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基础支撑平台第一章统一身份认证平台一、概述建设方案单点登录系统接受基于Liberty规范的单点登录ID-SSO系统平台实现，为数字化校内平台用户供应平安的一站式登录认证服务。
为平台用户以下主要功能：为平台用户供应“一点认证，全网通行”和“一点退出，整体退出”的平安一站式登录便利快捷的服务，同时不影响平台用户正常业务系统运用。
用户一次性身份认证之后，就可以享受全部授权范围内的服务，包括无缝的身份联盟、自动跨域、跨系统访问、整体退出等。
供应多种以及多级别的认证方式，包括支持用户名/密码认证、数字证书认证、动态口令认证等等，并且通过系统标准的可扩展认证接口（如支持JAAS），可以便利灵敏地扩展以支持第三方认证，包括有登录界面的第三方认证，和无登录界面的第三方认证。
系统遵循自由联盟规范的Liberty Alliance Web-Based Authentication 标准和OASIS SAML规则，系统优点在于让高校不用淘汰现有的系统，无须进行用户信息数据大集中，便能够和其无缝集成，实现单点登录从而建立一个联盟化的网络，并且具有和将来的系统的高兼容性和互操作性，为信息化平台用户带来更加便利、稳定、平安和灵敏的网络环境。
单点登录场景如下图所示：一次登录认证、自由访问授权范围内的服务单点登录的应用，减轻了用户记住各种账号和密码的负担。
通过单点登录，用户可以跨域访问各种授权的资源，为用户供应更有效的、更友好的服务；一次性认证削减了用户认证信息网络传输的频率，降低了被盗的可能性，提高了系统的整体平安性。
同时，基于联盟化单点登录系统具有标准化、开放性、良好的扩展性等优点，部署便利快捷。
二、系统技术规范单点登录平台是基于国际联盟Liberty规范（简称“LA”）的联盟化单点登录统一认证平台。
Liberty规范是国际170多家政府结构、IT公司、高校组成的国际联盟组织针对Web 单点登录的问题供应了一套公开的、统一的身份联盟框架，为客户释放了运用专用系统、不兼容而且不向后兼容的协议的包袱。
OMA Device Management Tree and DescriptionApproved Version 1.2 – 09 Feb 2007Open Mobile AllianceOMA-TS-DM_TND-V1_2-20070209-AUse of this document is subject to all of the terms and conditions of the Use Agreement located at/UseAgreement.html.Unless this document is clearly designated as an approved specification, this document is a work in process, is not an approved Open Mobile Allia nce™ specification, and is subject to revision or removal without notice.You may use this document or any part of the document for internal or educational purposes only, provided you do not modify, edit or take out of context the information in this document in any manner. Information contained in this document may be used, at your sole risk, for any purposes. You may not use this document in any other manner without the prior written permission of the Open Mobile Alliance. The Open Mobile Alliance authorizes you to copy this document, provided that you retain all copyright and other proprietary notices contained in the original materials on any copies of the materials and that you comply strictly with these terms. This copyright permission does not constitute an endorsement of the products or services. The Open Mobile Alliance assumes no responsibility for errors or omissions in this document.Each Open Mobile Alliance member has agreed to use reasonable endeavors to inform the Open Mobile Alliance in a timely manner of Essential IPR as it becomes aware that the Essential IPR is related to the prepared or published specification. However, the members do not have an obligation to conduct IPR searches. The declared Essential IPR is publicly available to members and non-members of the Open Mobile Alliance and may be found on the “OMA IPR Declarations” list at/ipr.html. The Open Mobile Alliance has not conducted an independent IPR review of this document and the information contained herein, and makes no representations or warranties regarding third party IPR, including without limitation patents, copyrights or trade secret rights. This document may contain inventions for which you must obtain licenses from third parties before making, using or selling the inventions. Defined terms above are set forth in the schedule to the Open Mobile Alliance Application Form.NO REPRESENTATIONS OR WARRANTIES (WHETHER EXPRESS OR IMPLIED) ARE MADE BY THE OPEN MOBILE ALLIANCE OR ANY OPEN MOBILE ALLIANCE MEMBER OR ITS AFFILIATES REGARDING ANY OF THE IPR‟S REPRESENTED ON THE “OMA IPR DECLARATIONS” LIST, INCLUDING, BUT