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Solder Heat resistance--Solder Dip焊锡耐热性

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TEST REPORT
Reliability Laboratory Report No.: HAXXXX/20XX
Page: 1 of 4 Date: April 9, 20XX
Signed for and on behalf of SGS TAIWAN Ltd.
Terence Hsieh
Asst. Manager
Client title
Client address
The following merchandise was submitted and identified by the vendor as: Product Description: sample description (EX connector, resistor…..) Style/Item No.: Style(model)/ No.1~No.5 Manufacturer/Vendor: Client title Quantity:
Total 5 piece(s) Testing Period: Apr. 6, 20XX to Apr. 6, 20XX
We have tested the submitted sample(s) as requested and the following results were obtained: Test Required ： (According to client’s test specification, please see following sheets in detail.)
1. Resistance to Soldering Heat Test
Test Results:
- PLEASE SEE ATTACHED SHEETS -
TEST REPORT
Reliability Laboratory Report No.: HAXXXX/20XX
Page: 2 of 4 1. Resistance to Soldering Heat by Solder Dip: Test Equipment:
Name Brand Model Serial No.
Solderability Tester Multicore MUST II PLUS 9652 Materials:
Name Brand Designation Chemical Composition
Solder SENJU M705E Sn/3.0Ag/0.5Cu
Flux Sharemate SM/NA (Unactivated)25 wt% of Colophony in 75wt% of 2-propanol
Lab Environmental Conditions: Ambient temperature: 25±3℃
Relative humidity: 55±20%RH
Test Method/ Specification:
Test Method: Reference to MIL-STD-202G Method 210F Condition B
Sample Condition: See below item marked “●”,
● As-received condition Specimen shall be cleaned (Immersed in a neutral organic solvent at room temperature and dried in air)
Type of Flux: Unactivated
Solder Composition: Sn/3.0Ag/0.5Cu
Test Temperature: 260±5℃ Immersion Angle: 90 o
Immersion/Emersion Rate: 25±6 mm/s
Immersion Depth: Terminations shall be immersed to within 1.27 mm of the component body
or to the seating plane (whichever is further from the component body)
Dwell Time: 10±1 seconds
* Leads should be immersed in the flux for 5 to 10 seconds before soldering. * If flux used, all leads shall have all visible flux residues removed by alcohol before examination.
Number of Heat Cycles: 1 time(s)
Test Requirement: Examine the appearance of specimens visually before and after this test.
Note: The component shall be placed on the FR-4 mounting board during test.
TEST REPORT
Reliability Laboratory Report No.: HAXXXX/20XX
Page: 3 of 4 Specimen:
Style/Item No.:
Style(model)/ No.1~No.5 Quantity: Total 5 piece(s) Test Result:
TEST REPORT
Reliability Laboratory Report No.: HAXXXX/20XX
Page: 4 of 4 Test Photos:
1. Appearance of specimen-- (Style(model))
2. Testing area of specimen
3. Resistance to Soldering Heat by Solder Dip
4. Resistance to Soldering Heat by Solder Dip
5. Final Inspection-- Resistance to Soldering Heat by Solder Dip
6. Final Inspection--
Resistance to Soldering Heat by Solder Dip ─ ─ ─ The End of Test Report ─ ─ ─。

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无铅化电子产品可靠度试验

无铅化电子产品可靠度试验


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Time in Minutes
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電子產品無鉛化會遇到什麼問題？
料件耐熱溫度須提升 表面處理變更：沾錫性、相容性及可靠度須 行評估
焊錫材料標準化、疲勞耐久及可靠 度須行評估
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選擇合適的電路板材
Peak：260℃
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3℃ ～ 6℃/s
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Heating Time
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电位器规格书

电位器规格书

制 订核 准业 务 部确 认 人核 准采 购 部Development Approved MarketingDept Confirmed by Approved Purchasing Dept结果判定：Judge outcome 结果判定：Judge outcomeity Guangdong Province制定日期（Date prepared）:客户料号（Customer NO ）:产品名称（Product Name ）:产品型号（Product Type ）:Customer's Approval旋转式电位器客户名称（Customer Name）:产 品 规 格 书Product Specification Report产品系列 NO:公司名称 CO. Name:型号名称 Model Name:Max. Operation Voltage最高工作电压■10,000 □Other (Cycles Min.)核 准ApprovedRotational Life 旋转寿命Solder dip:浸锡Preheating condition: Surface temperature of thesubstrate shall be settled within 100℃ in one min.预热: 基板表面温度100℃以下，1分钟内。

