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Freescale Semiconductor User’s GuideDocument Number: MC1320xRFCUGRev. 1.2, 03/20101IntroductionThe MC1320x RF Daughter Card (1320xRFD-A00) is used in conjunction with a microcontroller development board for RFIC evaluation, code development, and system evaluation. The RF Daughter Card interfaces directly to the M68EVB908GB60, RG60 and QG60 HCS08 family Microcontroller Development Boards and to the M52235 EVB Microcontroller Development Board, but it can be adapted to other boards that offer access to the MCU input/output ports.The RF Daughter Card is configured with all the off-chip circuitry required for functional performance of the MC1320x RF data modem except the MCU. The MCU interface required by the RFIC is pinned out at the edge of the card using standard header pins. The RF interface is accomplished through an onboard PCB antenna. Also, there is an SMT jumper that can be relocated, which will redirect the RF interface to an on-board 50 ohm connector. The SMA connector can be used with standard coax cables for testing purposes. Figure 1-1 shows the RF Daughter Card.Figure1-1. MC1320x RF Daughter CardMC1320x RF Daughter CardUser’s GuideIntroductionFigure1-2 shows the RF Daughter Card installed in a GB60 development board.Figure1-2. MC1320xRF Daughter Card In GB60 Development Board Figure1-3 shows the M52235 EVB development board.Figure1-3. M52235 EVB Development BoardSafety Information 2Safety InformationAny modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful.47 C.F.R. Sec. 15.21This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:•Reorient or relocate the receiving antenna.•Increase the separation between the equipment and receiver.•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.•Consult the dealer or an experienced radio/TV technician for help.47 C.F.R. Sec.15.105(b)This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:•This device may not cause harmful interference.•This device must accept any interference received, including interference that may cause undesired operation.3Revision HistoryThe following table summarizes revisions to this document since the previous release (Rev 1.1).Revision HistoryLocation RevisionSection 6Updated document cross reference.MC1320x MCU Interface4MC1320x MCU InterfaceFigure4-1 shows the typical connections between the MC1320x transceiver and a microcontroller unit (MCU). See the MC13202/203 Reference Manual, document MC13202RM, for interface considerations. Details about the interconnects for both the GB60 and M52235 Development boards are described in Section5.1, “Development Board Interconnects”. ArrayFigure4-1. MCU Interface PinoutDaughter Card Description 5Daughter Card DescriptionAs shown in Figure5-1 and Figure8-1, connector J101 is the main interface to the GB60 Development Board. The interface connections described in Section5.1, “Development Board Interconnects”, fall under the following three broad categories:1.Serial Peripheral Interface (SPI)2.Control3.PowerFigure1-2 shows how the RF Daughter Card is mounted on the GB60 Development Board.NOTEEnsure that zero ohm resistor R104 is in place on the MC1320x DaughterCard. As of this release, previous versions of the MC1320x Daughter Cardmay not have R104 inserted.NOTEJ101 