tl082

TL082与TL072的区别先看意法半导体公司的ＴＬ０８２内部等效电路（见图一）：再看意法半导体公司的ＴＬ０７２内部等效电路（见图二）：怎么看这两个图中的电路都是一样的，若不是图一右侧标注“１/２ＴＬ０８２”、图二右侧标注“１/２ＴＬ０７２”，大家可能误会我将同一份图纸粘贴了两次。

下面看摩托罗拉半导体公司的ＴＬ０８２和ＴＬ０７２内部等效电路（见图三）、德州仪器公司的ＴＬ０８２和ＴＬ０７２内部等效电路（见图四）：大家会发现很有趣：不同厂家的同型号产品电路结构不一样，相同厂家的不同型号产品电路结构相同。

下面我们看意法半导体公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 1. 2. ”），查遍“输入失调电压”、“输入失调电压温度漂移”、“输入失调电流”、“输入偏置电流”、“大信号电压增益”、“供电电压变动抑制比”、“单通道空载供电电流”、“输入共模电压范围”、“共模抑制比”、“输出短路电流”、“输出电压摆幅”、“转换速率”、“上升时间”、“过冲”、“增益带宽积”、“输入阻抗”、“总谐波失真”、“等效输入噪声电压”、“相位裕量”、“通道隔离度”，逐项对比，未发现有何不同。

对比一下摩托罗拉半导体公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 3. 4. ”），发现“输入失调电压”项ＴＬ０８２是小于１５ｍＶ（全温度范围是小于２０ｍＶ），而ＴＬ０７２是小于１０ｍＶ（全温度范围是小于１３ｍＶ）；“输入失调电流”项ＴＬ０８２是小于２００ｐＡ（全温度范围是小于５ｎＡ），而ＴＬ０７２是小于５０ｐＡ（全温度范围是小于２ｎＡ）；“输入偏置电流”项ＴＬ０８２是小于４００ｐＡ（全温度范围是小于１０ｎＡ），而ＴＬ０７２是小于２００ｐＡ（全温度范围是小于７ｎＡ）。

再对比一下德州仪器公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 5. 6. ”），发现“输入失调电压”项ＴＬ０８２是小于１５ｍＶ（全温度范围是小于２０ｍＶ），而ＴＬ０７２是小于１０ｍＶ（全温度范围是小于１３ｍＶ）；“输入失调电流”项ＴＬ０８２是小于２００ｐＡ（全温度范围是小于２０ｎＡ），而ＴＬ０７２是小于１００ｐＡ（全温度范围是小于２０ｎＡ）；“输入偏置电流”项ＴＬ０８２是小于４００ｐＡ（全温度范围是小于５０ｎＡ），而ＴＬ０７２是小于２００ｐＡ（全温度范围是小于５０ｎＡ）；“供电电压变动抑制比”和“共模抑制比”项ＴＬ０８２是８６ｄＢ（典型值），而ＴＬ０７２是１００ｄＢ（典型值）；“单通道空载供电电流”项ＴＬ０８２是小于２.８ｍＡ，而ＴＬ０７２是小于２.５ｍＡ；由上述可知：ＴＬ０７２比ＴＬ０８２略微精密一点，省电一点，也就那么一点点，甚至没有差别。

PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)5962-9851501Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851501QPA ACTIVE CDIP JG81TBD A42N / A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851503QCA ACTIVE CDIP J141TBD Call TI Call TI TL081ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG8TBD Call TI Call TITL081ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 1Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TI TL081ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 2Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081MFKB OBSOLETE LCCC FK20TBD Call TI Call TITL081MJG OBSOLETE CDIP JG8TBD Call TI Call TITL081MJGB OBSOLETE CDIP JG8TBD Call TI Call TITL082ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 3Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG8TBD Call TI Call TITL082CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITL082CPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 427-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG8TBD Call TI Call TITL082IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type TL082MJG ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL082MJGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL084ACD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084ACDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRE4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084BCNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084CDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWG4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRG4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084MFK ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MJ ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084MJB ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084QD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and27-Apr-2012 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :•Catalog: TL082, TL084•Automotive: TL082-Q1, TL082-Q1•Military: TL082M, TL084MNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects•Military - QML certified for Military and Defense ApplicationsTAPE AND REELINFORMATION *Alldimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL081IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082CPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL084ACDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084ACDR SOIC D 142500330.016.4 6.59.0 14-Jul-2012DevicePackage Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL084ACNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084BCDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084CPWR TSSOPPW 142000330.012.4 6.9 5.6 1.68.012.0Q1TL084IDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084QDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL081ACDRSOIC D 82500340.5338.120.6TL081BCDRSOIC D 82500340.5338.120.6TL081CDRSOIC D 82500340.5338.120.6TL081CPSRSO PS 82000367.0367.038.0TL081IDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500367.0367.035.0TL082ACPSRSO PS 82000367.0367.038.0TL082BCDRSOIC D 82500340.5338.120.6TL082CDR SOIC D 82500340.5338.120.6 14-Jul-2012DevicePackageType Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL082CDRSOIC D 82500367.0367.035.0TL082CPSRSO PS 82000367.0367.038.0TL082CPWRTSSOP PW 82000367.0367.035.0TL082IDRSOIC D 82500367.0367.035.0TL082IDRSOIC D 82500340.5338.120.6TL082IPWRTSSOP PW 82000367.0367.035.0TL084ACDRSOIC D 142500333.2345.928.6TL084ACDRSOIC D 142500367.0367.038.0TL084ACNSRSO NS 142000367.0367.038.0TL084BCDRSOIC D 142500333.2345.928.6TL084CDRSOIC D 142500333.2345.928.6TL084CNSRSO NS 142000367.0367.038.0TL084CPWRTSSOP PW 142000367.0367.035.0TL084IDRSOIC D 142500333.2345.928.6TL084QDR SOIC D 142500367.0367.038.0 14-Jul-2012IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components 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电子设计报告设计说明书设计题目：TL082的测试与应用专业：电子信息科学与技术作者：指导教师：年月日摘要器件应用到商业、工业、军事工业各方面。

它的特点有：低功耗，广泛通用模式和电压变化范围；输入偏置低和低补偿失调电流；有输出短路保护；高输入阻抗；内置频率补偿；速度快；输入电源电压通用等。

一、芯片介绍现有型号TL082CP，该运放采用DIP8的封装形式，各引脚如图1。

23184U1ATL08265748U1BTL082图1 TL082系列DIP8封装引脚图二、仪器放大器的设计与工作原理仪器放大器是在差分放大的基础上发展起来的一种比较完善的放大器,作为已成型的仪器放大器,其内部由三个运放和一些精密电阻构成,其图如1所示:A1,A2为高输入阻抗的同相放大器,A3为差动放大器.但这里的同相放大器所不同的是每个同相放大器的反相端的接地电阻Rg并不直接接地,而是这两个放大器的反相端通过变阻器Rg连在一起.下面的分析可以说明证明这样接的必要性.利用迭加原理可以导出仪器放大器的理想放大特性，首先令输入U i 2=0，求在U i 1作用下A1,A2的输出电压。

由于U i 2=0，B 点的电压U B =0，可见A1是有R1和R2构成的同相放大器其输出电压为：1/)21(1'1R R R UU i o +=有由于A 点的电压U A =U i 1，U i 2=0，则运放 A2是由R1和R3构成的反相放大器，其输出电压为：'2U o =U i 1-R3/R1然后令U i 1=0，求在U i 2作用下A1,A2的输出电压。

由于U B =U i 2，U i 1=0，则A1是有R1和R2构成的反相放大器其输出电压为：''o1U=Ui 2-R2 / R1又由于U i 1=0，则U A =0，可见运放A2是由R1和 R3构成的同相放大器，其输出电压为''2Uo = U i 2（R1+R3/R1当在 U i 1和U i 2同时作用下，A1和A2的输出电压为： U o 1= '1Uo +''o1U =1/)21(1R R R Ui +Ui 2-R2/R1U o 2= '2U o +''2Uo =Ui 1-R3/R1 +Ui 2（R1+R3）/R1A3为差动放大器，取匹配电阻R5=R4,R7=R6,则仪器放大器总的输出电压为 U o =（Uo 1Uo 2-）R6/R4 =(U i 2Ui 1-)R6(R1+R2+R3)/R1R4由此可得出仪器放大器的放大倍数为A I=14)321(6R R R R R R ++可见，仪器放大器只要求R4=R5,R6=R7两个电阻匹配条件。

TL082是一通用的J-FET双运算放大器。

其特点是：●较低的办入偏置电压和偏置电流；●输出设有短路保护电路；●输入级具有较高的输入阻抗；●内建频率补偿电路；●较高的压摆率:16V/us(典型值);●最大工作电压：Vccmax=+/-18V.TL082典型应用电路LM324LM324引脚图简介：LM324系列器件为价格便宜的带有真差动输入的四运算放大器。

