Fault detection using microtremor data(HVSR-based
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Central Battery Systems AC/AC Automatic T est System AT-S+ with STAR+ Technology – Components and optionsControle moduleA freely programmable control module withnon-volatile program memory and graphic displaymonitors and controls the test system. All func-tions such as mains/emergency light switchingof the devices and the emergency luminaires aretested automatically. Any faults that occur are sig-nalled immediately. An interface enables a centralmonitoring facility to be connected.In the event of a short circuit or open circuit incurrent loops, differential monitors immediatelypower on the system (maintained light) or put thesystem in readiness.• Non-volatile memory• Automatic luminaire search function• Individual luminaire monitoring• Automatic DLS/TLS search function• Selective manual reset/circuit• Selective emergency light/circuit• Password function• Final circuit fuse monitoring• Control module with multi-master mode M3Sealed keypad with 2 keys for:• Test (mains failure)• Function test start / cancel(Key DT without function)3 freely assignable function keys for:• System disable/enable• Manual reset• Cancel function test• Show fault list• Maintained light off/on• Power on complete safety lighting system(continuity lighting)• Mains failure simulation UV-A (emergencyoperation)7 control keysfor user-friendly navigationLED indicators for:• Ready• Electrical Source for Safety Services• FailureGraphic display:128 x 64 pixels, backlit, programadjustable contrast and brightness.Displays include:• Date/Time• Power source for safety services ready foroperation• Infeed of safety lighting from power source forsafety services• Power source for safety services faulty• Manual reset• Test mode• Delay-time on mains return (remaining time inmin.)• Luminaire failure with location label• UV-AV failure (location specification)• Failure/programming informationConnections• C onnection for disable switch:24V control loops for blocking the installationduring factory shutdowns with differential loopmonitoring for short-circuit and open circuitdetection. Differential monitoring: Short-circuitor open circuit result in readiness for operationof the system.• C onnection for phase monitor:24V current loop for requesting emergencylighting using differential loop monitoring forthe detection of short-circuit and open circuits.Differential monitoring: Short-circuit or opencircuit result in immediate power on (main-tained light) of the system.• C onnection for zero-potential signalcontacts and buzzers:Connection for zero-potential signal contacts, 24V 0.5 A:3 relays with common potential, 1 x switchingcontact each,One or several from 11 different messages canbe assigned to each zero-potential contact. Free-ly programmable, DIN VDE specification can becalled up at any time as a pre-setting.2 relays with common potential, 1 x open con-tact each with fixed assignment.• C onnection for analog inputs:4 of freely assignable 24 V analog inputs,switch function can be programmed negatedand non-negated, e.g. for start / cancel func-tion test, disable / enable system, manual re-set, maintained light on / off, power on safetylighting as continuity lighting.EATON - EMERGENCY LIGHTING CPS – Global Catalogue 2018 42710Central Battery Systems AC/ACAutomatic Test System AT-S+ with STAR+ T echnology – Components and optionsDisplay 128 x 64 pixel graphic display, program adjustable contrast Ilumination backlighting, program adjustable brightness Keypad sealed, with 6 function and 7 control keysReadoutInfeed of safety lighting from power source for safety services Power source for safety services ready for operation AC isolation fault External fan faultLuminaire failure with location label Manual resetDelay-time on mains returnUV-AV failure (location specification) Test mode Date/TimeFailure informationProgramming informationStatus– Ready– Electrical Source for Safety Services – FailurePotential-free signal contacts, buzzer3 freely configurable relays with common potential, 1 x switching contact each, 2 relays with fixed assignment and common potential, 1 x open contact each, 24 V 0.5 A; buzzer. Freely programmable, DIN VDE specification can be called up at any time as a pre-setting.Ordering detailsT ypeModelOrder No.Control module CU-S + with SD Plug-in module4 0071 360 371Default setting AT -S +DesignationRelay 1 C0/14/12Relay 2 C0/24/22Relay 3 C0/34/32Relay 4 C1/44Relay 5 C1/54BuzzerReady for operation XP e r m a n e n t l y c o n fi g u r e d f o r c o n t r o l o f a t e c h n i c a l c a b i n e t v e n t i l a t i o n . D e f a u l t s e t t i n g >40°C O N < 35°C O F F .Mains failure S3/S4X Mains failure DLS/3PH X Ext. source error X Circuit fault X Luminaire fault X Device fault XExt. source active XISO error XFunction test X (permanent-ly configured)Invert contactX10428 EATON - EMERGENCY LIGHTING CPS – Global Catalogue 2018。
Fault Detection Robot System HealthThe fault detection robot system health is a critical aspect of any automated system, as it ensures the proper functioning and performance of the robots in various operational environments. The health of the robot system is essential for maintaining productivity, efficiency, and safety in industrial, commercial, and even domestic settings. Therefore, it is crucial to address this problem and establish effective requirements to ensure the optimal performance and longevity of the fault detection robot system.One of the primary requirements for maintaining the health of the fault detection robot system is regular maintenance and monitoring. This involves conducting routine checks, inspections, and diagnostics to identify any potential faults, errors, or malfunctions in the system. By implementing a proactive maintenance schedule, the system can be kept in optimal condition, minimizing the risk of unexpected breakdowns or failures. Additionally, real-time monitoring of the system's performance and health can provide valuable insights into its overall functionality, allowing for timely interventions and adjustments as needed.Another important requirement is the implementation of robust fault detection and diagnostic capabilities within the robot system. This involves integrating advanced sensors, algorithms, and monitoring technologies to detect and analyze any deviations or anomalies in the system's behavior. By leveraging these capabilities, potential issues can be identified early on, allowing for prompt remedial actions to be taken. Furthermore, the system should be designed to provide detailed diagnostic information, enabling maintenance personnel to pinpoint the root cause of any faults and implement targeted solutions.Furthermore, the fault detection robot system should be designed with redundancy and fail-safe mechanisms to ensure continued operation in the event of a fault or failure. This involves incorporating backup systems, redundant components, and emergency protocols to mitigate the impact of any potential issues. By designing the system with built-in resilience, it can continue to function reliably even in challenging conditions, minimizing downtime and disruptions to operations.In addition to technical requirements, it is essential to establish clear protocols and procedures for addressing faults and maintaining the health of the robot system. This