NOT LIMITED TO THE ACCURACY, COMPLETENESS, VALIDITY OR RELEVANCE OF THE INFORMATION OR WHETHER OR NOT SUCH RIGHTS ARE ESSENTIAL OR NON-ESSENTIAL.THE OPEN MOBILE ALLIANCE IS NOT LIABLE FOR AND HEREBY DISCLAIMS ANY DIRECT, INDIRECT, PUNITIVE, SPECIAL, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES ARISING OUT OF OR IN CONNECTION WITH THE USE OF DOCUMENTS AND THE INFORMATION CONTAINED IN THE DOCUMENTS. © 2007 Open Mobile Alliance Ltd. All Rights Reserved.Used with the permission of the Open Mobile Alliance Ltd. under the terms set forth above.Contents1.SCOPE (5)2.REFERENCES (6)2.1N ORMATIVE R EFERENCES (6)2.2I NFORMATIVE R EFERENCES (6)3.TERMINOLOGY AND CONVENTIONS (7)3.1C ONVENTIONS (7)3.2D EFINITIONS (7)3.3A BBREVIATIONS (7)4.INTRODUCTION (8)5.THE MANAGEMENT TREE (9)6.NODES (10)6.1C OMMON CHARACTERISTICS OF NODES (10)6.2D ETAILS OF THE MANAGEMENT TREE (10)6.2.1Addressing object values (10)6.2.2Addressing interior node child lists (11)6.2.3Permanent and dynamic nodes (11)6.2.4Adding dynamic nodes (11)6.2.5Protecting dynamic nodes (12)7.PROPERTIES OF NODES (14)7.1D EFINITION (14)7.2S UPPORTED PROPERTIES (14)7.3P ROPERTY ADDRESSING (15)7.4P ROPERTY VALUES (15)7.5O PERATIONS ON PROPERTIES (15)7.5.1Properties of permanent nodes (16)7.6S COPE OF PROPERTIES (16)7.7D ETAILED DESCRIPTION OF PROPERTIES (16)7.7.1ACL (16)7.7.2Format (19)7.7.3Name (20)7.7.4Size (20)7.7.5Title (20)7.7.6TStamp (20)7.7.7Type (20)7.7.8VerNo (22)8.DEVICE MANAGEMENT TREE EXCHANGE (23)8.1R EQUESTING A P ART OF A M ANAGEMENT T REE (23)8.2R EPRESENTATION R ESPONSE OF THE M ANAGEMENT T REE (23)9.DEVICE DESCRIPTION FRAMEWORK (25)9.1R ATIONALE FOR A D EVICE D ESCRIPTION F RAMEWORK (25)9.2T HE OMA DM D EVICE D ESCRIPTION F RAMEWORK (26)9.3XML USAGE (26)9.4F RAMEWORK E LEMENTS (26)9.4.1Structural elements (26)9.4.2Run-time property elements (29)9.4.3Framework property elements (33)9.5S HORTCOMINGS OF THE OMA DM DESCRIPTION FRAMEWORK (38)10.WBXML DEFINITION (39)10.1C ODE P AGE D EFINITIONS (39)10.2T OKEN D EFINITIONS (39)APPENDIX A.CHANGE HISTORY (INFORMATIVE) (42)A.1A PPROVED V ERSION H ISTORY (42)A.2D RAFT/C ANDIDATE V ERSION 1.2H ISTORY ............................................................................. 错误！未定义书签。
Open AllianceIntroductionThe concept of open alliance refers to a collaborative effort among organizations to share knowledge, resources, and technologies for the advancement of a common goal. Through open alliance, organizations foster a sense of community and cooperation, enabling them to collectively solve complex problems and drive innovation.Benefits of Open AllianceOpen alliance offers several benefits to organizations involved:1. Knowledge SharingOne of the primary advantages of open alliance is the ability to share knowledge and best practices among participating organizations. By sharing expertise, organizations can benefit from each other’s experiences, learn from mistakes, and find better solutions collectively.2. Resource PoolingOpen alliance allows organizations to pool their resources together, whether it be financial, intellectual, or technological. This pooling of resources enables participants to tackle larger and more ambitious projects that may have been unattainable individually.3. Collaboration and NetworkingCollaboration and networking are essential components of open alliance. Through working together, organizations have the opportunity to build