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深圳市连大精密制品有限公司产品知识培训资料自制品部分连大产品料号在12位至14位数之间，产品料号L001－L904连接器主要指标：连接方式、间距、PIN数1、L100―――WAFER系列WAFER的定义：应用于板―线连接，公座的一端为WAFER.WAFER的间距：分为0.8 1.0 1.25 1.5 2.02.5 2.543.0 3.964.25.08。
WAFER的连接方式分为：180度、90度、SMT（贴板/贴片）WAFER 自制的有：WAFER PH0.8 单排立/卧贴系列(PIN数:2-22P)：成品料号规格L100XX-124001X WF PH0.8 XXP LCP 单排立贴环保L100XX-134001X WF PH0.8 XXP LCP 单排卧贴环保材料料号规格P100XX-14001 WF单排塑胶 PH0.8 3P 立/卧贴 LCP米白色环保T10012-9801 WF端子 PH0.8 单排 C5191-H<HV190-210>立/卧贴镀锡环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用>WAFER PH1.0 单排立/卧贴系列(PIN数:2-22P)：成品料号规格L101XX-124001X WF PH1.0 1*XXP LCP 单排立贴环保L101XX-134001X WF PH1.0 1*XXP LCP 单排卧贴环保材料料号规格P101XX-14001 WF塑胶 PH1.0 XXP SMT单排立/卧贴 LCP 米白色环保T10112-6802 WF PH1.0 单排立贴端子 C5191-H 镀锡环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用> 成品料号规格L101XX-134001X WF PH1.0 1*XXP LCP 单排卧贴环保材料料号规格P101XX-14001 WF塑胶 PH1.0 XXP SMT单排立/卧贴 LCP 米白色环保T10113-6805 WF PH1.0 H:2.9 单排卧贴端子 C5191-H 镀锡环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用>WAFER PH1.0 H4.3 立贴系列(PIN数:2*10/15/20/25P)：成品料号规格L101XX-224X01X WAFER PH1.0 2*XXP H4.3 立贴带柱/不带柱带吸取帽LCPfirst材料料号规格P101XX-24201 WAFER塑胶 PH1.0 2*XXP 立贴带柱/不带柱 H:4.3 LCP 环保P10115-24120 WAFER 吸取帽 PH1.0 LCP 环保T10112-6101 WF PH:1.0 H:4.3 双排立贴端子 C5191-H 镀全金1U" 环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用>WAFER PH1.0 H3.9 卧贴系列(PIN数:2*10/15/20/25P)：成品料号规格L101XX-234002X WAFER PH1.0 2*XXP H3.9侧插卧贴LCP 环保材料料号规格P101XX-24301 WF塑胶 PH1.0 2*XXP 卧贴 H:3.9 LCP 环保T10113-6103 WF PH1.0 H3.9 双排卧贴端子A C5191-H 1U" 环保T10113-6104 WF PH1.0 H3.9 双排卧贴端子B C5191-H 1U" 环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用>WAFER PH1.0 H5.4 卧贴系列(PIN数:2*10/15/20/25P)：成品料号规格L101XX-234001X WF PH1.0 2*XXP H:5.4 卧贴 LCP 卷装环保材料料号规格P101XX-24302 WF塑胶 PH1.0 2*XXP 卧贴 H:5.4 LCP 环保T10113-6101 WF PH1.0 H:5.4 侧插卧贴端子A C5191-H 镀1U"全金环保T10113-6102 WF PH1.0 H:5.4 侧插卧贴端子B C5191-H 镀1U"全金环保T10092-5801 接地片端子 C5191-H<HV190-210> 青铜镀锡环保<WF系列共用>WAFER的规格：单排间距0.8---1.25的最小为2P，最大为20P双排间距0.8---1.25的最小为2*5P，最大2*25P，具体有2*5P、2*8P、2*10P、2*15P、2*20P、2*25P。
W25Q64BV出版日期：2010年7月8日- 1 - 版本E64M位与串行闪存双路和四路SPIW25Q64BV- 2 -目录1，一般DESCRIPTION (5)2。
FEATURES (5)3引脚配置SOIC208-MIL.......................................... .. (6)4，焊垫配置WSON8X6-MM.......................................... . (6)5，焊垫配置PDIP300-MIL.......................................... . (7)6引脚说明SOIC208密耳，PDIP300密耳和WSON8X6-MM................................ 7......7引脚配置SOIC300mil的.......................................... .. (8)8引脚SOIC封装说明300-MIL (8)8.1包装Types (9)8.2片选(/CS) (9)8.3串行数据输入，输出和IO（DI，DO和IO0，IO1，IO2，IO3）............................. 9.......8.4写保护(/WP) (9)8.5控股(/HOLD) (9)8.6串行时钟(CLK) (9)9座DIAGRAM (10)10功能DESCRIPTION (11)10.1 SPI OPERATIONS (11)10.1.1标准SPI Instructions (11)10.1.2双SPI Instructions (11)10.1.3四路SPI Instructions (11)10.1.4保持功能 (11)10.2写保护 (12)10.2.1写保护Features (12)11，控制和状态寄存器............................................ .. (13)11.1状态REGISTER (13)11.1.1 BUSY (13)11.1.2写使能锁存(WEL) (13)11.1.3块保护位（BP2，BP1，BP0）..................................... .. (13)11.1.4顶/底块保护（TB）....................................... .................................................. ..1311.1.5部门/块保护(SEC) (13)11.1.6状态寄存器保护（SRP，SRP0）....................................... . (14)11.1.7四路启用(QE) (14)11.1.8状态寄存器内存保护........................................... .. (16)11.2 INSTRUCTIONS (17)11.2.1制造商和设备标识........................................... .. (17)11.2.2指令集表1 (18)W25Q64BV11.2.3指令表2（阅读说明书）....................................... (19)出版日期：2010年7月8日- 3 - 修订版E11.2.4写使能(06h) (20)11.2.5写禁止(04h) (20)11.2.6读状态寄存器1（05H）和读状态寄存器2（35H）.............................. (21)11.2.7写状态寄存器（01H）......................................... .................................................. .. (22)11.2.8读取数据(03h) (23)11.2.9快速阅读(0Bh) (24)11.2.10快速读双输出（3BH）........................................ .................................................. 0.25 11.2.11快速读四路输出（6BH）........................................ .. (26)11.2.12快速读双I / O (BBh) (27)11.2.13快速读取四I/ O (EBh) (29)11.2.14八进制字读取四I/ O（E3H）..................................... (31)11.2.15页编程(02h) (33)11.2.16四路输入页编程（32H）........................................ . (34)11.2.17扇区擦除（20H） (35)11.2.1832KB的块擦除（52H） (36)11.2.1964KB的块擦除(D8h) (37)20年2月11日芯片擦除（C7H/ 60h) (38)21年2月11日擦除挂起(75h) (39)22年2月11日擦除恢复(7Ah) (40)23年11月2日掉电(B9h) (41)24年2月11日高性能模式（A3H）......................................... (42)25年2月11日发布掉电或高性能模式/设备ID（ABH） (42)26年2月11日读制造商/设备ID（90H）....................................... . (44)27年2月11日阅读唯一的ID号（4BH）........................................ . (45)28年2月11日读JEDEC的ID (9Fh) (46)29年2月11日连续读取模式复位（FFH或FFFFH）...................................... .. (47)12，电气特性.............................................. (48)12.1绝对最大Ratings (48)12.2操作范围 (48)12.3上电时序和写抑制阈值......................................... (49)12.4直流电气Characteristics (50)12.5 AC测量条件.............................................. .. (51)12.6 AC电气Characteristics (52)12.7 AC电气特性（续）......................................... . (53)12.8串行输出Timing (54)12.9输入Timing (54)12.10持有Timing (54)13包装SPECIFICATION (55)W25Q64BV13.18引脚SOIC208密耳（包装代号SS）..................................... .. (55)- 4 -13.28引脚PDIP300密耳（封装代码DA）..................................... (56)13.38触点WSON8x6毫米（封装代码ZE）....................................... (57)13.416引脚SOIC300密耳（封装代码SF）..................................... . (58)14订货INFORMA TION (59)14.1有效的部件号和顶端标记.......................................... (60)15版本HISTORY (61)W25Q64BV出版日期：2010年7月8日- 5 - 修订版E1概述该W25Q64BV（64M位）串行Flash存储器提供了有限的系统存储解决方案空间，引脚和电源。
Dimensions: [mm]7443640150B7443640150B7443640150B7443640150B7443640150BT e m p e r a t u r eT pT L7443640150BFurther informationComponent Libraries:Altium_WE-HCF (23a)Downloads_CADENCE_WE-HCF (23a)Download_CadStar_WE-HCF (20a)Eagle_WE-HCF (23a)Download_IGS_WE-HCF-2818BPSpice_WE-HCF (22a)Download_STP_WE-HCFT-2818BSpectre_WE-HCF (23a)Free Sample Order:Order free samples of this article directly here!Tutorials:■Single Coil Inductors (PDF)■Redefining Rated Current Measurements for Power Inductors (PDF)REDEXPERT:Calculate losses for 7443640150B in REDEXPERTWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODALa003.0012023-11-30DIN ISO 2768-1mDESCRIPTIONWE-HCF SMT High CurrentInductor ORDER CODE7443640150BSIZE/TYPE BUSINESS UNIT STATUS PAGECautions and Warnings:The following conditions apply to all goods within the product series of WE-HCF of Würth Elektronik eiSos GmbH & Co. KG:General:•This electronic component was designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component was designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, as the core may flake apart.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not guarantee any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The customer is responsible for the functionality of their own products. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the Würth Elektronik technical soldering specification. All other profiles will void the warranty. •All other soldering methods are at the customers’ own risk.Cleaning and Washing:•Washing agents used during the production to clean the customer application may damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. Potting:•If the product is potted in the costumer application, the potting material may shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the core or wire contacts. Werecommend a manual inspection after potting to avoid these effects. Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty•Applying currents with audio-frequency signals may result in audible noise due to the magnetostrictive material properties. •Due to heavy weight of the components, strong forces and high accelerations may have the effect to damage the electrical connection or to harm the circuit board and will void the warranty.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompletenessWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODALa003.0012023-11-30DIN ISO 2768-1mDESCRIPTIONWE-HCF SMT High CurrentInductor ORDER CODE7443640150BSIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODALa003.0012023-11-30DIN ISO 2768-1mDESCRIPTIONWE-HCF SMT High CurrentInductor ORDER CODE7443640150BSIZE/TYPE BUSINESS UNIT STATUS PAGE。