includes defining roles and responsibilities for maintenance personnel, establishing escalation paths for reporting and resolving issues, and documenting standard operating procedures for fault detection and system health management. By formalizing these processes, the organization can ensure a consistent and effective approach to maintaining the system's health.Moreover, ongoing training and skill development for maintenance personnel are crucial requirements for ensuring the health of the fault detection robot system. By equipping personnel with the knowledge, skills, and resources needed to effectively maintain and troubleshoot the system, the organization can enhance its overall reliability and performance. Training programs should cover not only technical aspects but also emphasize the importance of proactive maintenance, thorough diagnostics, and effective problem-solving techniques.Lastly, it is important to establish a culture of accountability and continuous improvement within the organization to maintain the health of the fault detection robot system. This involves fostering a mindset of ownership and responsibility among all stakeholders, encouraging open communication and collaboration, and promoting a proactive approach to identifying and addressing potential issues. By instilling a culture of continuous improvement, the organization can adapt to evolving challenges and technologies, ensuring the long-term health and effectiveness of the robot system.In conclusion, the fault detection robot system's health is a critical consideration for any organization that relies on automated systems. By implementing the aforementioned requirements, including regular maintenance and monitoring, robust fault detection capabilities, redundancy and fail-safe mechanisms, clear protocols and procedures, ongoing training and skill development, and a culture of accountability and continuous improvement, the organization can ensure the optimal performance and longevity of the fault detection robot system. Ultimately, prioritizing the health of the system will contribute to enhanced productivity, efficiency, and safety across various operational environments.。
专利名称:METHOD AND DEVICE FOR THEAUTOMATED ERROR DETECTION IN NON-DESTRUCTIVE MATERIAL TESTING发明人:GÜNZLER, Til, Florian申请号:EP2009000711申请日:20090204公开号:WO09/100835P1公开日:20090820专利内容由知识产权出版社提供摘要:The invention relates to a method for the automated error detection in non-destructive material testing, comprising the steps of carrying out imaging measurements (30) on a test part, carrying out a statistical analysis (31) for each pixel with respect to the intensity fluctuation thereof, determining (35) a graduated error probability p derived from the statistical analysis (31) that a pixel can be associated with a material defect, creating a differential image (34) by subtraction of a comparison image from the measured image, and image processing (36) of the differential image as a function of the determined graduated error probability p, in order to be able to provide information about the presence of material defects in the test part. The comparison image is created from the measured image data during the testing by using (33) an error correction filter. The statistical analysis (31) for each measured pixel with respect to the intensity fluctuation thereof is carried out during the testing.申请人:GÜNZLER, Til, Florian地址:Robert-Bosch-Strasse 3 50354 Hürth DE,Alstertwiete 15 20099 Hamburg DE国籍:DE,DE代理机构:VERWEYEN, Andreas 更多信息请下载全文后查看。
Hardware fault detection method(硬件故障检测方法)Hardware fault detection method for.Txt36 love is a ray of sunshine, let your mind even in the cold winter can feel the warmth of spring; love is a clear spring, let your emotions over the years even if the dust is still clear net. 1 hardware fault detection methodLet's take a look at the basic test methods for hardware failures. When the display does not appear in any image, you can use the following method to test the faulty components.First, prepare a workbench.Two. Unplug the motherboard from the chassis and pull all the components from the motherboard, leaving only the CPU and RAM., and then put the motherboard on the workbench.Three. Connect the regulated power supply to the main board.Four insert the graphics card into the AGP slot. Of course, if the PCI card is inserted into the PCI slot. When inserting, be sure to insert the gold plated part of the card completely into the slot.Five 、 connect the display power jack and connect the video card to the monitor.Six, open the display power, and then switch on the chassis power switch. Then contact the main board power switch with a metal bar.The main board power switch is connected to the chassis power switch, usually labeled "PWR SW" or "POWER SE"".Seven, if the BIOS version information on the screen, the screen without exception, CPU, RAM, graphics card, motherboard, power supply is normal. Usually, often prone to failure of components is "card", "board", "hard disk" in this order.Eight, and then connect the hard disk and soft area for testing. Then connect the CD-ROM detection, then the sound card. Modem and so on, a single connection for testing. If the picture does not appear, the component after the connection is out of order or compatible. Just handle the faulty part.Nine, the case of the chassisSometimes problems occur when you install the motherboard into the chassis, causing the boot to fail. Therefore, if you do not have any problems with the above component check, you can install the motherboard to the chassis for testing. If there are no errors in the test, the software problems such as CMOS, Setup errors, drivers, etc. are explained.Five. A simple way to detect computer problemsIf the "false fault" is ruled out, then there is a real fault! To test the appearance of the accessories, including opening the case, see that the interior parts of the host are not damaged by high voltage, or with visible scars, if any, the faulty components are clear. If not, try the following method.1. dust removalDust floating in the air is a big killer of computers, and after a period of time it may be too dusty for the key components of the motherboard, even in the private room. So, for a long time using the computer, should first clean with the brush gently brush the dust on the motherboard, peripherals. If the dust has been cleared or dust free, the fault still exists, indicating that there are other problems with the hardware.In addition, due to some cards or chips on the board using pin form, vibration, dust and other reasons often lead to pin oxidation, poor contact. Eraser can be used to wipe the surface oxide layer, re plug after the boot, check whether the failure to rule out.Casually said, the keyboard will often leak, the key card and other failures, this fault should be promptly handled, otherwise the input file will enter some of the wrong characters. Treatment should be put up with a keyboard, button down cover open bracket, a keyboard, a contact alcohol cleaning circuit board and button, and the button below stuck shrapnel appropriate lever, so as to restore the original elasticity.Note: floppy or scratched floppy disks that are used in floppy disks will scratch the read and write head and damage the floppy drive when they are inserted into the floppy drive. The cleaning head must be very cautious, not a long