与单电源应用场合的标准运算放大器相比，它们有一些显著优点。

该四放大器可以工作在低到3.0伏或者高到32伏的电源下，静态电流为MC1741的静态电流的五分之一。

共模输入范围包括负电源，因而消除了在许多应用场合中采用外部偏置元件的必要性。

每一组运算放大器可用图1所示的符号来表示，它有5个引出脚，其中“+”、“-”为两个信号输入端，“V+”、“V-”为正、负电源端，“Vo”为输出端。

两个信号输入端中，Vi-（-）为反相输入端，表示运放输出端Vo的信号与该输入端的位相反；Vi+（+）为同相输入端，表示运放输出端Vo的信号与该输入端的相位相同。

LM324的引脚排列见图2。

参数描述：运放类型:低功率放大器数目:4 带宽:1.2MHz 针脚数:14 工作温度范围:0°C to +70°C 封装类型:SOIC 3dB带宽增益乘积:1.2MHz 变化斜率:0.5V/μs 器件标号:324 器件标记:LM324AD 增益带宽:1.2MHz 工作温度最低:0°C 工作温度最高:70°C 放大器类型:低功耗温度范围:商用电源电压最大:32V 电源电压最小:3V 芯片标号:324 表面安装器件:表面安装输入偏移电压最大:7mV 运放特点:高增益频率补偿运算逻辑功能号:324 额定电源电压, +:15V LM324的特点： 1.短路保护输出 2.真差动输入级 3.可单电源工作：3V-32V 4.低偏置电流：最大100nA 5.每封装含四个运算放大器。

