27pF贴片电容0603CG270J500NT《风华电容样品单》

广东风华高新科技股份有限公司GUANGDONG FENGHUA ADV ANCED TECHNOLOGY HOLDING CO.，LTD.承认书APPROV AL SHEET客户名称:CUSTOMER品名：常规厚膜片式固定电阻器PARTNAME规格版本号VERSION日期DATE制造客户APPROV AL APPROV AL 拟制审核确认检验审核批准FENGHUAFENG HUA ADV ANCED TECHNOLOGY (HOLDING) CO., LTD序号 No 目 录TABLE OF CONTENTS1.0 概述Summary2.0 结构及尺寸Structure And Dimensions3.0 型号规格表示办法How To Order4.0 电气性能Performance Specification5.0 可靠性Reliability Data6.0 包装Package7.0 环保情况说明 Environmental Protection Statement 8.0 推荐使用的焊接曲线Recommended soldering profile 9.0 使用注意事项Precautions For UseRC/RS□□□□1.0概述Summary片式电阻器主要生产的型号包括01005、0201、0402、0603、0805、1206、1210、2010、2512。

其特点是：The dimension type for chip resistor including01005、 0201、0402、0603、0805、1206、1210、2010、2512, and the features are as below:*体积小、重量轻miniature and light weight*电性能稳定，可靠性高 stable electrical capability and high reliability *机械强度高、高频特性优越superior mechanical and frequency*装配成本低，并与自动贴装设备匹配low assembly cost, suit for automatic SMT *适应再流焊与波峰焊suit for re-flow and wave flow soldering .*符合ROHS指令要求Compliant with ROHS Directive*符合无卤素要求Compliant with halogen free requirement*禁止使用SS-00259中规定的1级环境管理物质*SONY指定原材料只能从绿色伙伴认定供应商处采购产品广泛应用于计算机、通讯、工业自动化、航天航空、军事、数字电视、数字音响及消费类电子等领域。

贴片电容是一种常用的电子元器件，外观标准通常包括以下几个方面：
1.尺寸标准：贴片电容的尺寸通常按照国际标准进行设计，常见的尺寸标准有0201、0402、0603、0805、1206、1210等。

2.颜色标准：贴片电容的颜色通常有红色、黄色、绿色、蓝色、紫色、黑色等，不同的颜色代表不同的电压等级。

3.标识标准：贴片电容的标识通常包括电容值、耐压值、品牌等信息，可以帮助用户快速识别和选择合适的电容。

4.封装标准：贴片电容的封装形式有多种，常见的包括轴向、径向、SMD等，不同的封装形式适用于不同的应用场景。

5.外观质量：贴片电容的外观质量要求表面光滑、无明显瑕疵、无裂纹、无气泡等缺陷，以确保电容的正常使用和长期稳定性。

总之，贴片电容的外观标准是多方面的，包括尺寸、颜色、标识、封装形式和外观质量等多个方面。

声明：1、本规格书是由风华高科授权代理商－南京南山半导体有限公司自风华高科官方网站下载整理，若有变更，恕不另行通知；2、本规格书没有足够的空间说明详细电性能参数，仅列明了标准规格，在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性，在-55℃~125℃工作范围内，其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构，具有高可靠性。

*优良的焊接性和耐旱性，适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机：技术支持：客服：传真：电邮：客户基本资料公司名称网址：联系方式电话：传真：□生产型企业□贸易商收货地址生产产品姓名：职务：□技术□采购□其他联络人电话：手机：电邮：样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写，可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送，并请将此单打印盖章后，电邮至：：。

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4、收到样品申请单并经审核通过后，南京库有现货2个工作日内发出；如需订货，交期3-4周，非常规品顺延1-2周。

