PCLS2016-2R2M(SPEC)

IM307511/2020REV05SPEEDTEC 320CPSPEEDTEC 320CP Push PullSpare Parts (1)Figure A. Casing (2)Figure B. Wire Feeding (3)Figure C. Internal Parts (4)Figure D. Front Assembly (5)Figure E. Inverter (6)Figure F. Back assembly (7)Electrical Schematic (8)CODE: 50393 (8)CODE: 50501 (9)Lincoln Electric Bester Sp. z o.o.ul. Jana III Sobieskiego 19A, 58-260 Bielawa, Polandwww.lincolnelectric.euSpare Parts50393 REV0111/18ASSEMBLY PAGE NAMEC a s i n gW i r e F e e d i n gI n t e r n a l P a r t sW i r e D r i v e F r o n t A s s e m b l yn v e r t e rB a c k A s s e m b l y E l e c t r i c a lD i a g r a m CODE NO.: W NO.: FIGURE NO.: A B C C EFG50393 K14168-1 SPEEDTEC 320 CP 1 1 1 1 1 1 1 50501 K14168-2 SPEEDTEC 320 CP/PP 1 1 1 1 1 1 1Figure AFigure A. CasingItem Description Part Number Qty 1 2 3 4 5 6 7 01 BOTTOMASSEMBLY R-3019-497-1R 1 X X02 COVERASSEMBLY R-3019-498-1R 1 X X03 LATERAL PANEL ASSEMBLY R-1019-545-1R 1 X X04 LOCKINGUNITHINGE W000278021 2 X X05 ASA SPEEDTEC 400S/500S(HANDLE) R-0010-292-1R 2 X X06 CORNERCAP W95x1147R 4 X X07 LOQUETCOULISSANTAFFLEURANT W000241671 2 X X08 DOORINKED R-1019-544-1R 1 X X09 TORCH HOLDER (COMPLET AVEC87000055P)W000402488 1 X X10 STICKER 3YEARS WARRINTY D-2837-731-2 2719-107-823R 1 X X11 STICKERLIFTING R-0010-332-1R 1 X X 12 STICKERWARNINGSD-2837-728-1 2719-107-728R 1 X XFigure BFigure B. Wire FeedingItem Description Part Number Qty 1 2 3 4 5 6 713 PLASTIC SPOOL AXIS DV44J W000149075 1 X X14 4 ROLLS COD150PDVU DMU P400 W000277988 1 X XSWITCH W000147188 1 X X15 SWITCH2PB300 W000385691 1 X X16 ADAPTERFigure CFigure C. Internal PartsItem Description Part Number Qty 1 2 3 4 5 6 7 17 FERRITEFLAT W000376585 2 X XTURNS 90002919PR 1 X X818 CHOKE19 POWERTRANSFORMER W000385778 1 X X20 RIBBON CABLES PULS III W000384735 1 X XCOMMAND W000386035 1 X XCYCLE21 PCBSUPPLY W000277882 1 X XAUXILAIRY22 PCB23 ENCODERBOARD W000386042 1 X X35-50MM W000010560R 1 X X24 MALECONNECTORBOARD E523-01R 1 XPULL54 PUSHFigure DFigure D. Front AssemblyItem Description Part Number Qty 1 2 3 4 5 6 7 ASSEMBLY R-3019-492-1R 1 X XPANEL25 FRONTPANEL 91633329PR 1 X X26 BOARDFRONT27 FRONT PANEL BOARD SUPPORT R-3019-493-1 1 X X28 FRONT NAMEPLATE SPEEDTEC 320 CP R-0010-725-1R 2 X XINCHES 9SM22778-1 2 X X29 KNOB1INCHES 9SM22778-2 4 X X1.530 KNOB31 PRESA FEMMINIA SALD.OPTIP 500I W000148911 2 X X320C R-5241-033-1R 1 X32 “J”HARNESSES32A J” HARNESSES 320C PUSH PULL R-5041-600-1R 1 XCLAMP 04081581PR 1 X X33 CABLE34 LEM 90000389PR 1 X XPLATE 90002713PR 1 X X35 STICKERBOARD W000386043 1 X XFILTER36 SECONDARYEMC37 PLASTIC INSULATOR EURO CONNECTOR 90003007PR 1 X XFigure EFigure E. InverterItem Description Part Number Qty 1 2 3 4 5 6 7 38 PCBPRIMARY W000386030 1 X X39 PCB SECONDARY WITH LED W000386031 1 X X40 BRIDGERECTIFIER W000386032 1 X X41 CURRENTSENSETRANSFORMER 90002925PR 1 X X42 GENERICTHERMALSENSOR 90002863PR 1 X X43 FAN EQUIP DGPIII COMPACT WORKINGSKETCHR-5241-002-1R 1 X XFigure FFigure F. Back assemblyItem Description Part Number Qty 1 2 3 4 5 6 7 44 BACKASSEMBLY R-3019-494-1R 1 X X45 PLASTICFRAMEREAR W000373702 1 X X46 SOLENOID VALVE 24V DC DIGIPULS II W000278017 1 X X47 PRIMARY FILTER BOARD NCI WORKINGSKETCHR-5241-001-1R 2 X X48 TRANSFORMER 200VA III 320C W000386041 2 X X49 STICKERPLATEWIRE 90002486PR 4 X X 50 POWERCABLE R-5241-011-1R 2 X X 51 SWITCH40A W000385787 1 X X 52 FERRITETORE36X23X15 90002996PR 1 X X 53 COOLERHARNESS R-5241-079-1R 1 X XElectrical Schematic CODE: 50393CODE: 50501。