time drive, may to the head will be corroded, when not using the cleaning plate, the specific approach is to open the case of cleaning agent drops in the head, soak for half an hour after the use of fat cottonand carefully wipe clean. If you use the cleaning disk blindly, it will cause the damage of floppy disk read-write head and make the floppy drive useless.2. see, hear, smell, touch"See" the plug and socket observation system board is skew, resistor, capacitor pin is touching, whether there are signs of burning surface, whether the crack surface of the chip on the motherboard, the copper foil is blown. Of course, needless to say you know to check whether the foreign body into the motherboard components (which will cause a short circuit), can also take a look at the board have burnt discoloration, walk the line on the printed circuit board (copper) whether fracture etc..Listen to listen to the power supply fan, soft / hard disk motor or track mechanism, display, transformer and other equipment work sound is normal. In addition, when the system short circuit fault is often accompanied by abnormal sound, monitoring can detect some hidden dangers in time and take immediate measures before the accident occurs."Smell", that is, smell the host, board, whether there is burning smell, easy to find fault and determine the location of the short circuit."Touch" is pressed by hand and the movable chip, chip is loose or poor contact. In addition, in the operation of the system equipment by touching or near CPU, display, hard disk shell according to its temperature can determine whether the normaloperation of equipment; touch the surface of some chips by hand, if hot, for the chip damage.Authors: Zouping gov2008-6-13 09:10 replies to this statement--------------------------------------------------------------------------------2 hardware fault detection method3. plug detectionAs mentioned earlier, there are many reasons for the computer failure, such as the motherboard's own failures, I/O bus faults and various card faults, which can cause the system to run abnormally. The plug repair method is to determine the fault occurred in the simple method of the motherboard or I/O devices. The method is to shut down after the board by block pull out, pull out a piece of board of each observation on the boot machine running, once pulled out a piece of board after normal operation, then the cause of the malfunction is the plug-in board fault or the corresponding I/O bus slot and a load circuit fault. If the system startup is still out of order after pulling out all the plug-in boards, the fault is likely to be on the motherboard.Plug detection, but also from another computer trouble shooting: some chip, board and slot is bad, the chip card, pull out right after the re insertion can solve the microcomputer fault caused by improper installation of contact.4. exchange detectionThe plug-in board or the same type of chip can be exchanged with the same type of plug-in board, the same bus mode and the same function, and the fault can also be judged according to the change of the fault phenomenon. This method is easy to swap for the maintenance of the environment, such as memory self-test error, can exchange the same memory chips or memory to determine the fault location, fault free exchange between the chip, fault phenomenon remains the same, if the exchange after the fault phenomena and that the exchange has a bad chip, further through one by one. Exchange and determine the site. If you can find the same type of microcomputer components or peripherals, the use of exchange method can quickly determine whether the component itself quality problems.5. comparison detectionOperating two or more computers of the same or different type, according to the normal computer and the failure of the microcomputer in the implementation of the same operation of the different performance, you can initially determine the location of the fault.6. vibration knock detectionA chassis shell gently with your fingers, if troubleshooting, the fault is caused by bad contact or weld. After that, the location of the fault can be further checked out, but it is difficult to detect the exact location of such faults.7. temperature and temperature detectionPeople can raise the temperature of the running environment of the microcomputer, and can test the high temperature resistance of each component, especially the CPU, so as to detect the hidden trouble of the accident early. After reducing the temperature of the operating environment, if the failure rate is greatly reduced, indicating that the fault is in high temperature or high temperature resistant parts, this can help reduce the scope of fault diagnosis.In fact, heating and cooling method is the use of a fault trigger principle, to create the conditions for failure to make frequent failure to observe and judge the fault location, but the specific implementation should pay attention to control the heating method, the temperature is not more than 40 degrees celsius.8. running test programWith the wide application of various integrated circuit, the welding process becomes more complex, relying on the general maintenance method is often difficult to find a fault, and through special random diagnostic procedures, maintenance cards and according to the various technical parameters (such as the interface address), self specific diagnostic procedures to assist detection, can often have a multiplier effect. The principle of program testing is to send data and commands by software, and read the status of the line and the status of a chip (such as registers) to identify the fault location. This method is often used to check the fault interface circuits andhas the address parameters of various circuit, but the application premise is the basic operation of CPU and bus can run normally, the diagnostic software can run the installation in the I/O bus slot on the diagnosis card.When selecting, diagnostic procedures should be rigorous, comprehensive, and targeted, allowing regular signals to occur at certain critical locations,Able to perform repeated tests on accidental failures and display error records.Six. How to diagnose computer failure?Many beginners just touch the computer, there is a sense of fear that the computer's failure must be insurmountable big problem. In fact, most computer failures have a certain rule to follow, this problem is like a layer of window paper, a poke on the break, you do not need to have too much knowledge of the computer. Now let's learn some quick ways to diagnose computer problems.Environmental Inspection ActFor some unexpected hardware failures, such as no display on the phone. Let's not go into depth first, because we tend to overlook some of the details. First of all, we should look at the obvious: if we have the power on? Has the switch been turned on? Is the power socket energized? Are all the connections connected? Perhaps the root of the problem lies in it.CMOS reduction methodSome users tend to change some of the settings in the motherboard CMOS because of curiosity, which is a major reason for the failure. If the computer fails, then we can fix the problem by restoring the CMOS settings. The method is very simple, boot and press "Delete" key on the keyboard to enter the CMOS, select the "Load Optimized Defaults" (the default load), according to the "Y" button