A class D output stage with zero dead time

低档运放JRC4558。

这种运放是低档机器使用得最多的。

现在被认为超级烂，因为它的声音过于明亮，毛刺感强，所以比起其他的音响用运放来说是最差劲的一种。

不过它在我国暂时应用得还是比较多的,很多的四、五百元的功放还是选择使用它，因为考虑到成本问题和实际能出的效果,没必要选择质量超过5532以上的运放。

对于一些电脑有源音箱来说，它的应付能力还是绰绰有余的。

运放之皇5532。

如果有谁还没有听说过它名字的话，那就还未称得上是音响爱好者。

这个当年有运放皇之称的NE5532，与LM833、LF353、CA3240一起是老牌四大名运放，不过现在只有5532应用得最多。

5532现在主要分开台湾、美国和PHILIPS生产的，日本也有。

5532原来是美国SIGNE公司的产品，所以质量最好的是带大S标志的美国产品，市面上要正宗的要卖8元以上，自从SIGNE被PHILIPS 收购后，生产的5532商标使用的都是PHILIPS商标，质量和原品相当，只须4-5元。

而台湾生产的质量就稍微差一些，价格也最便，两三块便可以买到了。

NE5532的封装和4558一样，都是DIP8脚双运放（功能引脚见图），声音特点总体来说属于温暖细腻型，驱动力强，但高音略显毛糙，低音偏肥。

以前不少人认为它有少许的“胆味”，不过现在比它更有胆味的已有不少，相对来说就显得不是那么突出了。

5532的电压适应范围非常宽，从正负3V至正负20V都能正常工作。

它虽然是一个比较旧的运放型号，但现在仍被认为是性价比最高的音响用运放。

是属于平民化的一种运放，被许多中底档的功放采用。

不过现在有太多的假冒NE5532，或非音频用的工业用品，由于5532的引脚功能和4558的相同，所以有些不良商家还把4558擦掉字母后印上5532字样充当5532，一般外观粗糙，印字易擦掉，有少许经验的人也可以辨别。

据说有8mA的电流温热才是正宗的音频用5532。

NE5532还有两位兄弟NE5534和NE5535。

山东省烟台市芝罘区（五四制）2023-2024学年九年级上学期期中考试英语试题学校:___________姓名：___________班级：___________考号：___________一、阅读单选China has a lot of intangible cultural heritages of humanity（人类非物质文化遗产）. In1．Which of the following is NOT mentioned in the passage?A．The main roles of Peking Opera.B．The location of Fanjing Mountain.C．The reason why few young people would like to pass Tai Chi on.D．The person who first discovered Zhusuan.2．Why is The Twenty-four Solar Terms so important in our daily life?A．It appeared about 2000 years ago.B．It is known as the fifth great invention of China.C．It tells the relationship between agriculture and climate.D．It was created by ancient Chinese people to predict weather.3．What is the writing purpose of this passage?A．To advise people to use abacus in their life.B．To ask people to visit Fanjing Mountain.C．To let people know more about Twenty-four Solar Terms.D．To introduce five intangible cultural heritages of humanity of China.On March 3, 1887, the lives of two amazing women were changed forever when Anne Sullivan, a poor university graduate, arrived at the home of the wealthy Keller family to teachtheir six-year-old daughter Helen. It was a difficult job as Helen was unable to see, hear or speak because of illness.Anne had been suggested to the Kellers by her university professor, a close friend of Mr. Keller. Before she arrived, Anne expected her new pupil to be a quiet, weak child. But Helen was nothing like that. When Anne first walked through the Kellers’door, the energetic Helen nearly knocked her over in her hurry to feel Anne’s face, clothing and bag.Helen was used to visitors bringing her sweets, and angrily tried to open Anne’s case to take her candy. But Anne calmed her down by allowing Helen to play with her watch. So began one of the most successful student-teacher relationships in history.Anne Sullivan was only twenty years old when she began teaching Helen. She had to not only teach the child all the usual school subjects, but also control Helen’s sometimes wild behavior.Her well-meaning parents allowed Helen to do as she liked at home. Realizing that such an environment was unsuitable for learning, Anne requested that she and Helen live in a small house nearby.As soon as Helen began learning, it became clear that she was especially intelligent. She quickly learned to read and write, and by the age of ten she could also speak.In 1900, Helen started studying at Radcliffe University, and graduated first in her class in 1904. She was the very first blind and deaf person to get a university degree. How did she do it? Anne Sullivan read all of Helen’s books and then signed the information into her hand. Anne remained at Helen’s side until her death in 1936. Helen became a world-famous writer, and fought for disabled people’s rights until her death on June 1, 1968.※graduate: 1. 毕业生n. 2. 毕业v.4．How did Anne come to work at the Kellers’ home?A．She replied to a job advertisement.B．She was introduced by her family friend.C．She was recommended (推荐) by her university professor.D．She met Mr. Keller while studying at university.5．Why was it a difficult job for Anne to be Helen’s teacher?A．Because Helen was wild and energetic.B．Because she was new and had no teaching experience.C．Because Helen’s parents allowed her to do anything she liked.D．Because Helen was unable to see, hear or speak.6．According to the passage, Helen’s parents ________.A．allowed her to do as she wished at homeB．gave her too many gifts and sweetsC．did not spend much time with herD．cared little about her education7．Which of the following is NOT true about Helen’s university studies?A．She was greatly helped by Anne.B．She was the best student in her class.C．She was able to graduate in three years.D．She was the first deaf and blind university graduate.China has rich food culture. There are interesting stories behind some cuisine (菜肴), as well as table manners relating to tableware (餐具).HotpotHotpot has been popular among Chinese people for a long time. As early as in the Shang Dynasty (c. 16th Chinese century—11th century BC), people boiled foods in bronze cauldrons (青铜鼎). The cauldron had two parts — one was the pot to cook foods in soup, and the other part was a layer (层) or a space inside the cauldron to hold firewood.People started to have lattice (分格的) hotpot during the Han Dynasty (206 BC—AD 220). They divided pots into several parts to enjoy different flavors (口味).Yuan Mei was a poet and foodie (美食家) in the Qing Dynasty (1644—1911). He mentioned huoguo, the Chinese name for hotpot, in a book about all kinds of food. At that time, hotpot was very popular. People put all kinds of meat and vegetables into the hotpot. They also used different materials, such as copper (铜) and iron (铁), to make pots.Dongpo porkThere is a famous Chinese dish called “Dongpo pork”. Does it have anything to do with the great poet Su Dongpo?Yes. Su Dongpo (Su Shi) was a poet who lived during the Song Dynasty (960—1279). He was the first to make this dish. When he was a local official in Huangzhou, Hubei, he fell in love with cooking pork. In his article Ode to Pork (《猪肉颂》), Su wrote about how to cook it.According to folk stories, the dish became well-known when Su went to Hangzhou, Zhejiang, to take office. One day, there was a big flood and Su went out to help people. People heard that Su loved eating pork, so they gave him a lot of it. But Su wanted to give it back. He cooked the pork in his own special way. Then he gave the dish to every family in the city and every worker on the street. Very soon the dish became famous in Hangzhou and got the name “Dongpo pork”.ChopsticksWhat are the dos and don’ts of using chopsticks?For Chinese people, chopsticks are not just simple tools to pick up food. They come with their own special rules and traditions.First, people should not make noise with chopsticks. Playing with chopsticks is seen as rude, just as playing with forks and knives in a Western country is.There are also some superstitions (迷信) related to chopsticks. For example, some people believe that chopsticks should not be left standing upright in a bowl. It looks like the incense (香) that Chinese people use to honor (祭奠) the dead. Doing it at the dinner table is believed to bring bad luck.You should not tap chopsticks on the edge (边缘) of the bowl either, as beggars do this to ask for food.8．When did people start to have lattice hotpots?A．During the Shang Dynasty.B．During the Qin Dynasty.C．During the Han Dynasty.D．During the Qing Dynasty. 9．According to the story, what were pots made of in Qing Dunasty?A．Bronze cauldron.B．Copper and iron.C．Wood and bamboo.D．Gold and silver.10．Why “Dongpo pork” was named after Su Dongpo?A．Because he created the dish.B．Because he wrote a poem to praise the dish.C．Because he spread the dish to more cities.D．Because people made the dish to remember him.11．What is a taboo (禁忌) when Chinese people are using chopsticks?A．Using chopsticks to pick up food for guests.B．Laying chopsticks sideways on the table.C．Sticking chopsticks in the food and leaving them upright.D．Picking up things other than food with chopsticks.The 19th Asian Games were held in Hangzhou on September 23rd this year, which was also the day of the traditional Chinese festival “Autumn Equinox” (秋分), with the meaning of a good harvest. Through the theme of “Heart to Heart, @Future”, the event not only celebrated sports but also promoted (促进) cultural exchange among nations.Topic 1: Embracing (拥抱) Chinese Traditional cultureThe opening ceremony reflected the Chinese culture, drawing inspiration from the rich history and traditions of the country. It included elements (元素) of “Culture of Ancient Song Dynasty (宋韵文化)”, celebrating the timeless beauty of ancient Chinese customs. Impressive performances and visual displays showed the grace of traditional Chinese dance, art and classical poem, spreading Chinese culture to the world.Topic 2: Embracing Technological Advancements (进步)In addition to honoring tradition, the Hangzhou Asian Games stressed China’s status as a global leader in technological innovation (技术创新). For example, the use of Digital Human (数字人) to light the torch showed China is making progress.Topic 3: Embracing Global CooperationThe opening ceremony of the Hangzhou Asian Games also expressed a powerful message of global cooperation. The concept of “a Community of Shared Future” and “Green Mountains and Clear Waters are Invaluable Assets” (绿水青山就是金山银山) stressed the importance of environmental protection and the idea that a harmonious world is everyone’s responsibility.ConclusionThe Hangzhou Asian Games opening ceremony was a fantastic display. By showing the beauty of Chinese culture, embracing technological advancements, and promoting global cooperation, the event gave an example of the true meaning of the Games.12．When were the 19th Asian Games held?A．In Hangzhou, China.B．On September 23rd , 2023.C．In Tokyo, Japan.D．On July23rd, 2021.13．What’s the theme of the 19th Asian Games?A．Heart to Heart, @Future.B．Culture of Ancient Song Dynasty.C．A Community of Shared Future.D．Green Mountains and Clear Waters are Invaluable Assets.14．How was the torch lit in the opening ceremony?A．By a world-known player.B．By a famous leader.C．By an advanced robot.D．By a digital human.15．Which topic of the following is not mentioned in the passage?A．Embracing Chinese Traditional culture.B．Embracing Technological Advancements.C．Embracing Worldwide Peace.D．Embracing Global Cooperation.二、阅读还原6选5阅读下面短文，从短文后的选项中，选出可以填入空白处的最佳选项。

