E02158GJ型保护板原材料规格书A

1.CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONPRODUCT NAME: IT-158TC/IT-158BSOTHER / GENERIC NAME: Epoxy / glass composition, Copper Clad Laminate/Prepreg, Printed circuit board base material. CHEMICAL FAMILY: Epoxy resin, glass fabric.MANUFACTURER: ITEQ CorporationDongfang Road 168 , Nanfang Industrial Park,BEICE HUMEN Village,Town,DONGGUAN City,GUANGDONG Province,CHINA.CONTACT INFORMATION : For more information: Emergency / CHEMTRECPOSITION / INFORMATION ON INGREDIENTSINGREDIENT NAME: CAS# % w/wGlass cloth 65997-17-3 40~70%Copper foil 7440-50-8 VariationalCured diglycidyl ether of TBBPA Epoxy Resin 026265-08-7 20~40%Cured BPA Novolac Epoxy Resin 25068-38-6 20~40%This product does not contain reportable hazardous ingredients as defined by Rohs instruction and other hazardous substances, such as PCN, PCT, PCB, CP, Mirex, other organic chloride and bromide, organic tin compound, asbestos, azo compound, formaldehyde, TBBA(TBBPA), dioxins, Ozone Depleting Substances, antimony and other heavy metal or metal compound, and so on.For local ”Right to Know” compliance and other reasons, trace ingredients not listed above may appear in Section 15, Regulatory Information.3.HAZARDS IDENTIFICATIONEMERGENCY OVERVIEW: Non-flammable sheet materialDust caused by machining may irritate eyes, nose, or throat.POTENTIAL HEALTH HAZARDS:SKIN: Dust may cause minor irritation.EYES: Dust may cause minor irritation. Fumes may cause irritationINHALATION: Dust may cause respiratory irritationINGESTION: None known, none anticipated with normal handing.DELAYED EFFECTS: IARC has categorized continuous filament fiber glass as notClassifiable or probably non-carcinogenic (Group 3 ).Ingredients found on any of OSHA’s carcinogen lists are listed below.INGREDIENT NAME: NTP STATUS: IARC STATUS: OSHA LISTNone N/A N/A N/A4.FIRST AID MEASURESSKIN: Wash promptly with soap and running water. Do not rub or scratch.******************.cnIf irritation persists, consult physician.Remove contaminated clothing and wash thoroughly before reuseEYES: Flush immediately with plenty of low-pressure water for at least 20Minutes.Do not rub or scratch.If irritation persists, consult physician.INHALATION: Move to fresh air.Consult physician.INGESTION: If large amounts are ingested, consult physician.ADVICE TO PHYSICIAN:Treat symptomatically5.FIRE-FIGHTING MEASURESFLASH POINT: N/AFLASH POINT METHOD: N /AAUTOIGNITION TEMP: Not determined.UPPER FLAME LIMIT: N/ALOWER FLAME LIMIT: N/AFLAME PROPAGATION RATE: UL 94 V-0OSHA FLAMMABILITY CLASS: N/AEXTINGUISHING MEDIA: Water, CO2, foam, dry chemicalUNUSUAL FIRE ANDEXPLOSION HAZARDS: May give off toxic hydrogen bromide fumes when thermally decomposed. SPECIAL FIRE-FIGHTINGPROCEDURES: Wear proper protective equipment and self-contained breathing apparatus.6.ACCIDENTAL RELEASE MEASURESRESPONSE TO RELEASE: If material is not contaminated, return to container for use.If material is contaminated, pick up and place in container for disposal.Material is an article. Spill or release to the environment is unlikely.7.HANDLING AND STORAGENORMAL HANDLING: Always wear recommended personal protective equipment.STORAGE: Store in a cool dry place.8.ENGINEERING CONTROLS / PERSONAL PROTECTIONENGINEERING CONTROLS:VENTILATION: Adequate ventilation should be provided to keep dust concentrationswithin acceptable exposure limits. Discharge from the ventilationsystem should comply with applicable air pollution control regulation GENERAL: Eyewash fountains and safety showers should be easily accessible. PERSONAL PROTECTIVE EQUIPMENT:SKIN PROTECTION: Impervious gloves and clothing should be worn for prolonged orRepeated contact.EYE PROTECTION: Safety glassesRESPIRATORY PROTECTION:Atmospheric levels of fibrous glass, copper, and other dusts should bemaintained below recommended exposure guidelines.If airborne contaminant is likely to exceed acceptable limits, use aNIOSH-approved respirator.ADDITIONAL: N/A。

MATERIAL SAFETY DATA SHEET物质安全资料表1.CHEMICAL PRODUCT AND COMPANY IDENTIFICATION 产品和公司资料PRODUCT NAME: Copper Clad Laminate (S1150G)产品名称：覆铜箔层压板（S1150G）PRODUCT USE: Substrate for printed circuitry ;Multilayer Boards.用途：用于制作印制电路板；制作多层板NAME of COMPANY and ADDRESS:SHENGYI TECHNOLOGY CO.,LTD.; No.5 Western Industry Road New and high-tech Industrial Development Zone Dongguan SSL Sci.,Dongguan City ,Guangdong ,P.R.China公司名称及地址：广东生益科技股份有限公司;中国广东省东莞市松山湖高新科技产业开发区工业西路5号FOR MORE INFORMATION CALL: IN CASE OF EMERGENCY CALL:紧急联络电话：(Monday-Friday, 8:00am-5:00pm) (24 Hours/Day, 7 Days/Week)(0769)22271828(万江)\ 22899388(松山湖) (0769)22271828(万江)\ 22899388(松山湖)2.HAZARDS IDENTIFICATION 危害性资料EMERGENCY OVERVIEW:紧急情况概述：A nonflammable, sheet material. Dust, when machined or punched may cause skin or eye irritation. Fumes, if decomposed may irritate eyes, nose, and throat.是一种难燃的层压板。