处理器选项∙英特尔®至强®E5-2600处理器产品系列处理器插槽：2外形规格：1U机架内部互连：2条英特尔Quick Path互连(QPI)链路：6.4 GT/秒、7.2 GT/秒、8.0 GT/秒操作系统选项∙Microsoft® Windows Server® 2008 R2 SP1，x64（含Hyper-V™ v2）Microsoft Windows® HPC Server 2008Microsoft Windows Small Business Server 2011SUSE® Linux® Enterprise ServerRed Hat® Enterprise Linux可选的嵌入式虚拟机管理程序：Citrix® XenServer™VMware vSphere™芯片组选项∙英特尔®C600内存选项1∙最高可配768 GB（24个DIMM插槽）：2 GB/4 GB/8 GB/16 GB/32 GB DDR3（最高1600 MHz）高速缓存：每个核心2.5 MB；核心选项：2、4、6、8存储∙最大内部存储：高达10 TB热插拔硬盘选项：2.5英寸PCIe固态硬盘、SAS固态硬盘、SATA固态硬盘、SAS（15K、10K），近线SAS (7.2K),SATA (7.2K)支持自我加密硬盘驱动器托架∙最多10个2.5英寸热插拔SAS、SATA或固态硬盘，或者最多4个热插拔2.5英寸SAS、SATA或固态硬盘 + 2个PCIe固态硬盘插槽包含项∙三个PCIe插槽：两个x16插槽，带宽为x16，半高、半长一个x16插槽，带宽为x8，半高、半长（只有在具有3个PCIe插槽选项的情况下，才能使用10个驱动器托架配置）或两个PCIe插槽：一个x16插槽，带宽为x16，全高、3/4长一个x16插槽，带宽为x16（或者，在只有一个处理器的情况下为一个x8插槽），半高、半长RAID控制器∙内部控制器：PERC S110 (SW RAID)PERC H310PERC H710PERC H710P外部HBA (RAID)：PERC H810外部HBA（非RAID）：6 Gbps SAS HBA通信选项∙Broadcom®四端口1 GbE BASE-T（无TOE或iSCSI卸载）英特尔四端口1 GbE BASE-T（无TOE或iSCSI卸载）英特尔双端口10 GbE BASE-T，以及两个1 GbE端口（10 GbE端口上支持FCoE功能）Broadcom双端口10 GbE SFP+，带两个1 GbE端口（10 GbE端口上支持TOE或iSCSI卸载）电源选项∙通过白金认证的高能效电源：495瓦、750瓦，或者通过顶级白金认证的高能效电源：1100瓦自动量程电源可用性∙高能效、热插拔的冗余电源；直流电源；热插拔硬盘；TPM；双内置SD支持；热插拔冗余风扇；可选挡板；行李箱标签；ECC内存；交互式液晶屏；更强的散热支持；符合能源之星®标准；更大的功率范围；独立于交换机的分区(SWAP)管理∙远程管理配备生命周期控制器的iDRAC7iDRAC7 Express（默认），iDRAC7 Enterprise（升级选项），8 GB vFlash介质（升级选项），16 GB vFlash介质（升级选项）系统管理符合IPMI 2.0标准Dell OpenManage™ Essentials和Dell Management ConsoleDell OpenManage Power CenterDell OpenManage Connection：适用于Microsoft® System Center的OpenManage Integration Suite适用于VMware® vCenter™的戴尔插件HP Operations Manager、IBM Tivoli® Netcool®和CA Network and Systems Management 法规∙产品安全、EMC和环境数据表（英文版）戴尔法规合规性主页（英文版）戴尔和环境（英文版）机架支持∙ReadyRails滑轨，用于在具有方形或无螺纹圆孔的4柱式机架中进行免工具安装，或在4柱式螺纹孔机架中使用工具进行安装，支持可选免工具电缆管理臂ReadyRails固定式导轨，用于在具有方孔或无螺纹圆孔的4柱式机架中进行免工具安装，或在4柱式有螺纹和2柱式(Telco)机架中使用工具进行安装。