DESCRIPTIONThe Model 4052 Pump -Down Controller provides total control for duplex pumping systems. The Model 4052 monitors, controls and displays the liquid level in a tank or reservoir. Maximum selectable depth is from 11.5 ft. to 346 ft.The input to the Model 4052 can be from any 2 or 3-wire transducer with a 4-20mA output representing the selected depth. A 24VDC regulated probe supply is included. A Level Simulator is provided to aid in programming these five set points; Low Alarm, Pumps Off, Level 1, Level 2 and High Alarm.A universal zero to 30 second On Delay can be programmed to prevent outputs from closing due to input fluctuations caused by turbulent conditions. An additional 4-20mA output with zero and span controls is provided for a chart recorder or other external device.Four heavy -duty 10 amp, 120V contacts are provided for pump control and alarm activation. An auto -dialer or other emergency device can be activated with the SPDT power loss relay. This relay is held open when power is applied.Pump outputs include duplex alternation as well as hand -off -auto switches. Pump run -time can be displayed for each pump with tenth of an hour resolution, up to 99,999.9 hours. The Model 4052 can be panel -mounted (11 1/8” x 4 5/8) or surface -mounted using the optional surface -mounting kit (Model 4000).MODEL 4052Pump -Down Controller● 4-20mA Input/Scalable Output ● Seal Fail Monitoring ● Duplex Pump Alternation ● Hand -Off -Auto Controls ● Dual Run -time Meters● RS -485/Modbus Communications Telephone: Main - (918) 438-1220 Sales - (800) 862-2875 Fax: (918) 437-7584 11440 East Pine Stree t Tulsa, Oklahoma 74116SPECIFICATIONSMODEL4052Input Voltage 120VAC ± 10% 50/60HzPwr Consumption 8W max.Signal Input 4-20mA (optional 0-5V), 2 or 3 wireSignal Input Load 250 ohms max. Dead Band 1% of full scaleRepeat Accuracy ± 1% of scaled max. (fixed conditions)Display Type 6 digit red LED display Display RangesLevel: 00.0 to 346 ftRuntime: zero to 99,999.9 hours Delay:zero to 30 seconds Display Resolution 1 decimal placeControl Contacts 4 SPDT 10A at 120VAC resistive Power Loss Relay 1 SPDT 5A at 120VAC resistiveSignal OutputOutput is factory set to track the 4-20mA input. Zero and span adjustments are provided : as little as a 2mA change can cause a full swing of the output.Signal Output Load 300 ohms max. Probe Supply 24VDC regulated Setpoints3 levels, 2 alarms, all user -adjustableOperating Temp +14º to +122º FHumidity Tolerance 0-97% w/o condensationEnclosure Material 16 gauge steelTermination removable terminal strips Dimensions H: 5.5” W: 12.0” D: 4.75”Weight6.0 poundsAgency ApprovalsUL Recognized (U.S. & Canadian)DIMENSIONSA 6 digit LED displayM Indicates display is showing HIGH ALARM setting B Indicates display is showing LIQUID LEVEL N Indicates display is showing ON DELAY setting C Indicates display is showing PUMP #1 runtime O Controls ZERO setting for 4 to 20mA output D Indicates display is showing PUMP #2 runtime P Controls SPAN setting for 4 to 20mA output E Switches display between B, C and D Q Indicates LOW ALARM ACTIVE (low alarm relay -closed) F Push to enter SET mode R Indicates PUMP #1 RUNNING (pump #1 relay -closed) G Push ☐ to INCREASE setting S Indicates PUMP #2 RUNNING (pump #2 relay -closed) H Push ❑ to DECREASE settingT Indicates HIGH ALARM ACTIVE (high alarm relay -closed) I Indicates display is showing LEVEL 1 setting U 3-position switch HAND -OFF -AUTO Pump #1 J Indicates display is showing PUMPS OFF setting V 3-position switch HAND -OFF -AUTO Pump #2 KIndicates display is showing LOW ALARM settingWMomentary pushbuttonengages LEVEL SIMULATORL Indicates display is showing LEVEL 2 settingX Controls SIMULATED LEVEL(when SIMULATOR button is engaged)MODEL 4052 Pump Down ControllerREAD ALL INSTRUCTIONS BEFORE INSTALLING, OPERATING OR SERVICING THIS DEVICE.KEEP THIS DATA SHEET FOR FUTURE REFERENCE.GENERAL SAFETYPOTENTIALLY HAZARDOUS VOLTAGES ARE PRESENT AT THE TERMINALS OF THE MODEL 4052. ALL ELECTRICAL POWER SHOULD BE REMOVED WHEN CONNECTING OR DISCONNECTING WIRING.DO NOT EXCEED THE OUTPUT OR INPUT RATINGS, AS STATED IN THE SPECIFICATIONS.PROTECT THE UNIT WITH PROPERLY RATED FUSES.DO NOT INSTALL IN DAMP OR MOIST AREAS.THIS DEVICE SHOULD BE INSTALLED AND SERVICED BY QUALIFIED PERSONNEL.Installation InstructionsTelephone: Main - (918) 438-1220 Sales - (800) 862-2875 Fax: (918) 437-7584 11440 East Pine Stree t Tulsa, Oklahoma 74116figure 1. Front Panel Controlsfigure 2. Back Panel ControlsMOUNTING & WIRINGMount the Model 4052 Pump -Down Controller in apanel or suitable enclosure (see Time Mark’s Model 4000 Surface Mount kit ).Referring to the terminal block decals on the unit, and Figure 2, make the following connections:SIGNAL INPUTWith a 3-wire 4-20mA transducer (see Time Mark Model 450) remotely mounted, connect the +24VDC OUT terminal to the voltage input of the transducer (figure 3). Connect the 4-20mA IN terminals to the loop terminals of the transducer. OBSERVE POLARITY. figure 3.MODEL 4503-WIRE TRANSDUCER+24VDC4-20mAPIN 5PIN 84-20m A I N + -GND PIN 44-20m A O U T+ -+24V D C O U T + -GNDMODEL 4052 Pump Down ControllerSIGNAL OUTPUTThe 4-20mA output is proportional to the input signal.This allows for very accurate remote monitoring of level changes. The factory default is for the output to track the input; that is, a 4mA signal represents 00.0 feet, and a 20mA signal represents 34.6 feet. However, the output can be zeroed and spanned to a specific range, not necessarily the same as the reading on the LED display.The 4-20mA OUT terminals may be connected to a remote display or other devices. Connect these terminals as required for your application. OBSERVE POLARITY of the connections.RELAY OUTPUTSSPDT contacts are provided for PUMP 1, PUMP 2, HI -ALARM, LO -ALARM and POWER FAIL relays. Make wiring connections as required.OPERATING POWERConnect a chassis ground to the lug marked GND and the terminal marked G .Connect 120VAC operating power to the terminals marked L (line) and N (neutral).figure 4.GND4-20m A I N + -4-20m A O U T+ -+24V D C O U T + -- EXCITATION (BLK)+ EXCITATION (RED)MODEL 456-15PRESSURE TRANSDUCERConnect a 2-wire transducer (pressure, ultrasonic, etc.) as shown in figure 4. Telephone: Main - (918) 438-1220 Sales - (800) 862-2875 Fax: (918) 437-7584 11440 East Pine Stree t Tulsa, Oklahoma 74116USER SELECTABLE PROBE SETTINGSPROGRAMMING - SET modeThe Model 4052 Controller has been factory tested and calibrated. Factory settings are as follows:HIGH ALARM10.0 ftLEVEL 28.0 ftLEVEL 1 6.0 ftPUMPS OFF 4.0 ftLOW ALARM 2.0 ftNOTE: Both Hand-Off-Auto (H.O.A.) switches MUST be in the OFF position before entering the SET mode.To enter the SET mode, push the button marked SET PROGRAMMING - SET mode (Cont’d)The display will now show the LOW ALARM setpoint. Change the LOW ALARM setpoint to the desired level, using the ☐or❑keys (figure 1G,H) to the right of the SET button. After setting the LOW ALARM setpoint, press the SET button again. The display now shows the PUMPS OFF setting.Using this same procedure, set the PUMPS OFF, LEVEL 1, LEVEL 2, and HIGH ALARM settings (in that order).After setting the HIGH ALARM, press the SET button, to display the factory setting for the ON DELAY timer. Use the ☐or❑keys (figure 1 G,H) to set the ON DELAY to the desired setting (0 to 30 seconds).After setting the ON DELAY time period, press the SET button again to enter the