MTSC thermal seminar_master2

FLIR T650sc / T630scPortable Thermal Imaging CamerasThe T650sc / T630sc Series infrared cameras offer thermal and visual imagery, spot size resolution, and reliable temperature measurementaccuracy—all at an affordable cost. Technicians, engineers, and scientists will appreciate features including a built-in digital camera, voice annotation, laser target locator, GPS, and much more. The tiltable IR unit gives you great flexibility and allows you to conduct your experiments fast and in a comfortable position.EXCELLENT IMAGE QUALITY AND THERMAL SENSITIVITYThe T650sc / T630sc cameras are equipped with an uncooled Vanadioum Oxide (VoX) microbolometer detector that produces thermal images of 640 x480 Pixels. They generate crisp and clear detailed images that are easy to interpret, resulting in reliable imaging with high accuracy.TOUCH SCREENThe high quality LCD touch screen presents sharp and bright images and brings interactivity and user comfort to a new level. In combination with the large backlit buttons and joystick the cameras are very easy to use.RADIOMETRIC RECORDINGThe T650sc / T630sc allow for full dynamic video streaming to a PC using USB or to mobile devices using Wi-Fi. They can also create visual and thermal non radiometric MPEG-4 video files. The T650sc can record radiometric IR sequences in real-time directly on the camera. These sequences contain all temperature data and can be post analyzed during playback on the camera or PC.RICH FEATURE SETThe T650sc / T630sc come with features like Multi Spectral Dynamic Imaging (MSX), UltraMax™ image enhancement, auto-image rotation, image sketch and autofocus. They are equipped with Auto Hot/Cold Spot & Audible/Visual Alarms. On-screen emissivity tables, up to 5 temperature measurement spots, and Delta T functionality mean you can quickly acquire and easily compare temperature data.SOFTWAREFLIR T650sc / T630sc cameras work seamlessly together with FLIRResearchIR Max software enabling intuitive viewing, recording and advanced processing of the thermal data provided by the camera.MATHWORKS® MATLAB Control the T650sc / T630sc and capture data directly into MathWorks ® MATLAB software for advanced image analysis and enhancement.KEY FEATURES• Thermal and visual camera• VoX uncooled microbolometer: 640 x 480 pixels • Accuracy of +/- 1 °C• Multi-spectral dynamic imaging (MSX)• Ultramax for up to 1.2 mp thermal resolution• Software includedThermal image without MSX. MSX allows seeing even more detail on the thermal image.Thermal image without MSX.Imaging Specifications NASDAQ: FLIRPORTLANDCorporate Headquarters FLIR Systems, Inc.27700 SW Parkway Ave.Wilsonville, OR 97070USAPH: +1 866.477.3687BELGIUMFLIR Systems Trading Belgium BVBALuxemburgstraat 22321 Meer BelgiumPH: +32 (0) 3665 5100SWEDENFLIR Systems AB Antennvägen 6, PO Box 7376SE-187 66 Täby SwedenPH: +46 (0)8 753 25 00NASHUAFLIR Systems, Inc.9 Townsend West Nashua, NH 06063USAPH: +1 603.324.7611UKFLIR Systems UK 2 Kings Hill Avenue Kings HillWest Malling - Kent ME19 4AQUnited KingdomPH: +44 (0)1732 220 011Specifications are subject to change without notice©Copyright 2014, FLIR Systems, Inc. All other brand and product names are trademarks of their respective owners. The images displayed may not be representative of the actual resolution of the camera shown. Images forillustrative purposes only. (Updated 05/15)。

User ManualRev CPenn Photon Devices, LLC 1055 Mensch Dam Road Pennsburg, PA 18073, USATel: (011) 267-923-8798Table of Contents1Introduction (3)2Safety (3)2.1Explanation of labels (4)3System Overview (5)4Setup (6)4.1System Components (6)4.2Choosing a Location (6)4.3Connecting the Power Cord (6)5Operation (7)5.1Setup (7)5.2Performing a Photoredox Cycle (9)5.3Termination, Turning the Unit “Off” (11)6System Information (12)7Proper Care and Handling (12)7.1Cleaning, Disinfection, and Disposal (12)8Maintenance (12)9Technical Data (13)10Product Ratings (14)1IntroductionThe Photoreactor m2 is a benchtop instrument designed for chemists and researchers to accelerate chemical reactions using photoredox catalysis. The Photoreactor m2 combines LED illumination, mechanical stirring and cooling in one device. The user defined parameters of temperature, intensity, stir rate and time, creates a valuable tool for repeatability, traceability, efficiency and consistency of results. The Photoreactor m2 addresses the potential to streamline synthetic sequences, and create valuable strategies for addressing some of the challenges of molecule construction in drug discovery.Key Features:•Photoreactor m2 is a complete benchtop instrument to accelerate photoredox catalysis •Modular design allows for use with a variety of wavelengths from 365nm to 450nm•360 degree reflective environment maximizes surface area photon capture•Light shield interlock prevents user exposure to harmful light rays•Interactive touch screen controls reaction parameters•Intertek ETL, CE, and CB approved•User defined parameters including temperature, light intensity, fan speed and stirring•Auto stop, pause and reset options•Supports vial sizes gc, 4, 8, 20, 40 ml•Temp feedback using a k-type thermocouple2SafetyPrior to use, the operator should thoroughly read the instructions for use. Using this device without reading and understanding the instructions for use may result in operator injury or damage to the equipment.The device contains a powerful LED that produces extremely bright light. Do not look into the back end of the device when the LED is activated as this may result in eye damage.Only use the device with approved accessories. Proper care must be taken during setup and operation to prevent injury to operators and other personnel or damage to the unit.The unit is equipped with multiple safety features including an interlock device that will not permit LED emission when the light shield is not in place. Keep magnets away from the device to prevent accidental interlock activation.The Illuminator unit requires adequate airflow to maintain proper cooling. Ensure the ventilation holes and bottom of the unit are unobstructed and a minimum of 4” clearance is provide d in rear of unit. If the Illuminator is used in a manner not specified within this manual, the protection provided by the equipment might be impaired. It is theresponsibility ofthe userto followallapplicablesafety guidelines in prevention of injury or damageto the unit.Use of the equipment with an unapproved powersupply may cause damage to the device and/or powersupply and may result in injury.It is the responsibility of the user to assess and mitigateany hazards that may result from a mixinginterruption.It is the responsibility of the user to assess and mitigateany hazards that may result from mixing volatile orflammable materials. Users shall comply with allapplicable safety and accident-prevention proceduresfor laboratory work.Device intended for a variety of chemical reactions;Device to be used by trained operator in a laboratorysetting.Operation of multiple devices simultaneously in asingle enclosed area may require ear protection Explanation of labelsManufacturer.Caution – Read User Manual.3System OverviewLight Shield ReflectorVial Holder4SetupSystem ComponentsThe Photoreactor m2 is comprised of the following components:▪Base Unit▪450nm LED Module*▪8ml Reflector▪40ml Reflector▪gc Vial Holder▪4ml Vial Holder▪8ml Vial Holder▪20ml/40ml Vial Holder▪Power Supply▪Power Cable*420nm and 365nm wavelength LED modules are separately availableChoosing a LocationSet the Photoreactor m2 horizontally on its four neoprene feet on a flat surface in a place that allows for adequate air ventilation on the back and bottom. Do not place the Photoreactor m2 on top of paper or loose material that may be drawn into any ventilation port. Do not position the unit so that the back of the unit is obstructed. The Photoreactor m2 should only be transported in the horizontal position.NOTE: For adequate ventilation, maintain at least 4” of clearance around all sides of the unit in an unenclosed space.Connecting the Power CordInsert the power supply receptacle-end into the receptacle on the side of the unit. Insert the power cord plug into a standard AC outlet.Warning: To avoid risk of electric shock, thisequipment must only be connected to a supply mainswith a protective earth.The unit must be powered with the supplied power supply (85-264V, 50/60 Hz, Full Range).5OperationSetupOnce the power cord is connected set the ON/OFF (I/O) switch to the ON (I) position.Add the contents to vial with appropriately sized stir bar (if required) and insert into the vialholder. (Note: select the vial holder that corresponds to the correct vial size and ensure that it is fully seated).Insert the vial holder into the corresponding reflector and ensure that the vial is still fully seated and is roughly concentric to the reflector.With the light shield in the open position, select the desired LED module and insert it into the base unit, being careful to properly align the connector pins.Insert the reflector into the LED module by aligning the tabs with the slots and turning thereflector until it stops.If temperature monitoring or control is desired, connect a K-type thermocouple to the K-type connector. Pass the thermocouple through the opening at the rear of the light shield (seebelow) and place the distal end within the vial or at the desired location.Lower the light shield and verify that the interlock is engaged by ensuring that t he “Interlock”indicator is green on the touch screen.NOTE: Please note that the viscosity of the stirred material will affect theability of the stir bar to remain coupled to the rotating magnet.Materials of high viscosity must be stirred at slower speed settings.Warning: Magnetic stirring cannot be achieved with all combinations of stir bars, reflectors, vial holders, and vials. It is recommended that the user select the reflector (8ml or 40ml), which minimizes the distance from the bottom of the vial to the LED module. The user must determine the appropriate combination of stir bar, reflector, vial holder and vial to optimize magnetic stirring.Power SupplyReceptaclePower SwitchK-type connectorUSB ReceptacleWarning: To avoid damage to the device, ensure the thermocouple does not come into contact with anymoving parts, i.e. stir magnet, motor or fanThermocouple pathPerforming a Photoredox CycleThe user interface (GUI) initiates on the main display (shown left). The device is configured with the following default settings.• Duration (HH:MM:SS) is 01:00:00 • Post-cool duration (MM:SS) is 00:30 • LED intensity (%) is 50• Fan Control is set to Manual • Fan (rpm) is set to 6800 (Max) • Stir(rpm) is 100 (Min)To operate the device with the default settings, simply press “Start”.To customize set points press “Change Settings” on the main display. The user interface opens the settings screen (shown left) The following set points can be customized. • Duration (HH:MM:SS) up to 99:99:99 • LED intensity (%) – 1% to 100%• Post-cool duration (MM:SS) - 00:00 to 59:59 • Stir(rpm) – 100 to 2000• Fan Control – Manual / Auto• Manual Fan (rpm) – 2800 to 6800*• Auto Fan/Temperature Control (Temp (C) – 0 to 50 When the Fan Control is set to Auto, the Fan (rpm) will dynamically change to maintain the target temperature setpoint.Ensure Thermocouple is in vial while operating in auto fan modeTo change the set point of agiven parameter select it on thetouch screen. This will provide adisplay corresponding to theparameter you have chosen asshown on the right. The dialmay be rotated to select thedesired setting. Alternatively,pressing the “KEY” button willallow the user to enter an exactvalue. Pressing the “DONE”button will accept the value.Once the parameters have been set, press “Done” on the Change Settings screen to return to the main display.Press “Start” to begin.All values may be edited at any time during operation.The unit will begin a 10 second precooling cycle as indicated by the Status field. The reported time will show the countdown from 10 seconds. The fan and stir motor will start and the actual RPMs will be displayed. RPM values are expected to deviate slightly from the set values. At this point, all values can still be edited by changing the parameters as described above. Changes in set-points will take effect as soon as the “DONE” button is pressed on the dial or keypad screens, with the exception of the LED as it will not be emitting at this point.Once the precooling countdown reaches 0, the LED will activate at the set intensity. The Status will update to running. The count will start from the duration set value.Note: If the duration set value is edited during operation to a value less than the elapsed time, the device will begin a post cooling cycle.It is recommended to pause operation prior to changing the duration set value.Once the cycle has completed, the unit will begin post cooling as indicated by the status field. The LEDs will stop emitting, however the fan and stir bar will continue to rotate until the countdown has reached 0.During the operation the cycle can be “Paused”. The LED will stop emitting and the fan and stir bar will stop rotating. The LED exposure (HH:MM:SS) and Time Remaining (HH:MM:SS) will pause.The Status field will indicate “Paused” and the Pause button will change to “Resume”. Press “Resume” to restart the device. The LED exposure and Time Remaining count will continue from the point in the cycle when it was paused.Opening the light shield during a cycle will also pause the device.Upon completion of a cycle, the unit will display status “Complete”. Before initiating another reaction or changing parameters, th e device must be “Reset”. The “reset” button will res et the device to the parameters set for the last cycle. Parameters may be changed as described previously and another reaction may be initiated.During a cycle, the Stop button will immediately halt all operations. Similar to a completed cycle, the device must be reset from the stopped condition before initiating another reaction or changing parameters.Termination, Turning the Unit “Off”Unplugging the unit or switching off the unit while it is running will cause no harm to the system, nor will it cause an unsafe condition.All of the following methods can be used to turn off the unit, safely:•Side Panel Power Switch.•Disconnecting Mains Power.6System InformationTo display the system information press the “System Info” button on the main display.The user interface opens the system information screen.The GUI FW and Control FW version display the latest FW version on the device.The S/N is set by manufacturer during assembly and matches the control label S/N on the base of the device.7Proper Care and HandlingRemove Photoreactor m2 and accessories from packaging and observe all labeling. Immediately notify the manufacturer of any defects.Cleaning, Disinfection, and Disposal•Clean and disinfect the external housing of the Photoreactor m2 with a mild detergent.•Wipe with mild detergent, do not spray.•Never clean any internal electronics with liquid cleaners. If necessary, remove all dust from external surfaces with dry compressed air.•Photoreactor m2 units shall be disposed of via local and applicable regulations based on the intended use.8MaintenanceThe Photoreactor m2 is designed to operate for many years without any maintenance required.No user-changeable fuses are included. Consult manufacturer.Contact Information:Penn Photon Devices, LLC1055 Mensch Dam RoadPennsburg, PA 18073, USATel: (011) 267-923-87989Technical DataCover closed•Width: 12.2 cm (4.8 inches)•Height: 27.2 cm (10.7 inches)•Depth: 28.2 cm (11.1 inches)Cover open•Width: 12.2 cm (4.8 inches)•Height: 33.8 cm (13.3 inches)•Depth: 42.67 cm (16.8 inches)•Weight: Approximately 2 kg (4.4 lbs.)•Operating mode: Continuous•Main cable: 10 A/250 V•Power supply: 85-264V, 50/60 Hz, 120VA•Expected Service Life: 5 years•Cleaning: Surface cleaning with mild detergentAmbient conditions for operation•Temperature: 5° to 40°C (41° to 104°F)•Rel. humidity: 0% to 80% non-condensing for temperatures up to 31°C (88°F) decreasing linearly to 50% at 40°C (104°F)•Air pressure: 700 hPa to 1060 hPaAmbient conditions for storage (in shipping packaging)•Temperature: -20° to +50°C (-4° to 122°F)•Rel. humidity: 0% to 100%, non-condensing10Product RatingsFor all CE compliance questions, EU customers may contact; Necsel IP, Inc., an Ushio Group company101 Panton Road,Vergennes, VT 05491, USATel: (011) 802 877 2182。