SCHOTTKY BARRIER RECTIFIERDN:T 20526A0://Mechanical DataFeatures◆◆◆◆◆The plastic package carries UnderwritersLaboratory Flammability Classification 94V-0Metal silicon junction,majority carrier conduction Low power loss,high efficiencyHigh forward surge current capability High temperature soldering guaranteed:250°C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tensionDO-41Dimensions in inches and (millimeters)Case : JEDEC DO-41 Molded plastic bodyTerminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Color band denotes cathode end Mounting Position : AnyWeight: 0.012 ounce, 0.33 gramsMaximum Ratings And Electrical CharacteristicsRatings at 25°C ambient temperature unlss otherwise specified.Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.Parameter SYMBOLSSR 120SR 130SR 140SR 150SR 160SR 170SR 180SR 190SR 1100SR 1150SR1200UNITSMarking CodeMDD SR 120MDD SR 130MDD SR 140MDD SR 150MDD SR 160MDD SR 170MDD SR 180MDD SR 190MDD SR 1100MDD SR 1150MDD SR 1200Maximum repetitive peak reverse voltage V R R M 2030405060708090100150200V Maximum RMS voltage V RMS 142128354249566370105140V Maximum DC blocking voltageV DC 2030405060708090100150200V Maximum average forward rectified current 0.375”(9.5mm) lead length(see fig.1)I (AV)1.0APeak forward surge current 8.3ms single half sine-wavesuperimposed onrated load (JEDEC Method)I FSM 40AMaximum instantaneous forward voltage at 1.0A V F 0.550.700.850.95V T A =25℃Maximum DC reverse current at rated DC blocking voltage T A =100℃I R 0.50.2mA 10.05.0 2.0Typical junction capacitance (NOTE 1)C J 11080pF Typical thermal resistance (NOTE 2)R θJA 50.0℃/W Operating junction and storage T J -50 to +125-50 to +150℃Storage temperature rangeT STG-50 to +150Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted℃2Ratings And C haracteristic C urvesThe curve above is for reference only.://10.80.60.40.20 25 50 75 100 125 150 1750.20.40.60.81.0 1.10.010.11101001001010.1t,PULSE DURATION,sec.FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCEFIG. 3-TYPICAL INSTANTANEOUS FORWARDCHARACTERISTICSNUMBER OF CYCLES AT 60 HzFIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARDSURGE CURRENTFIG. 1- FORWARD CURRENT DERATING CURVEA V E R A G E F O R W A R D R E C T I F I E D C U R R E N T ,A M P E R E SI N S T A N T A N E O U S F O R W A R D C U R R E N T ,A M P E R E SP E A K F O R W A R D S U R G E C U R R E N T ,A M P E R E SINSTANTANEOUS FORWARD VOLTAGE,VOLTS1101000.010.1120101001010.10.010.001PERCENT OF PEAK REVERSE VOLTAGE,%FIG. 4-TYPICAL REVERSE CHARACTERISTICSI N S T A N T A N E O U S R E V E R S E C U R R E N T ,M I L L I A M P E R E ST R A N S I E N T T H E R M A L I M P E D A N C E ,C /WAMBIENT TEMPERATURE, C 0.11.010100REVERSE VOLTAGE,VOLTS FIG. 5-TYPICAL JUNCTION CAPACITANCEJ U N C T I O N C A P A C I T A N C E , p F1010010002000。