5、样品免费，运费到付(一般选择顺丰快递)；样品数量：单个型号5～20pcs，或根据BOM表清单按2～5套提供。

C1857 C1871 C5378 C8031 C12656 C13585 C13967 C14663 C14853 C14857 C14858 C15195 C15849 C15850 C16149 C16772 C19666 C19702 C21117 C21120 C21895 C22397 C23630 C23733 C23969 C28260 C28262 C28323 C29823 C31106 C31658 C32949 C35216 C37474 C38523 C39148 C45783 C46219 C47339 C49217 C49678 C53134 C53172 C53175 C53987 C57112 C59461 C1600 C1615 C1788 C1800 C1803 C1820 C67560 C1832 C1792
阻值(Ω)/容值 电压 (uF) 0.0010000000 50.00 0.1000000000 16.00 0.0022000000 50.00 0.0004700000 50.00 0.0001000000 50.00 0.0000120000 50.00 0.0000150000 50.00 0.0000180000 50.00 0.0000015000 50.00 0.0000220000 50.00 0.0000022000 50.00 0.0000330000 50.00 0.0010000000 50.00 0.0001500000 50.00 0.0015000000 50.00 0.0002200000 50.00 0.0022000000 50.00 0.0220000000 50.00 0.0033000000 50.00 0.0004700000 50.00 0.0470000000 50.00 0.4700000000 25.00 0.0006800000 50.00 0.0068000000 50.00 0.0000100000 50.00 0.0000015000 50.00 0.0000180000 50.00 0.0000200000 50.00 0.0000220000 50.00 0.0000270000 50.00 0.0000330000 50.00 0.0003300000 50.00 0.0000047000 50.00 0.0000470000 50.00 0.0000068000 50.00 0.0010000000 50.00 0.0100000000 50.00 0.0220000000 50.00 0.0330000000 50.00 0.3300000000 50.00 0.0004700000 50.00 0.0047000000 50.00 4.7000000000 25.00 0.0000100000 50.00 0.0001000000 50.00 0.0000150000 50.00 0.0000180000 50.00 0.0000200000 50.00 0.0000220000 50.00 0.0000300000 50.00 0.0000330000 50.00 0.0100000000 50.00 0.1000000000 50.00 1.0000000000 50.00 0.0002200000 50.00

各品牌贴片电容规格资料汇总贴片电容是一种常见的电子元器件，被广泛用于电路设计和生产中。

它们具有小巧的尺寸、稳定性好以及较低的成本。

各品牌贴片电容的规格资料是电子行业从业人员日常工作所必需的信息之一、本文将汇总一些知名品牌的贴片电容规格资料，供读者参考。

1. Murata（村田）Murata是一家日本电子元器件制造企业，也是全球最大的陶瓷电容制造商之一、以下为Murata的一些常用贴片电容规格资料：-容量范围：从0.1pF到100μF-额定电压范围：从4V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1808、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、NPO等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等2. Samsung（三星）三星是一家韩国综合电子企业，也是全球最大的半导体制造商之一、以下为三星的一些常用贴片电容规格资料：-容量范围：从0.5pF到22μF-额定电压范围：从4V到100V见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X8S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等3.TDK（TDK公司）TDK是一家日本电子元器件制造企业，也是全球最大的磁性元件制造商之一、以下为TDK的一些常用贴片电容规格资料：-容量范围：从0.1pF到220μF-额定电压范围：从4V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等4. Yageo（圆石）圆石是一家台湾电子元器件制造企业，也是全球最大的无源元件制造商之一、以下为圆石的一些常用贴片电容规格资料：-容量范围：从0.1pF到2.2μF-额定电压范围：从4V到100V见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等5.AVX（AECOM公司）AVX是一家美国电子元器件制造企业，也是全球领先的陶瓷电容制造商之一、以下为AVX的一些常用贴片电容规格资料：-容量范围：从0.1pF到47μF-额定电压范围：从6.3V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1808、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等以上仅为一些知名品牌贴片电容规格资料的简要汇总，实际应用中还需要根据具体的设计要求、电路需求以及可用的供应商和库存情况选择最合适的贴片电容。

一、【贴片电容的命名】贴片电容的命名所包含的参数有贴片电容的尺寸、做这种贴片电容用的材质、要求达到的精度、要求的电压、要求的容量、端头的要求以及包装的要求。

一般订购贴片电容需提供的参数要有尺寸的大小、要求的精度、电压的要求、容量值、以及要求的品牌即可。

例风华系列的贴片电容的命名：例如：0805 CG 102 J 500 N T含义：➢0805：是指该贴片电容的尺寸大小，是用英寸来表示的08表示长度是0.08英寸、05表示宽度为0.05英寸➢CG ：是表示做这种电容要求用的材质，这个材质一般适合于做小于10000PF以下的电容，➢102 ：是指电容容量，前面两位是有效数字、后面的2表示有多少个零；102＝10×100也就是＝1000PF，（这里的100即为：2个0）.➢J ：是要求电容的容量值达到的误差精度为5％，介质材料和误差精度是配对的➢500 ：是要求电容承受的耐压为50V 同样500前面两位是有效数字，后面是指有多少个零。

➢N：是指端头材料，现在一般的端头都是指三层电极（银/铜层）、镍、锡➢T ：是指包装方式，T表示编带包装，B表示塑料盒散包装二、【贴片电容的材料划分】贴片电容的材料常规分为三种，NPO,X7R,Y5V；NPO此种材质电性能最稳定，几乎不随温度，电压和时间的变化而变化，适用于低损耗，稳定性要求高的高频电路。

