CD4073BM96中文资料

CD4000 双3输入端或非门单非门CD4001 四2输入端或非门CD4002 双4输入端或非门CD4006 18位串入/串出移位寄存器CD4007 双互补对加反相器CD4008 4位超前进位全加器CD4009 六反相缓冲/变换器CD4010 六同相缓冲/变换器CD4011 四2输入端与非门CD4012 双4输入端与非门CD4013 双主-从D型触发器CD4014 8位串入/并入-串出移位寄存器CD4015 双4位串入/并出移位寄存器CD4016 四传输门CD4017 十进制计数/分配器CD4018 可预制1/N计数器CD4019 四与或选择器CD4020 14级串行二进制计数/分频器CD4021 08位串入/并入-串出移位寄存器CD4022 八进制计数/分配器CD4023 三3输入端与非门CD4024 7级二进制串行计数/分频器CD4025 三3输入端或非门CD4026 十进制计数/7段译码器CD4027 双J-K触发器CD4028 BCD码十进制译码器CD4029 可预置可逆计数器CD4030 四异或门CD4031 64位串入/串出移位存储器CD4032 三串行加法器CD4033 十进制计数/7段译码器CD4034 8位通用总线寄存器CD4035 4位并入/串入-并出/串出移位寄存CD4038 三串行加法器CD4040 12级二进制串行计数/分频器CD4041 四同相/反相缓冲器CD4042 四锁存D型触发器CD4043 三态R-S锁存触发器("1"触发) CD4044 四三态R-S锁存触发器("0"触发) CD4046 锁相环CD4047 无稳态/单稳态多谐振荡器CD4048 四输入端可扩展多功能门CD4049 六反相缓冲/变换器CD4050 六同相缓冲/变换器CD4051 八选一模拟开关CD4052 双4选1模拟开关CD4053 三组二路模拟开关CD4054 液晶显示驱动器CD4055 BCD-7段译码/液晶驱动器CD4056 液晶显示驱动器CD4059 "N"分频计数器 NSC/TICD4060 14级二进制串行计数/分频器CD4063 四位数字比较器CD4066 四传输门CD4067 16选1模拟开关CD4068 八输入端与非门/与门CD4069 六反相器CD4070 四异或门CD4071 四2输入端或门CD4072 双4输入端或门CD4073 三3输入端与门CD4075 三3输入端或门CD4076 四D寄存器CD4077 四2输入端异或非门CD4078 8输入端或非门/或门CD4081 四2输入端与门CD4082 双4输入端与门CD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器CD4095 三输入端J-K触发器CD4096 三输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器CD4099 8位可寻址锁存器CD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器CD40107 双2输入端与非缓冲/驱动器CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动CD40147 10-4线编码器CD40160 可预置BCD加计数器CD40161 可预置4位二进制加计数器CD40162 BCD加法计数器CD40163 4位二进制同步计数器CD40174 六锁存D型触发器CD40175 四D型触发器CD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) CD40193 可预置4位二进制加/减计数器CD40194 4位并入/串入-并出/串出移位寄存CD40195 4位并入/串入-并出/串出移位寄存CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交叉点开关0206A 天线开关集成电路03VFG9 发射压控振荡集成电路1021AC 发射压控振荡集成电路1097C 升压集成电路140N 电源取样比较放大集成电路 14DN363 伺服控制集成电路15105 充电控制集成电路15551 管理卡升压集成电路1710 视频信号处理集成电路1N706 混响延时集成电路20810－F6096 存储集成电路2252B 微处理集成电路2274 延迟集成电路24C01ACEA 存储集成电路24C04 存储集成电路24C64 码片集成电路24LC16B 存储集成电路24LC65 电可改写编程只读存储集成电路 27C1000PC－12 存储集成电路27C2000QC－90 存储集成电路27C20T 存储集成电路27C512 电可改写编程只读存储集成电路 2800 红外遥控信号接收集成电路28BV64 码片集成电路28F004 版本集成电路31085 射频电源集成电路32D54 电源、音频信号处理集成电路1732D75 电源、音频信号处理集成电路32D92 电源中频放大集成电路4066B 电子开关切换集成电路4094 移位寄存串入、并出集成电路424260SDJ 存储集成电路4260 动态随机存储集成电路4270351/91B9905 中频放大集成电路4370341/90M9919 中频处理集成电路4464 存储集成电路4558 双运算放大集成电路4580D 双运算放大集成电路47C1638AN－U337 微处理集成电路47C1638AU－353 微处理集成电路47C432GP 微处理集成电路47C433AN－3888 微处理集成电路49/4CR1A 中频放大集成电路5101 天线开关集成电路5G052 发光二极管四位显示驱动集成电路 5G24 运算放大集成电路5W01 双运算放大集成电路649/CRIA70612 中频放大集成电路673/3CR2A 多模转换集成电路74122 可重触发单稳态集成电路74HC04 逻辑与非门集成电路74HC04D 六反相集成电路74HC123 单稳态集成电路74HC125 端口功能扩展集成电路74HC14N 六反相集成电路74HC157A 多路转换集成电路1874HC245 总线收发集成电路74HC32 或门四2输入集成电路74HC374八D 触发集成电路74HC573D 存储集成电路74HCT157 多路转换双输入集成电路74HCT4046A 压控振荡集成电路74HCT4538D 单稳态集成电路74HCT4538N 触发脉冲集成电路74HCT86D 异或门四2输入集成电路74HCU04 与非门集成电路74LS125 端口功能扩展集成电路74LS373 锁存集成电路74LS393 计数双四位二进制集成电路74LS74双D 触发集成电路78014DFP 系统控制处理集成电路811N 伴音阻容偏置集成电路83D33 压控振荡集成电路85712 场扫描信号校正处理集成电路 85713 行扫描信号校正集成电路87C52 微处理集成电路87CK38N－3584 微处理集成电路87CK38N－3627 微处理集成电路89C52 系统控制处理集成电路89C55 系统控制处理集成电路93C66 电可改写编程只读存储集成电路 93LC56 电可改写编程存储集成电路9821K03 系统控制集成电路A1642P 背景歌声消除集成电路A701 红外遥控信号接收集成电路A7950 场频识别集成电路19A8772AN 色差信号延迟处理集成电路A9109 功率放大集成电路AAB 电源集成电路ACA650 色度信号解调集成电路ACFP2 色度、亮度信号分离集成电路 ACP2371 多伴音、多语言改善集成电路 ACVP2205 色度、亮度信号分离集成电路 AD1853 立体声数/模转换集成电路AD1858 音频解调集成电路AD722 视频编码集成电路ADC2300E 音频数/模转换集成电路ADC2300J 音频数/模转换集成电路ADC2310E 音频数/模转换集成电路ADV7172 视频编码集成电路ADV7175A 视频编码集成电路AE31201 频率显示集成电路AJ7080 射频调制集成电路AK4321－VF－E1 音频数/模转换集成电路AN1319 双高速电压比较集成电路AN1358S 双运算放大集成电路AN1393 双运算放大集成电路AN1431T 稳压电源集成电路AN1452 音频前置放大集成电路AN1458S 双运算放大集成电路AN206 伴音中频及前置放大集成电路AN222 自动频率控制集成电路AN236 副载波信号处理集成电路AN239Q 图像、伴音中频放大集成电路AN247P 图像中频放大、AGC控制集成电路 AN253P 调频/调幅中频放大集成电路20AN262 音频前置放大集成电路AN2661NK 视频信号处理集成电路AN2663K 视频信号处理集成电路AN272 音频功率放大集成电路AN2751FAP 视频信号处理集成电路AN281 色度解码集成电路AN2870FC 多功能控制集成电路AN295 行、场扫描信号处理集成电路AN301 伺服控制集成电路AN305 视频自动增益控制集成电路AN306 色度自动相位控制集成电路AN318 直流伺服控制集成电路AN320 频率控制、调谐显示驱动集成电路 AN3215K 视频信号处理集成电路AN3215S 视频信号处理集成电路AN3224K 磁头信号记录放大集成电路AN3248NK 亮度信号记录、重放处理集成电路 AN331 视频信号处理集成电路AN3311K 磁头信号放大集成电路AN3313 磁头信号放大集成电路AN3321S 录像重放信号处理集成电路AN3331K 磁头信号处理集成电路AN3337NSB 磁头信号放大集成电路AN3380K 磁头信号处理集成电路AN3495K 色度、亮度信号降噪集成电路AN355 伴音中频放大、检波集成电路AN3581S 视频驱动集成电路AN366 调频/调幅中频放大集成电路AN3791 移位控制集成电路21AN3792 磁鼓伺服控制接口集成电路AN3795 主轴伺服控制接口集成电路AN3814K 电机驱动集成电路AN4265 音频功率放大集成电路AN4558 运算放大集成电路AN5010 电子选台集成电路AN5011 电子选台集成电路AN5015K 电子选台集成电路AN5020 