strong connections, establish partnerships, and leverage a broader network of contacts. These connections can lead to new opportunities, collaborations, and increased visibility within the industry.4. Accelerated InnovationBy joining forces, organizations within an open alliance can combine their research and development efforts. This collaboration leads to accelerated innovation, as different perspectives and expertise are brought together to solve complex problems. This collective intelligence can result in groundbreaking discoveries and advancements that would be difficult to achieve individually.5. Reduced Costs and RisksParticipating in open alliance can help organizations reduce costs and risks associated with research, development, and implementation. By sharing the burden, organizations can mitigate individual risks and distribute the costs of innovation among the alliance members. This can lead to more efficient use of resources and reduced financial strain for all involved parties.Examples of Open AlliancesSeveral successful open alliances have emerged in various industries. Here are a few examples:1. Open Automotive AllianceThe Open Automotive Alliance comprises automotive manufacturers and technology companies aiming to accelerate the adoption of connected car technologies. By collaborating on open-source software platforms, the alliance aims to improve the in-car experience, advance vehicle safety, and enable seamless integration of mobile devices into vehicles.2. Open Compute ProjectThe Open Compute Project is an open alliance initiated by Facebook, promoting open-source hardware and data center designs. The project has successfully brought together technology companies, data center operators, and academic institutions to collaborate on the development of energy-efficient and scalable infrastructure solutions.3. OpenAIOpenAI is an open alliance focused on the research and development of artificial intelligence (AI). The alliance’s goal is to ensure that AI benefits all of humanity. Participating organizations collaborate to advance AI research, share findings, and develop safe and ethical AI technologies.ConclusionOpen alliance provides organizations with an opportunity to collaborate, share resources and knowledge, and accelerate innovation. By working together, organizations can achieve collective goals that may have been unattainable individually. The concept of open alliance continues to gain traction invarious industries, fostering collaboration and driving advancements that benefit society as a whole.Note: This document is written in Markdown format. Markdown is a lightweight markup language used for formatting text. Markdown files can be easily converted to HTML, PDF, or other document formats using various tools and editors.。
ODA（OpenDesignAlliance）介绍注：与autocad兼容的软件，⼤部分基于Intellicad，另外刚冒出⼀个bricscad，天河的PCCAD V10就是基于bricscad，bricscad是⽤ODA的库开发的，⽽开发bricscad的公司原来是ITC的成员，⽽Intellicad也是ODA的成员，现在正⽤ODA的库重写Intelicad。
ODA是由Intellicad的⽼东家visio牵头成⽴的...这关系够乱的。
1简介ODA(Open Design Alliance)是⼀个⾮盈利的组则，在40多个国家有1100多个成员。
ODA致⼒于促进开放的、⼯业标准的CAD数据和遗留的CAD数据的格式交换。
ODA开发⽤于技术图形应⽤程序的核⼼平台Teigha™，Teigha⽀持dwg、dgn、stl、pdf之间的数据交换。
Teigha⽀持的多个平台：Windows、Mac、Unix、Linux等。
O D A 会员可以⽤ C++, .NET, 和A cti ve X 接⼝开发⾃⼰的应⽤程序。
ODA的宗旨是开发核⼼的图形技术库，让软件开发商专注与应⽤开发。
和ITC⼀样也是⾯向会员的。
2 Teigha™平台⼯具介绍2.1 Teigha™ for .dwg曾⽤名OpenDWG 、DWGdirect，创建CAD和技术图形程序的c++API。
功能:⽀持DWG™, DXF, 和BDXF ⽂件格式:读取AutoCAD® 2.5 ⾄AutoCAD 2011的dwg⽂件。