setting into memory.Review all settings by cycling through the setpoints before proceeding to the DISPLAY mode. Finally, press the DISPLAY button, to enter all settings into memory. OPERATION - DISPLAY modeWhile in DISPLAY mode, the LIQUID LEVEL is shown on the LED display. Pushing the DISPLAY button, while in the DISPLAY mode will change the LED display from LIQUID LEVEL to RUN TIME #1 to RUN TIME #2, and back to LIQUID LEVEL.If the DISPLAY button is not pushed for 60 seconds, the LED display will automatically return to the LIQUID LEVEL setting.NOTE: The LOW ALARM, PUMPS OFF LEVEL 1 and LEVEL 2 settings must move up in value from LOW ALARM to LEVEL 2, to be properly set.The Model 4052 will not enter the DISPLAY mode if these settings are improper. When trying to move to the DISPLAY mode with improper settings, the LED display will automatically return to the SET mode. Adjust the improper setpoint, then continue.The HIGH ALARM setpoint can be set anywhere within the scale.VERIFYING SETTINGSBefore entering automatic operation, the program setting should be reviewed and verified using the following procedure.While in the DISPLAY mode (with H.O.A. switched in the OFF position), the LEVEL SIMULATOR can be engaged.Telephone:Main -(918) 438-1220Sales -(800) 862-2875 Fax:(918) 437-758411440 East Pine Stree t Tulsa, Oklahoma 74116This unit is factory set to 15 psi. To change probe values, press and hold the following buttonswhile powering up:Press &HoldResult:SET Use ☐or❑ keys to select probe values according to the chart below:Display Range PSI Max Ft.Max Display 50-511.518 100-1023.030 15*0-1534.640 200-2046.155 300-3069.275 400-4092.399.9 500-50115120 600-60138160 700-70162175 800-80185200 900-90208225 1000-100230250 1500-150346360☐&❑Restore unit to factory settings*.DISPLAY Select a Modbus address between 0—247 using the ☐or❑ keys. Unit is initially factory set to 1.Press Display to exit setup mode.VERIFYING SETTINGS (Cont’d)Push the LEVEL SIMULATOR momentary push-button (fig. 1W), and hold it down. The input to the external transducer will be disabled and internal level simulator will take its place.Turning the potentiometer (figure 1X ), will simulate changes to the liquid level being monitored.In this mode, simulated changes in liquid level will cause the alarm relays to open and close, the liquid level to change on the numeric display, and all LEDs to operate (PUMP 1 and PUMP 2 LEDs will flash). NOTES:RETURN THE SIMULATOR KNOB TO THE MINIMUM SETTING BEFORE RELEASING THE SIMULATOR BUTTON.The PUMP 1 and PUMP 2 relays will not energize in the LEVEL SIMULATOR mode.AUTOMATIC OPERATIONFor fully automatic operation, set the display to monitor the liquid level, and move the HAND-OFF-AUTO switches to the AUTO position.MANUAL OPERATIONTo manually operate either of the pumps, push the momentary HAND-OFF-AUTO toggle switch for the appropriate pump down to the HAND position, and hold. COMMUNICATION CONNECTOR SEAL FAILFor fully automatic operationConnect one side of a normally open dry contact from seal fail sensor for pump 2 to pin 5 and the other to pin 1.Run Time #2 will flash when contacts close and pump will operate normally.Connect one side of a normally open dry contact from seal fail sensor for pump 1 to pin 6 and the other to pin 1.Run Time #1 will flash when contacts close and pump will operate normally.Note: Seal Fail monitoring is not available on the Model 4052MC configurationRS-485 COMMUNICATIONSee Appendix A: RS-485 Communication for RS-485 Communication settings.WARRANTYThis product is warranted to be free from defects in materials and workmanship for one year. Should this device fail to operate, we will repair it for one year from the date of manufacture. For complete warranty details, see the Terms and Conditions of Sales page in the front section of the Time Mark catalog or contact Time Mark at 1-800-862-2875.Telephone:Main -(918) 438-1220Sales -(800) 862-2875 Fax:(918) 437-758411440 East Pine Stree t Tulsa, Oklahoma 74116Pin Label Name1COM Ground (Top Terminal)2A+RS-485(A+)3B- RS-485(B-)4N/U Not Used5SF2Seal Fail Pump 2 when grounded 6SF1Seal Fail Pump 1 when groundedTYPICAL APPLICATION - Float SwitchesINSTALLATION WORKSHEETJOB NAME:DATE:SETPOINTSFACTORY SETTINGSET AT LEVEL:NOTESHigh Alarm 10 ft Level 2 8 ft Level 1 6 ft Pumps Off 4 ft Low Alarm2 ftTYPICAL APPLICATION - TransducerMODEL 4052 Pump Down ControllerTelephone: Main - (918) 438-1220 Sales - (800) 862-2875 Fax: (918) 437-7584 11440 East Pine Stree t Tulsa, Oklahoma 74116MODEL 4000 Surface -Mount Kit● 20 Ga. CRS Enclosure ● Removable Access PanelDesigned to easily install Time Mark Models 403, 404, 4042, 4052, 4062, or 408 Liquid Level Controllers.This 20 gauge steel enclosure features a removable top panel for easy access to wiring connections. The mounting kit comes complete with everything you need, including steel support brackets. This model is designed specifically for applications that require surface -mounting these Time Mark Liquid Level Controllers.For more information, see the full data sheet in the Time Mark standard products catalog.Telephone: Main - (918) 438-1220 Sales - (800) 862-2875 Fax: (918) 437-7584 11440 East Pine Stree t Tulsa, Oklahoma 74116MODEL 4052MC Optional Configuration● Monitor Motor Control Contacts● Disable Run Time Meters In Fault ConditionThe 4052MC option replaces seal fail monitoring with motor starter monitoring. When the 4052MC calls for a pump to run the corresponding MC contact should close. If the MC contact closes,the pump controller will increment the run time for that pump. If the MC contact does not close, or opens after the pump has been started, the pump controller will not increment the run time for that motor and will flash the Run Time light on the left side of the controller for the corresponding pump.4052MC ConnectorINSTALLATION DRAWING MC1/MC2 CONNECTIONSAPPENDIX A: RS-485 Communications Connect RS-485 A+ to pin 2.Connect RS-485 B- to pin 3Connect RS-485 GND to pin 1Modbus holding registers (Function 03)Address Register in Pump Controller0Level1Low alarm2Pumps off3Level 14Level 25High Alarm6On delay7Run time pump1 low 16 bits8Run time pump1 high 16 bits9Run time pump2 low 16 bits10Run time pump2 high 16 bits11Run time pump1 0.1 seconds12Run time pump2 0.1 seconds13System status14Controller software version15Min low16Max high17Delta runtime pump1 low 16 bits18Delta runtime pump1 high 16 bits19Delta runtime pump2 low 16 bits20Delta runtime pump2 high 16 bits RS-485 Communications (Cont’d) Discrete Read (Function 02)Seal fail when bit = 1.Coils Write (Function 05)Set coil to 1. Unit will perform function and reset coil.MODEL 4052Pump Down ControllerTelephone:Main -(918) 438-1220Sales -(800) 862-2875 Fax:(918) 437-758411440 East Pine Stree t Tulsa, Oklahoma 74116Bit Decimal Signal If bit = 11532768L2ON Level 2 is on1416384L1ON Level 1 is on138192L2EN Level 2 is enabled 124096L1EN Level 1 is enabled 112048ELED2Pump 2 LED is on 101024ELED1Pump 1 LED is on9512TESTF Test button not pressed 8256SETF Set mode7128HAND_2Pump 2 in HAND |664AUTO_2Pump 2 in AUTO |-- 00 pump 2 off 532HAND_1Pump 1 in HAND |416AUTO_1Pump 1 in AUTO |-- 00 pump 1 off 38HI_AL High alarm on24M2RUN Pump 2 running12M1RUN Pump 1 running01LO_AL Low alarm on Address Bit Status00SEAL101SEAL2Address Bit Function00Reset delta runtime pump1 01Reset delta runtime pump2 02Reset Max High and Min Low。