5-7节锂电池二次保护IC概述HTL6217系列内置高精度电压检测电路和延迟电路，是用于锂离子可充电电池的二次保护IC。

通过将各节电池间短路，可适用于5节 ~7节电池的串联连接。

特点⏹针对各节电池的高精度电压检测电路过充电检测电压n(n=1~7)：3.60 V ~ 4.80 V (50 mV进阶)精度±25 mV (Ta = +25℃)精度±30 mV (Ta = -5︒C ~ +55︒C) 过充电滞后电压n(n=1~7)：0.1V ~ 0.4V (0.1V进阶)精度：±50mV⏹仅通过内置电路即可获得检测时的延迟时间 (不需要外接电容)⏹可选择过压检测延时时间：1s，2s，4s，6s⏹可选择输出方式：CMOS输出、NMOS漏极输出、PMOS漏极输出⏹可选择输出逻辑：动态 "H"、动态 "L"⏹可选断线保护功能⏹高耐压：绝对最大额定值40V⏹工作电压范围广： 4 V ~ 35V⏹工作温度范围广： Ta = -40︒C ~ +85︒C⏹消耗电流低各节电池V CUn -1.0 V时：5.0μA(最大值)(Tα = +25︒C)⏹无铅(Sn 100%)、无卤素应用锂离子可充电电池(二次保护用)5-7节锂电池二次保护IC 典型应用电路1、7节串联VCCVC7VC6VC5VC4 VC3 VC2 VC1 VSSCHC HTL6217系列R VCC R1C VCCC6C5C4C3C2C1BAT7 BAT6 BAT5 BAT4 BAT3 BAT2 BAT1SC PROTECTORFETEB+EB-R7R6R5R4R3R2C7R H2R H1图1 7节串联外接元器件参数No. 元器件最小值典型值最大值单位1 R1 ~ R7 0.5 1 10 kΩ2 C1 ~ C7 0.01 0.1 1 μF3 C VCC0.1 1 10 μF4 R VCC0.05 0.5 1 kΩ5 R H1，R H2 1 5 10 MΩ注意：1.上述参数有可能未经预告而改变。

Product feature :•0603 (1608 metric) compact design utilizes less board space•Halogen free, lead free and RoHS compliant•High inrush withstand capability •Fast-acting performance•Ampacity alpha mark on fuse for easy identification•Standard termination design for easy solderability•Compatible with standard lead-free solder reflow and wave soldering processes•Excellent environmental integrityApplicationsFor secondary circuit protection in spaceconstrained applications:• LCD Backlight inverters • Digital cameras • DVD Players • Bluetooth headsets •Battery packsAgency information•cURus Recognized Guide and Card JDXY2/JDYX8, File E19180Packaging•TR - Packaging code suffix for tape-and-reel (8 mm wide tape on 178mm diameter reel -specification EIA 481-1)•Quantity = 5000 fusesCC06HHigh I 2t Chip™ 0603 size fuses7 014PbTechnical Data 4346Effective June 2017CC06H High I2t Chip™ 0603 size fusesElectrical characteristicsAmp Rating% of Amp Rating Opening Time 1-8A100 4 Hours1-7A2001-60 Seconds1-8A250 5 Seconds Max SpecificationsPart NumberAmpRating5VoltageRating(Vdc)InterruptingRating1, 4(A)Typical ColdResistance2(Ω)TypicalPre-Arcing3(I2t)TypicalVoltageDrop(mV)TypicalPowerDissipation(W)AlphaMarkingAgencyInformation(cURus)CC06H1A132500.250.023100.32B x CC06H1.5A 1.532500.130.072500.38H x CC06H2A232500.0680.141700.38K x CC06H2.5A 2.532500.050.251550.38L x CC06H3A332500.0350.301300.38O x CC06H3.5A 3.532500.0230.501000.35R x CC06H4A432500.020.81100.45S x CC06H5A532500.013 1.6950.48T x CC06H6A632500.0076 2.6800.48V x CC06H7A732500.0056 3.3800.56X x CC06H8A832/2450/800.0040 4.5750.60Z x1.DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds, battery source).2.DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20°C -FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE WITHOUT NOTICE.3.Typical Pre-arcing I2t are measured at rated DC voltage, 10Incurrent (not to exceed interrupting rating).4.The insulation resistance after breaking capacity test is higher than 0.1MΩ when measured by 2X rated voltage.5.Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of rated current is recommended,with further design derating required at elevated ambient temperature. See Temperature Derating Curve on next page./el ectronics23Technical Data 4346Effective June 2017CC06HHigh I 2t Chip™ 0603 size fuses Time-current curves — average melt/el ectronics4Technical Data 4346Effective June 2017CC06HHigh I 2t Chip™ 0603 size fusesI 2t vs. time curvesI 2t (A 2s )5Technical Data 4346Effective June 2017CC06HHigh I 2t Chip™ 0603 size fuses I 2t vs. current curvesI 2t (A 2s )/el ectronics6Technical Data 4346Effective June 2017CC06HHigh I 2t Chip™ 0603 size fusesT emperature derating curve Product characteristicsOperating temperature -40 °C to +85 °C , with proper derating factor applied Storage temperature -40 °C to +85 °CLoad humidity MIL-STD-202G, Method 103B (1000 hr @ +85 °C / 85% RH & 10% rated current)Moisture resistance MIL-STD-202, Method 106E (50 cycles)Thermal shock MIL-STD-202, Method 107D (-65 °C to +125 °C, 100 cycles)Vibration testMIL-STD-202, Method 204D, Test Condition D (10-2,000 Hz)Mechanical shock resistance MIL-STD-202, Method 213B (3000 G / 0.3 ms)Salt spray resistance MIL-STD-202, Method 101, Test Condition B (48 h ou r exposure)Insulation resistance The insulation resistance after breaking capacity test is higher than 0.1 M Ω when measured by 2X rated voltage SolderabilityJ-STD-002C Method B1 (Dip and Look Test), Method G1 (Wetting Balance Test), Method D (Resistance to Dissolution / Dewetting of Metalization)Resistance to soldering heat MIL-STD-202, Method 210F (Solder dip +260 °C, 60 seconds / Solder Iron +350 °C, 3-5 seconds)High temperature life test MIL-STD-202G, Method 108A (1000 Hours @ +70 °C & 60% rated current)Resistance to solventsMIL-STD-202, Method 215KDimensions - mm (in)Drawing not to scale.0.47 ± 0.08Pad layoutA 0B 0D 0E 1E 2F G P 0P 1P 2T W 0.95±0.051.80±0.051.50+0.10,-0.01.75±0.106.25±0.303.50±0.050.75min.4.00±0.104.00±0.102.00±0.050.060±0.058.00±0.20*Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum.Solder reflow profileTechnical Data 4346Effective June 2017CC06HHigh I 2t Chip™ 0603 size fusesLife Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.EatonElectronics Division 1000 Eaton Boulevard Cleveland, OH 44122United States/electronics © 2017 EatonAll Rights Reserved Printed in USAPublication No. 4346 BU-SB14476 June 2017Eaton is a registered trademark.All other trademarks are property of their respective owners.。