Pin 1 of the MC1320x must to be connected to GB_PORT Pin 1 of theGB60 Development Board.As shown in Figure5-1 and Figure8-1, connector J102 is the main interface to the M52235 Development Board. Figure1-3 shows how the RF Daughter Card is mounted on the M52235 Development Board.NOTEJ102 Pin 1 of the MC1320x must be connected to MCU_PORT Pin 1 on theM52235 Development Board.Figure5-1 shows the top side of the RF Daughter Card PCB with component placement.Figure5-1. MC1320x Daughter Card (Top View)Daughter Card DescriptionFigure5-2 shows the shows the bottom side of the RF Daughter Card PCB.Figure5-2. MC1320x Daughter Card (Bottom View)5.1Development Board InterconnectsThe following sections describe the interconnects for both the GB60 and M52235 Development boards. Table5-1 lists the pin connections for J101 and Table5-2 lists the pin connections for J102.Table5-1. J101 Pin ConnectionsPin Number Pin Name Description Functionality1,2,3,4, 6,7,8,9, 10,11,12,15,16,17 18,21,23,25,26,28, 29, 30,33N/C No connection.5PTA2Connects to PTA2 on GB60.Provides a wakeup function to the MCU via Pin22 when jumper is installed between J103 pins1 and 2.13GPIO1Connects to General PurposeInput/Output 1 of MC1320X.When gpio_alt_en, Register 9, Bit 7 = 1, GPIO1 functions as an “Out of Idle” Indicator.14GPOI2Connects to General PurposeInput/Output 2 of MC1320X.When gpio_alt_en, Register 9, Bit 7 = 1, GPIO2 functions as a “CRC Valid” Indicator.Daughter Card Description19IRQConnects to IRQ pin of MC1320X.Allows the MC1320X to issue an IRQ to theMCU.20RESETOptionally connects to RESET of MC1320X when R101 or R102 are installed.Allows the MCU to reset the MC1320X.22PTE1/RXD1Connects to PTE1/RXD1 of GB60.Provides a wakeup function to the MCU via Pin5 when jumper is installed between J103 pins 1 and 2.24XCLK/16MHz Connects to CLKO of MC1320Xwhen jumper is installed between J103 pins 3 and 4.Provides reference based on MC1320X 16 MHz reference oscillator to the MCU.27PTC2/BAUD SEL Connect to PTC2/BAUD SEL ofGB60.31RXTXENConnect to RXTXEN of MC1320X.Allows the MCU to control the RXTXEN line ofthe MC1320X.32RESETConnects to RESET of MC1320X.Allows the MCU to reset the MC1320X.34PTD5/CESI/A TTN Connects to PTD5/CESI of GB60when R104 is installed. Connectdirectly to Pin 15 of J102.Allows the MCU to wake up the MC1320X from Doze or Hibernate.35MOSIConnect to MOSI of MC1320x.SPI36SPSCKConnect to SPICLK of the MC13201.SPI37CE Connect to CE of MC1320X.SPI38MISO Connects to MISO of MC1320X.SPI39V_INConnects the Daughter Card to the supply voltage output of the GB60 board.Provides supply voltage to the Daughter Card. Voltage must not exceed 16 Vdc. See Section 5.1.0.3, “Power Connections”.40GNDConnect ground on GB60 board to ground on Daughter Card.Table 5-1. J101 Pin Connections (continued)Pin NumberPin Name DescriptionFunctionalityDaughter Card DescriptionTable5-2. J102 Pin ConnectionsPin Number Pin Names Description Functionality 4, 5, 6, 7, 8, 11, 12, 14,16, 18, 22N/C No connection1V_IN Connects the Daughter Card to thesupply voltage output on theM52235EVB.Provides supply voltage to the Daughter Card. Voltage must not exceed 16 Vdc. See Section5.1.0.3, “Power Connections”.2IRQ Connects to IRQ pin of MC1320X.Allows the MC1320X to issue an IRQ to theMCU.3GND Connects the ground of the