DA-820Series3U19-inch IEC61850native PRP/HSR computers with Intel®Celeron®,Core™i3or i7 CPUFeatures and Benefits•IEC61850-3,IEEE1613,and IEC60255compliant for power substationautomation systems•Intel®Core™Celeron,i3,and i7CPU and QM77chipset•1CFast slot for OS and4SATA III for storage expansion(support Intel®RSTRAID0/1/5/10)•6USB2.0ports for high-speed peripherals•3PCIe x1slots and2PCI slots for expansion modules•1PCIe x16slot for an additional video card•Highly reliable design,supporting dual power and PRP/HSR technology(withPRP/HSR expansion module)•Onboard TPM module for enhanced cybersecurityCertificationsIntroductionThe DA-820is based on the Intel®Core™Celeron,i3,and i7CPU and QM77chipset,which supports the standard x86OS and comes with2VGA ports,6USB ports,4Gigabit LAN ports,and23-in-1RS-232/422/485serial ports.The DA-820is equipped with a4SATA disk interface and supports RAID0/1/5/10functionality.The DA-820is specifically designed for substation applications that require precise time synchronization and adherence to the IEC61850-3standards.The flexible design makes the DA-820suitable for local SCADA,environmental monitoring,video surveillance,protocol conversion,and PRP/HSR redundancy applications.In addition,the cybersecurity functions make the DA-820an ideal solution for secure network communication applications.The DA-820complies with the IEC60255standards to enable the protection of electrical relays in a smart substation.IEC60255is one of the most widely used standards for testing relays and protection equipment,and compliance ensures that the DA-820will work reliably and seamlessly with IEDs(intelligent electronic devices)as a part of the robust substation automation system.The housing is a standard3U,19-inch wide,rack-mounted rugged enclosure.This robust,rack-mountable design provides the hardened protection needed for industrial environment applications.Smart Recovery FunctionThe DA-820’s Smart Recovery function makes it easy to troubleshoot system software errors on computers to minimize downtime.Engineers who are experts in a particular vertical market may not have enough computer domain knowledge to know how to fix the operating system problems. Moxa Smart Recovery™is an automated BIOS-level recovery system tool that allows engineers to automatically trigger OS recovery to minimize downtime.Proactive Monitoring FunctionMoxa Proactive Monitoring is a small-footprint,resource-friendly,easy-to-use utility that allows users to track a number of system parameters. Users can view the current parameter values for these key parts by simply clicking on the icons corresponding to the parameters in the user er-defined key part indicators(KPIs)are used to monitor the computer’s key parts.Visible and/or audio alerts are triggered automatically via relay and SNMP traps when these KPIs exceed their preset threshold values,making it extremely convenient for operators to avoid system downtime by setting up predictive maintenance tasks well in advance.AppearanceFront View Rear ViewSpecificationsComputerCPU DA-820-C1Series:Intel®Celeron®Processor1047UE(2M cache,1.40GHz)DA-820-C3Series:Intel®Core™i3-3217UE Processor(3M cache,1.6GHz)DA-820-C7Series:Intel®Core™i7-3555LE Processor(4M cache,up