to confirm, save and exit CMOS.Authors: Zouping gov2008-6-13 09:10 replies to this statement--------------------------------------------------------------------------------3 hardware fault detection methodRegistry recovery methodSome users love by modifying the registry to personalize the optimization of the system settings or, some users in the Internet browsing by malicious program changes to the registry, some fault is caused because of abnormal changes to the registry. Then we can restart the computer, and switch to the MS-DOS mode, enter and execute "scanreg/restore" into the registry restore interface in the C root directory, and then select a computer intact registry file "Restore (reduction), can be realized on the recovery of the registry.Simplified startup methodThe fault is in our part of the computer to install some software, if the computer can also enter the operating system, so we can in the start menu, run the "msconfig" program, close all programs except "internat.exe, Scanregistry, Systemtray" start menu. After restarting the computer, if the fault no longer occurs, the problem is mostly caused by a software that has been started by itself.Logged tracking methodIf the computer has been unable to enter into a Windows or enter is not normal, so we can use Logged(\\\\\\\\\\\\\\\\Bootlog.txt) way to start the computer, so that the generated Bootlog.txt files can record the failure location. Using the method of Logged mode is activated, press the F8 key on the keyboard when the system starts, will appear in the start menu, select start in Logged, the fault appears, the startup disk to restart your computer with Windows, and then copy the C root directory of the Bootlog.txt file to the floppy disk, open the file on other computers. And you will find the above records the whole process of starting the Windows, from which we can find the root of problems.Equipment replacement methodThe equipment is replaced, when you doubt what equipment when there is a problem, with the same function (the best is the same type of equipment) to replace it, if the replacement problem disappeared, so most of the equipment was a problem.Minimum system methodIf you are not sure which hardware is the problem, you can use the minimum system approach to judge. Minimum system method is to remove other hardware devices in the system, only to retain the motherboard, memory, graphics card three basic components, and then boot to see if there is a fault. If available, other hardware problems can be eliminated, and the fault should come from the existing three hardware. If not, then add other hardware one by one, to see which hardware has been added to the fault, and find the fault, and then deal with the hardware.Program update methodA lot of people don't pay enough attention to drivers. They think it's OK to just install one. But when we buy hardware, we already have drivers, so why do hardware vendors keep releasing new versions of drivers? In fact,The purpose of this is to allow manufacturers to improve their own products.Because now the hardware update speed is very fast, but most manufacturers of hardware and hardware development before the software development, hardware driver and so there may be some small Bug in the just released, need to constantly update the driver to make up for these deficiencies. Therefore, upgrading the driver is also an effective way to solve the hardware problem.Software testing methodDiagnosing hardware failures usually requires some kind of hardware information, but many people do not have the habit of recording or knowing how to record hardware information. Computer failure, may not be able to enter the system, then we would need a hardware test under DOS tools, such as HwInfo for DOS, it is only the size of 582KB on the floppy disk can carry with it can at any time the hardware fault diagnosis.Change of resources lawMany computer failures are caused by resource conflicts between hardware, so we can solve the problem by changing the resource. Right-click "my computer" and select "properties" item in the drop-down menu, click the "device manager", select "view according to the type of equipment, if found in the list of equipment by the yellow exclamation mark, then it may be a conflict between hardware resources. Methods change the resources is marked with the exclamation point with the left mouse button double-click the hardware, select "resources", the removal of the "use automatic settings" before the tick, select "change settings", the conflict of resources changes。
Product data sheetCharacteristicsLT3SM00MWPTC probe relay TeSys - LT3 with manual reset -24...230 V - 2 OCMainRange of product LT3Device short name LT3SMProduct or component type Thermistor protection units [Uc] control circuit voltage 24...230 V AC 50/60 Hz 24...230 V DC ResetManualComplementaryControl circuit voltage limits 0.85...1.1 Uc Contacts type and composition 2 C/O multi voltage [Ith] conventional free air thermal current5 A for output control relay [Ui] rated insulation voltage Output control relay: 500 V AC[Ue] rated operational voltage 250 V AC 50/60 Hz for output control relay Signalling function Fault indication Voltage indication Control typeManual reset Manual testProbe interchangeability Label mark A conforming to IEC 60034-11Hold-in power consumption in W 1 W Hold-in power consumption in VA 2.5 VAResistance 1500...1650 Ohm reset 2700...3100 Ohm tripping Number of probes 0 (6)Input voltage< 2.5 V (1500 Ohm) for probe< 7.5 V (4000 Ohm) for probe conforming to IEC 60034-11Maximum short circuit detection resistance 20 OhmCondition of useConnection of probes 1000 m >2.5 mm²Connection of probes 500 m >1.5 mm²[Uimp] rated impulse withstand voltage 2.5 kVRated power in VA 100 VA at 220 V - electrical durability: 500000 cycles Breaking capacity2 A at 24 V DC DC-133 A at 250 V AC AC-16i s c l a i m e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s6 A at 120 V AC AC-16Connections - terminals Power circuit: cage type connector 1 cable(s) 0.75…2.5 mm²flexible with cable endPower circuit: cage type connector 1 cable(s) 0.75…2.5 mm²solid with cable endPower circuit: cage type connector 1 cable(s) 1…2.5 mm²flexible without cable endPower circuit: cage type connector 1 cable(s) 1…2.5 mm²solid without cable endPower circuit: cage type connector 2 cable(s) 0.75…2.5 mm²flexible with cable endPower circuit: cage type connector 2 cable(s) 0.75…2.5 mm²solid with cable endPower circuit: cage type connector 2 cable(s) 1…2.5 mm²flexible without cable endPower circuit: cage type connector 2 cable(s) 1…2.5 mm²solid without cable endTightening torque0.8 N.mHeight100 mmWidth22.5 mmDepth100 mmNet weight0.22 kgEnvironmentStandards IEC 60947-8IEC 60034-11VDE 0660IP degree of protection IP20 conforming to IEC 60529IP20 conforming to VDE 0106Ambient air temperature for operation-25…60 °CAmbient air temperature for storage-40…85 °C conforming to IEC 60068-2-2-40…85 °C conforming to IEC 60068-2-2Operating altitude<= 1500 m without derating in temperature> 1500...3000 m with derating in temperatureVibration resistance 1 gn 25...150 Hz conforming to IEC 60068-2-62.5 gn 2...25 Hz conforming to IEC 60068-2-6Shock resistance 5 gn 11 ms conforming to IEC 60068-2-27Electromagnetic compatibility Resistance to electrostatic discharge level 3 conforming to IEC 61000-4-2Resistance to fast transient level 3 conforming to IEC 61000-4-4Surge resistance 1.2/50-8/20 level 4 conforming to IEC 61000-4-5Susceptibility to electromagnetic fields level 3 conforming to IEC 61000-4-3Immunity to microbreaks and voltage drops conforming to IEC 61000-4-11Packing UnitsUnit Type of Package 1PCENumber of Units in Package 11Package 1 Weight154 gPackage 1 Height 2.6 cmPackage 1 width10.3 cmPackage 1 Length10.3 cmUnit Type of Package 2S02Number of Units in Package 236Package 2 Weight 5.999 kgPackage 2 Height15 cmPackage 2 width30 cmPackage 2 Length40 cmOffer SustainabilityEU RoHS Directive CompliantEU RoHS DeclarationMercury free YesRoHS exemption information YesChina RoHS Regulation China RoHS declarationProduct out of China RoHS scope. Substance declaration for your informationWEEE The product must be disposed on European Union markets following specific waste collection andnever end up in rubbish binsContractual warrantyWarranty18 months。