RFDaughter Card to the ground of theM52235EVB9GPIO1Connects to General PurposeInput/Output 1 of MC1320X.When gpio_alt_en, Register 9, Bit 7 = 1, GPIO1 functions as an “Out of Idle” Indicator.10GPOI2Connects to General PurposeInput/Output 2 of MC1320X.When gpio_alt_en, Register 9, Bit 7 =1, GPIO2 functions as a “CRC Valid” Indicator.13RESET Connects to RESET of MC1320Xand Pin 32 of J101.Allows the MCU to reset the MC1320X.15PTD5/CESI Connects to ATTN of MC1320Xand Pin 34 of J101.Allows the MCU to wake up the MC1320X from Doze or Hibernate.17MOSI Connects to MOSI of MC1320X.SPI19MISO Connects to MISO of MC1320X.SPI20RXTXEN Connect to RXTXEN of MC1320X.Allows the MCUntrol the RXTXEN line of theMC1320X.21SPICLK Connect to SPICLK of theMC1320XSPI23PTE2/CE-QSPI-CSO Connects to Pin 1 of J104Allows Chip Enable (CE) selection.See Section5.1.0.1, “SPI Connections”.24PTE2/CE-AN7Connects to Pin 3 of J104Allows Chip Enable (CE) selection.See Section5.1.0.1, “SPI Connections”.Daughter Card DescriptionNOTEIn the following sections, pin numbers not in parenthesis reference theGB60 Development Board. Pin numbers in parenthesis reference theM52235 Development Board.5.1.0.1SPI ConnectionsJ101 pins 35 through 38 (J102 pin 17, 19, 21 and 23) provide the following four wire SPI interface:•MOSI•SPICLK•CE•MISOThe MC1320x always functions as a slave device. SPI operation is described in detail in the appropriate MC1320x Data Sheet and/or MC1320x Reference Manual.NOTEAs it applies to the M52235 Development Board, the CE signal on (J102 Pin23 and Pin 24) are hard wired to header J104. These pins control thefunctionality of CE.When Pin 2 and Pin 3 of J104 are shorted, CE is wired to (J102 Pin 24)(PTE2/CE-AN7).When Pin 1 and Pin 2 of J104 are shorted, CE is wired to (J102 Pin 23)(PTE2/CE-QSPI_CS0).5.1.0.2Control Connections•J101 Pin 19 (J102 Pin 2) is the IRQ line from the MC1320x. Connection to the MCU depends on how the MCU services interrupts.•J101 Pin 31 (J102 Pin 20), RXTXEN, allows the MCU to initiate transceiver functions.•J101 Pin 34 (J102 Pin 15), ATTN, allows the MCU to wake up the MC1320x from Doze or Hibernate low power modes.NOTERXTXEN and ATTN are also available at header J105 for manual control.•J101 Pin 24 provides the MC1320x CLKO to the MCU when a jumper is installed at J103.•J101 Pin 32 (J102 Pin13) interfaces with the MCU to provide a Reset to the MC1320x.•J101 Pin 5 and Pin 22 provide a wake up function to the MCU when a jumper is installed at J103.•J101 Pin 13 and Pin 14 (J102 Pin 9 and Pin 11) provide access to the MC1320x GPIO1 and GPIO2 ports.RF Circuit5.1.0.3Power ConnectionsJ101 Pin 39 (J102 pin 1) provides the supply voltage to the RF Daughter Card. V oltage on this line should never exceed 16.0 VDC and the nominal voltage supply should not exceed 16.0 VDC. J101 Pin 40 (J102 pin 3) is ground.NOTEMCU connection signals are dependent on the on-board voltage regulator.If R105, D101, and C101 are mounted and R115 is removed, J101 Pin 39will provide the interface supply voltage which must never exceed 3.6 V.Nominal supply voltage should never exceed 3.4 V.5.1.0.4Non-MCU ConnectionsHeader J105 provides connections to a number of MC1320x contacts for non-MCU connections. As already stated, the RXTXEN and ATTN lines are available at J105 for external control