DRAMUpdated Date : 11/06/2006DensityOrganization DescriptionRefreshSpeedPackagePart Number(Pb-free)Sample MP EDO DRAM 5V 51225ns 40L-SOJ M11B416256A-25JP Now Now EDO DRAM 5V 51235ns 44-40L-TSOPII M11B416256A-35TG Now Now EDO DRAM 3.3V 51235ns 40L-SOJ M11L416256SA-35JP Now Now EDO DRAM 3.3V 51235ns 40/44L-TSOPIIM11L416256SA-35TGNowNowSDRAMDensityOrganization DescriptionRefresh SpeedPackagePart Number(Pb-free)Sample MP SDRAM 2.5V 2K 143MHz 50L-TSOPII M12S16161A-7TG Now Now SDRAM 2.5V 2K 143MHz VFBGA M12S16161A-7BG Now Now SDRAM 3.3V 2K 143MHz 50L-TSOPII M12L16161A-7T (I)G Now Now SDRAM 3.3V 2K 200MHz 50L-TSOPII M12L16161A-5T (I)G Now Now SDRAM 3.3V 2K 143MHz VFBGA M12L16161A-7B (I)G Now Now 2M*16SDRAM 3.3V 2K 143MHz 54L-TSOPII M12L32162A-7TG Now Now 1M*32SDRAM 3.3V 2K 143MHz 90-FBGA M12L32321A-7BG Now Now SDRAM 2.5V 4K 100MHz 54L-TSOPII M12S64164A-10TG Now Now SDRAM 3.3V 4K 143MHz 54L-TSOPII M12L64164A-7T (I)G Now Now SDRAM 3.3V 4K 200MHz 54L-TSOPII M12L64164A-5TG Now Now SDRAM 2.5V 4K 143MHz 86L-TSOPII M12S64322A-7TG Now Now SDRAM 3.3V 4K 166MHz 86L-TSOPII M12L64322A-6T (I)G Now Now SDRAM 3.3V 4K 200MHz 86L-TSOPII M12L64322A-5TG Now Now SDRAM 2.5V 4K 143MHz 54L-TSOPII M12S128168A-7TG Now Now SDRAM 2.5V 4K 166MHz 54L-TSOPII M12S128168A-6TG Now Now SDRAM 3.3V 4K 143MHz 54L-TSOPII M12L128168A-7TG Now Now SDRAM 3.3V 4K 166MHz 54L-TSOPII M12L128168A-6TG Now Now SDRAM 2.5V 4K 166MHz 90-FBGA M12S128324A-6BG Now Now SDRAM 2.5V 4K 143MHz 86L-TSOPII M12S128324A-7TG Now Now SDRAM 2.5V 4K 166MHz 86L-TSOPII M12S128324A-6TG Now Now SDRAM 3.3V 4K 143MHz 90-FBGA M12L128324A-7B (I)G Now Now SDRAM 3.3V 4K 166MHz 90-FBGA M12L128324A-6B (I)G Now Now SDRAM 3.3V 4K 143MHz 86L-TSOPII M12L128324A-7T (I)G Now Now SDRAM 3.3V4K166MHz86L-TSOPIIM12L128324A-6T (I)GNowNowDDR SDRAM (Dobule-Date-Rate SDRAM)Density Organization DescriptionRefresh SpeedPackagePart Number(Pb-free)Sample MP DDR-SDRAM 2.5V 4K 166MHz 100-LQFP M13S32321A-6L Now Now DDR-SDRAM 2.5V 4K 200MHz 100-LQFP M13S32321A-5L Now Now DDR-SDRAM 2.5V 4K 166MHz 66L-TSOPII M13S64164A-6TG Q2'07Q3'07DDR-SDRAM 2.5V 4K 200MHz 66L-TSOPII M13S64164A-5TG Q2'07Q3'07DDR-SDRAM 2.5V 4K 166MHz 66L-TSOPII M13S128168A-6TG Now Now DDR-SDRAM 2.5V 4K 200MHz 66L-TSOPII M13S128168A-5TG Now Now DDR-SDRAM 2.5V 4K 166MHz 144-FBGA (12x12mm)M13S128324A-6BG Now Now DDR-SDRAM 2.5V 4K 200MHz 144-FBGA (12x12mm)M13S128324A-5BG Now Now 256Mb16Mx16DDR-SDRAM 2.5V 4K200MHz66L-TSOPIIM13S2561616A-5TGNowNow*Identifier of Pb-free as G or P is shown on outer carton.