Helios 5 FX DualBeamEnabling breakthrough failure analysis for advanced technology nodesThe Helios 5 Dual Beam platform continues to serve the imaging, analysis, and S/TEM sample preparation applications in the most advanced semiconductor failure analysis, process development and process control laboratories.The Thermo Scientific ™ Helios 5 FX ™ DualBeam continues the Helios legacy to the fifth generation combining the innovative Elstar ™ with UC+ technology electron column for high-resolution and high materials contrast imaging, in-lens S/TEM 4 for 3Å in-situ low kV S/TEM imaging and the superior low kV performing Phoenix ™ ion column for fast, precise and sub-nm damagesample preparation. In addition to the industry leading SEM and FIB columns, the Helios 5 FX incorporates a suite of state-of-the-art technologies which enable simple and consistent sample preparation (for high resolution S/TEM imaging and/or Atom Probe microscopy) on even the most challenging samples.High quality imaging at all landing energiesThe ultra-high brightness electron source on the Helios 5 FX System is equipped with 2nd generation UC technology (UC+) to reduce the beam energy spread below 0.2 eV for beam currents up to 100 pA. This enables sub-nanometer resolution and high surface sensitivity at low landing energies. The highly efficient Mirror Detector and In-Column Detector in the Helios 5 FX System come with the ability to simultaneously acquire and mix TLD-SE, MD-BSE and ICD-BSE signals to produce the best overall ultra-high resolution images. Low-loss MD-BSE provides excellent materials contrast with an improvement of up to 1.5x in Contrast-to-Noise ratio, while No-loss ICD-BSE provides materials contrast with maximum surface sensitivity.Shorten time to useable dataThe Helios 5 FX System is the world’s first DualBeam toincorporate a TEM-like CompuStage for TEM lamella sample preparation and combine it with an all new In-lens STEM 4 detector to drastically reduce the time to high quality useable data. The integrated CompuStage is independent of the bulk stage and comes with separate X, Y, Z, eucentric 180° alpha tilt and 200° beta tilt axes enabling SEM endpointing on both sides of S/TEM lamella. The accompanying S/TEM rod is compatible with standard 3 mm TEM grids and enables fast grid exchange without breaking vacuum. In addition, the system is equippedDATASHEETHigh-performance Elstar electron column with UC+monochromator technology for sub-nanometer SEM and S/TEM image resolutionExceptional low kV Phoenix ion beam performance enables sub-nm TEM sample preparation damageSharp, refined, and charge-free contrast obtained from up to 5 integrated in-column and below-the-lens detectors MultiChem Gas Delivery System provides the most advanced capabilities for electron and ion beam induced deposition and etching on DualBeamsEasyLift EX Nanomanipulator enables precise, site-specific preparation of ultra-thin TEM lamellae all while promoting high user confidence and yieldSTEM 4 detector provides outstanding resolution and contrast on thin TEM samplesBacked by the Thermo Fisher Scientfic world class knowledge and expertise in advanced failure analysis forDualBeam applicationsFigure 1. TEM sample preparation using the Thermo Scientific iFAST automation software package and extracted using the EasyLift Nanomanipulator.Figure 2. HRSTEM Bright Field image of a 14 nm SRAM Inverter thinned to 15 nm showing both nFET and pFET structures connected with a metal gate.For current certifications, visit /certifications. © 2020 FEI Company. All rights reserved.All trademarks are the property of Thermo Fisher Scientific and its subsidiaries unless otherwise specified. DS0283-EN-07-2020Find out more at /EM-Saleswith a retractable, annular STEM 4 detector which can be used either in standard mode for real-time STEM endpointing (6Å resolution) or in the new In-lens mode for ultimate imaging performance (3Å resolution). Both modes support improved materials contrast through the use of Bright Field, Dark Field annular and HAADF segments collecting transmitted electrons simultaneously. A new STEM detector enables diffraction imaging and zone axis alignment (automated or manual), enabling highest resolution and contrast on STEM samples. Extreme high resolution, high contrast imaging of ultra-thin lamella is now possible using 30 kV electrons. Having the ability to complete failure analysis work in the DualBeam without exposing the finished sample to ambient air shortens the time to data and reduces the need for standalone S/TEM systems.High quality ultra-thin TEM sample preparationPreparing high quality, ultra-thin TEM samples requires polishing the sample with very low kV ions to minimize damage to the sample. The Thermo Scientific most advanced Phoenix Focused Ion Beam (FIB) column not only delivers high resolution imaging and milling at 30 kV but now expands unmatched FIB performance down to accelerating voltages as low as 500 V enabling the creation of 7 nm TEM lamella with sub-nm damage layers.Enabling flexibilitySmart Alignments actively maintain the system for optimum performance, ready to deliver the highest performance for all users. Patterning improvements ensure the highest quality depositions at any condition, and an extensive automation suite make the Helios 5 the most advanced DualBeam ever assembled—all backed by the Thermo Fisher expert application and service support. Specifications • Electron source–Schottky thermal field emitter, over 1 year lifetime • Ion source–Gallium liquid metal, 1000 hours • Landing Voltage –20 V – 30 kV SEM –500 V – 30 kV FIB • STEM resolution –6Å Standard mode –3Å In-len mode • SEM resolution–Optimal WD0.6 nm @ 2–15 kV 0.7 nm @ 1 kV1.0 nm @ 500 V with beam deceleration –Coincident WD 0.8 nm @ 15 kV 1.2 nm @ 1 kV• Ion beam resolution at coincident point –4.0 nm @ 30 kV using preferred statistical method –2.5 nm @ 30 kV using selective edge method–500 nm @ 500 V using preferred statistical method • EDS resolution–< 30 nm on thinned samples • Gas Delivery–Integrated MultiChem Gas Delivery System –Up to 6 chemistries can be installed –Up to 2 external gasses can be installed • In situ TEM sample liftout –EasyLift EX Nanomanipulator • Stage–5 axis CompuStage with S/TEM holder, equipped with automated insert/retract mechanism and air lock for fast TEM grid exchange without breaking system vacuum –5 axis all piezo motorized bulk stage with automated Loadlock • Sample types–Wafer pieces, packaged parts, grids • Maximum sample size–70 mm diameter with full travel• Application software–iFAST Developers Kit Professional automation software • User interface–Windows ® 10 GUI with integrated SEM, FIB, GIS, simultaneous patterning and imaging mode –Local language support: Check with your local Thermo Fisher sales representatives for available language packs –Two 24-inch widescreen LCD monitors Key options• MultiChem gas chemistries –Range of deposition and etch chemistries • Software–Auto Slice & View ™ software, Magma CAD Navigation • Hardware –EDS and WDS。

Scios 2 DualBeam 系统多功能、高性能 DualBeam 仪器Scios 2 DualBeam 系统可为各种样品提供业界最出色的样品制备、亚表层和三维表征性能。

Thermo Scientifc™ Scios™ 2 DualBeam™ 系统是一套超高分辨率的分析系统，能为包括磁性和非导电材料在内的各种样品提供出色的样品制备和三维表征性能。

Scios 2 DualBeam 系统的创新功能可提高通量、精度与易用性，是用于满足学术、政府和工业研究环境中科学家与工程师开展高级研究与分析需求的理想解决方案。

高质量 TEM 样品制备科学家和工程师不断面临新的挑战，需要对特征越来越小而复杂性日益提高的样品进行高度局部化的表征。

Scios 2 DualBeam 系统采用最新的创新技术，搭载最简单易用、功能最全面的Thermo Scientific AutoTEM™ 4 软件（可选），加上我们的应用技术，能够快速、轻松制备适合各种材料的位置特异性 HR-S/TEM 样品。

