Analog Design Centering and Sizing2

2Frequency Inverter - CFW500The optional communication network and I/O modules are easily installed, allowing interface of the standardVFD to each application.Quickly replicate the programming and application from one CFW500 to others without the need to apply powerto the drive.Built-in SoftPLC enables the VFD to do much more than just turn a motor. Programming flexibility combined with network and I/O options make the CFW500 a powerful part of an integrated system.The standard CFW500 is capable of 150% overload for one minute, repeatable every 6 minutes, based on ambient temperature of 50 °C.Does not require oversizing the VFD.AdvantagesTime saving, standardization and optimized costsFast, easy and reliable programming for manufacturersthat produce machines in large quantities.Often eliminates the need for an external PLC, reducingcosts, optimizing space and simplifying the system.Frequency Inverter - CFW5003Frequency Inverter - CFW5004Conformal Coating as StandardIncreasing the lifetime, protecting the electronic boards against corrosive atmospheres. Classified as 3C2 according to IEC 60721-3-3.FanSimple and fast removal.45123Easy ConfigurationJ Fast commissioningJ Innovative design, compact and uniformJ Optimized cost vs benefitFrequency Inverter - CFW5005J Centrifugal pumpsJ Process dosing pumps J Fans / ventilators J Blenders / mixers J CompressorsApplicationsJ Conveyors J Roller tables J GranulatorsJ Commercial dryers JRotary filtersJ D isplay up to three variables at the same time,selected by the userHuman-Machine InterfaceFriendly ProgrammingJ Oriented start-up: programming step by stepJ Easy and intuitive operation, fast access to the parametersJ Parameter group: shortcut to the parameters of interestCFW500 statusMain displaySoft keysBar forvariable monitoringSecondary displayUnit of measurementParameter groupsRemote HMISuitable for enclosure door or machine console.CFW500-CCHMIRXMX = up to 10 mRS485Included in all plug-inmodulesCFW500-HMIRIP54Frequency Inverter - CFW5006Frequency Inverter - CFW5007Energy EfficiencyCertificationsIn industry, electric motors are responsible for nearly 70% of all the electric energy consumption.By using VFD, is possible to reduce consumption up to 40%.Besides being efficient in the control of electric motors, theyreduce machine wear, save raw material, improve process quality and increase productivity.Visit our WEG website, to calculate how much energy can be saved by using the CFW500 VFD - /us .Ensure energy efficiency for your equipment and machines. Save money and contribute to the conservation of theenvironment.Frequency Inverter - CFW5008SuperDrive G2Software application for programming, control and monitoring of WEG VFD.Trend FunctionJ On-line graphic monitoring of parameters/variables J C apability to export an image of the respective graph based to the selected periodChanging and Monitoring of Parameters in a List/Table Parameter set storage in a computer file format.Status MonitoringOperation with HMIOn-line parameter editing.JUpload/download of parameters from the PC to the CFW500 and vice versa JOff-line editing of parameters stored on the PCUSB connectionFrequency Inverter - CFW5009Enable/Disable I/OIt simplifies and speeds up the validation of the application.I/O MonitoringSpeed referenceContacts and coilsComparators and math functionsPIDUser block protected by passwordCounters and timersFrequency Inverter - CFW50010Product CodingThe CFW500 code identifies its construction characteristics, nominal current, voltage range and optionals. Using the product code, it is possible to select the CFW500 required for your applicationsimply and quickly.Notes: 1) To know which models have these options in the standard product the table below should be checked.2) RFI filter.Categories:- Category C1: inverters with voltages below 1,000 V, for use in the First Environment.- Category C2:i nverters with voltages below 1,000 V, with plugs or mobile installation, when used in the “First Environment”, must be installed and started-up by a qualified professional.- Category C3: inverters with voltages below 1,000 V, developed for use in the Second Environment and not designed for use in the “First Environment”.Environments:- First Environment:e nvironments that include household installations, such as buildings directly connected, without intermediate transformer, to a low-voltage power supply grid, which supplies buildings used for domestic purposes.- Second Environment:i ncludes all the buildings other than those directly connected to a low-voltage power supply grid, which supplies buildings used for domestic purposes.For the RFI filters of external installations, refer to the CFW500 user manual. Drive RatingsThe correct way to select a VFD is matching its output current with the motor rated current. However, the tables below present the approximate motor power for each VFD model. Use the motor power ratings below only as a guide. Motor rated currents may vary with speed and manufacturer.Notes: H P rating based on FLA values from WEG W22, 2 and 4 poles, 230 V ac and 460 V ac, NEMA motors.Use as a guide only. Motor FLA may vary with speed and manufacturer.Always compare motor FLA to Nominal AMPS of VFD and overload conditions.Frequency Inverter - CFW50011Frequency Inverter - CFW50012Accessories and OptionalsThe CFW500 VFD was developed to meet the hardware configurations required by a wide range of applications. The table below presents the available options:Frequency Inverter - CFW500133 - Close coverDimensions and WeightsIP20NEMA1DWHDWHFrequency Inverter - CFW50014Block Diagram(CFW500-HMIR)KeypadSoftware WLP Notes: (*) T he number of inputs and outputs (analog and digital), as well as other resources, may vary according to the used plug-in module. For furtherinformation, refer to the CFW500 user manual.(**) Not available for frame size A. Technical DataTechnical Data - StandardsFrequency Inverter - CFW50015R e v : 00 | D a t e (m /y ): 06/2014T h e v a l u e s s h o w n a r e s u b j e c t t o c h a n g e w i t h o u t p r i o r n o t i c e .WEG Electric Corp.6655 Sugarloaf Parkway Duluth, GA 30097Phone: 1-800-ASK-4WEG For those countries where there is not a WEG own operation, find our local distributor at .WEG Worldwide OperationsARGENTINAWEG EQUIPAMIENTOS ELECTRICOSSan Francisco - Cordoba Phone: +54 3564 421 484***************/arWEG PINTURAS - Pulverlux Buenos AiresPhone: +54 11 4299 8000**************AUSTRALIAWEG AUSTRALIA VictoriaPhone: +61 3 9765 4600***************/au AUSTRIAWATT DRIVE - WEG Group Markt Piesting - Vienna Phone: +43 2633 404 0****************** BELGIUMWEG BENELUX Nivelles - BelgiumPhone: +32 67 88 84 20***************/beBRAZIL WEG EQUIPAMENTOS ELÉTRICOS Jaraguá do Sul - Santa CatarinaPhone: +55 47 3276-4002***************/brCHILE WEG CHILESantiagoPhone: +56 2 784 8900***************/clCHINA WEG NANTONGNantong - JiangsuPhone: +86 0513 8598 9333***************/cnCOLOMBIA WEG COLOMBIA BogotáPhone: +57 1 416 0166***************/coECUADORWEG ECUADOR QuitoPhone: 5144 339/342/317******************/ecFRANCEWEG FRANCESaint Quentin Fallavier - Lyon Phone: +33 4 74 99 11 35***************/frGERMANYWEG GERMANYKerpen - North Rhine Westphalia Phone: +49 2237 9291 0***************/de GHANAZEST ELECTRIC GHANA WEG Group AccraPhone: +233 30 27 664 90******************.gh .ghINDIAWEG ELECTRIC INDIA Bangalore - Karnataka Phone: +91 80 4128 2007***************/in WEG INDUSTRIES INDIA Hosur - Tamil Nadu Phone: +91 4344 301 501***************/in ITALY WEG ITALIA Cinisello Balsamo - Milano Phone: +39 02 6129 3535***************/it JAPAN WEG ELECTRIC MOTORS JAPAN Yokohama City - Kanagawa Phone: +81 45 550 3030***************/jp MALAYSIAWATT EURO-DRIVE - WEG Group Shah Alam, Selangor Phone: 603 78591626******************.my MEXICOWEG MEXICO HuehuetocaPhone: +52 55 5321 4231***************/mx VOLTRAN - WEG Group Tizayuca - HidalgoPhone: +52 77 5350 .mx NETHERLANDS WEG NETHERLANDS Oldenzaal - Overijssel Phone: +31 541 571 080***************/nl PERU WEG PERU LimaPhone: +51 1 209 7600***************/pe PORTUGAL WEG EURO Maia - PortoPhone: +351 22 9477705***************/pt RUSSIA and CIS WEG ELECTRIC CIS Saint PetersburgPhone: +7 812 363 2172***************/ru SOUTH AFRICAZEST ELECTRIC MOTORS WEG Group JohannesburgPhone: +27 11 723 6000************.za www.zest.co.zaSPAINWEG IBERIA MadridPhone: +34 91 655 30 08***************/es SINGAPOREWEG SINGAPORE SingaporePhone: +65 68589081***************/sg SCANDINAVIA WEG SCANDINAVIA Kungsbacka - Sweden Phone: +46 300 73 400***************/seUKWEG ELECTRIC MOTORS U.K.Redditch - Worcestershire Phone: +44 1527 513 800***************/ukUNITED ARAB EMIRATES WEG MIDDLE EAST DubaiPhone: +971 4 813 0800***************/ae USAWEG ELECTRIC Duluth - GeorgiaPhone: +1 678 249 2000***************/usELECTRIC MACHINERY WEG GroupMinneapolis - Minnesota Phone: +1 612 378 8000 VENEZUELAWEG INDUSTRIAS VENEZUELA Valencia - CaraboboPhone: +58 241 821 0582***************/ve。

计算机行业常见设备名称英语词汇汇总下面是计算机行业常见设备名称，大家可以参考下。

