Ch_11_Intel_Pkg_Spec
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转载黑苹果集成显卡Intel HD Graphics 4400/4600 驱动方法Mobile, Intel, 苹果, 动态, 信息显卡支持列表:设备id设备平台0x0c26移动版0x0c16移动版0x0c06移动版0x0d26移动版HD 52000x0a26移动版超级本HD 50000x0a2e移动版HD 51000x0a16移动版超级本HD 44000x0426移动版HD 46000x0416移动版HD 46000x0406移动版HD 42000x0d22HD 52000x0412HD 4600ig-platform-id信息:平台ID名称管线数端口数固定显存(M)动态显存(M)端口类型成功案例0x0000060c SDV MobileGT133641024eDP, DVI,HDMI0x0000160c SDV MobileGT233641024eDP, DVI, HDMI部分hd46000x0000260c SDV MobileGT333641024eDP, DVI, HDMI i5-4570hd46000x00000604Mobile GT133641024eDP, DVI, HDMI0x00001604Mobile GT233641024eDP, DVI, HDMI0x00002604Mobile GT333641024eDP, DVI, HDMI0x0000260d CRWMobile GT333641024eDP, DVI, HDMI0x0000160a ULT Mobile GT233641024eDP, DVI, HDMI i5-4500uhd44000x0000260a ULTMobile GT333641024eDP, DVI, HDMI0x02001604Mobile GT211641024eDP0x0500260a ULT MobileGT333321024eDP, DP,DP0x0600260a ULT MobileGT333321024eDP, DP, DP i5-4200uhd44000x0800260a ULT MobileGT333641024eDP, DP,Thunderbolt0x08002e0a ULT reservedGT333640x0700260d CRW MobileGT334641024eDP, DP, DP,HDMI0x0300220d CRW DesktopGT233641024DP, DP, DP0x04001204Desktop GT20064256无个人建议,先尝试使用参数驱动。
提升基于英特尔®架构的 Android* 模拟器的速度Costas Styliano...于星期五, 04/10/2013 - 00:21 提交摘要:如果您是一名Android* 开发人员,而且对Android 模拟器的性能不满意,请阅读本文。
我们经常听到许多Android 开发人员抱怨模拟器速度缓慢而且难以操作,但是事实并不应该如此!如果您使用的是采用英特尔®处理器且支持英特尔®虚拟化技术并运行Microsoft Windows* 或Apple Mac OS* 的新电脑,那么您可以使用英特尔®硬件加速执行管理器(英特尔® HAXM)或KVM for Linux* 来轻松地大幅提升Android 模拟器的性能,进而加快Android 应用的测试和调试速度。
本文详细介绍了加速模拟器所需的步骤以及如何对其进行操作。
然后,我们将介绍如何使用NDK 编译x86 原生代码以及如何将包含x86 原生库的APK 提交至Google Play 商店。
英特尔HAXM 还可用于加速Tizen* 模拟器,但这不在本文的讨论范围之内。
如欲获取更多信息,请访问,了解SDK 部分的内容。
目录1. 简介2. 安装2.1. 前提条件2.2. 在Windows 上安装2.3. 在Linux 上安装2.3.1. KVM 安装2.4. 创建AVD(Android* 虚拟设备)3. 公认的最佳方法3.1. 在Eclipse 中使用模拟器测试应用3.2. 提交多种面向不同ABI 的APK 与提交fat 二进制文件至Google Play3.3. 编译面向x86 的NDK3.3.1. 将NDK 路径添加至环境变量3.3.2. 使用NDK 编译3.3.3. 使用NDK 编译的其他方法1. 简介本文将为您安装英特尔®硬件加速执行管理器(英特尔® HAXM)提供指导。
英特尔® HAXM 是一款硬件辅助虚拟化引擎(管理程序),它可通过英特尔®虚拟化技术(英特尔® VT)在Windows* 上加快Android* 开发速度。
LTP工具说明1LTP测试套件 (3)1.1简介 (3)1.2源目录结构 (3)2LTP安装 (4)2.1下载 (4)2.2编译 (4)2.3安装说明 (5)3LTP测试套件结构说明 (6)3.1概述 (6)3.2目录介绍 (6)3.3LTP执行原理 (6)4LTP测试套件测试内容 (7)4.1LTP测试套件测试内容 (7)4.1.1commands (7)4.1.2kernel (7)4.1.3kdump (8)4.1.4network (8)4.1.5realtime (8)4.1.6open_posix_testsuite (8)4.1.7misc (8)4.2测试方法说明 (8)4.2.1commands模块内容描述及实现方法 (8)4.2.2kernel (10)4.2.3network (15)4.2.4open_posix_testsuite (17)4.2.5realtime (18)5LTP测试套件配置详细 (19)5.1networktests.sh脚本配置 (19)5.2networkstress.sh配置 (23)5.3open_posix_testsuite测试套件 (28)5.4realtime配置 (29)5.5mm脚本的配置 (30)5.6io脚本配置 (30)5.7filecaps的配置 (30)5.8tpm_tools的配置 (31)5.9tcore的配置 (31)5.10io_floppy的配置 (31)5.11io_cd 的配置 (32)5.12cpuhotplug的配置 (32)5.13adp.sh的配置 (33)5.14autofs1.sh和autofs4.sh的配置 (34)5.15exportfs.sh的配置 (34)5.16isofs.sh的配置 (34)5.17ltpdmmapper.sh的配置 (35)5.18ltpfslvm.sh的配置及要求 (36)5.19ltpfsnolvn.sh的配置及要求 (36)5.20ltp-scsi_debug.sh的配置及要求 (37)5.21sysfs.sh的配置及要求 (37)5.22rpctirpc的配置及要求 (37)5.23test_selinux.sh的配置及要求 (39)5.24smack的配置和要求 (40)5.25perfcounters的配置及要求 (41)5.26can的配置及要求 (41)5.27test_robind.sh的配置 (42)6LTP测试套件使用说明 (43)6.1概述 (43)6.2测试方法 (44)6.2.1初始测试 (44)6.2.2压力测试 (47)1LTP测试套件1.1简介LTP(Linux Test Project)是SGI、IBM、OSDL和Bull合作的项目,目的是为开源社区提供一个测试套件,用来验证Linux系统可靠性、健壮性和稳定性。