保存AutoCAD 12 ⾄AutoCAD 2011的dwg⽂件显⽰dwg和dxf⽂件和选择图形对象，⽀持GDI,OpenGL和DirectX。
恢复和修正损坏的dwg⽂件编辑和维护dwg⽂件数据：炸开实体实体坐标转换修改实体的任意属性复制对象将.dwg 和.dxf ⽂件转换为SVG, PDF, DWF, BMP, STL。
OpenX系列标准介绍(6)：OpenSCENARIO应用体会*“本系列尝试对ASAM OpenX系列标准进行介绍。
在ASAM相关标准公布后会逐一介绍，如OpenCRG、OSI等等。
这篇是最近应用OpenSCENARIO过程中的一些体会，与大家分享。
”*感谢大家对本号的关注，如果觉得有帮助，麻烦您点赞、分享！谢谢您！从最早接触OpenSCENARIO标准到现在也有一段时间，期间有朋友看过文章后也有一些私信和留言，从而有了一些体会和大家分享，说的可能不对，供大家参考。
场景的类别、数量的覆盖度和真实度在自动驾驶仿真测试中发挥着越来越重要的作用。
鉴于行业现状是成熟的商业软件占据着绝大多数的市场份额，而不同软件编辑和保存测试场景的格式又不相同，这不利于不同用户、不同软件之间测试场景库的共享。
而一个通用的标准，如OpenSCENARIO，为解决这一问题提供了一种可能性，从而受到大家的欢迎。
从宣传内容上看，仿真测试软件供应商、解决方案供应商、场景库供应商都在说自己的工具能够支持OpenSCNEARIO，自己能够提供OpenSCENARIO格式的测试场景，最终用户，如主机厂，在采购时也提需求说需要OpenSCNEARIO格式的场景和功能。
可实际情况是如何呢？可能要分成三个方面：01 OpenSCNEARIO标准处在什么阶段？诚然，2020年5月由ASAM发布了1.0版。
不过这个1.0版实现了哪些功能呢？可以实现的功能都在其标准说明里，这可以在网站上查得到。
一句话概括，实现了初步的功能，但是还不完善，还在发展中。
比如，最终需要能够描述100种场景，目前的版本可能只能描述30种，所以才会继续开发，逐渐升版。
02 现有工具对OpenSCENARIO支持程度如何？鉴于OpenSCENARIO标准还是一个不完善的标准，其发布过去之后又不久，现有工具对其的支持其实也不完善。
接着上面的比喻，目前标准内容可能能描述30种场景，而现有工具的支持可能只支持20种。
XMC4500 Satellite-kit: Automation I/O Kit Part Number: KIT_XMC4X_AUT_ISO_001Features∙Connection to CPU board via ACT Satellite Connector∙ISOFACE OUT, up to 8 channels∙ISOFACE IN, up to 8 channels∙I2C based IO expander up to 8 channels∙Single side assembly of all parts∙ 2 LEDs indicating power (3.3 Volt, 5 Volt)∙Power supply:-Power jack for external 24V supply-From CPU Board via ACT Satellite ConnectorPLEASE SEE THE FOLLOWING PAGES FOR USERS MANUALHexagon Application Kit For XMC4000 FamilyAUT_ISO-V1Automation I/O CardBoard User's Manual Revision 1.0, 2012-02-28Edition 2012-02-28Published byInfineon Technologies AG81726 Munich, Germany© 2012 Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ().WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or otherTrademarks of Infineon Technologies AGAURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™,my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.Other TrademarksAdvance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Foru m. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.Last Trademarks Update 2011-02-24Table of ContentsTable of Contents1Overview (7)1.1Key Features (7)1.2Block Diagram (8)2Hardware Description (8)2.1ISOFACE OUT (9)2.2ISOFACE IN (9)2.3IO Expander (10)2.4Power (11)2.5Satellite Connector (12)3Production Data (13)3.1Schematics (13)3.2Layout and Geometry (16)3.3Bill of Material (17)List of FiguresFigure 1Automation I/O Card (AUT_ISO-V1) (8)Figure 2Automation I/O Card Interfaces (8)Figure 3Power Circuit (11)Figure 4ACT Satellite Connector (12)Figure 5Satellite Connector Type ACT (12)Figure 6Satellite Connector, IO Expander, Power (14)Figure 7ISOFACE (15)Figure 8Automation I/O Card Layout (16)List of TablesTable 1ISOFACE OUT Connector Pinout (9)Table 2ISOFACE OUT signal connection to the Satellite Connector (9)Table 3ISOFACE IN Connector Pinout (9)Table 4ISOFACE IN signal connection to the Satellite Connector (10)Table 5GPIO channel LED/SMD pad mapping (10)Table 6IO Expander I2C signal connection to the Satellite Connector (10)Table 7Power LED’s (11)Table 8PowerScale Jumper (11)Table 9Automation I/O Card BOM (17)OverviewIntroductionThis document describes the features and hardware details of the Automation I/O Card (AUT_ISO-V1) designed to work with Infineon’s XMC4500 CPU board. This board is part of Infineon’s Hexagon Application Kits.1 OverviewThe AUT_ISO-V1 board is an