规 格 书SPECIFICATION SHEETCUSTOMER(客户) DESCRIPTION （品名）PART NAME （名称） -产品型号-供应商代码-底板厂代码 PART NUMBER （编号） DATE （日期）填写送样日期CUSTOMER(客户)APPROVE （批准）CHECK （审核）以上由鑫优普填写 盖章处APPROVE （批准）CHECK （审核）ISSUE （编制）以上由供应商填写并加盖公章（公司章或者文件出据部门章均可）更改目录序号更改项类别变更内容变更原因1 无更改初版2 增加ID电阻更改前无ID电阻客户要求（2011.08.29）更改后有10KΩ ID电阻3 更改前更改后4 更改前更改后5 更改前更改后6 更改前更改后7更改前更改后以上填写要求：1）第一次送样，按序号1中项目填写2）以后每次更改需要完整填写更改项目更改前更改后内容及变更原因及注明日期3）第二次更改必须保留第一次更改的内容第三次更改必须保留第一次第二次更改内容，依次类推1-1. 原理图Schematic diagram ：1-2元件清单PCB Parts lis注明：1）ROHS 报告号码必须填写，且为正确并在有效使用范围内的ROHS 报告号码2）元件件厂商填写元器件厂家，而不是代理商名称，厂家送样承认后不能做任何更改（包括底板 IC MOS 电阻 电容）3）规格包括元器件值 公差 耐压值 功率等主要参数 4）以上红色部分只是范例，按实际填写即可序号 元件编号 元件名称规格封装形式 配量 RoHS 报告号 厂商1 PCB 电路板 注明PCB 尺寸及公差 注明PCB 工艺（如黑油喷锡板 绿油镀金板） 1 PCS SH901755/CHEM 吉瑞达2 U2 MOS 管 8205A SOT-23-6 1 PCSSH9197409/CHEM富晶 3 U1 控制IC DW01+ SOT-23-6 1 PCS CANEC1001922017 富晶 4 R1 贴片电阻 SMD 100Ω±5% 0603 1 PCS KA/2010/10205 国巨 5 R2 贴片电阻 SMD 1K Ω±5% 0402 1 PCS KA/2010/10205 国巨 6 R3 贴片电阻SMD 10K Ω±5%0603 1 PCS KA/2010/10205 国巨 7 C1 贴片电容 10V 0.1UF (+80%-20%) 06031 PCS KA/2010/10205国巨 8镍块B+/B-2.8*2.2*0.3MM(-0.1MM)2PCS9 五金镀金五金或贴片五金贴写五金数量 尺寸及公差五金工艺（镀金 钴金 沉金等） 五金镀金厚度 五金要求等例如：3PCS （3*2*0.6）-0.05mm 贴片五金 五金镀金厚度0.1um 48H 盐雾测试不氧化 冲压五金反贴（不注明反贴就是正贴 例如：镀金五金 镀哑金 五金镀金厚度0.1um 48H 盐雾测试不氧化1-3焊盘描述Pad descriptionSymbol DescriptionP+/P- Positive/ Negative connection pad of packB+/B- Positive/ Negative connection pad of batteryT Connection pad of 10K以上只需要标识出B+ B- COM B1 B2 B3…及输出P+ P- T端即可，不需要标识IC MOS 元器件位置1-4尺寸dimensionsNote: (unit: mm)1、No mark tolerances: +/-0.12、Material : FR-43、Total Thickness: 0.8 +0.1（根据要求填写）抓打样详细尺寸图纸1-5 PCB 走线图Circuit PCB diagramABCDDiagram of PCB fit togetherNOTE ：A----Top overlayerB---- Toplayer C---- Bottomlayer D----Bottom overlayer1-6 技术参数Technical Parmeter1.参数ParmeterDW01+ Ta=25℃值Value参数 Parameter最小Min 标准Type 最大Max 单位过充检测电压4.25V 4.30v 4.325V VOvercharge Testing Voltage过充恢复电压4.05V 4.10V 4.15V VOvercharge renew voltage过充保护延迟时间80ms 200s ms Overdischarge protect Voltage过放检测电压2.3V 2.40V 2.5V VOverdischarge testing Voltage过放恢复电压2.9V3.00V 3.1V VOverdischarge renew voltage过放保护延迟时间Overdischarge20ms 60ms ms protect prolong time过流保护检测电压0.147V 0.15V 0.153V mvOvercurrent testing Voltage过流保护延迟时间10ms 20ms ms Over current prolong time短路保护检测电压1.25V 1.35V 1.45V VShort testing Voltage短路保护延迟时间5μs 50μs μs Short protect prolong time内阻 Resistance60mΩmΩ以上根据IC配置正确填写测试：审核：日期：最终判定：样品检测报告样品型号: 配置: DW01+ \ 8205A \1K 测试日期测试环境温度:15 ℃湿度:65%保护板参数范围值:( NTC注明当前测试温度下阻值范围值)自耗电(uA) 过充 (V) 过充恢复(V) 过放 (V) 过放恢复(V) 过流(A) 内阻（mΩ）ID(15 ℃) 2-6 4.25-4.35 4.05-4.15 2.3-2.5 2.9-3.1 2.1-6 20-60 1K测试仪器：泰斯锂电保护板测试仪序号过充 (V) 过充恢复(V)过放 (V) 过放恢复(V) 过流(A) 内阻（mΩ）自耗电(uA)ID 判定1. 4.321 4.0952.3353.05 3.27 53 3.10 1K ok2. 4.326 4.102 2.3553.01 3.22 53 3.45 1K ok3. 4.324 4.106 2.3650 2.97 3.21 54 3.90 1K ok4. 4.322 4.098 2.320 3.02 3.36 55 4.10 1K ok5. 4.315 4.104 2.395 2.96 3.33 55 4.10 1K ok PCB尺寸标准:34±0.3*5.3±0.1*0.8mm±0.10PCB尺寸测量: 1: 2: 3:4: 5:测试：审核：日期:客户测试数据：序号过充(V)过充恢复(V) 过放 (V) 过放恢复(V) 过流(A) 内阻（mΩ）自耗电(uA)ID 判定12345PCB尺寸测量: 1: 2: 3:4: 5:。