红外遥控信号接收集成电路AN5025S 红外遥控信号接收集成电路AN5026K 红外遥控信号接收集成电路AN5031 电调谐控制集成电路AN5034 调谐控制集成电路AN5036 调谐控制集成电路AN5043 调谐控制集成电路AN5071 频段转换集成电路AN5095K 电视信号处理集成电路AN5110 图像中频放大集成电路AN5130 图像中频、视频检波放大集成电路AN5138NK 图像、伴音中频放大集成电路AN5156K 电视信号处理集成电路AN5177NK 图像、伴音中频放大集成电路AN5179K 图像、伴音中频放大集成电路AN5183K 中频信号处理集成电路AN5195K 中频、色度、扫描信号处理集成电路AN5215 伴音信号处理集成电路AN5520 伴音中频放大及鉴频集成电路AN5222 伴音中频放大集成电路AN5250 伴音中频放大、鉴频及功率放大集成电路 AN5262 音频前置放大集成电路22AN5265 音频功率放大集成电路AN5270 音频功率放大集成电路AN5273 双声道音频功率放大集成电路AN5274 双声道音频功率放大集成电路AN5275 中置、3D放大集成电路AN5285K 双声道前置放大集成电路AN5312 视频、色度信号处理集成电路AN5313NK 视频、色度信号处理集成电路AN5342 图像水平轮廓校正集成电路AN5342FB 水平清晰度控制集成电路AN5344FBP 色度信号处理集成电路AN5348K 人工智能信号处理集成电路AN5385K 色差信号放大集成电路AN5410 行、场扫描信号处理集成电路AN5421 同步检测集成电路AN5422 行、场扫描信号处理集成电路AN5512 场扫描输出集成电路AN5515 场扫描输出集成电路AN5521 场扫描输出集成电路AN5532 场扫描输出集成电路AN5534 场扫描输出集成电路AN5551 枕形校正集成电路AN5560 场频识别集成电路AN5600K 中频、亮度、色度及扫描信号处理集成电路 AN5601K 视频、色度、同步信号处理集成电路AN5607K 视频、色度、行场扫描信号处理集成电路 AN5615 视频信号处理集成电路AN5620X 色度信号处理集成电路AN5621 场扫描输出集成电路23AN5625 色度信号处理集成电路AN5633K 色度信号处理集成电路AN5635 色度解码集成电路AN5635NS 色度解码集成电路AN5637 色度解码、亮度延迟集成电路AN5650 同步信号分离集成电路AN5682K 基色电子开关切换集成电路AN5693K 视频、色度、行场扫描信号处理集成电路 AN5712 图像中频放大、AGC控制集成电路AN5722 图像中频放大、检波集成电路AN5732 伴音中频放大、鉴频集成电路AN5743 音频功率放大集成电路AN5750 行自动频率控制及振荡集成电路AN5757S 行扫描电源电压控制集成电路AN5762 场扫描振荡、输出集成电路AN5764 光栅水平位置控制集成电路AN5765 电源稳压控制集成电路AN5767 同步信号处理集成电路AN5768 光栅倾斜校正控制集成电路AN5790N 行扫描信号处理集成电路AN5791 同步脉冲相位与脉宽调整集成电路 AN5803 双声道立体声解调集成电路AN5836 双声道前置放大集成电路AN5858K 视频信号控制集成电路AN5862 视频信号控制集成电路AN5862S－E1 视频信号开关控制集成电路AN5870K 模拟信号切换集成电路AN5891K 音频信号处理集成电路AN614 行枕形校正集成电路24AN6210 双声道前置放大集成电路AN6306S 亮度信号处理集成电路AN6308 模拟电子开关集成电路AN6327 视频重放信号处理集成电路AN6341N 伺服控制集成电路AN6342N 基准分频集成电路AN6344 伺服控制集成电路AN6345 分频集成电路AN6346N 磁鼓伺服控制集成电路AN6350 磁鼓伺服控制集成电路AN6357N 主轴接口集成电路AN6361N 色度信号处理集成电路AN6367NK 色度信号处理集成电路AN6371S 自动相位控制集成电路AN6387 电机伺服控制集成电路AN6550 卡拉OK音频放大集成电路AN6554 四运算放大集成电路AN6561 双运算放大集成电路AN6562SG 双运算放大集成电路AN6609N 电机驱动集成电路AN6612 电机稳速控制集成电路AN6650 电机速度控制集成电路AN6651 电机速度控制集成电路AN6652 电机稳速控制集成电路AN6875 发光二极管五位显示驱动集成电路 AN6877 发光二极管七位显示驱动集成电路 AN6884 发光二极管五位显示驱动集成电路 AN6886 发光二极管五位显示驱动集成电路 AN6888 发光二极管显示驱动集成电路AN6914 双电压比较集成电路25AN7085N5 单片录、放音集成电路AN7105 双声道音频功率放大集成电路AN7106K 双声道音频功率放大集成电路AN7108 单片立体声放音集成电路AN710S 单片放音集成电路AN7110E 音频功率放大集成电路AN7114 音频功率放大集成电路AN7116 音频功率放大集成电路AN7118 双声道音频功率放大集成电路AN7118S 双声道音频功率放大集成电路AN7120 音频功率放大集成电路AN7124 双声道音频功率放大集成电路AN7145 双声道音频功率放大集成电路AN7148 双声道音频功率放大集成电路AN7158N 音频功率放大7.5W×2集成电路 AN7161N 音频功率放大集成电路AN7164 双声道音频功率放大集成电路AN7171NK 音频功率放大集成电路AN7205 调频/调谐及高频放大集成电路 AN7220 调频/调幅中频放大集成电路AN7222 调频/调幅中频放大集成电路AN7223 调频/调幅中频放大集成电路AN7226 调频/调幅中频放大集成电路AN7256 调频/调谐及中频放大集成电路 AN7311 双声道前置放大集成电路AN7312 双声道前置放大集成电路AN7315 双声道前置放大集成电路AN7315S 双声道前置放大集成电路AN7320 音频前置放大集成电路AN7396K 双声道前置放大集成电路26AN7397K 双声道前置放大集成电路AN7410 调频立体声多路解码集成电路AN7414 调频立体声解码集成电路AN7420N 调频立体声解码集成电路AN7470 调频立体声解码集成电路AN7805 三端电源稳压＋5V/1A集成电路 AN7806 三端电源稳压＋6V/1A集成电路 AN7807 三端电源稳压＋7V/1A集成电路 AN7808 三端电源稳压＋8V/1A集成电路 AN7809 电源稳压＋9V/1A集成电路AN7810 三端电源稳压＋10V/1A集成电路 AN7812 三端电源稳压＋12V/1A集成电路 AN7815 三端电源稳压＋15V/1A集成电路 AN7818 三端电源稳压＋18V/1A集成电路AN7824 三端电源稳压＋24V/1A集成电路AN78L05 三端电源稳压＋5V/0.1A集成电路AN78L06 三端电源稳压＋6V/0.1A集成电路AN78L08 三端电源稳压＋8V/0.1A集成电路AN78L09 三端电源稳压＋9V/0.1A集成电路AN78L10 三端电源稳压＋10V/0.1A集成电路 AN78L12 三端电源稳压＋12V/0.1A集成电路 AN78L15 三端电源稳压＋15V/0.1A集成电路 AN78L18 三端电源稳压＋18V/0.1A集成电路 AN78L20 三端电源稳压＋20V/0.1A集成电路 AN78L24 三端电源稳压＋24V/0.1A集成电路 AN78M05 三端电源稳压＋5V/0.5A集成电路AN78M06 三端电源稳压＋6V/0.5A集成电路AN78M08 三端电源稳压＋8V/0.5A集成电路AN78M09 三端电源稳压＋9V/0.5A集成电路27AN78M10 三端电源稳压＋10V/0.5A集成电路 AN78M12 三端电源稳压＋12V/0.5A集成电路 AN78M15 三端固定式稳压＋15V/0.5A集成电路 AN78M18 三端电源稳压＋18V/0.5A集成电路 AN78M20 三端电源稳压＋20V/0.5A集成电路 AN78M24 三端电源稳压＋24V/0.5A集成电路 AN7905 三端电源稳压－5V/1A集成电路AN7906 三端电源稳压－6V/1A集成电路AN7908T 三端电源稳压－8V/1A集成电路AN7909T 三端电源稳压－9V/1A集成电路AN7910T 三端电源稳压－10V/1A集成电路AN7912 三端电源稳压－12V/1A集成电路AN7915 三端电源稳压－15V/1A集成电路AN7918 三端电源稳压－18V/1A集成电路AN7920 三端电源稳压－20V/1A集成电路AN7924 三端电源稳压－24V/1A集成电路AN79L05 三端电源稳压－5V/0.1A集成电路AN79L06 三端电源稳压－6V/0.1A集成电路AN79L08 三端电源稳压－8V/0.1A集成电路AN79L09 三端电源稳压－9V/0.1A集成电路AN79L10 三端电源稳压－10V/0.1A集成电路 AN79L12 三端电源稳压－12V/0.1A集成电路 AN79L15 三端电源稳压－15V/0.1A集成电路 AN79L18 三端电源稳压－18V/0.1A集成电路 AN79L20 三端电源稳压－20V/0.1A集成电路 AN79L24 三端电源稳压－24V/0.1A集成电路 AN79M05 三端电源稳压－5V/0.5A集成电路AN79M08 三端电源稳压－8V/0.5A集成电路 AN79M09 三端电源稳压－9V/0.5A集成电路28AN79M10 三端电源稳压－10V/0.5A集成电路 AN79M12 三端电源稳压－12V/0.5A集成电路 AN79M15 三端电源稳压－15V/0.5A集成电路 AN79M18 三端电源稳压－18V/0.5A集成电路 AN79M20 三端电源稳压－20V/0.5A集成电路 AN79M24 三端电源稳压－24V/0.5A集成电路 AN8028 自激式开关电源控制集成电路AN8270K 主轴电机控制集成电路AN8280 电机驱动集成电路AN8281S 电机驱动集成电路AN8290S 主轴电机驱动集成电路AN8355S 