为了获得高质量的结果，需要用低能量的离子进行最终抛光以最小化样品上的表面损伤。

Thermo Scientific Sidewinder™ HT 聚焦离子束 (FIB) 镜筒不仅可在高电压下提供高分辨率成像和铣削，而且还有不错的低电压性能，从而能够创建高质量的 TEM 薄片样品。

高质量的亚表层与三维信息为了更好地理解样品的结构和性质，通常需要进行亚表层或三维表征。

Scios 2 DualBeam 系统可选装 Thermo Scientific Auto Slice & View™ 4 (AS&V4) 软件，能够全自动高质量采集多模态三维数据集，其中包括用于获得最大材料对比度的 BSE 成像、用于获取成分信息的能谱分析技术 (EDS) 以及用于获取显微结构和晶体学信息的电子背散射衍射 (EBSD)。

结合 Thermo Scientific Avizo™ 软件，它为高分辨率的高级三维表征和分析提供了纳米级的独特工作流程解决方案。

MS-470C Urethane Conformal CoatingDescription:MS-470C is a non-flammable, solvent-based, one-component polyurethane conformal coating provided in the convenience of aerosol. Our coating provides excellent electrical and barrier properties in a thin-film applications on components and PCBs. When fully cured, the applied urethane coating exhibits superior toughness, abrasion resistance, and excellent moisture and chemical resistance. MS-470C will maintain its properties even after long exposure to the elements with minimal color change. Benefits include:•Superior toughness and abrasion resistance•Reworkable and room temperature cure•Solvent and discoloration resistant•Fluorescent under UV light•No cracking or crazing with vibration•Easier to re-work than epoxy-based coatingsPreparation/Application/Cure ScheduleNote: Performance of the MS-470C and its cured film is dependent on process controls used in the application of the coating. Cleanliness of the substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry. For specific recommendations please contact our Technical Support Team.Aerosol Preparation and Room Conditions:1. Important do not shake can prior to usage. Allow can to warmup to room temperature prior to use. Failure to do so will affectsprayability and can affect coating performance.2. MS-470C should be applied at room temperature.3. MS-470C should not be applied where relative humidity isbelow 30% or above 70%. Ideal room conditions are thefollowing: 50-60% humidity and 70–80 °F.4. If reusing a previous sprayed aerosol can, invert can to cleanvalve and perform several test sprays to inspect spray patternand fluid delivery. If both appear suitable continue with theapplication process.Application:Application should be done in a well-ventilated area. Proper safety equipment and chemical resistant gloves are strongly recommended1. Hold can 6 – 8 inches away from the assembly and apply amedium-light coating. Coating must be applied wet andallowed to dry on the surface of the assembly.2. Allow coating to dry for 30-35 minutes at room temperature.3. Apply 1-2 additional medium wet coats with 30-35 minutesbetween each.4. A total cured film thickness of 2 ± 1mil is recommended.5. Once spraying is complete, immediately invert can and purgethe valve and actuator. This will prevent clogging andpremature valve failure.6. Drying and curing of the coating depends upon evaporation ofthe solvent and subsequent reaction of the polymer withmoisture in the air at elevated or room temperatures.Cure Schedules:Final film properties can be achieved by either heat acceleration or room temperature.1. Heat Accelerated: Allow board to air dry for 30-45 minutesprior to placement into the oven.2. Oven curing must be done at 60-68°C (140-154 °F) at ahumidity level of 40-55%. This can be achieved by placing apan of distilled water in the cure oven one hour before youplace the coated assemblies inside.NOTE: Failure to provide humidity during the heat acceleratedcuring program will affect final film performance.3. Oven cure the coated assemblies for ~ 2hrs.4. Allow an additional 1 – 2 days at room temperature and 45-55% humidity for final film properties to be developed onceremoved from the oven.5. Room Temperature / Air Cure: Allow to cure for 7 days at room70-80 °F at a relative humidity of 55-65%.6. Coatings will typically be tack-free in 1 – 4 hours dependingon the number coats, coating thickness, and room conditions.NOTE: The cure schedules above are based on time after the assembly reaches the specific temperatures and are recommendations only. The user is responsible for determining the optimal cure conditions for their application.Clean-up:Uncured MS-470C can be removed with aromatic, ketones, or glycol ethers. Removal of cured MS-470C will require Miller-Stephenson MS-114D or MS-115 Conformal Coating Stripper.Storage:Aerosol Cans should be kept at 70-77°F and away from direct contact with sunlight.For technical information call 800.992.2424 or 203.743.4447General information:For safe handling information on this product, consult the safety datasheet, (SDS)Cured Film Electrical Properties: (1.0 - 3.0 mil film)Dielectric Strength, volts/mil1200Dielectric Constant, 105 Hz @25°C 4.2Dissipation Factor, 105 Hz @ 25°C0.010Volume Resistivity (ohm-cm) 2.0 x 1013Cured Physical Properties:Operating Temperature: -67°F/-55°C to 230°F/ 110°CAppearance: No blistering, wrinkling, cracking, or peeling of film, afterthermal shock and moisture resistance testing.Flexibility: No cracking of film over a 1/8" diameter mandrel.Fungus Resistance: Non-nutrient per ASTM G21Fluorescent: Under ultraviolet light.VOC Content of MS-470C: 882 g/lLIMITATION OF LIABILITY AND REMEDIES: Manufacturer warrantsthat, at the time of sale by the Manufacturer, this product is free fromdefect in material and manufacture. If the product is proved to be defective, the exclusiveremedy, at Manufacturer’s option, shall be refund of the purchase price or replacement of thedefective product, provided written notice of the defect is given no later than 210 days aftersale by the Manufacturer. Manufacturer shall not otherwise be liable for loss or damageswhether direct, indirect, incidental or consequential, regardless of the legal theory asserted,including negligence and strict liability. Manufacturer expressly disclaims all impliedwarranties, including the implied warranty of merchantability and the implied warrantyof fitness for a particular purpose. There are no warranties which extend beyond thedescription on the face hereof.1675-6OFor technical information call 800.992.2424 or 203.743.4447。

