Modeling The X-ray Timing Properties Of Cygnus X-1 As Caused By Waves Propagating In A Tran
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19StandardMath ToolsDisplay up to four math function traces (F1-F4). The easy-to-use graphical interface simplifies setup of up to two operations on each function trace;and function traces can be chained together to perform math-on-math.absolute value integralaverage (summed)invert (negate)average (continuous)log (base e)custom (MATLAB) – limited points product (x)derivativeratio (/)deskew (resample)reciprocaldifference (–)rescale (with units)enhanced resolution (to 11 bits vertical)roof envelope (sinx)/x exp (base e)square exp (base 10)square root fft (power spectrum, magnitude, phase,sum (+)up to 50 kpts) trend (datalog) of 1000 events floorzoom (identity)histogram of 1000 eventsMeasure ToolsDisplay any 6 parameters together with statistics, including their average,high, low, and standard deviations. Histicons provide a fast, dynamic view of parameters and wave-shape characteristics.Pass/Fail TestingSimultaneously test multiple parameters against selectable parameter limits or pre-defined masks. Pass or fail conditions can initiate actions including document to local or networked files, e-mail the image of the failure, save waveforms, send a pulse out at the rear panel auxiliary BNC output, or (with the GPIB option) send a GPIB SRQ.Jitter and Timing Analysis Software Package (WRXi-JTA2)(Standard with MXi-A model oscilloscopes)•Jitter and timing parameters, with “Track”graphs of •Edge@lv parameter (counts edges)• Persistence histogram, persistence trace (mean, range, sigma)Software Options –Advanced Math and WaveShape AnalysisStatistics Package (WRXi-STAT)This package provides additional capability to statistically display measurement information and to analyze results:• Histograms expanded with 19 histogram parameters/up to 2 billion events.• Persistence Histogram• Persistence Trace (mean, range, sigma)Master Analysis Software Package (WRXi-XMAP)(Standard with MXi-A model oscilloscopes)This package provides maximum capability and flexibility, and includes all the functionality present in XMATH, XDEV, and JTA2.Advanced Math Software Package (WRXi-XMATH)(Standard with MXi-A model oscilloscopes)This package provides a comprehensive set of WaveShape Analysis tools providing insight into the wave shape of complex signals. Includes:•Parameter math – add, subtract, multiply, or divide two different parameters.Invert a parameter and rescale parameter values.•Histograms expanded with 19 histogram parameters/up to 2 billion events.•Trend (datalog) of up to 1 million events•Track graphs of any measurement parameter•FFT capability includes: power averaging, power density, real and imaginary components, frequency domain parameters, and FFT on up to 24 Mpts.•Narrow-band power measurements •Auto-correlation function •Sparse function• Cubic interpolation functionAdvanced Customization Software Package (WRXi-XDEV)(Standard with MXi-A model oscilloscopes)This package provides a set of tools to modify the scope and customize it to meet your unique needs. Additional capability provided by XDEV includes:•Creation of your own measurement parameter or math function, using third-party software packages, and display of the result in the scope. Supported third-party software packages include:– VBScript – MATLAB – Excel•CustomDSO – create your own user interface in a scope dialog box.• Addition of macro keys to run VBScript files •Support for plug-insValue Analysis Software Package (WRXi-XVAP)(Standard with MXi-A model oscilloscopes)Measurements:•Jitter and Timing parameters (period@level,width@level, edge@level,duty@level, time interval error@level, frequency@level, half period, setup, skew, Δ period@level, Δ width@level).Math:•Persistence histogram •Persistence trace (mean, sigma, range)•1 Mpts FFTs with power spectrum density, power averaging, real, imaginary, and real+imaginary settings)Statistical and Graphical Analysis•1 Mpts Trends and Histograms •19 histogram parameters •Track graphs of any measurement parameterIntermediate Math Software Package (WRXi-XWAV)Math:•1 Mpts FFTs with power spectrum density, power averaging, real, and imaginary componentsStatistical and Graphical Analysis •1 Mpts Trends and Histograms •19 histogram parameters•Track graphs of any measurement parameteramplitude area base cyclescustom (MATLAB,VBScript) –limited points delay Δdelay duration duty cyclefalltime (90–10%, 80–20%, @ level)firstfrequency lastlevel @ x maximum mean median minimumnumber of points +overshoot –overshoot peak-to-peak period phaserisetime (10–90%, 20–80%, @ level)rmsstd. deviation time @ level topΔ time @ levelΔ time @ level from triggerwidth (positive + negative)x@ max.x@ min.– Cycle-Cycle Jitter – N-Cycle– N-Cycle with start selection – Frequency– Period – Half Period – Width– Time Interval Error – Setup– Hold – Skew– Duty Cycle– Duty Cycle Error20WaveRunner WaveRunner WaveRunner WaveRunner WaveRunner 44Xi-A64Xi-A62Xi-A104Xi-A204Xi-AVertical System44MXi-A64MXi-A104MXi-A204MXi-ANominal Analog Bandwidth 400 MHz600 MHz600 MHz 1 GHz 2 GHz@ 50 Ω, 10 mV–1 V/divRise Time (Typical)875 ps500 ps500 ps300 ps180 psInput Channels44244Bandwidth Limiters20 MHz; 200 MHzInput Impedance 1 MΩ||16 pF or 50 Ω 1 MΩ||20 pF or 50 ΩInput Coupling50 Ω: DC, 1 MΩ: AC, DC, GNDMaximum Input Voltage50 Ω: 5 V rms, 1 MΩ: 400 V max.50 Ω: 5 V rms, 1 MΩ: 250 V max.(DC + Peak AC ≤ 5 kHz)(DC + Peak AC ≤ 10 kHz)Vertical Resolution8 bits; up to 11 with enhanced resolution (ERES)Sensitivity50 Ω: 2 mV/div–1 V/div fully variable; 1 MΩ: 2 mV–10 V/div fully variableDC Gain Accuracy±1.0% of full scale (typical); ±1.5% of full scale, ≥ 10 mV/div (warranted)Offset Range50 Ω: ±1 V @ 2–98 mV/div, ±10 V @ 100 mV/div–1 V/div; 50Ω:±400mV@2–4.95mV/div,±1V@5–99mv/div,1 M Ω: ±1 V @ 2–98 mV/div, ±10 V @ 100 mV/div–1 V/div,±10 V @ 100 mV–1 V/div±**********/div–10V/div 1 M Ω: ±400 mV @ 2–4.95 mV/div, ±1 V @5–99 mV/div, ±10 V @ 100 mV–1 V/div,±*********–10V/divInput Connector ProBus/BNCTimebase SystemTimebases Internal timebase common to all input channels; an external clock may be applied at the auxiliary inputTime/Division Range Real time: 200 ps/div–10 s/div, RIS mode: 200 ps/div to 10 ns/div, Roll mode: up to 1,000 s/divClock Accuracy≤ 5 ppm @ 25 °C (typical) (≤ 10 ppm @ 5–40 °C)Sample Rate and Delay Time Accuracy Equal to Clock AccuracyChannel to Channel Deskew Range±9 x time/div setting, 100 ms max., each channelExternal Sample Clock DC to 600 MHz; (DC to 1 GHz for 104Xi-A/104MXi-A and 204Xi-A/204MXi-A) 50 Ω, (limited BW in 1 MΩ),BNC input, limited to 2 Ch operation (1 Ch in 62Xi-A), (minimum rise time and amplitude requirements applyat low frequencies)Roll Mode User selectable at ≥ 500 ms/div and ≤100 kS/s44Xi-A64Xi-A62Xi-A104Xi-A204Xi-A Acquisition System44MXi-A64MXi-A104MXi-A204MXi-ASingle-Shot Sample Rate/Ch 5 GS/sInterleaved Sample Rate (2 Ch) 5 GS/s10 GS/s10 GS/s10 GS/s10 GS/sRandom Interleaved Sampling (RIS)200 GS/sRIS Mode User selectable from 200 ps/div to 10 ns/div User selectable from 100 ps/div to 10 ns/div Trigger Rate (Maximum) 1,250,000 waveforms/secondSequence Time Stamp Resolution 1 nsMinimum Time Between 800 nsSequential SegmentsAcquisition Memory Options Max. Acquisition Points (4 Ch/2 Ch, 2 Ch/1 Ch in 62Xi-A)Segments (Sequence Mode)Standard12.5M/25M10,00044Xi-A64Xi-A62Xi-A104Xi-A204Xi-A Acquisition Processing44MXi-A64MXi-A104MXi-A204MXi-ATime Resolution (min, Single-shot)200 ps (5 GS/s)100 ps (10 GS/s)100 ps (10 GS/s)100 ps (10 GS/s)100 ps (10 GS/s) Averaging Summed and continuous averaging to 1 million sweepsERES From 8.5 to 11 bits vertical resolutionEnvelope (Extrema)Envelope, floor, or roof for up to 1 million sweepsInterpolation Linear or (Sinx)/xTrigger SystemTrigger Modes Normal, Auto, Single, StopSources Any input channel, External, Ext/10, or Line; slope and level unique to each source, except LineTrigger Coupling DC, AC (typically 7.5 Hz), HF Reject, LF RejectPre-trigger Delay 0–100% of memory size (adjustable in 1% increments, or 100 ns)Post-trigger Delay Up to 10,000 divisions in real time mode, limited at slower time/div settings in roll modeHold-off 1 ns to 20 s or 1 to 1,000,000,000 events21WaveRunner WaveRunner WaveRunner WaveRunner WaveRunner 44Xi-A 64Xi-A 62Xi-A104Xi-A 204Xi-A Trigger System (cont’d)44MXi-A64MXi-A104MXi-A204MXi-AInternal Trigger Level Range ±4.1 div from center (typical)Trigger and Interpolator Jitter≤ 3 ps rms (typical)Trigger Sensitivity with Edge Trigger 2 div @ < 400 MHz 2 div @ < 600 MHz 2 div @ < 600 MHz 2 div @ < 1 GHz 2 div @ < 2 GHz (Ch 1–4 + external, DC, AC, and 1 div @ < 200 MHz 1 div @ < 200 MHz 1 div @ < 200 MHz 1 div @ < 200 MHz 1 div @ < 200 MHz LFrej coupling)Max. Trigger Frequency with400 MHz 600 MHz 600 MHz 1 GHz2 GHzSMART Trigger™ (Ch 1–4 + external)@ ≥ 10 mV@ ≥ 10 mV@ ≥ 10 mV@ ≥ 10 mV@ ≥ 10 mVExternal Trigger RangeEXT/10 ±4 V; EXT ±400 mVBasic TriggersEdgeTriggers when signal meets slope (positive, negative, either, or Window) and level conditionTV-Composite VideoT riggers NTSC or PAL with selectable line and field; HDTV (720p, 1080i, 1080p) with selectable frame rate (50 or 60 Hz)and Line; or CUSTOM with selectable Fields (1–8), Lines (up to 2000), Frame Rates (25, 30, 50, or 60 Hz), Interlacing (1:1, 2:1, 4:1, 8:1), or Synch Pulse Slope (Positive or Negative)SMART TriggersState or Edge Qualified Triggers on any input source only if a defined state or edge occurred on another input source.Delay between sources is selectable by time or eventsQualified First In Sequence acquisition mode, triggers repeatedly on event B only if a defined pattern, state, or edge (event A) is satisfied in the first segment of the acquisition. Delay between sources is selectable by time or events Dropout Triggers if signal drops out for longer than selected time between 1 ns and 20 s.PatternLogic combination (AND, NAND, OR, NOR) of 5 inputs (4 channels and external trigger input – 2 Ch+EXT on WaveRunner 62Xi-A). Each source can be high, low, or don’t care. The High and Low level can be selected independently. Triggers at start or end of the patternSMART Triggers with Exclusion TechnologyGlitch and Pulse Width Triggers on positive or negative glitches with widths selectable from 500 ps to 20 s or on intermittent faults (subject to bandwidth limit of oscilloscope)Signal or Pattern IntervalTriggers on intervals selectable between 1 ns and 20 sTimeout (State/Edge Qualified)Triggers on any source if a given state (or transition edge) has occurred on another source.Delay between sources is 1 ns to 20 s, or 1 to 99,999,999 eventsRuntTrigger on positive or negative runts defined by two voltage limits and two time limits. Select between 1 ns and 20 sSlew RateTrigger on edge rates. Select limits for dV, dt, and slope. Select edge limits between 1 ns and 20 s Exclusion TriggeringTrigger on intermittent faults by specifying the normal width or periodLeCroy WaveStream Fast Viewing ModeIntensity256 Intensity Levels, 1–100% adjustable via front panel control Number of Channels up to 4 simultaneouslyMax Sampling Rate5 GS/s (10 GS/s for WR 62Xi-A, 64Xi-A/64MXi-A,104Xi-A/104MXi-A, 204Xi-A/204MXi-A in interleaved mode)Waveforms/second (continuous)Up to 20,000 waveforms/secondOperationFront