13A34726-015Grey back panel A34726-015SS back panel131014Lube Here17Item 1202-3839-01Top panel, for C series 3A25377-001Shield 403-1407-07Washer 502-2097-01Spring 613-0876-01Bumper 703-1539-03Retainer 8A36487-001Bar 903-1407-02Washer1017-2604-01Button disp.decal 1102-3018-01Grill 1202-3137-01Track13KIB200Optional ice baffle kit 1402-1994-20Dispensing hood &label 15A23674-001Return assemblyItemPart Number Number Description 1602-1995-01Ice chute gate 1703-1651-01Nut 18A35618-001Lock Kit 02-3263-01Key 1902-2901-04Sink20no number Latch,part of item 182103-0727-09Thumb screw 22A32818-001Side bracket 23A32817-001Rear bracket 2417-2598-02Bottom label 2517-2598-01Top label 26KLP7Leg kit (4 legs)24Item Part Number Number Description 103-1645-01Screw 2A32616-015Brace 3A34727-015Base4A38021-001Drain pan & fitting 512-2333-2150 Hz transformer 603-0571-00Screw 7A32617-015Bin support left 8A32617-016Bin support right 9A35416-001Drain chute 10A35542-001Dam screen 1102-3692-21Drain fitting 12A33203-001Drain tube 02-2814-08Hose clamp8112346171251112910Lower Cabinet Parts23459810Ins.Ins.Ins.111213141516171819Ins.2021Ins.Ins.Ins.761Item Part Number Number Description 1A37380-001Rotor channel 202-3221-01Rotor nut 302-3768-01Drive block 4A37343-002Rotor 503-1725-01Washer 603-1403-72Screw 703-1417-09Washer802-3754-20Shaft and housing 902-2809-01Drain top 1013-0617-11O ring 1102-2911-02Storage binItem Part Number Number Description 1203-1645-01Screw 13A32653-015Grey retainer 1412-2175-01Terminal block 1503-1404-13Screw16A32644-015Gear motor support 1715-0575-01Coupling 18A28155-021Gear and motor 1903-1406-12Hex nut 2003-1410-05Lockwasher 2102-2692-01DrainHopper and Rotor12345643217891011121315141617182019Item Part Number Number Description 103-1516-01Retaining ring 202-2026-01Cup closure 303-1408-27Special washer 402-2027-01Flinger 502-2186-01Bearing cup 02-2186-02Bearing cone 602-3754-20Bearing Housing,includes shaft and coupling702-3757-20Shaft and coupling kit 803-1410-04Lockwasher 903-1405-15Screw10A29732-001Bracket,double cam 1103-1403-18Screw12*A37852-001Cam #2,bottom -by case 13A29733-001Spacer 14*A37851-001Cam (top)all 1503-1410-07Lockwasher 1603-1406-03Nut 1703-1410-03Lockwasher1803-1405-03Screw 1903-1403-09Screw 2012-2365-01Cam switch 2103-0886-00Speed nut*Replace items 12 and 14 as a set in HD356s built prior to date code 05R.26Dispensing Components520Gear DriveItem PartNumber Number Description02-1503-00Grease Seal (2)03-1408-21Washer03-1408-04Washer02-2446-01Output shaft03-1515-03Retaining ring03-1602-01Woodruff key02-2444-01Output gear02-1505-00O-Ring03-0774-11Roll pinA28167-001Gear case assembly03-1408-39Washer03-1408-40Washer shim02-2441-01Second gear, third pinion03-1408-01Washer03-1408-38Washer02-2448-01First gear,second pinionA28189-001Gear box cover02-1504-00Grease seal02-1501-00Bearing03-1408-08WasherA28160-002Rotor assembly12-2036-01Stator (115/60/1)A28168-001Cooling fanA38487-020Motor housingA28155-021Complete gear Motorwithout cams or bracket.18-3701-01CapacitorofGear casecapacity is 12 oz.123Item Part Number Number Description 112-1213-10Snap bushing 203-1531-08Screw 312-2114-01Terminal strip 