-40 to +60°C Technical SpecificationsMOBOTIX S16B DualFlexFlexible. Virtually Invisible Flush-Mount Dual-Lens Camera.The S16B from MOBOTIX is a weatherproof system that stands out first and foremost for the extremely flexible installation options it offers. Two sensor modules are connected to the concealed camera housing via cables up to three meters long. This makes it possible to discreetly monitor two neighboring rooms with just a single camera.◼Mx6 system platform 2nd generation, with MxBus, H.264 and ONVIF compatibility◼Recording on an internal MicroSD card (4 GB as standard)◼Diverse installation options and mounting accessories for sensor modules◼Max. length of each sensor module cable: 3 m◼Microphone can be used in sensor module◼Additional microphone and speaker connections◼Integrated shock detector◼Weatherproof and robust camera housing (IP66, IK06)Camera Variants S16B DualFlexFlexible and modular system: The S16B camera module (Body) Mx-S16B can be fitted with one or two sensor modules free of choice (day/ night/thermal). MOBOTIX sensor cables are available with a length from 0.5 to 3 m (1.6 to 9.8 ft.). Additionally MOBOTIX offers three different S16B Complete Sets (Mx-S16B-S1, Mx-S16B-S2, Mx-S16B-S3) with one or two hemispheric sensor modules and 2 m (6.6 ft) long sensor cables. S16B Body Mx-S16BS16B Complete Set 1 (Body + 1x Mx-O-SMA-S-6D016 + accessories)Mx-S16B-S1S16B Complete Se 2 (Body + 2x Mx-O-SMA-S-6D016 + accessories)Mx-S16B-S2S16B Complete Set 3 (Body + 1x Mx-O-SMA-S-6D016 + 1x Mx-O-SMA-S-6N016 +accessories)Mx-S16B-S3Hardware S16B DualFlexLight sensitivity in lux at 1/60 s and 1/1 s Day sensor (Color): 0.1/0.005 luxNight sensor (B/W): 0.02/0.001 lux Thermal sensor modules NETD typ. 50 mK, < 79 mK, IR range 7,5 to 13,5 μmTemperature measuring range for thermal sensor modules High Sensitivity: -40 to 160°C/-40 t0 320°FLow Sensitivity: -40 to 550°C/-40 to 1022°F Optical image sensor (color or B/W sensor)1/1.8“ CMOS, 6MP (3072 x 2048), Progressive Scan Microprocessor i.MX 6 Dual Core incl. GPU (1 GB RAM, 512 MB Flash)H.264 Hardware Codec Yes, bandwidth limitation available; output image formatup to QXGAProtection class S16B camera module (body)IP66 and IK06Protection class S16B with 6MP sensor mdoulesIP66 with all modules incl. Thermal; IK04 with B036 to B237; IK07 with B016;BlockFlexMount: IP30/no IK classIntended use Not for use in hazardous areas (Ex area)Ambient temperature (range, incl. storage)-40 to 60°C/-40 to 140°F (cold boot from -30°C/-22°F)BlockFlexMount: 0 to 50°C/32 to 122°F Internal DVR, ex works 4 GB (microSD)Microphone Part of sensor module/BlockFlexMount (not part of sensor modules with CS-Mount or B500 super tele lens)or with accessory (e.g., ExtIO or AudioMount)Technical data for external microphone2,0 V, 2,2 kOhm, sensitivity –35 ± 4 dB,e. g., Panasonic Microphone Capsule WM61 Speaker With accessory (e.g., SpeakerMount)Technical data for external speaker Max. power output 400 mW at 8 Ohm impedance,e. g., Visaton Speaker K36WP or K50WP16bit/16kHz HD wideband audio (Opus codec)Yes (live and audio messages) Passive infrared sensor (PIR)NoTemperature sensors/shock detector (tamper detection)Yes/YesPower consumption (typically at 20°C/68°F)7.5 WattsPower consumption with one/two thermal sensor module(s) (typically at 20°C/68°F)1.5 W per thermal sensor module, 2.5 W possible over the short term; can only be used together with an S16B bodyPoE Class (IEEE 802.3af)Class 2 or 3 (variable), factory setting: class 3;S16B with thermal sensor always requires class 3 Interfaces Ethernet 100BaseT/MxBus/USB Yes (MxRJ45 and LSA+ rail)/Yes/Yes Interfaces external microphone/speaker Yes/YesInterface RS232With accessory (MX-232-IO-Box)Mounting options Wall, ceiling, hidden insatllation; extensive selection ofmounting accessories available Dimensions Mx-S16B (height x width x depth)130 x 115 x 33 mmWeight Mx-S16B430 gHardware S16B DualFlex Housing Mx-S16B PBT-30GF, color: whiteHousing thermal sensor modules l (not PTMount)Module housing: black anodized aluminum Pressure plate: V2A stainless steel Lens and protective glass lens: germaniumStandard accessory Mx-S16B Screws, dowels, allen wrench, module key, cable strap,0.5 m ethernet patch cable, Quick Install Detailed technical documentation > Support > Download Center Online version of this document > Support > Download Center MTBF> 80,000 hoursCertifications EN55022:2010; EN55024:2010; EN50121-4:2006 EN61000-6-1:2007; EN 61000-6-2:2005EN61000-6-3:2007+A1:2011EN61000-6-4:2007+A1:2011AS/ NZS CISPR22:2009+A1:2010CFR47 FCC part15BProtocolsIPv4, IPv6, HTTP, HTTPS, FTP, FTPS, RTP, RTSP, UDP, SNMP, SMTP, DHCP (client and server), NTP (client and server), SIP (client and server) G.711 (PCMA and PCMU)and G.722Manufacturer‘s warranty (since May 2018) 3 yearsImage Formats, Frame Rates, Image Storage S16B DualFlex Available video codecs MxPEG/MJPEG/H.264Image formatsFreely configurable format 4:3, 8:3, 16:9 or customized format (Image Cropping), such as 2592x1944 (5MP), 2048x1536 (QXGA), 1920x1080 (Full-HD), 1280x960 (MEGA)Multistreaming YesMulticast stream via RTSP YesMax. image format optical sensor modules (dual image from both sensors)2x 6MP (6144 x 2048)Max. image format thermal sensor module336 x 252 (Pixel Pitch 17 μm), scalable up to 3072 x 2048 Max. frame rate thermal sensor or thermal + optical sensor module9 frames per secon (fps)Max. frame rate optical sensor module (fps, only single core used)MxPEG: 42@HD(1280x720), 34@Full-HD, 24@QXGA,15@5MP, 12@6MP, 6@2x 6MP MJPEG: 26@HD(1280x720), 13@Full-HD, 9@QXGA, 5@5MP,4@6MP, 2@2x 6MPH.264:25@Full-HD, 20@QXGANumber of images with 4 GB microSD (internal DVR)CIF: 250,000, VGA: 125,000, HD: 40,000, QXGA: 20,000,6MP: 10,000General Functions S16B DualFlexTemperature measurement of 2x2 pixels in the center of the image (Thermal Spot)Only with thermal sensor module (incl. TR)TR temperature measurement in the whole image area Only with thermal sensor module TR Event trigger for temperatures above or below a limit between-40 to 550°C/-40 to 1022°F Only with thermal sensor module (incl. TR) Digital zoom and pan YesONVIF compatibility Yes (Profile S, audio support with camera firmwareV5.2.x and higher)Genetec protocol integration YesProgrammable exposure zones YesSnapshot recording (pre/post-alarm images)YesContinuous recording with audio YesEvent recording with audio YesGeneral Functions S16B DualFlex Time and event control/flexible event logic Yes Weekly schedules for recordings and actions Yes Event video and image transfer via FTP and email Yes Playback and QuadView via web browser Yes Bidirectional audio in browser Yes Animated logos on the image Yes Master/Slave functionality Yes Privacy zone scheduling Yes Customized voice messages Yes VoIP telephony (audio/video, alert)Yes Remote alarm notification (network message)Yes Programming interface (HTTP-API)YesDVR/Storage Management Inside camera via microSD card, externally via USB device and NAS, different streams for live image and recording, MxFFS with archive function, pre-alarm an post-alarm images, monitoring recording with failure reportingCamera and data security User and group management, SSL connections, IP-based access control, IEEE802.1x, intrusion detection, digitalimage signatureMxMessageSystem: Sending and receiving of MxMessages YesVideo Analysis S16B DualFlex Video motion detector Yes MxActivitySensor YesVideo Management So ft ware S16B DualFlex MxManagementCenter Yes Mobile MOBOTIX App YesOverview: Available Sensor Modules For S16:Sensor Modules and BlockFlexMounts Day, 6MP image sensor (color 3072 x 2048), IP66, IP66 (sensor modules) and IP30 (BlockFlexMounts)Sensor Module Day with Fisheye lens B016 (180° x 180°), white Sensor Module Day with Fisheye lens B016 (180° x 180°), black BlockFlexMount Day with Fisheye lens B016 (180° x 180°)Mx-O-SMA-S-6D016 Mx-O-SMA-S-6D016-b Mx-O-SMA-B-6D016Sensor Module Day with Ultra Wide lens B036 (103° x 77°), white Sensor Module Day with Ultra Wide lens B036 (103° x 77°), black BlockFlexMount Day with Ultra Wide lens B036 (103° x 77°)Mx-O-SMA-S-6D036 Mx-O-SMA-S-6D036-b Mx-O-SMA-B-6D036Sensor Module Day with Super Wide lens B041 (90° x 67°), white Sensor Module Day with Super Wide lens B041 (90° x 67°), black BlockFlexMount Day with Super Wide lens B041 (90° x 67°)Mx-O-SMA-S-6D041 Mx-O-SMA-S-6D041-b Mx-O-SMA-B-6D041Sensor Module Day with Wide lens B061 (60° x 45°), white Sensor Module Day with Wide lens B061 (60° x 45°), black BlockFlexMount Day with Wide lens B061 (60° x 45°)Mx-O-SMA-S-6D061 Mx-O-SMA-S-6D061-b Mx-O-SMA-B-6D061Sensor Module Day with Standard lens B079 (45° x 34°), white