ATAPI(AT Attachment Packet Interface)BCF(Boot Catalog File，启动目录文件)BIF(Boot Image File，启动映像文件)CDR(CD Recordable，可记录光盘)CD-ROM/XA(CD-ROM eXtended Architecture，唯读光盘增强形架构)CDRW(CD-Rewritable，可重复刻录光盘)CLV(Constant Linear Velocity，恒定线速度)DAE(digital Audio Extraction，数据音频抓取)DDSS(Double Dynamic Suspension System，双悬浮动态减震系统)DDSS II(Double Dynamic Suspension System II，第二代双层动力悬吊系统)PCAV(Part Constant Angular Velocity，部分恒定角速度)VCD(Video CD，视频CD)AAS(Automatic Area Seagment?)dpi(dot per inch，每英寸的打印像素)ECP(Extended Capabilities Port，延长能力端口)EPP(Enhanced Parallel Port，增强形平行接口)IPP(Inter Printing Protocol，因特网打印协议)ppm(paper per minute，页/分)SPP(Standard Parallel Port，标准并行口)TET(Text Enhanced Technology，文本增强技术)USBDCDPD(Universal Serial Bus Device Class Definition for Printing Devices，打印设备的通用串行总线级标准) VD(Variable Dot，变点式列印)TWAIN(Toolkit Without An Interesting Name)协议AAT(Average aess time，平均存取时间)ABS(Auto Balance System，自动平衡系统)ASMO(Advanced Storage Mago-Optical，增强形光学存储器) AST(Average Seek time，平均寻道时间)ATA(AT Attachment，AT扩展型)ATOMM(Advanced super Thin-layer and high-Output Metal Media，增强形超薄高速金属媒体)bps(bit per second，位/秒)CAM(Common Aess Model，公共存取模型)CSS(Common Command Set，通用指令集)DMA(Direct Memory Aess，直接内存存取)DVD(Digital Video Disk，数字视频光盘)EIDE(enhanced Integrated Drive Electronics，增强形电子集成驱动器)FAT(File Allocation Tables，文件分配表)FDBM(Fluid dynamic bearing motors，液态轴承马达)FDC(Floppy Disk Controller，软盘驱动器控制装置)FDD(Floppy Disk Driver，软盘驱动器)GMR(giant magoresistive，巨型磁阻)HDA(head disk assembly，磁头集合)HiFD(high-capacity floppy disk，高容量软盘)IDE(Integrated Drive Electronics，电子集成驱动器)LBA(Logical Block Addressing，逻辑块寻址)MBR(Master Boot Record，主引导记录)MTBF(Mean Time Before Failure，平均故障时间)PIO(Programmed Input Output，可编程输入输出模式)PRML(Partial Response Maximum Likelihood，最大可能部分反响，用于提高磁盘读写传输率)RPM(Rotation Per Minute，转/分)RSD：(Removable Storage Device移动式存储设备)SCSI(Small Computer System Interface，小型计算机系统接口)SCMA：(SCSI Configured Auto Magically，SCSI自动配置)S.M.A.R.T.(Self-Monitoring， Analysis and Reporting Technology，自动监测、分析和报告技术)SPS(Shock Protection System，抗震保护系统)STA(SCSI Trade Association，SCSI同业公会)Ultra DMA(Ultra Direct Memory Aess，超高速直接内存存取) LVD(Low Voltage Differential)Seagate硬盘技术DiscWizard(磁盘控制软件)DST(Drive Self Test，磁盘自检程序)SeaShield(防静电防撞击外壳)3DPA(3D Positional Audio，3D定位音频)AC(Audio Codec，音频多媒体数字信号编解码器)Auxiliary Input(辅助输入接口)CS(Channel Separation，声道别离)DS3D(DirectSound 3D Streams)DSD(Direct Stream Digital，直接数字信号流)DSL(Down Loadable Sample，可下载的取样音色)DLS-2(Downloadable Sounds Level 2，第二代可下载音色)EAX(Environmental Audio Extensions，环境音效扩展技术) Extended Stereo(扩展式立体声)FM(Frequency Modulation，频率调制)FIR(finite impulse response，有限推进响应)FR(Frequence Response，频率响应)FSE(Frequency Shifter Effect，频率转换效果)HRTF(Head Related Transfer Function，头部关联传输功能) IID(Interaural Intensity Difference，两侧声音强度差异) IIR(infinite impulse response，无限推进响应)Interactive Around-Sound(交互式环绕声)Interactive 3D Audio(交互式3D音效)ITD(Interaural Time Difference，两侧声音时间延迟差异) MIDI：( Musical Instrument Digital Interface乐器数字接口)NDA：( non-DWORD-aligned ，非DWORD排列)Raw PCM：( Raw Pulse Code Modulated元脉码调制)RMA：( RealMedia Architecture实媒体架构)RTSP： (Real Time Streaming Protocol实时流协议)SACD(Super Audio CD，超级音乐CD)SNR(Signal to Noise Ratio，信噪比)S/PDIF(Sony/Phillips Digital Interface，索尼/飞利普数字接口)SRS： (Sound Retrieval System声音修复系统)Surround Sound(环绕立体声)Super Intelligent Sound ASIC(超级智能音频集成电路)THD+N(Total Harmonic Distortion plus Noise，总谐波失真加噪音)QEM(Qsound Environmental Modeling，Qsound环境建模扬声器组)WG(Wave Guide，波导合成)WT(Wave Table，波表合成)3D：(Three Dimensional，三维)3DS(3D SubSystem，三维子系统)AE(Atmospheric Effects，雾化效果)AFR(Alternate Frame Rendering，交替渲染技术)Anisotropic Filtering(各向异性过滤)APPE(Advanced Packet Parsing Engine，增强形帧解析引擎) AV(Analog Video，模拟视频)Back Buffer，后置缓冲Backface culling(隐面消除)Battle for Eyeballs(眼球大战，各3D图形芯片公司为了争夺用户而作的竞争)Bilinear Filtering(双线性过滤)CEM(cube environment mapping，立方环境映射)CG(Computer Graphics，计算机生成图像)Clipping(剪贴纹理)Clock Synthesizer，时钟合成器pressed textures(压缩纹理) Concurrent Command Engine，协作命令引擎Center Processing Unit Utilization，中央处理器占用率DAC(Digitalto Analog Converter，数模传换器)Decal(印花法，用于生成一些半透明效果，如：鲜血飞溅的场面)DFP(Digital Flat Panel，数字式平面显示器)DFS：( Dynamic Flat Shading动态平面描影，可用作加速Dithering抖动)Directional Light，方向性光源DME：( Direct Memory Execute直接内存执行)DOF(Depth of Field，多重境深)Double Buffering(双缓冲区)DIR(Direct Rendering Infrastructure，基层直接渲染)DVI(Digital Video Interface，数字视频接口)DxR：( DynamicXTended Resolution动态可扩展分辨率)DXTC(Direct X Texture Compress，DirectX纹理压缩，以S3TC为根底)Dynamic Z-buffering(动态Z轴缓冲区)，显示物体远近，可用作远景E-DDC(Enhanced Display Data Channel，增强形视频数据通道协议，定义了显示输出与主系统之间的通讯通道，能提高显示输出的画面质量)Edge Anti-aliasing，边缘抗锯齿失真E-EDID(Enhanced Extended Identification Data，增强形扩充身份辨识数据，定义了电脑通讯视频主系统的数据格式)Execute Buffers，执行缓冲区environment mapped bump mapping(环境凹凸映射)Extended Burst Transactions，增强式突发处理Front Buffer，前置缓冲Flat(平面描影)Frames rate is King(帧数为王)FSAA(Full Scene Anti-aliasing，全景抗锯齿)Fog(雾化效果)flip double buffered(反转双缓存)fog table quality(雾化表画质)GART(Graphic Address Remappng Table，图形地址重绘表) Gouraud Shading，高洛德描影，也称为内插法均匀涂色GPU(Graphics Processing Unit，图形处理器)GTF(Generalized Timing Formula，一般程序时间，定义了产生画面所需要的时间，包括了诸如画面刷新率等)HAL(Hardware Abstraction Layer，硬件抽像化层)hardware motion pensation(硬件运动补偿)HDTV(high definition television，高清晰度电视)HEL： Hardware Emulation Layer(硬件模拟层)high triangle count(复杂三角形计数)ICD(Installable Client Driver，可安装客户端驱动程序) IDCT(Inverse Discrete Cosine Transform，非连续反余弦变换，GeForce的DVD硬件强化技术)Immediate Mode，直接模式IPPR： (Image Processing and Pattern Recognition图像处理和模式识别)large textures(大型纹理)LF(Linear Filtering，线性过滤，即双线性过滤)lighting(光源)lightmap(光线映射)Local Peripheral Bus(局域边缘总线)mipmapping(MIP映射)Modulate(调制混合)Motion Compensation，动态补偿motion blur(模糊移动)MPPS：(Million Pixels Per Second，百万个像素/秒)Multi-Resolution Mesh，多重分辨率组合Multi Threaded Bus Master，多重主控Multitexture(多重纹理)nerest Mipmap(邻近MIP映射，又叫点采样技术)Overdraw(透支，全景渲染造成的浪费)partial texture downloads(并行纹理传输)Parallel Processing Perspective Engine(平行透视处理器) PC(Perspective Correction，透视纠正)PGC(Parallel Graphics Configuration，并行图像设置)pixel(Picture element，图像元素，又称P像素，屏幕上的像素点)point light(一般点光源)Precise Pixel Interpolation，准确像素插值Procedural textures(可编程纹理)RAMDAC(Random Aess Memory Digital to Analog Converter，随机存储器数/模转换器)Reflection mapping(反射贴图)ender(着色或渲染)S端子(Seperate)S3(Sight、Sound、Speed，视频、音频、速度)S3TC(S3 Texture Compress，S3纹理压缩，仅支持S3显卡)S3TL(S3 Transformation & Lighting，S3多边形转换和光源处理)Screen Buffer(屏幕缓冲)SDTV(Standard Definition Television，标准清晰度电视)SEM(spherical environment mapping，球形环境映射)Shading，描影Single Pass Multi-Texturing，单通道多纹理SLI(Scanline Interleave，扫描线间插，3Dfx的双Voodoo 2配合技术)Smart Filter(智能过滤)soft shadows(柔和阴影)soft reflections(柔和反射)spot light(小型点光源)SRA(Symmetric Rendering Architecture，对称渲染架构)Stencil Buffers(模板缓冲)Stream Processor(流线处理)SuperScaler Rendering，超标量渲染TBFB(Tile Based Frame Buffer，碎片纹理帧缓存)texel(T像素，纹理上的像素点)Texture Fidelity(纹理真实性)texture swapping(纹理交换)T&L(Transform and Lighting，多边形转换与光源处理)T-Buffer(T缓冲，3dfx Voodoo4的特效，包括全景反锯齿Full-scene Anti-Aliasing、动态模糊Motion Blur、焦点模糊Depth of Field Blur、柔和阴影Soft Shadows、柔和反射Soft Reflections)TCA(Twin Cache Architecture，双缓存构造)Transparency(透明状效果)Transformation(三角形转换)Trilinear Filtering(三线性过滤)Texture Modes，材质模式TMIPM： (Trilinear MIP Mapping 三次线性MIP材质贴图)UMA(Unified Memory Architecture，统一内存架构)Visualize Geometry Engine，可视化几何引擎Vertex Lighting(顶点光源)Vertical Interpolation(垂直调变)VIP(Video Interface Port，视频接口)ViRGE： (Video and Rendering Graphics Engine视频描写图形引擎)Voxel(Volume pixels，立体像素，Novalogic的技术)VQTC(Vector-Quantization Texture Compression，向量纹理压缩)VSIS(Video Signal Standard，视频信号标准)v-sync(同步刷新)Z Buffer(Z缓存)ASIC： (Application Specific Integrated Circuit特殊应用积体电路)ASC(Auto-Sizing and Centering，自动调效屏幕尺寸和中心位置)ASC(Anti Static Coatings，防静电涂层)AGAS(Anti Glare Anti Static Coatings，防强光、防静电涂层)BLA： (Bearn Landing Area电子束落区)BMC(Black Matrix Screen，超黑矩阵屏幕)CRC： (Cyclical Redundancy Check循环冗余检查)CRT(Cathode Ray Tube，阴极射线管)DDC：(Display Data Channel，显示数据通道 )DEC(Direct Etching Coatings，外表蚀刻涂层)DFL(Dynamic Focus Lens，动态聚焦)DFS(Digital Flex Scan，数字伸缩扫描)DIC： (Digital Image Control数字图像控制)Digital Multiscan II(数字式智能多频追踪)DLP(digital Light Processing，数字光处理)DOSD：(Digital On Screen Display同屏数字化显示)DPMS(Display Power Management Signalling，显示能源管理信号)Dot Pitch(点距)DQL(Dynamic Quadrapole Lens，动态四极镜)DSP(Digital Signal Processing，数字信号处理)EFEAL(Extended Field Elliptical Aperture Lens，可扩展扫描椭圆孔镜头)FRC：(Frame Rate Control帧比率控制)HVD(High Voltage Differential，高分差动)LCD(liquid crystal display，液晶显示屏)LCOS： (Liquid Crystal On Silicon硅上液晶)LED(light emitting diode，光学二级管)L-SAGIC(Low Power-Small Aperture G1 wiht Impregnated Cathode，低电压光圈阴极管)LVD(Low Voltage Differential，低分差动)LVDS：(Low Voltage Differential Signal低电压差动信号) MALS(Multi Astigmatism Lens System，多重散光聚焦系统) MDA(Monochrome Adapter，单色设备)MS： (Magic Sensors磁场感应器)Porous Tungsten(活性钨)RSDS： (Reduced Swing Differential Signal小幅度摆动差动信号)SC(Screen Coatings，屏幕涂层)Single Ended(单终结)Shadow Mask(阴罩式)TDT(Timeing Detection Table，数据测定表)TICRG： (Tungsten Impregnated Cathode Ray Gun钨传输阴级射线枪)TFT(thin film transistor，薄膜晶体管)UCC(Ultra Clear Coatings，超清晰涂层)VAGP：( Variable Aperature Grille Pitch可变间距光栅) VBI：( Vertical Blanking Interval垂直空白间隙)VDT(Video Display Terminals，视频显示终端)VRR： (Vertical Refresh Rate垂直扫描频率 )ADIMM(advanced Dual In-line Memory Modules，高级双重内嵌式内存模块)AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡) AHA(Aelerated Hub Architecture，加速中心架构)ASK IR(Amplitude Shift Keyed Infra-Red，长波形可移动输入红外线)ATX： AT Extend(扩展型AT)BIOS(Basic Input/Output System，根本输入/输出系统)CSE(Configuration Space Enable，可分配空间)DB：(Device Bay，设备插架 )DMI(Desktop Management Interface，桌面管理接口)EB(Expansion Bus，扩展总线)EISA(Enhanced Industry Standard Architecture，增强形工业标准架构)EMI(Electromagic Interference，电磁干扰)ESCD(Extended System Configuration Data，可扩展系统配置数据)FBC(Frame Buffer Cache，帧缓冲缓存)FireWire(火线，即IEEE1394标准)FSB： (Front Side Bus，前置总线，即外部总线 )FWH( Firmware Hub，固件中心)GMCH(Graphics & Memory Controller Hub，图形和内存控制中心)GPIs(General Purpose Inputs，普通操作输入)ICH(Input/Output Controller Hub，输入/输出控制中心)IR(infrared ray，红外线)IrDA(infrared ray，红外线通信接口可进展局域网存取和文件共享)ISA：(Industry Standard Architecture，工业标准架构 )ISA(instruction set architecture，工业设置架构)MDC(Mobile Daughter Card，移动式子卡)MRH-R(Memory Repeater Hub，内存数据处理中心)MRH-S(SDRAM Repeater Hub，SDRAM数据处理中心)MTH(Memory Transfer Hub，内存转换中心)NGIO(Next Generation Input/Output，新一代输入/输出标准) P64H(64-bit PCI Controller Hub，64位PCI控制中心)PCB(printed circuit board，印刷电路板)PCBA(Printed Circuit Board Assembly，印刷电路板装配)PCI：(Peripheral Component Interconnect，互连外围设备 ) PCI SIG(Peripheral Component Interconnect Special Interest Group，互连外围设备专业组)POST(Power On Self Test，加电自测试)RNG(Random number Generator，随机数字发生器)RTC： (Real Time Clock 实时时钟)KBC(KeyBroad Control，键盘控制器)SAP(Sideband Address Port，边带寻址端口)SBA(Side Band Addressing，边带寻址)SMA： (Share Memory Architecture，共享内存构造 )STD(Suspend To Disk，磁盘唤醒)STR(Suspend To RAM，内存唤醒)SVR： (Switching Voltage Regulator 交换式电压调节)USB(Universal Serial Bus，通用串行总线)USDM(Unified System Diagnostic Manager，统一系统监测管理器)VID(Voltage Identification Definition，电压识别认证)VRM (Voltage Regulator Module，电压调整模块)ZIF： (Zero Insertion Force，零插力 )主板技术Gigabyte ACOPS：(Automatic CPU OverHeat Prevention SystemCPU 过热预防系统)SIV： (System Information Viewer系统信息观察)磐英ESDJ(Easy Setting Dual Jumper，简化CPU双重跳线法) 浩鑫UPT(USB、PANEL、LINK、TV-OUT四重接口)芯片组ACPI(Advanced Configuration and PowerInterface，先进设置和电源管理)AGP(Aelerated Graphics Port，图形加速接口)I/O(Input/Output，输入/输出)MIOC： (Memory and I/O Bridge Controller，内存和I/O桥控制器)NBC： (North Bridge Chip北桥芯片)PIIX： (PCI ISA/IDE Aelerator加速器)PSE36： (Page Size Extension 36-bit，36位页面尺寸扩展模式 )PXB：(PCI Expander Bridge，PCI增强桥 )RCG： (RAS/CAS Generator，RAS/CAS发生器 )SBC： (South Bridge Chip南桥芯片)SMB： (System Management Bus全系统管理总线)SPD(Serial Presence Detect，内存内部序号检测装置)SSB： (Super South Bridge，超级南桥芯片 )TDP：(Triton Data Path数据路径)TSC： (Triton System Controller系统控制器)QPA： (Quad Port Aeleration四接口加速)3DNow!