容量精度在5％左右，但选用这种材质只能做容量较小的，常规100PF以下，100PF-1000PF也能生产但价格较高.X7R此种材质比NPO稳定性差，但容量做的比NPO的材料要高，容量精度在10％左右。

Y5V此类介质的电容，其稳定性较差，容量偏差在20％左右，对温度电压较敏感，但这种材质能做到很高的容量，而且价格较低，适用于温度变化不大的电路中。

三、【SMD电阻、电容、电感的误差表示方法】第一种，相对误差，以电容量标称值的偏差百分数表示，即：字母 D P F R G U误差±0.5% ±0.625% ±1%±1.25% ±2% ±3.5% 字母J K M S Z四、【SMD元件封装公制、英制、尺寸】贴片电容的尺寸表示法有两种，一种是英寸为单位来表示，一种是以毫米为单位来表示，贴片电容系列的型号有0201、0402、0603、0805、1206、1210、1812、2010、2225等。

标准适用各样贴片电容容值表X7R贴片电容简述X7R贴片电容属于 EIA 规定的 Class 2 类资料的电容。

它的容量相对稳固。

X7R贴片电容特征拥有较高的电容量稳固性，在-55 ℃～ 125℃工作温度范围内，温度特征为± 15%。

层叠独石构造，拥有高靠谱性。

优秀的焊接性和和耐焊性，合用于回流炉和波峰焊。

应用于隔直、耦合、旁路、鉴频等电路中。

X7R贴片电容容量范围厚度与符号对应表符号A C E G J K M N P Q X Y Z最大厚度毫米(英寸 )3)2)8)4)7)0)0)5)0)0)0)0)0)0201～1206 X7R 贴片电容选型表封装尺寸02010402060308051206工作电压1616 25 50 10 16 25 50 100 10 16 25 50 100 200 10 16 25 50 100 200 500 100 A150 A220A C330A C G G J J J J J J K470A C G G J J J J J J K电容量680A C G G J J J J J J K(pF)1000 A C G G J J J J J 1500C G G J J J J J2200C G G J J J J J3300 C C G G J J J J J4700C G J J J J J6800 C C G J J J J JC G J J J J JC G G J J J J JC G J J J J J 电容量(uF)G J J J J MG G J J J J MG J J J J J K J J J J J J J M J J J J J J J M J J J J J J J M J J J J J J J M J J J J J J J PJ J J J J J J P J J J J J J MM J J J J J MJ J J J J MJ J J J J MJ J J J J PG G G J J J J J J J J MG J J J J J J JG J J M J J J JM M J J M MN M M M MN M MN M M QPQ工作电压1616 25 50 10 16 25 50 100 101625 50 100 200 10162550 100 200 500封装尺寸0201 04020603080512061210～2225 X7R 贴片电容选型表封装尺寸121018121825 222022256.10 16 25 50 100 200 500 50 100 200 500 50 100 50 100 200 50 100 310001500J J J J J J M电容量2200J J J J J J M(pF)3300J J J J J J M4700J J J J J J M6800J J J J J J MJ J J J J J M K KKKMMXXXXMPJ J J J J J P K KKPMMXXXXMPJ J J J J J Q K KKPMMXXXXMPJ J J J J J K KKXMMXXXXMPJ J J J J J K KKZMMXXXXMPJ J J J J M K K K MMXXXXMP电容量J J J J J M K K K MMXXXXMP(uF)J J J J M K K P MMXXXXMPJ J J J P K K P MMXXX M PJ J J J Z K M MMXXX M PMMMMZ K P MMXXX M PM M P X Z M Q M X X X M PN N P X Z M X M Z M PN N M M XX Z MQ Z 10Z1016 25 50 100 200 500 50 100 200 500 50 1006.工作电压50 100 200 50 1003封装尺寸12101812182522202225NPO COG贴片电容容量规格表默认分类2021-07-15 16:28阅读 354议论 1字号：大大中中小小NPO贴片电容简述NPO(COG)贴片电容属于 Class 1 温度赔偿型电容。

