EMDR工作卡

Embedded Multi-Media Card(e•MMC™ 5.1)EMMC16G-IB29-PE90EMMC32G-IB29-PE90EMMC64G-IB29-PE90v1.0Product Features•Packaged managed NAND flash memory with e•MMC™ 5.1 interface•Backward compatible with all prior e•MMC™ specification revisions•153-ball JEDEC FBGA RoHS Compliant package•Operating voltage range:o VCCQ = 1.8 V/3.3 Vo VCC = 3.3 V•Operating Temperature (T case) - 40C to +85C•Storage Temperature -55C to +85C•Compliant with e•MMC™ 5.1 JEDEC Standard Number JESD84-B51•Factory configured with pseudo Single Level Cell (pSLC) mode for enhanced reliability and performance•Factory configured with reliable writee•MMC™ Specific Feature Support•High-speed e•MMC™ protocol•Variable clock frequencies of 0-200MHz•Ten-wire bus interface (clock, 1 bit command, 8 bit data bus) with an optional hardware reset •Supports three different data bus widths: 1 bit(default), 4 bits, 8 bits•Bus Modes:o Single data transfer rate: up to 52MB/s (using 8 parallel data lines at 52MHz)o Dual data rate mode (DDR-104) : up to 104MB/s @ 52MHzo High speed, single data rate mode (HS-200) : up to 200MB/s @ 200MHzo High speed, dual data rate mode (HS-400) : up to 400MB/s @ 200MHz•Supports alternate boot operation mode to provide a simple boot sequence methodo Supports SLEEP/AWAKE (CMD5)o Host initiated explicit sleep mode for power saving•Enhanced write protection with permanent and partial protection options•Multiple user data partition with enhanced attribute for increased reliability•Error free memory accesso Cyclic Redundancy Code (CRC) for reliable command and data communicationo Internal error correction code (ECC) for improved data storage integrityo Internal enhanced data management algorithmo Data protection for sudden power failure during program operations•Securityo Secure bad block erase commandso Enhanced write protection with permanent and partial protection options•Power off notification for sleep•Field firmware update (FFU)•Production state awareness•Device health report•Command queuing•Enhanced strobe•Cache flushing report•Cache barrier•Background operation control & High Priority Interrupt (HPI)•RPMB throughput improvement•Secure write protection•Pre EOL information•Optimal sizeProduct DescriptionKingston’s e•MMC™ products conform to the JEDEC e•MMC™ 5.1standard. These devices are an ideal universal storage solution for many commercial and industrial applications. In a single integrated packaged device, e•MMC™ combines triple-level cell (TLC) NAND flash memory with an onboard e•MMC™ controller, providing an industry standard interface to the host system. The integrated e•MMC™ controller directly manages NAND flash media which relieves the host processor of these tasks, including flash media error control, wear-leveling, NAND flash management and performance optimization. Future revision to the JEDEC e•MMC™ standard will always maintain backward compatibility. The industry standard interface to the host processor ensures compatibility across future NAND flash generations as well, easing product sustainment throughout the product life cycle. ConfigurationsKingston’s e•MMC™ products support a variety of configurations that allow the e•MMC™ device to be tailored to your specific application needs. The most popular configurations described below are each offered under standard part numbers.Standard TLC – By default the e•MMC™ device is configured with the NAND flash in a standard TLC mode. This configuration provides reasonable performance and reliability for many applications. Pseudo Single Level Cell (pSLC) – The TLC NAND flash in the Kingston e•MMC™ device can be configured to further improve device endurance, data retention, reliability and performance over the standard TLC configuration. This is done by converting the NAND TLC cells to a pseudo single level cell (SLC) configuration. In this configuration, along with the performance and reliability gains, the device capacity is reduced by 2/3 of the capacity. This one-time configuration is achieved by setting the e•MMC™ enhanced attribute for the hardware partition.Kingston e•MMC™ can be ordered preconfigured with the option of reliable write or pSLC at no additional cost. Standard TLC devices can also be one-time configured in-field by following the procedures outlined in the JEDEC e•MMC™ specification. The JEDEC e•MMC™ specification allows for many additional configurations such as up to 4 additional general purpose (GPn) hardware partitions each with the option to support pSLC and reliable write. Additionally, Kingston provides a content loading service that can streamline your product assembly while reducing production costs. For more information, contact your Kingston representative.Kingston e•MMC™ devices are fully compliant with the JEDEC Standard Specification No. JESD84-B51. This datasheet provides technical specifications for Kingston’s family of e•MMC™ devices. Refer to the JEDEC e•MMC™ standard for specific information related to e•MMC™ device function and operation. See: /sites/default/files/docs/JESD84-B51.pdfe•MMC™ Mode and ControllerTLC mode using PS8229 - Leading edge 3D NAND flash technology in TLC mode rated to 3,000 endurance cycles.