(3D no waiting)ALU(Arithmetic Logic Unit，算术逻辑单元)AGU(Address Generation Units，地址产成单元)BGA(Ball Grid Array，球状矩阵排列)BHT(branch prediction table，分支预测表)BPU(Branch Processing Unit，分支处理单元)Brach Pediction(分支预测)CMOS： (Complementary Metal Oxide Semiconductor，互补金属氧化物半导体 )CISC(Complex Instruction Set Computing，复杂指令集计算机)CLK(Clock Cycle，时钟周期)COB(Cache on board，板上集成缓存)COD(Cache on Die，芯片内集成缓存)CPGA(Ceramic Pin Grid Array，陶瓷针型栅格阵列)CPU(Center Processing Unit，中央处理器)Data Forwarding(数据前送)Decode(指令解码)DIB(Dual Independent Bus，双独立总线)EC(Embedded Controller，嵌入式控制器)Embedded Chips(嵌入式)EPIC(explicitly parallel instruction code，并行指令代码) FADD(Floationg Point Addition，浮点加)FCPGA(Flip Chip Pin Grid Array，反转芯片针脚栅格阵列)FDIV(Floationg Point Divide，浮点除)FEMMS：(Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态)FFT(fast Fourier transform，快速热欧姆转换)FID(FID：Frequency identify，频率鉴别号码)FIFO(First Input First Output，先入先出队列)flip-chip(芯片反转)FLOP(Floating Point Operations Per Second，浮点操作/秒) FMUL(Floationg Point Multiplication，浮点乘)FPU(Float Point Unit，浮点运算单元)FSUB(Floationg Point Subtraction，浮点减)GVPP(Generic Visual Perception Processor，常规视觉处理器)HL-PBGA：外表黏著，高耐热、轻薄型塑胶球状矩阵封装IA(Intel Architecture，英特尔架构)ICU(Instruction Control Unit，指令控制单元)ID：(identify，鉴别号码 )IDF(Intel Developer Forum，英特尔开发者论坛)IEU(Integer Execution Units，整数执行单元)IMM：( Intel Mobile Module，英特尔移动模块 )Instructions Cache，指令缓存Instruction Coloring(指令分类)IPC(Instructions Per Clock Cycle，指令/时钟周期)ISA(instruction set architecture，指令集架构)KNI(Katmai New Instructions，Katmai新指令集，即SSE)Latency(潜伏期)LDT(Lightning Data Transport，闪电数据传输总线)Local Interconnect(局域互连)MESI(Modified， Exclusive， Shared， Invalid：修改、排除、共享、废弃)MMX(MultiMedia Extensions，多媒体扩展指令集)MMU(Multimedia Unit，多媒体单元)MFLOPS(Million Floationg Point/Second，每秒百万个浮点操作)MHz(Million Hertz，兆赫兹)MP(Multi-Processing，多重处理器架构)MPS(MultiProcessor Specification，多重处理器标准)MSRs(Model-Specific Registers，特别模块存放器)NAOC(no-aount OverClock，无效超频)NI：(Non-Intel，非英特尔 )OLGA(Organic Land Grid Array，基板栅格阵列)OoO(Out of Order，乱序执行)PGA： Pin-Grid Array(引脚网格阵列)，耗电大Post-RISC PR(Performance Rate，性能比率)PSN(Processor Serial numbers，处理器序列号)PIB(Processor In a Box，盒装处理器)PPGA(Plastic Pin Grid Array，塑胶针状矩阵封装)FP(Plastic Quad Flat Package，塑料方块平面封装)RAW(Read after Write，写后读)Register Contention(抢占存放器)Register Pressure(存放器缺乏)Register Renaming(存放器重命名)Remark(芯片频率重标识)Resource contention(资源冲突)Retirement(指令引退)RISC(Reduced Instruction Set Computing，精简指令集计算机)SEC：( Single Edge Connector，单边连接器 )Shallow-trench isolation(浅槽隔离)SIMD(Single Instruction Multiple Data，单指令多数据流) SiO2F(Fluorided Silicon Oxide，二氧氟化硅)SMI(System Management Interrupt，系统管理中断)SMM(System Management Mode，系统管理模式)SMP(Symmetric Multi-Processing，对称式多重处理架构)SOI： (Silicon-on-insulator，绝缘体硅片 )SONC(System on a chip，系统集成芯片)SPEC(System Performance Evaluation Corporation，系统性能评估测试)SQRT(Square Root Calculations，平方根计算)SSE(Streaming SIMD Extensions，单一指令多数据流扩展)Superscalar(超标量体系构造)TCP： Tape Carrier Package(薄膜封装)，发热小Throughput(吞吐量)TLB(Translate Look side Buffers，翻译旁视缓冲器)USWC(Uncacheabled Speculative Write Combination，无缓冲随机联合写操作)VALU(Vector Arithmetic Logic Unit，向量算术逻辑单元)VLIW(Very Long Instruction Word，超长指令字)VPU(Vector Permutate Unit，向量排列单元)VPU(vector processing units，向量处理单元，即处理MMX、SSE等SIMD指令的地方)。

3C（China Compulsory Certification，中国强制性产品认证制度）3D（Three Dimensional，三维）3DCG（3D computer graphics，三维计算机图形）3DNow！（3D no waiting，无须等待的3D处理）3DPA（3D Positional Audio，3D定位音频）3DS（3D SubSystem，三维子系统）3GIO（Third Generation Input/Output，第三代输入输出技术）AA（Accuview Antialiasing，高精度抗锯齿）AAC（Advanced Audio Compression，高级音频压缩）AAM（AMD Analyst Meeting，AMD分析家会议）AAM（Automatic Acoustic Management，自动机械声学管理）AAS（Automatic Area Segments）AA T（Average access time，平均存取时间）ABB（Advanced Boot Block，高级启动块）ABP（Address Bit Permuting，地址位序列改变）ABP（Advanced Branch Prediction，高级分支预测）ABS（Auto Balance System，自动平衡系统）A-Buffer（Accumulation Buffer，积聚缓冲）AC（Acoustic Edge，声学边缘）AC（Audio Codec，音频多媒体数字信号编解码器）AC-3（Audio Coding 3，第三代音响编码）AC97（Audio Codec 97，多媒体数字信号解编码器1997年标准）ACCP（Applied Computing Platform Providers，应用计算平台提供商）ACG（Aggressive Clock Gating，主动时钟选择）ACIRC（Advanced Cross Interleave Reed - Solomon Code，高级交叉插入里德所罗门代码）ACOPS（Automatic CPU OverHeat Prevention System（CPU过热预防系统）ACPI（Advanced Configuration and Power Interface，先进设置和电源管理）ACR（Advanced Communications Riser，高级通讯升级卡）ACS（Access Control Software，存取控制软件）ACT（Action，动作类游戏）AD（Analog to Digitalg，模拟到数字转换）ADC（Analog to Digital Converter，模数传换器）ADC（Apple Display Connector，苹果专用显示器接口）ADI（Adaptive De-Interlacing，自适应交错化技术）ADIMM（advanced Dual In-line Memory Modules，高级双重内嵌式内存模块）ADIP（Address In Pre-Groove，预凹槽寻址）ADSL（Asymmetric Digital Subscriber Line，不对称数字订阅线路）ADT（Advanced DRAM Technology，高级内存技术）AE（Atmospheric Effects，大气雾化效果）AE（Auto Focus，自动测光）AES-OCB（Advanced Encryption Standard-Operation Cipher Block，高级加密标准-操作密码块）AF（Auto Focus，自动对焦）AFC media（antiferromagnetically coupled media，反铁磁性耦合介质）AFC（Advanced Frame Capture、高级画面捕获）AFC（Amplitude-frequency characteristic，振幅频率特征）AFE（Analog Front End，模拟前置）AFM（Atomic Force Microscope，原子力显微镜）AFR（Alternate Frame Rendering，交替渲染技术）AG（Aperture Grills，栅条式金属板）AGBS（Advance GameBoy development System，高级GameBoy发展系统）AGC（Anti Glare Coatings，防眩光涂层）AGP（Accelerated Graphics Port，图形加速接口）AGPS（Assisted Global Positioning System，援助全球定位系统）AGTL+（Assisted Gunning Transceiver Logic，援助发射接收逻辑电路）AGU（Address Generation Units，地址产成单元）AH（Authentication Header，鉴定文件头）AHA（Accelerated Hub Architecture，加速中心架构）AI（Artificial Intelligence，人工智能）AIMM（AGP Inline Memory Module，AGP板上内存升级模块）AIS（Alternate Instruction Set，交替指令集）AL（Additive Latency，附加反应时间）AL（Artificial Life，人工生命）ALAT（advanced load table，高级载入表）ALDC（Adaptive Lossless Data Compression，适应无损数据压缩）ALU（Arithmetic Logic Unit，算术逻辑单元）Aluminum（铝）AM（Acoustic Management，声音管理）AMC（audio/modem codec，音频/调制解调器多媒体数字信号编解码器）AMR（Audio/Modem Riser，音效/调制解调器主板附加直立插卡）An isotropic Filtering（各向异性过滤）ANSI（American National Standards Institute，美国国立标准协会）AOI（Automatic Optical Inspection，自动光学检验）AOL（Alert On LAN，局域网警告）APC（Advanced Power Control，高级能源控制）API（Application Programming Interfaces，应用程序接口）APIC（Advanced Programmable Interrupt Controller，高级可编程中断控制器）APM（Advanced Power Management，高级能源管理）APPE（Advanced Packet Parsing Engine，增强形帧解析引擎）APS（Alternate Phase Shifting，交替相位跳转）APS（Audio Production Studio，音频生产工作室）APU（Audio Processing Unit，音频处理单元）APX（All Position eXpansion，全方位扩展）AR（Auto-Resume，自动恢复）ARC（Anti Reflect Coating，防反射涂层）ARF（Asynchronous Receive FIFO，异步接收先入先出）ARP（Address Resolution Protocol，地址解析协议）ARPG（Action Role Play Games，动作角色扮演游戏）ARR（Annual Return Rate，年返修率）ASB（Advanced System Buffering，高级系统缓冲）ASC（Advanced Size Check，高级尺寸检查）ASC（Anti Static Coatings，防静电涂层）ASC（Auto-Sizing and Centering，自动调效屏幕尺寸和中心位置）ASCI（The 10-year Accelerated Strategic Computing Initiative，领先10年战略加速计算机）ASCII（American Standard Code for Information Interchange，美国国家标准信息交换代码）ASD（Auto Stereoscopic Display，自动立体显示）ASF（Advanced Streaming Format，高级数据流格式）ASF（Alert Standards Forum，警告标准讨论）ASIC（Application Specific Integrated Circuit，特殊应用积体电路）ASIO（Audio Streaming Input and Output interface，音频流输入输出接口）ASK IR（Amplitude Shift Keyed Infra-Red，长波形可移动输入红外线）ASMO（Advanced Storage Magneto-Optical，增强形光学存储器）ASP（Active Server Pages，活动服务页）ASP（Application Service Provider，应用服务提供商）ASPI（Advanced SCSI Programming Interface，高级SCSI可编程接口）AST（amorphous-silicon TFT，非晶硅薄膜晶体管）AST（Average Seek time，平均寻道时间）AT（Advanced Technology，先进技术）ATA（Advanced Technology Attachment，高级技术附加装置）ATAPI（AT Attachment Packet Interface，AT扩展包接口）ATC（Access Time from Clock，时钟存取时间）ATC（Advanced Transfer Cache，高级转移缓存）ATD（Assembly Technology Development，装配技术发展）ATL（ActiveX Template Library，ActiveX模板库）ATM（Asynchronous Transfer Mode，异步传输模式）ATM（Automatic Teller Machine，自动提款机）ATOMM（Advanced super Thin-layer and high-Output Metal Media，增强形超薄高速金属媒体）ATP（Active to Precharge，激活到预充电）ATRAC（Adaptive TRansform Acoustic Coding，可适应转换声学译码）ATSC（Advanced Television Systems Committee，高级电视系统委员会）ATX（AT Extend，扩展型AT）AUD_EXT（Audio Extension，音频扩展）AUX（Auxiliary Input，辅助输入接口）A V（Analog Video，模拟视频）A V（Audio & Video，音频和视频）A VG（Adventure Genre，冒险类游戏）A VI（Audio Video Interleave，音频视频插入）B Splines（B样条）B.O.D.E（Body Object Design Envioment，人体/物体/设计/环境渲染自动识别）BAC（Bad Angle Case，边角损坏采样）Back Buffer（后置缓冲）Backface culling（隐面消除）BAD（Best Amiga Dominators）BASIC（Beginners All-purpose Symbolic Instruction Codec，初学者通用指令代码）Battle for Eyeballs（眼球大战）BBS（BIOS Boot Specification，基本输入/输出系统启动规范）BBUL（Bumpless Build-Up Layer，内建非凹凸层）BCF（Boot Catalog File，启动目录文件）BEDO（Burst