panel toggle between normal real-time mode and LeCroy WaveStream Fast Viewing modeAutomatic SetupAuto SetupAutomatically sets timebase, trigger, and sensitivity to display a wide range of repetitive signalsVertical Find ScaleAutomatically sets the vertical sensitivity and offset for the selected channels to display a waveform with maximum dynamic range44Xi-A 64Xi-A 62Xi-A104Xi-A 204Xi-A Probes44MXi-A 64MXi-A104MXi-A 204MXi-AProbesOne Passive probe per channel; Optional passive and active probes available Probe System; ProBus Automatically detects and supports a variety of compatible probes Scale FactorsAutomatically or manually selected, depending on probe usedColor Waveform DisplayTypeColor 10.4" flat-panel TFT-LCD with high resolution touch screenResolutionSVGA; 800 x 600 pixels; maximum external monitor output resolution of 2048 x 1536 pixelsNumber of Traces Display a maximum of 8 traces. Simultaneously display channel, zoom, memory, and math traces Grid StylesAuto, Single, Dual, Quad, Octal, XY , Single + XY , Dual + XY Waveform StylesSample dots joined or dots only in real-time mode22Zoom Expansion TracesDisplay up to 4 Zoom/Math traces with 16 bits/data pointInternal Waveform MemoryM1, M2, M3, M4 Internal Waveform Memory (store full-length waveform with 16 bits/data point) or store to any number of files limited only by data storage mediaSetup StorageFront Panel and Instrument StatusStore to the internal hard drive, over the network, or to a USB-connected peripheral deviceInterfaceRemote ControlVia Windows Automation, or via LeCroy Remote Command Set Network Communication Standard VXI-11 or VICP , LXI Class C Compliant GPIB Port (Accessory)Supports IEEE – 488.2Ethernet Port 10/100/1000Base-T Ethernet interface (RJ-45 connector)USB Ports5 USB 2.0 ports (one on front of instrument) supports Windows-compatible devices External Monitor Port Standard 15-pin D-Type SVGA-compatible DB-15; connect a second monitor to use extended desktop display mode with XGA resolution Serial PortDB-9 RS-232 port (not for remote oscilloscope control)44Xi-A 64Xi-A 62Xi-A104Xi-A 204Xi-A Auxiliary Input44MXi-A 64MXi-A104MXi-A 204MXi-ASignal Types Selected from External Trigger or External Clock input on front panel Coupling50 Ω: DC, 1 M Ω: AC, DC, GND Maximum Input Voltage50 Ω: 5 V rms , 1 M Ω: 400 V max.50 Ω: 5 V rms , 1 M Ω: 250 V max. (DC + Peak AC ≤ 5 kHz)(DC + Peak AC ≤ 10 kHz)Auxiliary OutputSignal TypeTrigger Enabled, Trigger Output. Pass/Fail, or Off Output Level TTL, ≈3.3 VConnector TypeBNC, located on rear panelGeneralAuto Calibration Ensures specified DC and timing accuracy is maintained for 1 year minimumCalibratorOutput available on front panel connector provides a variety of signals for probe calibration and compensationPower Requirements90–264 V rms at 50/60 Hz; 115 V rms (±10%) at 400 Hz, Automatic AC Voltage SelectionInstallation Category: 300 V CAT II; Max. Power Consumption: 340 VA/340 W; 290 VA/290 W for WaveRunner 62Xi-AEnvironmentalTemperature: Operating+5 °C to +40 °C Temperature: Non-Operating -20 °C to +60 °CHumidity: Operating Maximum relative humidity 80% for temperatures up to 31 °C decreasing linearly to 50% relative humidity at 40 °CHumidity: Non-Operating 5% to 95% RH (non-condensing) as tested per MIL-PRF-28800F Altitude: OperatingUp to 3,048 m (10,000 ft.) @ ≤ 25 °C Altitude: Non-OperatingUp to 12,190 m (40,000 ft.)PhysicalDimensions (HWD)260 mm x 340 mm x 152 mm Excluding accessories and projections (10.25" x 13.4" x 6")Net Weight7.26kg. (16.0lbs.)CertificationsCE Compliant, UL and cUL listed; Conforms to EN 61326, EN 61010-1, UL 61010-1 2nd Edition, and CSA C22.2 No. 61010-1-04Warranty and Service3-year warranty; calibration recommended annually. Optional service programs include extended warranty, upgrades, calibration, and customization services23Product DescriptionProduct CodeWaveRunner Xi-A Series Oscilloscopes2 GHz, 4 Ch, 5 GS/s, 12.5 Mpts/ChWaveRunner 204Xi-A(10 GS/s, 25 Mpts/Ch in interleaved mode)with 10.4" Color Touch Screen Display 1 GHz, 4 Ch, 5 GS/s, 12.5 Mpts/ChWaveRunner 104Xi-A(10 GS/s, 25 Mpts/Ch in interleaved mode)with 10.4" Color Touch Screen Display 600 MHz, 4 Ch, 5 GS/s, 12.5 Mpts/Ch WaveRunner 64Xi-A(10 GS/s, 25 Mpts/Ch in interleaved mode)with 10.4" Color Touch Screen Display 600 MHz, 2 Ch, 5 GS/s, 12.5 Mpts/Ch WaveRunner 62Xi-A(10 GS/s, 25 Mpts/Ch in interleaved mode)with 10.4" Color Touch Screen Display 400 MHz, 4 Ch, 5 GS/s, 12.5 Mpts/Ch WaveRunner 44Xi-A(25 Mpts/Ch in interleaved mode)with 10.4" Color Touch Screen DisplayWaveRunner MXi-A Series Oscilloscopes2 GHz, 4 Ch, 5 GS/s, 12.5 Mpts/ChWaveRunner 204MXi-A(10 GS/s, 25 Mpts/Ch in Interleaved Mode)with 10.4" Color Touch Screen Display 1 GHz, 4 Ch, 5 GS/s, 12.5 Mpts/ChWaveRunner 104MXi-A(10 GS/s, 25 Mpts/Ch in Interleaved Mode)with 10.4" Color Touch Screen Display 600 MHz, 4 Ch, 5 GS/s, 12.5 Mpts/Ch WaveRunner 64MXi-A(10 GS/s, 25 Mpts/Ch in Interleaved Mode)with 10.4" Color Touch Screen Display 400 MHz, 4 Ch, 5 GS/s, 12.5 Mpts/Ch WaveRunner 44MXi-A(25 Mpts/Ch in Interleaved Mode)with 10.4" Color Touch Screen DisplayIncluded with Standard Configuration÷10, 500 MHz, 10 M Ω Passive Probe (Total of 1 Per Channel)Standard Ports; 10/100/1000Base-T Ethernet, USB 2.0 (5), SVGA Video out, Audio in/out, RS-232Optical 3-button Wheel Mouse – USB 2.0Protective Front Cover Accessory PouchGetting Started Manual Quick Reference GuideAnti-virus Software (Trial Version)Commercial NIST Traceable Calibration with Certificate 3-year WarrantyGeneral Purpose Software OptionsStatistics Software Package WRXi-STAT Master Analysis Software Package WRXi-XMAP (Standard with MXi-A model oscilloscopes)Advanced Math Software Package WRXi-XMATH (Standard with MXi-A model oscilloscopes)Intermediate Math Software Package WRXi-XWAV (Standard with MXi-A model oscilloscopes)Value Analysis Software Package (Includes XWAV and JTA2) WRXi-XVAP (Standard with MXi-A model oscilloscopes)Advanced Customization Software Package WRXi-XDEV (Standard with MXi-A model oscilloscopes)Spectrum Analyzer and Advanced FFT Option WRXi-SPECTRUM Processing Web Editor Software Package WRXi-XWEBProduct Description Product CodeApplication Specific Software OptionsJitter and Timing Analysis Software Package WRXi-JTA2(Standard with MXi-A model oscilloscopes)Digital Filter Software PackageWRXi-DFP2Disk Drive Measurement Software Package WRXi-DDM2PowerMeasure Analysis Software Package WRXi-PMA2Serial Data Mask Software PackageWRXi-SDM QualiPHY Enabled Ethernet Software Option QPHY-ENET*QualiPHY Enabled USB 2.0 Software Option QPHY-USB †EMC Pulse Parameter Software Package WRXi-EMC Electrical Telecom Mask Test PackageET-PMT* TF-ENET-B required. †TF-USB-B required.Serial Data OptionsI 2C Trigger and Decode Option WRXi-I2Cbus TD SPI Trigger and Decode Option WRXi-SPIbus TD UART and RS-232 Trigger and Decode Option WRXi-UART-RS232bus TD LIN Trigger and Decode Option WRXi-LINbus TD CANbus TD Trigger and Decode Option CANbus TD CANbus TDM Trigger, Decode, and Measure/Graph Option CANbus TDM FlexRay Trigger and Decode Option WRXi-FlexRaybus TD FlexRay Trigger and Decode Physical Layer WRXi-FlexRaybus TDP Test OptionAudiobus Trigger and Decode Option WRXi-Audiobus TDfor I 2S , LJ, RJ, and TDMAudiobus Trigger, Decode, and Graph Option WRXi-Audiobus TDGfor I 2S LJ, RJ, and TDMMIL-STD-1553 Trigger and Decode Option WRXi-1553 TDA variety of Vehicle Bus Analyzers based on the WaveRunner Xi-A platform are available.These units are equipped with a Symbolic CAN trigger and decode.Mixed Signal Oscilloscope Options500 MHz, 18 Ch, 2 GS/s, 50 Mpts/Ch MS-500Mixed Signal Oscilloscope Option 250 MHz, 36 Ch, 1 GS/s, 25 Mpts/ChMS-500-36(500 MHz, 18 Ch, 2 GS/s, 50 Mpts/Ch Interleaved) Mixed Signal Oscilloscope Option 250 MHz, 18 Ch, 1 GS/s, 10 Mpts/Ch MS-250Mixed Signal Oscilloscope OptionProbes and Amplifiers*Set of 4 ZS1500, 1.5 GHz, 0.9 pF , 1 M ΩZS1500-QUADPAK High Impedance Active ProbeSet of 4 ZS1000, 1 GHz, 0.9 pF , 1 M ΩZS1000-QUADPAK High Impedance Active Probe 2.5 GHz, 0.7 pF Active Probe HFP25001 GHz Active Differential Probe (÷1, ÷10, ÷20)AP034500 MHz Active Differential Probe (x10, ÷1, ÷10, ÷100)AP03330 A; 100 MHz Current Probe – AC/DC; 30 A rms ; 50 A rms Pulse CP03130 A; 50 MHz Current Probe – AC/DC; 30 A rms ; 50 A rms Pulse CP03030 A; 50 MHz Current Probe – AC/DC; 30 A rms ; 50 A peak Pulse AP015150 A; 10 MHz Current Probe – AC/DC; 150 A rms ; 500 A peak Pulse CP150500 A; 2 MHz Current Probe – AC/DC; 500 A rms ; 700 A peak Pulse CP5001,400 V, 100 MHz High-Voltage Differential Probe ADP3051,400 V, 20 MHz High-Voltage Differential Probe ADP3001 Ch, 100 MHz Differential Amplifier DA1855A*A wide variety of other passive, active, and differential probes are also available.Consult LeCroy for more information.Product Description Product CodeHardware Accessories*10/100/1000Base-T Compliance Test Fixture TF-ENET-B †USB 2.0 Compliance Test Fixture TF-USB-B External GPIB Interface WS-GPIBSoft Carrying Case WRXi-SOFTCASE Hard Transit CaseWRXi-HARDCASE Mounting Stand – Desktop Clamp Style WRXi-MS-CLAMPRackmount Kit WRXi-RACK Mini KeyboardWRXi-KYBD Removable Hard Drive Package (Includes removeable WRXi-A-RHD hard drive kit and two hard drives)Additional Removable Hard DriveWRXi-A-RHD-02* A variety of local language front panel overlays are also available .† Includes ENET-2CAB-SMA018 and ENET-2ADA-BNCSMA.Customer ServiceLeCroy oscilloscopes and probes are designed, built, and tested to ensure high reliability. In the unlikely event you experience difficulties, our digital oscilloscopes are fully warranted for three years, and our probes are warranted for one year.This warranty includes:• No charge for return shipping • Long-term 7-year support• Upgrade to latest software at no chargeLocal sales offices are located throughout the world. Visit our website to find the most convenient location.© 2010 by LeCroy Corporation. All rights reserved. Specifications, prices, availability, and delivery subject to change without notice. Product or brand names are trademarks or requested trademarks of their respective holders.1-800-5-LeCroy WRXi-ADS-14Apr10PDF。