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.pSLC mode using PS8229 - Leading edge 3D NAND flash technology in pSLC mode.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.Part NumberingFigure 1 – Part Number FormatEMMC 16G - xxxx - PE90A B C DPart Number FieldsA: Product Family : EMMCB: Device Capacity : Available capacities of 16GB – 64GBC: Hardware Revision and ConfigurationD: Device Firmware Revision and ConfigurationTable 1 - Device SummaryDevice PerformanceTable 2 below provides sequential read and write speeds for all capacities. Performance numbers can vary under different operating conditions. Values are given at HS400 bus mode. Contact your Kingston Representative for performance numbers using other bus modes.Power ConsumptionDevice current consumption for various device configurations is defined in the power class fields of the EXT_CSD register. Power consumption values are summarized in Table 3 below.Device and Partition CapacityThe device NAND flash capacity is divided across two boot partitions (2048 KB each), a Replay Protected Memory Block (RPMB) partition (512 KB), and the main user storage area. Four additional general purpose storage partitions can be created from the user partition. These partitions can be factory preconfigured or configured in-field by following the procedure outlined in section 6.2 of the JEDEC e•MMC™ specification JESD84-B51. A small portion of the NAND storage capacity is used for the storage of the onboard controller firmware and mapping tables. Additionally, several NAND blocks are held in reserve to boost performance and extend the life of the e•MMC™ device. Table 4 identifies the specific capacity of each partition. This information is reported in the device EXT_CSD register. The contents of this register are also listed in the Appendix.e•MMC™ Bus ModesKingston e•MMC™ devices support all bus modes defined in the JEDEC e•MMC™ 5.1 specification. These modes are summarized in Table 6 below.Signal DescriptionTable 7 - e•MMC™ Signals Name Type DescriptionCLK I Clock: Each cycle of this signal directs a one bit transfer on the command and either a one bit (1x) or a two bits transfer (2x) on all the data lines. The frequency may vary between zero and the maximum clock frequency.DAT[7:0] I/O/PP Data: These are bidirectional data channels. The DAT signals operate in push-pull mode. These bidirectional signals are driven by either the e•MMC™ device or the host controller. By default, after power up or reset, only DAT0 is used for data transfer. A wider data bus can be configured for data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the e•MMC™ host controller. The e•MMC™ device includes internal pull-ups for data lines DAT1-DAT7. Immediately after entering the 4-bit mode, the device disconnects the internal pull ups of lines DAT1, DAT2, and DAT3. Correspondingly, immediately after entering to the 8-bit mode, the device disconnects the internal pull-ups of lines DAT1–DAT7.CMD I/O/PP/OD Command: This signal is a bidirectional command channel used for device initialization and transfer of commands. The CMD signal has two operation modes: open-drain for initialization mode, and push-pull for fast command transfer. Commands are sent from the e•MMC™ host controller to the e•MMC™ device and responses are sent from the device to the host.DS O This signal is generated by the device and used for output in HS400 mode. The frequency of this signal follows the frequency of CLK. For data output each cycle of this signal directs two bits transfer(2x) on the data - one bit for positive edge and the other bit for negative edge. For CRC status response output and CMD response output (enabled only HS400 enhanced strobe mode), the CRC status and CMD Response are latched on the positive edge only, and don't care on the negative edge.RST_n I Hardware Reset: By default, hardware reset is disabled and must be enabled in the EXT_CSD register if used. Otherwise, it can be left un-connected.RFU - Reserved for future use: These pins are not internally connected. Leave floatingNC - Not Connected: These pins are not internally connected. Signals can be routed through these balls to ease printed circuit board design. See Kingston’s Design