PCB加工能力统计表

PCB加工能力统计表加工能力统计表：项目内容批量极限1 层数 NO.OF LAYER 2～40层58层2 完成板尺寸（最大）FINISHED BOARD SIZE (MAX) 23″×41″(584mm×1041mm)23″×41″(584mm×1041mm)3 完成板尺寸（最小）FINISHED BOARD SIZE (MIN) 1″×1.2″(25mm×30mm)1″×1.2″(25mm×30mm)4 板厚度（最大）BOARD THICKNESS (MAX)0.236″ (6.0mm) 7.0mm5 板厚度（最小）BOARD THICKNESS (MIN)0.016″ (0.4mm) 0.016″ (0.4mm)6 芯片厚度（最小）T/C THICKNESS (MIN)0.039″ (0.1mm) 0.076mm7 成品厚度公差（板厚≥0.8mm）FINISHED BOARD THICKNESS TOLERANCE(BOARD THICKNESS≥0.8mm)±10% ±10%8 成品厚度公差（0.4mm≤板厚< 0.8mm）FINISHED BOARD THICKNESS TOLERANCE (0.4mm≤BOARD THICKNESS < 0.8mm)±3mil(±0.075mm) ±3mil(±0.075mm)9 板曲(最小)WARPAGE (min)0.7% 0.5%10 钻孔孔径(最大)DRILL HOLE DIAMETER (MAX)0.264″ (6.7mm) 0.264″ (6.7mm)11 钻孔孔径(最小) 指钻刀直径DRILL HOLE DIAMETER (MIN)0.0118″(0.30mm) 0.0118″(0.30mm)12激光钻孔孔径（最大）LASER DRILL HOLE DIAMETER（MAX）8mil8mil13激光钻孔孔径（最小）LASER DRILL HOLE DIAMETER（MIN）4mil4mil14激光钻孔纵横比（最大）LASER DRILL ASPECT RATION（MAX）1:11:115 完成孔径(最小)FINISHED VIA DIAMETER (MIN)0.008″ (0.20mm) 0.008″ (0.20mm)16 外层底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/3 OZ (0.012mm) 1/3 OZ (0.012mm)17 外层底铜厚度(最大)OUTER LAYER BASE COPPER THICKNESS (MAX)3 OZ (0.105mm) 3 OZ (0.105mm)18 内层底铜厚度(最小)INNER LAYER BASE COPPER THICKNESS (MIN)1/2 OZ (0.017mm) 1/2 OZ (0.017mm)19 内层底铜厚度(最大)INNER LAYER BASE COPPER THICKNESS (MAX)3 OZ (0.105mm) 3 OZ (0.105mm)20 绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN)0.039″ (0.1mm) 0.039″ (0.1mm)21 板料类型DIELECTRIC MATERIAL CEM-3; FR4(130℃ Tg); FR-4 (140℃ Tg); FR-4 (170℃ Tg);ROGERS 400322 孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX)8:1 12:123 孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH)±3mil(±0.076mm) ±2mil24 孔径公差(非镀通孔)HOLE DIAMETER TOLERANCE (NPTH)±2mil(±0.051mm) ±1mil25 孔位公差(与CAD数相比)HOLE POSITION TOLERANCE (COMPARED WITH CAD DATA)±3mil(±0.076mm) ±3mil(±0.076mm)26 孔壁铜厚(SMOBC)PTH HOLE COPPER THICKNESS(SMOBC)≥1mil (≥0.025mm) ≥1mil (≥0.025mm) 27 孔壁铜厚（全板镀金板）（盲孔板）≥0.6mil (≥0.015mm) ≥0.6mil (≥PTH HOLE COPPER THICKNESS(FLASH GOLD PLATING BOARD) （BLIND BOARD）0.015mm)28 外层设计线宽/间距（最小）OUTER LAYER DESIGN LINE WIDTH/SPACING(MIN) T/T OZ 4mil/4milH/H OZ 4mil/5mil1/1 OZ 6mil/6mil2/2 OZ 7mil/7mil3/3 OZ 8mil/8milT/T OZ 4mil/4milH/H OZ 4mil/5mil1/1 OZ 6mil/6mil2/2 OZ 7mil/7mil3/3 OZ 8mil/8mil29 内层设计线宽/间距（最小）INNER LAYER DESIGN LINE WIDTH/SPACING(MIN) H/HOZ 4mil/4mil1/1OZ 4mil/4mil2/2OZ 6mil/6mil3/3OZ 6mil/6milH/HOZ 4mil/4mil1/1OZ 4mil/4mil2/2OZ 6mil/6mil3/3OZ 