Core ModuleGeometry Creation and Editing• Lens primitives (rectangular or circular apertures)• Spline sweep and patch surfaces• Polyline sweeps and extrusions• Conic trough and revolved reflectors• Cylinders, blocks, spheres, toroids, and skinned solids• Union, intersection, subtraction boolean operations• Object trim operation• Move, rotate, scale, align• Copy, rectangular, and circular pattern copy• Multiple and partial immersion and cementing for solid objects• Pickups for parametric modeling• Grouping of model entitiesOptical Properties• Specular reflection/transmission/TIR with Fresnel losses• Diffuse transmission/reflection• Scatter models: mixed diffuse, narrow angle, and angle of incidence (AOI)• Volume scattering (Mie, user defined)• Scattering aim regions• User-defined coatings• Probabilistic ray splitting and importance sampling• Constant or varying optical density or transmittance vs. length• Index of refraction (constant, interpolated, standard dispersion formulas)• Surface patterns of 2D or 3D elements• Photorealistic rendering (Illumination Module needed for lit appearance)User Interface and Other Features• ActiveX interface for macro programming in MS Excel, VB, VC++, Matlab, Mathematica, and others • OpenGL-rendered graphics• Tabbed windows and editable spreadsheets• Multiple design views and navigation windows• Point-and-click, copy-and-paste, moving and resizing of windows• Extensive help featuresPoint-and-Shoot Ray Tracing• Parallel, diverging, or converging sets of rays• Individual rays, 2D ray fans, 3D ray grids• Sequential and non-sequential ray propagationLibraries• LED sources• Display films• Application and feature examplesIllumination ModulePowerful illumination analysis capabilities, such as photorealistic renderings that show the luminance effects of light sources in the model, simulate real-world conditions and reduce the need for physical prototypes.Illumination Analysis• Photorealistic Rendering• Photometric or radiometric analysis using forward and backward ray tracing• Illuminance, luminance, luminous intensity• Line charts, raster, contour, and surface charts• Colorimetric analysis: 1931 and 1976 CIE coordinates, correlated color temperature• RGB output display, CIE chromaticity chart• Post-processing of output data• Receiver data filtering using over a dozen filter types• Encircled and ensquared energy• Spectral power distribution• Multi-CPU processingSources and Receivers• Point sources• Volume and surface emitters (spheres, cylinders, blocks, toroids)• User-defined spatial, volume, and angular distributions• Source emittance aim regions• Spectral distributions: Blackbody, Gaussian, continuous, discrete, and user defined• Angular and spatial importance sampling• Ray data sources and Radiant Imaging source model support• Surface and far field receivers• Angular and spatial luminance meters• Receiver aperture sub-samplingOptimization ModuleThe Optimization Module gives designers tremendous flexibility to choose from hundreds of system parameters to designate as variables, constraints, and performance criteria in order to achieve the desired system performance.Illumination Optimization• Optimize illumination uniformity and/or flux on a receiver• Match target illumination distributions• Collimate and focus merit functions for non-sequential rays• Lagrange constraint handling• User-defined variables, constraints, and performance criteria• Vary any floating point model parameter• User-defined combinations of parameters• Bounded and unbounded variables• Backlight pattern optimization utility• Parameter sensitivity utility• Point-and-shoot ray merit functionsAdvanced Design ModuleThe Advanced Design Module leverages proprietary algorithms from Synopsys’ LucidShape products that automatically calculate and construct optical geometries based on user-defined illuminance and intensity patterns. This unique, functional approach gives designers the freedom to focus on overall design objectives rather than the implementation details of complex optical components.• Freeform Design features for modeling freeform reflective and refractive surfaces that are automatically shaped to form the resulting light pattern.• MacroFocal Reflector tool for designing multi-surface segmented reflectors, with different spreads for each facet.• Procedural Rectangle Lens tool for designing surfaces with pillowed optical arrays.• LED Lens tool for creating various types of freeform LED collimator lenses.Advanced Physics Module• Designers can take advantage of programming extensions to develop custom optical parts and advanced illumination subsystems using:• Phosphor particle modeling (single and multiple)• Gradient Index (GRIN) materials - used in copiers, scanners, and fiber optic telecommunication systems.• User-defined optical properties (UDOPs) - such as proprietary polarization components, scatterers, coatings, and other specialty optical materials.• Birefringent (uniaxial) materials - used in advanced applications such as AR/VR headsets and biomedical instruments.The results for UDOPs and birefringent materials can be packaged into a portable format and exchanged with your project team, customers, suppliers, and subcontractors.SOLIDWORKS Link ModuleThe SOLIDWORKS Link Module enables you to link SOLIDWORKS 3D opto-mechanical models to LightTools, where you can assign optical properties and use the Optimization Module to optimize your design. This module provides complete parametric interoperability between LightTools models and SOLIDWORKS.Data Exchange ModulesSupporting features for the Data Exchange Modules include the ability to group and simplify imported geometry and perform geometry repairs to maintain CAD model integrity and improve ray trace speed.Translators• SAT version 1.0 through 7.0• STEP AP 203 and AP 214• IGES version 5.3, including surfaces and solids• Parasolid• CATIA V4 and V5 (import and export)• Grouping and simplification of imported surfaces• Geometry repairLightTools SmartStart Library ModuleProvides access to a library of materials and media commonly used in the design of automotive lighting systems. Includes refractive index and absorption data as well as pre-defined volume scatter and BSDF materials.Imaging Path Module• Sequential ray tracing• Paraxial solves• Image path view• Spot diagram and transverse aberration plotsDistributed Simulation ModuleThe Distributed Simulation Module allows you to distribute Monte Carlo ray tracing over multiple computers to speed simulations of complex optical models.©2022 Synopsys, Inc. All rights reserved. Synopsys is a trademark of Synopsys, Inc. in the United States and other countries. A list of Synopsys trademarks isavailable at /copyright.html . All other names mentioned herein are trademarks or registered trademarks of their respective owners.。
本教程由【小羽】编辑FSHY2002@第 1 页Mental ray是一个专业的3D渲染引擎,它可以生成令人难以置信的高质量真实感图象。
现在你可以在3D Studio的高性能网络渲染中直接控制Mental ray 。
它在电影领域得到了广泛的应用和认可,被认为是市场上最高级的三维渲染解决方案之一。
原来它一直是Softimage标榜自己身价的重要筹码,现在已经被好心的软件商移植到了3D Studio MAX上,其无缝的集成使3D Studio MAX的用户需进行简单的学习就可以使用。
也就是说现在在Max中你也能得到和在Softimage中一样的高质量的渲染质感。
我们先来看一看Mental Ray的主要概念和功能:1.接近现实的快速反射效果Reflection(支持Ray Tracing贴图);2.接近现实的快速折射效果Refraction(支持Ray Tracing贴图);3.运动模糊(Motion Blur),特别是能够生成阴影的运动模糊;4.能渲染出原来只有在Video Post里才能实现的景深效果(Depth of Field );5.智能光全局照明Global Illumination,光线扩散(radiosity)使物体自身表面的色彩扩展到其他物体表面;6.优秀的折射和反射聚光(Caustics)效果;7.完美的双CPU支持在进行Mental Ray的学习之前,我们有必要了解一下Mental Ray中一些术语的概念。
1.Ray-traced Reflection and Refraction(光线追踪方式的反射和折射):反射和折射的概念我想不必再用过多的词语来解释,只是里面有一个追踪深度(Trace depth)的概念,是用来限制光线反射和折射次数的因素。
2.Motion blur(运动模糊):在真实照相机拍摄动画时会产生因为运动而产生模糊的效果。
2.Depth of field(景深):照相机聚焦于一点或一个平面,越远离这一点的场景越模糊。
电气信息工程学院大作业/论文11 — 12 学年第二学期课题名称基于组态王的交通灯控制系统姓名学号班级成绩组态王智能控制交通灯[摘要] 交通系统是一个具有随机性、模糊性和不确定性的复杂系统,建立数学模型非常困难,有时甚至无法用现有的数学方法加以描述。
目前大多采用的是自适应信号控制,它需要数学建模,且不考虑交通延误、停车次数等。
运用组态王系统能模仿有经验的交警指挥交通时的思路,达到很好的控制效果。
通过实验保证了系统运行稳定可靠,能根据不同的交通流量进行模糊控制决策,优化信号灯的配时,从而可以有效的解决交通流量不均衡、不稳定带来的问题。
关键词:交通、智能控制、组态Abstract: Traffic system is a randomness, fuzziness and uncertainty of complex system, the mathematical model is very difficult, sometimes can't even use the existing mathematics method are described. At present, we often use is adaptive signal control, it need mathematical modeling, and don't consider traffic delay, parking number, etc. Use kingview system can imitate the traffic police have experience when they direct traffic, the idea to achieve good control effect.Through the experiment ensure that the system operation is stable and reliable, and can according to different traffic flow in fuzzy control decision-making, optimize the signal timing, effectively solve the traffic flow is balanced, stable of the problems.Key words: Traffic, intelligent control, configuration1.引言道路拥挤现象日趋严重,造成的经济损失越来越大,并一直保持大比例的增长。
V-Ray 常用参数详解发表时间:2010-5-20前言:本文是我在学习VRAY 中根据各种书面教程和视频教程总结的容包括材质、灯光、渲染等,参考了VR 帮助、黑石教程和印象教程,尽量把各类参数的具体设置做了补充,以供以后巩固理解。
一、帧缓冲器解析:1、启用置帧缓冲器。
勾选将使用VR 渲染器置的置帧缓冲器,VR 渲染器不会渲染任何数据到max 自身的帧缓存窗口,而且减少占用系统存。
不勾选就使用max 自身的帧帧缓冲器。
2、显示上一次VFB:显示上次渲染的VFB 窗口,点击按钮就会显示上次渲染的VFB 窗口。
3、渲染到存帧缓冲器。
勾选的时候将创建VR 的帧缓存,并使用它来存储颜色数据以便在渲染时或者渲染后观察。
如果需要渲染高分辨率的图像时,建议使用渲染到V-Ray 图像文件,以节省存4、从MAX 获得分辨率:勾选时VR 将使用设置的3ds max 的分辨率。
5、渲染到V-Ray 图像文件:渲染到VR 图像文件。
类似于3ds max 的渲染图像输出。
不会在存中保留任何数据。
为了观察系统是如何渲染的,你可以勾选后面的生产预览选项。
6、保存单独的渲染通道:勾选选项允许在缓存中指定的特殊通道作为一个单独的文件保存在指定的目录。
二、全局设置解析:1、几何体:置换:决定是否使用VR 置换贴图。
此选项不会影响3ds max 自身的置换贴图。
2、照明:灯光:开启VR 场景中的直接灯光,不包含max 场景的默认灯光。
如果不勾选的话,系统自动使用场景默认灯光渲染场景。
默认灯光:指的是max 的默认灯光。
隐藏灯光。
勾选时隐藏的灯光也会被渲染。
阴影:灯光是否产生阴影。
仅显示全局光。
勾选时直接光照不参与在最终的图像渲染。
GI 在计算全局光的时候直接光照也会参与,但是最后只显示间接光照。
3、材质反射/折射:是否考虑计算VR 贴图或材质中的光线的反射/折射效果,勾选。
最大深度:用于用户设置VR 贴图或材质中反射/折射的最大反弹次数。
allegro_pcbsigxl_ds学习资料IC package andSiP designPCB designI/O bufferdesign IC designPackagedesign-in kitSilicondesign-in kitOn-target, on-timesystem interconnectInterconnectmodelsI/O bufferIPVirtual systeminterconnectmodelVerifyBuildCorrelateSpecifyExploreDesignImplementDATASHEETALLEGRO PCB SI GXLCadence? Allegro? PCB SI GXL provides a virtual prototyping environment fordesigns with signals operating in the multi-gigahertz MGH frequency range. Itoffers a completely integrated signal design and analysis solution built on top ofthe proven Allegro PCB SI environment. Its advanced technology shortens designcycle time and eliminates the need for multiple lab qualifications with fullfunctional physical prototypes.THE ALLEGRO SYSTEMINTERCONNECT DESIGNPLATFORMThe Cadence Allegro systeminterconnect design platform enablescollaborative design of high-performance interconnect across IC,package, and PCB domains. Theplatform’s unique co-designmethodology optimizes systeminterconnect?between I/O buffersand across ICs, packages, and PCBs?toeliminate hardware re-spins, decreasecosts, and reduce design cycles. Theconstraint-driven Allegro flow offersadvanced capabilities for designcapture, signal integrity, and physical implementation. With associatedsilicon design-in IP Portfolios, ICcompanies shorten new deviceadoption time and systems companiesaccelerate PCB design cycles for rapidtime to profit. Supported by theCadence Encounter? and Virtuoso?platforms, the Allegro co-designmethodology ensures effective designchain collaboration.The Allegro system interconnect design platform ALLEGRO PCB SI GXLDesigning system interconnects withsignals operating in the MGH rangerequires capabilities that quickly and accurately model each element of thesignal’s path. This is because at high frequencies the losses on a signalmount as the signal travels through different discontinuities such as vias, connectors, and different layers in one or more printed circuit boards. At gigahertz GHz frequencies, the lossin a transmission line can amount to approximately 0.25+ dB/inch, creating challenges for longer interconnects on PCB systems. Ensuring that losses in critical signals are acceptable is an important step in the design of MGH signals. To accomplish this, Allegro PCB SI GXL lets engineers perform loss budget tradeoffs quickly anditeratively using S-Parameters. It also provides a way to change the MGHsignal’s topology and view expectedloss through the system interconnect within seconds.Allegro PCB SI GXL offers engineers a highly integrated virtual prototyping environment that includes built-in productivity capabilities for MGH designs. It addresses MGH design challenges in an integratedenvironment that is easy to use and includes several advanced modules: SigXplorer topology exploration environment; high-capacity