Enhanced Data-Out RAM，突发型数据增强输出内存）Benchmarks（基准测试程序数值BGA（Ball Grid Array，球状网阵排列）BHT（branch prediction table，分支预测表）BIF（Boot Image File，启动映像文件）Bilinear Filtering（双线性过滤）BIOS（Basic Input/Output System，基本输入/输出系统）BLA（Bearn Landing Area，电子束落区）BLP（Bottom Leaded Package，底部导向封装）BMC（Black Matrix Screen，超黑矩阵屏幕）BMS（Blue Magic Slot，蓝色魔法槽）BOD（Bandwidth On Demand，弹性带宽运用）BOPS（Billion Operations Per Second，十亿次运算/秒）BP（Brach Prediction，分支预测）BPA（Bit Packing Architecture，位封包架构）BPI（Bit Per Inch，位/英寸）bps（bit per second，位/秒）bps（byte per second，字节/秒）BPU（Branch Processing Unit，分支处理单元）BRC（Beta Release Candidate，测试发布候选版）BSD（Berkeley Software Distribution，伯克利软件分配代号）BSP（Binary Space Partitioning，二进制空间分区）BSP（Boot Strap Processor，启动捆绑处理器）BSRAM（Burst pipelined synchronous static RAM，突发式管道同步静态存储器）BTAC（Branch Target Address Calculator，分支目标寻址计算器）BTO（Build-To-Order，按序构建）BURN-Proof（Buffer UnderRuN-Proof，防止缓冲区溢出）C.O.P（CPU overheating protection，处理器过热保护）C2C（card-to-card interleaving，卡到卡交错存取CAD（computer-aided design，计算机辅助设计）CAM（Common Access Model，公共存取模型）CAM（Computer-aided manufacturing，计算机辅助制造）CAS（Column Address Strobe，列地址控制器）CA V（Constant Angular Velocity，恒定角速度）CBDS（Continuous Background Defect Scanning，连续后台错误扫描）CBF（Cable Broadband Forum，电缆宽带论坛）CBGA（Ceramic Ball Grid Array，陶瓷球状网阵排列）CBMC（Crossbar based memory controller，内存控制交叉装置）CBR（Committed Burst Rate，约定突发速率）CBR（Constant Bit Rate，固定比特率）CBU（color blending unit，色彩混和单位）CCD（Charge Coupled Device，电荷连接设备）CCIRN（Coordinating Committee for Intercontinental Research Networking，洲际研究网络协调委员会）CCM（Call Control Manager，拨号控制管理）cc-NUMA（cache-coherent non uniform memory access，连贯缓冲非统一内存寻址）CCS（Cross Capacitance Sensing，交叉电容感应）CCS（Cut Change System）CCT（Clock Cycle Time，时钟周期）CD（Compact Disc）cd/m^2（candela/平方米，亮度的单位）CDIP（Ceramic Dual-In-Line，陶瓷双重直线）CDPD（Cellular digital Packet data，细胞数字信息包数据）CDR（CD Recordable，可记录光盘）CDRAM（Cache DRAM，附加缓存型DRAM）CD-ROM/XA（CD-ROM eXtended Architecture，唯读光盘增强形架构）CDRS（Curved Directional Reflection Screen，曲线方向反射屏幕）CDRW（CD-Rewritable，可重复刻录光盘）CDSL（Consumer Digital Subscriber Line（消费者数字订阅线路）CE（Consumer Electronics，消费电子）CEA（Consumer Electronics Association，消费者电子协会）CEA（Critical Edge Angles，临界边角）CEM（cube environment mapping，立方环境映射）CEMA（Consumer Electronics Manufacturing Association，消费者电子制造业协会）Center Processing Unit Utilization，中央处理器占用率CEO（Chief Executive Officer，首席执行官）CF（CompactFlash Card，紧凑型闪存卡）CFM（cubic feet per minute，立方英尺/秒）CG（C for Graphics/GPU，用于图形/GPU的可编程语言）CG（Computer Graphics，计算机动画）CGI（Common Gateway Interface，通用网关接口）CG-Silicon（Continuous Grain Silicon，连续微粒硅）CHRP（Common Hardware Reference Platform，共用硬件平台）CHS（Cylinders、Heads、Sectors，柱面、磁头、扇区）CIEA（Commercial Internet Exchange Association，商业因特网交易协会）CIR（Committed Information Rate，约定信息速率）CIS（Contact Image Sensors，接触图像传感器）CISC（Complex Instruction Set Computing，复杂指令集计算机）CL（CAS Latency，CAS反应时间）Clipping（剪贴纹理）CLK（Clock Cycle，时钟周期）Clock Synthesizer，时钟合成器CLV（Constant Linear Velocity，恒定线速度）CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）CMOV（conditional move instruction，条件移动指令）CMP（on-chip multiprocessor，片内多重处理）CMR（Colossal Magneto Resistive，巨磁阻抗）CMS（Code Morphing Software，代码变形软件）CMSS（Creative Multi Speaker Surround，创新多音箱环绕）CMT（course-grained multithreading，过程消除多线程）CNPS（Computer Noise Prevention System，计算机噪音预防系统）CNR（Communication and Networking Riser，通讯和网络升级卡）CNT（carbon nano-tube，碳微管）COAST（Cache-on-a-stick，条状缓存）COB（Cache on board，板上集成缓存）co-CPU（cooperative CPU，协处理器）COD（Cache on Die，芯片内核集成缓存）COM（Component Object Model，组件对象模式）COMDEX（Computer Distribution Exposition，计算机代理分销业展览会）compressed textures（压缩纹理）Concurrent Command Engine，协作命令引擎COO（Chief Organizer Officer，首席管理官）Copper（铜）CP（command processor，指令处理器）CPA（Close Page Auto recharge，接近页自动预充电）CPE（Customer Premise Equipment，用户预定设备）CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列）CPI（count per inch，每英寸计数）CPI（cycles per instruction，周期/指令）CPLD（Complex Programmable Logic Device，复杂可程序化逻辑组件）CPRM（Content Protection for record able media，记录媒体内容保护）CPS（Certification Practice Statement，使用证明书）CPU（Center Processing Unit，中央处理器）CRC（Cyclical Redundancy Check，循环冗余检查）CRM（Customer Relationship Management，顾客关系管理）CRT（Cathode Ray Tube，阴极射线管）CRT（Cooperative Redundant Threads，协同多余线程）CS（Channel Separation，声道分离）CSA（Canadian Standards Association，加拿大标准协会）CSA（Communication Streaming Architecture，通讯流架构）CSC（Colorspace Conversion，色彩空间转换）CSD（Circuit Switched Data，电路切换数据通话）CSE（Configuration Space Enable，可分配空间）CSG（constructive solid geometry，建设立体几何）CSP（Chip Scale Package，芯片比例封装）CSP（Chip Size Package，芯片尺寸封装）CSS（Cascading Style Sheets，层叠格式表）CSS（Common Command Set，通用指令集）CSS（Content Scrambling System，内容不规则加密）CTI（Computer Telephone Integration，计算机电话综合技术）CTO（Chief Technology Officer，首席技术官）CTR（CAS to RAS，列地址到行地址延迟时间）CTS（Carpal Tunnel Syndrome，计算机腕管综合症）CTS（Clear to Send，清除发送）CVS（Compute Visual Syndrome，计算机视觉综合症）CXT（Chooper eXTend，增强形K6-2内核）DA（Digital to Analog，数字到模拟转换）DAB（digital audio broadcast，数字音频广播）DAC（Digital to Analog Converter，数模转换器）DAC（Dual Address Cycle，双重地址周期）DAE（digital Audio Extraction，数据音频抓取）DAN（Dance，跳舞类游戏）DAO（Disc At Once，整盘刻录）DAO-RAW（Disc At Once Read after Write，整盘刻录-写后读）DASP（Dynamic Adaptive Speculative Pre-Processor，动态适应预测预处理器）Data Forwarding（数据前送）dB（decibel，分贝）DB（Deep Buffer，深度缓冲）DB（Device Bay，设备插架）DBBS（Dynamic Bass Boost System，动态低音增强系统）DBI（dynamic bus inversion，动态总线倒置）DBS（Direct Broadcast Satellite，直接卫星广播）DBS-PC（Direct Broadcast Satellite PC，人造卫星直接广播式PC）DC（Digital Camera，数码相机）DC（Dreamcast，世嘉64位游戏机）DCA（Defense Communication Agency，国防部通信局）DCC（Digital Compact Cassette，数字盒式磁带）DCC（Digital Content Creation，数字内容创造）DCD（Directional Corelational De-interlacing，方向关联解交错）DCD（Document Content Description for XML，XML文件内容描述）DCE（Data Circuit Terminal Equipment，数据通信设备）DCLK（Dot Clock，点时钟）DCOM（Distributing Component Object Model，构造物体模块）DCT（Display Compression Technology，显示压缩技术）DCT（DRAM Controller，DRAM控制器）DD（Double Side，双面内存）DDBGA（Die Dimension Ball Grid Array，内核密度球状矩阵排列）DDC（Display Data Channel，显示数据通道）DDC（Dynamic Depth Cueing，动态深度暗示）图像DDE（dynamic data exchange，动态数据交换）DDMA（Distributed DMA，分布式DMA）DDP（Digital Display Port，数字输出端口）DDR SDRAM（Double Date Rate，上下行双数据率SDRAM）DDR（Double Date Rate，上下行双数据率）DDS（Direct Draw Surface，直接绘画表面）DDSS II（Double Dynamic Suspension System II，第二代双层动力悬吊系统）DDSS（Dolby Digital Surround Sound，杜比数字环绕声）DDSS（Double Dynamic Suspension System，双悬浮动态减震系统）DDT（Dynamic Deferred Transaction，动态延期处理）DDWG（Digital Display Working Group，数字化显示工作组）DEC（Direct Etching Coatings，表面蚀刻涂层）Decal（印花法）Decode（指令解码）Deflection Coil（偏转线圈）DES（ata Encryption Standard，数据加密标准）DFL（Dynamic Focus Lens，动态聚焦）DFP（Digital Flat Panel，数字平面显示标准）DFPG（Digital Flat Panel Group，数字平面显示标准工作组）DFS（Digital Flex Scan，数字伸缩扫描）DFS（Dynamic Flat Shading，动态平面描影）DHCP（Dynamic Host Configuration Protocol，动态主机分配协议）DHHF（Dual Head - High Fidelity，高精度第四代双头）DHT（Dolby Headphone Technology，杜比耳机技术）DIB（Dual Independent Bus，双重独立总线）DIC（Digital Image Control，数字图像控制）DID（Device ID，设备ID）Digital Multiscan II（数字式智能多频追踪）DIL（dual-in-line）DIMM（Dual In-line Memory Modules，双重内嵌式内存模块）Directional Light（方向性光源）DiscWizard（磁盘控制软件）DIT（Disk Inspection Test，磁盘检查测试）Dithering（抖动）DIV A（Data IntensiVe Architecture，数据加强架构）DIY（Do it Yourself，自己装机）DLL（Delay-Locked Loop，延时锁定循环电路）dll（dynamic link library，动态链接库）DLP（digital Light Processing，数字光处理）DLS（Downloadable Sounds Level，可下载音色）DLS-2（Downloadable Sounds Level 2，第二代可下载音色）DM（Displacement mapping，位移贴图）DMA（Direct Memory Access，直接内存存取）DMAC（Direct Memory Access Controller，直接内存存取控制器）DME（Direct Memory Execute，直接内存执行）DMF（Distribution Media Format）DMI（Desktop Management Interface，桌面管理接口）DMT（Discreet Monitor Timing，智能型显示器调速）DMT（Discrete Multi - Tone，不连续多基频模式）DMT（Dynamic Multithreading Architecture，动态多线程结构）DNA（Distributed Internet Application，分布式因特网应用程序）DNS（Domain Name System，域名解析系统）DOA2 HC（Deal or Live 2 hardcore，生与死2完整版）DOC（Disk On Chip，芯片磁盘）DOCSIS（Data Over Cable Service Interface Specifications，线缆服务接口数据规格）DOF（Depth of Field，多重境深）DOJ（Department of Justice，反不正当竞争部门）DOM（Document Object Model，文档目标模型）DoS（Denial of Service，拒绝服务）DOS（Disk Operating System，磁盘操作系统）DOSD（Digital On Screen Display，同屏数字化显示）Dot Pitch（点距）dot texture blending（点型纹理混和）DOT（Dynamic Overcooking Technology，动态超频技术）DOT3（Dot product 3 bump mapping，点乘积凹凸映射）Double Buffering（双缓冲区）DP（Dual Processor，双处理器）DPBM（Dot Product Bump Mapping，点乘积凹凸映射）DPC（Desktop PC，桌面PC）dpi（dot per inch，每英寸的打印像素）DPMS（Display Power Management Signaling，显示能源管理信号）DPP（Direct print Protocol，直接打印协议DQL（Dynamic Quadra pole Lens，动态四极镜）DQS（Bidirectional data strobe，双向数据滤波）DQUICK（DVD Qualification and Integration Kit，DVD资格和综合工具包）DRA（deferred rendering architecture，延迟渲染架构）DRAM（Dynamic Random Access Memory，动态随机存储器）DRCG（Direct Rambus Clock Generator，直接Rambus时钟发生器）DRDRAM（Direct RAMBUS DRAM，直接内存总线DRAM）DRF（Digital radio frequency，数字无线电频率）DRI（Direct Rendering Infrastructure，基层直接渲染）DRM（Digital rights management，数字版权保护）DRSL（Differential Rambus Signaling Level，微分RAMBUS信号级）DRSL（Direct Rambus Signaling Level，直接RAMBUS信号级）DS3D（DirectSound 3D Streams）DSD（Direct Stream Digital，直接数字信号流）DSL（Data Strobe Link，数据选通连接DSL（Down Loadable Sample，可下载的取样音色）DSM（Dedicated Stack Manager，专门堆栈管理）DSM（Distributed shared memory，分布式共享内存）DSMT（Dynamic Simultaneous Multithreading，动态同步多线程）DSO（Dynamic Sound-stage Organizer，动态声音层组建）DSP（Delivery Service Partner，交付服务合伙人）DSP（Digital Signal Processing，数字信号处理）DSP（Digital Sound Field Processing，数字音场处理）DSP（Dual Streams Processor，双重流处理器）DST（Depleted Substrate Transistor，衰竭型底层晶体管）DST（Drive Self Test，磁盘自检程序）DSTN（Double layers Super Twisted Nematic，双层超扭曲向列，无源矩阵LCD）DSVD（Digital Simultaneous V oice and Data）DTD（Document Type Definition，文件类型定义）DTE（Data Terminal Equipment，数据终端设备）DTL（Developer Tool，发展工具包）DTR（Disk Transfer Rate，磁盘传输率）DTS（Digital Theater System，数字剧院系统）DTT（DeskTop Theater，桌面剧院）DTV（Digital TV，数字电视）DTV（Dual