6mil/6mil30 蚀刻公差 TOLERANCE AFTER ETCH ≥±20%31 图形对图形精度（最小）IMAGE TO IMAGE TOLERANCE (MIN)±5mil(±0.127mm) ±5mil(±0.127mm)32 外层图形对孔位精度（最小）IMAGE TO HOLE TOLERANCE (MIN)±4mil(±0.102mm) ±3mil(0.076mm)33 外层图形对板边精度（最小）IMAGE TO EDGE TOLERANCE (MIN)±6mil(±0.152mm) ±6mil(±0.152mm)34 孔位对孔位精度(最小)HOLE TO HOLE TOLERANCE(MIN) Фd < 1.0mm ±5mil(±0.127mm) ±3milФd ≥1.0mm ±3mil(±0.076mm) ±3mil(±0.076mm)35 孔位对板边精度(最小)HOLE TO EDGE TOLERANCE Фd < 1.0mm ±8mil(±0.204mm) ±8mil(±0.204mm) Фd ≥1.0mm ±6mil(±0.152mm) ±6mil(±0.152mm)36 阻焊对位精度公差SOLDERMASK REGISTRATION ±2mil ±2mil37 阻焊厚度（最小）SOLDERMASK THICKNESS (MIN)10μm 10μm38 阻焊桥宽（最小）SOLDERMASK DAM (MIN) 3mil(0.076mm) (C-7)2.5mil(0.0635mm)3mil(0.076mm) (C-7)2.5mil(0.0635mm)39 阻焊塞孔孔径SOLDERMASK PLUG HOLE DIAMETER ≥0.75孔内上锡SOLDER IN HOLE≤0.75 无锡珠NO SOLDER BALL≥0.75孔内上锡SOLDER IN HOLE≤0.75 无锡珠NO SOLDER BALL40 金插头开窗到阻焊盘窗（最小）SPACING BETWEEN GOLD FINGER & SOLDERMASK PAD (MIN)8mil (0.203mm) 8mil (0.203mm)41 金插头镀镍厚度（最大）GOLD FINGER NICKEL THICKNESS (MAX)200μin(5μm) 200μin(5μm)42 金插头镀金厚度（最大）GOLD FINGER GOLD THICKNESS (MAX)60μin(1.5μm) 60μin(1.5μm)43 金插头高度（最大）GOLD FINGER HEIGHT(BOARD EDGE TO TOP OF GOLD FINGER) (MAX)10"(254mm) 10"(254mm)44 金插头倒边深度公差（最小）TOLERANCE OF CHAMFER DEPTH (MIN) ±7mil(±0.178mm)< 30°±5mil(±0.127mm)≥30°±7mil < 30°±5mil ≥30°45 金插头倒边角度及公差RANGE OF CHAMFER ANGLE & TOLERANCE15°～75°±5°±1°46 金插头与相邻TAB间距（最小）SPACING BETWEEN GOLD FINGER WITH TAB (MIN)0.250"(6.35mm) 0.250"(6.35mm)47 沉镍/金镍厚（最薄点）（最大）NICKEL THICKNESS FOR ELECTROLESS NICKEL AND IMMERSION GOLD(MEASURED AT THE MINIMUM POINT) (MAX)150μin(3.8μm) 150μin(3.8μm)48 沉镍/金金厚（最薄点）（最大）GOLD THICKNESS FOR ELECTROLESS NICKEL AND IMMERSION GOLD(MEASURED AT THE MINIMUM POINT) (MAX)4μin(0.1μm) 4μin(0.1μm)49 全板镀金（薄金）镍厚（最薄点）（最大）NICKEL THICKNESS FOR FLASH GOLD PLATING(SOFT GOLD) (MEASURED AT THE MINIMUM POINT) (MAX)200μin(5μm) 200μin(5μm)50 全板镀金（薄金）金厚（最薄点）（最大）GOLD THICKNESS FOR FLASH GOLD PLATING2μin(0.05μm) 2μin(0.05μm)(SOFT GOLD) (MEASURED AT THE MINIMUM POINT) (MAX)51 全板镀金（厚金）镍厚（最薄点）（最大）NICKEL THICKNESS FOR FLASH GOLD PLATING(HARD GOLD) (MEASURED AT THE MINIMUM POINT) (MAX)200μin(5μm) 200μin(5μm)52 全板镀金（厚金）金厚（最薄点）（最大）GOLD THICKNESS FOR FLASH GOLD PLATING(HARD GOLD) (MEASURED AT THE MINIMUM POINT) (MAX)4μin(0.1μm) 4μin(0.1μm)53 锡厚（热风整平）（最大）SOLDER THICKNESS ON XFP (HAL) (MAX)100μin(2.54μm) 100μin(2.54μm)54 锡厚（热风整平）（最小）SOLDER THICKNESS ON PADS EXCEPT XFP.