using switches or other hardware. The MC1320x GPIO is also available for connection to external hardware.6RF CircuitThe MC1320x has an internal TX/RX switch. This feature allows for an external RF circuit that has a very low component count. The MC1320x requires only a few passive components and a balun to provide an interface to an antenna or a 50 ohm circuit. Figure6-1 shows a schematic for only the RF portion of the MC1320x Daughter Card.Figure6-1. RF Portion of 20x Daughter CardSoftware Configuration To provide a design that is of the lowest possible cost to produce, this reference design was built on a printed circuit board consisting of only two layers and with a printed circuit board antenna. The antenna is an Inverted F design widely used in the 2.4 GHz band. This antenna provides good performance while minimizing Bill of Material (BOM) cost.For more information on a low cost design approach, see the ZigBee Hardware Design Considerations Reference Manual (ZHDCRM)7Software ConfigurationAs shown in Figure8-1, the legend in the schematic shows the recommended jumper settings for Wake, ClkOut, and Chip Enable.NOTEThe Wake and ClkOut signals are only for interface to the GB60Development Board. The Chip Enable signal is only for interface to theM52235 Development Board.For software development, Freescale recommends users obtain the most recent software development tools and documentation from the following web pages:•For ZigBee related software and documentation go to /zigbee•For microcontroller software and documentation go to Bill of Materials (BOM) and Schematic8Bill of Materials (BOM) and Schematic This section contains the RF Daughter Card BOM and schematic.Table8-1. Bill of MaterialsQty Part Number ValueRatingToleranceManufacturer Part Number Reference196000310100Label 21*6mmTest BarCode96000310100BARCODE101350610710001100nF16V±10% X7R Murata GRM155R71C104KA88D C103, C104,C105050610710001100nF16V±10% X7R Murata GRM155R71C104KA88D C101 (NotMounted)2506208100011µF 6.3V±10% X5RMurata GRM188R60J105KA01D C102, C1060506208100011µF 6.3V±10% X5R Murata GRM188R60J105KA01D C108 (NotMounted)05061061000010nF16V±10% X7R Murata GRM155R71E103KZ01E C107(NotMounted)153300833001 3.3µF10V20%Vishay Sprague293D335X0010A2TE3C109250210268000 6.8pF50V±0.25pF NP0/C0GMurata GRM1555C1H6R8DZ01J C110, C11115021031000010pF50V±5% NP0/C0GMurata GRM1555C1H100JZ01D C112150210210000 1.0pF50V±0.25pF NP0/C0GMurata GRM1555C1H1R0CZ01D C113040110003303MM3Z3V3T1G 3.3V/200mW5%ONSemiconductorMM3Z3V3T1G D101 (NotMounted)141100017001Green_LED Citizen CL-170G-CD-T D102135501320200MC13202FreescaleSemiconductorMC13202IC101 134000298109LP2981IM5-3.3-40 to +125°C National LP2981IM5-3.3 NOPB IC1021200304040012*20p PinHeader - RightAnglemot/molex70216-4010-89-4402J1011200304024012*12p PinHeader - RightAnglemot/molex70216-2410-89-4242J1021200304004002*2p PinHeaderAMP0-826632-2J103 120030400300jumper_1x3AMP826629-3J104Bill of Materials (BOM) and Schematic200304020082*10 Pin HeaderAMP1-826632-0J105 (Not Mounted)120150700202SMA_edge_Re ceptacle_Fema lemot/sma-end_launch 142-0701-831J106220030000100ProbeLoop TobyElectronics TP-107-02-5-T J107, J108254710518001 1.8nH 300mA ±0.3nH TOKO LL1005-FHL1N8S L101, L102254710539002 3.9nH ±0.3nHTOKO LL1005-FHL3N9S L103, L104171000566010fsl566-1FreescaleSemiconductor