TL082Wide Bandwidth Dual JFET Input Operational AmplifierGeneral DescriptionThese devices are low cost,high speed,dual JFET input op-erational amplifiers with an internally trimmed input offset voltage (BI-FET II ™technology).They require low supply current yet maintain a large gain bandwidth product and fast slew rate.In addition,well matched high voltage JFET input devices provide very low input bias and offset currents.The TL082is pin compatible with the standard LM1558allowing designers to immediately upgrade the overall performance of existing LM1558and most LM358designs.These amplifiers may be used in applications such as high speed integrators,fast D/A converters,sample and hold cir-cuits and many other circuits requiring low input offset volt-age,low input bias current,high input impedance,high slew rate and wide bandwidth.The devices also exhibit low noise and offset voltage drift.Featuresn Internally trimmed offset voltage:15mV n Low input bias current:50pAn Low input noise voltage:16nV/√Hz n Low input noise current:0.01pA/√Hz n Wide gain bandwidth:4MHz n High slew rate:13V/µs n Low supply current: 3.6mA n High input impedance:1012ΩnLow total harmonic distortion A V =10,:<0.02%R L =10k,V O =20Vp −p,BW =20Hz−20kHzn Low 1/f noise corner:50Hzn Fast settling time to 0.01%:2µsTypical Connection Connection DiagramSimplified SchematicBI-FET II ™is a trademark of National Semiconductor Corp.DS008357-1DIP/SO Package (Top View)DS008357-3Order Number TL082CM or TL082CP See NS Package Number M08A or N08EDS008357-2April 1998TL082Wide Bandwidth Dual JFET Input Operational Amplifier©1999National Semiconductor Corporation Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage±18V Power Dissipation(Note2) Operating Temperature Range0˚C to+70˚C T j(MAX)150˚C Differential Input Voltage±30V Input Voltage Range(Note3)±15V Output Short Circuit Duration Continuous Storage Temperature Range−65˚C to+150˚C Lead Temp.(Soldering,10seconds)260˚C ESD rating to be determined.Note1:“Absolute Maximum Ratings”indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional,but do not guarantee specific performance limits.DC Electrical Characteristics(Note5)Symbol Parameter Conditions TL082C UnitsMin Typ MaxV OS Input Offset Voltage R S=10kΩ,T A=25˚C515mVOver Temperature20mV ∆V OS/∆T Average TC of Input Offset R S=10kΩ10µV/˚C VoltageI OS Input Offset Current T j=25˚C,(Notes5,6)25200pAT j≤70˚C4nA I B Input Bias Current T j=25˚C,(Notes5,6)50400pAT j≤70˚C8nA R IN Input Resistance T j=25˚C1012ΩA VOL Large Signal Voltage Gain V S=±15V,T A=25˚C25100V/mVV O=±10V,R L=2kΩOver Temperature15V/mV V O Output Voltage Swing V S=±15V,R L=10kΩ±12±13.5V V CM Input Common-Mode Voltage V S=±15V±11+15V Range−12V CMRR Common-Mode Rejection Ratio R S≤10kΩ70100dB PSRR Supply Voltage Rejection Ratio(Note7)70100dB I S Supply Current 3.6 5.6mAAC Electrical Characteristics(Note5)Symbol Parameter Conditions TL082C UnitsMin Typ Max Amplifier to Amplifier Coupling T A=25˚C,f=1Hz-−120dB20kHz(Input Referred)SR Slew Rate V S=±15V,T A=25˚C813V/µs GBW Gain Bandwidth Product V S=±15V,T A=25˚C4MHz e n Equivalent Input Noise Voltage T A=25˚C,R S=100Ω,25nV/√Hzf=1000Hzi n Equivalent Input Noise Current T j=25˚C,f=1000Hz0.01pA/√HzNote2:For operating at elevated temperature,the device must be derated based on a thermal resistance of115˚C/W junction to ambient for the N package.Note3:Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.Note4:The power dissipation limit,however,cannot be exceeded.Note5:These specifications apply for V S=±15V and0˚C≤T A≤+70˚C.V OS,I B and I OS are measured at V CM=0.Note6:The input bias currents are junction leakage currents which approximately double for every10˚C increase in the junction temperature,T j.Due to the limited production test time,the input bias currents measured are correlated to junction temperature.In normal operation the junction temperature rises above the ambient temperature as a result of internal power dissipation,P D.T j=T A+θjA P D whereθjA is the thermal resistance from junction to e of a heat sink is recom-mended if input bias current is to be kept to a minimum.Note7:Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with common practice.V S=±6V to±15V.2Typical Performance CharacteristicsInput Bias CurrentDS008357-18Input Bias CurrentDS008357-19Supply CurrentDS008357-20Positive Common-Mode Input Voltage LimitDS008357-21Negative Common-Mode InputVoltage LimitDS008357-22Positive Current LimitDS008357-23Negative Current LimitDS008357-24Voltage SwingDS008357-25Output Voltage SwingDS008357-26 3Typical Performance Characteristics(Continued)Gain BandwidthDS008357-27Bode PlotDS008357-28Slew RateDS008357-29Distortion vs FrequencyDS008357-30Undistorted Output Voltage SwingDS008357-31Open Loop Frequency ResponseDS008357-32Common-Mode Rejection Ratio DS008357-33Power Supply Rejection RatioDS008357-34Equivalent Input Noise VoltageDS008357-35 4Typical Performance Characteristics(Continued)Pulse ResponseOpen Loop VoltageGain(V/V)DS008357-36Output ImpedanceDS008357-37Inverter Setting TimeDS008357-38 Small Signal InvertingDS008357-6Small Signal Non-InvertingDS008357-7 Large Signal InvertingDS008357-8Large Signal Non-InvertingDS008357-95Pulse Response(Continued)Application HintsThese devices are op amps with an internally trimmed input offset voltage and JFET input devices (BI-FET II).These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for clamps across the inputs.Therefore,large differential input voltages can easily be accommodated without a large increase in input current.The maximum differential input voltage is independent of the supply voltages.However,neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to flow which can result in a destroyed unit.Exceeding the negative common-mode limit on either input will cause a reversal of the phase to the output and force the amplifier output to the corresponding high or low state.Ex-ceeding the negative common-mode limit on both inputs will force the amplifier output to a high state.In neither case does a latch occur since raising the input back within the common-mode range again puts the input stage and thus the amplifier in a normal operating mode.Exceeding the positive common-mode limit on a single input will not change the phase of the output;however,if both in-puts exceed the limit,the output of the amplifier will be forced to a high state.The amplifiers will operate with a common-mode input volt-age equal to the positive supply;however,the gain band-width and slew rate may be decreased in this condition.When the negative common-mode voltage swings to within 3V of the negative supply,an increase in input offset voltage may occur.Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±6V power sup-plies.Supply voltages less than these may result in lower gain bandwidth and slew rate.The amplifiers will drive a 2k Ωload resistance to ±10V over the full temperature range of 0˚C to +70˚C.If the amplifier is forced to drive heavier load currents,however,an increase in input offset voltage may occur on the negative voltage swing and finally reach an active current limit on both posi-tive and negative swings.Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed unit.Because these amplifiers are JFET rather than MOSFET in-put op amps they do not require special handling.As with most amplifiers,care should be taken with lead dress,component placement and supply decoupling in order to ensure stability.For example,resistors from the output to an input should be placed with the body close to the input to minimize “pick-up”and maximize the frequency of the feed-back pole by minimizing the capacitance from the input to ground.A feedback pole is created when the feedback around any amplifier is resistive.The parallel resistance and capacitance from the input of the device (usually the inverting input)to AC ground set the frequency of the pole.In many instances the frequency of this pole is much greater than the expected 3dB frequency of the closed loop gain and consequently there is negligible effect on stability margin.However,if the feed-back pole is less than approximately 6times the expected 3dB frequency a lead capacitor should be placed from the out-put to the input of the op amp.The value of the added ca-pacitor should be such that the RC time constant of this ca-pacitor and the resistance it parallels is greater than or equal to the original feedback pole time constant.Current Limit (R L =100Ω)DS008357-10 6Detailed SchematicDS008357-11 Typical ApplicationsThree-Band Active Tone ControlDS008357-127Typical Applications(Continued)DS008357-13•All potentiometers are linear taper•Use the LF347Quad for stereo applicationsNote8:All controls flat.Note9:Bass and treble boost,mid flat.Note10:Bass and treble cut,mid flat.Note11:Mid boost,bass and treble flat.Note12:Mid cut,bass and treble flat.Improved CMRR Instrumentation AmplifierDS008357-14C and E are separate isolated groundsMatching of R2’s,R4’s and R5’s control CMRRWith A VT=1400,resistor matching=0.01%:CMRR=136dB•Very high input impedance•Super high CMRR8Typical Applications(Continued)Fourth Order Low Pass Butterworth FilterDS008357-15Fourth Order High Pass Butterworth FilterDS008357-169Typical Applications(Continued)Ohms to Volts ConverterDS008357-1710Physical Dimensions inches(millimeters)unless otherwise notedOrder Number TL082CMNS Package M08AOrder Number TL082CPNS Package N08E11NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507T L 082W i d e B a n d w i d t h D u a l J F E T I n p u t O p e r a t i o n a l A m p l i f i e rNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。