**Industrial spec : (I) Operating temperature -40ºC ~+85 ºC.2M*3264Mb4Mb*1632Mb4Mb 256Kb*161Mb*1616Mb 128Mb8M*164Mx324M*32128Mb8M*1632Mb 64Mb1M*324M*16Mobile SDRAMDensityOrganizationDescriptionRefresh Speed Package & MCPPart Number(Pb-free)Sample MP Mobile SDRAM 2.5V4K 100MHz 50L-TSOPII M52S16161A-10T (I)G Now Now Mobile SDRAM 2.5V 4K 125MHz 50L-TSOPII M52S16161A-8T (I)G Now Now Mobile SDRAM 1.8V4K 100MHz50L-TSOPIIM52D16161A-10T (I)G Now Now Mobile SDRAM 2.5V 4K 100MHz 54L-TSOPII M52S32162A-10T (I)G Now Now Mobile SDRAM 2.5V 4K 100MHz 54-FBGA M52S32162A-10B (I)G Now Now Mobile SDRAM 2.5V 4K 133MHz 54L-TSOPII M52S32162A-7.5T (I)G Now Now Mobile SDRAM 2.5V 4K 133MHz 54-FBGA M52S32162A-7.5B (I)G Now Now Mobile SDRAM 1.8V 4K 100MHz 54L-TSOPII M52D32162A-10T (I)G Now Now Mobile SDRAM 1.8V 4K 100MHz 54-FBGA M52D32162A-10B (I)G Now Now Mobile SDRAM 1.8V 4K 100MHz 54L-TSOPII M52D32162A-7.5T (I)G Now Now Mobile SDRAM 1.8V 4K 133MHz 54-FBGA M52D32162A-7.5B (I)G Now Now Mobile SDRAM 2.5V 4K 100MHz 90-FBGA M52S32321A-10B (I)G Now Now Mobile SDRAM 2.5V 4K 133MHz 90-FBGA M52S32321A-7.5B (I)G Now Now Mobile SDRAM 1.8V 4K 100MHz 90-FBGA M52D32321A-10B (I)G Now Now Mobile SDRAM 1.8V 4K 133MHz 90-FBGA M52D32321A-7.5B (I)G Now Now Mobile SDRAM 2.5V 4K 100MHz 54L-TSOPII M52S64164A-10T (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 100MHz 54-FBGA M52S64164A-10B (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 133MHz 54L-TSOPII M52S64164A-7.5T (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 133MHz 54-FBGA M52S64164A-7.5B (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 54L-TSOPII M52D64164A-10T (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 54-FBGA M52D64164A-10B (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 54L-TSOPII M52D64164A-7.5T (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 133MHz 54-FBGA M52D64164A-7.5B (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 100MHz 86L-TSOPII M52S64322A-10T (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 100MHz 90-FBGA M52S64322A-10B (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 133MHz 86L-TSOPII M52S64322A-7.5T (I)G Q2 '07Q3 '07Mobile SDRAM 2.5V 4K 133MHz 90-FBGA M52S64322A-7.5B (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 86L-TSOPII M52D64322A-10T (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 90-FBGA M52D64322A-10B (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V 4K 100MHz 86L-TSOPII M52D64322A-7.5T (I)G Q2 '07Q3 '07Mobile SDRAM 1.8V4K133MHz 90-FBGAM52D64322A-7.5B (I)GQ2 '07Q3 '07*Identifier of Pb-free as G or P is shown on outer carton.**Industrial spec : (I) Operating temperature -40ºC ~+85 ºC.64Mb4Mx162Mx32(1)All Mobile functions are included : PASR,TCSR,DS,Deep power down mode.(2)Max. Icc6 : Self-refresh current with full bank in 70 ºC .1Mx16Max. Icc6= 75uA (1.8V)16Mb32Mb2Mx161Mx32。