Solder temperature 200±5℃for 5 sec.焊锡温度260±5℃，5秒。

Resistance to soldering heat 焊锡耐热性审 核Q.I.Department 制 表Design Manual Soldering: Less than 300℃ and quicker than 3seconds. (手焊: 300℃以下，3秒以內)0.8 Kgf.cm Min. -40dB ~0dB＜3dB;Withstand Voltage 耐电压特性Rotation Stopper Strength旋转止动强度Push-Pull Strength 旋钮推拉承受强度Rotation Torque 旋转力矩20 ~ 50 gf.cm Gang Error (Dual Unit) 同步误差值Less than _10_ ΩPull: 0.2Kg.f Max. Push: 0.5Kg.f Max. at 10 sec1 minute at AC 100 V 270° ±5 °MECHANICAL CHARACTERISTICS 机械特性:Residual Resistance残留阻抗值Total Rotation Angle 全回转角度Rated Power 额定功率■Linear Taper B : 0.05 W □Other Tapers: 0.025 W Less than 100 mV POTENTIOMETER SPECIFICATIONSELECTRICAL CHARACTERISTICS电气特性:规 格 书印章区AC 50 V，DC 12 V Total Resistance 全阻值□A，■B，□C，□D，□E，□MN，□RD，□W，□____ More than 100 MΩ at DC 100 V 10K Ω±20%Resistance Taper 阻抗特性型式Sliding Noise 滑动噪声Insulation Resistance 绝缘阻抗值。

焊接相关的英语术语

焊接相关的英语术语

焊接相关的英语术语以下是我⾃⼰搜集汇总的，如有错误，还望指正！false soldering "假焊"poor soldering（个⼈建议）“虚焊”=焊接得不够牢固不够好cold solder "冷焊"poor-wetting "润湿不良"insufficient solder "少錫"open solder "开路"unsoldering 拆焊假焊是指焊点表⾯上好像焊接成功，但实际上并没有焊住，有时⽤⼿⼀拨，引线就可以从焊接点中拨出。

关键字：没有焊住。

虚焊是焊点处只有少量的锡焊柱，造成接触不良，时通时断。

关键字：接触不良。

可以理解为：假焊实际是没有焊上去，器件不能使⽤，⽽虚焊是焊接的不牢靠，会出现接触不良时好时坏的情况。

补充⼀些：空焊是焊点应焊⽽未焊。

锡膏太少、零件本⾝问题、置件位置、印锡后放置时间过长等会造成空焊。

关键字：空的。

冷焊是在零件的吃锡接⼝没有形成吃锡带，（即焊锡不良）。

流焊温度太低、流焊时间太短、吃锡性问题等会造成冷焊。

关键字：温度不够，“冷”嘛！“虚焊”的英语表达：I support the answer "poor soldering", "cold soldering" should be another defect mode. I think "cold soldering" should be caused by low peak temperature or short reflow time, the solder paste doesn't melt well at peak temperature. but " poor soldering" is mainly cuased by oxidation. the surface ot the component termination or PCB is oxidized, so although the solder paste is melt, but the flux is not enough to remove the oxid. ---但本编辑认为poor soldering其实还是可以的。

EC11 资料

EC11 资料

Chattiring t1,t3≤5mS.Bounce t2≤3mS.Detent feeling has to remains Contact resistance 200ΩMax all items is shall be for 1.5H,After which measurements shall be made.all items is shall be all items is shall be Application time of soldering iron:within 3S solder shall cover75% minimum of the surface being immersed.所有项应满足初期规格。

be subjected to standard atmospheric conditions Specifications in clause 所有项应满足初期规格温度40±2℃,湿度90～95%的恒温恒湿槽中放置96±4atmospheric conditions for 1.5H,After which 温度-40±3℃的恒温箱中放置96±4小时,then the encoder.shall be subjected to standard satisfied.mechanical abnormality.不得有绝缘体的破损、变形、Electrical characteristics 常温、常湿放置1.5小时后测试.The encoder shall be stored at a temperature of -40±3℃for 96±4H in a thermostatic chamber.And 所有项应满足初期规格。