FSL566-1 FR4 0.76mm PCB1014611000000010R 62.5mW/25V 5%YAGEO RC0402JRE070RL R103, R112, R115,R1040611000000010R62.5mW/25V 5%YAGEORC0402JRE070RLR101, R102 (NotMounted)061100410001100R 62.5mW/25V 5%YAGEO RC0402JRE07100RL R105 (Not Mounted)06110061000110K62.5mW/25V 5%YAGEORC0402JRE0710KLR106, R107, R108, R110 (NotMounted)161100747000470K 62.5mW/25V 5%YAGEO RC0402JRE07470KL R109161100422000220R 62.5mW/25V 5%YAGEO RC0402JRE07220RL R1111611200000010R 125mW/150V 5%YAGEO RC0805JRE070RL R1130611200000010R 125mW/150V 5%YAGEO RC0805JRE070RL R114 (Not Mounted)15813091600416.000MHz ±20ppm ±20ppmKDS ZD00882X101156360240001LDB212G4005C-001MurataLDB212G4005C-001Z101Table 8-1. 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YB6500高速多用途半导体分立器件测试系统广泛应用于航天、航空、兵器、中船、电子多个领域，以产品性价比好、可测器件和参数齐全、测试精度高、速度快、保护性强、稳定性可靠性高、故障率极低、软件丰富、操作使用方便、售后服务为宗旨。
1、电学指标A-K 极间加压范围: ±2.500mV--2000V A-K 极间测流范围: ±1nA--49.90AA-K 极间加流范围: ±100nA--49.90AA-K 极间测压范围: ±2.500mV--2000VG-K 极间加压范围: ±2.500mV--20VG-K 极间测流范围: ±1nA--10AG-K 极间加流范围: ±100nA--10AG-K 极间测压范围: ±2.500mV--20V最大电压分辨率: 1mV最大电流分辨率: 1nAA-K 极间加/测压精度: 1%+10mVA-K 极间加/测流精度: 1%+10nA+20pA/VG-K 极间加/测压精度: 1%+5mVG-K 极间加/测流精度: 1%+10nA+20pA/V电参数测试重复性： 1%2、可测试器件（DUT）种类共计19大类, 27分类分立器件。
序号类型名称符号1 二极管DIODE2 稳压（齐纳）二极管ZENER3 晶体管TRANSISTOR（NPN/PNP）4 单向可控硅（普通晶闸管）SCR5 双向可控硅（双向晶闸管）TRIAC6 金属-氧化物-半导体场效MOSFET（N-CH/P-CH）应管7 结型场效应管J-FET（N-CH/P-CH）8 绝缘栅双极大功率晶体管IGBT（N-CH/P-CH）9 达林顿阵列器件DARLINGTON10* 光电耦合器OPTO-COUPLER（NPN/PNP）11* 光电逻辑器件OPTO-LOGIC12* 光电开关管OPTO-SWITCH13* 固态过压保护器SSOVP14* 硅触发开关STS，SBS15* 继电器RELAY（A，B，C型）16* 金属氧化物压变电阻MOV17* 压变电阻VARISTOR18* 双向触发二极管DIAC19* 三端稳压器REGULATOR* 需要另行定制专门的测试适配器和测试夹具。
AN0101应用笔记EFT测试操作手册版本：V1.2广芯微电子（广州）股份有限公司/AN0101条款协议条款协议本文档的所有部分，其著作产权归广芯微电子（广州）股份有限公司（以下简称广芯微电子）所有，未经广芯微电子授权许可，任何个人及组织不得复制、转载、仿制本文档的全部或部分组件。
本文档没有任何形式的担保、立场表达或其他暗示，若有任何因本文档或其中提及的产品所有资讯所引起的直接或间接损失，广芯微电子及所属员工恕不为其担保任何责任。
除此以外，本文档所提到的产品规格及资讯仅供参考，内容亦会随时更新，恕不另行通知。
1. 本文档中所记载的关于电路、软件和其他相关信息仅用于说明半导体产品的操作和应用实例。
用户如在设备设计中应用本文档中的电路、软件和相关信息，请自行负责。
对于用户或第三方因使用上述电路、软件或信息而遭受的任何损失，广芯微电子不承担任何责任。
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用户因本文档中所记载的信息的错误或遗漏而遭受的任何损失，广芯微电子不承担任何责任。
3. 对于因使用本文档中的广芯微电子产品或技术信息而造成的侵权行为或因此而侵犯第三方的专利、版权或其他知识产权的行为，广芯微电子不承担任何责任。
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4. 使用本文档中记载的广芯微电子产品时，应在广芯微电子指定的范围内，特别是在最大额定值、电源工作电压范围、热辐射特性、安装条件以及其他产品特性的范围内使用。
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5. 虽然广芯微电子一直致力于提高广芯微电子产品的质量和可靠性，但是，半导体产品有其自身的具体特性，如一定的故障发生率以及在某些使用条件下会发生故障等。
此外，广芯微电子产品均未进行防辐射设计。
testo 830-T1 (0560 8311) testo 830-T2 (0560 8312)91. General Information Please read this document through carefully and familiarise yourself with the operation of the product before putting it to use.Keep this documentation to hand so that you can refer to it when necessary.2. Product Description3. Safety InformationContact measurement: Do not measure on or near live parts. Infrared measurement: Please adhere to the required safe distance when measuring on live parts.Operate the instrument properly and according to its intended purpose and within the parameters specified. Do not use force.Do not expose to electromagnetic radiation (e.g. microwaves,induction heating systems), static charge, heat or extreme fluctuations in temperature.Do not store together with solvents (e.g. acetone).Open the instrument only when this is expressly