application expansion satellite card of the Hexagon Application Kits. The satellite card along with a CPU board (e.g. CPU_45A-V2 board) demonstrates ISOFACE capabilities together with XMC4500. The focus is safe operation under evaluation conditions. The satellite card is not cost optimized and cannot be seen as reference design.1.1 Key FeaturesThe AUT_ISO-V1 satellite card is equipped with following featuresConnection to CPU board (e.g. CPU_45A-V2) via satellite connector ACTISOFACE OUT, up to 8 channelsISOFACE IN, up to 8 channelsI2C based IO expander up to 8 channelsPower supplyo Powerjack for external 24 V supplyo From CPU board via ACT satellite connector1.2Block DiagramFigure 1 shows the block diagram of the AUT_ISO-V1 satellite card. There are following building blocks:Figure 1Automation I/O Card (AUT_ISO-V1)2 Hardware DescriptionThe following sections give a detailed description of the hardware and how it can be used.Figure 2 Automation I/O Card InterfacesISOFACE OUT (ISO1H812G)ISOFACE IN (ISO1I811T)Power 3.3 V (IFX1763SJV33)ISOFACE IN ConnectorACT Satellite ConnectorPower Jack24 V2.1 ISOFACE OUTISOFACE output device used in AUT_ISO-V1 satellite card is ISO1H812G. It is supplied by VDD3.3 on the CPU side and VDD24 for the ISOFACE OUT side. VDD24 and GNDISO can to be connected either by X300 or by X240(24 V external power jack). This is the same net that supplies the DC/DC converter. VDD24 is +24 Vdc (referred to GNDISO)Table 1 below gives the signal details of ISOFACE OUT connector.Table 12 below gives the details of SPI signal connection to the satellite connector.2.2 ISOFACE INISOFACE input device used in AUT_ISO-V1 satellite card is ISO1I811T. It is supplied by 3.3 V on the CPU side and VBB (24V) for the ISOFACE IN side. VBB and GNDBB need a separate connection to 24 V external power source through connector X320.Resistor R337 is used on board for setting input type to IEC61131-2 Type 1.Resistors R326 and R327 sets the frequency of ISOFACE IN to 100 kHz (default).Table 3 gives the details of ISOFACE IN connector pin mapping.Table 3 ISOFACE IN Connector PinoutISOFACE IN shares the same SPI lines with ISOFACE OUT except the chip select as shown in Table 4.2.3 IO ExpanderThe AUT_ISO-V1 satellite card supports GPIO expansion though I2C IO-Expander on board (U230). The I2C Address for IO expander device is 0x1001000X. The satellite card supports 8 such GPIO’s. All t he GPIO’s are connected to LEDs (V230-V237) and SMD-Pads (TP230 – TP237). The Table 5 gives the GPIO channel and corresponding LED/PAD mapping.Table 6 shows the connection of the IO Expander device to the ACT satellite connector.2.4 PowerThe AUT_ISO-V1 satellite card can be supplied by an external power supply (24 V / 1 A) to be connected to the power jack X240 or by a 5 V supply via the 80-pin ACT satellite connector. An external power supply is necessary only in case the current coming via the ACT satellite connector is not sufficient.A DC-DC converter on board (U240) steps down the input voltage from the power jack X240 to 5 V (VDD5). The input voltage can be in the range from 12 V to 24 V. An on board linear voltage regulator is generating a 3.3 V (VDD3.3) power supply out of the VDD5.Figure 3 Power CircuitA Diode V242 protects the reverse flow of current to an external source. Therefore a simultaneous power supply of the satellite boards via both the power jack and the satellite connector