412-2090-02Relay512-2836-01Transformer 115 to 24612-2631-01Recycling timer 803-1404-14Screw 912-0426-01Toggle switch10A35398-015Control box cover (not shown)Control Box86253417HD356 Service PartsItem Part Number Number Description102-3114-20Lock kit (includes key &lock)202-3114-21Coin return kit (solenoid)302-3114-22Cash box 402-3114-23Coin switch 517-2614-01LabelItem Part Number Number Description 1A29708-003Cover plate,SS A29708-015Cover plate,Grey 212-2450-01Microswitch 317-2144-01LabelCoin and Card Mechanisms02-3114-01 -Complete coin mechKCARDRelay Box for Coin Mechanism ModelsI tem Part Number Number Description 1No number Relay box 212-0876-00Cam switch 312-2090-02Relay 412-2175-01Terminal block 503-1403-08Screw 612-1213-10Bushing 712-0426-01Switch 812-2187-02Plug & harnessTIMER321RELAY C VEND SWITCHABCAM SWITCH #1TRANSFORMER74RELAY C NLMASTER SWITCH69RELAY C RUNCAPACITORGEAR MOTORDOOR SAFETY SWITCHSchematic Diagram - Button DispensingWiring Diagram- Button DispensingUSE COPPER CONDUCTORS ONLY THIS UNIT MUST BE GROUNDEDTRANSFORMERNLMASTER SWITCH69RELAY C DOOR SAFETY SWITCHRUNCAPACITORGEAR MOTORBARELAY D 9674FREE VENDRELAY D RELAY D COIN SWITCHCAM SWITCH #2EMPTY LIGHTCOIN BLOCK23165BARELAY C 123TIMER74RELAY CCAM SWITCH #1VEND SWITCHSchematic Diagram - Coin VendingWiring Diagram-Coin VendingTHIS UNIT MUST BE GROUNDEDDOOR SAFETY SWITCHGEAR MOTORRUNCAPACITORRELAY C 96MASTER SWITCHLNTRANSFORMERRELAY C 47CAM SWITCH #1BACARD SWITCHRELAY C 123TIMERVEND SWITCHSchematic Diagram - Card VendingWiring Diagram -Card VendingUSE COPPER CONDUCTORS ONLY50 Hz Wiring and Schematic Diagram。

MICROWAVE CORPORATION MIXERS-CHIP5HMC265v01.0701General Description Features Functional Diagram Integrated LO Amplifi er: -4 dBm Input Sub-Harmonically Pumped (x2) LO Integrated IF Amplifi er: 3 dB Gain Small Size: 1.32mm x 1.32mm Electrical Specifi cations, T A = +25° C, LO Drive = -4 dBm Typical Applications The HMC265 is ideal for:• Microwave Point to Point Radios • LMDS • SA TCOM The HMC265 chip is a sub-harmonically pumped (x2) MMIC downconverter with integrated LO & IF amplifi ers. The chip utilizes a GaAs PHEMT tech-nology that results in a small overall chip area of 1.74 mm 2. The 2LO to RF isolation is excellent eliminating the need for additional fi ltering. The LO amplifi er is a single bias (+3V to +4V) two stage design with only -4 dBm nominal drive requirement. All data is with the chip in a 50 ohm test fi xture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils). This downconverter IC is an excellent, smaller, and more reliable replacement to hybrid diode based downconverter MMIC assemblies.GaAs MMIC SUB-HARMONICALL Y PUMPED DOWNCONVERTER, 20 - 32 GHz Parameter IF = 1 GHz Vdd = +4V IF = 1 GHz Vdd = +4V Units Min.Typ.Max.Min.Typ.Max.Frequency Range, RF 20 - 3227 - 30GHz Frequency Range, LO 10 - 1613.5 - 15GHz Frequency Range, IF 0.7 - 3.00.7 - 3.0GHz Conversion Gain (RF to IF)-237-225dB Noise Figure (SSB)1313dB 2LO to RF Isolation 1720 ~ 402835dB 2LO to IF Isolation 4050 ~ 604555dB IP3 (Input)210913dBm 1 dB Compression (Input)-52-22dBm Supply Current (Idd)5050mA 查询HMC265供应商M I X E R S - C H I P 