1.General descriptionThe TFA9815is a 2-channel power comparator for high-efficiency class D audio amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive logic,protection control logic and full differential input comparators. By using this power comparator a compact closed-loop self-oscillating digital audio amplifier system oropen-loop system can be built. The continuous output power is 2×17 W in a full-bridge BTL application. The TFA9815 does not require a heat sink and operates using an asymmetrical supply voltage.2.FeaturesI Stereo full-bridge audio amplifier for class D applications I No external heat sink requiredI Operating voltage range: asymmetrical from 8 V to 20 V I Thermally protectedI Zero dead-time switchingICurrent-limiting (no audible interruptions)3.ApplicationsI Self-oscillating or open-loop class D audio amplifier applications I Flat-panel television sets I Flat-panel monitors I Multimedia systems I Wireless speakersIHigh-end CRT television sets4.Quick reference dataTFA9815Stereo full-bridge audio amplifier 2 x 17 WRev. 01 — 16 December 2008Preliminary data sheetTable 1.Quick reference dataV P = 12 V; f osc = 550 kHz; T amb = 25 °C; typical application diagram Figure 12, unless otherwise specified.Symbol ParameterConditionsMinTypMaxUnitGeneral V P supply voltage single, asymmetrical supply (V DD -V SS )81220V I Psupply currentSleep mode-110200µA5.Ordering informationI q(tot)total quiescent current Operating mode; no load; no snubbers; no filter connected -4050mAηpo output power efficiency output power;2×10W into 8Ω8991-%P o(RMS)RMS output powerV P =15V; R L = 8Ω;THD = 10 %1516-W V P =12V; R L = 8Ω;THD = 10 %910-W V P =12V; R L = 6Ω;THD =10%1213-W V P =12V; R L = 4Ω;THD =10%1718-WTable 1.Quick reference data …continuedV P = 12 V; f osc = 550 kHz; T amb = 25 °C; typical application diagram Figure 12, unless otherwise specified.Symbol Parameter ConditionsMin Typ Max Unit Table 2.Ordering informationType numberPackage NameDescriptionVersion TFA9815TSO32plastic small outline package; 32 leads; body width 7.5 mmSOT287-16.Block diagramFig 1.TFA9815 block diagram272625302928V DDP1V SSP12231BOOT1P V DDP1OUT1PV SSP1BOOT1NOUT1NSTAB1BOOT2P STAB1CONTROL LOGIC232419DRIVER HIGH202118V DDP2V SSP2V DDP2OUT2PV SSP2BOOT2NOUT2NSTAB2STAB2V DDA1IN1P IN1N V SSA1V DDA2IN2P IN2N V SSA2REFERENCEMANAGERPROTECTIONOVP UVP OCP OTP ODP WPHEATSPREADER COMPARATOR 1COMPARATOR 2SO/OL ENABLE CDELAY DIAG 114235106TEST 78131514121161732V SSD(HW)9n.c.TFA9815010aaa211CONTROL LOGICDRIVER HIGHDRIVER LOWDRIVER LOWCONTROL LOGICCONTROL LOGICDRIVER HIGHDRIVER LOWDRIVER HIGHDRIVER LOWSTAB1STAB27.Pinning information7.1PinningThe SO32 package has four corner leads. These leads (1, 16, 17 and 32) are internally connected to the die pad and must be connected to V SSA . Together with the applied copper area on the PCB these leads determine the ambient temperature, which affects the thermal resistance of the junction.7.2Pin descriptionFig 2.Pin configurationTFA9815SO32V SSD(HW)V SSD(HW)IN1P STAB1IN1N V SSP1V DDA1BOOT1N V SSA1OUT1N SO/OL BOOT1P ENABLE OUT1P CDELAYV DDP1NCV DDP2DIAG OUT2P TEST BOOT2P V SSA2OUT2N V DDA2BOOT2N IN2N V SSP2IN2P STAB2V SSD(HW)V SSD(HW)010aaa2121234567891011121314151618172019222124232625323130292827Table 3.Pin descriptionSymbol Pin DescriptionV SSD(HW)1negative digital supply voltage and handle-wafer connection IN1P 2positive input comparator channel 1IN1N 3negative input comparator channel 1V DDA14positive analog supply voltage channel 1V SSA15negative analog supply voltage channel 1SO/OL 6self-oscillating / open-loop configuration enableENABLE 7enable input to switch between Sleep and Operating mode CDELAY 8switch on/off timing control n.c.9not connectedDIAG 10diagnostic output; open-drainTEST 11test signal input; for testing purposes only V SSA212negative analog supply voltage channel 2V DDA213positive analog supply voltage channel 2IN2N14negative input comparator channel 2Table 3.Pin description …continuedSymbol Pin DescriptionIN2P15positive input comparator channel 2V SSD(HW)16negative digital supply voltage and handle-wafer connectionV SSD(HW)17negative digital supply voltage and handle-wafer connectionST AB218decoupling of internal 11 V regulator for channel 2 driversV SSP219negative power supply voltage channel 2BOOT2N20bootstrap high-side driver negative output channel 2OUT2N21negative output channel 2BOOT2P22bootstrap high-side driver positive output channel 2OUT2P23positive output channel 2V DDP224positive power supply voltage channel 2V DDP125positive power supply voltage channel 1OUT1P26positive output channel 1BOOT1P27bootstrap high-side driver positive output channel 1OUT1N28negative output channel 1BOOT1N29bootstrap high-side driver negative output channel 1V SSP130negative power supply voltage channel 1ST AB131decoupling of internal 11 V regulator for channel 1 driversV SSD(HW)32negative digital supply voltage and handle-wafer connection 8.Functional description8.1GeneralThe TFA9815 is a dual-switching power comparator. It is the main building block for astereo high-efficiency Class D audio power amplifier system. It contains two full-bridgeBTL power stages, drive logic, protection control logic and full differential inputcomparators and references (see Figure1). By using this power comparator a compactclosed-loop self-oscillating digital amplifier system or open-loop system can be built. Asecond-order low-pass filter converts the PWM output signal into an analog audio signalacross the speaker.8.2InterfacingThe pins ENABLE and SO/OL control the Operating mode of the TFA9815. Both theENABLE and the SO/OL pins are referenced to V SSD(HW).When the SO/OL pin is connected to V SSD(HW) the TFA9815 is in self-oscillatingconfiguration: when the SO/OL pin is floating the TFA9815 is in open-loop configuration.Under this latter condition the open-pin voltage is typically 4 V applied internally. TheTEST pin needs to be connected to ground in both situations.The device has two modes: Sleep and Operating.In Sleep mode the TFA9815is not biased and has a very low supply current.Sleep mode can also be used to quickly mute the device.When the TFA9815 is set into Operating mode the device is started via the start-up sequence, which provides a pop-free start-up behavior. After start-up the STABn reference voltages are present and the outputs start switching.8.3Input comparatorsThe input stages have a differential input and are optimized for low noise and offset. This results in maximum flexibility in the application.Operating in self-oscillating configuration the inputs (IN1P , IN1N, IN2P , IN2N) of the comparators are internally set to a voltage level of V P , but only during the start-up sequence. In Operating mode the inputs are high-ohmic.Operating in open-loop configuration, no internal voltages are applied to the inputs. The input pins (IN1P , IN1N, IN2P , IN2N) are pulled down to V SSA1 and V SSA2 level by internal resistors.8.4DiagnosticThe DIAG output is an open-drain output.The maximum current is 2mA.When one of the protections is activated the DIAG output is set LOW. The DIAG output refers to V SSD .Table 4.SO/OL connectionsInterfacingSO/OL connected to:Configuration V SSD(HW)Self-oscillating OpenOpen-loopTable 5.Start-upInterfacing ENABLE (V)Mode ENABLE < 0.8 V Sleep mode ENABLE > 3 VOperating modeFig 3.Timing diagramLOWDIAG HighProtectionActive5 µsAmplifier restart010aaa377tt8.5ProtectionsThe TFA9815 has the following protections:•OverT emperature Protection (OTP)•OverCurrent Protection (OCP)•OverVoltage Protection (OVP)•UnderVoltage Protection (UVP)•OverDissipation Protection (ODP)•Window Protection (WP)When either the OTP or the OCP are activated the output power stage is switched off and all the outputs (OUT1N, OUT1P, OUT2N and OUT2P) become floating. The power stage will switch back on after 5µs or as soon as the fault condition is removed.When any other protection is activated (OVP, UVP, ODP, or WP) all the outputs become floating and the device shuts down. The TFA9815 will resume operating after the faultcondition has been removed, going through the restart sequence shown in Figure3.Restarting will typically take 500 ms, depending on the power-supply voltage level.