Threshold V oltage，双重极限电压）DTXS（Decryption Transform for XML Signature，XML签名解密转换）DUN（Dial-Up Networking，拨号网络）DUV（Deep Ultra-Violet，纵深紫外光）DV（Digital Vidicon，数码摄录机）DVB（Digital Video Broadcasting，数字视频广播DVC（Digital Vibrance Control，数字振动控制）DVD（Digital Video/Versatile Disk，数字视频/万能光盘）DVD-R（DVD Recordable，可记录DVD盘）DVD-RAM（Digital Video/Versatile Disk - Random Access Memory，随机存储数字视频/万能光盘）DVD-RW（DVD Rewritable，可重复刻录DVD盘）DVFM（Dynamic V oltage and Frequency Management，动态电压和频率管理）DVI（Digital Video Interface，数字视频接口）DVI（Digital Visual Interface，数字化视像接口）DVMT（Dynamic Video Memory Technology，动态视频内存技术）DWDM（Dense WaveLength Division Multiplex，波长密集型复用技术）DxR（DynamicXTended Resolution，动态可扩展分辨率）DXTC（Direct X Texture Compress，DirectX纹理压缩）Dynamic Z-buffering（动态Z轴缓冲区）E（Economy，经济，或Entry-level，入门级）E3（Electronic Entertainment Expo，电子娱乐展览会）EAP（Extensible Authentication Protocol，扩展证明协议）EAX（Environmental Audio Extensions，环境音效扩展技术）EB（Expansion Bus，扩展总线）EBGA（Enhanced Ball Grid Array，增强形球状网阵排列）EBL（electron beam lithography，电子束平版印刷）EBR（Excess Burst Rate，超额突发速率）EC（Early Childhood，学龄前儿童）EC（Embedded Controller，嵌入式控制器）ECC（Elliptic Curve Crypto，椭圆曲线加密）ECC（Error Checking and Correction，错误检查修正）ECD（Electro Chromic Display，电铬显示器）ECP（Extended Capabilities Port，延长能力端口）ED（Execution driven，执行驱动）EDA（Electronic Design Automatic，电子设计自动化）E-DDC（Enhanced Display Data Channel，增强形视频数据通道协议）EDEC（Early Decode，早期解码）Edge Anti-aliasing（边缘抗锯齿失真）EDO（Enhanced Data-Out RAM，数据增强输出内存）EE（Emotion Engine，情感引擎）E-EDID（Enhanced Extended Identification Data，增强形扩充身份辨识数据）EEPROM（Electrically Erasable Programmable ROM，电擦写可编程只读存储器）eFB（embedded Frame Buffer，嵌入式帧缓冲）EFEAL（Extended Field Elliptical Aperture Lens，可扩展扫描椭圆孔镜头）EFF（Electronic Frontier Foundation（电子前线基金会）EFI（Extensible Firmware Interface，扩展固件接口）EFM（Eight to Fourteen Modulation，8位信号转换为14位信号）EFU（Elemntary Functional Unit，增强功能单元）EHCI（Enhanced Host Controller Interface，加强型主机端控制接口）EHSDRAM（Enhanced High Speed DRAM，增强型超高速内存）EIDE（enhanced Integrated Drive Electronics，增强形电子集成驱动器）EISA（Enhanced Industry Standard Architecture，增强形工业标准架构）EL DDR（Enhanced Latency DDR，增强反应周期DDR内存）Embedded Chips（嵌入式）EMBM（environment mapped bump mapping，环境凹凸映射）Embosing（浮雕）EMC（Electron Magnetic Compatibility，电磁兼容）EMF（Electron Magnetic Field，电磁场）EMI（Electromagnetic Interference，电磁干扰）EMP（Emergency Management Port，紧急事件管理端口）EMS（Enhanced Memory System，增强内存系统）EMS（Enhanced Message Service，扩展型信息服务）EMS（Expanded Memory Specification，扩充内存规格）EOL（End of Life，最终完成产品）EOS（eBookMan Operating System，电子书操作系统）EPA（edge pin array，边缘针脚阵列）EPA（Environmental Protection Agency，美国环境保护局）EPF（Embedded Processor Forum，嵌入式处理器论坛）EPIC（explicitly parallel instruction code，并行指令代码）EPL（electron projection lithography，电子发射平版印刷）EPM（Enhanced Power Management，增强形能源管理）EPM（enterprise project manage）EPOC（Electronic Piece of Cheese，小型电子块）EPOC（Elevated Package Over CSP，CSP架空封装）EPP（Enhanced Parallel Port，增强形平行接口）EPROM（erasable，programmable ROM，可擦写可编程ROM）EPV（Extended Voltage Protection，扩展电压保护）ERD（Emergency Repair Disk，应急修理磁盘）ERP（Enterprise Requirement Planning，企业需求计划）ERP（Enterprise Resource Planning，企业资源计划）ERP（estimated retail price，估计零售价）ES（Energy Star，能源之星）ES（Engineering Sample，工程样品）eSA TA（External Serial ATA，扩展型串行A TA）ESCD（Extended System Configuration Data，可扩展系统配置数据）ESD（electro-static discharge，静电释放）ESDJ（Easy Setting Dual Jumper，简化CPU双重跳线法）ESDRAM（Enhanced SDRAM，增强型SDRAM）ESER（EAC Secure Extract Ripping，EAC安全抓取复制）ESP（Electronic-Shock Protection，电子抗震系统）ESP（Embedded System Platform，嵌入式系统平台）ESP（Encapsulating Security Payload，压缩安全有效载荷）ESR（Equivalent Series Resistance，等价系列电阻）ESRAM（Enhanced SRAM，增强型SRAM）eTM（embedded Texture Buffer，嵌入式纹理缓冲）ETRI（Electronics and Telecommunications Research Institute，电子和电信研究协会）EULA（End-User License Agreement，最终用户释放协议）EUV（Extreme Ultra Violet，紫外光）EUV（extreme ultraviolet lithography，极端紫外平版印刷）EVF（Electronic Viewfinder，电子取景窗）E-WDM（Enhanced Windows Driver Model，增强型视窗驱动程序模块）Execute Buffers（执行缓冲区）Extended Burst Transactions（增强式突发处理）Extended Stereo（扩展式立体声）Factor Alpha Blending（因子阿尔法混合）FADD（Floationg Point Addition，浮点加）FAQ（Frequently Asked Questions，常见问题回答）Fast Z-clear（快速Z缓冲清除）FAT（File Allocation Tables，文件分配表）FB（fragment buffer，片段缓冲）FBC（Frame Buffer Cache，帧缓冲缓存）FBGA（Fine-Pitch Ball Grid Array，精细倾斜球状网阵排列）FBGA（flipchip BGA，轻型芯片BGA）F-Buffer（Fragment Stream FIFO Buffer，片段流先入先出缓冲区）FC（Famicom，任天堂8位游戏机）FC（Fibre Channel，光纤通道）FC-BGA（Flip-Chip Ball Grid Array，反转芯片球形栅格阵列）FCC（Federal Communications Commission，联邦通信委员会）FC-PGA（Flip-Chip Pin Grid Array，反转芯片针脚栅格阵列）FCRAM（Fast Cycle RAM，快周期随机存储器）FDB（Fluid Dynamic Bearing，非固定动态轴承）FDB（fluid-dynamic bearings，动态轴承）FDBM（Fluid dynamic bearing motors，液态轴承马达）FDC（Floppy Disk Controller，软盘驱动器控制装置）FDD（Floppy Disk Driver，软盘驱动器）FDIV（Floationg Point Divide，浮点除）FDM（Frequency Division Multi，频率分离）FED（Field Emission Displays，电场显示器）FEMMA（Foldable Electronic Memory Module Assembly，折叠电子内存模块装配）FEMMS（Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态FFB（Force Feed Back，力反馈）FFJ（Force Feedback Joystick，力量反馈式操纵杆）FFT（fast Fourier transform，快速热欧姆转换）FGM（Fine-Grained Multithreading，高级多线程）FID（FID（Frequency identify，频率鉴别号码）FIFO（First Input First Output，先入先出队列）FIR（finite impulse response，有限推进响应）FireWire（火线，即IEEE1394标准）FISC（Fast Instruction Set Computer，快速指令集计算机）FL（fragment list，片段列表）FL（Function Lookup，功能查找）Flat（平面描影）FlexATX（Flexibility ATX，可扩展性A TX）flip double buffered（反转双缓存）flip-chip（芯片反转）FLIR（Forward Looking Infra-Red，前视红外）FLOPs（Floating Point Operations Per Second，浮点操作/秒）Flow-control（流控制）FLS（Front Light Screen，前发光屏幕）Flyback Transformer（回转变压器）FM（Flash Memory，快闪存储器）FM（Frequency Modulation，频率调制）FMA（full-motion animated backdrops）FMAC（Floating-Point Multiply-Accumulators，浮点累积乘单元）FMC（Frictionless Memory Control，无阻内存控制）FMD ROM（Fluorescent Material Read Only Memory，荧光质只读存储器）FMT（fine-grained multithreading，纯消除多线程）FMUL（Floationg Point Multiplication，浮点乘）Fog table quality（雾化表画质）Fog（雾化效果）FPD（flat panel display，平面显示器）FPM（Fast Page Mode，快页模式内存）FPRs（floating-point registers，浮点寄存器）FPS（First Person Shooters，第一人称射击游戏）FPS（FourPointSurround，创新的四点环绕扬声器系统）fps（frames per second，帧/秒）FPU（Float Point Unit，浮点运算单元）FR（Frames Rate，游戏运行帧数）FR（Frequence Response，频率响应）Frames rate is King（帧数为王）FRC（Frame Rate Control，帧比率控制）FRICC（Federal Research Internet Coordinating Committee，联邦调查因特网协调委员会）FRJS（Fully Random Jittered Super-Sampling，完全随机移动式超级采样）Front Buffer（前置缓冲）FSAA（Full Scene/Screen Anti-aliasing，全景/屏幕抗锯齿）FSB（Front Side Bus，前端总线）FSE（Frequency Shifter Effect，频率转换效果）FSR（force sensor resistance，动力感应电阻）FSTN（Film compensated Super Twisted liquid crystal，带补偿膜超扭曲相列）FSUB（Floationg Point Subtraction，浮点减）FTC（Federal Trade Commission，联邦商业委员会）FTG（Fighting Game，格斗类游戏）FTP（File Transfer Protocol，文件传输协议）Fur（软毛效果）FW（Fast Write，快写，AGP总线的特殊功能）FWH（Firmware Hub，固件中心）GART（Graphic Address Remappng Table，图形地址重绘表）GB（Game Boy，任天堂4位手提游戏机）GB（Garibaldi架构，Garibaldi基于ATX架构，但是也能够使用WTX构架的机箱）GBA（Game Boy Advanced，任天堂增强型手提游戏机）GBC（Game Boy Color，任天堂手提16色游戏机）GBL（GameBoy Light，GB夜光型）GBP（GameBoy Pocket，GB口袋型）GDC（Game Developer Conference，游戏发展商会议）GDI（Graphics Device Interface，图形设备接口）GFD（Gold finger Device，金手指超频设备）GG（Game Gear，世嘉彩色手提游戏机）GHC（Global History Counter，通用历史计数器）Ghost（（General Hardware Oriented System Transfer，全面硬件导向系统转移）GI（Global Illumination，球形光照）GIC（Gold Immersion Coating，化金涂布技术）GIF（Graphics Interchange Format，图像交换格式）GIF（Graphics Interface unit，图形接口单元）GLV（grating-light-valve，光栅亮度阀）GM（General Midi，普通MIDI）GM（Glass Mould，玻璃铸制）GMCH（Graphics & Memory Controller Hub，图形和内存控制中心）GMR（giant magnetoresistive，巨型磁阻）Gouraud Shading，高洛德描影，也称为内插法均匀涂色GPA（Graphics Performance Accelerator，图形性能加速卡）GPF（General protect fault，一般保护性错误）GPIs（General Purpose Inputs，普通操作输入）GPL（GNU Public License，GNU公众授权）GPRS（General Packet Raice，整合封包无线服务）GPRs（General Purpose Registers，通用寄存器）GPS（Global Positioning System，全球定位系统）GPT（Graphics Performance Toolkit，图形性能工具包）GPU（Graphics Processing Unit，图形处理器）GS（Graphic Synthesizer，图形合成器）GSM（Galvanization Superconductive Material，电镀锌超导材料）GTF（General Timing Formula，普通调速方程式）GTL（Gunning Transceiver Logic，发射接收逻辑电路）GTS（Giga Textel Sharder，十亿像素填充率）Guard Band Support（支持保护带）GUI（Graphics User Interface，图形用户界面）GVPP（Generic Visual Perception Processor，常规视觉处理器）GWS（graphics workstations，图形工作站）HAL（Hardware Abstraction Layer，硬件抽像化层）HCF（Host Controller，主体控制处理）HCI（Host Controller Interface，主机控制接口HCL（Hardware Compatibility List，硬件兼容性列表）HCRP（Hardcopy Cable Replacement Profile，硬复制电缆复位协议子集）HCT（Hardware Compatibility Test，硬件兼容性测试HDA（Head Disk Assembly，头盘组件）HDA（high-efficiency Audax High Definition Aerogel，高效高清楚气动）HDIT（High Bandwidth Differential Interconnect Technology，高带宽微分互连技术）HDMI（High Definition Multimedia Interface，高精度多媒体接口）HDR（High Dynamic Range，高级动态范围）HDRL（high dynamic-range lighting，高动态范围光线）HDSL（High bit rate DSL，高比特率数字订阅线路）HDSS（Holographic Data Storage System，全息数据存储系统）HDTV（high definition television，高清晰度电视）HDVP（High-Definition Video Processor，高精度视频处理器）HE（Home Edition，家庭版）HEL（Hardware Emulation Layer（硬件模拟层）HID（Human Interface Device，人机对话接口设备）Hierarchical Z（Z分级）HiFD（high-capacity floppy disk，高容量软盘）Hi-fi（high fidelity，高精度设备）high triangle count（复杂三角形计数）HLL（high level language，高级语言）HLLCA（High-Level Language Computing Architecture，高级语言计算架构）HL-PBGA（表面黏著，高耐热、轻薄型塑胶球状网阵封装HLSL（High Level Shading Language，高级描影语言）HMC（hardware motion compensation，硬件运动补偿）HMC（holographic media card，全息媒体卡）HMD（holographic media disk，全息媒体磁盘）Home PNA（Home Private Network Adapter，家庭私人网络适配器）HOS（Higher-Order Surfaces，高次序表面）HPC（Hand held PC，手持电脑设备）HPDR（High-Precision Dynamic-Range，高精度动态范围）HPF（High-Pass Filter，高通滤波器）HPNA（home phoneline networking，家庭电话线网络）HPS（High Performance Server，高性能服务器）HPTC（high performance technical computing，高性能技术运算）HPW（High Performance Workstation，高性能工作站）HRAA（High Resolution Anti-aliasing，高分辨率抗锯齿）HRTF（Head Related Transfer Function，头部关联传输功能）HSCSD（High-Speed Circuit-Switched Data，高速巡回开关数据）HSDRAM（High Speed DRAM，超高速内存）HSF（Host Signal，主体信号处理）HSI（High Speed Interconnect，高速内连）HSLB（High Speed Link Bus，高速链路总线）HSP（Host Signal Processing，主体信号处理）HSR（Hidden Surface Removal，隐藏表面移除）HT（Hyper Transport，超级传输）HTA（Hypertext Application，超文本应用程序）HTML（Hypertext Markup Language，超文本标记语言）HTP（Hyper Texel Pipeline，超级像素管道）HTT（Hyper Threading Technology，超级线程技术）HTTC（Hyper Transport Technology Consortium，Hyper Transport技术协会）。