Federal Communications Commission (FCC) Statement (011898)This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with instructions contained in this manual, may cause harmful interference to radio and television communications. However, there is no guarantee that interference will not occur in a particular installation.If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:-REORIENT OR RELOCATE THE RECEIVING ANTENNA-INCREASE THE SEPARATION BETWEEN THE EQUIPMENT AND THE RECEIVER -CONNECT THE EQUIPMENT INTO AN OUTLET ON A CIRCUIT DIFFERENT FROM THAT OF THE RECEIVER-CONSULT THE DEALER OR AN EXPERIENCED AUDIO/TELEVISION TECHNICIANNOTE:Connecting this device to peripheral devices that do not comply with Class B requirements, or using an unshielded peripheral data cable, could also result in harmful interference to radio or television reception.The user is cautioned that any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.To ensure that the use of this product does not contribute to interference, it isnecessary to use shielded I/O cables.CopyrightThis manual is copyrighted with all rights reserved. No portion of this manual may be copied or reproduced by any means.While every precaution has been taken in the preparation of this manual, no responsibility for errors or omissions is assumed. Neither is any liability assumed for damages resulting from the use of the information contained herein.TrademarksAll brand names, logos and registered trademarks mentioned are property of their respective owners.Table of ContentsHARDWARE CONFIGURATION (3)Key Features (3)Motherboard Layout (5)Jumper Settings (6)CPU Speed Selection (6)SW1, SW2 - CPU Frequency Ratio (6)SW3 - VID[0:4] Code to Voltage Definition (7)J7 - CMOS Clear (8)J2 - On Board AC97 Codec Sound (8)Pin Assignment (9)HARDWARE SETUP (10)T o Install DIMMs (10)Installing a New Processor (11)To Install a Processor to ZIF Socket (11)Connect the processor Fan Connector (11)BIOS SETUP (12)Starting Setup (12)Main Menu (13)Standard CMOS Features (14)Advanced BIOS Features (16)Advanced Chipset Features (16)Integrated Peripherals (16)Power Management Setup (16)PnP/PCI Configurations (16)PC Health Status (16)Frequency/Voltage Control (16)Set Supervisor/User Password (16)Flash Update Procedure (18)APPENDIX (19)Select the Heatsink (19)Select the Power Supply (20)HARDWARE CONFIGURATIONKey Features:Chipset•VIA® KT133/KT133A Chipset.Processor•Full support for the AMD Duron TM and Athlon TM processors using Socket A.•Supports 100MHz & 133MHz (optional) bus speed including all processors using Socket A.VRM 9.0 (Voltage Regulator Modules) on Board•Flexible motherboard design with on board VRM 9.0.System Memory• A total of three 168-pin DIMM sockets (3.3V Synchronous DRAM).•Supports Synchronous DRAM PC100/PC133.•Memory size up to 1.5G bytes.•Supports SDRAM memory types.•Supports single-density DIMMs of 1MB, 2MB, 4MB, 8MB and 16MB depth (x64).•Supports double-density DIMMs of 2MB, 4MB, 8MB, 16MB and 32MB depth (x64).•Supports single & double sided DIMMs.•Banks of different DRAM types depths can be mixed.System BIOS•2MB flash BIOS supporting PnP, APM, ATAPI and Windows® 95.•Auto detects and supports LBA hard disks with capacities up to 8.4GB.•Full support of ACPI & DMI.