条形码扫描接收集成电路AN8370S 光电伺服控制集成电路AN8373S 射频伺服处理集成电路AN8375S 伺服处理集成电路AN8389S－E1 电机驱动集成电路AN8480NSB 主轴电机驱动集成电路AN8481SB－E1 主轴电机驱动集成电路AN8482SB 主轴电机驱动集成电路AN8623FBQ 主轴伺服处理集成电路AN8788FB 电机驱动集成电路AN8802CE1V 伺服处理集成电路AN8813NSBS 主轴电机驱动集成电路AN8819NFB 伺服驱动、直流交换集成电路AN8824FBQ 前置放大集成电路AN8825NFHQ－V 聚焦、循迹误差处理集成电路AN8831SC 视频预视放集成电路AN8832SB－E1 射频放大、伺服处理集成电路AN8837SB－E1 伺服处理集成电路AN89C2051－24PC 微处理集成电路29APU2400U 音频信号处理集成电路APU2470 音频信号处理集成电路AS4C14405－60JC 动态随机存储1M×4集成电路AS4C256K16ED－60JC 存储集成电路ASD0204－015 图文控制集成电路ASD0204GF－022－3BA显示控制集成电路AT24C08 存储集成电路AT24C08A 存储集成电路AT24C256－10CI 码片集成电路AT27C010 电可改写编程只读存储集成电路 AT27C020 存储集成电路ATMEL834 存储集成电路AVM－1 视频信号处理厚膜集成电路AVM－2 音频信号处理厚膜集成电路AVSIBCP08 倍压整流切换集成电路B0011A 存储集成电路B1218 电子快门控制集成电路BA033T 三端电源稳压＋3.3V集成电路 BA10324 四运算放大集成电路BA10393N 双运算放大集成电路BA1102F 杜比降噪处理集成电路BA1106F 杜比降噪处理集成电路BA12ST 电源稳压集成电路BA1310 调频立体声解码集成电路BA1332L 调频立体声解码集成电路BA1350 调频立体声解码集成电路BA1351 调频立体声解码集成电路BA1356 调频立体声解码集成电路BA1360 调频立体声解码集成电路BA15218N 双运算放大集成电路30BA225 可触发双单稳态振荡集成电路 BA302 音频前置放大集成电路BA311 音频前置放大集成电路BA313 音频前置放大集成电路BA3283 单片放音集成电路BA328F 双声道前置放大集成电路BA329 双声道前置放大集成电路BA3304F 录放音前置均衡放大集成电路 BA3306 音频、前置放大集成电路BA3312N 话筒信号前置放大集成电路BA3313L 自动音量控制集成电路BA3314 话筒信号前置放大集成电路BA335 自动选曲集成电路BA336 自动选曲集成电路BA340 音频前置放大集成电路BA3402F 双声道前置放大集成电路BA3404F 自返转放音集成电路BA3416BL 双声道前置放大集成电路BA343 双声道前置放大集成电路BA3503F 双声道前置放大集成电路BA3506 单片放音集成电路BA3513FS 单片放音集成电路BA3706 自动选曲集成电路BA3707 录音带曲间检测集成电路BA3812L 五频段音调补偿集成电路BA3818F 电压比较运放集成电路BA3822LS 双声道五频段显示均衡集成电路BA3828 电子选台预置集成电路BA3880 音频处理集成电路31BA401 调频中频放大集成电路BA402 调频中频放大集成电路BA4110 调频中频放大集成电路BA4234L 调频中频放大集成电路BA4402 调频调谐收音集成电路BA4403 调频高频放大、混频、本振集成电路 BA4560 双运算放大集成电路BA5096 数字混响集成电路BA5102A 音频功率放大集成电路BA514 音频功率放大集成电路BA516 音频功率放大集成电路BA5208AF 音频功率放大集成电路BA532 音频功率放大集成电路BA534 音频功率放大集成电路BA5406 双声道音频功率放大集成电路BA5412 音频功率放大集成电路BA547 音频功率放大1.5W集成电路BA5912AFP－YE2 电机驱动、倾斜、加载集成电路BA5981FP－E2 聚焦、循迹驱动集成电路BA5983FB 四通道伺服驱动集成电路BA5983FM－E2 电机驱动集成电路BA6104 发光二极管五位显示驱动集成电路 BA6107A 电机伺服控制集成电路BA6109 加载电机驱动集成电路BA6125 发光二极管五位显示驱动集成电路 BA6137 发光二极管五位显示驱动集成电路 BA6191 音频控制集成电路BA6196FP 伺服驱动集成电路BA6208 电机驱动集成电路BA6208D 电机驱动集成电路32BA6209 电机驱动集成电路BA6209N 双向驱动电机集成电路BA6209U 电机双向驱动集成电路BA6218 加载电机驱动集成电路BA6219B 电机驱动集成电路BA6227 电机稳速控制集成电路BA6238 电机驱动集成电路BA6239 电机双向驱动集成电路BA6239A 电机双向驱动集成电路BA6246M 加载、转盘电机驱动集成电路BA6248 电机驱动集成电路BA6286 电机驱动集成电路BA6287 电机驱动集成电路BA6290 电机驱动集成电路BA6295AFP－E2 加载、倾斜驱动集成电路BA6296FP 电机速度控制集成电路BA6297AFP 伺服驱动集成电路BA6302A 电机伺服控制集成电路BA6305 控制放大集成电路BA6305F 控制放大集成电路BA6308 电子开关切换集成电路BA6321 电机伺服控制集成电路BA6392 伺服驱动集成电路BA6395 主轴电机驱动集成电路BA6396FP 伺服驱动集成电路BA6411 电机驱动集成电路BA6435S 主轴电机驱动集成电路BA6459P1 电机驱动集成电路BA6570FP－E2 聚焦、循迹驱动集成电路33BA6664FM 三相主电机驱动集成电路BA6791FP 四通道伺服驱动集成电路BA6796FP 电机驱动集成电路BA6810S 音频显示驱动集成电路BA6844AFP－E2 三相主电机驱动集成电路BA6849FP 主轴电机驱动集成电路BA689 发光二极管十二位显示驱动集成电路 BA6893KE2 直流变换驱动集成电路BA6956AN 加载电机驱动集成电路BA6993 双运算放大集成电路BA7001 音频切换集成电路BA7004 测试信号发生集成电路BA7005AL 射频调制集成电路BA7007 信号检测集成电路BA7021 视频信号选择集成电路BA7024 视频信号测试集成电路BA7025L 信号检测集成电路BA7042 振荡集成电路BA7047 调频检波集成电路BA7048N 包络信号检测集成电路BA7106LS 检测信号控制集成电路BA7180FS 磁头信号放大集成电路BA7212S 磁头信号放大集成电路BA7253S 磁头信号放大集成电路BA7254S 四磁头信号放大集成电路BA7258AS 亮度信号处理集成电路BA7264S 视频信号处理集成电路BA7274S 磁头信号放大集成电路BA7357S 中频放大集成电路BA7604N 电子开关切换集成电路34BA7606F 色差信号切换集成电路BA7655 色度信号处理集成电路BA7665FS－E2 视频输出放大集成电路BA7725FS 混响立体声放大集成电路BA7725S 信号压缩及扩展处理集成电路BA7743FS 磁头信号放大集成电路BA7751ALS 音频信号录放处理集成电路BA7752LS 音频信号处理集成电路BA7755 磁头开关集成电路BA7755AF－E2 磁头开关集成电路BA7765AS 音频信号处理集成电路BA7766SA 音频信号处理集成电路BA7767AS 音频信号处理集成电路BA7797F 音频信号处理集成电路BA8420 特技控制处理集成电路BAL6309 场同步信号发生集成电路BH3866AS 音频、色度信号前置放大集成电路 BH4001 微处理集成电路BH7331P 音频功率放大集成电路BH7770KS 音频信号处理集成电路BL3207 亮度延时集成电路BL3208B 音频延迟混响集成电路BL5132 中频放大集成电路BL54573 电子调频波段转换集成电路BL5612 视频放大、色差矩阵集成电路BM5060 微处理集成电路BM5061 字符发生集成电路BM5069 微处理集成电路BN5115 图像中频放大集成电路BOC31F 单片微处理集成电路35BP5020 视频电源转换集成电路BT852 视频编码集成电路BT864 视频编码集成电路BT866PQFP 微处理集成电路BU12102 时序信号发生解码集成电路BU2092F 扩展集成电路BU2185F 同步信号处理集成电路BU2285FV 时钟信号发生集成电路BU2820 伺服控制集成电路BU2841FS 视频、蓝背景信号发生集成电路 BU2872AK 操作系统控制、屏显驱动集成电路 BU3762AF 红外遥控信号发射集成电路BU4053B 电子开关切换集成电路BU5814F 红外遥控信号发射集成电路BU5994F 红外遥控信号发射集成电路BU6198F 屏幕显示集成电路BU9252F 音频延时集成电路BU9252S 数/模转换集成电路BU9253FS 话筒音频混响集成电路BX1303 音频功率放大集成电路BX1409 红外遥控信号接收集成电路BX7506 主轴电机电源控制集成电路C1363CA 红外遥控电子选台集成电路C1490HA 红外遥控信号接收集成电路C187 分配、十进制计数集成电路C301 译码BCD－10段集成电路C68639Y 微处理集成电路C75P036 微处理集成电路CA0002 调幅模拟声解调集成电路CA2004 音频功率放大集成电路36CA2006 音频功率放大集成电路CA270AW 视频检波放大集成电路CA3075 调频中频放大集成电路CA3089 调频中频放大集成电路CA3120E 视频信号处理集成电路CA3140 运算放大集成电路CA810 音频功率放大集成电路CA920 行扫描信号处理集成电路CAS126 天线开关集成电路CAT24C16 电可改写编程只读存储集成电路 CAT35C104HP 存储集成电路CC4000 或非门双3输入集成电路。

