BUK7107-55AIE中文资料
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1.2 Features
s Integrated current sensor s ESD protection s Q101 compliant s Standard level compatible.
1.3 Applications
s Variable Valve Timing for engines s Electrical Power Assisted Steering.
VGS ≥ 10 V
Fig 1. Normalized total power dissipation as a function of mounting base temperature.
Fig 2. Continuous drain current as a function of mounting base temperature.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 09877
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
1.4 Quick reference data
s VDS ≤ 55 V s ID ≤ 140 A s RDSon = 5.8 mΩ (typ) s ID/Isense = 500 (typ).
2. Pinning information
Table 1: Pin 1 2 3 4 5 mb Pinning - SOT426 and SOT263B, simplified outline and symbol Simplified outline
80
40 40
Capped at 75A due to package
0 0 50 100 150 200 Tmb (° C)
0 0 50 100 150 200 Tmb (°C)
P tot P der = ---------------------- × 100 % P °
tot ( 25 C )
BUK71/7907-55AIE
TrenchPLUS standard level FET
Rev. 01 — 12 August 2002 Product data
1. Product profile
1.1 Description
N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring very low on-state resistance, TrenchPLUS current sensing and diodes for ESD protection. Product availability: BUK7107-55AIE in SOT426 (D2-PAK) BUK7907-55AIE in SOT263B (TO-220AB).
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
9397 750 09877
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 01 — 12 August 2002
4 of 15
Philips Semiconductors
BUK71/7907-55AIE
TrenchPLUS standard level FET
5. Characteristics
Table 4: Characteristics Tj = 25 °C unless otherwise specified. Symbol V(BR)DSS Parameter drain-source breakdown voltage Conditions ID = 0.25 mA; VGS = 0 V Tj = 25°C Tj = −55 °C VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 Tj = 25°C Tj = 175 °C Tj = −55 °C IDSS drain-source leakage current VDS = 55 V; VGS = 0 V Tj = 25°C Tj = 175 °C V(BR)GSS IGSS gate-source breakdown voltage gate-source leakage current IG = ±1 mA; −55°C < Tj <175 °C VGS = ±10 V; VDS = 0 V Tj = 25 °C Tj = 175 °C RDSon drain-source on-state resistance VGS = 10 V; ID = 50 A; Figure 7 and 8 Tj = 25°C Tj = 175 °C ID/Isense ratio of drain current to sense VGS > 10 V; current −55°C < Tj <175 °C total gate charge gate-source charge gate-to-drain (Miller) charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time internal drain inductance from upper edge of drain mounting base to center of die from source lead to source bond pad VDS = 30 V; RL = 1.2 Ω; VGS = 10 V; RG = 10 Ω VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 VGS = 10 V; VDS = 44 V; ID = 25 A; Figure 14 450 5.8 500 7 14 550 mΩ mΩ 22 1000 10 nA µA 20 0.1 22 10 250 µA µA V 2 1 3 4 4.4 V V V 55 50 V V Min Typ Max Unit Static characteristics
s Kelvin source
1
5
MBL263
SOT426 (D2-PAK)
SOT263B (TO-220AB)
Philips Semiconductors
BUK71/7907-55AIE
TrenchPLUS standard level FET
3. Limiting values
Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDS VDGS VGS ID Parameter drain-source voltage (DC) drain-gate voltage (DC) gate-source voltage (DC) drain current (DC) Tmb = 25 °C; VGS = 10 V; Figure 2 and 3 Tmb = 100 °C; VGS = 10 V; Figure 2 IDM Ptot IGS(CL) Tstg Tj IDR IDRM EDS(AL)S peak drain current total power dissipation gate-source clamping current storage temperature junction temperature reverse drain current peak reverse drain current non-repetitive drain-source avalanche energy Tmb = 25 °C Tmb = 25 °C; pulsed; tp ≤ 10 µs unclamped inductive load; ID = 68 A; VDS ≤ 55 V; VGS = 10 V; RGS = 50 Ω; starting Tj = 25 °C
103 ID (A)
03nf55
Limit RDSon = VDS/ID
tp = 10 µs
102
100 µs Capped at 75 A due to package 1 ms DC
10
10 ms 100 ms
1 1 10 VDS (V) 102
Tmb = 25 °C; IDM single pulse.
[1] [2] [1] [2] [2]
Conditions IDG = 250 µA
Min −55 −55 -
Max 55 55 ±20 140 75 75 560 272 10 50 +175 +175 140 75 560 460
Unit V V V A A A A W mA mA °C °C A A A mJ
Product data
Rev. 01 — 12 August 2002
3 of 15
Philips Semiconductors