simulation, SPICE-based simulation subsystem; Allegro Constraint Manager; Allegro Model Integrity; floorplanner/editor and PCB Router; and EMControl. Technological advances?such as differential signals with embedded clocks serial links, drivers with pre- emphasis, and receivers with equalization?allow engineers to architect systems that have higher performance and throughput.However, many of the EDA solutions required to design systems such as these have not kept pace, leaving engineers forced to use disparate, stand-alone products to design systems with high-speed signals, particularly those that operate in MGH range. Allegro PCB SI GXL addresses the numerous challenges typically created as system designers work to provideultra-high bandwidth for data transferagainst shrinking market windows.Another key challenge for MGHdesigners involves ensuring thattiming and voltage margins indifferential signals used in serial linksare met. As traditional circuit simulatorsare limited to approximately 1024 bitsof custom stimulus pattern length,the effect of inter-symbol interferenceISI is not adequately modeled. Toaccurately predict the eye opening,engineers need solutions that cansimulate stimulus patterns of over onemillion bits. On a typical PC/Windowsplatform, Allegro PCB SI GXL cansimulate 10,000 bits in just secondsone million bits in an hour.BENEFITSEliminates the need for physicalprototypes for multiple qualificationsthrough advanced simulationtechniquesShortens design cycle time throughfaster tradeoffs of MGH signals usingS-Parameters and single or coupledanalytical via modelingImproves product quality, cost, andperformanceSaves time via a virtual prototypingenvironment that is seamlesslyintegrated with other Allegroplatform design productsFEATURESINTEGRATED S-PARAMETER SUPPORTIntegrated S-Parameter support enablesengineers to generate S-Parametersfrom PCB signal t opologies “Stack-upto S” and plot in SigWave quickly andeasily. Users can change topology orstack-up and do quick iterative lossbudget tradeoffs. It also allowsdesigners to concatenate multipleS-Parameters into one, simulateS-Parameters in time domain, andincorporate S-Parameters for an objectinto the topology and then generateS-Parameters for the entire topologyAdditionally, by incorporating S-Parameter support that is flexible,Allegro PCB SI GXL allows engineers toincorporate measurement-basedS-Parameter models in native Touchstoneformat. S-Parameters with otherinterconnect topologies can also beincorporated, measured, or importedAny portion of the passive interconnect can be plotted as S-Parameter in SigWavetopology explorer2MACRO MODELINGMacro modeling capabilities enableengineers to model and simulateMGH drivers and receivers faster andmore accurately?with simulationperformance improvements of 20x to400x over transistor-level simulation.VIA MODEL GENERATORUsers can quickly create accuratevia models wideband, narrowband,S-Parameter to simulate via stubeffects at MGH frequencies for singlevias, differential vias, and vias coupledwith ground/power vias.HIGH-CAPACITY, HIGH-PERFORMANCESIMULATIONThe Channel Analysis module withinAllegro PCB SI GXL addresses the needfor high-capacity simulation that canensure timing and voltage margins aremet for MGH signals. The Channel Analysis module allows users tosimulate up to 10 million bits very rapidly. 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Engineers can model frequency- dependent losses and skin effect accurately for MGH signals with an integrated field solver. Quick trial implementation is possible using the tightly integrated Allegro PCB Router XL. SPICE-BASED SIMULATIONSUBSYSTEMThe Allegro PCB SI GXL circuitsimulation engine TlSim is a proven SPICE-based simulator that combinesthe advantages of traditional SPICE- based structural modeling with thespeed of behavioral analysis. TlSim includes the capability to simulateS-Parameters in time domain. By combining both structural andbehavioral modeling techniques, Tlsim enables engineers to accurately andefficiently model complex devicebehavior. Tlsim also includes a lossycoupled, frequency-dependenttransmission line model that accuratelypredicts the distributed behavior ofPCB traces into the GHz rangeALLEGRO CONSTRAINT MANAGERAllegro Constraint Manager allowsusers to capture, manage, and validatevarious rules in a hierarchical fashion.It provides a real-time display of high-speed rules and their status based onthe current state of a design. WithHigh-pass filterDSP techniques RxDe-emphasisMulti-tapTxUsers need proven advanced macro modeling capabilities for devices with preemphasis ofreceiver equalization without sacrificing simulation performance Eye shrinks with number of bits in stimulus pattern. A good eye diagram is important foraccurate jitter, insertion loss, and BER prediction34Allegro Constraint Manager designerscan group all of the high-speedconstraints for a collection of signalsand form an electrical constraint setECset that is then associated withthose nets to manage their actualimplementation. ECSets can be usedto drive the PCB layout design process,shortening the design cycle time.ALLEGRO MODEL INTEGRITYThe Model Integrity module allowsdesigners to quickly create, manipulate,and validate models in an easy-to-useediting environment. Device modelformats supported include:IBIS 4.1 External Model support for Verilog?-A, Spectre?, HSPICE, CadenceeSpice modelsMentor/Quad XTKCadence Device Modeling Language DMLA Spectre-to-DML conversion moduleassists in creating DML models fromSpectre simulation runs. With theoutput of the Spectre simulation runbuffer options file, users can quicklycreate DML models. Model integrityidentifies V-I and V-T tables for typical,imum, and minimum corner casesfrom the Spectre run file. A proven,intelligent best-curve-fitting algorithmprovides an accurate DML model. AnHSPICE-to-IBIS conversion moduleallows users to create IBIS modelsfrom HSPICE simulation runs.Complete library managementthrough Model Integrity lets usersread and write touchstone formatS-Parameters, check passivity ofS-Parameters, and plot S-Parameters?all with the click of a button. FLOORPLANNER/EDITOR AND PCBROUTERThe floorplanner provides a graphicalview of the PCB database allowingusers to view, simulate, and edit thePCB design. Designers can quickly andeasily evaluate the effects of different placement strategies on designbehavior. They can also perform testrouting using proposed electrical constraints to ensure high-speed design rules are achievable before passingthem on to the PCB layout designerEMCONTROL By applying a combination ofstandard rules and user-defined rules, EMControl can eliminate weeks ofmanual checking and improve product quality and reliability. For a standard rule set, EMControl provides comprehensive, knowledge-based,design rule checking DRC forcommon EMI-related placement androuting issues. For user-defined rules, EMControl allows creation of custom rules that fit within a company’sdesign guidelines. Importantly, these rules capture the high-speed design “experience” as customized rules, which in turn can be reused on future designs. The EMControl module predicts far-field differential-mode radiated emissions in both SigXplorer and the Allegro PCB SI floorplanner. It also allows for exploration of design strategies required to keep radiation within acceptable levels. Near-field EMI analysis, available within the Allegro PCB SI floorplanner, canpredict radiated energy immediately above the board surface. By analyzing near-field EMI patterns, designers canidentify which portions of a routedtrace are producing the most radiatedenergy and adapt the design accordingly.I/O BUFFER MODELSSupported I/O buffer model formatsinclude:Cadence Allegro PCB SI DeviceModeling Language DMLSynopsys HSPICE transistor-levelmodels requires HSPICE simulator andlicense, which is not included withAllegro PCB SI GXLCadence Spectre transistor-levelmodels available on Sun Solaris, HPUX, and Linux RHEL 3.0 platformsonly. This utilizes an integrated andlimited capability version of theSpectre simulator, which is includedwith Allegro PCB SI GXLIBIS 4.1 External Model support for HSPICE, Spectre, Verilog-A, andCadence DMLMentor/Quad XTKINTEGRATION AND INTERFACESAllegro PCB SI GXL reads and writesAllegro PCB database .brd files andprovides interface to Mentor BoardStation layout database.OPERATING SYSTEMSUPPORTRed Hat Linux 3.0, 4.0Windows 2000 with Service Pack 4,XP ProfessionalSun Solaris 8, 9, 10HP-UX 11.11iIBM AIX 5.3CADENCE SERVICES ANDSUPPORTCadence application engineers cananswer your technical questions bytelephone, email, or Internet?theycan also provide technical assistanceand custom trainingCadence certified instructors teachover 70 courses and bring their real-world experience into the classroomOver 25 Internet Learning Series iLSonline courses allow you the flexibilityof training at your own computer viathe Internet SourceLink? online customer supportgives you answers to your technicalquestions?24 hours a day, 7 days aweek?including the latest in quarterlysoftware rollups, product changerelease information, technicaldocumentation, solutions, softwareupdates, and moreVia model generator allows users to modelstub effects at MGH frequencies duringpre-route exploration and analysis phaseof the design processFOR MORE INFORMATIONContact Cadence sales at 1.800.746.6223or visit //0>. foradditional information. To locate aCadence sales office or CadenceChannel Partner in your area, visit//./contact_us 2006 Cadence Design Systems, Inc. All rights reserved. Cadence, the Cadence logo, Allegro, Encounter, SourceLink, Spectre, Verilog, and Virtuoso are registered trademarks Cadence Design Systems, Inc. All others are properties of their respective holders.5585E 07/06ALLEGRO PCB SI FEATURESMajor feature summary for SI, Allegro Design Entry HDL, Allegro PCB SI GXL, and Allegro PCB PI Option XLAllegro PCB Allegro Design Entry Allegro PCB Allegro PCB PISI XL HDL SI XL SI GXL Option XLAllegro Design Entry HDL XL xAssign Models in Schematics xCreate Xnets in Schematics xApply Constraints and Topologies to Schematic for Single-ended and Differential Nets xSingle-line Topology Editor Graphical Canvas x x xSimulation Setup Advisor x xModel Integrity: Model Development Environment x x xModel Integrity: Syntax Checking for IBIS 3.2 and DML x x xModel Integrity: HSPICE-to-IBIS Conversion x x xIBIS 4.0 Models Support x x xQuad Models Translator x x xSpectre Transistor-level Models x x x xMacro-models Support DML x x xSimulation Control: Single-line Simulation x x xWaveform Viewer x x xDetailed Simulation Reports Such as Flight Time, Overshoot, Noise Margin x x xCoupled 3 Net Simulation x xCoupled 3nets Simulation x xSingle Net Pre-layout Extraction from Allegro Design Entry HDL x x xAllegro Physical Viewer PlusDifferential Pair Exploration and Simulation x x xDifferential Pair Pre- and Postlayout Extraction from Allegro PCB Editor x xDifferential Pair Pre-layout Extraction from Allegro Design Entry HDL x x xDifferential Signal Constraint Capture x x xCoupled Line Simulations x x xCrosstalk Simulation x x xSweep Simulations x x xCurrent Probes x x xMultiterminal Black Boxes in Topologies x x xConstraint Development and Capture of Topologies x x xCustom Measurement x x xCustom Stimulus x x xBatch Simulation x xEMControl: Rules Development x xEMControl: Rules Checking x xEMI Differential Simulation x x xAllegro Constraint Manager x x xColor-coded Real-time Feedback on Violations xApply Constraints and Topologies to Board for Single-ended and Differential Nets x xFloorplanner x xConstraint-driven Floorplanning and Routing x xAllegro PCB Router XL x xHSPICE Simulator Interface x x x xS-Parameter Generation from Stackup xS-Parameter Plotting in SigWave xTime Domain Simulation of S-Parameters xLibrary Management of S-Parameters in Model Integrity xCoupled Via Model Generator for Pre-layout Explorations xHigh Capacity Simulation Using Channel Analysis Overlay xOptimum Pre-emphasis Bit Configurations “Tap Settings” xPower Integrity: Design and Analysis Environment xPower Integrity: Decoupling Capacitor Database Setup Wizard xPower Integrity: Impedance Requirements Calculator xPower Integrity: Decoupling Capacitor Selection and PlacementEnvironment xPower Integrity: VRM Editor xPower Integrity: Decoupling Capacitor Library Editor xPower Integrity: Cross-probing Between Waveform Allegro PCB SI Floorplanner xPower Integrity: Frequency Domain Analysis x。