to3.20GHz)DA-820-C8Series:Intel®Core™i7-3612QE Processor(6M cache,up to3.10GHz) System Chipset Mobile Intel®QM77Express ChipsetGraphics Controller Intel®HD Graphics4000(integrated)System Memory Slot SODIMM DDR3/DDR3L slot x2DRAM16GB max.capacity(204-pin SODIMM x2,each supporting unbuffered ECC DDR3memory at1333and1600MT/s and8GB maximum per module)Supported OS Linux Debian7Windows Embedded Standard7(WS7P)32-bitWindows Embedded Standard7(WS7P)64-bitWindows Embedded Standard7(WS7E)32-bitWindows Embedded Standard7(WS7E)64-bitNote:OS available by CTOSStorage Slot 2.5-inch HDD/SSD slots x4CFast slot x1Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(RJ45connector)x4Serial Ports RS-232/422/485ports x2,software selectable(DB9male)USB2.0USB2.0hosts x6,type-A connectorsExpansion Slots PCIe x1slots x3PCIe x16slot x1PCI slots x2Video Input VGA x2,15-pin D-sub connector(female)LED IndicatorsSystem Power x1Storage x1Programmable x8LAN8per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial InterfaceBaudrate50bps to115.2kbpsConnector DB9maleESD8kV(level4)Isolation2kVSerial Standards RS-232/422/485Surge2kVSerial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GND RS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersPower Button Reset button(front panel)ON/OFF(rear panel)Power Consumption60W(max.)Physical CharacteristicsHousing MetalDimensions(without ears)361x440x133mm(14.23x17.32x5.24in) Weight14,000g(31.11lb)Installation19-inch rack mountingEnvironmental LimitsOperating Temperature Standard Models:-40to60°C(-40to140°F)Wide Temp.Models:-40to75°C(-40to167°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN61000-6-2/-6-4EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-11DIPsIEC61000-4-2ESD:Contact:8kV;Air:15kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:4kV;Signal:4kVIEC61000-4-5Surge:Power:4kV;Signal:4kVIEC61000-4-6CS:10VIEC61000-4-8:20A/mPower Substation IEC61850-3,IEEE1613Protection Relay IEC60255Safety EN60950-1,IEC60950-1,UL60950-1Shock IEC60068-2-27,IEC60870-2-2,IEC61850-3Edition1.0 DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime DA-820-C1-SP-HV-T:193,537hrsDA-820-C1-DP-HV-T:222,207hrsDA-820-C1-SP-LV-T:283,281hrsDA-820-C1-DP-LV-T:288,116hrsDA-820-C3-SP-HV-T:193,537hrsDA-820-C3-DP-HV-T:222,207hrsDA-820-C3-SP-LV-T:283,281hrsDA-820-C3-DP-LV-T:288,116hrsDA-820-C7-SP-HV-T:191,570hrsDA-820-C7-DP-HV-T:219,618hrsDA-820-C7-SP-LV-T:240,015hrsDA-820-C7-DP-LV-T:285,508hrsDA-820-C8-SP-HV:172,182hrsDA-820-C8-DP-HV:194,509hrsDA-820-C8-SP-LV:240,015hrsDA-820-C8-DP-LV:285,508hrsWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x DA-820Series computerInstallation Kit1x rack-mounting earDocumentation1x quick installation guide1x warranty cardNote This product requires additional modules(sold separately)to function. DimensionsOrdering InformationDA-820-C8-SP-HV i7-3612QE Single✓–-40to60°C DA-820-C8-DP-HV i7-3612QE Dual✓–-40to60°C DA-820-C8-SP-LV i7-3612QE Single–✓-40to60°C DA-820-C8-DP-LV i7-3612QE Dual–✓-40to60°C DA-820-C7-SP-HV i7-3555LE Single✓–-40to60°C DA-820-C7-SP-HV-T i7-3555LE Single✓–-40to75°C DA-820-C7-DP-HV i7-3555LE Dual✓–-40to60°C DA-820-C7-DP-HV-T i7-3555LE Dual✓–-40to75°C DA-820-C7-SP-LV-T i7-3555LE Single–✓-40to75°C DA-820-C7-DP-LV-T i7-3555LE Dual–✓-40to75°C DA-820-C3-SP-HV-T i3-3217UE Single✓–-40to75°C DA-820-C3-DP-HV-T i3-3217UE Dual✓–-40to75°C DA-820-C3-SP-LV-T i3-3217UE Single–✓-40to75°C DA-820-C3-DP-LV-T i3-3217UE Dual–✓-40to75°C DA-820-C1-SP-HV-T Celeron1047UE Single✓–-40to75°C DA-820-C1-DP-HV-T Celeron1047UE Dual✓–-40to75°C DA-820-C1-SP-LV-T Celeron1047UE Single–✓-40to75°C DA-820-C1-DP-LV-T Celeron1047UE Dual–✓-40to75°C Accessories(sold separately)Expansion ModulesDA-IRIG-B-S-02-T IRIG-B expansion module,PCI interface,1fiber IRIG-B in,1DB9M in/out,1DB9M outDA-IRIG-B-S-04-T IRIG-B expansion module,PCI interface,1fiber