贴片电容识别简介贴片电容，也称为贴片电容器，是一种常见的电子元件，被广泛用于电路板和电子设备中。

贴片电容具有体积小，封装方便，性能稳定等特点。

因此，对于电子维修和制造行业的从业人员来说，学会准确识别贴片电容是至关重要的。

本文将介绍如何识别贴片电容以及常见的贴片电容规格和标记。

希望能够帮助读者更加熟悉和了解贴片电容。

贴片电容的外观贴片电容通常采用矩形外观，尺寸小，颜色常见为黑色或白色。

常见的封装方式有0603、0805、1206等。

贴片电容的标记贴片电容的上表面通常会印有特定的标记，用于表示其电容值和电压等信息。

下面是常见的贴片电容标记示例：•104：表示电容值为100000pF，即0.1uF。

•105：表示电容值为1000000pF，即1uF。

•474：表示电容值为47000000pF，即47uF。

•225：表示电容值为2000000pF，即2.2uF。

需要注意的是，这些标记值是以皮法（pF）为单位的。

除了电容值，贴片电容上还可能会印有电压等级、精度等信息。

贴片电容的识别方法要准确识别贴片电容，可以采用以下步骤：1.观察外观：贴片电容具有典型的矩形外观，颜色一般为黑色或白色。

根据尺寸可以初步判断封装类型。

2.查看标记：注意贴片电容上的标记，将标记的数字进行转换，根据上面提到的标记示例来判断电容值和单位。

同时，注意标记上是否还有其他的信息，如电压等级和精度。

3.测试电容值：如果无法准确识别电容值，可以借助电容表或万用表来测试电容值。

将正负极分别接触到电容的两个引脚上，读取电容的值，并进行单位换算，以确认电容的数值。

常见的贴片电容规格以下是一些常见的贴片电容规格：1.0603：尺寸为0.06英寸 × 0.03英寸，体积小，适用于小型电子设备。

2.0805：尺寸为0.08英寸 × 0.05英寸，广泛应用于电子设备中。

3.1206：尺寸为0.12英寸 × 0.06英寸，适用于需要较高电容值的应用。

贴片电容和其它贴片电子元器件一样，按封装类型（也就是体积的大小）可分为0402（1.0×0.5）、0603（1.6×0.8）、0805（2.0×1.2）、1206（3.2×1.6）、1210（3.2×2.5）、1812（4.5×3.2）等。

除了封装类型外，常见的贴片电容还必须包括材质、容量、电压和精度等。

以下以风华系列的贴片电容的型号为例：例：0805 CG 102 J 500 N T0805：是指该贴片电容的尺寸套小，是用英寸来表示的。

08表示长度是0.08英寸、05表示宽度为0.05英寸；CG：是表示做这种电容要求用的材质，这个材质一般适合于做小于10000PF以下的电容；102：是指电容容量，前面两位是有效数字、后面的2表示有多少个零102=10×102,也就是=1000PF；J：是要求电容的容量值达到的误差精度为5％，介质材料和误差精度是配对的；500：是要求电容承受的耐压为50V。

同样500前面两位是有效数字，后面是指有多少个零；N：是指端头材料。

现在一般的端头都是指三层电极(银/铜层)、镍、锡；T：是指包装方式。

T表示编带包装，B表示塑料盒散包装；国巨、TDK，三星等贴片电容型号基本上也是这样，只是使用的符号不一样而已。

贴片电阻电容的封装形式无极性电容以0805、0603两类封装最为常见；0805具体尺寸：2.0×1.25×0.51206具体尺寸：3.0×1.50×0.5贴片电容以钽电容为多，根据其耐压不同，又可分为A、B、C、D四个系列，具体分类如下：类型封装形式耐压A 3216 10VB 3528 16VC 6032 25V 尺寸：L:6.0 w3.2D 7343 35V贴片钽电容的封装是分为A型（3216），B型（3528），C型（6032），D型（7343），E型（7845）。

0.3mm 0.4mm 0.5mm 0.3mm 0.4mm 0.5mm 0.4mm 0.5mm 0.4mm 0.5mm Capacitance 0.5PF 1PF 5PF 10PF 15PF 22PF 33PF 47PF 68PF 100PF 150PF 220PF 330PF 470PF 1000PF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 100nF
0 1 2
J K
5% 10%
10 10
6R3 100 250 500
6.3V 10V 25V 50V
S C N ( / / ) T
WB W L
T
mm L 0805 2012 2.00 0.20 1.25 W 0.20 T 0.30 0.10 0.40 0.10 0.50 0.10 0.30 0.10 0.40 0.10 0.50 0.10 WB 0.50 0.25

Capacitance Range
Item Size Thickness Capacitance 0.5PF 1PF 5PF 10PF 15PF 22PF 33PF 47PF 68PF 100PF 150PF 220PF 330PF 470PF 1000PF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 100nF COG 0805 Thin MLCC X7R 1206 Thin MLCC COG X7R
Package Method Expression Method T Packaging Taping Packaging
Outside Dimension
WB W L 1206 3216 3.20 0.30 1.60 Type Metric British expression expression 0805 2012 2.00 Dimension(mm) L 0.20 1.25 W T WB 0.25

风华高科
广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
※Y5V：The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. ※Z5U：The capacitor made of this kind of material is considered as ClassⅡ capacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature. 二、结构及尺寸