(MIN)40μin(1.0μm) 40μin(1.0μm)55 碳油阻抗CARBON INK RESISTANCE18Ω/□18Ω/□56 碳油间距（最小）SPACING FOR CARBON CONDUCTOR (MIN)15mil (0.375mm) 15mil (0.375mm)57 冲外形公差（边到边）（最小）PUNCHING DIMENSION TOLERANCE (EDGE TO EDGE) (MIN)±6mil (±0.152mm) ±6mil (±0.152mm)58 冲外形公差（孔到边）（最小）PUNCHING DIMENSION TOLERANCE(HOLE TO EDGE) (MIN)±5mil (±0.127mm) ±5mil (±0.127mm)59 铣外形公差（边到边）（最小）ROUTING DIMENSION TOLERANCE (EDGE TO EDGE) (MIN)±4mil (±0.101mm) ±2mil60 铣外形公差（孔到边）（最小）ROUTING DIMENSION TOLERANCE (HOLE TO EDGE) (MIN)±4mil (±0.101mm) ±4mil (±0.101mm)61 铣外形圆弧（内角）（最小）RADIUS BY ROUTING（INTERNAL ANGLE）(MIN)R≥16mil（0.4mm）R≥16mil（0.4mm）62 铣沉头孔孔径(当顶角角度为165°)(最大)COUNTERSINK HOLE SIZE（WHEN TOP ANGLE IS 165°）(MAX)0.25"(6.35mm) 0.25"(6.35mm)63 长槽宽度（最小）SLOT WIDTH （MIN）20mil (0.5mm) 20mil (0.5mm)64 长槽形状公差（沉铜）（当长度≥2×宽度+0.15mm）SLOT TOLERANCE（PTH）（L≥2W+0.15mm）±4mil (±0.10mm) ±4mil (±0.10mm)65 长槽形状公差（沉铜）（当长度<2×宽度+0.15mm）SLOT TOLERANCE（PTH）（L<2W+0.15mm）±6mil (±0.15mm) ±6mil (±0.15mm)66 V-槽筋厚公差（最小）V-CUT REMAINING THICKNESS TOLERANCE(MIN) 自动：±2mil (±0.05mm)手动：±4mil (±0.10mm)自动：±2mil手动：±4mil67 V-槽角度公差（30°～60°）（最小）V-CUT ANGLE TOLERANCE （30°～60°）(MIN)±5°±4°68 V-槽错位度（最小）V-CUT MISREGISTRATION （MIN）自动：±3mil (±0.076mm)手动：±5mil (±0.127mm)自动：±3mil手动：±5mil69 切割V-槽的板厚度（最小）BOARD THICKNESS THAT CAN BE V-CUT （MIN）24mil (0.6mm) 20mil (0.5mm)70 V-槽对孔公差（最小）V-CUT TO HOLE TOLERANCE （MIN）自动±5mil (±0.127mm)手动±6mil (±0.150mm)自动±5mil手动±6mil71 V-槽对V-槽位置公差（最小）V-CUT TO V-CUT LOCATION TOLERANCE （MIN）自动±4mil (±0.100mm)手动±5mil (±0.127mm)自动±4mil手动±5mil72 V-槽对板边公差（最小）V-CUT TO EDGE TOLERANCE（MIN）±5mil (±0.127mm) ±5mil (±0.127mm) 73 阻抗公差（最小）±10% ±10%4 其它/OTHERIMPEDANCE TOLERANCE （MIN ） 74 银厚(沉银)(范围)SILVER THICKNESS(RANGE)6-20μ" 6-20μ"项目内 容1表面处理METAL FINISHESa. 水平喷锡 HHALb. 垂直喷锡 VHALc. 有机涂布(ENTEK CU 106A)ORGANIC COATING (ENTEK CU 106A) d. 沉镍/金ELECTROLESS NICKEL/IMMERSION GOLD e. 碳浆CARBON INK f. 全板镀金(软金)FLASH GOLD (SOFT GOLD) g. 全板镀金(硬金)FLASH GOLD (HARD GOLD) h. 蓝胶PEELABLE SOLDERMASK i. 沉银IMMERSION SILVER 2 内层处理INNER LAYER TREATMENT a. 黑化 BLACK OXIDE棕化 OXIDE REPLACEMENT 3 镀通孔 PTHa.无电沉铜ELECTROLESS COPPER 4图形电镀PATTERN PLATINGa.图形电镀PATTERN PLATING项目 内 容 1 通断路测试电压 E-TEST VOLTAGE 10-250V2 短路电阻 ISOLATION RESISTANCE ≥10M Ω3 开路电阻 CONTINUITY RESISTANCE ≤25Ω4 铜线抗剥强度 COPPER TRACE PEEL STRENGTH ≥1.1N/mm5 阻焊硬度 SOLDERMASK HARDNESS ≥6H6 热应力测试THERMAL STRESS TEST288℃ 10sec 1次通过 7 自燃性 FLAMMABILITY 94V-O8 离子污染 IONIC CONTAMINATION≤6.45μg/in 2 (≤1.0μg/cm 2)。