IRIG-B in,1DB9M in/out,3DB9M outDA-PRP-HSR PRP,HSR expansion module,PCIe interfaceDE-GX02-SFP-T2-port1000Mbps fiber card,SFP slot x2,PCIe interface(SFP module excluded)DE-FX02-SFP-T2-port100Mbps fiber card,SFP slot x2,PCIe interface(SFP module excluded)CablesRG58AU BNC male to DB9male cable for the DA-IRIG-B-S-02-T and DA-IRIG-B-S-04-T,1.5m RG58AU BNC Male to DB9Malecable,150cmStorage KitsHDD kit with lock HDD/SSD kit(lock included)HDD/SSD kit with heat dissipationHDD/SSD kit with heat dissipation vent(lock not included)vent(lock not included)HDD/SSD kit with heat dissipation vent(lock included)HDD/SSD kit with heat dissipationvent and lockConnectorsDB9female to terminal block adapter DB9female to terminal block connector for the DA-IRIG-B-S-02-T and DA-IRIG-B-S-04-TUSB Dongle KitsUSB Dongle Kit Internal USB dongle kit installation packageThermal KitsDDR3-THERMAL-KIT-82001DDR3SDRAM thermal kit©Moxa Inc.All rights reserved.Updated May03,2019.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
数字家庭主板M2NDH-支持AMD®SocketAM2Athlon64FX/Athlo64X2/Athlon64/Sempron -AMDLive!™Ready-强大扩充能力：1xPCI-Ex16、2xPCI-E、3xPCI-华硕WiFi-APSolo-华硕DHRemote™-华硕MP3-In™-华硕Q-Connector-高保真音频中央处理器支持AMD®SocketAM2Athlon64FX/Athlo64X2/Athlon64/Sempron 支持AMDCool'n'Quiet™技术AMD64架构，同时兼容32位和64位计算AMDLive!™Ready芯片组NVIDIAnForce®430MCP前端总线2000/1600MT/s内存双通道内存架构4x240-pinDIMM内存插槽，支持最大容量高达8GB的DDR2800/667/533ECC和non-ECC、un-buffered内存扩充插槽1xPCI-Expressx16插槽2xPCI-Expressx1插槽3xPCI2.2插槽存储装置/RAID-1xUltraDMA133/100/66/33-4xSerialATA3.0Gb/s-NVIDIAMediaShield™RAID通过SerialA TA设备支持RAID0、1、0+1、5和JBOD网络功能NVIDIAnForce®430内建GigabitMAC，支持externalAttansicPHY无线局域网：54MbpsIEEE802.11b/g（华硕WiFi-APSolo）音频功能ADI6声道高保真音频CODEC背板S/PDIF数字音频输出USB高达8个USB2.0/1.1接口M2N-VMDH-AMDSocketAM2-NVIDIAGeForce6100/nForce430-双通道DDR2800/667/533-1xPCIExpressx16+1xPCIExpressx1+2xPCI-双VGA：DVI-D和D-Sub-8声道高保真音频-2x1394a接口中央处理器支持AMD®SocketAM2Athlon64X2/Athlon64FX/Athlon64/Sempro nAMDCool'n'Quiet™技术AMD64架构，兼容32位和64位计算AMDLive!™Ready芯片组NVIDIAGeForce6100/nForce430前端总线2000/1600MT/s 内存双通道内存架构4x240-pinDIMM插槽，支持最大容量为8GB的DDR2800/667/533non-ECC，un-buffered内存显卡集成GeForce6100GPU高清晰视频处理，最高分辨率可达1920x1440（@75Hz）支持RGB显示；UXGA1600x1200（@60Hz）支持DVI-D显示支持双VGA输出：DVI-D和RGB注意：DVI-D不能用来输出RGB信号至CRT。
10 Port USB Hub with Power Adapter - Surge Protection - Metal Industrial USB 3.0 Data Transfer Hub - Din Rail, Wall or Desk Mountable - High Speed USB 3.1 Gen 1 5Gbps HubProduct ID: HB30A10AMEThis TAA compliant 10-port industrial USB 3.0 hub gives you thescalability and power supply flexibility you need in harsh industrial environments, product, and repair labs, conference rooms or office workstations. With its rugged industrial-grade metal housing, it is designed to meet the advanced requirements of connecting a high number of devices in factories and office environments.Perfect for Harsh EnvironmentsThis industrial USB hub delivers reliable performance with a metal, heavy-duty housing. It supports wide-range 7-24V DC terminal block input, giving you the flexibility to power the hub as required, based on your own power input capabilities.Perfect for factory environments, the rugged hub also supports a wide operating temperature range (0°C to 70°C) and offers surge and ESD protection to each USB port, which can help prevent damage to your connected devices.Connect & Charge More USB DevicesDesigned for a high volume of connections, this robust USB 3.0 hub offers 10 connection ports, for connecting more USB devices and peripherals.The hub also supports USB battery charging specification 1.2, delivering up to 2.4A on any port to a maximum of 50W total, so you can charge your mobile devices faster than traditional USB ports allow.Locate the Hub Where You Need It MostWith versatile installation options, you can install the hub where it’s best suited for your environment. With