风华高科贴片电阻的命名方法我们以两个实例来说明国内最大的片式无源器件生产商风华高科的贴片电阻命名方法：1、5%精度的命名：RS-05K102JTL2、1％精度的命名：RS-05K1002FTLR－表示厚膜片式固定电阻器（Thick film chip fixed resistor）S－是该贴片电阻额定功率所属系列为特殊功率系列（额定功率比此前的老款标准有所提升）：不同封装尺寸的贴片电阻功率不同，但是同一封装尺寸的贴片电阻具有统一的额定功率值。

具体数值如下：0402是1/16W、0603是1/10W、0805是1/8W、1206是1/4W、 1210是1/3W、1812是1/2W、2010是3/4W、2512是1W。

（备注：C 系列是较早的老一代贴片电阻的额定功率系列代号，现在已经基本不生产了。

因此基本上看不到。

C系列的额定功率参数表如下：04 02是1/16W、0603是1/16W、0805是1/10W、1206是1/8W、 1210是1/4W、18 12是1/2W、2010是1/2W、2512是1W）05－表示封装尺寸(英寸)：02表示0402、03表示0603、05表示0805、06表示1206、1210表示1210、1812表示1812、10表示1210、12表示2512。

点击查看封装尺寸英寸与国际标准尺寸对照表K－表示温度系数为100PPM。

其他型号包括：W：正负200PPM；U正负400PPM；K正负100PPM；L正负250PPM102 －表示电阻阻值为1000Ω=1kΩE-24（5%精度贴片电阻）系列贴片电阻阻值采用三位数表示法：前两位为有效数字，后一位是有效数字后面零的个数，基本单位是Ω。

例如：103=10 000Ω=10kΩE-96系列（1%精度贴片电阻）采用4位数表示法：前三位为有效数字，后一位是有效数字后面零的个数，基本单位是Ω。

例如：1003=10 0 000Ω=100kΩ备注：1欧姆电阻的表示法比较特殊，用1R0表示，即1R 0=1欧姆J －表示该贴片电阻的阻值误差精度在正负5%内。

Internal Code 85 85 85 PET 85 PET 105
Code 81 85 8F 8E 11
Lead Foming Type
Bulk 5mm 5mmChip tape ( 4~ 6.3)2.5mm 2.5mmTape ( 4~ 6.3)3.5mm 3.5mmTape ( 4~ 8)5.0mm Lead forming 8)5mm 5mmTape 8mm orininal type(vertical)tape 5mm 5mm Lead forming C Lead forming B B lLead forming ( 4~ 5)2.5mm Lead forming 8x5 F2.5mm ( 4~
4.50
35
50
5.70
6800(682)
25 25 30 25 30 25 30
30 2.80
3.80
4.40
5.10
35
60
6.00
8200(822)
25
25 2.80
35 25 3.30 30 30 30 40 3.50 35 30 30 45 4.00 35 35 40 4.80 35 35 45 5.70 35 40 45 6.30
30 35 30 45 35 45 35 50 40 45 35 50 40 50
2.50
3.20
2700(272)
25
30
2.50
2.90
3.60
3300(332)
25
25
2.40
25 25 30 25 30 25 30 25 30 35 30 35 30 35 35
35 35 30 40 30 45 35 50 40 35 45 35 50 40 50