PCIE报告中的LNKSTA2解读一、PCIE概述1. PCIE（Peripheral Component Interconnect Express，外围组件互连表达）是一种用于连接外围设备的高速串行总线标准，其目的是提高系统性能和降低功耗。

2. PCIE接口通常用于连接显卡、网卡、存储设备等外围设备，其速度通常远高于传统的PCI和PCI-X接口。

3. PCIE接口分为不同版本，包括PCIE 1.0、2.0、3.0、4.0和最新的PCIE5.0，每个版本的速度和带宽都有所不同。

二、LNKSTA2的含义1. LNKSAT2是PCIE报告中的一个重要参数，它反映了PCIE设备信息状态的具体情况。

2. LNKSAT2包含了一系列的状态信息，可以帮助我们了解PCIE设备的信息稳定性和性能表现。

3. LNKSAT2的解读可以帮助我们诊断PCIE设备信息问题，解决信息不稳定或性能下降的情况。

三、LNKSTA2参数解读1. 第一个参数：速度速度参数反映了PCIE设备当前的信息速度，通常以数值加上单位“GT/s”（Giga transfers per second）表示，例如“5.0GT/s”表示信息速度为5.0 Giga每秒。

2. 第二个参数：信息宽度信息宽度参数反映了PCIE设备当前的信息通道数，通常以数值加上单位“x”表示，例如“x16”表示信息宽度为16通道。

3. 第三个参数：训练状态训练状态参数反映了PCIE设备信息过程中的训练状态，包括初始化、训练和信息等不同状态。

4. 第四个参数：信息状态信息状态参数反映了PCIE设备信息的当前状态，包括信息成功、信息失败、信息不稳定等不同情况。

四、LNKSTA2参数对性能的影响1. 速度和信息宽度是决定PCIE设备性能的重要因素，高速和宽带的信息可以提供更大的带宽和更快的数据传输速度。

2. 训练状态和信息状态直接影响了PCIE设备的信息稳定性，稳定的信息状态可以保证数据的可靠传输。

概述
LP20R100S 是一款高性能高耐压的副边同步整流控制芯片，适用于AC-DC 的同步整流应用，适用于正激系统和反激系统。

LP20R100S 支持DCM ，BCM ，QR 和CCM 多种工作模式。

特点
⏹ 隔离型的同步整流控制应用 ⏹ 适用正激和反激系统
⏹ 兼容DCM ，BCM ，QR ，CCM 多种工作模式 ⏹ 100V 功率管耐压
图2 LP20R100S 正激典型应用图
定购信息
极限参数(注1)
电气参数(注4, 5)（无特别说明情况下，V
=6 V,T A =25℃）
CC
内部结构框图
电容充电，输出电压上升。

LP20R100S通过D脚
连接输出电压，当输出电压上升时，经过芯片内部供电电路，给VCC电容充电，当VCC的电压充到开启阈值电压时，芯片内部控制电路开始工作，MOS正常的导通和关断。

MOS正常的导通时，电流不再从体二极管流过，而从MOS的沟道流过。

同步整流管关断
为了避免同步整流管导通时，因激磁振荡幅度较大，导致误检测关断信号，使同步整流管异常的关断；LP20R100S通过设置最小死区时间以及设
定的整流管关断第一电压阈值和第二电压阈值，能准确地判断同步整流管的关断。

保护功能
LP20R100S集成了VCC欠压保护，过压钳位，以及驱动脚去干扰等技术。

PCB设计
在设计LP20R100S PCB时，需要遵循以下指南：主功率回路走线要短粗；
VCC旁路电容紧靠芯片VCC管脚和GND管脚；D引脚的铺铜面积适当大些以提高芯片散热。