built-in mounting brackets and included DIN mount rails, you can securely mount the USB 3.0 hub to most surfaces such as a wall, under a desk or rack.It supports wide-range 7-24V DC terminal block input, giving you the flexibility to power the hub as required, based on your own power input capabilities. You have the option to power the industrial hub by connecting the hub directly to an outlet with the included external terminal block power adapter, for more convenient and flexible installation. offers an external power adapter, ITB20D3250, sold separately. The universal DC power adapter can be used as an alternative, back up or replacement power supply for ’s line of industrial USB hubs.Works with Older USB DevicesThe rugged USB hub supports the full 5Gbps bandwidth of USB 3.0 and is backward compatible with previous USB devices. You can connect your legacy peripherals alongside your newer USB 3.0 devices without any disruptions.The HB30A10AME is backed by a 2-year warranty and free lifetime technical support.Certifications, Reports and Compatibility Features•RUGGED & RELIABLE: With a metal housing, 15kV/8kV air/contactESD protection & 350W surge protection this heavy duty USB 3.0 hub reliably connects 10 USB devices in harsh, industrial environments •MOUNTING OPTIONS: This mountable USB hub securely installson/under a desk, to a wall or DIN rail using the built-in mountingears & included DIN brackets, a 6ft (1.8 m) USB 3.0 cable is alsoincluded•POWER FLEXIBILITY: For unique power requirements the USB 3.0 hub supports a +7-24 volt DC range, powered via DC drop, LPS witha terminal block or by AC outlet with the included power supplyadapter•POWER & CHARGE YOUR DEVICES: 10 USB 3.1 Gen 1 ports transferdata at 5Gbps with 2.4A (12W) of power on up to 4 ports or anycombination of lower power draw devices for up to 50W of totalshared power•THE ADVANTAGE: offers a 2-year warranty and free lifetime technical support on this hub with avariety of USB cables available to connect downstream devices (sold separately)Warranty 2 YearsHardware Bus Type USB 3.0Chipset ID Genesys Logic - GL3523Fast-Charge Port(s)YesIndustry Standards USB Battery Charging Specification Rev. 1.2USB 3.2 Gen 1 - Backwards compatible with USB 3.0, 3.0,and 1.1Interface USB 3.0Ports10USB-C Device Port(s)NoUSB-C Host Connection NoPerformance ESD Protection+/-15kV (Air)+/-8kV (Contact)Maximum Data Transfer Rate 5 GbpsMTBF126,106 HoursSurge Protection350W on the DFP and UFPType and Rate USB 3.0 - 5 Gbit/sUASP Support YesConnector(s)Connector Type(s)10 - USB 3.1 USB Type-A (9 pin, Gen 1, 5 Gbps) Female1 - USB Type-B (9 pin) USB 3.0 Female1 - Terminal Block (2 Wire)Software OS Compatibility OS Independent; No additional drivers or software requiredSpecial Notes / Requirements Note If connected to a USB 2.0 host port, performance may belimitedThis product is intended for use with terminal block poweronly – Standard AC adapter not availableSystem and Cable Requirements Host computer with an available USB 3.0 portIndicators LED Indicators 1 - Power (Green) Power Input Current 1.4AInput Voltage100 - 240 ACOutput Current 3.25AOutput Voltage20V DCPlug Type Terminal Block (2 Wire)Power Consumption (In Watts)65WPower Source AC Adapter IncludedEnvironmental Humidity5%~95% RH (Non-condensing)Operating Temperature0°C to 70°C (32°F to 158°F)Storage Temperature-20°C to 85°C (-4°F to 185°F)Color BlackPhysicalCharacteristicsForm Factor IndustrialProduct Height30.000Product Length7.8 in [19.8 cm]Product Width55.000Weight of Product352.000PackagingPackage Height70.000InformationPackage Length295.000Package Width190.000Shipping (Package) Weight1362.000What's in the Box Included in Package 1 - USB Hub1 - USB 3.0 Host Cable1 - Universal Power Adapter (NA/JP, ANZ, UK, EU)2 - DIN Rail Brackets4 - Mounting Screws1 - Quick-Start GuideProduct appearance and specifications are subject to change without notice.。