5-20-15-10-50510182022242628303234C O N V E R S I O N G A I N (d B )RF FREQUENCY (GHz)182022242628303234RF FREQUENCY (GHz)Conversion Gain vs. Temperature @ LO = -4 dBm Vdd = +4V -20-15-10-50510C O N V E R S I O N G A I N (d B )-70-60-50-40-30-20-10010182022242628303234I S OL A T IO N (d B )RF FREQUENCY (GHz)182022242628303234RF FREQUENCY (GHz)Conversion Gain vs. Temperature @ LO = -4 dBm Vdd = +3VConversion Gain vs. LO Drive @ Vdd = +4V Conversion Gain vs. LO Drive@ Vdd = +3VPUMPED DOWNCONVERTER, 20 - 32 GHz502468101214161820182022242628303234T H I R D O R D E R I N T E R C E P T (d B m )RF FREQUENCY (GHz)182022242628303234RF FREQUENCY (GHz)IP3 vs. LO Drive @ Vdd = +4V IP3 vs. Temperature @ LO = -4 dBm, Vdd = +4V LO & RF Return Loss@ LO = -4 dBm, Vdd = +4V -20-15-10-500510152025303540R ETU R NLO S S (d B )FREQUENCY (GHz)PUMPED DOWNCONVERTER, 20 - 32 GHz IF Return Loss @ LO = -4 dBm, Vdd = +4V P1dB vs. Temperature@ LO = -4 dBm, Vdd = +4V IF Bandwidth @ LO = -4 dBm-20-15-10-500123456R ET UR NL OSS(dB )FREQUENCY (GHz)-5-4-3-2-10123182022242628303234P 1dB (d B m )RF FREQUENCY (GHz)0123456IF FREQUENCY (GHz)M I X E R S -C H I P 5Outline Drawing (See Handling Mounting Bonding Note)Absolute Maximum RatingsPUMPED DOWNCONVERTER, 20 - 32 GHzNOTES:1. ALL DIMENSIONS ARE IN INCHES [MM].2. DIE THICKNESS IS .004”.3. TYPICAL BOND P AD IS .004” SQUARE.4. BOND P AD SPACING CENTER TOCENTER IS .006”.5. BACKSIDE MET ALLIZA TION: GOLD.6. BOND P AD MET ALLIZA TION: GOLD.7. BACKSIDE MET AL IS GROUND.8. CONNECTION NOT REQUIRED FORUNLABELED BOND PADS.5MIC Assembly Techniques Mounting & Bonding Techiniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note).50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin fi lm substrates are recommended for bringing RF to and from the chip (Figure 1). If0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die shouldbe raised 0.150mm (6 mils) so that the surface of the die is coplanar with thesurface of the substrate. One way to accomplish this is to attach the 0.102mm(4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2).Microstrip substrates should be brought as close to the die as possible in orderto minimize bond wire length. Typical die-to-substrate spacing is 0.076mm (3mils).An RF bypass capacitor should be used on the Vdd input. A 100 pF single layercapacitor (mounted eutectically or by conductive epoxy) placed no further than0.762mm (30 mils) from the chip is recommended. The photo in fi gure 3 shows atypical assembly for the HMC265 MMIC chip.PUMPED DOWNCONVERTER, 20 - 32 GHz Figure 3:Typical HMC265 AssemblyM I X E R S - C H I P 5PUMPED DOWNCONVERTER, 20 - 32 GHzHandling PrecautionsFollow these precautions to avoid permanent damage.Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up.General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fi ngers.MountingThe chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and fl at.Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment.Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fi llet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.Wire BondingBall or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).。