CABLE GLAND FOR USE WITH UNARMOURED AND BRAID ARMOURED CABLESINCORPORATING EU DECLARATION OF CONFORMITY TO DIRECTIVE 2014/34/EUTECHNICAL DATACABLE GLANDTYPES A2e100RA2e100INSTALLATION INSTRUCTIONS FOR A2e100, RA2e100 CABLE GLANDGlasshouse Street • St. Peters • Newcastle upon Tyne • NE6 1BSTel: +44 191 265 7411 • Fax: +44 1670 715 646E-Mail:********************************.uk•Web:Notified Body: Sira Certification Service, Unit 6, Hawarden Industrial Park, Hawarden, CH5 3US, UK0518CABLE GLAND TYPE : A2e100, RA2e100INGRESS PROTECTION: IP66, IP67, IP68PROCESS CONTROL SYSTEM : BS EN ISO 9001ISO/IEC 80079-34:2011C M PD o c u m e n t N o . F I 493 I s s u e 4Logo’s shown for illustration purposes only. Please check certification for detailsEN 60079-0:2012/A11:2013, EN 60079-7:2015, EN 60079-15:2010, EN 60079-31:2014, BS 6121:1989, EN 62444:2013David Willcock - Certification Engineer (Authorised Person)CMP Products Limited, Cramlington, UK, NE23 1WHSCAN FOR INSTALLATION VIDEOSEXPLOSIVE ATMOSPHERES CLASSIFICATIONATEX CERTIFICATION No : SIRA16ATEX3165, SIRA16ATEX4020ATEX CERTIFICATION CODE : ^ II 2G Ex eb IIC Gb, II 1D Ex ta IIIC Da IP66, IP67, IP68^ II 3G Ex nRc IIC Gc IP66 ^ I M2 Ex eb I Mb IP66, IP67, IP68IECEx CERTIFICATION No : IECEx SIR 16.0053IECEx CERTIFICATION CODE : Ex eb IIC Gb, Ex ta IIIC Da, Ex nRc IIC Gc, Ex eb I Mb IP66, IP67, IP68A2e100 - no face seal RA2e100 - with face seal1. Read all instructions before beginning installation. Installation shall only be performed by competent, suitably trained personnel (in accordance with EN/IEC 60079-14) using the correct tools; spanners should be used for tightening.2.Inspection and maintenance shall only be performed by competent, suitably trained personnel (in accordance with EN/IEC 60079-14 (Initial Inspection) and EN/IEC 60079-17).3.Ingress Protection Statement; The interface between a cable entry device and its associated enclosure / cable entry cannot be defined. It is the user’s responsibility to ensure that a minimum protection level (IP54 for explosive gas atmospheres and IP6X for explosive dust atmospheres) is maintained at the interface. Entry component threads may need additional sealing to maintain the ingress protection rating and/orrestricted breathing performance as applicable to the equipment to which it will be attached, such as by either a sealing washer, thread sealant or integrated ‘O’ ring face seal (RA2e100). Reference should also be made to the information from EN 60079-14:2014, Clause 10, Table 10, (Note: When fitted to a threaded entry, all tapered threads will automatically provide an ingress protection rating of IP6X).4. The standard product temperature range is -60°C to +130°C. The equipment should not be used outside of this range.5. Cable glands do not have any serviceable parts and are therefore not intended to be repaired.6. Cable glands are manufactured from Brass, Nickel Plated Brass, Stainless Steel, Mild Steel or Aluminium, with Silicone seals. The end user shall consider the performance of these materials with regard to attack by aggressive substances that may be present in the hazardous area. Consideration should be given to potential degradation due to galvanic corrosion at the interface of dis-similar metallic materials.7.It is the end user’s responsibility to ensure the equipment materials are suitable for their final installation location. If in doubt consult CMP Products Limited.IMPORTANT NOTES FOR INSTALLERSSPECIAL CONDITIONS FOR SAFE USE None INSTALLATION INSTRUCTIONS FOR CMP CABLE GLAND A2e100, RA2e100CABLE GLAND COMPONENTS - It is not necessary to dismantle the cable gland any further than illustrated below 1. Entry Item 2. Seal 3. Seal NutPLEASE READ ALL INSTRUCTIONS CAREFULLY BEFORE BEGINNING THE INSTALLATION1. It is not necessary to dismantle the gland any further than illustrated below.where required to reveal the insulated conductors.4. Slacken the seal nut (3) to relax the seal (2).5. Only using finger pressure, tighten the seal nut until light resistance to tightening is met.Then either use the seal tightening guide tape or table on the rear of the page to determine how much further to tighten the seal using a spanner (using the outer seal tightening guide is recommended).Wrap the seal tightening guide tape around the cable to show the amount of spanner turns needed (as shown here). Make sure the correct side of the seal tightening guide tape is used depending on the cable gland size.。