Guidelines for further details.VSF - Vendor Specific Function: These pins are not internally connectedVddi - Internal Voltage Node: Note that this is not a power supply input. This pin provides access to the output of an internal voltage regulator to allow for the connection of an external Creg capacitor. See Kingston’s Design Guidelines for further details.Vcc S Supply voltage for core Vccq S Supply voltage for I/ODesign GuidelinesDesign guidelines are outlined in a separate document. Contact your Kingston Representative for more information.Package DimensionsFigure 2 – Package DimensionsFigure 3 – Ball Pattern DimensionsBall Assignment (153 ball)Table 8 – Ball Assignment, Top View (HS400)1 2 3 4 5 6 7 8 9 10 11 12 13 14A NC NC DAT0 DAT1 DAT2 Vss RFU NC NC NC NC NC NC NC AB NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC BC NC Vddi NC Vssq NC Vccq NC NC NC NC NC NC NC NC CD NC NC NC NC NC NC NC DE NC NC NC RFU Vcc Vss VSF VSF VSF NC NC NC EF NC NC NC Vcc VSF NC NC NC FG NC NC RFU Vss VSF NC NC NC GH NC NC NC DS Vss NC NC NC H J NC NC NC Vss Vcc NC NC NC J K NC NC NC RST_n RFU RFU Vss Vcc VSF NC NC NC K L NC NC NC NC NC NC L M NC NC NC Vccq CMD CLK NC NC NC NC NC NC NC NC M N NC Vssq NC Vccq Vssq NC NC NC NC NC NC NC NC NC N P NC NC Vccq Vssq Vccq Vssq RFU NC NC RFU NC NC NC NC P1 2 3 4 5 6 7 8 9 10 11 12 13 14 Note: VSF, RFU and NC balls are not electrically connected. RFU balls may be defined with functionality by the Joint Electron Device Engineering Council (JEDEC) in future revisions of the e•MMC™ standard. Please refer to Kingston’s design guidelines for more info.Device MarkingFigure 4 - EMMC Package Marking240xxxx-xxx.xxxxYYWW PPPPPPPPxxxxxxx-xxxx2xxxxxxTAIWANKingston Logo240xxxx-xxx.xxxx：Internal control numberYYWW：Date code (YY– Last 2 digits ofyear, WW- Work week)PPPPPPPP： Internal control numberxxxxxxx-xxxx Sales P/N2xxxxxx : Internal control numberCountry：TAIWANCard Identification Register (CID)The Card Identification (CID) register is a 128-bit register that contains device identification information used during the e•MMC™ protocol device identification phase. Refer to JEDEC Standard Specification No.JESD84-B51 for details.Field Byte ValueMID [127:120] 0x70reserved [119:114] 0x00CBX [113:112] 0x01OID [111:104] 0x00PNM [103:56 ] IB2916(16G) IB2932(32G) IB2964(64G)PRV [ 55:48 ] 0x90PSN [ 47:16 ] RandomMDT [ 15:8 ] month, yearCRC [ 7:1 ] Follows JEDEC Standard reserved [ 0:0 ] 0x01Card Specific Data Register [CSD]The Card-Specific Data (CSD) register provides information on how to access the contents stored in e•MMC™. The CSD registers are used to define the error correction type, maximum data access time, data transfer speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueCSD_Structure [127:126] 0x03 (V2.0)SPEC_VER [125:122] 0x04 (V4.0~4.2)reserved [121:120] 0x00TAAC [119:112] 0x4F (40ms)NSAC [111:104] 0x01TRAN_SPEED [103:96 ] 0x32 (26Mbit/s)CCC [ 95:84 ] 0x0F5READ_BL_LEN [ 83:80 ] 0x09 (512 Bytes)READ_BL_PARTIAL [ 79:79 ] 0x00WRITE_BLK_MISALIGN [ 78:78 ] 0x00READ_BLK_MISALIGN [ 77:77 ] 0x00DSR_IMP [ 76:76 ] 0x00reserved [ 75:74 ] 0x00C_SIZE [ 73:62 ] 0xFFFVDD_R_CURR_MIN [ 61:59 ] 0x07 (100mA)VDD_R_CURR_MAX [ 58:56 ] 0x07 (200mA)VDD_W_CURR_MIN [ 55:53 ] 0x07 (100mA)VDD_W_CURR_MAX [ 52:50 ] 0x07 (200mA)C_SIZE_MULT [ 49:47 ] 0x07 (512 Bytes)ERASE_GRP_SIZE [ 46:42 ] 0x1FERASE_GRP_MULT [ 41:37 ] 0x1FWP_GRP_SIZE [ 36:32 ] 0x0FWP_GRP_ENABLE [ 31:31 ] 0x01DEFAULT_ECC [ 30:29 ] 0x00R2W_FACTOR [ 28:26 ] 0x02WRITE_BL_LEN [ 25:22 ] 0x09 (512 Bytes)WRITE_BL_PARTIAL [ 21:21 ] 0x00reserved [ 20:17 ] 0x00CONTENT_PROT_APP [ 16:16 ] 0x00FILE_FORMAT_GRP [ 15:15 ] 0x00COPY [ 14:14 ] 0x00PERM_WRITE_PROTECT [ 13:13 ] 0x00TMP_WRITE_PROTECT [ 12:12 ] 0x00FILE_FORMAT [ 11:10 ] 0x00Field Byte ValueECC [ 9:8 ] 0x00CRC [ 7:1 ] Follow JEDEC Standard reserved [ 0:0 ] 0x01Extended Card Specific Data Register [EXT_CSD]The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The most significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot be modified by the host. The lower 192 bytes are the Modes segment, which defines the configuration the Device is working in. These modes can be changed by the host by means of the SWITCH command. For details, refer to section 7.4 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueReserved [511:506] 0EXT_SECURITY_ERR [505:505] 0x00S_CMD_SET [504:504] 0x01HPI_FEATURES [503:503] 0x01BKOPS_SUPPORT [502:502] 0x01MAX_PACKED_READS [501:501] 0x3CMAX_PACKED_WRITES [500:500] 0x20DATA_TAG_SUPPORT [499:499] 0x01TAG_UNIT_SIZE [498:498] 0x03TAG_RES_SIZE [497:497] 0x00CONTEXT_CAPABILITIES [496:496] 0x05LARGE_UNIT_SIZE_M1 [495:495] 0x17(16G) 0x2F(32G) 0x5F(64G)EXT_SUPPORT [494:494] 0x03 SUPPORTED_MODES [493:493] 