Data sheet acquired from Harris Semiconductor SCHS015C – Revised August 2003The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)7704403CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 89263AKB3T OBSOLETE CFP WR16TBD Call TI Call TICD4001BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4001BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4001BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4001BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4001BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4001BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4001BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4002BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4002BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4002BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4002BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4002BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4025BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4025BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4025BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4025BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BM96G4ACTIVE SOIC D142500Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)CD4025BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4025BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM JM38510/05252BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/05254BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4001BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4001BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4001BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4002BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4002BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4002BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4025BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4025BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4025BPWRTSSOPPW142000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION11-Mar-2008*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4001BM96SOIC D 142500346.0346.033.0CD4001BNSR SO NS 142000346.0346.033.0CD4001BPWR TSSOP PW 142000346.0346.029.0CD4002BM96SOIC D 142500346.0346.033.0CD4002BNSR SO NS 142000346.0346.033.0CD4002BPWR TSSOP PW 142000346.0346.029.0CD4025BM96SOIC D 142500346.0346.033.0CD4025BNSR SO NS 142000346.0346.033.0CD4025BPWRTSSOPPW142000346.0346.029.0PACKAGE MATERIALS INFORMATION11-Mar-2008。

Data sheet acquired from Harris Semiconductor SCHS041D − Revised October 2003The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4043BD ACTIVE SOIC D1640Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4043BDR ACTIVE SOIC D162500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4043BDT ACTIVE SOIC D16250Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4043BDW ACTIVE SOIC DW1640Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMCD4043BDWR ACTIVE SOIC DW162000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMCD4043BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC CD4043BF3A ACTIVE CDIP J161None Call TI Level-NC-NC-NC CD4043BM OBSOLETE SOIC D16None Call TI Call TICD4043BNSR ACTIVE SO NS162000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4043BPW ACTIVE TSSOP PW1690Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMCD4043BPWR ACTIVE TSSOP PW162000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMCD4044BD ACTIVE SOIC D1640Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4044BDR ACTIVE SOIC D162500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4044BDT ACTIVE SOIC D16250Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4044BDW ACTIVE SOIC DW1640Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMCD4044BDWR ACTIVE SOIC DW162000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMCD4044BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC CD4044BF ACTIVE CDIP J161None Call TI Level-NC-NC-NC CD4044BF3A ACTIVE CDIP J161None Call TI Level-NC-NC-NC CD4044BM OBSOLETE SOIC D16None Call TI Call TICD4044BNSR ACTIVE SO NS162000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMCD4044BPW ACTIVE TSSOP PW1690Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMCD4044BPWR ACTIVE TSSOP PW162000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. 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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.CD4078BMSCMOS 8 Input NOR/OR GateFeatures•High Voltage Type (20V Rating)•Medium Speed Operation-tPHL, tPLH = 75ns (Typ.) at VDD = 10V •Buffered Inputs and Output •5V, 10V and 15V Parametric Ratings•Standardized, Symmetrical Output Characteristics •100% Tested for Quiescent Current at 20V•Maximum Input Current of 1µA at 18V Over Full Pack-age Temperature Range; 100nA at 18V and +25o C •Noise Margin (Over Full Package/Temperature Range)-1V at VDD = 5V -2V at VDD = 10V - 2.5V at VDD = 15V •Meets All Requirements of JEDEC Tentative Standard No. 13B, “Standard Specifications for Description of ‘B’ Series CMOS Devices”DescriptionCD4078BMS NOR/OR Gate provides the system designer with direct implementation of the positive logic 8 input NOR and OR functions and supplements the existing family of CMOS gates.The CD4078BMS is supplied in these 14 lead outline packages:Braze Seal DIP H4Q Frit Seal DIPH1B Ceramic FlatpackH3WDecember 1992File Number3326PinoutCD4078BMS TOP VIEWFunctional DiagramK **A B C D NC VSS VDD J *H G F E NC1234567141312111098J =A + B + C + D + E + F + G + HK = A + B + C + D + E + F + G + H***NC = NO CONNECTION12111092345A B C DE F G H13JK 1J =A + B + C + D + E + F + G + H K =A + B + C + D + E + F + G + H VDD = 14VSS = 76, 8 = NO CONNECTION Logic DiagramFIGURE 1.LOGIC DIAGRAM13J1K2A 3B4C 5D 9E 10F 11G 12HAbsolute Maximum Ratings Reliability InformationDC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . .-0.5V to +20V (Voltage Referenced to VSS Terminals)Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA Operating Temperature Range. . . . . . . . . . . . . . . .-55o C to +125o C Package Types D, F, K, HStorage Temperature Range (TSTG). . . . . . . . . . .-65o C to +150o C Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . .+265o C At Distance 1/16 ± 1/32 Inch (1.59mm± 0.79mm) from case for 10s Maximum Thermal Resistance . . . . . . . . . . . . . . . .θjaθjc Ceramic DIP and FRIT Package. . . . .80o C/W20o C/W Flatpack Package . . . . . . . . . . . . . . . .70o C/W20o C/W Maximum Package Power Dissipation (PD) at +125o CFor TA = -55o C to +100o C (Package Type D, F, K). . . . . .500mW For TA = +100o C to +125o C (Package Type D, F, K) . . . . .DerateLinearity at 12mW/o C to 200mW Device Dissipation per Output Transistor . . . . . . . . . . . . . . .100mW For TA = Full Package Temperature Range (All Package Types) Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+175o CTABLE1.DC ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS(NOTE 1)GROUP ASUBGROUPS TEMPERATURELIMITSUNITSMIN MAXSupply Current IDD VDD = 20V, VIN = VDD or GND1+25o C-0.5µA2+125o C-50µAVDD = 18V, VIN = VDD or GND3-55o C-0.5µA Input Leakage Current IIL VIN = VDD or GND VDD = 201+25o C-100-nA2+125o C-1000-nAVDD = 18V3-55o C-100-nA Input Leakage Current IIH VIN = VDD or GND VDD = 201+25o C-100nA2+125o C-1000nAVDD = 18V3-55o C-100nA Output Voltage VOL15VDD = 15V, No Load1, 2, 3+25o C, +125o C, -55o C-50mV Output Voltage VOH15VDD = 15V, No Load (Note 3)1, 2, 3+25o C, +125o C, -55o C14.95-V Output Current (Sink)IOL5VDD = 5V, VOUT = 0.4V1+25o C0.53-mA Output Current (Sink)IOL10VDD = 10V, VOUT = 0.5V1+25o C 1.4-mA Output Current (Sink)IOL15VDD = 15V, VOUT = 1.5V1+25o C 3.5-mA Output Current (Source)IOH5A VDD = 5V, VOUT = 4.6V1+25o C--0.53mA Output Current (Source)IOH5B VDD = 5V, VOUT = 2.5V1+25o C--1.8mA Output Current (Source)IOH10VDD = 10V, VOUT = 9.5V1+25o C--1.4mA Output Current (Source)IOH15VDD = 15V, VOUT = 13.5V1+25o C--3.5mA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA1+25o C-2.8-0.7V P Threshold Voltage VPTH VSS = 0V, IDD = 10µA1+25o C0.7 2.8VFunctional F VDD = 2.8V, VIN = VDD or GND7+25o C VOH >VDD/2VOL <VDD/2VVDD = 20V, VIN = VDD or GND7+25o CVDD = 18V, VIN = VDD or GND8A+125o CVDD = 3V, VIN = VDD or GND8B-55o CInput Voltage Low(Note 2)VIL VDD = 5V, VOH > 4.5V, VOL < 0.5V1, 2, 3+25o C, +125o C, -55o C- 1.5VInput Voltage High(Note 2)VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V1, 2, 3+25o C, +125o C, -55o C 3.5-VInput Voltage Low (Note 2)VIL VDD = 15V, VOH > 13.5V,VOL < 1.5V1, 2, 3+25o C, +125o C, -55o C-4VInput Voltage High (Note 2)VIH VDD = 15V, VOH > 13.5V,VOL < 1.5V1, 2, 3+25o C, +125o C, -55o C11-VNOTES: 1.All voltages referenced to device GND, 100% testing being implemented.2.Go/No Go test with limits applied to inputs.3.For accuracy, voltage is measured differentially to VDD. Limitis 0.050V max.TABLE2.AC ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS(NOTES 1, 2)GROUP ASUBGROUPS TEMPERATURELIMITSUNITSMIN MAXPropagation Delay TPHLTPLH VDD = 5V, VIN = VDD or GND9+25o C-300ns10, 11+125o C, -55o C-405nsTransition Time TTHLTTLH VDD = 5V, VIN = VDD or GND9+25o C-200ns10, 11+125o C, -55o C-270nsMaximum Clock Input Frequency FCL VDD = 5V, VIN = VDD or GND9+25o C3-MHz10, 11+125o C, -55o C 2.22-MHzNOTES:1.VDD = 5V, CL = 50pF, RL = 200K2.