编号：JK/J.JK-BXAXSXP.09版本：2.2锂电池主动均衡保护板JK-BD6AxxS-6P/JK-BD6AxxS-8PJK-BD6AxxS-10P/JK-BD6AxxS-15PJK-BD6AxxS-20P/JK-B1AxxS-15PJK-B2AxxS-15P/JK-B2AxxS-20P使用维护说明书成都极空科技有限公司产品保修条款产品名称：锂电池智能保护板保修期限：壹年首先，感谢您购买成都极空科技有限公司推出的锂电池智能保护板产品。

成都极空科技有限公司对由本公司出售的硬件产品和附件提供质量保修，保修期限如上所示。

在保修期内如果出现因质量原因而产生故障，公司在收到关于产品故障的通知并经查验核实后，有权选择维修或整套更换产品。

整套更换的产品可是新件或接近新件。

1.成都极空科技有限公司保证产品经过充分测试。

2.成都极空科技有限公司不保证在产品修理过程中产品可不中断地使用。

但公司应保证在合理的期限内修理好发生故障的产品。

3.产品保修期从产品发运之日或由成都极空科技有限公司开始安装之日开始计算。

如果因用户的进度安排或延后使公司产品在发运之日后的30天内仍未开始安装，产品保修期从发运之日后的第31天开始计算。

4.成都极空科技有限公司对任何下列情况而导致的产品故障和损坏不提供免费保修：(a)错误的使用或不适当的维护；(b)非成都极空科技有限公司提供的软件、附件、部件或其它物品；(c)未经许可的拆卸、修改和错误使用；(d)超过产品技术规格指明的范围使用；(e)不适当的运输、搬运和存贮；（f）其它非质量原因造成的故障或损坏（如地震、战争、交通事故等）。