•Overtemperature protectionIf the junction temperature (T j) exceeds a threshold level of about 150°C the outputsbecome floating. The device will start switching again after 5 ms and when thetemperature is below 150°C. This thermal limitation is without audible interruptions.•Overcurrent protectionIf the output current exceeds the maximum output-current threshold level the outputsbecomefloating.The device will start switching again after5µs.This current limitationis without audible interruptions.•Overvoltage protectionIf the supply voltage applied to the TFA9815 exceeds the maximum supply-voltagethreshold level the device shuts down. The device will resume operating when thesupply is within the operating range, going through the restart sequence.•Undervoltage protectionIf the supply voltage applied to the TFA9815 falls below the minimum supply-voltagethreshold level the device shuts down. The device will resume operating when thesupply is within the operating range, going through the restart sequence.•Overdissipation protectionIf the junction temperature(T j)exceeds135°C an internal OverTemperature Warning(OTW)signal is generated.If the overcurrent protection is generated while the OTW isactive the device will shut down and resume operating automatically, going throughthe restart sequence.•Window protectionDuring start-up, if one of the outputs is shorted to V SS or V DD the device will interruptthe start-up sequence and wait until the short is removed. This is an effectivemeasure to protect the device against shorts between the outputs (before the filter)and the ground or supply lines. The WP protects the device against errors madeduring board assembly.8.6Timing diagramTable 6.Overview protections ProtectionsSymbol Condition Diag.Outputs RecoveringOTP T j > 150°C LOW Floating Automatic, after 5µs and T j < 150°C OCP I O > I ORM LOW Floating Automatic, after 5µsOVP V P > 20 V LOW Floating Switch-off to restart when V P < 20 V UVP V P < 8 VLOW Floating Switch-off to restart when V P > 8 V ODP T j > 135°C and I O > I ORMLOW FloatingSwitch-off to restartWPOUTX > V DDA − 1 V or OUTX < V SSA + 1 VLOWStart-up after removing fault conditionFig 4.Start-up sequenceSLEEP START-UP OPERATING FAULT RESTART OPERATING SHUT-DOWN SLEEPFLOATINGAUDIOPWM010aaa378AUDIOPWMFLOATINGV PENABLESTAB1CDELAYV IN xOUT xAUDIO DIAG9.Internal circuitryTable 7.Internal circuitryPin Symbol Equivalent circuit1V SSD(HW)16V SSD(HW)17V SSD(HW)32V SSD(HW)2IN1P3IN1N14IN2N15IN2P4V DDA15V SSA1 12V SSA2 13V DDA26SO/OL22 VV DDAV SSA 1,16, 17, 32010aaa384hvp V SSA135 kΩ135 kΩ5.5 V5.5 VV SSA1, V SSA2V DDA1, V DDA2 2, 143, 15010aaa38522 V4, 125, 13010aaa386110 kΩ6V SSA010aaa381V DDA1V SSA1V DDA150 µA7ENABLE8CDELAY10DIAG11TESTTable 7.Internal circuitry …continued Pin Symbol Equivalent circuit3 k ΩV SSA250 nA7V DDA1010aaa3878V DDA1DISCHARGE V SSA1010aaa3792.8 µA200 nA2.8 kΩV DDA1V SSA1 V SSD10010aaa030V DDA1V SSA111010aaa03113 k Ω9 V18ST AB231ST AB119V SSP224V DDP225V DDP130V SSP120BOOT2N 29BOOT1N21OUT2N 23OUT2P 26OUT1P 28OUT1N22BOOT2P 27BOOT1PTable 7.Internal circuitry …continued Pin Symbol Equivalent circuitV SSD50 mA18, 31V DDA1, V DDA212 V010aaa44519, 3024, 2523.5 V010aaa44612 VOUT2N, OUT1N20, 29010aaa447V DDP1, V DDP221, 23, 26, 28V SSP1, V SSP2010aaa38012 VOUT2P22, 27010aaa44810.Limiting values[1]Human-body model (HBM): R S = 1500Ω; C = 100 pF; for pins 2, 3, 14, and 15: V esd =±1500 V .[2]Machine model (MM): R S = 0Ω; C = 200 pF; L = 0.75µH.11.Thermal characteristics[1]Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.[2]Two-layer application board (70 mm x 57 mm), 35µm copper, FR4 base material in free air with natural convection.[3]Strongly depends on where the measurement is taken on the package.Table 8.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V P supply voltage Asymmetrical −0.3+23.1V I ORM repetitive peak output current-3-A T j junction temperature --180°C T stg storage temperature -−55+150°C T amb ambient temperature -−40+85°C P max maximum power dissipation --5W V xvoltage on pin xDIAG V SS − 0.312V IN1P - IN1N −6+6V IN2P - IN2N −6+6V all other pinsV SS −0.3V DD +0.3VV esdelectrostatic discharge voltageHBM [1]−2000+2000V MM[2]−200+200VTable 9.Characteristics Symbol ParameterConditions Min Typ Max Unit R th(j-a)thermal resistance from junction to ambientJEDEC test board [1]-3942K/W T wo-layer application board [2]-42-K/W Ψj-lead thermal characterizationparameter from junction to lead ---30K/W Ψj-topthermal characterizationparameter from junction to top of package-[3]--8K/W12.Characteristics12.1Static characteristicsTable 10.CharacteristicsV P= 12 V;T amb = 25 ˚C; f osc = 550 kHz; typical application diagram Figure12, unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Supply voltage81220VV P supply voltage single asymmetrical supply(V DD−V SS)I P supply current Sleep mode-110200µA-4050mA I q(tot)total quiescent current Operating mode; no load, nosnubbers and no filter connectedSeries resistance output power switchesR DSon drain-source on-state resistance T j = 25°C-150220mΩEnable input: pin ENABLE[1]V IL LOW-level input voltage Sleep mode--0.8VV IH HIGH-level input voltage Operating mode3-V P VI I input current V I = 5 V-120µA SO/OL input: pin SO/OL[1]V IL LOW-level input voltage self-oscillating configuration0-0.4VV IH HIGH-level input voltage open-loop configuration345V Stabilizer output pins STAB1 and STAB2V O output voltage Operating mode[1]10.21111.7V Comparator full-differential input stageV offset(i)(eq)equivalent input offset voltage---1mV V n(i)(eq)equivalent input noise voltage20 Hz < f < 20 kHz--15µVVV i(cm)common-mode input voltage-V SSA + 3-V DDA− 1I IB input bias current---1µA Overtemperature protection-150-180°C T act(th_prot)thermal protection activationtemperatureOvervoltage protectionlevel internal fixed20.121.523VV th(ovp)overvoltage protection thresholdvoltageUndervoltage protectionlevel internal fixed77.57.9VV P(uvp)undervoltage protection supplyvoltageOvercurrent protection-[2]3 3.5-AI O(ocp)overcurrent protection outputcurrent[1]Measured with respect to V SSD .[2]Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop.12.2Dynamic characteristics12.3AC characteristics measured in typical application[1]THD+N is measured in a bandwidth of 20 Hz to 20 kHz, AES17, brick-wall.