Sensor Module Day with Standard lens B079 (45° x 34°), black BlockFlexMount Day with Standard lens B079 (45° x 34°)Mx-O-SMA-S-6D079 Mx-O-SMA-S-6D079-b Mx-O-SMA-B-6D079Sensor Module Day with Tele lens B119 (31° x 23°), white Sensor Module Day with Tele lens B119 (31° x 23°), black BlockFlexMount Day with Tele lens B119 (31° x 23°)Mx-O-SMA-S-6D119 Mx-O-SMA-S-6D119-b Mx-O-SMA-B-6D119Sensor Module Day with Distant Tele lens B237 (15° x 11°), white Sensor Module Day with Distant Tele lens B237 (15° x 11°), black BlockFlexMount Day with Distant Tele lens B237 (15° x 11°)Mx-O-SMA-S-6D237 Mx-O-SMA-S-6D237-b Mx-O-SMA-B-6D237Sensor Module Day with Super-Tele lens B500 (8° x 6°), white Sensor Module Day with Super-Tele lens B500 (8° x 6°), black BlockFlexMount Day with Super-Tele lens B500 (8° x 6°)Mx-O-SMA-S-6D500 Mx-O-SMA-S-6D500-b Mx-O-SMA-B-6D500Sensor Module Day with CS-Mount (no lens), white Sensor Module Day with CS-Mount (no lens), black BlockFlexMount Day with CS-Mount (no lens)Mx-O-SMA-S-6DCS Mx-O-SMA-S-6DCS-b Mx-O-SMA-B-6DCSSensor Module Day with CSVario-Objektiv B045-100-CS, white Sensor Module Day with CSVario-Objektiv B045-100-CS, black BlockFlexMount Day with CSVario-Objektiv B045-100-CS Mx-O-SMA-S-6DCSV Mx-O-SMA-S-6DCSV-b Nur SelbstmontageSensor Modules and BlockFlexMounts Night, 6MP image sensor (B/W 3072 x 2048), IP66), IP66 (sensor modules) and IP30 (BlockFlexMounts)Sensor Module Night with Fisheye lens B016 (180° x 180°), white Sensor Module Night with Fisheye lens B016 (180° x 180°), black BlockFlexMount Night with Fisheye lens B016 (180° x 180°)Mx-O-SMA-S-6N016 Mx-O-SMA-S-6N016-b Mx-O-SMA-B-6N016Sensor Module Night with Ultra Wide lens B036 (103° x 77°), white Sensor Module Night with Ultra Wide lens B036 (103° x 77°), black BlockFlexMount Night with Ultra Wide lens B036 (103° x 77°)Mx-O-SMA-S-6N036 Mx-O-SMA-S-6N036-b Mx-O-SMA-B-6N036Sensor Modules and BlockFlexMounts Night, 6MP image sensor (B/W 3072 x 2048), IP66), IP66 (sensor modules) and IP30 (BlockFlexMounts)Sensor Module Night with Super Wide lens B041 (90° x 67°), white Sensor Module Night with Super Wide lens B041 (90° x 67°), black BlockFlexMount Night with Super Wide lens B041 (90° x 67°)Mx-O-SMA-S-6N041 Mx-O-SMA-S-6N041-b Mx-O-SMA-B-6N041Sensor Module Night with Wide lens B061 (60° x 45°), white Sensor Module Night with Wide lens B061 (60° x 45°), black BlockFlexMount Night with Wide lens B061 (60° x 45°)Mx-O-SMA-S-6N061 Mx-O-SMA-S-6N061-b Mx-O-SMA-B-6N061Sensor Module Night with Standard lens B079 (45° x 34°), white Sensor Module Night with Standard lens B079 (45° x 34°), black BlockFlexMount Night with Standard lens B079 (45° x 34°)Mx-O-SMA-S-6N079 Mx-O-SMA-S-6N079-b Mx-O-SMA-B-6N079Sensor Module Night with Tele lens B119 (31° x 23°), white Sensor Module Night with Tele lens B119 (31° x 23°), black BlockFlexMount Night with Tele lens B119 (31° x 23°)Mx-O-SMA-S-6N119 Mx-O-SMA-S-6N119-b Mx-O-SMA-B-6N119Sensor Module Night with Distant Tele lens B237 (15° x 11°), white Sensor Module Night with Distant Tele lens B237 (15° x 11°), black BlockFlexMount Night with Distant Tele lens B237 (15° x 11°)Mx-O-SMA-S-6N237 Mx-O-SMA-S-6N237-b Mx-O-SMA-B-6N237Sensor Module Night with Super-Tele lens B500 (8° x 6°), white Sensor Module Night with Super-Tele lens B500 (8° x 6°), black BlockFlexMount Night with Super-Tele lens B500 (8° x 6°)Mx-O-SMA-S-6N500 Mx-O-SMA-S-6N500-b Mx-O-SMA-B-6N500Sensor Module Night with CS-Mount (no lens), white Sensor Module Night with CS-Mount (no lens), black BlockFlexMount Night with CS-Mount (no lens)Mx-O-SMA-S-6NCS Mx-O-SMA-S-6NCS-b Mx-O-SMA-B-6NCSSensor Module Night with CSVario-Objektiv B045-100-CS, white Sensor Module Night with CSVario-Objektiv B045-100-CS, black BlockFlexMount Night with CSVario-Objektiv B045-100-CS Mx-O-SMA-S-6NCSV Mx-O-SMA-S-6NCSV-b Nur SelbstmontageSensor Modules and BlockFlexMounts Nigth with Longpass filter (LPF), 6MP image sense sensor (B7W: 3072 x 2048), IP66 (sensor modules) and IP30 (BlockFlexMounts)Sensor Module Night+LPF with Fisheye lens B016 (180° x 180°), white Sensor Module Night+LPF with Fisheye lens B016 (180° x 180°), black BlockFlexMount Night+LPF with Fisheye lens B016 (180° x 180°)Mx-O-SMA-S-6L016 Mx-O-SMA-S-6L016-b Nicht verfügbarSensor Module Night+LPF with Ultra Wide lens B036 (103° x 77°), white Sensor Module Night+LPF with Ultra Wide lens B036 (103° x 77°), black BlockFlexMount Night+LPF with Ultra Wide lens B036 (103° x 77°)Mx-O-SMA-S-6L036 Mx-O-SMA-S-6L036-b Mx-O-SMA-B-6L036Sensor Module Night+LPF with Super Wide lens B041 (90° x 67°), white Sensor Module Night+LPF with Super Wide lens B041 (90° x 67°), black BlockFlexMount Night+LPF with Super Wide lens B041 (90° x 67°)Mx-O-SMA-S-6L041 Mx-O-SMA-S-6L041-b Mx-O-SMA-B-6L041Sensor Module Night+LPF with Wide lens B061 (60° x 45°), white Sensor Module Night+LPF with Wide lens B061 (60° x 45°), black BlockFlexMount Night+LPF with Wide lens B061 (60° x 45°)Mx-O-SMA-S-6L061 Mx-O-SMA-S-6L061-b Mx-O-SMA-B-6L061Sensor Module Night+LPF with Standard lens B079 (45° x 34°), white Sensor Module Night+LPF with Standard lens B079 (45° x 34°), black BlockFlexMount Night+LPF with Standard lens B079 (45° x 34°)Mx-O-SMA-S-6L079 Mx-O-SMA-S-6L079-b Mx-O-SMA-B-6L079Sensor Module Night+LPF with Tele lens B119 (31° x 23°), white Sensor Module Night+LPF with Tele lens B119 (31° x 23°), black BlockFlexMount Night+LPF with Tele lens B119 (31° x 23°)Mx-O-SMA-S-6L119 Mx-O-SMA-S-6L119-b Mx-O-SMA-B-6L119Sensor Module Night+LPF with Distant Tele lens B237 (15° x 11°), white Sensor Module Night+LPF with Distant Tele lens B237 (15° x 11°), black BlockFlexMount Night+LPF with Distant Tele lens B237 (15° x 11°)Mx-O-SMA-S-6L237 Mx-O-SMA-S-6L237-b Mx-O-SMA-B-6L237Sensor Module Night+LPF with Super-Tele lens B500 (8° x 6°), white Sensor Module Night+LPF with Super-Tele lens B500 (8° x 6°), black BlockFlexMount Night+LPF with Super-Tele lens B500 (8° x 6°)Mx-O-SMA-S-6L500 Mx-O-SMA-S-6L500-b Mx-O-SMA-B-6L500Sensor Module Night+LPF with CS-Mount (no lens), white Sensor Module Night+LPF with CS-Mount (no lens), black BlockFlexMount Night+LPF with CS-Mount (no lens)Nicht verfügbar Nicht verfügbar Mx-O-SMA-B-6LCSSensor Modules Thermal, NETD 50 mK, measuring range -40 to 550 °C, IP66 (all)Thermal Sensor Module with metal housing, lens T079 (45° x 32°)Mx-O-SMA-TS-T079 Thermal Sensor Module with metal housing, lens T119 (25° x 19°)Mx-O-SMA-TS-T119Sensor Modules Thermal, NETD 50 mK, measuring range -40 to 550 °C, IP66 (all)Thermal Sensor Module with metal housing, lens T237 (17° x 13°)Mx-O-SMA-TS-T237 PTMount Thermal, lens T079 (45° x 32°), white Mx-O-SMA-TP-T079 PTMount Thermal, lens T119 (25° x 19°), white Mx-O-SMA-TP-T119 PTMount Thermal, lens T237 (17° x 13°), white Mx-O-SMA-TP-T237 PTMount Thermal, lens T079 (45° x 32°), black Mx-O-SMA-TP-T079-b PTMount Thermal, lens T119 (25° x 19°), black Mx-O-SMA-TP-T119-b PTMount Thermal, lens T237 (17° x 13°), black Mx-O-SMA-TP-T237-brange -40 to 550 °C, IP66 (all) Sensor Modules Thermal with Thermal Radiometry (TR), NETD 50 mK, measuring rangeThermal Sensor Module TR with metal housing, lens R079 (45° x 32°)Mx-O-SMA-TS-R079 Thermal Sensor Module TR with metal housing, lens R119 (25° x 19°)Mx-O-SMA-TS-R119 Thermal Sensor Module TR with metal housing, lens R237 (17° x 13°)Mx-O-SMA-TS-R237 PTMount Thermal TR, lens R079 (45° x 32°), white Mx-O-SMA-TP-R079 PTMount Thermal TR, lens R119 (25° x 19°), white Mx-O-SMA-TP-R119 PTMount Thermal TR, lens R237 (17° x 13°), white Mx-O-SMA-TP-R237 PTMount Thermal TR, lens R079 (45° x 32°), black Mx-O-SMA-TP-R079-b PTMount Thermal TR, lens R119 (25° x 19°), black Mx-O-SMA-TP-R119-b PTMount Thermal TR, lens R237 (17° x 13°), black Mx-O-SMA-TP-R237-bStandard Delivery Mx-S16BS16 with two PTMount ThermalAttention – Special Export Regulations For Thermal Cameras Apply!Cameras with thermographic image sensors (“thermographic cameras”) are subject to special U.S. and ITAR (International Traffic in Arms Regulation) export regulations:According to currently valid export regulations from the U.S. and ITAR, cameras with thermographic image sensors or their component parts cannot be exported to countries that have been embargoed by the U.S./ITAR. The corresponding delivery ban also applies to all individuals and institutions included on “The Denied Persons List” (see under Policy Guidance > Lists of Parties of Concern). These cameras and their installed thermographic image sensors are not to be used for the design, development, or production of nuclear, biological or chemical weapons or installed in these systems.Link to the Thermal End User Statement on MOBOTIX WebsiteDimension in mm。