在法律允许的范围内,上述保修条款是唯一明确的，同时没有任何其它的保修条款，不论是书面的或口头的。

明确表示拒绝承认任何隐含的保修条款和商业条款。

版权声明所有成都极空科技有限公司出售的产品或随同硬件产品出售的软件和文件，其版权属成都极空科技有限公司所有，成都极空科技有限公司保留产品和文件方面的所有版权。

Table Of ContentsTable Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Lead Free Legislation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 European Union Directive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Japanese Ministry of Trade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 US Legislation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Bourns Commitment to Lead Free Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Bourns® Lead Free Surface Mount Multifuse® Polymer PTC Product Portfolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Category 2 Typical Coating Durability for Non-Tin and Non-Tin Lead Finishes . . . . . . . . . . . . . . . . . . . . . . . . .6 Category 3 Typical Coating Durability Default for Tin and Tin Lead Finishes . . . . . . . . . . . . . . . . . . . . . . . . . .6 Multifuse® Surface Mount Component Terminations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Bourns® Lead Free Radial Multifuse® Polymer PTC Product Portfolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Improved Heat Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Recommended Reflow Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Lead Free Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Cross-Sections of Fillet Shaped Solder Joints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Terminal Strength Test Comparison Between Lead and Lead Free Plated Products . . . . . . . . . . . . . . . . . . . . .11 Terminal Strength Test of Lead Free Plated Products after Steam Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Tin Whisker Growth Accelerated Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Additional Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16AbstractIn today’s environmentally conscious world there is a strong movement away from the use of lead in favor of alternative products.This is happening across all industry sectors.We have been introduced to lead free paint, lead free castings,lead free fuel and many other lead free products.As electronic goods become disposable commodities the electronics sector has become the principal driver of this trend.The majority of electronic companies are now evaluating lead free solders.Manufacturers are producing lead free components and the sector as a whole is moving very quickly to lead free electronic devices.Bourns® Multifuse® Polymer PTC product line meets the requirements of the global community with a product family of lead free surface mount products.In terms of Bourns general strategic policy,the movement to a lead free surface mount component is consistent with our overall environmental policy.Our principal manufacturing and design site for Bourns® Multifuse® products is ISO 14001 certified,reflecting our strong commitment to the environment.The effective introduction of the ISO 14001 standard has allowed Bourns to achieve reductions in both environmental risk and costs.Achieving this voluntary registration demonstrates Bourns pledge to the global community and illustrates company environmental awareness.IntroductionThe development of lead free surface mount Bourns® Multifuse® Polymer PTC devices involved converting the tin lead plating on product terminations to a lead free alternative. Strict criteria were developed to guide the selection of the optimum material.1.The lead free termination should have no adverse effect on the ability of the component tosolder to an interconnecting substrate.2.The strength of the bond between the terminal and the substrate must be maintained at theexisting high level,significantly above the industry standard (JIS-C-6429).3.The devices must be compatible with traditional tin lead solders as well as lead free solders.4.The devices must have the ability to withstand the peak temperature of the standard reflowtemperature profile of both types of solder,typically 245 °C for tin lead and 260 °C for leadfree.5.The components should be exposed to the industry accepted accelerated steam aging process(Reference J-STD-002A) to evaluate the long-term durability and reliability of the lead freeterminations.6.Storage under normal conditions (40 °C Max 75 % RH Max) should have no adverse effecton the solderability of the device.7.Whisker growth should be evaluated by an industry accepted accelerated growth testprocedure.8.The components must be qualified to Bourns internal and independent agency standards(UL,CSA and TÜV).9.The product must maintain its commercial competitive advantage.The tin lead terminations of our 1812 (MF-MSMD) and 1210 (MF-USMD) product families have been replaced with an electroless nickel immersion gold (ENIG) termination that maintains the high performances and quality standards of the existing Bourns® Multifuse® product family. Subsequently, Bourns has released a 2018 (MF-SMDF) and a 1206 (MF-NSMF) product family with ENIG terminations. A second option of a 100 % tin termination is also available on the product families referenced above. The terminations of the larger 3425 and 2920 (MF-SM) product families are only available with 100 % tin plated terminations.This report details the procedures used to ensure the above criteria were met. The first section outlines the current legislation driving the trend towards lead free products. A brief summary of the European, US, and Japanese lead free legislation is outlined for general information (and is not intended as legal advice). The test and results section details the methods used to ensure the components meet or exceed the relevant industry standards as well as Bourns own internal standards developed over 50 years of component manufacturing and design. A complete section is dedicated to solderability. The objective of this section is to clearly outline how solderability is categorized. Finally the conclusion section outlines the findings and recommendations of our evaluation.Lead Free Legislation as of 2004EUROPEAN UNION DIRECTIVEIn parallel to the drive initiated by environmentally conscious corporations,legislation has been drafted to accelerate the change to non-toxic products. Thislegislation will directly affect the solder, electronic component and assemblyindustries. The European Union’s directive, the Reduction on Hazardous Substances(RoHS) sets phase-out dates for the use of lead (Pb) and several other materials usedin electronic products. The RoHS requires that on July 1, 2006, the targeted materials,including lead may no longer be used unless there is an exemption provided in therule. This legislation has a direct impact on the type of solder and components thatcan be used in electronic devices.JAPANESE MINISTRY OF TRADEThe Japanese Ministry of Trade (MITI) has drafted a recycling law for electricalappliances. This does not yet include a