TEST REPORT测试报告Product Name ：HDMI TYPE A 母座正向沉板DIP型Product No. ：Sample Quantity ：72PCSTest Item：可靠性测试(Reliability Test)Test Dept. ：品管部(QA Dept.)MeasureEnvironment : Temp. : 23±3℃, R.H. : 35%~75%Report NO. ：Total Pages ：本报告共23 页(pages)Test Date ：XXXX.XX.XX~XXXX.XX.XXNote : 1. The results of the testing report relate only to the items tested.2. The testing report shall not be reproduced except in full,without the written approval of HELIOWAY.Test Group process:1. Test Group 1 [Thermal Shock] :1.1 Test item & Test method :1.2 Test condition :1.2.1 LLCR : 20mV maximum. Open circuit at 10mA maximum.Shell : measure by open circuit, 5V Max. ,100 mA1.2.2 Thermal Shock :10 cycles of: –55 ℃for 30 minutes.+85 ℃for 30 minutes.1.3 Test request :1.3.1 LLCR :Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.1.3.2 Thermal Shock :a. No evidence of damage.b. The electrical performances should meet the spec. specified.1.4 Test value :1.5 Test result :2. Test Group 2 [HumidityA]:2.1 Test item & Test method :2.2 Test condition :2.2.1 LLCR : 20mV maximum. Open circuit at 10mA maximum.Shell : Measure by open circuit, 5V Max. ,100 mA2.2.2 IR : Unmated connectors, apply 500V DC between adjacent terminal or ground.Mated connectors, apply 150V DC between adjacent terminal or ground.2.2.3 DWV: Unmated connectors, apply 500V AC between adjacent terminal or ground.Mated connectors, apply 300V AC between adjacent terminal or ground.2.2.4 Humidity:Mating connectors:Temperature : +25 to +85℃.Relative Humidity : 80 to 95%Duration : 4 cycles (96 hours)2.3 Test request :2.3.1 LLCR :Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.2.3.2 IR: Unmated:100 MΩ Minimum.Mated: 10 MΩ Minimum.2.3.3 DWV:No Breakdown.2.3.4 Humidity :a. No evidence of damage.b. The electrical performances should meet the spec. specified.2.4 Test value :2.5 Test result :3. Test Group 3 [HumidityB]:3.1 Test item & Test method :3.2 Test condition :3.2.1 LLCR : 20mV maximum. Open circuit at 10mA maximum.Shell : Measure by open circuit, 5V Max. ,100 mA3.2.2 IR : Unmated connectors, apply 500V DC between adjacent terminal or ground.Mated connectors, apply 150V DC between adjacent terminal or ground. 3.2.3 DWV: Unmated connectors, apply 500V AC between adjacent terminal or ground.Mated connectors, apply 300V AC between adjacent terminal or ground. 3.2.4 Humidity:Mating connectors:Temperature : +25 to +85℃.Relative Humidity : 80 to 95%Duration : 4 cycles (96 hours)3.3 Test request :3.3.1 LLCR :Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.3.3.2 IR: Unmated:100 MΩ Minimum.Mated: 10 MΩ Minimum.3.3.3 DWV:No Breakdown.3.3.4 Humidity :a. No evidence of damage.b. The electrical performances should meet the spec. specified.3.4 Test value :3.5 Test result :4. Test Group 4 [Thermal Aging]:4.1 Test item & Test method:4.2 Test condition:4.2.1 LLCR: 20mV maximum. Open circuit at 10mA maximum.Shell: measure by open circuit, 5V Max. , 100 mA4.2.2 Thermal Aging:Mate connectors and expose to 105±2°C for 250 hours .4.3 Test request:4.3.1 LLCR: Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.4.3.2 Thermal Aging:a. No evidence of damage.b. The electrical performances should meet the spec. specified.4.4 Test value:4.5 Test result :5. Test Group 5[Vibration]:5.1 Test item & Test method:5.2 Test condition:5.2.1 LLCR: 20mV maximum. Open circuit at 10mA maximum.Shell: measure by open circuit, 5V Max. , 100 mA5.2.2 Vibration:a. Amplitude: 1.52mm P-P or 147m/s² (15G).b. Frequency: 50-2000-50Hz in 20 minutes.c. Duration: 12 times in each (total of 36 times) X, Y, Z axes.d. Electrical load: DC 100 mA current shall be flowed during the test.5.3 Test request:5.3.1 LLCR:Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.5.3.2 