3d MAX 菜单中英文对照表Absolute Mode Transform Type-in绝对坐标方式变换输入Absolute/Relative Snap Toggle Mode绝对/相对捕捉开关模式ACIS Options ACIS选项Activate活动;激活Activate All Maps激活所有贴图Activate Grid激活栅格;激活网格Activate Grid Object激活网格对象;激活网格物体Activate Home Grid激活主栅格;激活主网格ActiveShade实时渲染视图;着色;自动着色ActiveShade(Scanline)着色(扫描线)ActiveShade Floater自动着色面板;交互渲染浮动窗口ActiveShade Viewport自动着色视图Adaptive适配;自动适配;自适应Adaptive Cubic立方适配Adaptive Degradation自动降级Adaptive Degradation Toggle降级显示开关Adaptive Linear线性适配Adaptive Path自适应路径Adaptive Path Steps适配路径步幅;路径步幅自动适配Adaptive Perspective Grid Toggle适配透视网格开关Add as Proxy加为替身Add Cross Section增加交叉选择Adopt the File’s Unit Scale采用文件单位尺度Advanced Surface Approx高级表面近似;高级表面精度控制Advanced Surface Approximation高级表面近似;高级表面精度控制Adv。
Lighting高级照明Affect Diffuse Toggle影响漫反射开关Affect Neighbors影响相邻Affect Region影响区域Affect Region Modifier影响区域编辑器;影响区域修改器Affect Specular Toggle影响镜面反射开关AI Export输出Adobe Illustrator(*.AI)文件AI Import输入Adobe Illustrator(*.AI)文件Align对齐Align Camera对齐摄像机Align Grid to View对齐网格到视图Align Normals对齐法线Align Orientation对齐方向Align Position对齐位置(相对当前坐标系)Align Selection对齐选择Align to Cursor对齐到指针Allow Dual Plane Support允许双面支持All Class ID全部类别All Commands所有命令All Edge Midpoints全部边界中点;所有边界中心All Face Centers全部三角面中心;所有面中心All Faces所有面All Keys全部关键帧All Tangents全部切线All Transform Keys全部变换关键帧Along Edges沿边缘Along V ertex Normals沿顶点法线Along Visible Edges沿可见的边Alphabetical按字母顺序Always总是www_bitscn_com中国.网管联盟Ambient阴影色;环境反射光Ambient Only只是环境光;阴影区Ambient Only Toggle只是环境光标记American Elm美国榆树Amount数量Amplitude振幅;幅度Analyze World分析世界Anchor锚Angle角度;角度值Angle Snap Toggle角度捕捉开关Animate动画Animated动画Animated Camera/Light Settings摄像机/灯光动画设置Animated Mesh动画网格Animated Object动画物体Animated Objects运动物体;动画物体;动画对象Animated Tracks动画轨迹Animated Tracks Only仅动画轨迹Animation动画Animation Mode Toggle动画模式开关Animation Offset动画偏移Animation Offset Keying动画偏移关键帧Animation Tools动画工具Appearance Preferences外观选项Apply Atmospherics指定大气Apply—Ease Curve指定减缓曲线Apply Inverse Kinematics指定反向运动Apply Mapping指定贴图坐标Apply—Multiplier Curve指定增强曲线Apply To指定到;应用到Apply to All Duplicates指定到全部复本Arc弧;圆弧Arc Rotate弧形旋转;旋转视图;圆形旋转Arc Rotate Selected弧形旋转于所有物体;圆形旋转选择物;选择对象的中心旋转视图Arc Rotate SubObject弧形旋转于次物体;选择次对象的中心旋转视图Arc ShapeArc Subdivision弧细分;圆弧细分Archive文件归档Area区域Array阵列Array Dimensions阵列尺寸;阵列维数Array Transformation阵列变换ASCII Export输出ASCII文件Aspect Ratio纵横比Asset Browser资源浏览器Assign指定Assign Controller分配控制器Assign Float Controller分配浮动控制器Assign Position Controller赋予控制器Assign Random Colors随机指定颜色Assigned Controllers指定控制器At All Vertices在所有的顶点上At Distinct Points在特殊的点上At Face Centers 在面的中心At Point在点上Atmosphere氛围;大气层;大气,空气;环境Atmospheres氛围Attach连接;结合;附加Attach Modifier结合修改器Attach Multiple多项结合控制;多重连接Attach To连接到Attach To RigidBody Modifier连接到刚性体编辑器Attachment连接;附件Attachment Constraint连接约束Attenuation衰减AudioClip音频剪切板AudioFloat浮动音频Audio Position Controller音频位置控制器AudioPosition音频位置Audio Rotation Controller音频旋转控制器AudioRotation音频旋转Audio Scale Controller音频缩放控制器AudioScale音频缩放;声音缩放Auto自动Auto Align Curve Starts自动对齐曲线起始节点Auto Arrange自动排列Auto Arrange Graph Nodes自动排列节点Auto Expand自动扩展Auto Expand Base Objects自动扩展基本物体Auto Expand Children自动扩展子级Auto Expand Materials自动扩展材质Auto Expand Modifiers自动扩展修改器Auto Expand Selected Only自动扩展仅选择的Auto Expand Transforms自动扩展变换Auto Expand XYZ Components自动扩展坐标组成Auto Key自动关键帧Auto-Rename Merged Material自动重命名合并材质Auto Scroll自动滚屏Auto Select自动选择Auto Select Animated自动选择动画Auto Select Position自动选择位置bitsCN#com中国网管联盟Auto Select Rotation自动选择旋转Auto Select Scale自动选择缩放Auto Select XYZ Components自动选择坐标组成Auto—Smooth自动光滑AutoGrid自动网格;自动栅格AutoKey Mode Toggle自动关键帧模式开关Automatic自动Automatic Coarseness自动粗糙Automatic Intensity Calculation自动亮度计算Automatic Reinitialization自动重新载入Automatic Reparam.自动重新参数化Automatic Reparamerization自动重新参数化Automatic Update自动更新Axis轴;轴向;坐标轴Axis Constraints轴向约束Axis Scaling轴向比率Back后视图Back Length后面长度Back Segs后面片段数Back View背视图Back Width后面宽度Backface Cull背面忽略显示;背面除去;背景拣出Backface Cull Toggle背景拣出开关Background背景Background Display Toggle背景显示开关Background Image背景图像Background Lock Toggle背景锁定开关Background Texture Size背景纹理尺寸;背景纹理大小Backgrounds背景Backside ID内表面材质号Backup Time One Unit每单位备份时间Banking倾斜Banyan榕树Banyan tree榕树Base基本;基部;基点;基本色;基色Base/Apex基点/顶点Base Color基准颜色;基本颜色Base Colors基准颜色Base Curve基本曲线Base Elev基准海拔;基本海拔Base Objects导入基于对象的参数,例如半径、高度和线段的数目;基本物体Base Scale基本比率Base Surface基本表面;基础表面Base To Pivot中心点在底部Bevel Profile轮廓倒角Bevel Profile Modifier轮廓倒角编辑器;轮廓倒角修改器Bezier贝塞尔曲线Bezier Color贝塞尔颜色bbs。
一维指数分布的英语作文Title: The Exponential Distribution: An Insight into Its Significance and ApplicationsThe exponential distribution stands out as a fundamental component of probability theory and statistics, offering a unique perspective on the timing of events where the occurrence of one does not influence the probability of another. This essay aims to explore the exponential distribution’s definition, characteristics, and its wide-ranging applications across various fields.A key characteristic of the exponential distribution is memorylessness. This property signifies that the probability of an event occurring in the next time interval is independent of how much time has already passed. In simpler terms, an exponential distribution does not 'remember' past events, making it particularly suitable for modeling phenomena that are independent of time.The exponential distribution's versatility is evident in its applications across multiple disciplines. In telecommunications, it is used to model the time between call arrivals in a call center or the duration of a call. In reliabilityengineering, it assists in predicting failure times of components that do not wear out over time.In finance, the exponential distribution is applied to model the time between financial transactions or the duration of a stock’s price movement. This distribution is also used in queuing theory to describe the time between arrivals in a queue, making it an indispensable tool in optimizing service operations.The exponential distribution, despite its simplicity, plays a crucial role in various scientific and industrial applications. Its unique properties, especially memorylessness, make it a powerful tool for analyzing and predicting events that occur independently of time. As science and technology continue to advance, the relevance of the exponential distribution is expected to grow, offering insights into a broader range of phenomena.。
ABC参见Activity Based CostingABM参见Activity Based ManagementAbstract Resource 抽象资源Abstraction 抽象Acceleration 加速Acceptability Criteria 验收标准Acceptable Quality Level ("AQL") 可接受质量水平Acceptance 验收Acceptance Criteria 验收标准Acceptance Letters 验收函Acceptance Number 接受数目Acceptance Review 验收评审Acceptance Test 验收测试Acquisition Methods 采购方式Acquisition Negotiations 采购谈判Acquisition Plan 采购计划Acquisition Plan Review ("APR") 采购计划评审Acquisition Planning 采购计划编制Acquisition Process 采购过程Acquisition Strategy 采购策略Action 行动Action Item 行动项Action Item Flags 行动项标记Action Plan 行动计划Activation 激活Active Listening 积极倾听Activity Arrow Net 活动箭线网络Activity Based Costing ("ABC") 基于活动的成本核算Activity Based Management ("ABM") 基于活动的管理Activity Calendar 活动日历Activity Code 活动代码Activity Definition 活动定义Activity Description 活动描述Activity Duration 活动工期活动持续时间Activity Duration Estimating 活动工期估算Activity Elaboration 活动详述Activity File 活动档案Activity ID 活动识别码Activity List 活动清单Activity Node Net 活动节点网络双代号网络Activity on Arc ("AOA") 弧线表示活动双代号网络Activity on Arrow ("AOA") 箭线表示活动双代号网络参见Arrow Diagramming Method.Activity on Node 节点表示活动单代号网络参见Activity on Arc 和Precedence Diagram Method. Activity Oriented 面向活动Activity Oriented Schedule 面向活动的进度计划Activity Properties 活动属性Activity Quantities 活动量值Activity Status 活动状态Activity Timing 活动定时Actor 执行者角色Actual 实际的Actual and Scheduled Progress 实际进展的与计划进度Actual Cost 实际成本Actual Cost Data Collection 实际成本汇总Actual Costs 实际费用Actual Dates 实际日期Actual Direct Costs 实际直接成本Actual Expenditures 实际的支出参见Actual Costs.Actual Finish 实际完成Actual Finish Date 实际完成日期Actual Start 实际开始Actual Start Date 实际开始日期ACWP 已完成工作实际成本See Actual Cost of Work PerformedAdaptation 适应Added value 附加价值Addendum 附录参见procurement addendum.Adequacy 适当Adjourning 解散Adjustment 调节ADM参见Arrow Diagram MethodADM Project ADM 项目Administration 管理部门Administrative 行政的参见Administrative ManagementAdministrative Change 行政变更Administrative Management 行政管理ADP参见Automated Data ProcessingADR参见Alternative Dispute ResolutionAdvanced Material Release ("AMR") 材料提前发布AF参见Actual Finish DateAFE参见Application for Expenditure参见Authority for ExpenditureAffect 影响Affected Parties 受影响方Agency 代理Agenda 议程Aggregation 汇总Agreement 协议Agreement, legal 协议合同ALAP参见As-Late-As-PossibleAlgorithm 算法Alignment 排列成行Alliance 联合Allocated Baseline 分配的基线Allocated Requirements 分配需求Allocation 分配Allowable Cost 允许成本Allowance 预留Alternate Resource 替代资源Alternative Analysis 替代分析Alternative Dispute Resolution ("ADR") 替代争议解决方案Alternatives 可选方案Ambiguity 含糊不清Amendment 修订Amount at Stake 损失量AMR 材料提前公布Analysis 分析Analysis and Design 分析与设计Analysis Time 分析期Analyst 分析员AND Relationship 与关系Anecdotal 轶事Anticipated A ward Cost 预期中标价AOA参见Activity on Arrow参见Activity on ArcAON参见Activity on NodeAOQ参见A verage Outgoing QualityAOQL参见A verage Outgoing Quality LimitAPMA参见Area of Project Management ApplicationApparent Low Bidder 最低投标人Application 应用Application Area 应用领域Application for Expenditure ("AFE") 支出申请Application for Expenditure Justification 支出申请的论证Application Programs 应用程序Applied Direct Costs 实际直接成本Apportioned Effort 分摊努力Apportioned Task 分摊任务Appraisal 评估Approach 方法Appropriation 拨款Approval 批准Approval to Proceed 批准继续Approve 同意Approved Bidders List 批准的投标人清单Approved Changes 批准的变更Approved Project Requirements 批准的项目需求APR参见Acquisition Plan ReviewAQL参见Acceptable Quality LevelArbitrary 随意的Arbitration 仲裁Arc 弧线Architectural Baseline 构架基线Architectural View 构架视图Architecture 构架Architecture, executable 构架可执行参见Executable Architecture.Archive 档案文件Archive Plan 存档计划Area of Project Application参见Area of Project Management Application Area of Project Management Application ("APMA") 项目管理的应用领域Arrow 箭线Arrow Diagram参见Activity Arrow NetArrow Diagram Method ("ADM") 箭线图方法Arrow Diagramming 箭线图方法Arrow Diagramming Method 箭线图方法双代号网络图Artifact 制品Artificial 人工的AS参见Actual Start DateASAP参见As-Soon-As-PossibleAs-built Design 实际建造设计As-built documentation 实际建造文档As-Built Records参见As-Built documentationAs-Built