Page 2 of 8PIM Master ™ Passive Intermodulation AnalyzerPIM Master™ OverviewPIM Master™ IntroductionAnritsu Company introduces the first battery-operated high power Passive Intermodulation (PIM) testing solution for the major wireless standards in use around the world. PIM is a form of interference generated by passive components that are normally thought of as linear such as connectors, cable assemblies, filters and antennas. However , when subject to high RF power levels found in cellular systems, these devices can generate spurious signals that increase the receiver noise floor and reduce site performance.The PIM Master accurately measures PIM performance by injecting two CW test tones into the antenna feed network and recording the magnitude of the 3rd , 5th , or 7th order intermodulation products falling in the receive band of the system. The MW82119A is able to perform the following measurements enabling test technicians to quickly find and eliminate PIM problems found at the cell site:• PIM versus Time • Swept PIM• Distance-to-PIM™ (DTP)The PIM Master’s small size and light weight combined with battery operation make it the ideal solution for verifying performance atdifficult to access sites such as Remote Radio Head (RRH) installations or indoor Distributed Antenna Systems (DAS). Performing a PIM test at these sites often involves a tower climb or carrying the equipment up a ladder or through small access ports to reach the required point of test. The enhanced portability of the MW82119A enables high power PIM testing where required without heavy lifting and without long extension cords.The PIM Master includes Anritsu’s patented Distance-to-PIM™ (DTP) technology for accurately determining the location of PIM faults both inside the feed system as well as beyond the antenna. This technology becomes critically important for fault finding DAS installations due to the complexity of the feed system and largenumber of RF interconnects. Without DTP , finding and eliminating PIM requires a process of elimination involving the movement of low PIM loads in the network until the PIM problem disappears. This process is not only time consuming, but it also means that good connections may be opened (and potentially damaged) in the process of locating PIM problems. Distance-to-PIM allows technicians to quickly andefficiently locate PIM sources at a site resulting in quicker site repairs and lower cost.As with all Anritsu Handheld products, the MW82119A has been designed and tested to rigorous standards for shock, vibration and temperature extremes to ensure reliable service in an outdoor environment.2 x 40 W Test CapabilityEven though the package is small and it is battery operated, theMW82119A is a high performance PIM test solution allowing operators to adjust output power from 25 dBm (0.3 Watts) for indoor DAS testing to 46 dBm (40 Watts) for macro site testing. In both indoor and outdoor systems, PIM interference is highly dependent on the power level being transmitted by that system. By matching the PIM test power level more closely to the actual power level used at the site, operators will gain a clearer understanding of the true interference generated by both the RF infrastructure and theenvironment where the antenna is placed.PIM Master MW82119A 40 Watts, Battery-operatedIdeal solution for tower mounted Radio Head installations1981Page 3 of 8PIM Master™ OverviewDistance-to-PIM™ (DTP)Distance-to-PIM (DTP) is similar to Distance-to-Fault (DTF), which Anritsu introduced in the Site Master™ in 1997 for identifying the location of impedance mismatches in a feed line. DTP quickly andaccurately identifies the location of PIM faults inside the feed system as well as beyond the antenna. This capability eliminates the guesswork involved in isolating PIM sources and speeds site repairs.Up to 6 markers can be activated in Distance-to-PIM to identify the magnitude and distance to PIM faults found in the system. Using Anritsu’s familiar Line Sweep Tools (LST) application, operators canoverlay multiple DTP measurements to identify what has changed since the last visit. This enables the ability to see growing PIM problems and take corrective action before they impact network performance.PIM vs. TimeThe PIM Master includes a PIM versus Time measurement that tracks not only the instantaneous PIM level but also records the maximum PIM level experienced throughout a fixed frequency PIM test. The two test frequencies, transmit power level, intermodulation order (3rd , 5th or 7th ) and test duration can be easily adjusted by the user to meet the test requirements.This mode is useful for dynamic PIM tests as it not only captures the peak PIM value for pass / fail determination but also provides a visual indication of the stability of the system under test. When a limit line is entered in this mode, the color of the PIM magnitude changes to red when the value has exceeded the limit value. The peak value will remain red indicating a failure even if the PIM level returns to a passing level after the dynamic stress has been removed.Swept PIMWhen making a Swept PIM measurement, the PIM Master is able to evaluate changes in PIM magnitude versus Intermodulation (IM) frequency. This test is conducted by holding one transmit tone fixed while varying the frequency of the second transmit tone, causing the IM product to “sweep” across a range of frequencies in the receive band of the system. The magnitude of the PIM generated versus frequency is displayed and can be compared to a user-selected pass / fail limit.PIM measurements are the vector sum of all PIM signals generated on a line at the IM frequency being tested. When multiple PIMsources exist, it is possible for the signals to combine out of phase at a particular test frequency indicating a passing result when the individual PIM levels are actually failures. A swept PIM test varies the IM frequency over a range of frequencies providing the user a clearer picture of the true PIM performance of the system. It is worth mentioning that Distance-to-PIM measurements provide the same function as they also evaluate a range of frequencies rather than a single IM frequency.Easy to view displayThe PIM Master uses the same large, field proven, color touch screen displays found in other Anritsu Handheld products. Five differentscreen settings are available to enhance visibility in the environment where the test will be performed. This includes a Black & White setting to improve readability in direct sunlight as well as a NightVision setting to reduce screen brightness for nighttime operation.Distance-to-PIM (DTP)PIM Level (dBm) vs. Distance (meter)PIM vs. TimePIM Level (dBm) vs. Time (second)Swept PIMPIM Level (dBm) vs. Frequency (MHz)Page 4 of 8PIM Master Passive Intermodulation Analyzer FeaturesSize: 350 mm x 314 mm x 152 mm (13.8 in x 12.4 in x 6.0 in)Lightweight: 9.0 kg to 12.2 kg (20 lb to 27 lb) depending on frequency optionExternal Power OutputLANDual USB Type AUSB Mini-BGPSFactory use onlyKeypadOn/Off Key SpeakerBattery Charge LEDPower Indicator LED Emergency Stop ButtonPower OnIndicator LightArrow KeysMenu Key Protective CapRF Out 7/16 DIN, female,50 Ω ConnectorConnector Panel for MW82119APage 5 of 8PIM Report Generation and Certified TrainingLine Sweep Tools for Cable, Antenna, and PIM AnalysesLine Sweep Tools (LST) is a post processing tool to manage and archive measured data from Anritsu’s cable & antenna analyzers as well as PIM analyzers. Measured PIM results from different frequency band PIM Analyzers as well as measured data from your SiteMaster™ can be combined together into a single, unified site report.In one report an operator can have all of the information needed to verify the integrity of an antenna system with the measurements of:• PIM• Distance-to-PIM (DTP)• Return Loss • Insertion Loss• Distance-to-Fault (DTF)Contractors, technicians, and engineers can be more productive with one cohesive tool to learn and use in managing antenna line quality measurements.PIM Master™ Certified PIM Measurement Training Course Specialized PIM Master™ passive intermodulation measurement training is an intense one-day instructor led training course that focuses on making PIM measurements (theory and lab). This ismodeled on our successful Site Master™ Certified Line Sweep course.• Brief Course Outline• Definition and Description • How PIM differs from Return Loss • Why is PIM a problem • How to test for PIM • PIM testing process • Hints for successful testing • Assessing results • Labs• Hooking up the equipment and confirming proper operation • Measuring known good and bad devices • Device measurement practice • Exams• Theory and safety • Hands-on practical• Certification (after passing exams)• Certificate of Completion • Wallet-sized photo IDStudents will learn technical aspects of PIM measurements, how to set up a PIM measurement, useful examples of what works and what doesn’t, interpreting results, and locating the PIM.Customer SupportLike all Anritsu products, the PIM Master has a range of support products, services and training allowing you to maximize your return-on-investment.With Anritsu’s design know-how and demanding production testing and performance verification you can count on the PIM Master to give youyears of reliable, dependable service.Line Sweep Tools (LST) utilized for report generation on a PIM traceTest Report generated using Line Sweep Tools (LST)PIM Master™ SpecificationsGeneral Specifications All specifications and characteristics apply under the following conditions, unless otherwise stated: 1) After 5 minutes of warm-up time, where theinstrument is left in the ON state; 2) All specifications subject to change without notice; 3) T ypical performance is the measured performance of anaverage unit; 4) Recommended calibration cycle is 12 months.MeasurementsPIM and PIM vs. Time3rd, 5th, and 7th order intermodulation product when in receive band (user selectable)Distance-to-PIM Distance and relative magnitude of mutiple PIM sourcesSwept PIM3rd, 5th, and 7th order intermodulation product when in receive band (user selectable) Instrument Setup ParametersFrequency Carrier F1, Carrier F2, Intermodulation Order (3rd, 5th, 7th)Amplitude Ref Value, Scale, Auto Range (On/Off), Amplitude Tone (On/Off)Setup Output Power, Test Duration (1 s to 3,600 s)Limit Lines Limit (Upper/Lower), On/Off, Limit Move, Limit Alarm (On/Off)GPS On/Off, 3.3/5.0 VDTP Cable Velocity, DistancePIM Measurement RangesRF Test Power Two CW tones 25 dBm to 46 dBm, 0.1 dBm stepsTransmit Frequency RangeOption 700Tx: 734 MHz to 734.5 MHz, 745 MHz to 766 MHzRx(L): 698 MHz to 722 MHz, Rx(U): 779.5 MHz to 804.5 MHzOption 850Tx: 869 MHz to 871.5 MHz, 881.5 MHz to 894 MHzRx: 824 MHz to 849 MHzOption 900Tx: 927 MHz to 937.5 MHz, 951.5 MHz to 960 MHzRx: 880 MHz to 915 MHzOption 180Tx: 1805 MHz to 1837.5 MHz, 1857.5 MHz to 1880 MHzRx: 1710 MHz to 1785 MHzOption 190Tx: 1930 MHz to 1932.5 MHz, 1950 MHz to 1990 MHzRx: 1870 MHz to 1910 MHzOption 192Tx: 1930 MHz to 1935 MHz, F2: 2110 MHz to 2155 MHzRx: 1710 MHz to 1750 MHzResidual PIM Performance<-117 dBm, <-125 dBm typical (2x 43 dBm test tones)PIM Measurement Range-70 dBm to -130 dBmPIM Master ConnectorsTest Port7/16 DIN, female, 50 ΩDual USB Type A2x Type A (connect USB Flash Drive and USB Power Sensor)USB Mini-B1x Mini-B (connect to PC for data transfer)GPS SMA, female (with GPS option only)External Power 2.1 mm x 5.5 mm barrel connector, 12 to 15 VDC, < 5.0 ADisplaySize213 mm (8.4 in) touch screenResolution800 x 600BatteryType Li-IonBattery Operation 2.5 hours, typicalPowerEmergency Stop Red push buttonAC/DC Adapter Input: 100-240 VAC, 50/60 Hz , Output: 12 VDCElectromagnetic CompatibilityAustralia and New Zealand C-tick N274Interference EN 61326-1:2006Emissions EN 55011:2007Immunity EN 61000-4-2/-3/-4-4/-4-5/-4-6/-4-11European Union CE Mark, EMC Directive 2004/108/ECSafetySafety Class2006/95/EC, EN 61010-1 Class 1Product Safety IEC 60950-1 when used with Anritsu Company supplied Power cable EnvironmentalOperating Temperature-10 °C to 55 °CRelative Humidity 5 % to 95 % at +40 °C, Non-condensingShock MIL-PRF-28800F Class 2Storage-51 °C to 71 °CAltitude4600 meters, operating and non-operatingSize and WeightSize350 mm x 314 mm x 152 mm (13.8 in x 12.4 in x 6.0 in)Weight9.0 kg to 12.2 kg (20 lb to 27 lb)Page 6 of 8Page 7 of 8PIM Master™ Ordering InformationOrdering InformationModel NumberDescriptionMW82119APIM Master™ Passive Intermodulation Analyzer Frequency Options(Must order one)MW82119A-0700LTE 700 MHz MW82119A-0850Cellular 850 MHz MW82119A-0900E-GSM 900 MHz MW82119A-0180DCS 1800 MHz MW82119A-0190PCS 1900 MHzMW82119A-0192PCS/AWS 1900/2100 MHzOther Options MW82119A-0019High Accuracy Power Meter (requires USB power sensor)MW82119A-0031GPS Receiver (requires GPS antenna)MW82119A-0098Standard Calibration to ISO 17025 and/or Z540.1MW82119A-0099Premium Calibration to ISO 17025 and/or Z540.1 plus test data Standard Accessories(included with PIM Master)Part Number Description2000-1712-R Soft Carrying Case 2000-1714-R Shoulder Strap1091-387-R Adapter , 7/16 DIN(f) to 7/16 DIN(m), 50 Ω (Connector Saver)10920-00060Handheld Instruments Documentation Disc2300-530Anritsu Tool Box with Line Sweep Tools (LST) DVD Disc 10580-00285User Guide633-75High-capacity Li-Ion Battery Pack 40-187-RAC/DC Power Supply (Country dependent)AC Power Cable806-141-R Automotive Cigarette Lighter 12 VDC Adapter 2000-1371-R Ethernet Cable, 7 ft/213 cm3-2000-1498USB A-mini B Cable, 10 ft/305 cm 11410-00679PIM Master Product BrochureOne Year Warranty (Including battery, firmware, and software)Certificate of CalibrationAccessory KitsPart Number Description2000-1716-RPIM Master Accessory Kit with 2.75 m Armored PIM T est Cable and Hard CasePIM accessory kit includes16DD50-2.75-R Armored PIM T est Cable, 2.75 m, 45 MHz to 3000 MHz, 7/16 DIN(m), 50 Ω2000-1724-RLow PIM Termination, 700 MHz to 2600 MHz, 40 W CW , 7/16 DIN(m), 7/16 DIN(f), 50 Ω1091-390-R PIM Standard, -80 dBm ±3 dB @ 1775 MHz, 20 W , 7/16 DIN(m) to 7/16 DIN(f), 50 Ω1091-403-R PIM Standard, -80 dBm ±3 dB @ 910 MHz, 20 W , 7/16 DIN(m) to 7/16 DIN(f), 50 Ω1091-386-R Adapter , 7/16 DIN(f) to N(f), 50 Ω1091-389-R Adapter , 7/16 DIN(f) to N(m), 50 Ω1091-387-R Adapter , 7/16 DIN(f) to 7/16 DIN(m), 50 Ω1091-388-R Adapter , 7/16 DIN(f) to 7/16 DIN(f), 50 Ω1091-385-R Adapter , 7/16 DIN(m) to 7/16 DIN(m), 50 Ω760-260-RHard Case 01-510Crescent Wrench 01-512-R 1” Torque Wrench 01-513-R 1¼” Torque Wrench971-9-R Isopropyl Alcohol Wipes (50 pieces)971-10-R Tapered Cotton Swab (100 pieces)971-11-RDuster (10 oz. spray can) (blow away microscopic contaminants)Optional AccessoriesPart NumberDescription760-259-RMW82119A T ransit Case 67135Backpack for Accessories 2000-1374Dual Battery Charger16DD50-4.0-R Armored PIM T est Cable, 4 m, 45 MHz to 3000 MHz, 7/16 DIN(m), 50 Ω2000-1528-R GPS Antenna, SMA(m) with 15 ft cable 2000-1652-R GPS Antenna, SMA(m) with 1 ft cableMA24106A High Accuracy RF Power Sensor , 50 MHz to 6 GHz, +23 dBmMA24105A Inline High Power Sensor , 350 MHz to 4 GHz, +3 dBm to +51.76 dBm MA24108A Microwave USB Power Sensor , 10 MHz to 8 GHz, +20 dBm MA24118A Microwave USB Power Sensor , 10 MHz to 18 GHz, +20 dBm MA24126A Microwave USB Power Sensor , 10 MHz to 26 GHz, +20 dBm 10580-00315Certified PIM Master™ PIM Measurement Training CoursePlease Contact:©2012 Anritsu Company, All Rights Reserved.respective owners. Data subject to change without notice. For the most recent specifications visit: The Master Users Group is an organization dedicated toproviding training, technical support, networking opportunities and links to Master product development teams. 