0x01FFU_FEATURES [492:492] 0x00 OPERATION_CODE_TIMEOUT [491:491] 0x00FFU_ARG [490:487] 65535 BARRIER_SUPPORT [486:486] 0x01Reserved [485:309] 0CMDQ_SUPPORT [308:308] 0x01CMDQ_DEPTH [307:307] 0x0FReserved [306:306] 0x00 NUMBER_OF_FW_SECTORS_CORRECTLY_PROGRAMMED [305:302] 0 VENDOR_PROPRIETARY_HEALTH_REPORT [301:270] 0 DEVICE_LIFE_TIME_EST_TYP_B [269:269] 0x01DEVICE_LIFE_TIME_EST_TYP_A [268:268] 0x01PRE_EOL_INFO [267:267] 0x01 OPTIMAL_READ_SIZE [266:266] 0x01OPTIMAL_WRITE_SIZE [265:265] 0x08Field Byte Value OPTIMAL_TRIM_UNIT_SIZE [264:264] 0x01 DEVICE_VERSION [263:262] 0FIRMWARE_VERSION [261:254] 0x90 PWR_CL_DDR_200_360 [253:253] 0x00 CACHE_SIZE [252:249] 1024 GENERIC_CMD6_TIME [248:248] 0x32 POWER_OFF_LONG_TIME [247:247] 0xFF BKOPS_STATUS [246:246] 0x00 CORRECTLY_PRG_SECTORS_NUM [245:242] 0 INI_TIMEOUT_AP [241:241] 0x64 CACHE_FLUSH_POLICY [240:240] 0x01 PWR_CL_DDR_52_360 [239:239] 0x00 PWR_CL_DDR_52_195 [238:238] 0x00PWR_CL_200_195 [237:237] 0x00PWR_CL_200_130 [236:236] 0x00 MIN_PERF_DDR_W_8_52 [235:235] 0x00 MIN_PERF_DDR_R_8_52 [234:234] 0x00 Reserved [233:233] 0x00TRIM_MULT [232:232] 0x11(16G) 0x11(32G) 0x22(64G)SEC_FEATURE_SUPPORT [231:231] 0x55 SEC_ERASE_MULT [230:230] 0xF7 SEC_TRIM_MULT [229:229] 0xF7 BOOT_INFO [228:228] 0x07Reserved [227:227] 0x00 BOOT_SIZE_MULT [226:226] 0x20ACC_SIZE [225:225] 0x07(16G) 0x08(32G) 0x09(64G)HC_ERASE_GRP_SIZE [224:224] 0x01ERASE_TIMEOUT_MULT [223:223] 0x11(16G) 0x11(32G) 0x22(64G)REL_WR_SEC_C [222:222] 0x01HC_WP_GRP_SIZE [221:221] 0x10 S_C_VCC [220:220] 0x08S_C_VCCQ [219:219] 0x08 PRODUCTION_STATE_AWARENESS_TIMEOUT [218:218] 0x14 S_A_TIMEOUT [217:217] 0x15 SLEEP_NOTIFICATION_TIME [216:216] 0x0FField Byte ValueSEC_COUNT [215:212] 10207232 (16G) 20414464 (32G) 40828928 (64G)SECURE_WP_INFO [211:211] 0x01 MIN_PERF_W_8_52 [210:210] 0x08 MIN_PERF_R_8_52 [209:209] 0x08 MIN_PERF_W_8_26_4_52 [208:208] 0x08 MIN_PERF_R_8_26_4_52 [207:207] 0x08 MIN_PERF_W_4_26 [206:206] 0x08 MIN_PERF_R_4_26 [205:205] 0x08 Reserved [204:204] 0x00 PWR_CL_26_360 [203:203] 0x00 PWR_CL_52_360 [202:202] 0x00 PWR_CL_26_195 [201:201] 0x00 PWR_CL_52_195 [200:200] 0x00 PARTITION_SWITCH_TIME [199:199] 0xFF OUT_OF_INTERRUPT_TIME [198:198] 0xFF DRIVER_STRENGTH [197:197] 0x1F DEVICE_TYPE [196:196] 0x57 Reserved [195:195] 0x00 CSD_STRUCTURE [194:194] 0x02 Reserved [193:193] 0x00 EXT_CSD_REV [192:192] 0x08 CMD_SET [191:191] 0x00Reserved [190:190] 0x00 CMD_SET_REV [189:189] 0x00 Reserved [188:188] 0x00 POWER_CLASS [187:187] 0x00 Reserved [186:186] 0x00HS_TIMING [185:185] 0x01 STROBE_SUPPORT [184:184] 0x01 BUS_WIDTH [183:183] 0x02Reserved [182:182] 0x00 ERASED_MEM_CONT [181:181] 0x00 Reserved [180:180] 0x00 PARTITION_CONFIG [179:179] 0x00 BOOT_CONFIG_PROT [178:178] 0x00 BOOT_BUS_CONDITIONS [177:177] 0x00 Reserved [176:176] 0x00 ERASE_GROUP_DEF [175:175] 0x00 BOOT_WP_STATUS [174:174] 0x00C - 4Field Byte Value BOOT_WP [173:173] 0x00 Reserved [172:172] 0x00 USER_WP [171:171] 0x00 Reserved [170:170] 0x00 FW_CONFIG [169:169] 0x00 RPMB_SIZE_MULT [168:168] 0x20 WR_REL_SET [167:167] 0x00 WR_REL_PARAM [166:166] 0x15 SANITIZE_START [165:165] 0x00 BKOPS_START [164:164] 0x00 BKOPS_EN [163:163] 0x00 RST_n_FUNCTION[162:162] 0x00 HPI_MGMT[161:161] 0x00 PARTITIONING_SUPPORT [160:160] 0x07 MAX_ENH_SIZE_MULT [159:157] 623(16G) 1246(32G) 2492(64G) PARTITIONS_ATTRIBUTE[156:156] 0x01 PARTITION_SETTING_COMPLETED[155:155] 0x01 GP_SIZE_MULT_4 [154:152] 0 GP_SIZE_MULT_3 [151:149] 0 GP_SIZE_MULT_2 [148:146] 0 GP_SIZE_MULT_1[145:143] 0 ENH_SIZE_MULT[142:140] 623(16G) 1246(32G) 2492(64G)ENH_START_ADDR[139:136] 0 Reserved[135:135] 0x00 SEC_BAD_BLK_MGMNT[134:134] 0x00 PRODUCTION_STATE_AWARENESS[133:133] 0x00 TCASE_SUPPORT [132:132] 0x00 PERIODIC_WAKEUP[131:131] 0x00 PROGRAM _CID_CSD_DDR_SUPPORT[130:130] 0x01 Reserved[129:128] 0 VENDOR_SPECIFIC_FIELD[127:67 ] 538968064ERROR_CODE [ 66:65 ] 0 ERROR_TYPE[ 64:64 ] 0x00 NATIVE_SECTOR_SIZE [ 63:63 ] 0x00 USE_NATIVE_SECTOR [ 62:62 ] 0x00 DATA_SECTOR_SIZE [ 61:61 ] 0x00 INI_TIMEOUT_EMU[ 60:60 ] 0x00C - 5FieldByte Value CLASS_6_CTRL [ 59:59 ] 0x00 DYNCAP_NEEDED[ 58:58 ] 0x00 EXCEPTION_EVENTS_CTRL [ 57:56 ] 0 EXCEPTION_EVENTS_STATUS [ 55:54 ] 0 EXT_PARTITIONS_ATTRIBUTE[ 53:52 ] 0 CONTEXT_CONF[ 51:37 ] 0 PACKED_COMMAND_STATUS [ 36:36 ] 0x00 PACKED_FAILURE_INDEX [ 35:35 ] 0x00 POWER_OFF_NOTIFICATION[ 34:34 ] 0x00 CACHE_CTRL [ 33:33 ] 0x00 FLUSH_CACHE [ 32:32 ] 0x00 BARRIER_CTRL [ 31:31 ] 0x00 MODE_CONFIG[ 30:30 ] 0x00 MODE_OPERATION_CODES[ 29:29 ] 0x00 Reserved [ 28:27 ] 0 FFU_STATUS[ 26:26 ] 0x00 PRE_LOADING_DATA_SIZE [ 25:22 ] 0MAX_PRE_LOADING_DATA_SIZE[ 21:18 ] 3304106(16G) 6608213(32G) 13216426(64G)PRODUCT_STATE_AWARENESS_ENABLEMENT[ 17:17 ] 0x01 SECURE_REMOVAL_TYPE[ 16:16 ] 0x01 CMDQ_MODE_EN[ 15:15 ] 0x00 Reserved[ 14:0 ]。