[2]Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling −1 %.Window Protection (WP)V Ooutput voltageHIGH-level -V DDA − 1-V LOW-level-V SSA + 1-VTable 10.Characteristics …continuedV P = 12 V;T amb = 25 ˚C; f osc = 550 kHz; typical application diagram Figure 12, unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Table 11.Switching characteristicsV P = 12 V;T amb = 25 ˚C; f osc = 550 kHz unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Timing PWM output: pins OUT1 and OUT2t r rise time I O = 0 A -10-ns t f fall timeI O = 0 A -10-ns t w(min)minimum pulse widthI O = 0 A-60-nsTable 12.AC characteristics measured in typical applicationSymbol ParameterConditionsMin Typ Max Unit P o(RMS)RMS output powerV P = 15 V; R L = 8Ω; THD = 10 %1516-W V P = 12 V; R L = 8Ω; THD = 10 %910-W V P = 12 V; R L = 6Ω; THD = 10 %1213-W V P = 12 V; R L = 4Ω; THD = 10 %1718-W THD+N total harmonicdistortion-plus-noise P o = 1 W; f i = 1 kHz [1]-0.050.1%ηpo output power efficiency P o = 2× 10 W at 8Ω8991-%P o = 2× 18 W at 4Ω8890-%G v(cl)closed-loop voltage gain V i = 100 mV (RMS); f i = 1 kHz 18.619.321dB V n(o)output noise voltage inputs shorted; AES17 brick-wall -150-µV S/N signal-to-noise ratioV o = 10 V (RMS); G v(cl) = 20 dB 9496-dB SVRR supply voltage ripple rejection Operating mode; f i = 1 kHz [2]3445-dB αcschannel separationP o = 1 W; f i = 1 kHz5570-dB13.Application information13.1Output power estimationFor BTL configuration the output power can be estimated using Equation 1:(1)Where,•V P = supply voltage [V]•R L = load impedance [Ω]•R DSon = on resistance power switch [Ω]•R S = series resistance output inductor [Ω]The output power at 10% THD can be estimated by using Equation 2(2)Figure 5 and Figure 6 below show the estimated output power at THD =0.5% and THD =10% as a function of the BLT supply voltage for different load impedances.THD+N = 0.5 %f = 1 kHz (1) 4Ω(2) 6Ω(3) 8ΩFig 5.BTL output power as function of supply voltage: THD = 1 %P o 1%R LR L 2+R DSon R S +()×------------------------------------------------------V P×22R L×---------------------------------------------------------------------------------=P o 10% 1.25P ×o 0.5%=V P (V)8201612101814010aaa44920103040P o (W)032113.2Output current limitingThe maximum peak output current is limited by the level of the overcurrent protection threshold. During normal operation the output current should not exceed this threshold level of 3A otherwise the OCP will be triggered and the device will stop switching for 5µs.The peak output current in BTL can be estimated using the following equation:Where:•V P = supply voltage [V]•R L = load impedance [Ω]•R DSon = on resistance power switch [Ω]•R S = series resistance output inductor [Ω]13.3Speaker configuration and impedanceFor a flat-frequency response (second-order Butterworth filter) it is necessary to change the low-pass filter components LLC and CLC according to the speaker configuration and impedance.T able 13 shows the practical required values:THD+N = 10 %f = 1 kHz (1) R L = 4Ω(2) R L = 6Ω(3) R L = 8ΩFig 6.BTL output power as function of supply voltage: THD = 10 %V P (V)8201612101814010aaa45020103040P o (W)0132I O max V PR L 2R DSon R S +()×+------------------------------------------------------3A≤≤13.4Differential inputFor a high common-mode rejection ratio and a maximum of flexibility in the application,the audio inputs of the application are fully differential.The input configuration for a differential-input application is illustrated in Figure 7.13.5Single-ended inputWhen using an audio source with a single-ended ‘out’,it is important to connect the IN1N from the application board to the V SS of the audio source (e.g. Audio Digital Signal Processing (Audio DSP)).The input configuration for a single-ended ‘in’ application is illustrated in Figure 8.Table 13.Filter component valuesConfigurationImpedance (Ω)LLC (µH)CLC (nF)BTL41015006151000822680Fig 7.Input configuration for a differential inputIN1AUDIO DSPOUT1POUT1N010aaa382++−V SS −13.6Curves measured in a typical applicationFig 8.Input configuration for a single-ended inputIN1P IN1NAUDIO DSPOUT1POUT1N010aaa383+−VSSV P = 12 V; R L = 4Ω; V I = 300 mV (RMS)Fig 9.Gain as a function of frequency010aaa451f i (Hz)1010510410210318142226G v (dB)1013.7Typical application diagram TFA9815A typical application diagram with the TFA9815 supplied from an asymmetrical supply is shown in Figure 12.V P = 12 V; R L = 4Ω(1) P o = 1 W (2) P o = 10 WFig 10.Total harmonic distortion + noise as a function of frequencyV P = 12 V; R L = 4Ω; f = 1 kHz (1) 6 kHz (2) 1 kHz (3) 100 HzFig 11.Total harmonic distortion as a function of output power010aaa45210−110−2101102THD+N (%)10−3f i (Hz)1010510410210312010aaa45310−110−2101102THD+N (%)10−3P o (W)10−21021010−11132xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxxTFA9815_1© NXP B.V . 2008. All rights reserved.Preliminary data sheet Rev. 01 — 16 December 200820 of 26NXP SemiconductorsTFA9815Audio amplifier 2 x 17 WFig 12.Typical application diagram TFA9815V DDA1n.c IN1P IN1N CDELAY SO/OLIN2P IN2N OUT1PBOOT1PBOOT1NOUT1NSTAB1STAB2OUT2PBOOT2PBOOT2NOUT2NV SSA1V SSA2V SSD V SSD V SSD V SSD V SSP1V SSP2V DDA2V DDP1V DDP2010aaa454C12680 nFC27470 pF C13680 nFC28470 pFGNDGND 21J3OUT1C9220 nFC14220 nFR2710 ΩR2810 ΩC20680 nFC29470 pFC23680 nFC30470 pFGNDGND 21J6OUT2C19220 nFC25220 nFR2910 ΩR3010 ΩL322 µHL422 µHL522 µHL622 µHC161µFC171µFGNDGND26272928311823222120OUT1+OUT1−OUT2+OUT2−C31100 nFC1220 µFC3100 nFC4100 nFC2220 µFC5100 nF GND GNDGNDR310 ΩL2BEAD L1BEAD 12 VC8220 pF R610 k ΩC61 µFR710 k ΩR1010 k ΩGND R1110 k ΩC1147 pFGND12J4C21220 pF R1910 k ΩR17100 k ΩC181 µFC261 µFR1810 k ΩR2210 k ΩGNDR2310 k ΩC2268 pFOUT2−STAB1GND12J7C154.7 µFGNDC24220 pFC10220 pFENABLEDIAG V DDA24139252451211617323019GND VP J1GND12C32220 µFC33100 nF12 V 12 VSW1ENABLE2386710111514IN1J2TFA9815R3210 k ΩR3110 k ΩC71 µFR26100 k ΩOUT2+R5100 k ΩOUT1−R14100 k ΩOUT1+R3310 k ΩR3410 k ΩIN2J5R35200 k ΩGNDSnubber network(Optional)R10022 Ω芯天下--/13.8Typical application: bill of materialsRemark:The power supply requires at least a 1000µF capacitor.Table 14.Typical application: bill of materialsItem Quantity ReferencePart Footprint 12C1, C2.220 mF/35 V CE09-02R 25C3, C4, C5, C31,C33.100 nF/50 V SMD 0805 X7R 32C16, C17. 1 mF/50 V SMD 1206 X7R 44C6, C7, C18, C26 1 mF/25 V MKT54C8, C10, C21, C24.220 pF/25 V SMD 0402 NP064C9, C14, C19, C25.220 nF/25 V SMD 0805 X7R 71C1147 pF/25 V SMD 0402 NP084C12, C13, C20,C23.680 nF/25 V MKT91C22.68 pF/25 V SMD 0402 NP0103J1, J3, J6.CON2 2 pins terminal 112J2, J5.CINCH CINCH122J4, J7Jumper Closed on demo board only132L1, L2BEAD SMD 1206 Würth Elektronik DC <0.5 Ω10 MHz > 80 Ω141R35200 k Ω/0.1W / 5 %SMD 0603151C154.7µF / 16V 164L3, L4, L5, L6.22µH8RDY TOKO A7040HN-220M,11RHBP TOKO A7503CY -220M or Sagami 7311NA-220M175R310 / 0.25 W /5%SMD 1206184R5, R14, R17, R26.100 k Ω /0.1W /1%for 20dB 200 k /0.1W /1%for 26dBSMD 06031912R6, R7, R10, R11,R18, R19, R22,R23, R31, R32,R33, R34.10k Ω/0.1W /1%SMD 0603201R10022Ω / 5 % /0.1W SMD 0603211SW1SC 1X1Secme 090320901221U1TFA9815TSOT287-1 (SO32) NXP SemiconductorsTable 15.Snubber network: bill of materialsItem Quantity Reference Part Footprint14C27, C28, C29, C30470 pF, 25 V SMD 0805 X7R 24R27, R28, R29, R3010 / 0.25 W /SMD 12065%14.Package outlineFig 13.Package outline SOT287-1 (SO32)UNIT Amax.A 1A 2A 3b p c D (1)E (1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm inches2.650.10.250.011.40.0550.30.12.452.250.490.360.270.1820.720.37.67.4 1.2710.6510.00 1.21.00.950.5580o o 0.250.10.0040.25DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.1.10.4 SOT287-1MO-119(1)0.0120.0040.0960.0890.020.010.050.0470.0390.4190.3940.300.290.810.800.0110.0070.0370.0220.010.010.0430.016w Mb p D H EZ ecv M AXAy3217161θAA 1A 2L pQdetail XL (A )3E pin 1 index0510 mmscaleSO32: plastic small outline package; 32 leads; body width 7.5 mmSOT287-100-08-1703-02-1915.Revision historyTable 16.Revision historyDocument ID Release date Data sheet status Change notice Supersedes TFA9815_120081216Preliminary data sheet--16.Legal information16.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .16.2DefinitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.16.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. 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疯狂动物城1--Fear, treachery (betrayal), blood lust(性欲，欲望）.恐惧，背叛，杀戮。