Fault Diagnosis Based on Knowledge for Smart Sen-sors in FieldbusYu Lianzhi1,2 Liang Weichong2 Yan Guo zheng31(Univ er sity of Shanghai f or S cience and T echnology,Shanghai 200093,China)2(Shanghai P u j iang Cable L imited Com p any,Shanghai 200022,China) 3(Electr onic and I n f ormation I nstitute820,S hanghai J iaotong U niv er sity,Shanghai 200030,China)Abstract Smart sensors are basic unit s in t he f ieldbus cont rol syst em,and their performances are most impor-tant for the whole cont rol system.According t o the smart sensor work t heory in f ieldbus,t he fault diagnosis met hod based on knowledge is adopt ed for smart sensors in fieldbus,and t he fault diagnosis model is described. Key words Fieldbus Smart sensors F ault diagnosis现场总线基于知识的智能传感器故障诊断于莲芝1,2 梁卫冲2 颜国正31(上海理工大学光电学院 上海 200093)2(上海浦江缆索有限公司 上海 200022)3(上海交通大学电子信息学院820研究所 上海 200030)摘要 智能传感器是现场总线控制系统中最基本的结构单元,智能传感器的正常工作对整个控制系统至关重要。
Technical NoteFault detection using microtremor data(HVSR-based approach)and electrical resistivity surveyMarzieh Khalili*,Abdul Vahed MirzakurdehDepartment of Earth Sciences,College of Sciences,Shiraz University,Shiraz,Irana r t i c l e i n f oArticle history:Received9April2018Received in revised form22December2018Accepted28December2018Available online21January2019Keywords:MicrotremorHorizontal to vertical spectral ratio(HVSR) Electrical resistivitySediment thicknessHidden faults a b s t r a c tThe faults and fractures are known as two of the most important parameters in earthquake occurrence. During the construction in urban areas,faults and fractures may be covered in depth and thus are not visible at the ground surface.In this context,non-invasive geophysical prospecting methods(micro-tremor and geoelectrical methods)and borehole data were used to detect subsurface geological struc-tures(hidden faults)in a suburb of Shiraz in Iran.The horizontal to vertical spectral ratio(HVSR)method was used to obtain the dynamic parameters(predominant frequency and resonance amplitude)of the soil,to detect hidden faults.The results show that the abrupt changes in the sediment thickness and predominant frequencies at a specific direction(NW-SE)can be related to the displacement of a nearly vertical fault with NW-SE trend.In addition,the electrical resistivity method using continuous resistivity profiling(CRP)and Schlumberger arrays was employed to detect a hidden fault and the results were compared with previous data.The obtained results of both arrays illustrate the presence of a nearly vertical fault with NW-SE trend in the parison of all results shows that the detected faults by both methods are consistent with each other.Therefore,it can be conclusive that combination of the two methods is a useful and reliable approach to study and detect hidden faults.Ó2019Institute of Rock and Soil Mechanics,Chinese Academy of Sciences.Production and hosting by Elsevier B.V.This is an open access article under the CC BY-NC-ND license(/licenses/by-nc-nd/4.0/).1.IntroductionDue to the tectonic complexity of the Earth,some of the deep fractures do not reach the ground surface.In this instance,lack of knowledge about the fault existence can cause an error in urban planning.To assess seismic hazards and mitigate potential damages in metropolises without demolishing buildings and structures,a safe method to detect the hidden faults is required.Seismic exploration is one of the most important geophysical methods to determine subsurface structures,but technically and economically,there is still difficulty to use it directly in metropol-itan areas.Microtremors were pioneered by Bertelli(1872)and then by Omori(1909).Engineering applications of microtremors were introduced by Gutenberg(1958)and then by Kanai and Tanaka (1961).Simultaneous observations of long-period microtremors were suitable for evaluation of the amplification due to the deep soil deposits(Kagami et al.,1982).The horizontal to vertical spectral ratio(HVSR)method wasfirst presented by Nakamura(1989).Currently,this method is known as a cost-efficient,reliable and effective tool to assess the site-specific parameters(Konno and Ohmachi,1998;Horike et al.,2001;Huang, 2002;Bard,2004,2008;Zhao et al.,2007;Nakamura,2008; Hardesty et al.,2010;Paudyal et al.,2013).Ibs-von Seht and Wohlenberg(1999)experimentally studied the relationship between sedimentary cover thickness and fundamental resonant frequencies using a microtremor observa-tion.They showed that the resonance frequency(in horizontal to vertical(H/V)spectra)correlates well with the entire soil thick-ness.Subsequently,several studies(e.g.Noguchi and Nishida, 2002;Toshinawa et al.,2003;Uebayashi,2003;Birgören et al., 2009;Özalaybey et al.,2011;Paudyal et al.,2012;Liu et al., 2015;Gao et al.,2016;Gosar,2017)applied the HVSR method to evaluating the thickness of soil coverage over a hard layer or bedrock.Over the last decades,electrical resistivity surveys were widely used to study the subsurface structural and sedimentary settings of different areas(e.g.Unsworth and Bedrosian,2004;Diaferia et al.,*Corresponding author.E-mail address:marzieh-khalili@shirazu.ac.ir(M.Khalili).Peer review under responsibility of Institute of Rock and Soil Mechanics,Chi-nese Academy ofSciences.Contents lists available at ScienceDirect Journal of Rock Mechanics and Geotechnical Engineering journal homep age:www.rockgeotech.org Journal of Rock Mechanics and Geotechnical Engineering11(2019)400e408https:///10.1016/j.jrmge.2018.12.0031674-7755Ó2019Institute of Rock and Soil Mechanics,Chinese Academy of Sciences.Production and hosting by Elsevier B.V.This is an open access article under the CC BY-NC-ND license(/licenses/by-nc-nd/4.0/).2006;Giocoli et al.,2008;Gyulai et al.,2013;Bezák et al.,2014; Mirzakurdeh and Khalili,2015;Garcia and Díaz,2016).The HVSR technique combined with other geophysical methods such as geoelectrical method is also observed to detect subsurface struc-tures(soil,subsoil,superficial deposits characterization,and fault) (e.g.Manakou et al.,2010;Benjumea et al.,2011;Moisidi et al., 2012;Gabàs et al.,2014;Galli et al.,2014;Sauret et al.,2015; Maresca and Berrino,2016;Pastén et al.,2016;Pischiutta et al., 2017).The aim of this paper was to detect subsurface geological structures(hidden faults)in an urban region in Shiraz,Iran using the safe geophysical methods(microtremor and geoelectrical methods).In this context,the HVSR or Nakamura method was used. In order to achieve an accurate result,the