PNY Technologies, Inc. 100 Jefferson Road, Parsippany, NJ 07054 Tel 408 567 5500 | Fax 408 855 0680For more information visit: /quadro 1 Via adapter/connector/bracket | 2 Windows 7, 8, 8.1, 10 and Linux | 3 Product is based on a published Khronos Specification, and is expected to pass the Khronos Conformance Testing Process when available. Current conformance status can be found at /conformance | 4 GPU supports DX 12.0 API, Hardware Feature Level 12_1© 2016 NVIDIA Corporation and PNY. All rights reserved. NVIDIA, the NVIDIA logo, Quadro, nView, CUDA, and NVIDIA Maxwell are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. The PNY logotype is a registered trademark of PNY Technologies. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. All other trademarks and copyrights are the property of their respective owners. APR16The World’s Most Powerful Workstation Graphics Card.The NVIDIA M6000 24GB is the world’s most powerful workstation graphics card, giving you the extreme performance and on-board memory to take on your biggest visualization challenges.Artists, animators, and editors can now work in real-time on their most complex projects with multiple layers and advanced effects. Plus, product designers and engineers don’t have to compromise on model complexity or image quality when working on large assemblies; they can now integrate interactive, physically based rendering and simulation to evaluate product design and functionality in entirely new ways. Geophysicists can also accelerate their time-to-insight in seismic exploration by holding substantially larger data sets in memory for faster processing and analysis.Quadro cards are certified with a broad range of sophisticated professional applications, tested by leading workstation manufacturers, and backed by a global team of support specialists. This gives you the peace of mind to focus on doing your best work. Whether you’re developing revolutionary products or telling spectacularly vivid visual stories, Quadro gives you the performance to do it brilliantly.THE PNY ADVANTAGE PNY provides unsurpassed service and commitment to its professional graphics customers. In addition, PNY delivers a complete solution that includes the appropriate adapters, cables, brackets, driver software installation disc, and documentation to ensure a quick and successful install.FEATURES >Support for any combination of four connected displays >Four DisplayPort 1.2 Connectors >DisplayPort with Audio >One DVI-I Dual-Link Connector >VGA Support 1 >3D Stereo Support 1 >NVIDIA GPUDirect ™ Support >Quadro Sync Compatibility >Stereo Connector >NVIDIA nView ® multidisplay technology >NVIDIA Mosaic 2PACKAGE CONTENTS >NVIDIA Quadro M6000 24GB Professional Graphics Board >Software Installation Disc >Printed Quick Start Guide >8-Pin Auxiliary Power Cable >Stereo Connector Bracket >Three DisplayPort to DVI-D SL Adapters >DVI to VGA Adapter WARRANTY AND SUPPORT >3-Year Warranty >Pre- and Post-Sales Technical Support >Dedicated Field Application Engineers >Direct Tech Support Hot Lines PNY PART NUMBER VCQM6000-24GB-PB SPECIFICATIONS GPU Memory 24 GB GDDR5 Memory Interface 384-bit Memory Bandwidth Up to 317 GB/s NVIDIA CUDA ® Cores 3072 Peak Single Precision Performance Up to 7 TFLOPs System Interface PCI Express 3.0 x16 Max Power Consumption 250 W Thermal Solution Ultra-Quiet Active Fansink Form Factor 4.4” H × 10.5” L, Dual Slot, Full Height Display Connectors 4x DP 1.2, DVI-I DL, Optional Stereo Max Simultaneous Displays 4 direct, 4 DP 1.2 Multi-Stream Max DP 1.2 Resolution 4096 × 2160 at 60 Hz Max DVI-I DL Resolution2560 × 1600 at 60 Hz Max DVI-I SL Resolution1920 × 1200 at 60 Hz Max VGA Resolution2048 × 1536 at 85 Hz Graphics APIs Shader Model 5.0, OpenGL 4.53 , DirectX 12.04, Vulkan 1.03Compute APIsCUDA, DirectCompute, OpenCL ™REAL INTERACTIVE EXPRESSION NVIDIA ® QUADRO ®M6000 24GB。