Vibration:a. No discontinuities of 1μs or longer duration.b. No evidence of damage.c. The electrical performances should meet the spec. specified.5.4 Test value:5.5 Test result:6.Test Group 6 [Shock]:6.1 Test item & Test method:6.2 Test condition:6.2.1 LLCR: 20mV maximum. Open circuit at 10mA maximum.Shell: measure by open circuit, 5V Max. , 100 mA6.2.2 Shock:Pulse width: 11 msec.Waveform: half sine,490 m/s2 (50G), 3 strokes in each X, Y, Z, axes.6.3 Test request:6.3.1 LLCR:Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.6.3.2 Shock:a. No discontinuities of 1μs or longer duration.b. No evidence of damage.c. The electrical performances should meet the spec. specified.6.4 Test value:6.5 Test result :7.Test Group 7 [Durability] :7.1 Test item & Test method:7.2 Test condition:7.2.1 LLCR: 20mV maximum. Open circuit at 10mA maximum.Shell: measure by open circuit, 5V Max. , 100 mA7.2.2 Insertion / Withdrawal Force:Speed: 25mm/minute7.2.3 Durability:10,000 cycles at 100 ±50 cycles per hour.7.3 Test request:7.3.1 LLCR:Initial contact resistance excluding conductor resistance: 10 mΩ Max.Final: 30 mΩ Max. Shell: Change from initial value: 50mΩ Max.7.3.2 Insertion / Withdrawal Force:a. Insertion force: 44.1N (4.5kgf) Max.b. Withdrawal Force: Initial9.8N (1.0kgf) Min. 39.2N (4.0kgf) Max.7.3.3 Durability:a. Withdrawal force: After 10000 cycles 4.9N (0.5kgf) Min.b. The electrical performances should meet the spec. specified.c. Final: Contact: Change from initial value: 30mΩ Max.Shell: Change from initial value: 50mΩ Max.7.4 Test value:7.5 Test result:8.Test Group 8 [Contact Current Rating] :8.1 Test Item & Test method:8.2 Test condition:8.2.1 Contact Current Rating:a. Current Rating: 0.5A.b. Ambient Temperature: 23±3℃.8.3 Test request :8.3.1 Temperature Rise vs Current Rating :55℃, Max. ambient; 85℃, Max. Temperature change 8.4 Test value:8.5 Test result:9.Test Group 9 [Salt Spray ] :9.1 Test item & Test method:9.2 Test condition:9.2.1 LLCR: 20mV maximum. Open circuit at 10mA maximum.Shell: measure by open circuit, 5V Max. , 100 mA9.2.2 Salt Spray:a. Temperature: 35±1.1℃.b. Humidity: 95~98%. (R.H)c. PH Value: 6.5~7.2.d. Duration: 48 hours.9.3 Test request:9.3.1 LLCR:Initial contact resistance excluding conductor resistance: 10 mΩ Max.Shell: Change from initial value: 50mΩ Max.9.3.2 Salt Spray:a. No evidence of damage.b. The electrical performances should meet the spec. specified.9.4 Test value:9.5 Test result:10. Test group 10[High frequency request]: 10.1 Test item & Test method:10.2 Test request:10.3 Test value10.3.1 Differential impedanceNote:Zdiff_conn_low = lowest impedance through the connector and transition areaZdiff_conn_hi = highest impedance through the connector and transition areaZdiff_cable_low = lowest impedance in the cable areaZdiff_cable-hi = highest impedance in the cable area1) If (Zdiff_cable _low<90_) or (Zdiff_cable_hi>110_) then Fail2) If (Zdiff_conn_low<75_) or (Zdiff_conn_hi>125_) then Fail3) If (Zdiff_conn_low<85_) or (Zdiff_conn_hi>115_) thenIf the duration of violation is 250ps or longer or there is more then one excursion then FAIL.10.4 Test picture10.5 Test result:11. Test Group 11 [Solder ability]:11.1 Test item & Test method:11.2 Test condition:11.2.1 Solder ability:a. Steam Aging Temperature: 90~96︒CSteam Aging Duration: 8hours±5minutes.b. Soldering Temperature: 245±5︒CSoldering Time: 2~3 secondsFlux: Inactivated11.3 Test request:11.3.1 Solder ability:Continuous solder coating with a minimum 95% coverage.11.4 Test value:11.5 Test result:12. Test Group 12 [Resistance to Soldering Heat]: 12.1 Test item & Test method:12.2 Test condition:12.2.1 Infrared Reflow condition12.3 Test request:12.3.1 Resistance to Soldering Heat: No evidence of damage.12.4 Test profile:12.5 Test value:12.6 Test result:Testing Equipment:UNDER BLANK.。