1Entry roller table (2)2Entry side guide (4)3Slab sizing press (7)3.1Base plates (9)3.2Press housing (10)3.3Mechanical adjustment system (12)3.4Sizing sled (14)3.5Eccentric shaft unit (16)3.6Tool sled (18)3.7Pinch roll unit (20)3.8Guide roller unit (23)3.9Main gear units (25)3.10Drive parts (62)3.11Main universal shafts (28)3.12Special grease system (Hydrostatic) (29)3.13Machinery piping slab sizing press (30)3.14Maintenance platform (31)3.15Pressing tool changing device (32)4Exit roller table (33)5Roughing mill approach roller table (35)1 Entry roller table2010 ArrangementThe roller table is located in front of the SSPFunctionThe roller table is capable of transferring the slabs through the sizing press either continuously during the slab approach to and the backward transport from as well as stepwise in operation of the press.The table will be designed for accommodating the entry side guide.Technical dataQuantity 1 unitType individually direct driven rollersRoller type solid rollers, roller barrel water cooled Table length approx. 11 640 mmRoller spacing 11 x 960 + 1 x 1 080mmNumber of rollers 13Roller diameter 450 mmBarrel length 2 050 mmRoller speed max. ± 2.2 m/sMotor dataRated power 16.5 kWSpeed 0 – 94 min-1 LRDescriptionRoller Type solid rollersRoll drive driven via one electrical motor per roller Roller bearings self-aligning roller bearingsBearing houses single-part design, cast steel or steel,fixed on table framesTable frames fabricated steel sectionsFixed side guides fabricated steel sections,attached to the roller table frame Aprons fabricated steel, grid type Crossbeams fabricated steelDrive shafts gear type couplingMotor bases fabricated steelPiping for- centralized grease lubrication of theroller bearings- roller barrel cooling by means of spraypipes2 Entry side guide2020 ArrangementThe entry side guide is located in front of SSPFunctionFor centering and measuring of the slab before entering the SSP.The side guides will be located in the area of the entry roller table and will be driven from one side by two hydraulic cylinders which are connected to the top carrier beams.They consist of a parallel centering section, which is attached to four carrier beams. The carrier beam pairs on drive and operator side are arranged above each other and synchronized via gear and tooth racks, the entry and exit side can be adjusted independently (for adjusting and measuring of transition slabs) and are synchronized via electrical controls. The carrier beams are supported via slide ways in the hous-ings on either side of the roller table.Thrust guides are arranged between the roller table frames and the side guides are equipped with bolted-on wear linersTechnical dataQuantity 1 unitGuides operate opening min. 800 mmmax. 2 100 mmShifting speed 100 mm/s on each sideLength of guides approx. 6 000 mmQuantity of cylinders 2Centering force approx. 600 kNCylinder dimensions Ø 140/100 x 800 mmHydraulic pressure 250 barDescriptionSide guides heavy fabricated steel constructionWear liners steel, bolted to the side guidesCarrier beams fabricated steel sections with bolted ontooth racks, gear racks quenched andtemperedHousings fabricated steel with incorporated bronzeliners for guiding of the carrier beams, lo-cated outside the roller table, housings ar-ranged on base frames, bearing blocks forsupporting the gear attached to the hous-ingsDrive actuated by 2 hydraulic cylinders, mount-ed onto the housings,Position control by position transducers installed in eachcylinder (please refer to M&C list)Piping for- centralized grease lubrication of thesliding liners & tooth racks- hydraulic cylinderReference DrawingGeneral arrangementSectional view3 Slab sizing pressArrangement and functionThe slab sizing press will be located between the roughing mill descaler and the roughing mill stand R1, for heavy width reductions of the slabs in one pass before rolling in the roughing mill.Technical dataType sizing press with pressing tools arrangedhorizontally and oppositely each other forstop-and-go advance of slabs through thepresspressing tools are oscillating continuouslyand simultaneously in the horizontal direc-tion and pressing the slab to a smallerwidth during closing. In the stop-and-gomode the slab will be advanced duringopening of pressing toolsWidth reduction 0 - 350 mm depending on:steel grade, slab width, temperature Pressing force max. 22 000 kNMain drive 1x 0 – 4 400 kW @ 0 - 600 min-1Pressing length max 428 mm per strokeNumber of strokes 42 strokes/minSlab advance speed max. 300 mm/sOpening of tools min. 655 mmmax. 2800 mm for free passagePressing tool adjusting drive 2x 0 - 440 kW @ 0 - 950 min-1Adjusting speed max. 44 mm/sec per sideReference image3.1 Base plates2040 ArrangementThe base plates are located below the separate equipment units of the SSP FunctionFor accommodation the following equipment units:•Press housing•Main gear box•Pinch roll drive•Main drive motor•Sizing sled push out device•Grease collecting systemTechnical dataQuantity 1 SetDescriptionBase plates fabricated steel construction &steel structure3.2 Press housing2050 ArrangementThe press housing consist of two horizontal mill housings connected by the housing separator and mounted on the base plates.FunctionFor accommodation of the following main equipment units:•Sizing & Tool sled•Eccentric shaft units•Mechanical scredown systemTechnical dataQuantity 1 SetDescriptionMill housing four-piece assembled design, made ofcast steel, horizontally arranged on thebase platesHousing separators heavy fabricated steel construction, boltedin between both housingsCross beam fabricated steel construction, arrangedbetween the bottom housing post withguide ways for dismantling of the presssleds, equipped with wear platesWear plates made of compound steel (55-60 HRC),Reference drawing3.3 Mechanical adjustment system2060 ArrangementArranged at both ends of the press housing.FunctionThe mechanical adjustment system in accordance with the balancing system serves for adjusting the sizing sled units for opening and closing the gap between the press-ing tools.Each mechanical adjustment system consists of two screwdown spindles which are mechanically synchronized and electrically driven via worm gears. Pneumatically op-erated disk brakes are arranged at the drive shafts. Both mechanical adjustment systems are electrical synchronized and moving horizontally.Technical dataQuantity 2 units (each unit: 2 spindels /3 cylinder) Pitch of thread 40 mmGear ratio 14,3DescriptionAdjusting screws forged steel, arranged in the press hous-ing, including nuts and thrust plates Worm gear units driving the adjusting screwsHydraulic balancing cylinders 1 for tool and 2 for sizing sled on eachsideLubrication gear boxes connected to centralized oillubrication system, coupling grease fillingReference drawing3.4 Sizing sled2070 ArrangementArranged on both ends inside of the press housing.FunctionEach sizing sled accommodate two eccentric shaft units and the tool sled, adjusted by the mechanical screwdown system for opening and closing the gap between the pressing tools.Technical dataQuantity 1 SetDescriptionSizing sleds cast steel, with guide ledges and holdingledges, with bearing parts and covers forthe accommodation of the eccentric shafts Clamping cylinders attached to the sizing sledsLubrication plain bearings connected to central greaselubrication systemReference drawing3.5 Eccentric shaft unit2080 ArrangementArranged in the sizing sled.FunctionDriven by the main universal shafts the eccentric shafts have the function to move forward and backward the pressing sled with the pressing tool.Technical dataQuantity 2 eccentric shafts per sizing sled80 mm eccentricityDescriptionEccentric shafts forged steel arranged in anti-friction bear-ings, sealed by labyrinth rings and sealingringsConnecting rods cast steel, accommodated in anti-frictionbearings on the eccentric shafts, sealedby labyrinth rings and sealing rings, plainthrust bearing shells of steel and retractingbolts for accommodation of the connectingrods in the pressing sledLubrication antifriction bearings connected to centralgrease lubrication systemplain bearings connected to the hydrostat-ic systemReference drawing3.6 Tool sled2090 ArrangementThe tool sleds with pressing tools and the bottom and top guide cross beams ar-ranged horizontally and oppositely to each other between the press housing posts with guide ways.FunctionDriven by the pair of eccentric shaft units and connected by a link to the sizing sled the tool sled accommondate the pressing tool and carry out the width reduction of the slab.Technical dataQuantity 1 SetTool dimension (approx)Width 400 mmThickness 350 mmLength 1700 mmDescriptionGuiding cross beams fabricated steel construction, arrangedbetween the press housing posts withguide ways for the tool sledTool sled cast steel, for accommodation of pressingtoolPressing tool special steel, attached to the tool sled,hydraulically releasable spring-loadedtensioning elements for clamping of thetools, cylinders for the turning of the rodsCooling of pressing tools width-dependent direct cooling of thepressing tools, as well as internal coolingof the pressing tool clamping platesLubrication plain bearings connected to central greaselubrication systemReference drawing3.7 Pinch roll unit2110 ArrangementThe pinch roll units arranged at the entry and exit side of the SSP are provided for driving the slab through the press.FunctionThe bottom rollers arranged stationary at the entry side and hydraulically adjustable in height at the exit side with regard to the operational conditions during pressing. Top rolls hydraulically adjusted to the slab. Each of these 3 rolls can be operated in position- / force control.Entry bottom and both exit rolls are electrical driven.Technical dataNumber of rolls top/bottom 2 / 2Roll diameter 520 mmBarrel length approx. 