microtremor data were recorded alongfive boreholes with a known sediment thick-ness.Moreover,electrical resistivity method with continuous re-sistivity profiling(CRP)and Schlumberger arrays was used to detect the hidden faults and the results were compared with the micro-tremor data.2.Geological settingDue to the presence of the orogenic belt in Alpine-Himalayan tectonic movement,Iran is a seismically active area suffering from devastating earthquakes,which is characterized by active faults,recent volcanoes and high surface elevation along the Alpine-Himalaya orogenic belt(Zamani et al.,2011).The Zagros folded-thrust belt is the youngest and the most active part of this continental collision zone due to the tectonic complexity of the Earth,however,some of the fractures do not reach the ground surface(Berberian,1995).The study area,between latitude29 3305000N to29 3402000N and longitude52 2805000E to52 2903000E,is located in southern Shiraz, Fars Province,Iran(Fig.1).The area of interest is located in a sedimentary-structural zone and is a part of the Zagros folded belt that involves a sequence from the Mesozoic to the Cenozoic(Fig.2), i.e.the Sabz-Pushan fault zone which is known as an active lateral strike-slip fault.The historical and instrumental seismicity records in the study area indicate that this region is a seismically active area.This region has a moderate level of hazards for the future occurrence of a number of earthquakes with magnitude M b!4.5Richter(Zamani et al.,2012;Khalili and Zamani,2016).The Gurpi formation with Cretaceous age(the oldest)and the Quaternary deposits(the youngest)are exposed in this region.The dolomitic-carbonate Asmari-Jahrum formations(Paleocene-Miocene),Aghajari forma-tion,Bakhtiari formation and the calcareous Gachsaran-Razak for-mations have outcrops in the study area(Fig.2).Fig.1.Maps of(a)Iran,(b)Fars Province and Shiraz City,and(c)The study area.M.Khalili,A.V.Mirzakurdeh/Journal of Rock Mechanics and Geotechnical Engineering11(2019)400e408401From the perspective of structural geology,the existence of many tectonic structures such as anticline,syncline,joints and fractures with active seismicity indicate that this region is active.The axial trend of all mountains around the area coincides with the Zagros main trend (NW-SE).Most important and recognized faults in Shiraz and its surrounding areas are basically of thrust and strike-slip.The Sabz-Pushan Mountain as an anticline with double-plunge is located in the NW of the region and the Soltan Mountain as a reverse syncline is located in the SE of the Sabz-Pushan Mountain (Fig.2).Field investigations and facies/thickness con-tour maps revealed that the Sabz-Pushan fault zone is frequently active from Middle Cretaceous (Cenomanian)to recent time (Safari,2006).3.Methods and data 3.1.Microtremor analysisMicrotremor data are a time series of small amplitude ground vibrations in three orthogonal directions (NS,EW and vertical)(Guo et al.,2014).These data can be used to estimate the dynamic properties of a site.The HVSR method is an adequate tool to study subsurface soil structure and site response.This technique is especially recom-mended in regions with low-to-moderate seismic activities (Kyaw et al.,2015).Delgado et al.(2000)determined the average HVSR in each window byHVSR ¼ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiF 2NS þF 2EW. 2F 2V r (1)where F NS ,F EW and F V are the Fourier amplitude spectra in the NS,EW and vertical directions,respectively.The resonant frequency and ampli fication of the ground are calculated using the HVSR.The fundamental resonant frequency of the soil layer (f r )is closely related to the thickness of the soil layer (Ibs-von Seht and Wohlenberg,1999):h ¼af b r(2)where h is the depth of sediments (Quaternary),and a and b are the correlation coef ficients related to the geometric and geotechnical properties of the site.3.2.Resistivity surveysThe electrical resistivity method is used in a wide range of geophysical investigations such as exploration for minerals,engineering investigation,geothermal studies,archaeological sur-veys and geological mapping (Anomohanran,2013).Vertical electrical sounding (VES)and electrical pro filing (mapping)are two widely used types of electrical resistivity sur-veys.VES is based on the measurements of apparent resistivity.An electrical resistivity survey can be conducted using different elec-trode arrays,for example,pole-dipole,dipole-dipole,Wenner,and Schlumberger (Loke and Barker,1996;Reynolds,1997;Dahlin and Zhou,2004).In this study,to detect the subsurface fault(s)and to obtain more accurate results,the Schlumberger and CRP arrays were utilized.The Schlumberger con figuration is an array which is sensitive to both horizontal and vertical features.It has a good signal-to-noise ratio and an acceptable depth of investigation.CRP is to date the best geoelectrical array to detect lateral discontinuities such as dikes,faults,and fracture zones.This array is used to identify electrical resistance discontinuities underground.3.3.Borehole dataIn this context,the microtremor data were taken from five boreholes with a speci fic sediment thickness (Table 1).4.Results and discussionIn this study,the microtremor and geoelectrical methods were utilized to detect the subsurface geological structure (hidden fault)in the urban region.4.1.Microtremor observationsIn order to achieve the desired results and understand the capability of the method to detect hidden faults,we selected a study area in such a way that the probability of the existence of a fault below the surface would be high.For this,a part of a devel-oping city close to the seismically active zone (the Sabz-Pushan fault zone),with some borehole data,was investigated.BasedonFig.2.Cross-section along the Sabz-Pushan and Soltan Mountains with the SW-NE direction (the location of the C -C 0pro file shown in Fig.1).Table 1Sediment thicknesses (depths)of the five boreholes in the study area.Borehole No.Sediment thickness (m)BH119BH218BH334BH461BH540M.Khalili,A.V.Mirzakurdeh /Journal of Rock Mechanics and Geotechnical Engineering 11(2019)400e 408402the borehole locations,microtremor data were recorded in the five pro files.Three pro files A ,B and C were located parallel to each other and two pro files E and D were perpendicular to the first three ones (Fig.3).In order to avoid the in fluence of buildings,traf fic and other factors as much as possible,we recorded microtremors at midnight.Windy days were also avoided to enhance the reliability of HVSR analysis.In pro file A ,microtremor measurements were conducted over a length of 70m with 11stations.The other pro files (B ,C ,D and E )had a length of 190m,300m,356m and 360m with 14,17,9and 9stations,respectively (Fig.4).The spacing between the stations was approximated 10m.In all stations,the microtremor data were recorded within 65s at a sampling rate of 1ms,2ms and 125ms.Each of them was divided into the windows of 20s to 25s and 30swithout overlapping and the windows with strong temporal noise were removed.In this study,Geopsy software developed by Wathelet (2007)was used to gain the HVSR of the microtremor data.Fast Fourier transform (FFT)was applied to obtaining the spectra.Then,the obtained spectra were smoothed using the Konno-Ohmachi func-tion (Konno and Ohmachi,1998).The HVSR of each window was determined within a frequency band of 0.4e 20Hz.After gathering the HVSR for all windows of a station,the HVSR for the particular point was obtained using the average of these spectral ratios.The result indicates that the first peak of the H/V spectra plot corresponding to the frequency rep-resents the site ’s fundamental resonant frequency (Field and Jacob,1993;Bard,2004,2008;Bonnefoy-Claudet et al.,2006;Paudyal et al.,2012).Therefore,the speci fic fundamental frequency of the site can be obtained for all pro files.Scienti fically,the sediment thicknesses should be obtained from the HVSR peak frequencies in a region in which the properties of the sediments do not vary in the study area,and the depth of the basement is known at an acceptable of points or boreholes (e.g.Ibs-Fig.3.Locations of the microtremor pro files (purple lines)and the boreholes (red circles)in the studyarea.parison of Eq.