-55o C and +125o C limits guaranteed, 100% testing being implemented.TABLE3.ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONS NOTES TEMPERATURELIMITSUNITS MIN MAXSupply Current IDD VDD = 5V, VIN = VDD or GND1, 2-55o C, +25o C-0.25µA+125o C-7.5µAVDD = 10V, VIN = VDD or GND1, 2-55o C, +25o C-0.5µA+125o C-15µAVDD = 15V, VIN = VDD or GND1, 2-55o C, +25o C-0.5µA+125o C-30µA Output Voltage VOL VDD = 5V, No Load1, 2+25o C, +125o C,-55o C-50mVOutput Voltage VOL VDD = 10V, No Load1, 2+25o C, +125o C,-55o C-50mVOutput Voltage VOH VDD = 5V, No Load1, 2+25o C, +125o C,-55o C4.95-VOutput Voltage VOH VDD = 10V, No Load1, 2+25o C, +125o C,-55o C9.95-V Output Current (Sink)IOL5VDD = 5V, VOUT = 0.4V1, 2+125o C0.36-mA-55o C0.64-mA Output Current (Sink)IOL10VDD = 10V, VOUT = 0.5V1, 2+125o C0.9-mA-55o C 1.6-mA Output Current (Sink)IOL15VDD = 15V, VOUT = 1.5V1, 2+125o C 2.4-mA-55o C 4.2-mA Output Current (Source)IOH5A VDD = 5V, VOUT = 4.6V1, 2+125o C--0.36mA-55o C--0.64mA Output Current (Source)IOH5B VDD = 5V, VOUT = 2.5V1, 2+125o C--1.15mA-55o C--2.0mA Output Current (Source)IOH10VDD = 10V, VOUT = 9.5V1, 2+125o C--0.9mA-55o C--1.6mA Output Current (Source)IOH15VDD =15V, VOUT = 13.5V1, 2+125o C--2.4mA-55o C--4.2mA Input Voltage Low VIL VDD = 10V, VOH > 9V, VOL < 1V1, 2+25o C, +125o C,-55o C-3VInput Voltage High VIH VDD = 10V, VOH > 9V, VOL < 1V 1, 2+25o C, +125o C,-55o C7-V Propagation DelayTPHL TPLH VDD = 10V 1, 2, 3+25o C -150ns VDD = 15V 1, 2, 3+25o C -110ns Transition TimeTTHL TTLH VDD = 10V 1, 2, 3+25o C -100ns VDD = 15V 1, 2, 3+25o C -80ns Maximum Clock Input Frequency FCLVDD = 10V 1, 2, 3+25o C 6-MHz VDD = 15V1, 2, 3+25o C 8.5-MHz Input Capacitance CINut1, 2+25o C-7.5pFNOTES:1.All voltages referenced to device GND.2.The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics.3.CL = 50pF, RL = 200K, Input TR, TF < 20ns.TABLE 4.POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICSPARAMETER SYMBOL CONDITIONSNOTES TEMPERATURELIMITSUNITS MIN MAX Supply Current IDD VDD = 20V, VIN = VDD or GND 1, 4+25o C - 2.5µA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1, 4+25o C -2.8-0.2V N Threshold Voltage Delta∆VTN VDD = 10V, ISS = -10µA 1, 4+25o C -±1V P Threshold Voltage VTP VSS = 0V, IDD = 10µA 1, 4+25o C 0.2 2.8V P Threshold Voltage Delta ∆VTP VSS = 0V, IDD = 10µA1, 4+25o C -±1V FunctionalFVDD = 18V, VIN = VDD or GND 1+25o CVOH >VDD/2VOL <VDD/2VVDD = 3V, VIN = VDD or GNDPropagation Delay TimeTPHL TPLHVDD = 5V1, 2, 3, 4+25o C- 1.35 x +25o C LimitnsNOTES: 1.All voltages referenced to device GND.2.CL = 50pF, RL = 200K, Input TR, TF < 20ns.3.See Table 2 for +25o C limit.4.Read and RecordTABLE 5.BURN-IN AND LIFE TEST DELTA PARAMETERS +25O C PARAMETERSYMBOL DELTA LIMITSupply Current - SSI IDD ± 0.1µAOutput Current (Sink)IOL5± 20% x Pre-Test Reading Output Current (Source)IOH5A± 20% x Pre-Test ReadingTABLE 6.APPLICABLE SUBGROUPSCONFORMANCE GROUP MIL-STD-883METHOD GROUP A SUBGROUPSREAD AND RECORD Initial Test (Pre Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5ATABLE 3.ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)PARAMETER SYMBOL CONDITIONSNOTES TEMPERATURE LIMITSUNITS MIN MAXAll Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.For information regarding Intersil Corporation and its products, see web site Interim Test 1 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5A Interim Test 2 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5APDA (Note 1)100% 50041, 7, 9, DeltasInterim Test 3 (Post Burn-In)100% 50041, 7, 9IDD, IOL5, IOH5APDA (Note 1)100% 50041, 7, 9, Deltas Final Test 100% 50042, 3, 8A, 8B, 10, 11Group A Sample 50051, 2, 3, 7, 8A, 8B, 9, 10, 11Group BSubgroup B-5Sample 50051, 2, 3, 7, 8A, 8B, 9, 10, 11, DeltasSubgroups 1, 2, 3, 9, 10, 11Subgroup B-6Sample 50051, 7, 9Group DSample 50051, 2, 3, 8A, 8B, 9Subgroups 1, 2 3NOTE:1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.TABLE 7.TOTAL DOSE IRRADIATIONCONFORMANCE GROUPS MIL-STD-883METHODTESTREAD AND RECORD PRE-IRRAD POST-IRRAD PRE-IRRADPOST-IRRAD Group E Subgroup 250051, 7, 9Table 41, 9Table 4TABLE 8.BURN-IN AND IRRADIATION TEST CONNECTIONSFUNCTION OPEN GROUND VDD 9V ± -0.5VOSCILLATOR50kHz25kHzStatic Burn-In 1Note 11, 6, 8, 132-5, 7, 9-1214Static Burn-In 2Note 11, 6, 8, 1372-5, 9-12, 14Dynamic Burn-In Note 16, 87141, 132-5, 9-12Irradiation Note 21, 6, 8, 1372-5, 9-12, 14NOTE:1.Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V2.Each pin except VDD and GND will have a series resistor of 47K ±5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,VDD = 10V ± 0.5VTABLE 6.APPLICABLE SUBGROUPSCONFORMANCE GROUP MIL-STD-883METHOD GROUP A SUBGROUPSREAD AND RECORDSchematicFIGURE 2.SCHEMATIC DIAGRAM2345*pn***VDDppnnpVDDn p131npVSS VDDALL INPUTS PROTECTED BY *CMOS PROTECTION NETWORKVDDVSSDETAIL OF INVERTERSINVERTERSpppnnn9101112*pn***INVERTERS pppnnnVSSVSSnnpVSSVDDTypical Performance CharacteristicsFIGURE 3.TYPICAL OUTPUT LOW (SINK) CURRENTCHARACTERISTICSFIGURE 4.MINIMUM OUTPUT LOW (SINK) CURRENTCHARACTERISTICSFIGURE 5.TYPICAL OUTPUT HIGH (SOURCE) CURRENTCHARACTERISTICSFIGURE 6.MINIMUM OUTPUT HIGH (SOURCE) CURRENTCHARACTERISTICSFIGURE 7.TYPICAL TRANSITION TIME AS A FUNCTION OFLOAD CAPACITANCE FIGURE 8.TYPICAL PROPAGATION DELAY TIME AS AFUNCTION OF LOAD CAPACITANCE10V5V AMBIENT TEMPERATURE (T A ) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = 15V51015151********DRAIN-TO-SOURCE VOLTAGE (VDS) (V)O U T P U T L O W (S I N K ) C U R R E N T (I O L ) (m A )10V5VAMBIENT TEMPERATURE (T A ) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = 15V510157.55.02.510.012.515.0DRAIN-TO-SOURCE VOLTAGE (VDS) (V)O U T P U T L O W (S I N K ) C U R R E N T (I O L ) (m A )-10V-15VAMBIENT TEMPERATURE (T A ) = +25o CGATE-TO-SOURCE VOLTAGE (VGS) = -5V0-5-10-15DRAIN-TO-SOURCE VOLTAGE (VDS) (V)-20-25-30-5-10-15O U T P U T H I G H (S O U R C E ) C U R R E N T (I O H ) (m A )-10V-15VAMBIENT TEMPERATURE (T A ) = +25o C-5-10-15DRAIN-TO-SOURCE VOLTAGE (VDS) (V)-5-10-15O U T P U T H I G H (S O U R C E ) C U R R E N T (I O H ) (m A )GATE-TO-SOURCE VOLTAGE (VGS) = -5VAMBIENT TEMPERATURE (T A ) = +25o CLOAD CAPACITANCE (CL) (pF)40608010020050100150200SUPPL Y VOLTAGE (VDD) = 5V10V15VT R A N S I T I O N T I M E (t T H L , t T L H ) (n s )LOAD CAPACITANCE (CL) (pF)0251020304050607080901005075100125150175P R O P A G A T I O N D E L A Y T I M E (t P H L , t P L H ) (n s )10V 15VAMBIENT TEMPERATURE (T A ) = +25o CSUPPL Y VOLTAGE (VDD) = 5VMETALLIZATION:Thickness: 11k Å−14k Å, AL.PASSIVATION:10.4kÅ - 15.6k Å, SilaneBOND PADS:0.004 inches X 0.004 inches MIN DIE THICKNESS:0.0198 inches - 0.0218 inchesFIGURE 9.TYPICAL PROPAGATION DELAY TIME AS AFUNCTION OF SUPPLY VOLTAGE FIGURE 10.TYPICAL DYNAMIC POWER DISSIPATION AS AFUNCTION OF INPUT FREQUENCYChip Dimensions and Pad LayoutDimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated.Grid graduations are in mils (10-3 inch).Typical Performance Characteristics(Continued)AMBIENT TEMPERATURE (T A ) = +25o CSUPPLY VOLTAGE (VDD) = 15V 10V5V 15105510152025INPUT VOLTAGE (VI) (V)O U T P U T V O L T A G E (V O ) (V )CL = 15pFCL = 50pF 10V 5V10V AMBIENT TEMPERATURE (T A ) = +25oC SUPPLY VOLTAGE (VDD) = 15V 10510310P O W E R D I S S I P A T I O N (P D ) (µW )102104INPUT FREQUENCY (fI) (kHz)110102103104(O N E O U T P U T L O A D E D )86428642864286428642864286428642。