EMDR的原理与操作技术创伤的神经生理•大脑对创伤性事件激活的模式：–1、回忆创伤事件时，被激活的部分基本上都是右脑，特别是处理情感信息的区域，如杏仁核、岛状结构、颞叶中部、右侧视皮质；–2、与此同时，左侧额叶下区域的活跃性显著下降，如布洛卡区域附近，其功能主要是将经验转化为用于交流的语言。

•左半球的功能主要是对信息进行分析、连贯、分类，用言语、符号操作。

右半脑主要是对非言语性的、整体的、动力性的信息进行处理。

•总的来说，在严重精神创伤发生以后，受害人两侧大脑半球的功能会出现脱节：左半球略受抑制，右半球略占优势。

创伤的整合•治疗需要充分的准备与稳定的治疗联盟。

–所有有经验的治疗师都应该注意避免准备不充分时就开始创伤的暴露，因为这只会带来再创伤，而非整合。

创伤治疗中的要素•1、正性信息传递---在回忆中反复证实和强化现实。

–创伤的心理治疗目的并非在于转变或减弱防御、增强体验，在很多情况下，创伤暴露涉及到如何处理挫败感，这需要反复向来访者确认现实的情景。

–理想的创伤整合分为两个层面：创伤再体验与中性的观察。

•焦点放在处理情感、残余自我及界限化上。

•一方面，让脑中记忆和创伤部分被分离出来；而另一方面又要保持对现实性的控制，在治疗过程中，反复对来访者强调如下观点十分重要：“我知道，我现在是在医院，一切只是在自动地进行着。

我现在在此所忍受的只是过去发生的事。

”–提供相关文献与书籍。

反复强调：这是两个成年的有知识、有能力的人——来访者与治疗师——之间所进行的对既往创伤过程的处理。

–创伤暴露的进行步骤和内容也需要在治疗前对患者解释清楚。

•2、稳定化：情感耐受性训练–及早地、有针对性地教来访者学会与相关回忆和感受保持适当距离的技术，也是帮助来访者重新恢复对日常生活的掌控以及恰当地与创作性回忆打交道的良好途径。

–支持治疗……表达（探索）治疗间的平衡点•忌暴露的状态：完全孤独无社会支持、严重躯体疾病、物质滥用、无足够情感耐受力、治疗联盟薄弱。

LMC-PCIE-Double-YLR系列激光控制卡电气使用说明书一、概述LMC-PCIE-Double-YLR系列打标焊接控制卡是专门针对激光打标开发的控制卡，其通过PCIE口与电脑通讯。

二、安装尺寸PCIE主卡PCIE端子板三、外观介绍PCIE主卡PCIE端子板四、LED指示灯说明注意：在对控制卡上电后第一时间查看亮灯情况，如果异常马上断电检查接线情况。

主卡灯状态：位号说明状态三色灯绿色指示灯空闲灯黄色指示灯运行灯红色指示灯报警灯端子板灯状态位号说明LED1负向电源指示灯LED6正向电源指示灯LED8外接24V电源指示灯（IO）LED3板卡空闲指示灯LED4板卡工作中指示灯LED5板卡错误指示灯五、接口说明5.1电源接口（J1，3PIN接线端子）5.1.1振镜不通过板卡J1端口供电接线方式管脚号板卡端丝印名称方向供电电源电压电源功率1+15V输入8V~28V>5W2GND输入GND3-15V不接注：如是以上方式接线，为避免振镜或板卡损坏需将振镜电源参考地与板卡电源参考地短接。