MULTILAYER CHIP CERAMIC CAPACITOR(:)DC Medium-voltage MLCCDC medium-voltage MLCC has good high-voltage reliability,it is made in special design that based on the MLCC technology and equipments.It is suitable for surface-mounting ,can improve the properties of circuits.New monolithic structureThe size of the capacitor is small,yet has high electrostatic capacitance,can operate at high-voltage levels.Has good solderability.Technology Parameter (refer to the picture below):DC-DC converter.The circuit filter and vibration bell of telephone,electrograph and modem.Snubber circuit for switching power supply.FeaturesApplicationsProduct Part Number Expression1206CG100J202NTWMULTILAYER CHIP CERAMIC CAPACITORCapacitance RangeOutside DimensionWMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITOR【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R 1808 (V)10018122225200 200 200 5001000 2000 3000 4000 100 500 1000 2000 3000 4000 100 500 1000 2000 3000 4000 5000 /250 /250 /250100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3 F 10 F 22 F75【 南京南山半导体有限公司 — 贴片电容选型资料】ItemX7R Medium-voltage MLCCDielectric 1808 1812 2225 Size Rated 100 200 5001000 2000 3000 4000 100 200 500 1000 2000 3000 4000 100 200 500 1000 2000 3000 4000 5000 /250 /250 Volatage(V) /250 Capacitance 100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3. F 10 F 22 F76【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V 0603 (V) 100 100 0805 200 250 100 1206 200 250 100 1210 200 250 100 1812 200 250 100 2225 200 2501000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 F 2.2 3.3 10 F F F77【 南京南山半导体有限公司 — 贴片电容选型资料】ItemY5V Medium-voltage MLCC 1210 100 200 250 100 1812 200 250 100 2225 200 250Dielectric 0603 0508 1206 Size Rated Volatage(V) 100 100 200 250 100 200 250 Capacitance 1000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 2.2 3.3 10 F F F F78【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG1-551251. 2. 3. 2 4. , , , , , 105.3 4 :HP4278A 1. 2. 5 (D.F.) 3. HP4284 25 5 :30% 75% 1.0 0.2V C<1000PF,1.0 0.1MHz; C 1000PF,1.0 0.1KHZ :10( :SF2511) >500V6I.R. 500V: , 60 5>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA 150+0/-10 60 55S 5S 5S824 2 -55 125 25975235 5 5 2 0.5 150+0/-10 5% 0.5PF, 10 1 D.F. 24 2 265 5 24 2 25 2.5mm/ : 25 2.5mm/ 60 524510I.R.1 2100 170120 2001 179【 南京南山半导体有限公司 — 贴片电容选型资料】Middle and high Voltage COG MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed innerelectrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified toleranceCr 5PF 0.56% -4 5PF Cr 50PF 1.5[(150/Cr)+7] 10 Cr 50PF 0.15%Check by using microscope10.3 4Dimensions Capacitance Dissipation Factor (DF) Insulation ResistanceUsing micrometer or vernier calipers Measuring Equipment:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30%~75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and if Ur>500V,then just use 500V,measure the IR within 60 1 seconds. Ur Max. Current Measuring Time 1000V 1000V 2000V 2000V 50mA 50mA 10mA 5S 5S 5S56C<10nF,IR 5 10 C>10nF,IR CR 500S10Withstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur8Must meet the capacitor Capacitance temperature coefficient Temperature requirements within the Characteristics operating temperature range. Solderability Tin coverage 75% should be of the outer electrode covered by Tin Appearance Cap. Change ratio No defects visible 5% or 0.5PF whichever is bigger Same as original standard Same as original standardFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55~125 or 55~85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 eutectic solder solution for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minutes 1minutes9 Resistance to Soldering10DFIR80【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz10 55Hz 10Hz 2 6 123 420 mmmm3mm mm mm mmmm150+0/-10 14 24 260 524 281【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Adhesive Strength of TerminationStandard No removal of the termination or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc.11Fig.1 Vibration Resistance10N,10 1s Speed:1.0mm/s Glss epoxy resin board12Appearance No defects or Solder the capacitor to the test jig (glass epoxy resin abnormities board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the Capacitance Within the frequency being varied uniformly between the specified approximate limits of 10 and 55Hz, shall be traversed tolerance range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 DF Same as hours in each 3 mutually perpendicular directions original (total is 6 hours). standardFig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown in Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mmmm13mmmm mmmmTemperature Cycle 14Appearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, the measure.82【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, min. 14 D.F. I.R. 10000M 1 2 3 4 2 3 30 2 30 2 3 3 3 34029095 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M1.5 50mA ( 5% 0.5PF, 16 .) >2000V100012 24 21.2D.F. I.R. 10000M83【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Temperature CycleStandard Cap. Change ratio 2.5% or 0.25PF whichever is larger Same as original standard More than 10000M Heat-treatment:Test MethodD.F. 14 I.R.Stage Temperature Time 1 lowest operating temperature 3 30 2 2 Room Temperature 3 Highes operating temperature 2 30 4 Room Temperature 2min. 3 3 3 3Humidity Steady State 15AppearanceNo defects or abnormities 5% or 0.5PF whichever is larger Same as original standard More than 10000M No defects or abnormities 5% or 0.5PF (whichever is larger) Same as original standard More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.Cap. Change ratioD.F.I.R. Life Test AppearanceCap. Change ratio 16Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2times Ur to test)D.F.I.R.84【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R1-551251. 