2--Thousands of years ago these were the...几千年前这些是...3--forces that ruled our world支配着我们的世界的力量4--A world where prey（食草动物；猎物；捕食）were scared of predators（食肉动物，掠夺者）. 一个猎物担心着捕食者的世界。

5--And predators had an uncontrollable...捕食者有一个无法控制的...6--biological urge to maim（捕猎，致残/disable）, and maul(残杀，袭击）, and...生理上的冲动去伤害，残害，并且...7--Awww! 噢！8--Blood! Blood! Blood!血！血！血！9--And.. death!和..死！10--Ahhh...唉唉......11--Back then, the world was divided in two.在那时，世界分为二种。

12--Vicious（cruel/evil）predator, or meek(温顺的）prey.凶猛的捕食者与脆弱的猎物。

13--But over time, we evolved, and moved beyond or primitive（原始的）savage（n/adj 野蛮的）ways.但随着时间的推移，我们进化了并抛弃了野蛮的性格。

14--Now predator and prey live in harmony.现在捕食者与猎物和睦相处。

15--And every young mammal(哺乳动物）has multitudinous (ˌmʌltɪˈtuːdɪnəs/,大量的，无数的)opportunities.而且所有的年轻的动物都有着各种的可能。

FEG-TEM Qualification (Written Exam for class D users)1.Please write down the standard conditions that you must check before and after theoperation of FEM TEM.Answer:(a). Confirm there are five “0”s on the monitoring screen: specimen translation X=0, Y=0, Z=0, Tilt X=0, tilt Y=0(b). Check the readout of Dark Current=76 and Emission=116(c). Check the read out of OBJ =3.66 and STIG X=0.79,Y=-1.77(d). Confirm OBJ and SAD apertures have been removed.(e). Check the operation log book to see any reported problems from last user. Report yours in log book, if you find any problem of the TEM in your operation section.(f). Check the vacuum condition of the TEM.2. Please describe sample loading procedures in detail.Answer:(a)Procedures of withdrawing the sample holder from TEM:(i)Please confirm the above standard conditions and all the valves are closed and stagezeroed.(ii)Remove the connectors on the sample holder.(iii)Withdraw the holder “SLOWLY”, and use the other hand to catch the holder in case the holder is accidentally sucked back by the vacuum chamber.(iv)Once the holder has been pulled to the end of the 1st stage, “GENTLY” rotate the holder counter-clockwise until it stops, and then “SLOWLY” withdraw the holder tothe end of the 2nd stage.(v)Hold the sample holder and wait for the sound of the valve closing(vi)Once you hear the sound of valve closing, switch the pump/air to the “air” position.Wait for the N2 gas to push the holder out, then slowly withdraw the holder out fromTEM.(b)Procedures of inserting the sample holder into TEM:(i)Insert the holder slowly into TEM. Use your four fingers of your right hand to push theholder. Wait until you hear the sound of the valve opening and then gas venting.(ii)Turn the pump/air switch to the “pump” position.(iii)This is an important step. Hold the sample holder with your right hand and use the thumb of left hand as a stall to prevent the sample holder being suddenly sucked in tocause the TEM down and damage of the sample holder.(iv)Wait till you hear a loud sound, then you may slowly release the holder. Wait for about15 min. until the green light of the pump/air switch lits on.(v)After the green light is on, “GENTLY” rotate the sample holder clockwise until it stops (~ position of 30 degrees) Slowly release the holder. Again, Use your (or thumbs of)left hand as a stall to prevent the holder being suddenly sucked in.(vi)Rotate the holder clockwise until it stops (~60 degrees), and slowly release the holder.Always keep an eye on the vacuum condition during the procedures (i)-(vi).3. Please describe in details the procedures of increasing and decreasing the voltage. Answer:(a)Procedures of increasing high tension(i)Press “ Dialogue”(ii)Open “High V oltage Control”(iii)Confirm the “Standard” values in the “high voltage control”HT status: ON, Emission status: ON, HT: 160kV, Dark Current: 76 , Emission Current: 116 (iv)Press “normal” button in the “Normal/Stand by”(v)The high tension will run from 160kV to 200kV in 20mins.(b)Procedures of decreasing high tension(i)Press “ Dialogue”(ii)Open “High V oltage Control”(iii)Confirm the “Standard” values in the “high voltage control”HT status: ON, Emission status: ON, HT: 200kV, Dark Current:95 , Emission Current: 116 (iv)Press “Stand by” button in the “Normal/Stand by”(v)The high tension will run from 200kV to 160kV in 20mins.4. Please describe in details the procedures of basic alignment of the optical system. Answer:After opening the Valve, find the sample location at low mag. Switch to operating mode, adjust the focus, and check whether the Obj value is at 3.66Below 30K mag. α=3100K~30K mag. α=2Over 100K mag. α=1Use the trackball or X,Y buttons to bring a suitable hole on the specimen to the screen center Condense Aperture:(a). Set the magnification to 20,000times in the MAG mode.(b). Center the beam with the SHIFT knobs.(c). Adjust the aperture position using the aperture shift knobs so that the electron beam convergesand diverges concentrically when the brightness knob is turn slowly clockwise andcounterclockwise.Eucentric height:(a)Reset the defocus.(b)Turn on image wobble(c)Move specimen z-axis to minimize image shiftor(a)Find a recognizable feature and center it on screen(b)Tilt the specimen for 1-degree(c)Move specimen z-axis to bring the feature back to center(d)Tilt to 5-degree and bring the feature back(e)Make sure the feature does not move while tilting back and forthIllumination System Alignment:(a).Set “Maintenance” on the “TEM controller” main menu to display the “Alignment Panel forMaintenance” screen(b).Set the SPOT SIZE knob to 1(c). Select “Gun“ and Manipulate the SHIFT knobs to center the beam.(d). Set the SPOT SIZE knob to 5(e). Select “CLA“ and Manipulate the SHIFT knobs to center the beam.(f). Repeat step (b)to (d)above until the beam deviation from the screen center when the SPOTSIZE knob setting is changed becomes minimum.(g).Depress the “Wobble- Anode” button and manipulate the SHIFT knobs and DEF-STIG knobs sothat the beam converge and diverges concentrically.Condenser Lens Astigmatism Correction:(a).Depress the COND STIG switch or Depress the “DEF Select- CL STIG” button(b).Manipulate the DEF/STIG knobs to make the beam circle appearing just before and after thebeam is converged.Beam Deflector AdjustmentTilt adjustment(a).Set the magnification to 200,000 times.(b).Center the beam using the SHIFT knobs.(c).Depress the “compensator-Tilt ”and “Wobble-Tilt X”.(d).Make the divides spot a single spot using the DEF/STIG X knob.Turn off the “compensator-Tilt ”and “Wobble-Tilt X”.(e).Depress the “compensator-Tilt ”and “Wobble-Tilt X”.(f).Make the divides spot a single spot using the DEF/STIG X knob.(g).Turn off the “compensator-Tilt ”and “Wobble-Tilt X”.V oltage Center Adjustment(a).Focus the image(b).Bring a conspicuous image to the screen center(c). Depress the HT WOBB switch (The sample now starts to expand and contract periodically.(d). Depress the BRTHT TILT switch.(e). Manipulate DEF/STIG to bring the image expansion / contraction center to the screen center.(f).Turn off the HT WOBB switch.At High Magnifications(a).Set higher in the MAG mode.(b).Use the trackball or X,Y buttons to obtain an amorphous specimen on the screen .(c).Depress OBJ STIG(d).Slowly turn OBJ FOCUS back and forth from the in-focus position to observe a phase image.(e).Manipulate DEF/STIG so as to make the phase image as separated tiny spots.5. Please describe in details the procedures of advanced alignment on optical system while doing NBD and nano-beam EDX.Answer:NBD1.Obtain a conventional image on the screen.2.Depress the MAG1, and select the desired magnification in the TEM mode.3.Select a magnification to be used using the MAG-CAM L knob.4.Bring a field of view to be used to the screen center using the triangle buttons or trackball.5.Focus the image using the OBJ FOCUS knob .6.Carry out the multiple-exposure to carry out the first photograph.7.Depress the NBD switch to obtain the NBD mode.8.Converge the beam using the BRIGHTNESS knob.9.Manipulate the SPOT SIZE knob to select the spot size value.10.Move the electron beam to the field to be studied using the left and right SHIFT.11.Depress the SA DIFF.12.Select a camera length using the MAG-CAM L knob.13.Adjust the size of the diffraction spot by varying the _-SELECTOR knob and changing thecondenser aperture size.14.Depress the MAG1 switch to obtain the MAG mode.15.Carry out the second exposure in the multiple-exposure mode.16.Depress the SA DIFF switch.17.Record the pattern in the manual exposure mode (the exposure time of about 30 secondswill be suitable).a: Beam spot and image b: Microbeam diffraction patternFig. Microbeam electron diffractionEDX1.Obtain a conventional image on the screen.2.Depress the MAG1, and select the desired magnification in the TEM mode.3.Select a magnification to be used using the MAG-CAM L knob.4.Bring a field of view to be used to the screen center using the triangle buttons or trackball.5.Focus the image using the OBJ FOCUS knob .6.Depress the EDX switch to obtain the EDX mode.7.Switch to INCA software. Note: the DigitalMicrograph need to be closed before theINCA can be started. When DigitalMicrograph is restarting, one might see a errormessage about DigiScanII that is for STEM operation. It is okay to ignore the DigiScanII warning.e INCA software to insert the detector. If the detector withdrawn