Data sheet acquired from Harris Semiconductor SCHS049C − Revised October 2003H CD4060B consists of an oscillator section and 14 ripple-carry binary counter stages. The oscillator configuration allows design of either RC or crystal oscillator circuits. A RESET input is provided which resets the counter to the all-O’s state and disables the oscillator. A high level on the RESET line accomplishes the reset function. All counter stages are master-slave flip-flops. The state of the counter is advanced one step in binary order on the negative transition of f I (and f O). All inputs and outputs are fully buffered. Schmitt trigger action on the input-pulse line permits unlimited input-pulse rise and fall times.The CD4060B-series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4060BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4060BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4060BF ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4060BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4060BF3AS2534OBSOLETE CDIP J16TBD Call TI Call TI CD4060BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BMT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BMTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BMTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4060BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4060BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4060BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4060BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4060BM96SOIC D162500333.2345.928.6 CD4060BNSR SO NS162000346.0346.033.0 CD4060BPWR TSSOP PW162000346.0346.029.0。

cd40107中文资料CD4049功能简介:CD4049六反相缓冲器/转换器.,CD4049是六反相缓冲器，具有仅用一电源电压(VCC)进行逻辑电平转换的特征。

用作逻辑电平转换时，输入高电平电压(VIH)超过电源电压VCD。

该器件主要用作COS/MOS到DTL/TTL的转换器，能直接驱动两个DTL/TTL负载。

CD4049可替换CD4009，因为CD4049仅需要一电源电压，可取代CD4009用于反相器、电源驱动器或逻辑电平转换器。

CD4049与CD4009引出端排列一致，16引出端是空脚，与内部电路无连接。

若使用时不要求高的漏电流或电压转换，推荐使用CD4049六反相器。

CD4049引脚图:CD4049引脚图CD4049内部结构图:CD4049内部图CD4049电气参数:CD4049交流特性波形图CD4049典型应用电路:典型电路CD4060(引脚图,真值表,电气参数及应用电路)CD4060由一振荡器和14级二进制串行计数器位组成，振荡器的结构可以是RC或晶振电路，CR为高电平时，计数器清零且振荡器使用无效。

所有的计数器位均为主从触发器。

在CP1(和CP0)的下降沿计数器以二进制进行计数。

在时钟脉冲线上使用斯密特触发器对时钟上升和下降时间无限制。

CD4060引脚图:CD4060引脚功能图CD4060内部结构图:CD4060内部方框图CD4060电气参数:CD4060典型应用电路CD4060B典型振荡器连接：上图-RC振荡器下图-晶体振荡器CD4060秒脉冲发生器电路:图2CD4060秒脉冲发生器脉冲发生器是数字钟的核心部分，它的精度和稳定度决定了数字钟的质量，通常用晶体振荡器发出的脉冲经过整形、分频获得1Hz的秒脉冲。