•Easy to upgrade BIOS by end-user.Dual BIOS•As our dual BIOS use the awdflash ver.7.83 to flash the dual BIOS, so our dual BIOS support the flash type of the awdflash ver.7.83, such as Syncmos,ATMEL etc..•The normal boot sequence is from main BIOS. If one BIOS is fail to boot, you can press the ‘Reset’ button to boot from the other BIOS (Note: no every time issuccess, you can try it several times or touch button time is enough long, forexample 2~3 second).•If the BIOS error that contained in compressed part of BIOS bin file, our dual BIOS can know to automatic flash, but the boot block error can not know to flash, that is: If the BIOS bin file is damage, it will auto flash BIOS, and if the bin file is OKeven different with the board bin file, computer will boot normal without enter the flash screen). If the user want to flash the BIOS unconditionally, you can press the ‘Alt + F2’ key to flash another BIOS.On-board I/O•On board two PCI fast IDE ports supporting up to 4 ATA and Ultra DMA33/66/ 100 (optional) IDE devices.•Supports bus master IDE, PIO mode 4 (up to 16.6M bytes/sec) and Ultra DMA33/66/100 (optional) (up to 33/66/100M (optional) bytes/sec) transfer.•One ECP/EPP parallel port.•Two 16550-compatible UART serial ports.•One floppy port, supports two FDDs of 360KB, 720KB, 1.2MB, 1.44MB and 2.88MB capacity.•Four USB ports.•PS/2 mouse port.•PS/2 keyboard port.•Infrared (IrDA) is supported.•One Line/Speaker out, one Mic in, one Line in and MIDI/Game port (optional).Plug-and-Play•Supports plug-and-play specification 1.1.•Plug-and-play for DOS, Windows® 3.X, Windows® 95 as well as Windows® 98.•Fully steerable PCI interrupts.On-board AC97 Sound•Integrated AC97 controller with standard AC97 codec.•Direct Sound and Sound Blaster compatible.•Full-Duplex 16-bit record and playback.•PnP and APM 1.2 support.On-board Creative Sound (optional)•Creative ES1373 Audio controller.•128 voice wave table synthesizer.•DOS game compatibility.•PCI bus master for fast DMA.•Fully compliant with PC97 power management specification.(Note: If Creative PCI Sound is on board, only Primary AMR Card can be used. If Creative PCI Sound is enabled, Bus Master Device on one PCI cannot be used.)Power Management•Supports SMM, APM and ACPI.•Break switch for instant suspend/resume on system operations.•Energy star “Green PC” compliant .•WOL (Wake-On-Lan) Header support.•External Modem Ring-in Wake-up support.•Support auto setting or manual setting for CPU voltage.•Supports suspend-to-RAM (STR) (optional).Expansion Slots• 5 PCI bus master slots (Rev. 2.1 compliant).• 1 Audio Modem Riser (AMR) (optional).• 1 ISA slot (1 ISA slot share with 1 PCI slot).• 1 universal AGP slot (AGP 2.0 compliant - 4X mode support).CAUTIONStatic electricity can harm delicate components of the motherboard. To prevent damage caused by static electricity, discharge the static electricity from yourbody before you touch any of the computers electronic components.Motherboard LayoutThe following diagrams show the relative positions of the jumpers, connectors, major components and memory banks on the motherboard.