described in the documentation for maintenance purposes.Laser radiation! Do not look into laser beam. e n Accessories Name Item no.Water-tight immersion/penetration probe, -60 to +400°C/-76 to +752°F 0602 1293Quick-reaction surface probe, -60 to +300°C/-76 to +572°F 0602 0393Robust air probe, -60 to +400°C/-76 to +752°F 0602 1793Leather protection sleeve 0516 8302Emissivity adhesive tape ε=0.950554 0051Infrared sensor,laser Battery compartment DisplayOn/Off switch Contact measurement Measurement button:infrared measurement Infrared measurementProbe socket (testo 830-T2 only)10Ensure correct disposal:Dispose of defective rechargeable batteries and spentbatteries at the collection points provided.Send the instrument directly to us at the end of its life cycle.We will ensure that it is disposed of in an environmentallyfriendly manner.4. Intended Usetesto 830 is a compact infrared thermometer for the non-contact measurement of surface temperatures. Using testo830-T2, it is possible to carry out additional contact measurements byattaching probes.5. Technical DataFeature testo 830-T1testo 830-T2Parameter°C/°FInfrared measurement range-30 to +400°C/ -22 to +752°FInfrared resolution0.1°C/0.1°FInfrared accuracy±1.5°C/ 2.7°F or 1.5% of reading (+0.1 to +400°C/ +32 to +752°F)1;(at 23°C) +/- 1 digit±2°C/ 3.6°F or 2% of reading (-30 to 0°C/ -22 to +31.9°F)1Emissivity0.1 to 1.0 adjustableInfrared measurement rate0.5sTemp. sensor -Thermocouple Type K (attachable) Measurement range of temp sensor--50 to +500°C/ -58 to +932°F Resolution of temp. sensor-0.1°C/ 0.1°FAccuracy of temp. sensor-±0.5°C/0.9°F+0.5% of reading (±1 digit)at rated temperature 22°C/ 72°F Measuring rate of temp. sensor- 1.75sOptics (90% value)10:1212:12Laser type 1 x laser 2 x laserOperating temperature-20 to +50°C/ -4 to +122°FTransport /S torage temperature-40 to +70°C/ -40 to +158°FPower supply9V block batteryBattery life 20 h 15 hHousing ABSDimensions (LxHxB)190 x 75 x 38mm/ 7.5 x 3.0 x 1.5inCE guideline2004/108/EECWarranty 2 yearsLaserLaser type 1 x laser 2 x laserPower< 1 mWWavelength645 to 660 nmClass2Standard DIN NE 60825-1:2001-111the larger value applies2+ Opening diameter of the sensor (16mm/ 0.6in)6. Initial OperationInsert battery: See 9.1Changing the battery.117. Operation7.1 Connecting probe (testo 830-T2 only)Connect temperature probe to probe socket. Observe +/-!7.2 Switching on/offSwitch on instrument: Press measurement button.-lights up).The display light remains for 10 seconds every time a button is activated.pressed until display darkens.The device switches off automatically after 1 min (IR measure -ment view) or 10 mins (contact measurement view, only testo830-T2) without the button being pressed.7.3 Measuring/ measurement, this is done when the device is switched off orwhen you switch to the IR measurement view.-The instrument is switched on.Infrared measurement1Start measurement: Hold down measurement button.2Locate object to be measured using laser point.testo830-T1: laser marks the centre point of the measurement spot.testo830-T2: Laser marks the upper and lower end of themeasurement spot.-The current reading is shown (2 measurements per second)3End measurement: Release button.