中科院 微电子机械系统设计(MEMS)课件

MEMS may involve large arrays of microfabricated elements
DNA array, infrared imaging devices, both reflective and refractive projection displays
Examples of MEMS Devices
inkjet-printer cartridges accelerometers Microengines inertial sensors micromirrors, optical scanners fluid pumps, chemical, pressure and flow
sensors. Biosensors
Density (and performance, broadly defined) of digital integrated circuits increases by a factor of two every year.
Moore’s Law
Moore’s Law
In the 1990s the number of transistors on microprocessors continued to double nearly every 18 months. The rate of change followed an early prediction made by American semiconductor pioneer Gordon Moore. In 1965 Moore predicted that the number of transistors on a computer chip would double every year, a prediction that has come to be known as Moore’s Law. In the mid-1990s chips included the Intel Pentium Pro, containing 5.5 million transistors; the UltraSparc-II, by Sun Microsystems, containing 5.4 million transistors; the PowerPC620, developed jointly by Apple, IBM, and Motorola, containing 7 million transistors; and the Digital Equipment Corporation's Alpha 21164A, containing 9.3 million transistors. By the end of the decade microprocessors contained many millions of transistors, transferred 64 bits of data at once, and performed billions of instructions per second.
Dimensional Ranges
1 mm < L < 300 mm lateral dimensions
Surface micromachined structures … “classic MEMS”
300 mm < L < 3 mm
Bulk silicon/wafer bonded structures … still call them MEMS and cover them in this course
Energy density scaling for this type of motor indicated performance degradation as dimensions were reduced …
Materials incompatibility with Stanford’s Microelectronics Lab research focus on electronic devices became a major issue
Other Batch Fabrication
Processes
Historically, there aren't that many examples outside of chemical processes
However, that’s changing:
Soft (rubber-stamp) lithography Parallel assembly processes enable low-cost
Planar IC Technology
Harvey Nathanson and William Newell, got a surface-micromachined resonant gate transistor,
(Westinghouse, 1965)
The device operates a high-Q electromechanical filter
What are the Goals of this Course?
Accessible to a broad audience minimal prerequisites
Design emphasis exposure to the techniques useful in analytical design of structures,transducers, and process flows
on Thursdays and due the following Thursday at the class beginning Exam: (TBA) Office Hours: (TBA) Credit breakdown (approximate)
10% homework 30% final Project 60% final exam
3. Lateral dimensions defined by photolithography, a
process derived from offset printing Result: CMOS integrated circuits became the
ultimate “enabling technology” by circa 1980 Moore’s Law
Perspective on MEMS research and commercialization circa
Course Mechanics
Lectures: Monday, Wednesday 10:00-12:00 Homework: bi-weekly assignments distributed
10 nm < L < 1 mm Nano electromechanical systems … NEMS
Batch Fabrication Technology
Planar integrated circuit technology 1958 -
1. Thin-film deposition and etching 2. Modification of the top few mm of the substrate
Did Harvey hear about Richard Feynman’s talk in 1959? I don’t think so …
Planar IC Technology
Planar IC Technology
Why Didn’t MEMS Take Off
in 1965?
Resonant gate transistor was a poor on-chip frequency reference metals have a high temperature sensitivity and don’t have a sharp resonance (low-Q) … specific application didn't “fly”
In 1968, Robert Newcomb (Stanford, now Maryland)proposed and attempted to fabricate a surface micromachined electromagnetic motor after seeing the Westinghouse work
Textsbook: 1. Stephen D. Senturia, Microsystem Design,
Kluwer Academic Press, 2001 2. Course Reader (Selected Reference Papers)
Part 1
Introduction to MEMS
Lecture Outline
Today’s Lecture
What is MEMS Historical tour of MEMS MEMS and nanotechnology
MEMS Defined
Micro ElectroMechanical Systems
What is MEMS
Introduction to MEMS Spring 2012
Weidong Yi
Design, Analysis , Fabrication
Course Overview
Part 1 Introduction to MEMS Part 2 Microfabrication Fundamentals Part 3 Microsystem Fabrication Processes Part 4 Mechanics, and Transduction Part 5 Electronic Interface Design Principles Part 6 MEMS Design Case Studies