automatically due tohigh count, do NOT force inser the detector before lowering the beam intensity (seebelow).9.Check the dead time ratio and make sure it is below 50% through the work.10.Converge the beam using the BRIGHTNESS knob.11.Manipulate the SPOT SIZE knob to select the spot size value and make sure the dead timeratio is below 50%.12.Move the electron beam to the field to be studied using the left and right SHIFT.13.Record and analyze the spectrum with INCA.6. Please describe in details the procedures of taking HRTEM images.Answer:■ The specimen must be tightly secured and at eucentric height.If the specimen is not tightly secured, it will result as time passes in a gradual shift of the specimen (image). This phenomenon is referred to as “image drift”. Fig. 1a shows a hole image under drift-free conditions, and Fig. 1b shows the same image when image drift exists. In the former, the background structure is distinct, and the edge of the hole can be clearly discerned all the way round. In the latter case, the background structure appears to be unidirectional, and the edge of the hole exhibits one-way blurring.a: Hole image when there is no drift b: Hole image when there is driftFig.1 Effect of image driftThe chief causes of image drift and the countermeasures to be taken are as follows:※Damaged, wrinkled, improperly secured and/or insufficiently strong supporting filmExercise great care when preparing the supporting film. Use adequate adhesive whensecuring the film to the grid, and reinforce the film using the carbon coating method.＊Bent specimen gridDiscard and replace with new (unbent) grid.＊Electrically charged specimen and/or supporting filmEnhance conductivity by coating the specimen and/or supporting film with carbon■ The electron beam divergence angle must be smallHigh resolution micrographs will be difficult to obtain due to low coherence when theelectron beam divergence angle is large. Therefore, use a small condenser aperture (100or 40 micron meters in diameter), manipulate the BRIGHTNESS knob to obtain 2 to 4seconds of exposure time and set the beam divergent angle as follows using theThe α-SELECTOR No. is displayed on the left main screen. The No. can be varied using the α-SELECTOR knob (TEM, EDS, NBD and CBD). No. 3 covers all the range of magnification except when very high resolution photographs are required. No.2 and 1 are recommended for microscopy at very high magnifications required small divergence angle. The smaller the divergence angle (i.e., the smaller theα-SELECTOR No.), the higher the image quality with smaller field of view. Refer to the following when selecting the α-SELECTOR No.α-SELECTOR No. 3: For any magnificationα-SELECTOR No. 2: For 100,000 times or higherα-SELECTOR No. 1: For 500,000 times or higher■ The voltage center must be properly aligned.Fig. 1a shown below shows a hole image when the voltage center is properly aligned. In this figure, the background structure (phase contrast) is readily discernible, and the edge of the hole can be clearly observed all the way round. On the other hand, Fig. 2b shows a hole image when the voltage center is misaligned. In this figure, the image is indistinct, the background structure appears unidirectional, and the edge of the hole is blurred as if astigmatism exists. For high magnification photography, realign the voltage center at the photographing magnification by using the HT-WOBBLER switch.a: Hole image when voltage center is aligned b: Hole image when voltage center is misalignedFig.2 Effect of voltage center alignment■ The objective aperture must be properly inserted (or removed completely).Fig. 3a shows a hole image when the objective aperture is properly inserted into the electron beam path. In this figure, the background structure is readily discernible, and the edge of the hole can be clearly observed all the way round. On the other hand, Fig. 3b shows a hole image when the aperture is improperly inserted. In this figure, the image is indistinct, the background structure exhibits unidirectional blurring, and the edge of the hole appears as if astigmatism exists.a: Hole image when objective aperture is aligned b: Hole image when objective aperture ismisalignedFig.3 Effect of objective aperture insertion■ The objective lens astigmatism correction must be complete.If astigmatism exists in the objective lens, the focusing becomes unidirectional, and it will be impossible to focus the image correctly in all directions. To illustrate the point, Fig. 4a shows a hole image when the lens is free from astigmatism, and Fig.4 b shows the same image when lens astigmatism is present. It will be seen that when the lens is free from astigmatism, the background structure is clear and the edge of the hole can be readily observed all the way round; and that when lens astigmatism is present, the image is blurred and the Fresnel fringe is asymmetrical around the edge of the hole. Astigmatism correction should be carried out at a magnification higher than that used for actual photography. However, once astigmatism correction is complete, photography can be carried out at lower magnifications without the need to repeat astigmatism correction. If the amount and direction of astigmatism vary as time goes by, a dirty objectiveaperture or dirty specimen holder is indicated. In this case, clean the contaminated part/parts as per the maintenance manual. Utilizing the background structure in conjunction with the Fresnel fringe (at slightly over-focus) is extremely effective when correcting objective lens astigmatism at magnifications of 100,000 times or more. That is to say, after first of all removing the astigmatism as much as possible using the Fresnel fringe, focus the image and then remove any remaining astigmatism so as to make the background structure as clear as possible.a: Hole image when astigmatism does not exist b: Hole image when astigmatism existsFig.4 Effect of objective lens astigmatismTo fine tune the astigmatism, live FFT (diffractogram) of the image is beneficial. The FFT pattern should be a perfect round shape if the astigmatism is corrected.Fig.5 Effect of objective lens astigmatism and sample drift■ OthersIf the specimen is contaminated, it is difficult to focus the image correctly, and photographs obtained will be obscure even though the image is properly focused. In order to prevent contamination by the electron beam, avoid irradiating the specimen for a long time. Do not use a magnification higher than that necessary for resolving the feature of interest adequately, and photograph the image with an exposure time as short aspossible (two to four seconds will be adequate).7. Describe the significance of each lens and apertures in a TEM. State how can one control the strength of each lens from the operation console (knob).Condenser optics: to provide appropriate illumination on the specimen.Condenser lens 1 (C1): controlled by “spot size” knob and creates a demagnified image of the gun crossover, control the minimum spot size obtainable in the rest of the condenser system.When the number of spot size increased, the strength of the lens increases and brought the demagnified image closer to the source and optical axis. Such a larger (numerical) spot size is also used as a reference point for beam alignment.Condenser lens 2 (C2): controlled by “brightness” or “intensity” knob and affects the beam convergence (in conjunction with C2 aperture) and diameter of the illuminated area on the specimen. When the C2 is focused, the illuminated area is at a minimum and all the electrons could reach the screen. As this condition, the brightness of the image reaches its maximum.For diffraction, parallel beam is desired and under-focus the C2 can minimize the beam convergence.Objective lens: controlled by “focus” knob and forms an inverted initial image, which is subsequently magnified. In the back focal plane of the objective lens, a diffraction pattern is formed and objective aperture can be inserted here to generate diffraction contrast. The focus setting changes the focal length of the objective lens and brings the image plane to where the intermediate lens is “looking” at.Intermediate lens: controlled by “image/diffraction mode switch” and “diffraction focus” and magnifies the initial image that is formed by the objective lens. The intermediate lens can also be focused on the diffraction pattern at the back focal plane or image plane of the objective lens forming diffraction pattern or image, respectively. This lens determines whether the viewing screen of the microscope shows a diffraction pattern or an image. (Note: intermediate lens can also be focused between the image and back focal plane of the objective lens. When this happens, one could get image in diffraction pattern and visa versa.)Projection lens: controlled by “magnification” knob and consists with a series of lenses to magnify the image formed by intermediate lens. Magnification in the electron microscope can be varied from hundreds to several hundred thousands of times. This is done by varying the strength of the projector and intermediate lenses. Not all lenses will necessarily be used at lower magnifications.。