-HOLD lights up. The last measured value and min./max. value are saved until the next measurement.Restart measurement: Press measurement button.Contact measurement (testo 830-T2 only)-Temperature probe was connected before the measuring instrument was switched on.1-The instrument changes to the contact measurement mode (lights up). The current reading is shown.en122End the measurement: Press .-HOLD lights up. The last measured value and min./max. value are saved until the next measurement.Switch between min., max. and recorded value: Press .Restart measurement: Press .Back to infrared measurement view: Press measurementbutton.Setting the emissivity-Instrument is in the infrared measurement mode.If no button is pressed for 3 s in the emissivity mode, theinstrument switches to the infrared measurement mode.1Press for 3 s.2Set emissivity: Press or-The instrument switches to the infrared measurement mode.8. Settings-Instrument is switched off.If no button is activated in the setting mode for 3 s, theinstrument changes to the next mode.1Press for 3 s.-The device switches to settings mode.2Set lower alarm value (ALARM): Press or . Hold the button down to go forward quickly.3Set upper alarm value (ALARM): Press or . Hold the button down to go forward quickly.4Set alarm function on/oFF: Press or .5Select parameter (°C/ °F) : Press or .-The device returns to IR measurement view.The alarm function is only available for IR measurement. If theset alarm values are exceeded/not reached, a visual andacoustic alarm is output.9. Service and Maintenance9.1 Changing the batteryInstrument must be switched off!1Open battery compartment:Open up cover.2Remove used battery and insert newone. Observe +/-. The minus should bevisible once the battery is inserted.3Close battery compartment: Closecover.139.2 Clean instrument Do not use abrasive cleaning agents or solutions.Clean the housing with a damp cloth (soap water).Carefully clean the lens with water or cotton buds dipped in water or medical alcohol. 10. Questions and AnswersQueryPossible causes Possible solutionInfrared measurement mode: -Readings outside -- - -lights up.measurement range.Contact measurement mode: -Readings outside -If we have not answered your question, please contact your local distributor or Testo´s Customer Service.11. Information on infrared measurement 11.1 Measurement methodInfrared measurement is an optical measurementKeep lens clean.Do not measure with clouded lens.Keep measurement field (area between instrument and object being measured) free of interferences: no dust and dirtparticles, no moisture (rain, steam) or gases.Infrared measurement is a surface measurementIf there is dirt, dust, frost etc. on the surface, only the top layer will be measured, i.e. the dirt.In the case of shrinkwrapped foodstuffs, do not measure in air pockets.If values are critical, always subsequently measure using a contact thermometer. Particularly in the food sector, the core temperature should be measured with a penetration/immersion thermometer.Adaptation timeIf the ambient temperature changes (change of location, e.g.inside/outside measurement) the instrument needs an adaptation time of 15 minutes for infrared measurement.e n1411.2 EmissivityMaterials have different emissivities, i.e. they emit different levels of electromagnetic radiation. The emissivity of testo 830 is set in the factory to 0.95. This