2. 3. 2 4. , , , , , 105.3 4 : HP4278A HP42845(D.F.)25010-41.255:30% 75% 2. 3. : :1.0 :1.0 0.2V 0.1KHz ( :SF2511 ) >500V , 60 56I.R.C 25nF,IR 10000M C>25nF,R C 500S 500V:>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA5S 5S 5S150+0/-10 24 8 25 -55 125 2605235 9 75 245 5 25 2.5mm/ 2 0.5585【 南京南山半导体有限公司 — 贴片电容选型资料】General X7R MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of the termination width. Within the specified dimensions Within the specified tolerance 250 10-4Check by using microscope10 .3 4Dimensions Capacitance Dissipation Factor (DF)5Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency:1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 1 seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5SInsulation Resistance 6C 25nF,IR 10000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000V8Capacitance Temperature CharacteristicsMust meet the capacitor character temperature coefficient requirements within the operating temperature range. 75% of the outer electrode should be covered by TinFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 ,then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 245 5 eutectic solder solution for 2 0.5 seconds. Dipping speed:25 2.5mm/second.Solderability 986【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 10% D.F. 10 I.R. 25 : 10 1 24 2 26560 5 24522.5mm/1 2100 170120 2001 1110N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 55Hz 55Hz 10Hz 1 2 12 6 1023 13 ( ) 487【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Within 10% ratio DF 10 IR Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defect shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1388【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mmmmmm13mmmmmmmmmin. 20% 1 2 14 D.F. I.R. 3 4 2 3 30 2 30 2 3 3 3 340 20% 15 ( ) D.F. I.R.29095 48 2500+24/-01.5 20% .) 16 D.F. I.R 50mA ( >2000V100012 24 21.289【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmmmm13mm mmmmTemperature CycleAppearanceNo defects or abnormities 20%Cap. Change Within ratio 14Stage Temperature Time min. 1 Min. Operating Temperature 3 30 3 2 Room Temperature 2 3 3 Max. Operating Temperature 2 30 3 4 Room Temperature 2 3D.F.Same as original Specification Same as original Specification No defects or abnormities 20% Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 48 2 hours at room temperature, then measure.I.R.Humidity Steady StateAppearanceCap. Change within ratio D.F.15 I.R. Life Test AppearanceSame as original Specification Same as original Specification No defects or abnonrmities 20% Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2Ur to test.)Cap. Change within ratio 16 D.F.Same as original specification Same as original specificationI.R.90【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V1-25~851. 2. 3. 2 4. 5. , , , , ,103 4 : HP4278A 1. 5 (D.F.) 500 10-4HP4284 25 5 75% 0.2V 0.1kHz:30% 2. 3. : :1.0 :1.06I.R.C 25nF,IR 40000M C>25nF,R C 500S( : ,: SF2511 60 5)7>300V >400V >500V100V 200V 250V50mA 50mA 50mA5S 5S 5S150+0/-10 8 24 -25 85 2605 25975235 25 0.52455 25 2.5mm/91【 南京南山半导体有限公司 — 贴片电容选型资料】General Y5V MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -25 85 Standard Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified tolerance 500 10-4Check by using microscope10.3 4Dimensions Capacitance) Dissipation Factor (DF)Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency: 1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 5seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5S5Insulation Resistance 6C 25nF,IR 40000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000VCapacitance Temperature Characteristics 8Must meet the capacitor temperature coefficient requirements within the operating temperature range.First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55 125 or 55 85 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 235 5 (or 245 5 leadless eutectic solder solution) eutectic solder solution hanging lead for 2 0.5seconds. Dipping speed: 25 2.5mm/second.Solderability 975% of the outer electrode should be covered by Tin92【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 30% D.F. I.R. 10 60 5 24 22655 24 2 25 2.5mm/ :1011 2100 170120 200 11 110N11 10N,10 1 :1.0mm/ 11.5mm D.F. 10 55Hz 12 55Hz 10Hz 1 2 6 1023 ( 13 ) 493【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Z5U, Y5V: within ratio DF 10 IR30%Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defects shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1394【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mm mmmm13mm mmmmmm30%min. 1 2 3 4 3 2 30 2 30 2 3 3 3 3D.F. 14 I.R.40 30%29095 48 2500+24/-015()D.F. I.R.30% 16 D.F. I.R 48 21.5 50mA10001295【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmm13mmmmmmmmTemperature CycleAppearanceNo defects or abnonrmities 2.5Cap. Change Within ratio 14Stage Temperature Time 30 1 Min. Operating Temperature 3 2 Room Temperature 2 3 Max. Operating Temperature 2 30 4 Room Temperature 2min. 3 3 3 3D.F.Same as original spec. Same as original spec. No defects or abnonrmities Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.I.R.Humidity Steady State 15AppearanceCap. Change within 30% ratio Same as D.F. original spec. I.R. Same as original spec. No defects or abnonrmities 30%Life TestAppearanceCap. Change within ratio 16 D.F.Same as original spec. Same as original spec.Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.I.R.96。