5.1.2振镜通过板卡J1端口供电接线方式管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入振镜正向电源电压（8~28V范围内）振镜功率+5W不小于0.75平方mm2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入振镜负向电源电压（-8~-28V范围内）振镜功率+5W不小于0.75平方mm例如：鹏鼎Ⅰ、Ⅱ代振镜供电，J1端口如下接线：管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入+15V振镜功率+5W不小于0.75平方mm 2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入-15V振镜功率+5W不小于0.75平方mm管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入+24V振镜功率+5W不小于0.75平方mm 2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入不接5.2振镜控制接口定义（J3，DB25母头）(XY2-100协议接口定义)管脚名称说明信号方向管脚名称说明信号方向1Clk-时钟信号-输出14Clk+时钟信号+输出2Sync-同步信号-输出15Sync+同步信号+输出3X_data-X振镜信号-输出16X_data+X振镜信号+输出4Y_data-Y振镜信号-输出17Y_data+Y振镜信号+输出5X_fb-（A-）X振镜反馈-（复用，飞行A-）输入18X_fb+（A+）X振镜反馈+（复用，飞行A+）输入6Y_fb-（B-）Y振镜反馈-（复用，飞行B-）输入19Y_fb+（B+）Y振镜反馈+（复用，飞行B+）输入9/10 /22+15V振镜供电电源+15V输出，与J1的1脚直连11/23/24GND GND，电源参考点输出，与J1的2脚直连12/1 3/25-15V振镜供电电源-15V输出，与J1的3脚直连7/8/20/21NC留用5.2.1振镜控制接口（J3，DB25母头）(SL2-100协议接口定义)振镜接线（SL2-100）SCANLAB振镜接口控制卡振镜接口振镜管脚号振镜信号定义控制卡管脚号接口定义1DATA IN+16x-data+6DATA IN-3X-data-5DATA OUT+18X-FB+9DATA OUT-5X-FB-7，8GND11,23,24GND注：①振镜信号（+，-）为一对差分信号，信号线要用屏蔽双绞线，振镜信号线长度<20m.②如果振镜电源从J3供电，供电线缆线径不小于0.75平方mm。

Print PageDescriptionDell Precision M4800 Mobile WorkstationDate & Time:September 14, 2015 5:53 PM CSTSYSTEM COMPONENTSDell Precision M4800 M obile Workstation Qty1Dell Precision M4800 CTO Base, Ubuntu 12.04Long Term Support (LTS) SP1Unit Price$1,934.8635% Off List Price OptiPlex, Latitude, and Precision WorkstationsExpires M onday, September 21, 2015-$677.20$50 Off Select Latitude, OptiPlex, PrecisionExpires M onday, September 21, 2015-$50.00 Catalog Number: 4 CUPMWS4800W7PModule Description Show DetailsM obile Precision M4800Dell Precision M4800 CTO BaseOperating System Ubuntu 12.04 Long Term Support (LTS) SP1M emory8GB (2x4GB) 1600MHz DDR3LKeyboard Internal English Backlit Dual Pointing KeyboardVideo Card AMD FirePro M5100 w/2GB GDDR5Driver Dell Wireless 1506 DriverHard Drive500GB 2.5" 7200rpm Hard DriveM ouse No MouseOptical Drive8X DVD+/-RW Drive Tray LoadWireless Dell Wireless 1506 802.11g/n Single Band Wi-Fi Half Mini CardPower Cord US Power CordDocumentation/Disks English Shipping DocsCamera Software No Camera SoftwareHardware Support 3 Year Hardware Service with Onsite/In-Home ServiceServices After Remote DiagnosisSystems M anagement No Out-of-Band Systems Management Resource DVD No Resource DVDPalmRest Smart Card onlyPlacemat No Quick Reference GuideRFID Label No RFID LabelCanada Ship Options US No Canada Ship ChargePrimary Battery6-cell (65Wh) Primary Battery Additional Battery No Additional BatteryM obile Broadband No Mobile BroadbandChassis Options Smartcard Reader Base (Non FIPS) for HD/FHD/UHD PanelEnergy Star No Energy StarProcessor Intel® Core™ i7-4710MQ Processor (Quad Core2.50GHz,3.50GHz Turbo, 6MB 47W, w/HD Graphics 4600)Dell Data Protection|Encryption SecuritySWNo DDPE Encryption SoftwareOptical Bay Hard Drive No Optical Bay Hard DriveBack Cover Back cover for FHD panel no WiGig Camera Camera and microphone for HD+/FHD panels Display Adapters No AccessoriesDell Data Protection | Endpoint Security Suite No Dell Data Protection | Endpoint Security Suite SoftwareOptical Software No Optical Software Secondary Hard Drive No Additional Hard Drive Label Regulatory LabelProcessor Branding Intel® Core™ i7 Processor LabelLCD 15.6" UltraSharp FHD(1920x1080) Wide View Anti-Glare LED-backlit with Premium Panel GuaranteeOffice ProductivitySoftwareNo Productivity SoftwareNon-M icrosoftApplication SoftwareDell Applications for N-Series Raid Connectivity NO RAIDProtect your new PC No Security SoftwarePower Supply180W AC AdapterSHIPPING MIX SHIP Config (DAO)Operating SystemNot IncludedRecovery OptionsDell Backup & Recovery No Dell Backup & RecoveryTransportation fromStandard shipmentODM to regionTOTAL: $1,207.66Total PriceSub-total$1,207.66Shipping & Handling1--Tax--Total Price2--In the event that you are subject to a taxholiday, you will not be charged tax.Learn More© 2015 Dell Regulatory Compliance Terms of Sale Unresolved Issues Privacy Ads & EmailsDell Recycling Contact Site M ap Visit ID FeedbackProductsPricing, specifications, availability and terms of offers may change without notice, are not transferable and are valid only for new purchases from this site for delivery in the 50 United States and the District of Columbia. Taxes, fees, shipping, handling and any applicable restocking charges extra, vary and are not subject to discount. This site and offers contained herein valid only for end users and not for resellers and/or online auctions. Dell cannot be responsible for pricing or other errors, omissions, or consequences of misuse of site and its functions. Offers not necessarily combinable. Discounts cannot be retroactively applied. Orders subject to cancellation by Dell. Software and peripherals offers do not apply to software and peripherals in the online system configuration pages (including PowerConnect switches); you must purchase eligible items through the separate Software & Peripherals online store. Limit 5 systems and 5 discounted or promotional products per customer. If items purchased under these promotions are leased, items leased will be subject to applicable end of leaseoptions or requirements.If you have a separate purchase agreement with Dell the terms and conditions in that agreement are not applicable to purchases of ink, toner or other printer supplies made by you via /supplies; all such sales are subject to Dell's Terms and Conditions of Sale located at /terms, except for the provision(s) regarding separate purchase agreements.All other sales are subject to Dell's Terms and Conditions of Sale located at /terms.snCM09。