Schedule 实际建造进度计划As-Late-As-Possible ("ALAP") 尽可能晚As-Needed 恰如所需As-of Date见Data Date.As-Performed Schedule 实际进度计划Assembly 组装件Assembly Sequence 组装顺序Assessment 评估Assets 资产Assignment 分配委派任务Associated Revenue 关联收益Association 关联关系As-Soon-As-Possible ("ASAP") 尽快Assumption 假设Assumptions 假设Assumptions List 假设清单Assurance 保证Assurance Program见Quality Assurance Program.A TP见Acceptance Test ProcedureAttitude 态度Attribute 属性Attrition 损耗Audit 审核审计Authoritarian 独裁的Authoritative 权威的Authority 权威权力Authority for Expenditure ("AFE") 开支权Authorization 授权见ApprovalAuthorize 批准Authorized Unpriced Work 批准的未定价工作Authorized Work 批准的工作Authorized Works 批准的工作Automated Data Processing ("ADP") 自动化数据处理Automatic Decision Event 自动决策事件Automatic Generation 自动生成Automatic Test Equipment 自动测试设备AUW见Authorized Unpriced WorkAuxiliary Ground Equipment 辅助场地设备A vailability 可用性A verage Outgoing Quality ("AOQ") 平均出厂质量A verage Outgoing Quality Limit ("AOQL") 平均出厂质量限度A verage Sample Size Curve 平均样本规模曲线A voidance 避免A ward 授予A ward Fee 奖金A ward Letter 中标函BAC 完工预算参见Budget at Completion参见Baseline at CompletionBack Charge 逆向计费参见BackchargeBackcharge 逆向收费Backward Pass 倒推法/反向计算Bad Debts 坏帐Balance 余额权衡Balanced Matrix 平衡矩阵Balanced Scorecard 平衡记分卡参见Scoring a Project's ContributionBalanced Scorecard Approach ("BSA") 平衡记分卡方法Bank 储备Banking 储备Bar Chart 横道图Bargaining 讨价还价交涉Bargaining Power 讨价还价权力交涉权力Barriers 障碍Base 基础基数Baseline 基线基准Baseline at Completion ("BAC") 完成/完工基线Baseline Concept 基线概念Baseline Control 基线控制参见Configuration ControlBaseline Cost 基线成本Baseline Dates 基线日期Baseline Finish Date 基线完成日期参见Scheduled Finish DateBaseline Management 基线管理Baseline Plan 基线计划基准计划Baseline Review 基线评审Baseline Schedule 基线进度计划Baseline Start Date 基线开始日期参见Scheduled Start Date.Baseline, budget 基线预算Baseline, business 基线商业Baseline, cost estimate 基线费用估算Baseline, technical 基线技术Basis of Estimate 估算根据Batch 批量参见LotBatch Operation 批运行/批处理BA TNA参见Best Alternative to Negotiated AgreementBCM参见Business Change ManagerBCWP参见Budgeted Cost of Work PerformedBCWS参见Budgeted Cost of Work ScheduledBEC参见Elapsed CostBehavior 行为/反应Behavior Analysis 行为分析参见Functional AnalysisBenchmark 基准Benchmarking 标竿管理Beneficial Occupancy/Use 有益的占用/使用Benefits 效益Benefits Framework 效益框架Benefits Management 效益管理Benefits Management Plan 效益管理计划Benefits Management Regime 效益管理制度Benefits Profiles 效益简述Benefits Realization Phase 效益实现阶段Best Alternative to Negotiated Agreement ("BA TNA") 协议外最佳方案BA TNABest and Final Contract Offer 最佳及最终合同报价Best and Final Offer 最佳及最终报价Best Efforts Contract 最大努力合同Best Practices 最佳实践Best value 最佳值Beta Distribution 贝塔发布Beta Test 贝塔测试Beta testing 贝塔测试Bid 投标Bid Analysis 投标分析Bid Bond 投标保证金Bid Cost Considerations 投标成本补偿费Bid document Preparation 招标文件准备Bid documents 招标文件Bid Evaluation 评标Bid List 投标人清单Bid Package 标段标块Bid Protests 投标抗议/拒付Bid Qualifications 投标资质Bid Response 投标响应Bid Technical Consideration 投标技术因素Bid Time Consideration 投标中的时间因素Bid/No Bid Decision 投标/不投标决策Bidder 投标人Bidders Conference 投标人会议Bidders List 投标人名单Bidders Source Selection 投标人来源选择Bidding 投标Bidding Strategy 投标策略Bill 帐单Bill of Materials 材料清单Bills of Materials 材料清单Blanket Purchase Agreement ("BPA") 一揽子采购协议BPABlueprint 蓝图/计划设计图Board 委员会Boiler Plate 样板文件Bona Fide 真诚真实Bond 担保Bonus 奖金Bonus Schemes 奖励计划Booking Rates 预提费率BOOT参见Build, Own, Operate, TransferBottom Up Cost Estimate 自下而上成本估算Bottom Up Cost Estimating 自下而上成本估算Bottom Up Estimating 自下而上估算Boundary 边界BPA参见Blanket Purchase AgreementBPR参见Business Process ReengineeringBrainstorming 头脑风暴法Branching Logic 分支逻辑关系Breach of Contract 违约Breadboarding 实验模型Break Even 盈亏平衡Breakdown 分解Breakdown Structure 分解结构Break-Even Chart 盈亏平衡图Break-Even Charts 盈亏平衡图Break-Even Point 盈亏平衡点Bribe 贿赂BSA参见Balanced Scorecard ApproachBuck Passing 完全通过/推卸责任Budget 预算Budget at Completion ("BAC") 完工预算BAC Budget Cost 预算成本Budget Costs 预算成本预算费用Budget Decrement 预算消耗Budget Element 预算要素Budget Estimate 预算估算参见EstimateBudget Presentation 预算介绍Budget Revision 预算修订Budget Unit 预算单位Budgetary Control 预算性控制Budgeted 已安排预算的Budgeted Cost of Work Performed ("BCWP") 已完工作预算成本BCWPBudgeted Cost of Work Scheduled ("BCWS") 计划工作的预算成本Budgeting 制定预算Budgeting & Cost Management 预算制定与成本管理Build 建设构造Build, Own, Operate, Transfer ("BOOT") 建造拥有经营转让Buildability 建造能力Building 建筑物Building Professionalism 建设专业化Build-to documentation 建成文档Built-in Test Equipment 内置测试设备Bulk Material 大宗材料Burden 间接费用负担参见Indirect Cost.Burden of Proof 举证费Bureaucracy 官僚制度Burn Rate 消耗速度Burst Node 分支点Business Actor 业务参与者/角色Business Appraisal 商业评估Business Area 业务领域Business Assurance 商业保证Business Assurance Coordinator 商业保证协调人Business Case 商业案例Business Change Manager ("BCM") 商业变更经理BCM Business Creation 商业创新Business Engineering 商业工程Business Imperative 商业需要Business Improvement 业务改进Business Manager 商务经理商业经理Business Modeling 业务建模Business Needs 商业需求Business Objectives 商业目标Business Operations 业务运作Business Process 业务流程Business Process Engineering 业务流程工程参见business engineeringBusiness Process Reengineering ("BPR") 业务流程重组Business Processes 业务流程Business Risk 商业风险Business Rule 商业规则Business Transition Plan 业务转换计划参见Transition PlanBusiness Unit 业务单位Buyer 买方Buyer's Market 买方市场Buy-In 支持认同买进Bypassing 回避C/SCSC参见Cost/Schedule Control System Criteria C/SSR参见Cost/Schedule Status ReportCA参见Control AccountCAD参见Computer Aided Drafting参见Computer Aided DesignCalculate Schedule 估算进度安排Calculation 计算Calendar 日历参见Project Calendar.Calendar File 日历文件Calendar Range 日历范围Calendar Start Date 日历开始日期Calendar Unit 日历单位Calendar, Software 日历软件Calendars 日历集Calibration 校准CAM参见Cost Account Manager参见Computer Aided Manufacturing参见Control Account ManagerCAP参见Cost Account Plan参见Control Account PlanCapability 能力Capability Survey 能力调查Capital 资本Capital Appropriation 资本划拨Capital Asset 资本资产Capital Cost 资本成本Capital Employed 占用的资本Capital Expansion Projects 资本扩展项目Capital Goods Project 资本货物项目Capital Property 资本财产CAR参见Capital Appropriation RequestCards-on-the-wall Planning 墙卡规划法Career 职业Career Path Planning 职业路线规划Career Planning 职业规划参见Career Path Planning.Carryover Type 1 结转类型1 Carryover Type 2 结转类型2Cascade Chart 层叠图CASE (1)参见Computer Aided Software Engineering CASE (2)参见Computer Aided System EngineeringCash 现金Cash Flow 现金流Cash Flow Analysis 现金流分析Cash Flow Management 现金流管理Cash Flow, Net 现金流净值Cash In 现金流入Cash Out 现金支出Catalyst 催化者Catch-up Alternatives 赶上计划的备选方案Causation 起因Cause 动因CBD参见Component-Based DevelopmentCBS参见Cost Breakdown StructureCCB参见Change Control BoardCCDR参见Contractor Cost Data ReportCDR参见Critical Design ReviewCentral Processing Unit ("CPU") 中央处理单元Centralized 集中的Certain 确定的参见Certainty.Certainty 确定性Certificate of Conformance 一致性认证Certification 认证Chain 链Challenge 挑战Champion 推动者支持者Change 变更变化变革Change Control 变更控制Change Control Board ("CCB") 变更管理委员会Change documentation 变更文档Change in Scope 工作范围变化参见Scope Change.Change Log 变更日志Change Management 变更管理Change Management Plan 变更管理计划Change Notice 变更通知Change Order 变更通知单参见V ariation OrderChanged Conditions 变更的条款Characteristic 特性Chart 图表Chart of Accounts 会计科目表Chart Room 图表室Charter 章程参见Project CharterChecking 检查Checklist 检查清单Checkpoint 检查点Checkpoints 检查点集Chief Executive Officer 首席执行官Child 子项Child Activity 子活动CI参见Configuration ItemClaim 索赔Clarification 澄清Class 类Classes 类Classification 分类Classification of Defects 缺陷的分类Clearance Number 净空数Client 客户Client Environment 客户环境Client Quality Services 客户质量服务Closed Projects 已收尾的项目Closeout 收尾Closeout Report 收尾报告Closeout, phase 收尾阶段参见Project Closeout.Closing 终止Closure 收尾CM参见Configuration Management参见Construction ManagementCoaching 教练Code 代码参见Source Code.Code and Unit Test 编码和单元测试Code of Accounts 帐目编码Coding 编码Collaboration 协作Collapsing 折叠Collective 集体的Combative 好战的Commercial 商务的Commercial Item Description 商务描述Commission and Handover 委托和移交Commissioning 试运行Commissions and Bonuses 酬金和奖金Commit 提交Commitment 承诺义务Commitment document 承诺文件Commitment Estimate参见Estimate Class ACommitment Package 承诺包Commitment to Objectives 对目标的承诺Committed Cost 已承担成本已承付成本Committed Costs 已承诺费用Common Carrier 公众运营商Communicating With Groups 与团队的沟通Communicating With Individuals 与个人的沟通Communication 沟通参见Effective Communication.Communication Channels 沟通渠道Communication Plan, Strategic 沟通计划策略性的Communication Plan, Tactical 沟通计划--战术性的Communication Room 交流室Communications Management 沟通管理Communications Plan 沟通计划Communications Planning 沟通规划编制Community 社团Company 公司Comparison 对比Compatibility 兼容性Compensation 补偿Compensation and Evaluation 补偿和评价Competence 能力Competency 能力Competition 竞争Competitive:竞争的Compile 编译Compile Time 编译时Complete 完成Completed Activity 已完成的活动Completed Units 完工单元Completion 完工Completion Date 完成日期Complex 复杂的参见Project Complexity.Component 构件组件Component Integration and Test 组件集成和测试Component-Based Development ("CBD") 基于构件的开发Components 组件Compound Risk 复合风险Compromise 折衷Compromising, in negotiating 折衷谈判Computer 计算机Computer Aided Design ("CAD") 计算机辅助设计Computer Aided Drafting ("CAD") 计算机辅助制图Computer Aided Manufacturing ("CAM") 计算机辅助制造Computer Cost Applications 计算机化的成本管理应用Computer Hardware 计算机硬件Computer Modeling 计算机建模Computer Program Configuration Item 计算机程序配置项参见Computer Software Configuration Item.Computer Software 计算机软件Computer Software Component 计算机软件组件Computer Software Configuration Item ("CSCI") 计算机软件配置项Computer Software documentation 计算机软件文档Computer Software Unit 计算机软件单元Computer-Aided 计算机辅助的Computerized Information Storage, Reference and Retrieval 计算机化的信息存储定位和检索Concept 概念Concept Definition document 概念定义文档Concept Phase 概念阶段Concept Study 概念研究Conception Phase 概念形成阶段Conceptual 概念性的参见Concept.Conceptual Budgeting 概念性预算Conceptual Design 概念性设计Conceptual Development 概念性开发Conceptual Project Planning 概念性项目计划Concession 让步Concession Making, in negotiating 谈判中的让步Conciliatory 调和的Concluding 终决的Conclusions 结论Concurrency 并发性Concurrent 并发事件Concurrent Delays 并行延迟Concurrent Engineering 并行工程Concurrent Tasks 并行任务Conditional Risk 条件风险Conditions 条件条款Conducting 执行Confidence Level 信心等级Configuration 配置Configuration Audit 配置审核Configuration Breakdown 配置分解Configuration Control 配置控制Configuration Control Board 配置控制委员会Configuration Identification 配置识别Configuration Item Acceptance Review 配置项验收评审Configuration Item V erification 配置项验证Configuration Item V erification Procedures 配置项验证程序Configuration Management 配置管理Configuration Management Board 配置管理委员会Configuration Relationships 配置关系Configuration Status Accounting 配置状态统计Conflict 冲突Conflict Management 冲突管理Conflict Resolution 冲突解决方案Conformance to Requirements 与需求的一致性Confrontation 积极面对Consensus 一致同意Consensus Decision Process 集体决策过程Consent 同意Consequences 后果Consideration 对价Considerations 对价需要考虑的事项Consolidate 合并Consortium 联盟Constituents 涉众Constraint 约束条件Constraint, project constraint 约束条件对项目的约束Constraints 约束条件Constructability 施工能力Construction 施工构造建造建筑Construction Contractor 施工承包商Construction Cost 施工成本Construction Management ("CM") 施工管理Construction Manager 施工经理Construction Stage 施工阶段Construction Work 施工工作Construction-Oriented 以施工为导向的Constructive Challenge 建设性质询Constructive Change 建设性变更Consultant 咨询顾问Consulting 咨询Consumable Resource 可消耗资源Consumables 消费性物资Contemplated Change Notice 预期变更通知Contending, in negotiating 争论在谈判中Content 内容Content Type 内容类型Context 背景Contingencies 不可预见费应急费用参见Reserve and Contingency Planning.Contingency 不可预见费应急费用Contingency Allowance 应急补助参见Reserve.Contingency Budget Procedure 不可预见费用预算程序Contingency Plan 意外事件计划Contract Package 合同包参见Contract Breakdown.Contract Performance Control 合同履行控制Contract Plan 合同计划Contract Pre-award Meetings 合同预授予会议Contract Quality Requirements 合同质量要求Contract Requirements 合同要求Contract Risk 合同风险Contract Risk Analysis 合同风险分析Contract Signing 合同签署Contract Strategy 合同战略Contract Target Cost ("CTC") 合同目标成本Contract Target Price ("CTP") 合同目标价格Contract Type 合同分类Contract Types 合同类型Contract Work Breakdown Structure ("CWBS") 合同工作分解结构Contract/Procurement Management 合同/采购管理Contracting 签订合同Contractor 承包商Contractor Claims Release 承包商索赔豁免Contractor Cost Data Report ("CCDR") 承包商成本数据报告Contractor Evaluation 承包商评估Contractor Furnished Equipment 承包商供应的设备Contractor Project Office 承包商项目办公室Contractor Short Listing 承包商短列表Contractor's Performance Evaluation 承包商的绩效评价Contractual 合同的参见Contractual Conditions.Contractual Conditions 合同条款Contractual/Legal Requirements 合同的/法律上的要求Contributed value 贡献价值参见Added value.Contribution Analysis 贡献分析Control 控制参见Project Control 和Control Cycle.Control Account ("CA") 控制帐目Control Account Manager ("CAM") 控制帐目经理Control Account Plan ("CAP") : 控制帐目计划Control and Coordination 控制和协调Control Chart 控制表Control Cycle 控制周期Control Gate 控制关口控制关卡参见Management Control Point.Control Loop 控制回路Control Point 控制点Control Requirements 控制必要条件要求Control System 控制系统Control Theory 控制论Controllable Risks 可控风险Controlling 控制参看Project ControlControlling Relationship 控制关系Coordinated Matrix 协调型的矩阵Coordination 协调Coordinator 协调员Corporate 公司Corporate Administration and Finance 公司行政和财务Corporate Budget. 