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X AYOUT UIDELINESAN6441.2. Front-End LayoutThe following layout rules are used:⏹ Layer 1 top side component placement and analog signal routing ⏹ Layer 2 solid ground plane ⏹ Layer 3 digital signal routing ⏹Layer 4 solid ground plane ⏹ Power routed by trace⏹ 0402 component size or larger ⏹ 6 mil traces ⏹ 6 mil trace spacing ⏹ 15 mil component spacingFigure 2.Four-Layer PCB StackupFigure 3.Si477x FM/AM Front-End LayoutAN6441.3. FM Front-End1.3.1. FM Front-EndESD diode D1 protects against external antenna ESD events. Place D1 close to the antenna connector. Choose diodes with minimum parasitic capacitance, such as the Tyco Electronics PESD0402-140 (0.25pF).Series inductor L9 (10nH) suppresses EMI.The AM loading capacitor, C10 (18pF) ac-couples the antenna to the input network and resonates with the inductor L3 (150nH).The FM input (FMI, Pin 7) matching network consists of L2 (47nH), C9 (62pF), and AGC-controlled internal resistor banks FMAGC1 (Pin 40) and FMAGC2 (Pin 39). Place these components close to the FMAGC1/2 pins to minimize trace inductance. Connect FMI using two vias and a trace on PCB Layer 2.Connect the LNA output (FMO, Pin 6) to the RF regulator (RFREG, Pin 5) using L1 (220nH). Place L1 and RF regulator bypass capacitor C7 (2.2nF) close the RFREG pin.Connect the LNA output through ac-coupling capacitor C8 (1nF) to input of T1, the external FM balun. The two outputs of the balun are connected to FM mixer inputs (FMXIP, Pin 2 and FMXIN, Pin 3).Shunt Capacitors C11,C22, C24, C25, and C26 are placeholders for filtering caps on the EVB. They may not be required in actual application.Components should be placed close to the IC to minimize trace lengths.All front-end ground connections should be to a common system ground. Alternatively, an RF ground plane should be connected to system ground by a shield or large copper fill.1.3.2. AM Front-EndThe schematic shows two paths to the AM input (AMI, pin 10). The path originating with J33 is used on the evaluation board for conducted testing and is not needed as part of the true application circuit. The path originating from JP1 assumes a loop antenna will be used. JP1 is connected to an external AM transformer (T2).The output of the transformer is ac coupled to the AMI input pin through a 0.1uF capacitor (C13).Ensure R5 is populated for loop antenna reception and J35 is shorted for conducted tests. The output of C13 is connected to the AMI input pin. Components should be placed close to the IC to minimize trace lengths.Shunt Capacitors C23 and C27 are placeholders for filtering caps on the EVB. They may not be required in actual application.AN6444Rev. 0.31.4. System Interface SchematicFigure 4.Si477x System Interface SchematicRFC12NPJ32J29X137.209375MHZ3.2x 2.5NF46U14140393837363534333231302928272625242322212019181716151413121110987654321FMXIP FMXIN GNDRF RFREG FMO FMI NC AMIA 0A 1R S T B S D A S C L I N T B V I O 1V DDBYPVIO2IQCLK IQFS IOUT QOUT DOUT DFS DCLK V AL O U T R O U T X T A L 2X T A L 1D A C R E F G P I O 2G P I O 1F M A G C 2F M A G C 1G N D _P A D D C L K 2D O U T 2NC NC BLEND SI477XC52.2NF100PF C1C22.2NF C32.2NFC2010UFC42.2NF10UFC60.1UFC21VDVAIQCLK V_PGMXOUTLOUTXIN VIO2GPIO_3DCLK QOUT VIO1DOUT DFS ROUT IOUT IQFS INTB_1SCL RSTB_1GPIO_0SDA GPIO_1GPIO_2D_0AN6441.5. System Interface LayoutThe layout for the system interface is shown in Figure5. The following sections discuss the components of this layout.Figure5.Si477x System Interface Layout1.5.1. BypassingThe analog supply VA (Pin 25) requires three parallel bypass capacitors: C1 (100pF), C2 (2.2nF), and C21 (0.1µF). Place these capacitors as close as possible to the VA pin, with the 100pF capacitor closest to the pin. Place a via connecting the VA pin and the capacitors to the system VA supply such that the capacitors are closer to the Si477x VA pin than the via. Connect all three capacitors to the surrounding ground fill with wide, low-inductance traces and vias. See Figure6.AN644DACREF bypass capacitor locationVA supply VIA locationVA bypass capacitor location andground fillFigure6.Si477x VA Supply Bypassing LayoutThe voltage reference for the audio DAC (DACREF, Pin 36) requires a 10µF capacitor (C6) to ground. Both VA and DACREF bypassing should be connected to the system ground plane.The digital supply VD (Pin 20) requires two parallel bypass capacitors, C3 (2.2nF), and C20 (10µF). Place these capacitors as close as possible to the VD pin, with the 2.2nF capacitor closest to the pin. Place a via connecting the VD pin and the capacitors to the system VD supply such that the capacitors are closer to the Si477x VD pin than the via. See Figure7, “Si477x VD/VIO1/VIO2 Supply Bypassing Layout”.The control (VIO1, Pin 19) and data bus interface (VIO2, Pin 22) supplies each require a 2.2nF bypass capacitor (C4, C5). Place each capacitor as close as possible to the corresponding VIO pin. Place a via connecting the VIO pin and the capacitor to the system VIO supply such that the capacitor is closer to the Si477x VIO pin than the via. Connect all digital bypass capacitors (C3, C20, C4, C5) only to the digital bypass ground (DBYP) Pin 21 with a wide, low-inductance trace. Do not connect the digital bypassing capacitors to the PCB ground; this grounding is provided by the Si477x internally. See Figure7, “Si477x VD/VIO1/VIO2 Supply Bypassing Layout”.AN644Figure7.Si477x VD/VIO1/VIO2 Supply Bypassing Layout1.5.2. Reference ClockThe Si477x generates all internal clocking from an external crystal using an on-chip oscillator or an external refer-ence clock. The supported crystal and external clock source frequency is 4MHz. The reference clock/crystal accu-racy must be within ±100ppm.X1 is an optional crystal required only when using the internal oscillator feature. Place the crystal, X1, as close to XTAL1 (Pin 35) and XTAL2 (Pin 34) as possible to minimize current loop lengths. If an external clock source is used instead of a crystal, route the clock through series capacitor C12 to XTAL2 and leave XTAL1 floating (NC). Route the RCLK trace as far away from digital I/O traces as possible to minimize capacitive coupling.1.5.3. Analog Audio / MPX Output (Si4777)High-fidelity digital-to-analog converters (DACs) drive analog audio signals or the FM MPX signal to LOUT/MPX-OUT (Pin 32) and ROUT (Pin 33). For analog audio and FM MPX information, refer to the Si477x data sheet.AN6441.5.4. Control InterfaceAll control interface signals operate at VIO1 supply levels. Route all control interface traces on Layer 2 to minimize coupling to the RF front-end. SDA and SCL (Pins 16 and 17) are an I2C-compatible serial port slave interface, which allows an external controller to send commands and receive responses from the Si477x. Both the SDA and SCL signals require external pull-up resistors to VIO1. The value of pull-up resistor values will vary based on the number of devices, capacitance, and speed of the bus. Placement location is not critical. Refer to the I2C specifica-tion for additional design information. For I2C Control Bus information, refer to the Si477x data sheet.A0 and A1 (Pins 11 and 12) select the I2C device address. Leave each pin either floating (NC) or connected to the system ground. For I2C Device Address selection, refer to the Si477x data sheet.RSTB (Pin 15) is the global chip reset input. Setting the RSTB pin low disables analog and digital circuitry, resets the registers to their default settings, and disables the bus. Setting the RSTB pin high brings the device out of reset. For Reset, Powerup, and Powerdown information, refer to the Si477x data sheet.INTB (Pin 18) is an active low interrupt output. See “AN645:Si477x Programming Guide” for interrupt configuration. Series termination resistors may be added to the SDA, SCL, and INTB traces to mitigate system noise and control slew rate. Confirm that data sheet timing requirements are met with the selected series termination resistor value. Place the series termination resistors for SDA and INTB as close to the Si477x as possible. Place the series termi-nation resistor for SCL close to the host controller.1.5.5. Digital Audio InterfaceThe digital audio interface includes data serial lines containing audio data (DOUT, Pin 27), a bit clock (DCLK, Pin 29), and a word frame for left- and right-channel data (DFS, Pin 28). For Digital Audio Interface information, refer to the Si477x data sheet.All digital audio signals operate at VIO2 supply levels. Route all digital audio traces on Layer 3 to minimize coupling to the RF front-end.Series termination resistors may be added to the DOUT, DCLK, and DFS traces to mitigate system noise and control slew rate. Confirm that data sheet timing requirements are met with the selected series termination resistor value. Place the series termination resistors for DCLK and DFS as close to the host controller as possible. Place the series termination resistor for DOUT close to the Si477x.AN6441.5.6. Digital I/Q ZIF Output and IBOC Blend Mode (Si4777)All digital I/Q signals operate at VIO2 supply levels. Route all digital I/Q traces on Layer 3 to minimize coupling to the RF front-end.The digital ZIF I/Q output provides the down-converted channelized AM/FM signal at baseband to a third-party pro-cessor for IBOC signal processing. The ZIF I/Q 4-pin interface consists of two data serial lines containing I and Q data (IOUT/QOUT, Pins 25/26), a bit clock (IQCLK, Pin 23), and a word frame for each data sample (IQFS, Pin 24). Connect these traces to the I/Q input of the HD Radio Demod.In IBOC Blend Mode (Si4777), Pins 27 through 30 (DOUT, DFS, DCLK, XOUT) are digital audio and blend control inputs. Connect these pins to a third-party processor's digital audio master output and blend control output. Pins 13, 14, and 18 (DCLK2, DOUT2, and DFS2) are blended digital audio outputs. Connect these pins to a digital audio master host processor. See the Si477x data sheet, section “4.12 IBOC Blend Mode for HD Radio”. The HD system implementation is shown below in Figure8.Figure8.System Implementation of HD-Radio Reception with IBOC BlendAN6441.6. Thermal Performance for Two-Layer Module ApplicationsWhen designing a small, two-layer based on the Si477x, the module size must be no less than 3 x 5cm to achieve best thermal performance, as a larger board area dissipates heat more readily. Place all LDOs on the base board if possible, to eliminate heat sources on the module. Lowering VA from 5.0V to 4.8V decreases board temperature without RF performance degradation.Connect the IC ground paddle to the bottom layer PCB ground using vias to dissipate heat. Place large vias on the ground paddle connected to the bottom layer ground as shown in Figure9. Do not use vias with diameter greater than 20mils, as this may impact RF performance. Standard 1mil via plating lowers thermal resistance and helps decrease temperature.Figure 9.Si477x Ground Paddle Via PlacementConnect NC pins, I 2C address select pins A0/A1, and the IC ground paddle to the top layer ground with solid ground fill to lower thermal resistance.For two-layer module designs, 2oz Cu weight (70µm) is required to maximize thermal performance. FR4-370HR PCB material is recommended for best thermal and RF performance due to its thermal conductivity.AN6441.7. Design Checklist*⏹ Place VA bypass capacitors C1, C2, and C21 as close as possible to the Si477x supply pin.⏹ Place VD bypass capacitors C3 and C20 as close as possible to the Si477x supply and digital bypass(DBYP) pins.⏹ Place VIO1/VIO2 bypass capacitors C4 and C5 as close as possible to the Si477x supply and digitalbypass pins (DBYP).⏹ Route supplies using wide, low-inductance traces. Ensure that each trace is rated to handle the requiredcurrent.⏹ Route all supply connections through a via such that the bypass capacitors are closer to the Si477x supplypins than the source via.⏹ Place crystal X1 as close as possible to the Si477x XTAL1/XTAL2 pins.⏹ Select a crystal with accuracy of ±100ppm.⏹ Place the Si477x close to the antenna connector to minimize RF front-end trace lengths and capacitanceand to minimize inductive and capacitive coupling.⏹ Route all traces to minimize inductive and capacitive coupling by keeping digital traces away from analogand RF traces, minimizing trace length, minimizing parallel trace runs, and keeping current loops small.⏹ Route digital traces between ground planes for best performance.⏹ Add series termination resistors to digital signals if necessary to mitigate noise coupling. Ensure timingspecifications are maintained when adding series terminations.⏹ Connect the Si477x ground pad to the ground plane using multiple vias to minimize ground potentialdifferences and achieve optimal thermal performance.⏹ Do not route signal traces under the Si477x.⏹ Do not route digital or RF traces over breaks in the ground plane.⏹ Flood the primary and secondary routing layers with separated RF and system grounds, and connect alllayers using stitching vias.⏹ PCB size should be no less than 3 x 5cm in a two-layer module application. Use 2oz Cu and FR4-370PCB material for best thermal performance.⏹ Place 20-mil diameter vias at the IC ground paddle to for heat dissipation.⏹ Use NC pins and I2C address lines pins 9-10 to connect ground paddle to top layer ground. The groundarea should be as large as possible with many ground vias on it.*Note:Design checklist is listed in order of importance.AN6441.8. Bill of Materials: Si477x FM/AMTable 1. Si477x FM/AM Bill of MaterialsDesignatorDescription Value ManufacturerPart Number C1CAP ,SM,0402100pF Murata GRM1555C1H101JZ01C2,C3,C4,C5,C7CAP ,SM,0402 2.2nF Murata GRM155R71H222KA01C6,C20CAP ,SM,040210µF Murata GRM188R60J106ME47D C8CAP ,SM,0402 1.0nF Murata GRM155R71H102KA01C9CAP ,SM,040262pF Murata GRM1555C1H620JD01C10CAP ,SM,040218pFMurataGRM1555C1H180JZ01C11,C12,C22,C23,C24,C25,C26,C27CAP ,SM,0402NPC13,C17,C21CAP ,SM,04020.1µF MurataGRM155R71A104-KA01D D1,D2,D3ESD PROTECTOR,14VDC,SMDigikey PESD0402-140TR-ND L1IND,SM,0603220nH Murata LQW18ANR22G00L2IND,SM,060347nH Murata LQW18AN47NG00L3IND,SM,0603150nH Murata LQW18ANR15G00L9IND,SM,060310nHMurata LQW18AN10NJ00DT1Balun, 1:1TOKO #458PT1566T2Transformer Silicon LaboratoriesSL755TF01R1,R4,R5RES,SM,04020U1IC,SM,SI4770,MLP40Silicon LaboratoriesSI4770U2IC, SM, RAM Microchip34LC02X1XTAL,SM,37.209375MHz TAI-SAW TZ1522AJ29,J32,J36,J37RES,SM,0402,SOL-DER_BUMP_JUMPER NPJ1,J33CONN, SMA, EDGEMOUNTAEPCONNECTORSJ2CONN,SM,SFM,2X30,0.05INPITCHSamtecSFM-130-02-S-D-AAN644JP1CONN,TH,HEADER,.100PITCH,1X2Samtec HTSW-101-07-G-DJ3,J4,J5,J6,J7, J8,J9,J10,J11, J12,J13,J14,J15,J16,J17, J18,J19,J20, J21,J22,J23, J24,J25,J26, J27,J28,J30, J31,J35RES,SM,0402,SOL-DER_BUMP_JUMPERTable 1. Si477x FM/AM Bill of Materials (Continued)Designator Description Value Manufacturer Part NumberAN644D OCUMENT C HANGE L IST Revision 0.1 to Revision 0.2⏹Updated "1.3.1. FM Front-End" on page 3. Revision 0.2 to Revision 0.3⏹Updated Table1 on page12.● Updated T1 designator part number.DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. 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Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. 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表面技术第53卷第5期煤油流量对HVOF喷涂FeCrMoSi-Ti3SiC2涂层高温摩擦磨损性能的影响何陶a,b，刘侠a*，张世宏a,b，常诚a,b，杨阳a，薛召露a，杨康a（安徽工业大学 a.先进金属材料绿色制备与表面技术教育部重点实验室b.材料科学与工程学院，安徽 马鞍山 243002）摘要：目的提高燃煤锅炉四管的耐磨性能。