Specifications in clause 小时后,在常温、常湿中放置1.5小时后测试. The 温度85±3℃的恒温箱中放置96±4小时,satisfied.in a thermostatic chamber.And the encoder shall with relative humidity of 90% to95% for96±4H encoder shall be stored at temperature of40 ±2℃ Specifications in clause 85±3℃for 96±4H in a thermostatic chamber.And The encoder shall be stored at a temperature of satisfied.then the encoder.shall be subjected to standard 常温、常湿放置1.5小时后测试.atmospheric conditions for 1.5H,After which 温度300℃以下,时间3秒以内.端子在260℃±5℃温度的焊锡槽内浸锡3秒±0.5秒.measurements shall be made. 预热:基板表面温度100℃以下,时间1分钟以内.Printed wiring board:single-sided copper clad 焊接:温度260±5℃或以下,时间3秒以内.Preheating:1.Surface temperature of board:100℃. heator less 2.Preheating time:within 1 minute.shall be satisfied No 接触无异常.Soldering:Solder temperature:260±5℃ or less Bit temperature of soldering iron:300℃less than Immersion time:within 3S 手焊 Manual soldering. 7-6.焊锡性浸渍面须有75%以上焊锡附着at 260℃for 3S±0.5S.Solderability The terminals shall be immersed into solder bath A new uniform coating of EC11 REVERSE DIRECTION SERIES SPECIFICATION600～1000cycles/H without electrical load,after with 在无负荷条件下轴以600～1000周/小时速度回转，端子间接触阻抗200Ω以下■在力矩≤100gf.cm时30,000±200周 7-3.耐热性 7-2.耐湿性 Damp heatmeasurements shall be made.Resistance Cold7-4.低温特性一日连续5000～8000次.laminate board with thickness of 1.6mm.使用基板:t=1.6mm的单面覆铜板.槽焊 Dip soldering.7-5.焊锡耐热性 to Soldering Dry heat7 耐久性能 Endurance CharacteristicsRotationallifeCONDITIONSITEM条件(5000 to 8000 continuous cycles for 24 hours.）7-1.回转寿命项目振荡 t1,t3≤5mS.突跳 t2≤3mS.SPECIFICATIONS15,000±200cycles per above 100gf.cm.规格The shaft of encoder shall be rotated at a speed of measurements shall be made.尚余有轻微定位感.30,000±200cycles per below 100gf.cm.□在力矩＞100gf.cm时15,000±200周.≤100mΩ100mΩor lessPush 1Kgf to the shaft of encoder in the axial4-1.按压寿命 Push-life修订 Revision日期 Date 经　办 Designed审　核 Check批　准 Approved初始发行2011-1-4版本 VERSION：A0≤10mS10mS or less 在端子和安装板间施加AC300V电压1分钟A voltage of300V AC shall be applied for 1 minute 用DC 5V 1mA 电压测定.which a voltage of 250V DC is applied between Rated voltage:DC 5VNote：The following specification is only suitable for the one type with switch construction of RE11 encoder series.1.额定值 Rating2-1.接触电阻 2.电气性能 Electrical Characteristics条件规格1-2.最大额定电流 (阻抗负载)Measurement shall be made under the condition 在端子和安装板间施加电压 250V DC.100MΩ 以上100MΩ Min SPECIFICATIONSMaximum operating current (resistive load):10mA MaxITEMCONDITIONS1-1.额定电压推动开关部分Push Switch Portion备注：以下规格适用于RE11编码器带开关系列.项目不得有绝缘破坏Without arcing or breakdown.3 机械性能 M echanical Characteristicsbetween individual terminals and bushing and plank.EC11 REVERSE DIRECTION SERIES SPECIFICATION4 耐久性能 Endurance Characteristicsfore of switch Single pole and single throw （push ON）单极单投(按压ON)接点数Switch circuit and ■0.5±0.3 mm □1.5±0.5 mm3-2.开关动作力 Operation 500±200gf Push static load to the shaft in the axial directionTravel of switchVoltage test at DC 5V 1mA.2-2.绝缘阻抗 Insulation number of pulse individual terminals and bushing and plank.以1秒钟1往返(OFF-ON-OFF)按压动作.Shaft shall be push at 1 cycles/s(OFF-ON-OFF) resistance Contact 2-3.振荡 Bouncing resistance 3-1.开关电路 2-4.耐电压 Dielectric strength 在轴端，沿轴向施加的按压力.3-3.开关移动量的速度按压。