控制点输出扩展卡 概述该部分内容介绍设定点输出扩展板的安装,参数配置及设定点控制操作。

仪表最多可以配置三种功能的扩展板，不同功能的扩展卡需插在特定的插槽上。

可选功能的扩展卡有：通讯扩展卡，变送输出扩展卡，控制点（报警）输出扩展卡。

每种功能只能有一个扩展卡安装在仪表上。

（安装图）设定点输出扩展卡有以下几种类型：EM-AL 2组继电器常开触点输出卡EM-AL2H 2组继电器常开常闭触点输出卡EM-AL2Z 2组继电器常开触点输出卡加2组开关量输入EM-AL2H2U 2组晶体管集电极开路输出卡（拉电流）加2组开关量输入EM-AL2O2U 2组晶体管集电极开路输出卡（灌电流）加2组开关量输入EM-AL2I2U 4组继电器常开触点输出卡EM-AL4H 4组晶体管集电极开路输出卡（拉电流）EM-AL4O 4组晶体管集电极开路输出卡（灌电流）EM-AL4I性能指标双继电器输出卡，常开型:EM-AL2H类型：2个常开型继电器隔离：与仪表信号输入公共端间：2000Vrms，1分钟工作电压：250Vrms触点额定容量：1A 250V AC或28VDC，阻性负载. 触点寿命：>10万次触点保护：压敏电阻吸收。

双继电器输出卡，常开常闭型:EM-AL2Z类型：2个常开常闭型继电器隔离：与仪表信号输入公共端间：2000Vrms，1分钟工作电压：250Vrms触点额定容量：3A 250V AC或28VDC，阻性负载. 触点寿命：>10万次触点保护：压敏电阻吸收。

双继电器输出及双开关量输入卡：EM-AL2H2U 类型：2个常开型继电器，2个干接点开关量输入隔离：与仪表信号输入公共端间：2000Vrms，1分钟继电器部分：工作电压：250Vrms触点额定容量：1A 250V AC或28VDC，阻性负载. 触点寿命：>10万次触点保护：压敏电阻吸收。

开关量输入部分：无源干接点双晶体管输出卡，集电极开路，拉电流，两组开关量输入:EM-AL2O2U类型：2只PNP型晶体管，隔离驱动，2个干接点开关量输入隔离：与仪表信号输入公共端间：500Vrms，1分钟工作电压：30VDC额定电流：200mA（最大）双晶体管输出卡，集电极开路，灌电流，两组开关量输入:EM-AL2I2U类型：2只PNP型晶体管，隔离驱动，2个干接点开关量输入隔离：与仪表信号输入公共端间：500Vrms，1分钟工作电压：30VDC额定电流：200mA（最大）四继电器输出卡，常开型: EM-AL4H类型：4个常开型继电器隔离：与仪表信号输入公共端间：2000Vrms，1分钟工作电压：250Vrms触点额定容量：3A 250V AC或28VDC，阻性负载. 触点寿命：>10万次触点保护：压敏电阻吸收。

EM Microelectronic闪存智能卡芯片
佚名
【期刊名称】《电子产品世界》
【年(卷),期】2005(000)11B
【摘要】EM Microelectronic公司推出基于独特闪存的智能卡IC产品——EMTG30和EMTG56。

该产品是为低端手机SIM卡设计的。

EMTG30／56符合IS07816-3集成电路卡（智能卡）指标。

存储器的灵活性是EMTG30／56的关键优势，存储器是容量分别为31KB和57KB的纯闪存。

EMTG30／56具有一个硬件实现的高性能8位标准8051微控制器内核，其每时钟周期的指令处理速度是基于微码8051内核典型设计的4倍。

其内部校正时钟的工作频率高达30MHZ，比需要外部时钟的设计更安全。

EMTG30／56增强了其内置模拟、硬件保护的存储器分区和修改通知的安全性。

其存储器结构100％可重编程。

EMTG30的闪存结构是由一个31KB通用NVM组成248页的128字节。

【总页数】2页(P32-33)
【正文语种】中文
【中图分类】TN492
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