公司预算Corporate Business Life Cycle 公司商务生命周期Corporate Constraints 公司限制因素Corporate Data Bank 公司数据库Corporate Management 公司管理Corporate Memory 公司记忆库Corporate Philosophy 公司价值体系, 公司哲学Corporate Planning 公司计划编制Corporate Project Management 公司项目管理Corporate Project Strategy 公司项目战略Corporate Quality Standards 公司质量标准Corporate Resources 公司资源Corporate Responsibility Matrix 公司责任矩阵Corporate Standards 公司标准Corporate Supervision 公司监管Corporation 公司Correction 纠正Corrective Action 纠正措施Correlation 相关性Cost 成本参见Project Cost.Cost Account 成本帐目Cost Account Breakdown 成本帐目分解Cost Account Manager ("CAM") 成本帐目经理Cost Account Plan ("CAP") 成本帐目计划Cost Accumulation Methods 成本累加方法Cost Analysis 成本分析Cost Applications 成本应用Cost A voidance 成本规避Cost Baseline 成本基线Cost Benefit 成本效益Cost Benefit Analysis 成本效益分析Cost Breakdown Structure 成本分解结构Cost Budgeting 成本预算Cost Ceiling 封顶成本成本上限Cost Ceiling Bracket 成本上限范围Cost Center 成本中心Cost Check 成本检查Cost Classes 成本类别Cost Code 成本代码Cost Codes 成本代码Cost Control 成本控制Cost Control Point 成本控制点Cost Control System 成本控制系统Cost Curve 成本曲线Cost Distribution 成本分摊Cost Effective 成本效率成本有效的Cost Element 成本元素Cost Engineering 成本工程Cost Envelope 成本区域Cost Estimate 成本估算Cost Estimate Classification System 成本估算分类系统Cost Estimating 成本估算Cost Estimating Relationship 成本估算关系Cost Forecast 成本预测Cost Forecasting 成本预测Cost Growth 成本增长Cost Incurred 已发生成本Cost Index 成本指数Cost Indices 成本指数表Cost Input 成本投入Cost Management 成本管理Cost Model 成本模型Cost of Money 资金成本Cost of Quality 质量成本Cost Overrun 成本超支Cost Performance Baseline 成本绩效基线请参见"Cost Baseline".Cost Performance Index ("CPI") 成本绩效指数Cost Performance Indicator ("CPI") 成本绩效指数Cost Performance Measurement Baseline 成本绩效度量基线Cost Performance Ratio ("CPR") 成本绩效比率参见Cost Performance IndicatorCost Performance Report ("CPR") 成本绩效报告Cost Plan 成本计划Cost Plus 成本补偿Cost Plus Fixed Fee Contract ("CPFF") 成本加固定费用合同Cost Plus Incentive Fee Contract ("CPIFC") 成本加奖励费用合同Cost Plus Percentage of Cost Contract ("CPPC") 成本加成本百分比合同Cost Reimbursable Contract 成本补偿合同费用可偿还合同Cost Reimbursement 成本补偿Cost Reimbursement Type Contracts 成本补偿型合同Cost Reviews 成本评审Cost Savings 成本节约Cost Sharing Contract 成本共享合同Cost Status 成本状态Cost to Complete 竣工尚需成本Cost to Complete Forecast 竣工所需成本预测Cost Types 成本类型Cost V ariance ("CV") 成本偏差Cost/Schedule Status Report ("C/SSR") 成本/进度状态报告Cost-Benefit Analysis 成本效益分析Costed Work Breakdown Structure 带成本信息的工作分解结构Cost-Effectiveness 成本效果分析法Costing 成本核算Costing Systems 成本核算系统Cost-Time Resource Sheet ("CTR") 成本时间资源表Counseling 指导Countermeasures 对策CPFFC参见"Cost Plus Fixed Fee Contract"CPI参见"Cost Performance Index".参见"Cost Performance Indicator".CPIF 成本加奖励费用合同参见"Cost Plus Incentive Fee Contract"CPIFC参见"Cost Plus Incentive Fee Contract"CPM参见"Critical Path Method"CPN参见"Critical Path Network"CPPC参见"Cost Plus Percentage of Cost Contract" CPR参见"Cost Performance Ratio"参见Cost Performance Report"CPU参见"Central Processing Unit"CR参见"Change Request"Craft 技艺Crash Costs 赶工成本Crash Duration 赶工工期Crashing 赶工Creativity 创造力Credit 赊欠信誉Credited Resource 已授予的资源Crisis 危机Criteria 标准指标Criterion 标准指标Critical 关键的Critical Activity 关键活动Critical Chain 关键链Critical Defect 关键性缺陷Critical Defective 有关键缺陷的产品Critical Design Review 关键设计评审Critical Event 关键事件Critical Factors 关键因素Critical Path 关键路径Critical Path Analysis 关键路径分析Critical Path Method ("CPM") 关键路径法Critical Path Network ("CPN") 关键路径网络图Critical Performance Indicator 关键绩效指标Critical Ratio 临界比关键比率Critical Sequence 关键工序Critical Sequence Analysis 关键工序分析Critical Subcontractor 关键分包商Critical Success Factors ("CSF") 关键的成功因素Critical Task 关键任务Critical Work Item 关键工作项Criticality Index 关键指数Cross Organizational 交叉型组织跨组织的Cross References 交叉参照Cross-Stage Plan 交叉阶段计划CSCI参见"Computer Software Configuration Item".CSF参见"Critical Success Factors"CTC参见"Contract Target Cost"CTP参见"Contract Target Price"CTR参见"Cost-Time Resource Sheet"Culture 文化Culture, organizational 文化组织文化Cumulative Cost-to-Date 到目前为止的累计成本参见Total Expenditure to Date"Cumulative S Curve 累计S 曲线参见" S Curve"Currency Conversion 货币兑换Current Budget 当前预算Current Date Line 当前日期线Current Finish Date 当前完成日期Current FY Budget Allocation 当前财政年的预算分配Current Start Date 当前开始日期Current Status 当前状态Current Y ear 当年Custom Duty and Tax 海关关税Customer 客户Customer Acceptance Criteria 客户验收标准Customer Furnished Equipment 客户提供的设备Customer Perspective 客户观点Customer/Client Personnel 客户方的职员Cutoff Date 移交日期Cutover 移交CV参见Cost V ariance"CWBS参见"Contract Work Breakdown Structure"Cybernetics 控制论Cycle 周期Cycle Time 周期Damages 损害赔偿金Dangle 悬空活动Data 数据Data Application 数据应用Data Bank参见"Corporate Memory"Data Collection 数据收集Data Date ("DD") 数据日期Data Entry Clerk 数据录入员Data Item Description ("DID") 工作项描述Data Processing 数据处理Data Refinements 数据改进Data Type 数据类型Data Structure Organization 数据结构组织Database 数据库Database Administrator ("DBA") 数据库管理员Database Management System ("DBMS") 数据库管理系统Date of Acceptance 验收日期Day Work Account 日常工作帐户DBA参见"Database Administrator"DBM见"Dynamic Baseline Model"DBMS参见"Database Management System"DCE参见"Distributed Computing Environment"DCF参见"Discounted Cash Flow"DD参见"Data Date"Deactivation Plan 惰性化计划Deactivation Procedures 惰性化流程Debriefing 投标反馈听取情况汇报情况Decentralized 分散的Decision 决策Decision documentation 决策文档Decision Event 决策事件Decision Making 制定决策Decision Making Process 决策过程Decision Support System 决策支持系统Decision Theory 决策论Decision Tree 决策树Decision Trees 决策树组Decomposing 分解Decomposition 分解Default 违约Default values 默认值Defect 缺陷Defective 缺陷产品Defects-Per-Hundred-Units 每百个单元有缺陷的数量Deficiency 缺陷Deficiency List 缺陷清单Definition 定义Definition Phase 定义阶段Definitive 确定性的Definitive Estimate 确定性估算参见"Estimate"Deflection 风险转移Degradation 降级Delay 延期Delay, compensable 补偿性延期Delaying Resource 资源延期Delegating 授权Delegation 授权Deliberate Decision Event 预先准备的决策事件Deliverable 可交付成果,可交付物参见"Product".Deliverable Breakdown Structure 可交付物分解结构参见"Work Breakdown Structure"Deliverable Deadline 可交付物的终止期限Deliverables 可交付成果可交付物Deliverables Management 交付物管理Delivery 交付Delphi Technique 德尔菲法Demonstrate 演示证明Demonstrated 已证明的Demonstrated Past Experience 已证明的过去经验Demonstration 演示Demonstration Review 演示评审Department 部门Departmental Budget 部门预算Dependability 可靠性Dependencies 依赖关系Dependency 活动之间的依赖关系参见Logical Relationship"Dependency Arrow 关系箭线Dependency Diagram 网络图前导网络图Dependency Links 依赖关系Dependency Management 依赖关系管理Deployment 部署Deployment Lessons Learned document 部署的经验教训文档Deployment Plan 部署计划Deployment Procedures 部署流程Deployment Readiness Review 部署准备评审Deployment View 部署视图Depreciation 折旧Descriptive 描述性的Design 设计Design & Development Phase 设计和开发阶段Design Alternatives 设计备选方案Design Appraisal 设计评估Design Authority 设计权威Design Baseline 基准设计Design Bid Build 设计阶段投标的建立Design Brief 设计大纲Design Build 设计的建立包括设计和构造Design Concept 设计概念Design Contingency 设计应急费用Design Contract 设计合同Design Control 设计控制Design Development 设计开发Design Management 设计管理Design Management Plan 设计管理计划Design Model 设计模型Design of Experiment 试验设计Design Package 设计包Design Review 设计评审Design Subsystem 设计子系统Design Time 设计时间Design to Budget 按预算设计Design to Cost 按成本设计Design-to Specifications 按规范设计Desirable Logic 合意逻辑Detail documentation 详细的文档Detail Schedule 详细的进度安排Detailed Design 详细设计Detailed Design Stage 详细设计阶段Detailed Engineering 详细工程Detailed Planning 详细计划Detailed Plans 详细的计划参见Detailed Resource Plan 和Detailed Technical Plan Detailed Resource Plan 详细的资源计划Detailed Schedule 详细的进度安排Detailed Technical Plan 详细的技术计划Determination 决定决心Determine Least Cost for Maximum Results 确定可以获得最大收获的最小成本参见Cost Benefit"Deterministic 确定性的Deterministic Network 确定的网络图Developed Country 发达国家Developer 开发人员Developing Country 发展中国家Development 开发参见"Development Phase"Development case 开发案例Development Phase 开发阶段Development Plan 开发计划Development process 开发过程Deviation 偏差Deviation Permit 允许偏差参见"Production Permit"Diagram 图Diagramming参见"Scheduling"DID参见"Data Item Description"Differences 偏差差异Differentials 差值Differing Site Conditions 不同的现场环境Direct Cost 直接成本Direct Cost Contingency 直接成本应急费用参见"Project Direct Cost Contingency"Direct Costs 直接成本Direct Labor 直接人工Direct Project Costs 直接项目成本费用Directing 指挥Direction 指导Directive 指示。
a r X i v :a s t r o -p h /9912177v 1 8 D e c 1999Modeling The X-ray Timing Properties Of Cygnus X-1AsCaused By Waves Propagating In A Transition DiskR.MisraDept.of Physics &Astronomy,Northwestern University,Evanston,Illinois -60208,U.S.A ReceivedABSTRACTWe show that waves propagating in a transition disk can explain the short term temporal behavior of Cygnus X-1.In the transition disk model the spectrum is produced by saturated Comptonization within the inner region of the accretion disk where the temperature varies rapidly with radius.Recently, the spectrum from such a disk has been shown tofit the average broad band spectrum of this source better than that predicted by the soft-photon Comptonization model.Here,we consider a simple model where waves are propagating cylindrically symmetrically in the transition disk with a uniform propagation speed(c p).We show that this model can qualitatively explain(a) the variation of the power spectral density(PSD)with energy,(b)the hard lags as a function of frequency and(c)the hard lags as a function of energy for various frequencies.Thus the transition disk model can explain the average spectrum and the short term temporal behavior of Cygnus X-1.Subject headings:accretion disks—black hole physics—radiation mechanisms: thermal—relativity—stars:Cygnus X-11.IntroductionThe X-ray emission of the well known Black Hole system Cygnus X-1shows two long term spectral states.The system spends most of its time in the hard state where the spectrum can be approximated as an power-law with an exponential cutoffaround100 keV.The radiative mechanism generally invoked to explain this spectrum is unsaturated Comptonization of soft photons in a hot plasma.A model where the hot plasma is in the form of an corona on top of a cold accretion disk(Haardt&Maraschi1993;Liang&Price 1977)has been ruled out by spectral modeling of the spectrum(Gierlinski et al.1997; Nowak et al.1999).The hot plasma could then be a hot inner accretion disk with the soft photons either arising from the cold outer disk(Shapiro,Lightman&Eardley1976),from a pre-shockflow(Chakrabarti1997)or