with not harm.LED V210 indicates the presence of 5 V power and LED V211 indicates the presence of 3.3 V power.Table 7 Power LED’sThe AUT_ISO-V1 satellite card supports a PowerScale probe for power measurement purpose.Table 8 PowerScale Jumper2.5 Satellite ConnectorThe satellite connector of the AUT_ISO-V1 satellite card interfaces it’s the signals to a CPU board e.g. CPU_45A-V2. Take care to connect the ACT satellite card always to the corresponding ACT satellite connector of the CPU board only.Figure 4 ACT Satellite ConnectorThe signal mapping of the ACT satellite connector and correponding CPU function are provided in figure 6Figure 5 Satellite Connector Type ACT3 Production Data3.1 SchematicsThis chapter contains the schematics for the Automation I/O Card:Satellite Connector, IO Expander, PowerISOFACEFigure 6 Satellite Connector, IO Expander, PowerFigure 7 ISOFACE3.2 Layout and GeometryFigure 8 Automation I/O Card Layout3.3 Bill of MaterialTable 9 Automation I/O Card BOMTable 9 Automation I/O Card BOMw w w.i n f i n e o n.c o m。
OpenX系列标准介绍（3）：OpenSCENARIO介绍01 概览作为一个完整的仿真测试场景描述方案，OpenX系列标准包括：OpenDRIVE、OpenCRG和OpenSCENARIO。
仿真测试场景的静态部分（如道路拓扑结构、交通标志标线等）由OpenDRIVE文件描述，道路的表面细节（如坑洼、卵石路等）由OpenCRG文件描述；仿真测试场景的动态部分（如交通车的行为）由OpenSCENARIO文件描述。
如下图所示：OpenSCENARIO是一种用于描述动态场景的数据格式，由德国VIRES Simulationstechnologie GmbH 和 Automotive Simulation Center Stuttgart公司于2014年启动，逐渐迭代，并在2017年7月发布了0.9.1版本。
2018年9月，OpenSCENARIO的开发团队将维护工作转交给德国ASAM标准化组织，1.0及之后的版本由ASAM负责。
1.0版本已由ASAM组织在2020年3月发布，本文使用该版本进行介绍。
OpenSCENARIO的1.0版本与0.9版本有较大的区别，ASAM提供了0.9到1.0版本文件的转换方法。
OpenSCENARIO文件按XML格式编写，文件扩展名为.xosc。
02 OpenSCENARIO的文件结构OpenSCENARIO文件主要分为三个部分：RoadNetwork、Entity和Storyboard，如下图所示：其中：（1）RoadNetwork：用于对场景运行的道路进行说明，引用了OpenDRIVE文件。
（2）Entity：用于描述场景参与者的参数。
参与者的类型包括车辆、行人和树木、路灯等物体。
不同类型的参与者具有不同的参数，比如车辆参数有长宽高、轴距和最高车速等，行人的参数有质量、名称等；（3）Storyboard：用于描述参与者的行为，包括参与者的初始状态和运行过程中的行为变化。
Tekla Structures建模指南产品版本 17.0十月 2010版权所有 2010 Tekla Corporation版权所有 2010 Tekla 公司及其商标持有人。
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有关重要义务和相应的权利限制及制约，请参照许可协议。
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未经授权复制、显示、修改或分发本手册或本手册的任何部分都可能会引起严厉的民事及刑事惩罚，并将受到最大程度的法律制裁。
Tekla、Tekla Structures, Xcity、Xengineer、Xpipe、Xpower、Xsteel 和 Xstreet 都是 Tekla Corporation 在欧盟、美国和/或其它国家/地区的注册商标或商标。
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本软件的一部分：D-Cubed 2D DCM © 2008 Siemens Industry Software Limited. 保留所有权利。
EPM toolkit © 1995-2004 EPM Technology a.s., Oslo, Norway. All rights reserved.XML parser © 1999 The Apache Software Foundation. All rights reserved.Project Data Control Library © 2006 - 2007 DlhSoft. All rights reserved.DWGdirect, DGNdirect and OpenDWG Toolkit/Viewkit libraries © 1998-2005 Open Design Alliance. All rights reserved.FlexNet Copyright © 2010 Flexera Software, Inc. and/or InstallShield Co. Inc. All Rights Reserved. This product contains proprietary and confidential technology, information and creative works owned by Flexera Software, Inc. and/or InstallShield Co. Inc. and their respective licensors, if any. Any use, copying, publication, distribution, display, modification, or transmission of such technology in whole or in part in any form or by any means without the prior express written permission of Flexera Software, Inc. and/or InstallShield Co. Inc. is strictly prohibited. Except where expressly provided by Flexera Software, Inc. and/or InstallShield Co. Inc. in writing, possession of this technology shall not be construed to confer any license or rights under any Flexera Software, Inc. and/or InstallShield Co. Inc. intellectual property rights, whether by estoppel, implication, or otherwise.本软件受美国第 7,302,368 和 7,617,076 号专利保护。