如晶振为32768Hz，通过15次二分频后可获得1Hz的脉冲输出，电路图如图2所示。

CD4060定时电路由CD4060和CD4027构成的50Hz振荡器电路本振荡器能产生交变的50Hz脉冲方波，其占空比为50%.可供某些反相器电路应用。

Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)7702402CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 7705102CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 7705902CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4073BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4073BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4081BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4081BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4081BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4081BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4081BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4082BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4082BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4082BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4082BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4082BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM JM38510/17001BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/17002BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/17003BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4073BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4073BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4073BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4081BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4081BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4081BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4082BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4082BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4082BPWRTSSOPPW142000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION11-Mar-2008*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4073BM96SOIC D 142500346.0346.033.0CD4073BNSR SO NS 142000346.0346.033.0CD4073BPWR TSSOP PW 142000346.0346.029.0CD4081BM96SOIC D 142500346.0346.033.0CD4081BNSR SO NS 142000346.0346.033.0CD4081BPWR TSSOP PW 142000346.0346.029.0CD4082BM96SOIC D 142500346.0346.033.0CD4082BNSR SO NS 142000346.0346.033.0CD4082BPWRTSSOPPW142000346.0346.029.0PACKAGE MATERIALS INFORMATION11-Mar-2008。

Data sheet acquired from Harris Semiconductor SCHS056D – Revised August 2003CD4071B Quad2-Input OR Gate CD4072B Dual4-Input OR Gate CD4075B Triple3-Input OR GateH CD4071B, CD4072B, and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)7706002CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4071BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4071BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4071BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4071BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4071BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4071BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4071BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4072BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4072BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4072BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4072BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4072BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4075BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4075BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4075BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4075BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4075BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4075BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM JM38510/17101BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/17103BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4071BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4071BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4071BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4072BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4072BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4072BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4075BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4075BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4075BPWRTSSOPPW142000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION11-Mar-2008*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4071BM96SOIC D 142500346.0346.033.0CD4071BNSR SO NS 142000346.0346.033.0CD4071BPWR TSSOP PW 142000346.0346.029.0CD4072BM96SOIC D 142500346.0346.033.0CD4072BNSR SO NS 142000346.0346.033.0CD4072BPWR TSSOP PW 142000346.0346.029.0CD4075BM96SOIC D 142500346.0346.033.0CD4075BNSR SO NS 142000346.0346.033.0CD4075BPWRTSSOPPW142000346.0346.029.0PACKAGE MATERIALS INFORMATION11-Mar-2008。

CD系列数字芯片资料概览表CD系列数字芯片资料概览表CD4000 双3输入端或非门+单非门 TICD4001 四2输入端或非门 HIT/NSC/TI/GOLCD4002 双4输入端或非门 NSCCD4006 18位串入/串出移位寄存器 NSCCD4007 双互补对加反相器 NSCCD4008 4位超前进位全加器 NSCCD4009 六反相缓冲/变换器 NSCCD4010 六同相缓冲/变换器 NSCCD4011 四2输入端与非门 HIT/TICD4012 双4输入端与非门 NSCCD4013 双主-从D型触发器 FSC/NSC/TOSCD4014 8位串入/并入-串出移位寄存器 NSCCD4015 双4位串入/并出移位寄存器 TICD4016 四传输门 FSC/TICD4017 十进制计数/分配器 FSC/TI/MOTCD4018 可预制1/N计数器 NSC/MOTCD4019 四与或选择器 PHICD4020 14级串行二进制计数/分频器 FSCCD4021 08位串入/并入-串出移位寄存器 PHI/NSC CD4022 八进制计数/分配器 NSC/MOTCD4023 三3输入端与非门 NSC/MOT/TICD4024 7级二进制串行计数/分频器 NSC/MOT/TI CD4025 三3输入端或非门 NSC/MOT/TICD4026 十进制计数/7段译码器 NSC/MOT/TICD4027 双J-K触发器 NSC/MOT/TICD4028 BCD码十进制译码器 NSC/MOT/TICD4029 可预置可逆计数器 NSC/MOT/TICD4030 四异或门 NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器 NSC/MOT/TICD4032 三串行加法器 NSC/TICD4033 十进制计数/7段译码器 NSC/TICD4034 8位通用总线寄存器 NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存 NSC/MOT/TI CD4038 三串行加法器 NSC/TICD4040 12级二进制串行计数/分频器 NSC/MOT/TICD4041 四同相/反相缓冲器 NSC/MOT/TICD4042 四锁存D型触发器 NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环 NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器 NSC/MOT/TICD4048 4输入端可扩展多功能门 NSC/HIT/TICD4049 六反相缓冲/变换器 NSC/HIT/TICD4050 六同相缓冲/变换器 NSC/MOT/TICD4051 八选一模拟开关 NSC/MOT/TICD4052 双4选1模拟开关 NSC/MOT/TICD4053 三组二路模拟开关 NSC/MOT/TICD4054 液晶显示驱动器 NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器 NSC/HIT/TICD4056 液晶显示驱动器 NSC/HIT/TICD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器 NSC/TI/MOTCD4063 四位数字比较器 NSC/HIT/TICD4066 四传输门 NSC/TI/MOTCD4067 16选1模拟开关 NSC/TICD4068 八输入端与非门/与门 NSC/HIT/TICD4069 六反相器 NSC/HIT/TICD4070 四异或门 NSC/HIT/TICD4071 四2输入端或门 NSC/TICD4072 双4输入端或门 NSC/TICD4073 三3输入端与门 NSC/TICD4075 三3输入端或门 NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门 HITCD4078 8输入端或非门/或门CD4081 四2输入端与门 NSC/HIT/TICD4082 双4输入端与门 NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器 NSC/MOT/ST CD4094 8位移位存储总线寄存器 NSC/TI/PHI CD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器 NSC/MOT/TICD4099 8位可寻址锁存器 NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器 NSC\\TICD40107 双2输入端与非缓冲/驱动器 HAR\\TICD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/***CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD40110 十进制加/减,计数,锁存,译码驱动 STCD40147 10-4线编码器 NSC\\MOTCD40160 可预置BCD加计数器 NSC\\MOTCD40161 可预置4位二进制加计数器 NSC\\MOTCD40162 BCD加法计数器 NSC\\MOTCD40163 4位二进制同步计数器 NSC\\MOTCD40174 六锁存D型触发器 NSC\\TI\\MOTCD40175 四D型触发器 NSC\\TI\\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\\TI CD40193 可预置4位二进制加/减计数器 NSC\\TICD40194 4位并入/串入-并出/串出移位寄存 NSC\\MOT CD40195 4位并入/串入-并出/串出移位寄存 NSC\\MOT CD40208 4×4多端口寄存器型号器件名称厂牌备注CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐)CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器。

The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PWR suffix). The CD4011B and CD4023B types also are supplied in 14-lead thin shrink small-outline packages (PW suffix).PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)89265AKB3T OBSOLETE CFP WR14TBD Call TI Call TI89266AKB3T OBSOLETE CFP WR16TBD Call TI Call TI89273AKB3T OBSOLETE CFP WR14TBD Call TI Call TICD4011BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCCD4011BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC CD4011BF ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC CD4011BF3A ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC CD4011BK3OBSOLETE CFP WR14TBD Call TI Call TICD4011BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4011BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCCD4012BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC CD4012BF3A ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC CD4012BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4012BM96E4ACTIVE SOIC D142500Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)CD4012BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4012BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCCD4023BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC CD4023BF ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC CD4023BF3A ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC CD4023BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4023BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMJM38510/05051BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC JM38510/05052BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC JM38510/05053BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to 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Data sheet acquired from Harris SemiconductorSCHS053C – Revised September 2003The CD4068B types are supplied in 14-leadhermetic dual-in-line ceramic packages (F3Asuffix), 14-lead dual-in-line plastic packages (Esuffix), 14-lead small-outline packages (M, MT,M96, and NSR suffixes), and 14-lead thin shrinksmall-outline packages (PW and PWR suffixes).Copyright © 2003, Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4068BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4068BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4068BF ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4068BF3A ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4068BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4068BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4068BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4068BMT SOIC D 14250330.016.4 6.59.0 2.18.016.0Q1CD4068BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4068BPWRTSSOPPW142000330.012.46.95.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4068BM96SOIC D142500367.0367.038.0 CD4068BMT SOIC D1*******.0367.038.0 CD4068BNSR SO NS142000367.0367.038.0CD4068BPWR TSSOP PW142000367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s 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process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)7702402CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 7705102CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 7705902CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4073BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4073BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4073BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4073BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4081BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4081BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4081BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4081BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4081BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4081BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4082BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4082BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4082BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4082BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4082BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4082BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM JM38510/17001BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/17002BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type JM38510/17003BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4073BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4073BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4073BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4081BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4081BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4081BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4082BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4082BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4082BPWRTSSOPPW142000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION11-Mar-2008*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4073BM96SOIC D 142500346.0346.033.0CD4073BNSR SO NS 142000346.0346.033.0CD4073BPWR TSSOP PW 142000346.0346.029.0CD4081BM96SOIC D 142500346.0346.033.0CD4081BNSR SO NS 142000346.0346.033.0CD4081BPWR TSSOP PW 142000346.0346.029.0CD4082BM96SOIC D 142500346.0346.033.0CD4082BNSR SO NS 142000346.0346.033.0CD4082BPWRTSSOPPW142000346.0346.029.0PACKAGE MATERIALS INFORMATION11-Mar-2008。