2 000 mmAdjustment force, max. 400 kNOpening max 440mm (between top and bottom PR) Motor power 1 x 192 kW (for each pinch roll pair) Speed 0 – 173 / 417 min-1Gear ratio 4,94Travelling speed max ± 2.2 m/secDescriptionPinch roll frame fabricated steel construction, arranged atentry and exit side sizing press housingposts, for accommodation of the pinch rollunitsPinch rollers made of special stainless steel, arrangedin anti-friction bearings, top roller featuringinternal & external and bottom roller ex-ternal water coolingPivot levers fabricated steel, for adjustment of top andbottom pinch rolls, arranged in plain bear-ings, fastened at the housing postsHydraulic cylinders (2) top and (1) bottom, for lifting and low-ering of the top pinch rolls and bottom exitpinch rollCylinder dimensions Ø 160/110 x 310 upper pinch rollsØ 200/140 x 110 lower pinch roll exit side Hydraulic pressure 250 barPosition control by position transducers installed in eachcylinder (please refer to M&C list)Drive unit the bottom entry roller is driven by onespur gear unit and universal joint shaft, topand the bottom exit rollers are driven viauniversal joint shafts, common distributiongear unit, motor couplings and electricalmotor (please refer to M&C list)Motor base frame steel constructionLubrication central grease lubrication: for bearingscentral oil lubrication: for gear boxes Machine piping for cooling water, lubrication, hydraulicsReference drawingSectional view3.8 Guide roller unit2120 ArrangementThe guide roller unit is arranged at the entry and exit side of the SSP inside of the press housing.FunctionUsed for guiding the slabs through the press, as well as for preventing of buckling of the slabs.The two top rollers are adjustable by hydraulic cylinders. Both bottom guide rollers with fixed arrangement.For the transport of slabs without pressing the bottom rollers are used as support rollers.Technical dataNumber of rolls top/bottom 2 / 2Roll diameter 800 mmRoll width approx. 340 mmAdjustment force, max. 400 kNOpening max 440mm (between top and bottom GR) DescriptionGuide rollers solid stainless steel rollers, arranged inanti-friction bearings, non-driven, topguide rollers internally & external and bot-tom guide rollers externally water cooledBearing housings fabricated steel construction, verticallyguided between wear ledges, vertical ad-just able by hydraulic cylinderGuide beams fabricated steel construction, fastened tothe top resp. bottom press housing posts,equipped with vertical guide ways for theaccommodation of the bearing housingsHydraulic cylinders 2 for top rollers adjustmentCylinder dimensions Ø 160/110 x 355 mmHydraulic pressure 250 barPosition control by position transducers installed in eachcylinder (please refer to M&C list) Lubrication centralized grease lubrication: bearingsMachine piping for cooling water,hydraulic equipmentReference drawing3.9 Main gear units2130 ArrangementAbove the slab sizing press on drive side and on operator side between the universal joint shafts to the eccentric shafts and the motor.FunctionTransmitting of torque and speed of the main drive motors via couplings, gear unit drive side, intermediate shaft, gear unit operator side and universal joint shaft. to the four eccentric shaftsTechnical dataQuantity 2 gear units per slab sizing pressGear ratio i = 14,448DescriptionGear housing welded steel structure with vertical parti-tion line in the shaft centers which arefixed by means of screw bolts, covers andoil collecting hoods, provided with inspec-tion covers, fastened on the foundationwith anchor boltsPinion shafts made of case-hardened steel with groundhelical toothing, resting in anti-frictionbearingsSpur gears made of case-hardened steel, with groundhelical toothingBevel gears made of case-hardened steelShafts made of heat-treated steel, resting in anti-friction bearingsMachine piping for lubrication on the machine up to thetakeover pointLubrication lubrication of the toothing and anti-frictionbearings by means of circulation oil lubri-cation, connection of the gear unit to acentralised oil lubrication system Reference drawingSectional viewTop view3.10 Drive parts2140 ArrangementAbove the slab sizing press, motor coupling on drive side between the motor and the main gear unit drive side and the intermediate shaft with tooth couplings between the both main gear unitsFunctionTransmitting of torque and speed of the main drive motors to the main gear unit be-tween the both main gear unitsTechnical dataQuantity 1 SetDescriptionMotor coupling tooth couplingLubrication manual grease lubrication systemIntermediate shaft made of steel, resting in antifriction bear-ingsIntermediate coupling tooth couplingLubrication lubrication of the toothing and antifrictionbearings by means of circulation oil lubri-cation, connection to a centralised oil lu-brication system3.11 Main universal shafts2150 ArrangementMain universal shafts as part of the complete drive system are arranged above the press housing between the two main gear boxes and the eccentric shafts.FunctionTransmitting of torque and speed of the main gear box output and the eccentric shaft units.Technical dataNumber of shafts 4Type of shaft Heavy universal shaft, cross-pin type Operating torque max. 630 kNmOperating speed 42 rpmCatalog functional limit torque appr. 2200 kNmDescriptionLubrication manual grease operation3.12 Special grease system (Hydrostatic)2160 ArrangementThe grease system for the hydrostatic of the SSP consists of 2 pump stations, each mounted to the sizing sled of the operator and drive sides.FunctionPermanently feed of special grease for the four connecting rod plain-bearing shells to insure hydrostatic lubrication condition.Technical dataType multichannel pumpQuantity 2 x 2 (1 operating, 1 stand-by)Operating pressure 350 barType of system special progressive systemType of grease special grease (BECHEM & RHUS FA50) Control & Monitoring Included in the system3.13 Machinery piping slab sizing press8804Arrangement- pipes mounted on steel structures which are arranged at the slab sizing press- bulkhead plates in the foundation area of the mill standFunctionPiping for feeding of the various fluids and media to the consumers, such as:- hydraulic fluid- lubrication fluids- water- compressed airBulkhead plates for:- closuring of the openings in the foundation area of the mill stand to the cellar- connection of the mill stand piping to the interconnecting piping in the mill stand areaTechnical dataQuantity 1 setPiping material: refer to 2.1.30.8.103.14 Maintenance platform2180 ArrangementArranged around the SSP on two levels.FunctionWalkway with access to certain sections of the SSP, accommodating of valve stands. Technical dataQuantity 1DescriptionMaintenance Platform welded steel plates and pipe structuresand stairs3.15 Pressing tool changing device2190 ArrangementArranged on the press housing, on each side above the sizing sled unit.FunctionThe tool change will be carry out via bay crane, tool changing car, lifting device and hydraulic valve stands in a semi-automatically mode.Technical dataQuantity 2 (one on each side)DescriptionLifting device please refer to special toolsTool changing car fabricated steel construction,with 2 vertical and 2 horizontal cylinders. Piping for hydraulic components4 Exit roller table2011 ArrangementThe roller table is located behind SSPFunctionThe roller table is capable of transferring the slabs from the sizing press either step-wise in operation of the press and continuously during the slab approach to the roughing mill stand and the backward transport from the roughing mill stand during reversing passes.Technical dataQuantity 1 unitType individually direct driven rollersRoller type solid rollers, roller barrel water cooled Table length approx. 5 250 mmRoller spacing 875 mmNumber of rollers 7Roller diameter 450 mmBarrel length 2 050 mmRoller speed max. ±3.0 m/sMotor dataRated power 22.5 kWSpeed 0 - 128 min-1 LRDescriptionRoller Type solid rollersRoll drive driven via one electrical motor per roller Roller bearings self-aligning roller bearingsBearing houses single-part design, cast steel or steel,fixed on table framesTable frames fabricated steel sectionsFixed side guides fabricated steel sections,attached to the roller table frame Aprons fabricated steel, grid type Crossbeams fabricated steelDrive shafts gear type couplingMotor bases fabricated steelPiping for- centralized grease lubrication of theroller bearings- roller barrel cooling by means of spraypipes5 Roughing mill approach roller table1590 ArrangementThe roller table is located between SSP exit roller table and roughing mill stand entry table.FunctionThe function of the roller table is to convey the slabs to the roughing mill stand. The table is capable of fast reversing and running synchronised with the mill stand in both forward and reverse direction.Technical dataQuantity 1 unitType individually direct driven rollersRoller type solid rollers, roller neck water cooled Table length 11 700 mmRoller spacing 900 mmNumber of rollers 14Roller diameter 450 mmBarrel length 2 050 mmRoller speed 0 ± 3.5 m/sMotor dataRated power 20 kWSpeed 0 – 149 min-1 LRDescriptionRoller Type solid rollersRoll drive driven via one electrical motor per rollerRoller bearings self-aligning roller bearingsBearing houses single-part design, cast steel or steel,fixed on table framesTable frames fabricated steel sections Crossbeams fabricated steelFixed side guides fabricated steel sections,attached to the roller table frame Aprons fabricated steel, grid typeDrive shafts universal spindlesMotor bases fabricated steelLubrication roller bearings lubricated by centralizedgrease lubricationRoller neck cooling water cooling by means of spray pipes1 入口辊道 (2)2 入口侧导板 (4)3 定宽机 (7)3.1 基底板 (9)3.2 外壳 (10)3.3 机械调整系统 (12)3.4 定宽滑块 (14)3.5 偏心轴装置 (16)3.6 工具滑板 (18)3.7 夹送辊装置 (20)3.8 导辊装置 (23)3.9 主齿轮装置 (25)3.10 传动件 (62)3.11 主万向轴 (28)3.12 特殊油脂系统(流体) (29)3.13 定宽机的机械管道 (30)3.14 检修台 (31)3.15 冲压工具更换装置 (32)4 出口辊道 (33)5 粗轧机输入辊道 (35)6入口辊道2010 布置辊道位于定宽机前功能该辊道既可连续输送板坯通过定宽机，也可在操作定宽机时逐步的反向输送。