from internally produced Synchrotron photons as in the ADAF model(Narayan1996).In the transition disk model(Misra&Melia1996),the structure of the disk is obtained using the standardα-disk model of Shakura&Sunyaev(1973)without the assumption that the effective optical depth(τeff)is greater than unity.For high accretion rates(>∼1018 g sec−1),τeff turns out(self-consistently)to be less than unity for the innermost regions. The disk is then forced to cool by bremsstrahlung self Comptonization which causes the temperature to be much hotter than that obtained by assuming black body emission.The temperature rapidly increase with decreasing radius in this region.Since the Comptony-parameter is always greater than unity(althoughτeff<1)the local spectrum is a Wien peak.The sum over all Wien peak from the different radii(and corresponding different temperatures)gives rise to a power-law which matches the observed spectrum of Cygnus X-1(Misra&Melia1996).A similar model has been used to explain AGN spectra (Maraschi&Molendi1990).Fitting broad-band(2-200keV)spectrum of Cygnus X-1 revealed that the transition disk modelfits the data better than a simple Comptonizationone(Misra et al.1998;Misra,Chitnis&Melia1998).In particular an ad hoc additional Wien peak(kT≈50keV)feature required in the Comptonizationfit to the spectrum( Gierlinski et al.1997)is not required for the transition disk modelfit.Another way to differentiate between these theoretical models is by studying the timing analysis of this source.Recently RXTE observed Cygnus X-1and measured the power spectral density(PSD)for various energy bins,the time lags between energy bins as a function of frequency and energy and the coherence function(Nowak et al1999a).These observations indicate that if the time lag is due to light travel time through the plasma,the size of the plasma has to be around104GM/c2(Kazanas,Hua&Titarchuk1997)and the seed photon source has to be isotropic(Nowak et al.1999b).To avoid the energy problem associated with such a large plasma,Bottcher&Liang(1999),proposed a model where the variations are due to“blobs”of cool,dense matter which spiral inwards through the hot plasma.However,it is not clear whether these models agree even qualitatively with all the trends in the temporal behavior of Cygnus X-1as observed by RXTE.Nowak et al.1999b showed that the time delays could be due to linear disturbances propagating through the plasma provided the speed of propagation is much smaller than c and photons of different energies are predominately produced in different regions.While such a scenario is not natural in the framework of a Comptonizing plasma,the transition disk meets the above requirements.In this letter,we show that waves propagating in a transition disk at least match qualitatively with most of the temporal observations.2.Waves in the transition diskA complete solution for the steady state disk structure in the framework of the transition disk model can be obtained using physical parameters which are the massaccretion rate,the black hole mass and the the viscosity parameterα(Misra&Melia1996).However,for simplicity and clarity Misra et al.1997used an empirical model tofit theaverage photon spectrum of Cygnus X-1.In the empirical model(which differs from thetransition model only in the parameterization form)the temperature profile is assumed tobe of the form:kT∝r n J m keV,(1) where r is the radius and J(r)=1−(r i/r)1/2.r i is the radius of the last stable orbit,takento be r i=3R g,with R g≡2GM/c2.Here n and m are free parameters obtained byfittingthe spectrum.The local radiative mechanism for such disks is saturated Comptonization(i.e.a Wien peak)since the local y parameter obtained is greater than unity(Misra et al.1998).Since the gravitational power per unit area F g∝R−3J(R),the photonflux at earthcan be written as(Misra et al.1998)f E(E)= r o r i F(E,r)dr∝E2 r o r i(kT)−4exp(−E/kT)r−2dr,(2) where E is the energy of the photon and r o is the radius to which the transition disk extends.Misra et al.(1998)fitted this empirical model and obtained the bestfit temperature profileT(r)with n≈−2.5,m≈1and the maximum temperature to be≈70keV.This profile isshown infigure1.The temporal behavior of the source is studied using the count rate as a function oftime in a certain energy band.It is useful to define a response function(Nowak et al.1999b)for a particular energy bandg(r)= E2E1F(E,r)A(E)dE(3) where E2and E1are the limits of the energy band and A(E)is the energy dependenteffective area of the detector.In this paper,we have used approximate values of A(E)forthe RXTE detector.The normalized g(r)for some of the energy bands used in this paperare shown infigure1.The plot indicates where most of the photons contributing to the channel arise in the disk.We have assumed throughout this paper that the transition disk extends till50r s.Following Nowak et al.(1999b),for simplicity,we shall consider waves propagating cylindrically symmetrically in the disk with a uniform propagation speed(c p).Further only waves moving toward a sink in the origin are considered.The sink at the origin is represented asρs(r,t)=δ(r)ρs(t)in the wave equation.In this formalism the Fourier transform of the observed light curve in an energy channel(s(t))becomes(Nowak et al. 1999b,Morse&Feshbach1953)P s(f)S(f)=c p=3000r g/secs=0.2c for a10M⊙Black Hole which is the only free parameter in this analysis.Only for those values of frequency where the coherence function is near unity is considered(i.e f<10Hz).Considering the simplifying assumptions made in this analysis the results do qualitatively match the observations while there are discrepancies at higher frequencies.Crary et al.(1998)have used approximately2000days of data from the BATSE to estimate the time lag between20-50keV and50-100keV bands in the frequency range 0.01to0.2Hz.Infigure2(b)we show the predicted time lag for the corresponding energy bands.The slope of the curve is similar to the observations in this frequency range. However,the observed time lag is≈2higher than the predicted one.This could mean that the wave propagation speed is generally slightly smaller than0.2c.Infigure3,we show the predicted time lags versus energy for three different frequencies. The data are obtained from Nowak et al.(1999a).The logarithmic dependence for low energies is obtained for this model.Moreover,the predicted slope of the curves decreases with frequency matching the observed trend.Again at high frequency(≈10)Hz there is significant deviation from the observations.The PSD cannot be predicted in the framework of this simple model since the Fourier transform of the sink term(P s(f)in eqn(4))is ing the observed PSD we obtain P s(f)and present the result infigure4(a).Figure4(a)also shows the predicted PSD w if P s(f)was constant(i.e.white noise).It should be noted that in this model there is no exponential cutoffin PSD w below100Hz.It would have been difficult to explain the observed PSD if there had been such a cutoff.Even though,the observed PSD cannot be directly inferred,the model does make predictions for the ratio of PSD in various energy bands since this is independent of P s(f).Infigure4(b)we show two calculated ratio as a function of frequency and compare it with the observed values.The ratios have beenrenormalized to one at a frequency1Hz.For a wide range of frequency the ratios are close to unity which shows that the PSD is not sensitive to the energy band.One alsofinds that there is a remarkable correspondence of the calculated ratios with the observed values as a function of frequency and for different energy bands.Note that for frequencies greater than 10Hz,the present analysis is not adequate because of the lack of coherence.In the framework of this model a transition in the temporal behavior might take place when kr12≈1where r12is the distance between the maxima of g(r)for the two energy bands under consideration.This would occur at a frequency f tr≈c p/(2πr12)≈477/r12≈15 Hz for r12≈30r g(figure1).It is tempting to associate f tr with the observed frequency where the coherence function drops below unity.At higher frequencies than f tr damping or non-linear effects may be dominant giving rise to this effect.In summary,waves propagating in a transition disk can qualitatively explain most of the temporal properties of Cygnus X-1.In the analysis only one additional parameter to the steady state disk model is used to explain the temporal behavior of the system.There are several observational features like the high frequency lag and the“shelves”in the lag versus frequency plot which is yet to be explained.The absence of such features maybe due to the simplifying assumptions(described in the end of section2)used in this analysis.The transition disk models are generically radiation pressure dominated and hence are subject to secular and thermal instabilities(Misra&Melia1996).However, these instabilities may be suppressed by non local effects like advection or convection.Fast moving radial waves as required in the above model may be produced in such a quasi-stable disk.The author would like to thank Ron Taam for useful discussions.REFERENCESBottcher,M.,&Liang,E.P.,1999,ApJ,511,L37Bottcher&Liang1999511L37 Chakrabarti,S.K.,1997,ApJ,484,313.Crary,D.J.et al.,1998,ApJ,493,L71.Gierlinski et al.,1997,MNRAS,288,958.Haardt,F.&Maraschi,L.,1993,ApJ,413,507.Kazanas D.,Hua,X.M.,&Titarchuk,L.,1997,ApJ,480,280.Liang,E.P.&Price,R.H.,1977,ApJ,218,247.Maraschi,L.&Molendi,S.,1990,ApJ,353,452.Misra,R.&Melia,F.,1996,ApJ,467,405.Misra,R.&Chitnis,V.R.,Melia,F.&Rao,A.R.1997,487,388.Misra,R.&Chitnis,V.R.&Melia,F.,1998,495,407.Morse,P.M.&Feshbach,H.,1953,Methods of Theoretical Physics,Part1(New York: McGraw-Hill Book Company,Inc.)Narayan,R.1996,ApJ,462,136.Nowak,M.A.,et al.,1999a,ApJ,510,874.Nowak,M.A.,et al.,1999b,ApJ,515,726.Shakura,N.I.&Sunyaev,R.A.1973,Astr.Ap.,24,337.Shapiro,S.L.,Lightman A.P.&Eardley,D.M.1976,ApJ,204,187.Fig.1—Temperature as a function of radius(solid line).The response function(g(r))for various energy bins(dotted lines).From left to right the energy bins correspond to(a)14.1 -45keV,(b)6.0-8.2keV and(c)0-3.9keV.Fig.2(a)—Time lags as a function of frequency between0-3.9keV and(from top to bottom)(a)14.1-45keV,(b)8.2-14.1keV(solid line),(c)6.0-8.2keV and(d)3.9-6.0 keV.The dots are the observed time lags taken from Nowak et al.(1999a)between0-3.9 keV and8.2-14.1keV.Fig.2(b)—Time lags as a function of frequency between20-50keV and50-100keV (solid line).The dashed line is the bestfit to the observed values in the frequency range 0.01-0.2Hz(Crary et al.1998).Fig.3—Time lag as a function of energy for three different frequencies.circles:0.3Hz, squares:1Hz and triangles:10Hz.Points with error bars are data taken from Nowak et al.(1999a)for the corresponding frequencies.Fig.4—Top:(a)The observed PSD for energy bin0-3.9keV(solid line).The inferred sink function P S(f)required to match the observed PSD(dashed line).The PSD if P S(f)was a constant(PSD w)which corresponds to white noise(dotted line).Bottom(b):The ratio of the PSD.PSD soft is for energy bin0-3.9keV.PSD hard is for energy bins14.1-45keV and6.0-8.2keV.Solid lines are the computed values while dotted lines correspond to the observed ratios taken from Nowak et al.(1999a).。