October 1987Revised January 1999CD4043BC • CD4044BC Quad 3-STATE NOR R/S Latches • Quad 3-STATE NAND R/S Latches © 1999 Fairchild Semiconductor Corporation DS005967.prf CD4043BC • CD4044BCQuad 3-STATE NOR R/S Latches •Quad 3-STATE NAND R/S LatchesGeneral DescriptionThe CD4043BC are quad cross-couple 3-STATE CMOSNOR latches, and the CD4044BC are quad cross-couple 3-STATE CMOS NAND latches. Each latch has a separate Qoutput and individual SET and RESET inputs. There is acommon 3-ST ATE ENABLE input for all four latches. Alogic “1” on the ENABLE input connects the latch states tothe Q outputs. A logic “0” on the ENABLE input discon-nects the latch states from the Q outputs resulting in anopen circuit condition on the Q output. The 3-ST ATE fea-ture allows common bussing of the outputs.Featuress Wide supply voltage range: 3V to 15Vs Low power:100 nW (typ.)s High noise immunity:0.45 V DD (typ.)s Separate SET and RESET inputs for each latchs NOR and NAND configurations3-STATE output with common output enableApplications•Multiple bus storage•Strobed register•Four bits of independent storage with output enable•General digital logicOrdering Code:Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection DiagramsPin Assignments for DIP, SOIC and SOPCD4043BCTop ViewPin Assignments for DIP and SOICCD4044BCTop ViewOrder Number Package Number Package DescriptionCD4043BCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyCD4043BCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WideCD4044BCM M16A16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyCD4044BCSJ M16D16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WideCD4044BCN N16E16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide 2C D 4043B C • C D 4044B CBlock DiagramsCD4043BCCD4044BCTruth TablesCD4043BCCD4044BC OC = 3-ST ATE NC = No change X = Don’t care∆ = Dominated by S = 1 input ∆∆ = Dominated by R = 0 inputS R E Q X X 0OC 001NC 10110110111∆S R E Q X X 0OC 111NC 0111101001∆∆CD4043BC • CD4044BCAbsolute Maximum Ratings (Note 1)(Note 2)Recommended Operating Conditions (Note 2)Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed; they are not meant to imply that the devices should be operated at these limits. The tables of “Recom-mended Operating Conditions” and “Electrical Characteristics” provide con-ditions for actual device operation.Note 2: V SS = 0V unless otherwise specified.DC Electrical Characteristics (Note 2)Note 3: I OH and I OL are tested one output at a time.Supply Voltage (V DD )−0.5V to +18V Input Voltage (V IN )−0.5V to V DD +0.5V Storage Temperature Range (T S )−65°C to +150°CPower Dissipation (P D )Dual-In-Line 700 mW Small Outline 500 mW Lead Temperature (T L )(Soldering, 10 seconds)260°C Supply Voltage (V DD ) 3.0V to 15V Input Voltage (V IN )0 to V DD VOperating T emperature Range (T A )CD4043BC, CD4044BC−40°C to +85°CSymbol ParameterConditions−40°C +25°C +85°C Units MinMax MinTyp Max MinMax I DDQuiescent V DD = 5V , V IN = V DD or V SS 200.0120150µA Device CurrentV DD = 10V , V IN = V DD or V SS 400.0140300µA V DD = 15V , V IN = V DD or V SS 800.0280600µA V OLLOW Level |I O | ≤ 1 µA, V IL = 0V , V IH = V DD Output VoltageV DD = 5.0V 0.0500.050.05V V DD = 10V 0.0500.050.05V V DD = 15V0.0500.050.05V V OHHIGH Level |I O | ≤ 1 µA, V IL = 0V , V IH = V DD Output VoltageV DD = 5.0V 4.95 4.95 5.0 4.95V V DD = 10V 9.959.95109.95V V DD = 15V14.9514.951514.95V V ILLOW Level |I O | ≤ 1 µAInput VoltageV DD = 5.0V , V O = 0.5V or 4.5V 1.5 2.25 1.5 1.5V V DD = 10V , V O = 1.0V or 9.0V 3.0 4.5 3.0 3.0V V DD = 15V , V O = 1.5V or 13.5V4.06.754.0 4.0V V IHHIGH Level |I O | ≤ 1 µAInput VoltageV DD = 5.0V , V O = 0.5V or 4.5V 3.5 3.5 3.5V V DD = 5.0V , V O = 1.0V or 9.0V 7.07.07.0V V DD = 15V , V O = 1.5V or 13.5V111111V I OLLOW Level V IL = 0V , V IH = V DD Output Current V DD = 5.0V , V O = 0.4V 0.520.440.880.36mA (Note 3)V DD = 10V , V O = 0.5V 1.3 1.1 2.20.9mA V DD = 15V , V O = 1.5V 3.6 3.0 6.0 2.4mA I OHHIGH Level V IL = 0V , V IH = V DD Output Current V DD = 5.0V , V O = 4.6V −0.52−0.44−0.32−0.36mA (Note 3)V DD = 10V , V O = 9.5V −1.3−1.1−0.8−0.9mA V DD = 15V , V O = 13.5V −3.6−3.0−2.4−2.4mAI INInput CurrentV DD = 15V , V IN = 0V −0.3−0.3−1.0µA V DD = 15V , V IN = 15V0.30.31.0µA 4C D 4043B C • C D 4044B CAC Electrical Characteristics (Note 4)T A = 25°C, C L = 50 pF , R L = 200k, input t r = t f = 20 ns, unless otherwise notedNote 4: AC Parameters are guaranteed by DC correlated testing.Timing WaveformsCD4043BCD4044BEnable TimingSymbol ParameterConditions Min Typ Max Units t PLH , t PHLPropagation Delay S or R to QV DD = 5.0V 175350ns V DD = 10V 75175ns V DD = 15V60120ns t PZH , t PHZPropagation Delay Enable to Q (HIGH)V DD = 5.0V 115230ns V DD = 10V 55110ns V DD = 15V4080ns t PZL , t PLZPropagation Delay Enable to Q (LOW)V DD = 5.0V 100200ns V DD = 10V 50100ns V DD = 15V4080ns t THL , t TLHTransition TimeV DD = 5.0V 100200ns V DD = 10V 50100ns V DD = 15V4080ns t WOMinimum SET or RESET Pulse WidthV DD = 5.0V 80160ns V DD = 10V 4080ns V DD = 15V2040ns C INInput Capacitance5.07.5pFCD4043BC • CD4044BCPhysical Dimensions inches (millimeters) unless otherwise noted16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow BodyPackage Number M16A16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M16DF a irch ild d o e s n o t a ssu m e a n y re spo n sib ility fo r u se o f a n y circu itry de scrib e d , n o circu it pa ten t lice nse s a re im p lie d a nd F a irch ild re se rv e s the rig h t a t a n y tim e w ith ou t n o tice to cha n g e sa id circu itry an d sp e cifica tio n s.C D 4043B C • C D 4044B C Q u a d 3-S T A T E N O R R /S L a t c h e s • Q u a d 3-S T A T E N A N D R /S L a t c h e sLIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into thebody, or (b) support or sustain life, and (c) whose failureto perform when properly used in accordance withinstructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or Physical Dimensions inches (millimeters) unless otherwise noted (Continued)16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” WidePackage Number N16E。