is the ideal value for measuring non-metals (paper, ceramics, plaster, wood, paints and varnishes),plastics and foodBright metals and metal oxides are only suited to a limited extent to infrared measurement on account of their low or nonuniform emissivity.Apply emissivity enhancing layers such as varnish or emission adhesive tape (Item no. 05540051) to the object being measured. If this is not possible, measure with the contact thermometer.Emissivity table of the most important materials(typical values)A specific spot is determined depending on the distance from the measuring instrument to the object being measured. Measurement optics (Ratio Distance : Measurement spot)500 mm1000 mm2000 mm5000 mmØ 516 mmØ 216 mmØ 116 mmØ 66 mmØ 16 mm testo 830-T1laser1512. Information on contactmeasurementObserve minimum penetration depth in immersion/penetration probes: 10 x probe diameterAvoid applications in corrosive acids or bases.Do not use spring-loaded surface probes on sharp edges.e n 500 mm 1000 mm2000 mm 5000 mm Ø 433 mm Ø 183 mmØ 100 mmØ 58 mm Ø 16 mm testo 830-T2laserlaser。
LX9300 大功率分立器件测试系统系统用途LX9300大功率分立器件测试系统是由北京励芯泰思特测试技术有限公司自主研制、开发、生产的半导体参数测试的专用设备, 本测试系统不仅满足大功率VDMOS 的GFS(跨导)测试、IGBT功率参数的测试，还涵盖中小功率半导体器件的测试，适用于半导体器件生产厂家进行圆片中测或封装成测，各类整机厂家、科研院所的质量检测部门进行入厂检验、可靠性分析测试测试原理符合《GJB 128 半导体分立器件试验方法》、《GJB 33A-97 半导体分立器件总规范》《SJ/Z 9014 半导体器件分立器件》、《SJ 2215.1-82半导体光耦器测试方法》等相应的国家标准、国家军用标准。
系统的人机界面有好，编程容易，软件能对用户输入的数据进行自动查错。
系统软件可进行器件参数的分档、分类编程，并可实时显示和记录分档、分类测试结果，测试结果和统计结果均可以用EXCEL格式存贮于计算机中，根据需要可以打印输出。
系统为模块化、开放式结构，具有升级扩展潜能。
系统特点◆PC机为系统的主控机◆菜单式测试程序编辑软件操作简便◆预先连接测试自动识别NPN/PNP◆ 0～±2000V程控高压源◆高达±500A程控高流源（可扩展到±1000A）◆±40V/±40A（可扩展到±80V、±50A）的可编程电压电流源通过测试系统先进的硬件闭环测试方法实现功率VDMOS的GFS跨导的测试◆测试漏流最小分辨率达6.1pA◆四线开尔文连接保证加载测量的准确◆通过IEEE488接口连接校准数字表传递国家计量标准对系统进行校验◆ Prober接口、Handler接口可选（16Bin）◆可为用户提供丰富的测试适配器测试对象二极管/稳压管/恒流二极管/整流桥/瞬态抑制管：BVR、IR、VF、VZ、RZ三极管：BVCBO、BVCEO、BVCES、BVCER、BVEBO、HFE、ICBO、ICBS、ICEO、ICES、ICER、IEBO、VBEF、VBCF、VBESAT、VCESAT可控硅：BVGKO、IAKF、IAKR、IGKO、IGT、IH、IL、VGT、VON场效应管： BVDSO、BVDSS、BVDSR、BVDGO、BVGDS、BVGSO、BVGSS、GFS、IDSO、IDSS、IDSR、IG、IGDO、IGSO、IGSS、RDS(on)、VDS(on)、VGS、VGS(th)、VPIGBT：BVCES、BVCGR、BVGES、ICES、IGES、VCESAT、VGETH、VGS(off) 达林顿矩阵：ICEX、IIN(ON)、IIN(Off)、VIN(on)、IR、VCESA T、BVR、HFE、ICEO单结晶体管：Iv、Vv、IP、VP、VEB1、ETA、RBB、IEB1O、IB2光敏二、三极管：ID、IL、VOC、ISC、BV、BVCE光耦：C TR、BVECO、BVCBO、BVCEO、ICBO、ICEO、HFE、VBESAT、VCESAT、IR、IAKF、IAKR技术指标1. 电流/电压源P VIS2. 数据采集VM16位ADC，100K/S采样速率。
分立器件动态参数测试系统技术指标1、功能范围：EN-1230A可对各类型Si·二极管、Si·MOSFET、Si·IGBT和SiC·二极管、SiC·MOSFET、SiC·IGBT等分立器件的各项动态参数如开通时间、关断时间、上升时间、下降时间、导通延迟时间、关断延迟时间、开通损耗、关断损耗、栅极总电荷、栅源充电电量、平台电压、反向恢复时间、反向恢复充电电量、反向恢复电流、反向恢复损耗、反向恢复电流变化率、反向恢复电压变化率、集电极短路电流、输入电容、输出电容、反向转移电容、栅极串联等效电阻、雪崩耐量进行测试。
2、环境要求1、环境温度：15—40℃2、相对湿度：存放湿度不大于70%3、大气压力：86Kpa—106Kpa4、电网电压：AC220V±10%无严重谐波5、电网频率：50Hz±1Hz6、电源功率：20KW7、供电电网功率因数：＞0.98、气源要求：≥0.6Mpa9、无较大灰尘，腐蚀或爆炸性气体，导电粉尘等空气污染的损害。
3、主要技术指标：设备技术指标要求如下：1、（阻性/感性）开关测试单元•漏极电压测试范围：5V-1500V，5V-100V，步进0.1V，100V-1500V，步进1.0V；•漏极电流测试范围：1A-300A，分辨率1A；•栅极驱动：±30V，分辨率0.1V；•最大栅极电流：2A；•最大脉冲电流：300A；•电源电压（VDD）：5V-100V，步进0.1V，100V-1500V，步进1.0V。
•脉冲宽度：1us-100us,步进0.1us•时间测试精度：1ns；•感性负载：0.01mH-160mH程序控制，步进10uH；•阻性负载：1Ω、2Ω、5Ω、10Ω、50Ω，程序控制，备用三个电阻，以便使用时选择。
•开通/关断时间ton/toff：5-10000ns•开通/关断延迟td(on)/td(off）：5-10000ns•上升/下降时间tr/tf：5-10000ns最小分辨率1ns•开通/关断损耗Eon/Eoff：1-2000mJ最小分辨率1uJ2、栅极电荷单元•驱动电流：0-2mA，分辨率0.01mA，2-20mA，分辨率0.1mA；20mA-200mA，分辨率1mA。