(3)with other equations in the literature.Table 2Sediment thicknesses obtained from the five boreholes and resonance frequency data.Borehole No.Sediment thickness (m)Resonance frequency by microtremor (Hz)Borehole dataEq.(3)Eq.(4)BH11921.8720.71 2.9BH21816.115 3.57BH33438.9438.03 1.96BH46157.1956.99 1.51BH54036.1935.212.06Fig.5.Contour map of the predominant frequency of the study area.Predominant frequency is in Hz.M.Khalili,A.V.Mirzakurdeh /Journal of Rock Mechanics and Geotechnical Engineering 11(2019)400e 408403von Seht and Wohlenberg,1999;Parolai et al.,2002;Gosar and Lenart,2010).In this study,based on the Ibs-von Seht and Wohlenberg (1999)equation (Eq.(2)),and using the thickness of the sediment obtained from the boreholes (Table 1)and their resonant frequencies (Table 2),the following equation was proposed for the study area:h ¼104:94f À1:473r(3)Then,the thickness or depth of soft sediments (Table 2)can becalculated using Eq.(3).Since the five boreholes were insuf ficient for an accurate study,we compared Eq.(3)with the equations obtained from other in-vestigations.Then,a nonlinear regression analysis was performed (Fig.4)and the equations that most closely resembled Eq.(3)in this study were chosen.As shown in Fig.4,Parolai et al.(2002)equation (Eq.(4))has thesame form as Eq.(3)proposed in this study.Therefore,the corre-lation coef ficients (a and b )were obtained:h ¼108f À1:551r(4)The thickness or depth of soft sediments (alluvium)was also calculated using Eq.(4)(Table 2).For this,the contour map of the predominant frequency was plotted in Fig. 5.In this study,to validate the result accuracy,the contour maps of the alluvium ’s thickness were drawn using both Eqs.(3)and (4)(Fig.6a,b).The contour map (Fig.5)indicates that the predominant fre-quency of the study area dropped signi ficantly in a speci fic direc-tion (NW-SE).It is interesting to note that both of the alluvium thickness contour maps (Fig.6a,b)highlight a sudden change in the alluvium thickness in a speci fic direction (NW-SE).As shown in Figs.5and 6,the abrupt changes observed in the sediment thicknesses and predominant frequencies at the speci fic direction (NW-SE)can be related to the displacement of a fault in the region.Therefore,the possible fault path is marked on the contour maps (Figs.5and 6).Comparison of the results obtained from Eqs.(3)and (4)shows that although an acceptable number of the boreholes is unavailable in the study area,Eq.(3)is useful and reliable.It should be mentioned that the study was in an attempt to examine the thickness changes of the sediments in order to detect hidden fault.By changing the correlation coef ficients,the thickness of the sediments will change with a constant ratio.Thus,in any case (using Eq.(3),Parolai et al.(2002)equation,Hinzen et al.(2004)equation,Gosar and Lenart (2010)equation,and Motamed et al.(2007)equation),an abrupt change in the thickness of the sedi-ment could be clearly revealed.The results of the present study (Fig.6)con firmed this hypothesis.It seems that the resistance of the sedimentary layer had a signi ficant effect on the predominant frequency of the site.When a layer becomes looser and the thickness of the alluvium increases,the dominant frequency of the site will decrease,and viceversa.Fig.6.Alluvium thickness contour maps of the region obtained from (a)Eq.(3)and (b)Eq.(4).Sediment thickness is inm.Fig.7.Locations of the geoelectrical arrays (VES and CRP)in the study area.M.Khalili,A.V.Mirzakurdeh /Journal of Rock Mechanics and Geotechnical Engineering 11(2019)400e 4084044.2.Geoelectrical surveyThe electrical resistivity survey with the Schlumberger and CRP arrays was conducted to detect subsurface structures and the re-sults were compared with the microtremor data.4.2.1.Electrical resistivity survey with CRP arrayCRP measurements were conducted in seven stations over a profile with NE-SW direction.The station spacing was10m.A location map of the CRP profile is illustrated in Fig.7.At each station,three resistivity measurements with current electrode spacing AB/2ranging from10m to100m,and potential electrode spacing MN/2ranging from5m to10m were applied (Fig.8).Resistivity values were measured by using four-electrode arrays (BCMN and ACMN)for both forward and reverse(backward) movements along each station in successive steps.The resistivity charts of the arrays were drawn using Excel software(Fig.8).In Fig.8,the goal was to determine the location and depth of the fracture between the stations.In the resistivity charts of the CRP array,when two lines cross and then continue to diverge,it is interpreted as a fracture or lateral heterogeneity(Rashidi Gouya, 2005).In the resistivity charts of the CRP array,any intersection is not a fault as the collision lines must have a certain trend(one of them must have a decreasing trend and the other must have an increasing trend).Therefore,in Fig.8,the points where lines cross and then continue with the inverse trend are interpreted as the fractures.Their point depth values which were obtained from AB/2 were drawn against the CRP stations using Excel software(Fig.9).As shown in Fig.9,two fractures with different trends were explored in the region.Thefirst fault which was almost closeto Fig.8.Resistivity charts of the CRP array.Green arrows show a lateral heterogeneity orfracture.Fig.9.Detected faults by CRP array.M.Khalili,A.V.Mirzakurdeh/Journal of Rock Mechanics and Geotechnical Engineering11(2019)400e408405vertical with NW-SE trend was detected between the fourth and fifth stations at a depth of 5e 10m.The second fracture was detected at a greater depth of 15e 25m with SW-NE trend.4.2.2.Electrical resistivity survey with Schlumberger arrayThe Schlumberger array was used to identify the fault path,depth,and composition of subsurface layers.Three vertical elec-trical soundings (S 1,S 2and S 3)of the Schlumberger con figuration were performed in parallel to CRP pro file at a distance of 331m (Fig.8).The apparent resistivity was estimated as a subordinate of electrode spacing.The Schlumberger con figuration used an elec-trode spacing of AB ¼3m up to 300m.By interpreting the vertical electrical sounding curves,variations in resistivity of the soil and rock surroundings at a depth below the array center AMNB were detected.The apparent resistivity curve was converted to the thickness and true resistivity,for detected layers,using the IPI2win software (Fig.10).Geophysically,the geologic structure at the soundings S 1,S 2and S 3behaves like five-,five-and