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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9851501Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9851501QPA ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9851503QCAACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL081ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8TBD Call TI Call TITL081ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CDRG4ACTIVESOICD82500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL081CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8TBD Call TI Call TITL081ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8TBD Call TI Call TITL082ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082ACPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDE4ACTIVESOICD875Green (RoHS &CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)TL082BCDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082BCPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082CP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082CPSR ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPSRG4ACTIVE SO PS 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPW ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWE4ACTIVE TSSOP PW 8150Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8TBDCall TI Call TITL082CPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDG4ACTIVESOICD875Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007OrderableDeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL082IDR ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IDRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8TBD Call TI Call TITL082IP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL082IPWR ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IPWRE4ACTIVE TSSOP PW 82000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeTL082MJG ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL082MJGB ACTIVE CDIP JG 81TBD A42SNPB N /A for Pkg Type TL084ACD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACDRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL084ACNSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4ACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TL084BCN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084BCNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type 23-Apr-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL084MFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MFKB ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type TL084MJ ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084MJB ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type TL084QD ACTIVE SOIC D 1450TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRACTIVESOICD142500TBDCU NIPDAULevel-1-220C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight inhomogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.23-Apr-2007TAPE AND REELINFORMATION3-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL081CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL081IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082ACDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082ACPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082BCDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082CDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082CPSR PS 8MLA 330168.2 6.6 2.51216Q1TL082CPWR PW 8MLA 330127.0 3.6 1.6812Q1TL082IDR D 8FMX 33012 6.4 5.2 2.1812Q1TL082IDR D 8MLA 33012 6.4 5.2 2.1812Q1TL082IPWR PW 8MLA 330127.0 3.6 1.6812Q1TL084ACDR D 14MLA 33016 6.59.0 2.1816Q1TL084ACDR D 14FMX 3300 6.59.0 2.1816Q1TL084ACNSR NS 14MLA 330168.210.5 2.51216Q1TL084BCDR D 14FMX 3300 6.59.0 2.1816Q1TL084CDR D 14FMX 3300 6.59.0 2.1816Q1TL084CNSR NS 14MLA 330168.210.5 2.51216Q1TL084CPWR PW 14MLA 330127.0 5.6 1.6812Q1TL084IDRD14FMX3306.59.02.1816Q13-May-2007TAPE AND REEL BOX INFORMATIONDevicePackagePins Site Length (mm)Width (mm)Height (mm)TL081ACDR D 8FMX 338.1340.520.64TL081BCDR D 8FMX 338.1340.520.64TL081CDR D 8FMX 338.1340.520.64TL081CPSR PS 8MLA 333.2333.228.58TL081IDR D 8FMX 338.1340.520.64TL082ACDR D 8FMX 338.1340.520.64TL082ACDR D 8MLA 338.1340.520.64TL082ACPSR PS 8MLA 333.2333.228.58TL082BCDR D 8FMX 338.1340.520.64TL082CDR D 8FMX 338.1340.520.64TL082CDR D 8MLA 338.1340.520.64TL082CPSR PS 8MLA 333.2333.228.58TL082CPWR PW 8MLA 338.1340.520.64TL082IDR D 8FMX 338.1340.520.64TL082IDR D 8MLA 338.1340.520.64TL082IPWR PW 8MLA 338.1340.520.64TL084ACDR D 14MLA 333.2333.228.58TL084ACDR D 14FMX 333.2333.228.58TL084ACNSR NS 14MLA 333.2333.228.58TL084BCDR D 14FMX 333.2333.228.58TL084CDR D 14FMX 333.2333.228.58TL084CNSR NS 14MLA 333.2333.228.58TL084CPWR PW 14MLA 338.1340.520.64TL084IDRD14FMX333.2333.228.583-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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TL082与TL072的区别先看意法半导体公司的ＴＬ０８２内部等效电路（见图一）：再看意法半导体公司的ＴＬ０７２内部等效电路（见图二）：怎么看这两个图中的电路都是一样的，若不是图一右侧标注“１/２ＴＬ０８２”、图二右侧标注“１/２ＴＬ０７２”，大家可能误会我将同一份图纸粘贴了两次。