封装信息。

IntroducingMULTIGIG RT 2-RRuggedized Connectors for VPX applicationspart configUrationssee TE drawings for guide module and pin options.see TE drawings for guide module and pin options.part configUrations see TE drawings for guide module and pin options.Notes (Reference VITa 46.10; Observation 3-6):Note 1: 16 column shell, 15 columns of contactsNote 2: 16 column shell, 7 columns of contacts present (plus contacts i9-16)Note 3: 16 column shell, 16 columns of contactsNote 4: 16 column shell, 8 columns of contacts present (plus contacts i1-8)associated VpX solUtionsMEZaLOK Mezzanine Connectors (Compliant to VITa 61)• U tilizes the proven, reliable MIL-55302 Mini-Box contact interface, with fourpoints of contact• B ackwards compatible with XMC board footprint• Accommodates 10mm, 12mm, 15mm and 18mm stack heights• Solder ball SMT attach in SnPb and RoHS options• 114 (6 x 19) positions and 60 (6 x 10) positions• Protected “stub-proof” socket contacts w/superior signal integrity• Exceptional solder joint reliability (1000+ cycles thermal shock)MULTI-BEaM XLE Power Connectors (Compliant to VITa 62)• 20A and 50A power contacts, plus signal contacts• 3-beam high-conductivity-copper contact design allows for a greater angularmisalignment between mating connectors and offers a lower mating force• Slim guide sockets reduce the overall PCB footprint• Vented housing allows for better heat dissipation• Hot-plug capableOptic Connectors (Compliant to VITa 66)• L ight weight• High bandwidth• EMI immunity• 3 fiber optic interface types available:- 66.1 has two MT ribbon ferrules up to 24 fibers each- 66.2 four ARINC 801 termini- 66.3 one expanded beam lensed insert with four fibersRF Modules (Compliant to VITa 67)• E xcellent channel-to-channel isolation and RF performance to 65 GHz• M odular design permits application specific configuration with high RFcontact count• F loat mounted jack maintains positive RF ground• .240 center-to-center spacing• 4 and 8 position modules are designed to meet the requirements ofVITA 67.1 and VITA 67.2MULTIGIG RT 2-R ConnectorsdescriptionTE’s MULTIGIG RT 2-R ruggedized, light weight, high speed board-to-board interconnect is compliant to VITA 46 standard. This connector systemfeatures the modularity and flexibility of the MULTIGIG RT 2 connector, with a new quad-redundant contact structure designed for high vibration levels.applicationsRugged embedded computing applications: - Ground Defense - Missile Defense - Electronic Systems / C4ISR - Space - Commercial and Military AerospacematerialsContacts: High performance copper alloy, plated 50 µin Au over50 µin Ni in mating area, tin-lead on compliant pin tails Housings:High temperature thermoplasticRugged Guide Hardware: Aluminum or passivated stainless steelmechanicalOperating Temperature: -55 to +105˚CMating Force: 0.75 N [2.70 ozf] maximum per contact, same as standardMULTIGIG RT 2 backplane connectorstandards & specificationsCompliant to VITA 46 (VPX)Product Specification: 108-2072Application Specification: 114-13056Qualification Test Report:501-544physical or other properties Tested to HALT (Highly accelerated life test) vibration levels(0.2G 2/Hz) per VITA 72Connector modules available for 3U and 6U VPX slot profiles,including rear transition modulesReliable press-fit termination, requiring only flat rock toolingLightest weight VPX connector system: mated set of connectors and guide hardware for typical module and backplane slots: 3U - 62.66g (2.21 oz); 6U - 140.26g (4.95 oz)KEy FEaTUREsQuad-redundant contact system supports high lev-els of shock/vibration Compliant to VITA 46 for Open VPX applications Supports Ethernet, Fibre Channel, InfiniBand appli-cations, PCIe and Serial RapidIO high speed protocolsModular, lightweight connector system Robust “pinless” interface Differential, single-ended and powerRuggedized guide hardware availableSupports 0.8 inch card slot pitchesVITA 46 compliance enables upgrade in existingVPX applications Can be combined with high power modules (VITA 62), RF modules (VITA 67) and Optical modules (VITA 66)FOR MORE INFORMaTIONTechnical supportInternet: /ADMamericas: +1 800 522-6752asia Pacific: +86 400 820 6015Europe:Austria: +43 1 905 601 228Baltic Regions: +46 8 5072 5000Benelux: +31 73 6246 999France: +33 1 34 20 86 86Germany: +49 6251-133 1999Italy: +39 011-401 2632Nordic: +46 8 5072 5000Spain/Portugal: +34 93-2910366Switzerland: +41 52 633 66 26United Kingdom: +44 800 267 666Czech Republic: +420 800 701 462Poland: +48 800 702 309Hungary: +36 809 874 04Russia: +7495 790 790 2Follow us on Twitter for all the latest product news@TEConnectivity, and on Facebook, TEConnectivity./aDM© 2013 Tyco Electronics Corporation. All Rights Reserved.1773466-4 ADM/RRD 2.5M 01/2013MEZALOK, MULTI-BEAM XL, MULTIGIG RT, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.Other products, logos, and company names mentioned herein may be trademarks of their respective owners. InfiniBand is a trademark of the InfiniBand Trade Association.While TE has made every reasonable effort to ensure the accuracy of the information herein, nothing herein constitutes any guarantee that such information is error-free, or any other representation, warranty or guarantee that the information is accurate, correct, reliable current. The TE entity issuing this publication reserves the right to make any adjustments to the information contained herein at any time without notice. All implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose are expressly disclaimed. The dimensions herein are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications.。