Example:
CC 0805 K K X7R 9 B N 104
Code 1~2 Series Name CC = Multi-layer
chip cap. CA = Cap. Array CL=Low. Inductance
Code 3~6
Size Code
inches (mm)
0402 (1005)
Tanδ≤ 5% or ≤ 7%, 25V/50V depending on capacitance value
Tan δ ≤ 4%, 50V Tan δ ≤ 6%, 25V
Tanδ≤ 9% or ≤12.5%, Tan δ ≤ 9%, 16V 16V depending on capacitance value
-1-
YAGEO CORPORATION
3. ELECTRICAL CHARACTERISTICS
Characteristics
Operation temperature range Temperature characteristic/coefficient (TC) Capacitance tolerance
C ≥ 10pF Tan δ ≤ 10 x 10-4
±15%
±10%, ±20%
Tan δ ≤ 2.5%, 50V Tan δ ≤ 2.5%, 25V Tan δ ≤ 3.5%, 16V Tan δ ≤ 5%, 10V
+30% to –80%
+22% to –56%
±20%, -20%~+80% ±20%, -20%~+80%
Tan δ ≤ 12.5%, 10V
Insulation resistance(IR)

贴片电容规格表贴片电容规格表贴片电容是一种高效的电子元器件，广泛应用于电子电路中。

以下是一些常用的贴片电容规格表，其中包括容值范围、工作电压、温度系数和尺寸等信息。

1. 0603规格贴片电容0603规格贴片电容是一种常用的小型电容，尺寸为0.06英寸×0.03英寸，也就是1.60 mm×0.80 mm。

其容值范围为1pF to 1µF，工作电压在6.3V to 50V之间。

温度系数通常为±100ppm/℃，也有一些产品温度系数更小，例如±50ppm/℃。

这种电容通常用于手机、平板电脑、笔记本电脑等小型电子设备中。

2. 0805规格贴片电容0805规格贴片电容是一种中等尺寸的电容，尺寸为0.08英寸×0.05英寸，也就是2.03 mm×1.27 mm。

其容值范围为1pF to 10µF，工作电压在6.3V to 250V之间。

温度系数通常为±100ppm/℃。

这种电容通常用于消费电子产品、车载电子设备等中等尺寸的电子设备中。

3. 1206规格贴片电容1206规格贴片电容是一种较大的电容，尺寸为0.12英寸×0.06英寸，也就是3.20 mm×1.60 mm。

其容值范围为1pFto 22µF，工作电压在6.3V to 630V之间。

温度系数通常为±100ppm/℃。

这种电容通常用于工业控制、通信设备等较大尺寸的电子设备中。

以上是常见的贴片电容规格表，但不限于此，不同品牌和型号的贴片电容可能具有不同的规格和性能参数。

在选购贴片电容时，应该根据具体的应用需求和设计要求选择合适的规格和品牌。

电子元器件贴片电容识别容值代码贴片电容识别容值代码方法，贴片电容的容值没有直接标在电容的表面，贴片电容的表面什么都没有（便于区分相同大小的贴片电阻和电容）。

贴片电容的容值标在了包装盘的标签上面。

贴片电容的容值有很多种，唯一的快速的识别贴片电容的包装标签，如果是单个的话那么可以使用万用表测量。

下面我们来了解一下怎么识别贴片电容容值代码。

例如：104=10×10的四次方=100000pF=100nF=0.1uF电容有三个常用单位；pF、nF、uF，三者的换算关系为：1uF=1000nF=100000pF，即两两之间是1000的倍数关系。

所以在读取电容的容值的时候，要牢记三个单位之间的换算关系，因为不同的厂家可能会使用不同的单位表示。

贴片电容容值：47PF、51PF、68PF、82PF、100PF、120PF、150PF、470PF、560PF等。

1NF、1.5NF、2.2NF、4.7NF、10NF、15NF、22NF、27NF、33NF等。

0.1UF、0.15UF、0.22UF、0.33UF、0.47UF、1UF、2.2UF、10UF、47UF、100UF等。

现在较为通用的容值代码表示方法为三位代码“XXY”表示法前两位数字表示乘系数，后一位表示乘指数，单位为pF。

其中一般前两位的取值范围为上述E6和E12系列，后一位数字表示乘指数10 n。

当Y= 9时，对应前述n = -1；当Y= 8时，对应前述n = -2；当Y= 0，1，2，3，4，5，6，7时，Y就等于n。

示例如下：0.5pF容值代码表示为508；68pF容值代码表示为680；47μF容值代码表示为476；330μF容值代码表示为337。

今天分享的贴片电容识别容值代码方法就了解到这里，贴片电容作为当下需求最大的电子元件，由于体积小本身也没有标识贴片电容容值，所以用肉眼识别没有标签的贴片电容基本不可能的，也提醒一下大家在焊接的时候要注意别太贴太近进行高温焊接，容易损坏电子元件。