Goals, Technical Committees and Procedures 6.3.2012Contents• • • • • Goals & Objectives Members General Structure Technical Committees ProceduresGoals & ObjectivesThe OPEN Alliance wishes to facilitate the adoption of Ethernet based communication in automotive • By establishing the OPEN Alliance 100Mbps BroadR Reach (OABR) physical layer specification as an open industry and de facto standard. • By examining interoperability requirements and identifying independent parties to conduct interoperability testing. • By encouraging and supporting the development of an automotive suitable higher speed physical layer solution in a standards setting organization. • By ensuring that the gaps needing standardization, when implementing Ethernet based communication in automotive, are filled (by OPEN or others).Members (6.3.2012)PromotersAdoptersOPEN confidential slidesGeneral StructureSteering Committee (SC)Chair SecretaryCommunications Team (CC)Technical CommitteeTechnical CommitteeTechnical CommitteeTechnical CommitteeTechnical CommitteeTC 1Chair Vice chairTC 2Chair Vice chairTC 3Chair Vice chairTC 4Chair Vice chairTC 5Chair Vice chairTechnical Committee 1: BroadR Reach 100Mbps SpecificationGoals: • Facilitating the production of BroadR Reach products by other semiconductor manufacturers. • Ensuring spec compliance and interoperability between ECUs of different Tier 1 products on physical layer. Output: • Concept on how at least one test house is available by the required timeline. • List of recommended interoperability and compliance test houses. • Documentation that allows to use the BroadR Reach Specification (including errata to specification). Other: • No certification by OPEN. • Specific Design guidelines will be provided individually by the semiconductor vendors and are not part of OPEN.Technical Committee 2: Enabling Technologies for 100Mbps BroadR ReachGoals: • Recommend a number of specifications needed to allow vehicle level implementation of BroadR Reach. Output: • A collection of EMC requirement specifications (incl. immunity, ESD etc.). • Harness specification. • Cable specification. • Connector specification (electrical parameters). • Recommendation list of test houses for EMC qualification . • Concept for peripheral component strategy poss. magnetic/CMC specification, enabling suppliers. • Description of bus diagnostics (link quality, re-use from standard SNMP MIB). Other: • OPEN intends first of all to collect existing specifications. Publication in OPEN then depends on the author`s authorization.Technical Committee 3: Higher Data Rate Ethernet for AutomotiveGoals: • Ensure Ethernet in automotive has a future. • Pave the way to the 1 Gbps Ethernet suitable for automotive . Output: • Requirements documents on Gbit Ethernet (incl. use cases, diagnostics, power consumptions). • Requirements on connectors (and cables) suitable for automotive Gbit Ethernet . • Concept of how to move forward.Technical Committee 4: ToolsGoals: • Provide the basis for tools that support the development process along the V-cycle Output: • List of products necessary (including new/ Ethernet specific requirements, including timeline, including what