# The AMR slot is optional.NOTE1)Be sure to check the cable orientation in order to match the colored strip tothe pin 1 end of the connector.2)When you start up the system, please wait for 5 seconds after you poweron AC.Jumper SettingsThis chapter explains how to configure the motherboard’s hardware. Before using your computer, make sure all jumpers and DRAM modules are set correctly. Refer to this chapter whenever in doubt.CPU Speed SelectionIn this motherboard, you can set the CPU speed by manual or auto way, but over clock isn’t recommended.SW1, SW2 - CPU Frequency RatioSW2[1:5]SW1[1:4] SW2[1:5] CPU FREQ1 2 3 4 5SW3 - VID[0:4] Code to Voltage DefinitionSW1(6) Off, Auto Setting SW1(6) On, Manual Setting。
International Packaging Specifications 11 11.1Electronic Industries Association of Japan (EIAJ)
EIAJ publishes the following rules and standards as they apply to the preparation of outline
drawings of integrated circuits.
Number Nomenclature
ED -7300Recommended practice on standard for the preparation of outline drawings of
semiconductor packages
ED -7301Manual or the standard of integrated circuits package
ED -7302Manual for integrated circuits package design guideline
ED -7303Name and code for integrated circuits package
ED -7304Measuring method for package dimensions of ball grid array (BGA)
ED -7304-1Measuring method for package dimensions of Small Outline Package (SOP)
ED -7304-2Measuring method for package dimensions of Small Outline J-leaded package (SOJ)
ED -7305Unit design guide for the preparation of package outline drawing of integrated circuits
(gullwing-lead)
ED -7311Standards of integrated circuits package
ED -7311-1Standard of integrated circuits package [TSOP(1)]
ED -7311-2Standard of integrated circuits package [TSOP(2)]
ED -7311-3Standard of integrated circuits package [Tape Ball Grid Array 1.0mm pitch (T-BGA)]
ED -7311-4Standard of integrated circuits package [Tape Ball Grid Array 1.27mm pitch (T-BGA)]
ED -7311-5Standard of integrated circuits package [32/48 pins Fine-pitch Ball Grid Array (FBGA)]
ED -7311-6Standard of integrated circuits package [60/90 pins Fine-pitch Ball Grid Array (FBGA)]
ED -7311-7Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array (P-FBGA)]
ED -7311-8Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array 0.8mm pitch (P-
FBGA)]
ED -7311-9A Standard of integrated circuits package [P-BGA (Cavity up type)]
ED -7311-10A Standard of integrated circuits package [P-BGA (Cavity down type)]
ED -7311-11A Standard of integrated circuits package (119/153 pins P-BGA)
ED -7311-12Standard of integrated circuits package (52 pins 64 pins 80 pins and 100 pins low-profile
quad flat package with exposed heatsink)
ED -7400Standards for the dimensions of semiconductor devices (integrated circuits)
ED -7400-1Standards for the dimensions of semiconductor devices (integrated circuits)
ED -7400-2Standards for the dimensions of semiconductor devices (integrated circuits)
ED -7401-4Method of measuring semiconductor device package dimensions (integrated circuits)
ED -7405General rules for the preparation of outline drawings of integrated circuits zigzag in-line
packages (ZIP)
ED -7405-1General rules for the preparation of outline drawings of integrated circuits shrink zigzag
in-line packages (SZIP)
International Packaging Specifications
International Packaging Specifications。