phase-out of the use of lead, but it is expectedto do so in the near future. The recycling law will require consumer and businessusers of electrical appliances to return end-of-life goods to retailers or localauthorities for recycling. A key factor will be the elimination of lead based products.US LEGISLATIONAlthough there is no federal legislation yet in the US, there are a number of stateselectronics recycling initiatives to consider. In addition, the Environmental ProtectionAgency (EPA) has recently proposed a crackdown on lead emissions frommanufacturing plants. This action may speed the industry to embrace lead free soldermuch more quickly than originally planned.BOURNS COMMITMENT TO LEAD FREE COMPONENTSThe remainder of the report outlines the specification of Bourns® surface mountMultifuse® Polymer PTC devices and the procedure used to qualify these devices. Reliable Electronic SolutionsBourns® Lead Free Surface Mount Multifuse® Polymer PTC Product PortfolioBourns® Multifuse® Polymer PTC lead free surface mount components’ (MF-SMDF, MF-MSMF, and MF-NSMF) standard metal termination finish is electroless nickel immersion gold (ENIG). The finish gives the components long shelf life and the precious metal topcoat provides excellent electrical connectivity. The ENIG finished components fully comply with the solderability characteristics defined in the joint industry standard ANSI/J-STD-002 Category 2.Bourns offers an alternative electroless 100 % tin (Sn) termination finish to the standard ENIG finish. This option is available for applications requiring the soldering characteristics of ANSI/J-STD-002, Category 3.CATEGORY 2 TYPICAL COATING DURABILITY FOR NON-TIN AND NON-TIN LEAD FINISHESThis category is intended for surfaces finished with other than Sn or Sn/Pb coatings that will be soldered after an extended time from the time of testing. Standard Bourns® Multifuse® Polymer PTC surface mount products have an ENIG coated terminal consistent with this category. These parts were tested and found to comply with the tests and procedures outlined in Category 2.CATEGORY 3 TYPICAL COATING DURABILITY DEFAULT FOR TIN AND TIN LEAD FINISHESA category intended for surfaces finished with Sn or Sn/Pb coatings, which will be soldered after an extended storage from the time of testing. The Bourns® Multifuse® Polymer PTC devices with an optional Sn finish fall into this category and all products with the optional Sn finish meet or exceed the requirements of this category.BOURNS® MULTIFUSE® SURFACE MOUNT COMPONENT TERMINATIONSPART NUMBER EXPLANATIONMF-SM150/33-2-99MF . . . . . . . . . .Bourns® Multifuse® Product DesignatorSM . . . . . . . . . .The letters between MF and the digits represent the product series,i.e.MSMD and MSMF 1812,USMD1210,NSMF 1206 and SMDF 2018.SM is common for all Metal (Sn coated Brass) framedesigns;no size distinction150 . . . . . . . . . .The digits following the product designator represent the hold current of the device for example150 = 1.5 amps or 110 = 1.10 amps/33 . . . . . . . . . . .Indicates high voltage model-2 . . . . . . . . . . . .Packaging option –2 = Tape & Reel –1 = Bulk Packaging-99 . . . . . . . . . .Lead free option for MF-SM products.For the lead free version of the MF-MSMD and MF-USMDproducts,please see MF-MSMF,MF-NSMF and MF-USMF*.MF-SM (Metal Frame)Product DesignSn or Sn/Pb Termination.MF-MSMD Product Design Sn/Pb Termination MF-SMDF,MF-MSMF and MF-NSMF Product Design ENIG TerminationBourns® Lead Free Radial Multifuse® Polymer PTC Product PortfolioThe majority of Bourns® Radial Multifuse® Polymer PTC products are lead free as standard.The low voltage products (60 V or below) use Sn/Pb solder to attach the metal body to thePTC body. To order these products as lead free simply place a -99 at the end of the partnumber and the lead will be attached by a Sn/Ag solder. (All radial products manufacturedafter March 2005 will be lead free as standard so the need to add a -99 at the end of the lowvoltage product name will no longer be necessary.)The MF-RX/72, MF-RX/250 and MF-R/600 product families are all lead free as standard.PART NUMBER EXPLANATIONMF-R110-2-99MF . . . . . . . . . .Bourns® Multifuse® Product DesignatorR . . . . . . . . . . .The letters between MF and the digits represent the product series,the radial series R or the RX series 012 . . . . . . . . . .The digits following the product designator represent the hold current of the device for example110 = 1.10 amps/250 . . . . . . . . ._ = Standard rated part,/250 = 250 Volt interrupt rated part-2 . . . . . . . . . . . .Packaging option –2 = Tape & Reel –1 = Bulk Packaging-99 . . . . . . . . . .Lead Free Option* The 72V rated MF-RX/72 product is the lead free equivalent of the MF-RX product.IMPROVED HEAT RESISTANCEThe new lead free plated Bourns® Multifuse® Polymer PTCs have the ability to be reflow soldered with both lead and lead free solder pastes (e.g. Sn/Ag/Cu). Both types of solder paste require the components to withstand reflow temperatures of 245 °C and 260 °C.RECOMMENDED REFLOW PROFILESLEAD FREE SOLDER PASTEBourns® Multifuse® Polymer PTCs can be reflow soldered with the majority of commercially available lead free solder pastes. Bourns refers to 96.5/3.5 Tin/Silver as lead free solder paste. 96.5/3.5 Tin/Silver solder paste was used for all lead free testing documented in this paper. For information concerning other specific PreheatingT e m p e r a t u r e (°C )Time (sec)160 ~ 22012010 ~ 20Soldering Cooling30025020015010050grades of lead free solder pastes please contact your local Bourns representative.CROSS-SECTIONS OF FILLET SHAPED SOLDER JOINTS Model TerminationBondingSolder Paste MF-MSMD Sn/Pb solder paste MF-MSMF96.5/3.5 Tin/Silver solder pasteTest ResultsTERMINAL STRENGTH TEST COMPARISON BETWEEN LEAD AND LEAD FREE PLATED PRODUCTSBoth tin lead and lead free plated Bourns® Multifuse® Polymer PTCs form solder joints with terminal strength values in excess of the specification of the JIS-C-6429 standard (also used in AEC-Q200 Rev B). Thecastellated design of the lead free plated Polymer PTCs show further improved terminal strength of the solder joints when compared to the tin lead plated products.TERMINAL STRENGTH AFTER REFLOW USING LEAD FREE SOLDER···> Parts reflowed using a lead free 96.5/3.5 solder paste ···> Parts reflowed using the recommended reflow profileTERMINAL STRENGTH AFTER REFLOW USING Sn/Pb SOLDER25.020.015.010.05.00.0Tin Lead Plating Electroless Gold Electroless TinShear test123No.of ReflowsJIS Standard T e r m i n a l S t r e n g t h (K g .f )25.020.015.010.05.00.0Tin Lead Plating Electroless Gold Electroless TinShear test 123No.of ReflowsT e r m i n a l S t r e n g t h (K g .f )JIS StandardTERMINAL STRENGTH TEST OF LEAD FREE PLATED PRODUCTS AFTER STEAM AGINGThe electroless gold plated Bourns® Multifuse® Polymer PTCs show no significant reduction in the terminal strength of the solder joints after