four-layer models,respectively,composed of alluvial deposit,limestone,limestone marl and marl (Fig.10).After interpreting the VES data,the solid rock depths along the pro files S 1,S 2and S 3were 55m,13m and 25m,respectively.A signi ficant difference in depth between the first and second pro files was noticed which can be considered as a fault.The horizontal and vertical distributions of the apparent re-sistivity data,using IPI2win software,were plotted in Fig.11.In this figure,the VES stations are located on the x -axis direction.As indicated by the obtained results,the detected faults by the microtremor and geoelectrical resistivity methods with the CRP and Schlumberger arrays are consistent with each other (Fig.7).Therefore,the new fault discovered here is named as the Mian-rood fault (the local name of the study area)and is projected on the geological map of the region (Fig.12).It is a nearly vertical fault with NW-SE trend.The results indicate that the Mianrood fault has the same trend as that of the active faults and the tec-tonic regime in the region.It can be concluded that the micro-tremor data and geoelectrical methods are useful and reliable ways to detect subsurface structures such as hidden faults,espe-cially in the urbanareas.Fig.10.Vertical electrical soundings (S 1,S 2and S 3)and their interpretations.Field data (apparent resistivity)marked by lines with the hollow circle,computed curves (true resistivity)represented by lines with solid circle,and interpretation of the computa-tional curves shown by solidlines.Fig.11.Pseudo-cross-section of apparent resistivity ðr a Þmeasurement along the electrical vertical soundings (S 1,S 2and S 3)as seen in Fig.10.The boundary between parts A and B has a high slope with sharp resistivity contrasts,and can be interpreted as a fault.M.Khalili,A.V.Mirzakurdeh /Journal of Rock Mechanics and Geotechnical Engineering 11(2019)400e 4084065.Concluding remarksThe results of microtremor analysis suggest that the abrupt changes in the sediment thicknesses and predominant frequencies at the speci fic direction (NW-SE)can be caused by the displace-ment of a nearly vertical fault with NW-SE trend.The results ob-tained from the electrical resistivity method with CRP and Schlumberger arrays illustrate the presence of a nearly vertical fault with NW-SE parison of all findings indicates that the faults detected by the microtremor and geoelectrical resistivity methods are consistent with each other.Finally,the new fault is discovered and named as Mianrood fault,suggesting that the combination of these methods is reliable in detecting the hidden faults.Con flicts of interestThe authors wish to con firm that there are no known con flicts of interests associated with this publication and there has been no signi ficant financial support for this work that could have in flu-enced its outcome.AcknowledgementsThis study was supported by the Center of Excellence for Envi-ronmental Geohazards and the Research Council of Shiraz University.ReferencesAnomohanran O.Evaluation of aquifer characteristics in Echi,Delta State,Nigeriausing well logging and pumping test method.American Journal of Applied Sciences 2013;10:1263e 9.Bard P.The SESAME project:an overview and main results.In:Proceedings of the13th world conference on earthquake engineering;2004.Bard P.The H/V technique:capabilities and limitations based on results of theSESAME project.Bulletin of Earthquake Engineering 2008;6(1):1e 2.Benjumea B,Macau A,Gabàs A,Bellmunt F,Figueras S,Cirés J.Integratedgeophysical pro files and H/V microtremor measurements for subsoil charac-terization.Near Surface Geophysics 2011;9(5):413e 25.Berberian M.Master “blind ”thrust faults hidden under the Zagros folds activebasement tectonics and surface morphotectonics.Tectonophysics 1995;241(3):193e 224.Bertelli T.Osservazioni sui piccolo movimenti dei pendoli in relazione ad alcunifenomeni meteorologiche.Bullettino Meteorologico dell ’Osservatorio dell Col-legio Romano 1872;9:101(in Italian).Bezák V,Pek J,Vozár J,Bielik M,Vozár J.Geoelectrical and geological structure of thecrust in Western Slovakia.Studia Geophysica et Geodaetica 2014;58(3):473e 88.Birgören G,Özel O,Siyahi B.Bedrock depth mapping of the coast south of Istanbul:comparison of analytical and experimental analyses.Turkish Journal of Earth Sciences 2009;18:315e 29.Bonnefoy-Claudet S,Cotton F,Bard PY.The nature of noise wave field and its ap-plications for site effects studies.A literature review.Earth Science Reviews 2006;79:205e 27.Dahlin T,Zhou B.A numerical comparison of 2D resistivity imaging with 10elec-trode arrays.Geophysical Prospecting 2004;52(5):379e 98.Delgado J,Lopez Casado C,Estevez A,Giner J,Cuenca A,Molina S.Mapping soft soilsin the Segura river valley (SE Spain):a case study of microtremors as an exploration tool.Journal of Applied Geophysics 2000;45(1):19e 32.Diaferia I,Barchi M,Loddo M,Schiavone D,Siniscalchi A.Detailed imaging of tec-tonic structures by multiscale earth resistivity tomographies:the Col fiorito normal faults (central Italy).Geophysical Research Letters 2006;33(9).https:///10.1029/2006GL025828.Field E,Jacob K.The theoretical response of sedimentary layers to ambient seismicnoise.Geophysical Research Letters 1993;20(24):2925e 8.Gabàs A,Macau A,Benjumea B,Bellmunt F,Figueras S,Vila bination ofgeophysical methods to support urban geological mapping.Surveys in Geophysics 2014;35(4):983e 1002.Galli PAC,Giocoli A,Peronace E,Piscitelli S,Quadrio B,Bellanova J.Integrated nearsurface geophysics across the active Mount Marzano Fault System (southern Italy):seismogenic hints.International Journal of Earth Sciences 2014;103(1):315e 25.Gao Y,Jiang Y,Li B.Voids delineation behind tunnel lining based on the vibrationintensity of microtremors.Tunnelling and Underground Space Technology 2016;51:338e 45.Garcia K,Díaz D.Three-dimensional geo-electrical structure in Juncalito geothermalprospect,northern Chile.Geothermics 2016;64:527e 37.Giocoli A,MagrìC,Vannoli P,Piscitelli S,Rizzo E,Siniscalchi A,Burrato P,Basso C,DiNocera S.Electrical resistivity tomography investigations in the U fita valley (southern Italy).Annals of Geophysics 2008;51(1):213e 23.Gosar A,Lenart A.Mapping the thickness of sediments in the Ljubljana Moor Basin(Slovenia)using microtremors.Bulletin of Earthquake Engineering 2010;8(3):501e 18.Gosar A.Study on the applicability of the microtremor HVSR method to supportseismic microzonation in the town of Idrija (W Slovenia).Natural Hazards and Earth System Sciences 2017;17:925e 37.Guo Z,Aydin A,Kuszmaul J.Microtremor recordings in northern Mississippi.En-gineering Geology 2014;179:146e 57.Gutenberg B.Microseisms.Advances in Geophysics 1958;5:53e 92.Gyulai Á,Dobróka M,Ormos T,Turai E,Sasvári T.In-mine geoelectric investigationsfor detecting tectonic disturbances in coal seam structures.Acta Geophysica 2013;61(5):1184e 95.Hardesty K,Wolf L,Bodin P.Noise to signal:a microtremor study at liquefactionsites in the New Madrid Seismic Zone.Geophysics 2010;75(3):83e 90.Hinzen KG,Weber B,Scherbaum F.On the resolution of H/V measurements todetermine sediment thickness,a case study across a normal fault in theLowerFig.12.Geological map of the study area (scale of 1:40,000)on which the new discovered fault (Mianrood fault)is projected.M.Khalili,A.V.Mirzakurdeh /Journal of Rock Mechanics and Geotechnical Engineering 11(2019)400e 408407。