is available and where are gaps) • Concept of how to ensure the tools are available by multiple vendors • List of tools BroadR Reach Ethernet IP capable available for members/on website • Tool session at the next TechdayTechnical Committee 5: Gap HandlingGoals: • Identify the open issues on all protocol layers that need to be solved in order to adopt Ethernet based communication in automotive and propose approaches to resolve these issues • Ensure no unnecessary overlap between OPEN activities and those of other organizations (interface to other organization bodies outside OPEN) Output: • Overview /Landscape on what issue is being addressed in what organization • Proposals on how open issues can be addressed as they ariseTechnical Committee Timeline31-May-12 Compliance test suite ready for 100Mbps BroadR Reach 31-May-13 Interop test suite ready for 100Mbps BroadR Reach Collection of documents made available on enabling 100Mbps T C 131-Dec-14 Review for 31-May-13Review for ending of TC 1, 2, and 4BroadR ReachMilestones and timeline depend on identified gaps,might lead to new TCsT C 5 T C 4 T C 3 T C 22012 2013 2014ending OPEN30-Sep-12 List with suitable tools on website Continuous update after the end of TC 4Requirement for automotive Gbps Ethernet, coop with IEEE SG 19-Nov-12 Review of strategyPromoter and Adopter RightsPromoter Adopter Membership cost Free*Free* Participation in Steering Committee Yes NoCan be elected Secretary or Chair of the Alliance Yes NoYes**No Setting up new and terminating existing TechnicalCommitteesParticipation in Technical Committees Yes YesHas access to BroadR Reach Specification Yes YesCan become a licensee of BroadR-Reach technology Yes Yes*each adopter or promoter bears its own costs and expenses for its participation in the OPEN Alliance**requires majority vote of the PromotersHow to become a Promoter?•New Promoters are added to the OPEN Alliance–By a ¾ majority vote by the existing Promoters and–By execution of the Promoter Agreement by the new Promoter.•The Promoter Agreement needs to be signed and sent back to the address of the Secretary of the OPEN Alliance. •Additionally a scanned pdf of the signed Promoter Agreement can be sent to the Secretary.•Every Promoter has to name a main contact and deputy. The main contact is automatically member of the SteeringCommittee.How to become an Adopter?•New Adopters are added to the OPEN Alliance by execution of the Adopter Agreement.•The Adopter Agreement needs to be signed and sent back to the address of the Secretary of the OPEN Alliance. •Additionally a scanned pdf of the signed Adopter Agreement can be sent to the Secretary.•Any legal company can become Adopter.•Every Adopter has to name a main contact and a deputy.Procedure: How to become a Member of a Technical Committee?•Every Technical Committee has a chair and a vice chair.•In case a new Technical Committee is set up the chair will invite the main contacts of every Member to participate. The main contact then names participants of their company ordeclines participation.•New Members will automatically be informed about and invited to participate in existing committees by the committee chairs upon having become a Member.•Every registered Member of a technical committee is expected to participate in at least 50% of the meetings.Specialists can be invited to particular meetings on anindividual basis.Thank you for your attention !。