being subjected to a 72-hour steam age test (85 °C, 85 % humidity).TERMINAL STRENGTH AFTER 72 HOUR 85 °C, 85 % STEAM AGING AND REFLOWED USING Sn/Pb SOLDER···> Parts reflowed using a lead free 96.5/3.5 solder paste ···> Parts reflowed using the recommended reflow profileTERMINAL STRENGTH AFTER REFLOW USING Sn/Pb SOLDER 25.020.015.010.05.00.0Electroless GoldShear test123No.of ReflowsJIS StandardT e r m i n a l S t r e n g t h (K g .f )20.015.010.05.00.0Electroless GoldShear test123No.of ReflowsJIS StandardT e r m i n a l S t r e n g t h (K g .f )TIN WHISKER GROWTH ACCELERATED TESTBourns® Multifuse® Polymer PTC lead free surface mount components standard metal termination finish is electroless nickel immersion gold (ENIG). However, since components may also be supplied with a 100 % tin (Sn) finish, tests must be performed to measure the propensity of the tin plating to grow whiskers.Two sets of tests were carried out to accelerate tin whisker growth:···> Temperature cycle test: 500 cycles, 1 cycle= [-35 °C 7 min, 23 °C 5 min, 125 °C 7 min, 23 °C 5 min]···> Temperature humidity: 85 °C , 85 % RH, 500 hoursThe tests match the requirements in the SONY SS-00254 method.Microscopic and scanning electron microscopic inspections following the tests showed no significant growth of tin whiskers in any Sn finished Bourns® Multifuse® Polymer PTC surface mount components.Bourns® Multifuse® Polymer PTC components are plated with a white immersion tin process. This process has gained widespread acceptance as a coating. Some of the advantages of white tin include superior solderability, long shelf life and reworkability. The coating can withstand multiple heat cycles and can be used with all of the leading industry solder profiles. Immersion white tin is formulated to create a fine, dense grain structure that is stable and works to suppress the growth of an intermetallic layer. This distinguishes it from traditional tins, which have a porous structure that is unstable and insufficient to suppress the intermetallic layer. This fine grain structure allows immersion white tin to resist the dendritic growth or "tin whiskers" that can be a problem for other tins. A component coated with immersion white tin will have a solderable shelf life of more than one year. Bourns® PTCs are manufactured with an annealed process stepWhite Tin Gray TinFine Grain Hexagonal CrystalLarge Grain Orthorhombic Crystaldesigned to prevent tin whisker growth.SOLDERABILITYTo evaluate the durability and reliability of any electronic component termination finish, solderability and steam age tests are conducted on the component. Bourns® Multifuse® Polymer PTC Components with the ENIG finish and with the 100 % Sn finish have undergone extensive solderability testing. All of Bourns®Multifuse® Polymer PTC lead free surface mount components have been found to be compliant with the Joint Industry Standard, J-STD-002A. The title of the standard is Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. The EIA soldering Technology Committee (STC) and the Component and Wire Solderability Specification Task Group of IPC developed the joint industry standard to establish procedures to assess the solderability of electronic components.The tests outlined in the standard evaluate the resistance of the surface finish of the termination to dissolution of metallization; determination is made to verify that the metallized terminations will remain intact throughout the assembly soldering process. Compliance to the standard also indicates that subsequent storage will have no adverse effect on the ability of the components to solder to an interconnecting substrate. Steam age testing enables evaluation of the storage life capability of the components. Steam aging is used to accelerate the degradation of the metal surfaces in a similar manner to natural aging. The degradation mechanisms of surface oxidations and intermetallic growth are both enhanced by the heat and humidity of steam. The standard outlines a number of steam aging categories for a range of component leads and terminations. In this regard two categories apply to Bourns® Multifuse® Polymer PTC lead free surface mount components:Category 2 Typical Coating Durability for Non-Tin and Non-Tin Lead Finishes.This category is intended for surfaces finished with other than Sn or Sn/Pb coatings, which will be soldered after an extended time from the time of testing. Bourns® standard Multifuse® Polymer PTC surface mount products have an ENIG coated terminal so they fall into this category. These parts have been tested and have been found to comply with the tests and procedures outlined for the category.Category 3 Typical Coating Durability Default for Tin and Tin Lead Finishes.A category intended for surfaces finished with Sn or Sn/Pb coatings, which will be soldered after an extended storage from the time of testing. The Bourns® Multifuse® Polymer PTC devices with the optional Sn finish fall into this category; all products with the optional Sn finish meet or exceed the requirements of the category.ADDITIONAL TESTINGIn addition to the solderability tests, the components have been fully tested to our own internal qualification tests and the independent agency tests outlined below. Bourns® Multifuse® Polymer PTC surface mount components with a Sn finish have also been subjected to a tin whisker accelerated growth test procedure. They have been subjected to temperature cycling tests and constant temperature/humidity test procedures and in each case complied with or exceeded the existing industry standards.ConclusionBourns continues to demonstrate its environmental consciousness to the greater community by developing more environmentally friendly products. This document highlights the lead free construction of the new surface mount Bourns® Multifuse® Polymer PTCs and their ability to be assembled with both lead and lead free solder pastes and reflow profiles. The tests completed ensure the components meet the guidelines for suppliers transitioning to lead free components as outlined in the EMS Forum on Lead Free PCB Assembly. In general this document highlights the continued dedication of Bourns to produce robust and reliable components without compromising either performance or reliability.ReferencesThis document was made with reference to the following documents:• Sony SS-00254• EMS Forum – Guidelines for Suppliers Transitioning to Lead Free Components,Rev 1.0• IBM Server & Storage Systems Environmental Requirements for Purchasing Electronic Components(including restriction on hazardous materials RoHS)• Directive 2002/95/EC of the European Parliament and of the Council of January 27,2003 on therestriction of the use of certain hazardous substances in electrical and electronic equipment"Bourns" and "Multifuse" are registered trademarks of Bourns, Inc. in the U.S. and other countries.COPYRIGHT© 2004, BOURNS, INC. • 04/04 • e/MF0406。