Cost Effective Assembly
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Cost Effective Assembly of Hybrid Microsystems
Iwan Kurniawan Delft University of Technology Precision Manufacturing and Assembly Mekelweg 2, 2628 CD Delft, The Netherlands Tel: +31 15 2786706 Fax: +31 15 2783910 Email: i.kurniawan@tudelft.nl
Hybrid microsystems have an advantage that the most appropriate technology for each component can be selected independently. This often leads to a shorter development time and the ease of system performance optimization. On the other hand, the increasing component number can make the assembly of the micro components very complex due to material and process compatibility issues, the downscaling effects, accuracy requirements, cost, and so on.
Objective
The objective of this research is to investigate the assembly principles and to develop cost effective assembly techniques for hybrid microsystems.
Morphological Classification of the Assembly Process
A. Target part Die Wafer
B. Added part
Approach
Based on literature study, the nature of microsystems assembly processes were analyzed and classified. The classification scheme will be used as a basis to develop the assembly techniques. Experimental demonstration will be performed to verify and improve the techniques.
Classification and Analysis of Classification and Analysis of Assembly Principles Assembly Principles
Non wafer based
Multiple parts Multiple Single part Dies on wafer Single die
Wafer based
MEMS structure on wafer MEMS structure on die
I. Transfer
Without Carrier
Separated carrier
Integrated carrier
II. Alignment
Parallel
Single
Self Alignment
Minimum alignment
Integrated constraint
Separated constraint
Controlled by external tool
Multiple
Serial
III. Joining
Concept Development of the Concept Development of the Assembly Techniques Assembly Techniques
Direct Joining
Joining with interface medium
Single
Mechanical
Thermal
Electric potential
Compression
Ultrasonic
Adhesive
Others
Experimental Demonstrations Experimental Demonstrations of Assembly Techniques of Assembly Techniques
Example: Assembly path of die encapsulation
(many paths are possible, but only two are shown in this example)
Assembly Classification
The assembly scheme is divided into 5 levels. The first two levels consist of the classification of the micro parts to be assembled, which are the target and added part. The other three levels consist of the classification of the assembly step, which are transfer, alignment, and joining. Each level has class alternatives. Choosing different alternative in each level leads to various possibilities of the overall assembly process configuration.
Path 1: Die-to-die assembly (Blue line: die – single die – without carrier – controlled by external tool – adhesive)
Caps wafer
Microsystems wafer Dicing
Transfer Align Join
Path 2: Wafer-to-wafer assembly (Red line: wafer – dies on wafer – without carrier – integrated constraint – thermal)
Caps wafer
Microsystems wafer
Future Goals
Development of the assembly techniques Experimental demonstrations to test and verify the assembly techniques.
Transfer Align Join
Dicing
Acknowledgement
This project is a research collaboration between PMA and HiTeC - TU Delft and supported by Delft Centre for Mechatronics and Microsystems (DCMM) and MicroNed.
PMA
Laboratory for Precision Manufacturing and Assembly
DCMM
。