方法使用喷雾造粒技术制备FeCrMoSi/Ti3SiC2复合粉末，并利用超音速火焰喷涂技术（HVOF）在12CrMoV基体上制备煤油流量分别为26、28、30、32 L/h的复合涂层。

使用X射线衍射仪（XRD）、扫描电镜（SEM）及其自带的能谱仪（EDS）、Raman、维氏显微硬度计和摩擦磨损试验机研究FeCrMoSi/Ti3SiC2粉末及其涂层相组成、组织结构，检测涂层的力学性能，并对涂层在800 ℃下的摩擦学性能和磨损机理进行系统分析。

结果粉末物相主要由Ti3SiC2、Fe-Cr和TiC组成，涂层的物相与粉末类似，但是新产生了SiC相，且随着煤油流量的升高，Ti3SiC2物相逐渐分解。

当煤油流量为30、32 L/h时，涂层内Ti3SiC2物相大量分解。

涂层的硬度和断裂韧性随着煤油流量的升高表现出先升高、后降低的趋势，孔隙率和磨损率呈现先减小、后增大的趋势。

当煤油流量为28 L/h时，涂层磨损率最低，约为5.44 ⨯ 10-15 m3/(N·m)。

结论煤油流量为28 L/h时，涂层表面生成的SiO2、TiO2和Fe2O3等氧化物均匀分布在磨痕和对偶球表面，有效阻挡了对偶球和涂层的直接接触，使得涂层显示出最优异的摩擦学性能。

涂层的主要磨损机制为氧化磨损和黏着磨损。

关键词：FeCrMoSi/Ti3SiC2复合涂层；超音速火焰喷涂；煤油油量；显微组织；高温磨损；氧化层中图分类号：TH117 文献标志码：A 文章编号：1001-3660(2024)05-0060-09DOI：10.16490/ki.issn.1001-3660.2024.05.006Effect of Kerosene Flow Rate on Friction and Wear Properties ofHVOF Sprayed FeCrMoSi-Ti3SiC2 Coating at High Temperature HE Tao a,b, LIU Xia a*, ZHANG Shihong a,b, CHANG Cheng a,b, YANG Yang a, XUE Zhaolu a, YANG Kang a(a. Key Laboratory of Green Preparation and Surface Technology of Advanced Metal Materials, Ministry of Education,b. School of Materials Science and Engineering, Anhui University of Technology, Anhui Maanshan 243002, China)ABSTRACT: Titanium silicon carbon (Ti3SiC2) is a new ternary compound MAX phase with excellent properties of both metallic and ceramic materials and it is prone to form oxide film on the friction surface, which makes it show excellent tribological performance at high temperature. However, the phase decomposition of Ti3SiC2-based coating prepared by thermal收稿日期：2023-03-24；修订日期：2023-06-29Received：2023-03-24；Revised：2023-06-29基金项目：国家自然科学基金（U22A20110）；安徽省高校协同创新项目（GXXT-2020-071）Fund：The National Natural Science Foundation of China (U22A20110); The University Synergy Innovation Program of Anhui Province (GXXT-2020-071)引文格式：何陶，刘侠，张世宏, 等. 煤油流量对HVOF喷涂FeCrMoSi-Ti3SiC2涂层高温摩擦磨损性能的影响[J]. 表面技术, 2024, 53(5): 60-68.HE Tao, LIU Xia, ZHANG Shihong, et al. Effect of Kerosene Flow Rate on Friction and Wear Properties of HVOF Sprayed FeCrMoSi-Ti3SiC2 Coating at High Temperature[J]. Surface Technology, 2024, 53(5): 60-68.*通信作者（Corresponding author）第53卷第5期何陶，等：煤油流量对HVOF喷涂FeCrMoSi-Ti3SiC2涂层高温摩擦磨损性能的影响·61·spraying technology is easy to occur, which affects its performance and restricts its wide application in high temperature protection filed. The work aims to individually granulate Ti3SiC2 powder by spray granulation technique, and then investigate the effect of different kerosene flow rates on the coating phase structure and tribological properties at high temperature.Ti3SiC2 particles were ground by a vertical planetary ball mill and mixed with quantitative deionized water and binder to obtain Ti3SiC2 water-based slurry, and then spherical Ti3SiC2 powder was prepared by spray granulation technique. The 12CrMoV matrix square sample with the size of 20 mm × 20 mm × 5 mm was prepared by electric discharge wire cutting mechanism. Before spraying experiment, the matrix sample was roughened by sand blasting and cleaned by ultrasonic with alcohol. The composite coatings with kerosene flow rates of 26 L/h, 28 L/h, 30 L/h and 32 L/h were prepared on 12CrMoV matrix by supersonic flame spraying (HVOF) technology. The phase composition, microstructure of powder and coating were investigated with X-ray diffractometer (XRD), scanning electron microscope (SEM), energy spectrometer (EDS) and Raman spectrum. Vickers microhardness tester and high temperature friction wear testing machine were applied to test the mechanical properties and the tribological properties. Finally, the wear mechanism of the coating at 800 ℃ was analyzed.The results indicated that the powder phase was mainly composed of Ti3SiC2, Fe-Cr and TiC. The coating phase was similar to that of the powder, but a new SiC phase appeared. With the increase of kerosene flow, the Ti3SiC2 phase was gradually decomposed. When the kerosene flow was 30 L/h and 32 L/h, the Ti3SiC2 phase in the coating was decomposed a lot. The average microhardness of K-26, K-28, K-30 and K-32 coatings was 359HV0.3, 528HV0.3, 548HV0.3 and 485HV0.3, the fracture toughness was 3.75, 3.94, 4.65 and 3.95 MPa·m1/2, and the mean friction coefficient was 0.48, 0.45, 0.59 and 0.52, respectively. The hardness, fracture toughness and average friction coefficient of the four coatings all increased firstly and then decreased with the increase of kerosene flow. The porosity of coatings K-26, K-28, K-30 and K-32 was 1.03, 0.44, 0.31 and1.62, and the wear rates was 6.17⨯10-15, 5.44⨯10-15, 8.62⨯10-15 and 6.79⨯10-15 m3/(N·m), respectively. The porosity and wearrate of the four coatings decreased firstly and then increased with the increase of kerosene flow. In summary, when the kerosene flow rate was 28 L/h, the coating had higher MAX content, higher hardness and lower porosity, which ultimately resulted in the lowest coefficient of friction and wear rate.The K-28 coating retains a high content of MAX phase, and the oxides such as SiO2, TiO2 and Fe2O3 generated on the surface are evenly distributed on the surface of the wear scars and dual ball, effectively blocking the direct contact between the dual ball and the coating, which makes the coating show the most excellent tribological performance.KEY WORDS: FeCrMoSi/Ti3SiC2 composite coating; supersonic flame spraying; kerosene flow rate; microstructure; high temperature friction and wear; oxide layer目前我国发电方式仍以火力发电为主，但电站燃煤锅炉的高温防护问题一直是长期困扰行业的技术难题。