下面看摩托罗拉半导体公司的ＴＬ０８２和ＴＬ０７２内部等效电路（见图三）、德州仪器公司的ＴＬ０８２和ＴＬ０７２内部等效电路（见图四）：大家会发现很有趣：不同厂家的同型号产品电路结构不一样，相同厂家的不同型号产品电路结构相同。

下面我们看意法半导体公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 1. 2. ”），查遍“输入失调电压”、“输入失调电压温度漂移”、“输入失调电流”、“输入偏置电流”、“大信号电压增益”、“供电电压变动抑制比”、“单通道空载供电电流”、“输入共模电压范围”、“共模抑制比”、“输出短路电流”、“输出电压摆幅”、“转换速率”、“上升时间”、“过冲”、“增益带宽积”、“输入阻抗”、“总谐波失真”、“等效输入噪声电压”、“相位裕量”、“通道隔离度”，逐项对比，未发现有何不同。

对比一下摩托罗拉半导体公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 3. 4. ”），发现“输入失调电压”项ＴＬ０８２是小于１５ｍＶ（全温度范围是小于２０ｍＶ），而ＴＬ０７２是小于１０ｍＶ（全温度范围是小于１３ｍＶ）；“输入失调电流”项ＴＬ０８２是小于２００ｐＡ（全温度范围是小于５ｎＡ），而ＴＬ０７２是小于５０ｐＡ（全温度范围是小于２ｎＡ）；“输入偏置电流”项ＴＬ０８２是小于４００ｐＡ（全温度范围是小于１０ｎＡ），而ＴＬ０７２是小于２００ｐＡ（全温度范围是小于７ｎＡ）。

再对比一下德州仪器公司关于ＴＬ０８２和ＴＬ０７２的参数表（详见“参考资料 5. 6. ”），发现“输入失调电压”项ＴＬ０８２是小于１５ｍＶ（全温度范围是小于２０ｍＶ），而ＴＬ０７２是小于１０ｍＶ（全温度范围是小于１３ｍＶ）；“输入失调电流”项ＴＬ０８２是小于２００ｐＡ（全温度范围是小于２０ｎＡ），而ＴＬ０７２是小于１００ｐＡ（全温度范围是小于２０ｎＡ）；“输入偏置电流”项ＴＬ０８２是小于４００ｐＡ（全温度范围是小于５０ｎＡ），而ＴＬ０７２是小于２００ｐＡ（全温度范围是小于５０ｎＡ）；“供电电压变动抑制比”和“共模抑制比”项ＴＬ０８２是８６ｄＢ（典型值），而ＴＬ０７２是１００ｄＢ（典型值）；“单通道空载供电电流”项ＴＬ０８２是小于２.８ｍＡ，而ＴＬ０７２是小于２.５ｍＡ；由上述可知：ＴＬ０７２比ＴＬ０８２略微精密一点，省电一点，也就那么一点点，甚至没有差别。