3C（China Compulsory Certification，中国强制性产品认证制度）3D（Three Dimensional，三维）3DCG（3D computer graphics，三维计算机图形）3DNow!（3D no waiting，无须等待的3D处理）3DPA（3D Positional Audio，3D定位音频）3DS（3D SubSystem，三维子系统）3GIO（Third Generation Input/Output，第三代输入输出技术）AA（Accuview Antialiasing，高精度抗锯齿）AAC（Advanced Audio Compression，高级音频压缩）AAM（AMD Analyst Meeting，AMD分析家会议）AAM（Automatic Acoustic Management，自动机械声学管理）AAS（Automatic Area Segments）AAT（Average access time，平均存取时间）ABB（Advanced Boot Block，高级启动块）ABP（Address Bit Permuting，地址位序列改变）ABP（Advanced Branch Prediction，高级分支预测）ABS（Auto Balance System，自动平衡系统）A-Buffer（Accumulation Buffer，积聚缓冲）AC（Acoustic Edge，声学边缘）AC（Audio Codec，音频多媒体数字信号编解码器）AC-3（Audio Coding 3，第三代音响编码）AC97（Audio Codec 97，多媒体数字信号解编码器1997年标准）ACCP（Applied Computing Platform Providers，应用计算平台提供商）ACG（Aggressive Clock Gating，主动时钟选择）ACIRC（Advanced Cross Interleave Reed - Solomon Code，高级交叉插入里德所罗门代码）ACOPS（Automatic CPU OverHeat Prevention System（CPU过热预防系统）ACPI（Advanced Configuration and Power Interface，先进设置和电源管理）ACR（Advanced Communications Riser，高级通讯升级卡）ACS（Access Control Software，存取控制软件）ACT（Action，动作类游戏）AD（Analog to Digitalg，模拟到数字转换）ADC（Analog to Digital Converter，模数传换器）ADC（Apple Display Connector，苹果专用显示器接口）ADI（Adaptive De-Interlacing，自适应交错化技术）ADIMM（advanced Dual In-line Memory Modules，高级双重内嵌式内存模块）ADIP（Address In Pre-Groove，预凹槽寻址）ADSL（Asymmetric Digital Subscriber Line，不对称数字订阅线路）ADT（Advanced DRAM Technology，高级内存技术）AE（Atmospheric Effects，大气雾化效果）AE（Auto Focus，自动测光）AES-OCB（Advanced Encryption Standard-Operation Cipher Block，高级加密标准-操作密码块）AF（Auto Focus，自动对焦）AFC media（antiferromagnetically coupled media，反铁磁性耦合介质）AFC（Advanced Frame Capture、高级画面捕获）AFC（Amplitude-frequency characteristic，振幅频率特征）AFE（Analog Front End，模拟前置）AFM（Atomic Force Microscope，原子力显微镜）AFR（Alternate Frame Rendering，交替渲染技术）AG（Aperture Grills，栅条式金属板）AGBS（Advance GameBoy development System，高级GameBoy发展系统）AGC（Anti Glare Coatings，防眩光涂层）AGP（Accelerated Graphics Port，图形加速接口）AGPS（Assisted Global Positioning System，援助全球定位系统）AGTL+（Assisted Gunning Transceiver Logic，援助发射接收逻辑电路）AGU（Address Generation Units，地址产成单元）AH（Authentication Header，鉴定文件头）AHA（Accelerated Hub Architecture，加速中心架构）AI（Artificial Intelligence，人工智能）AIMM（AGP Inline Memory Module，AGP板上内存升级模块）AIS（Alternate Instruction Set，交替指令集）AL（Additive Latency，附加反应时间）AL（Artificial Life，人工生命）ALAT（advanced load table，高级载入表）ALDC（Adaptive Lossless Data Compression，适应无损数据压缩）ALU（Arithmetic Logic Unit，算术逻辑单元）Aluminum（铝）AM（Acoustic Management，声音管理）AMC（audio/modem codec，音频/调制解调器多媒体数字信号编解码器）AMR（Audio/Modem Riser，音效/调制解调器主机板附加直立插卡）An isotropic Filtering（各向异性过滤）ANSI（American National Standards Institute，美国国立标准协会）AOI（Automatic Optical Inspection，自动光学检验）AOL（Alert On LAN，局域网警告）APC（Advanced Power Control，高级能源控制）API（Application Programming Interfaces，应用程序接口）APIC（Advanced Programmable Interrupt Controller，高级可编程中断控制器）APM（Advanced Power Management，高级能源管理）APPE（Advanced Packet Parsing Engine，增强形帧解析引擎）APS（Alternate Phase Shifting，交替相位跳转）APS（Audio Production Studio，音频生产工作室）APU（Audio Processing Unit，音频处理单元）APX（All Position eXpansion，全方位扩展）AR（Auto-Resume，自动恢复）ARC（Anti Reflect Coating，防反射涂层）ARF（Asynchronous Receive FIFO，异步接收先入先出）ARP（Address Resolution Protocol，地址解析协议）ARPG（Action Role Play Games，动作角色扮演游戏）ARR（Annual Return Rate，年返修率）ASB（Advanced System Buffering，高级系统缓冲）ASC（Advanced Size Check，高级尺寸检查）ASC（Anti Static Coatings，防静电涂层）ASC（Auto-Sizing and Centering，自动调效屏幕尺寸和中心位置）ASCI（The 10-year Accelerated Strategic Computing Initiative，领先10年战略加速计算机）ASCII（American Standard Code for Information Interchange，美国国家标准信息交换代码）ASD（Auto Stereoscopic Display，自动立体显示）ASF（Advanced Streaming Format，高级数据流格式）ASF（Alert Standards Forum，警告标准讨论）ASIC（Application Specific Integrated Circuit，特殊应用积体电路）ASIO（Audio Streaming Input and Output interface，音频流输入输出接口）ASK IR（Amplitude Shift Keyed Infra-Red，长波形可移动输入红外线）ASMO（Advanced Storage Magneto-Optical，增强形光学存储器）ASP（Active Server Pages，活动服务页）ASP（Application Service Provider，应用服务提供商）ASPI（Advanced SCSI Programming Interface，高级SCSI可编程接口）AST（amorphous-silicon TFT，非晶硅薄膜晶体管）AST（Average Seek time，平均寻道时间）AT（Advanced Technology，先进技术）ATA（Advanced Technology Attachment，高级技术附加装置）ATAPI（AT Attachment Packet Interface，AT扩展包接口）ATC（Access Time from Clock，时钟存取时间）ATC（Advanced Transfer Cache，高级转移缓存）ATD（Assembly Technology Development，装配技术发展）ATL（ActiveX Template Library，ActiveX模板库）ATM（Asynchronous Transfer Mode，异步传输模式）ATM（Automatic Teller Machine，自动提款机）ATOMM（Advanced super Thin-layer and high-Output Metal Media，增强形超薄高速金属媒体）ATP（Active to Precharge，激活到预充电）ATRAC（Adaptive TRansform Acoustic Coding，可适应转换声学译码）ATSC（Advanced Television Systems Committee，高级电视系统委员会）ATX（AT Extend，扩展型AT）AUD_EXT（Audio Extension，音频扩展）AUX（Auxiliary Input，辅助输入接口）AV（Analog Video，模拟视频）AV（Audio & Video，音频和视频）AVG（Adventure Genre，冒险类游戏）AVI（Audio Video Interleave，音频视频插入）B Splines（B样条）B.O.D.E（Body Object Design Envioment，人体/物体/设计/环境渲染自动识别）BAC（Bad Angle Case，边角损坏采样）Back Buffer（后置缓冲）Backface culling（隐面消除）BAD（Best Amiga Dominators）BASIC（Beginner s All-purpose Symbolic Instruction Codec，初学者通用指令代码）Battle for Eyeballs（眼球大战）BBS（BIOS Boot Specification，基本输入/输出系统启动规范）BBUL（Bumpless Build-Up Layer，内建非凹凸层）BCF（Boot Catalog File，启动目录文件）BEDO（Burst Enhanced Data-Out RAM，突发型数据增强输出内存）Benchmarks（基准测试程序数值BGA（Ball Grid Array，球状网阵排列）BHT（branch prediction table，分支预测表）BIF（Boot Image File，启动映像文件）Bilinear Filtering（双线性过滤）BIOS（Basic Input/Output System，基本输入/输出系统）BLA（Bearn Landing Area，电子束落区）BLP（Bottom Leaded Package，底部导向封装）BMC（Black Matrix Screen，超黑矩阵屏幕）BMS（Blue Magic Slot，蓝色魔法槽）BOD（Bandwidth On Demand，弹性带宽运用）BOPS（Billion Operations Per Second，十亿次运算/秒）BP（Brach Prediction，分支预测）BPA（Bit Packing Architecture，位封包架构）BPI（Bit Per Inch，位/英寸）bps（bit per second，位/秒）bps（byte per second，字节/秒）BPU（Branch Processing Unit，分支处理单元）BRC（Beta Release Candidate，测试发布候选版0）BSD（Berkeley Software Distribution，伯克利软件分配代号）BSP（Binary Space Partitioning，二进制空间分区）BSP（Boot Strap Processor，启动捆绑处理器）BSRAM（Burst pipelined synchronous static RAM，突发式管道同步静态存储器）BTAC（Branch Target Address Calculator，分支目标寻址计算器）BTO（Build-To-Order，按序构建）BURN-Proof（Buffer UnderRuN-Proof，防止缓冲区溢出）C.O.P（CPU overheating protection，处理器过热保护）C2C（card-to-card interleaving，卡到卡交错存取CAD（computer-aided design，计算机辅助设计）CAM（Common Access Model，公共存取模型）CAM（Computer-aided manufacturing，计算机辅助制造）CAS（Column Address Strobe，列地址控制器）CAV（Constant Angular Velocity，恒定角速度）CBDS（Continuous Background Defect Scanning，连续后台错误扫描）CBF（Cable Broadband Forum，电缆宽带论坛）CBGA（Ceramic Ball Grid Array，陶瓷球状网阵排列）CBMC（Crossbar based memory controller，内存控制交叉装置）CBR（Committed Burst Rate，约定突发速率）CBR（Constant Bit Rate，固定比特率）CBU（color blending unit，色彩混和单位）CCD（Charge Coupled Device，电荷连接设备）CCIRN（Coordinating Committee for Intercontinental Research Networking，洲际研究网络协调委员会）CCM（Call Control Manager，拨号控制管理）cc-NUMA（cache-coherent non uniform memory access，连贯缓冲非统一内存寻址）CCS（Cross Capacitance Sensing，交叉电容感应）CCS（Cut Change System）CCT（Clock Cycle Time，时钟周期）CD（Compact Disc）cd/m^2（candela/平方米，亮度的单位）CDIP（Ceramic Dual-In-Line，陶瓷双重直线）CDPD（Cellular digital Packet data，细胞数字信息包数据）CDR（CD Recordable，可记录光盘）CDRAM（Cache DRAM，附加缓存型DRAM）CD-ROM/XA（CD-ROM eXtended Architecture，唯读光盘增强形架构）CDRS（Curved Directional Reflection Screen，曲线方向反射屏幕）CDRW（CD-Rewritable，可重复刻录光盘）CDSL（Consumer Digital Subscriber Line（消费者数字订阅线路）CE（Consumer Electronics，消费电子）CEA（Consumer Electronics Association，消费者电子协会）CEA（Critical Edge Angles，临界边角）CEM（cube environment mapping，立方环境映射）CEMA（Consumer Electronics Manufacturing Association（消费者电子制造业协会）Center Processing Unit Utilization，中央处理器占用率CEO（Chief Executive Officer，首席执行官）CF（CompactFlash Card，紧凑型闪存卡）CFM（cubic feet per minute，立方英尺/秒）CG（C for Graphics/GPU，用于图形/GPU的可编程语言）CG（Computer Graphics，计算机动画）CGI（Common Gateway Interface，通用网关接口）CG-Silicon（Continuous Grain Silicon，连续微粒硅）CHRP（Common Hardware Reference Platform，共用硬件平台）CHS（Cylinders、Heads、Sectors，柱面、磁头、扇区）CIEA（Commercial Internet Exchange Association，商业因特网交易协会）CIR（Committed Information Rate，约定信息速率）CIS（Contact Image Sensors，接触图像传感器）CISC（Complex Instruction Set Computing，复杂指令集计算机）CL（CAS Latency，CAS反应时间）Clipping（剪贴纹理）CLK（Clock Cycle，时钟周期）Clock Synthesizer，时钟合成器CLV（Constant Linear Velocity，恒定线速度）CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）CMOV（conditional move 包含uction，条件移动指令）CMP（on-chip multiprocessor，片内多重处理）CMR（Colossal Magneto Resistive，巨磁阻抗）CMS（Code Morphing Software，代码变形软件）CMSS（Creative Multi Speaker Surround，创新多音箱环绕）CMT（course-grained multithreading，过程消除多线程）CNPS（Computer Noise Prevention System，计算机噪音预防系统）CNR（Communication and Networking Riser，通讯和网络升级卡）CNT（carbon nano-tube，碳微管）COAST（Cache-on-a-stick，条状缓存）COB（Cache on board，板上集成缓存）co-CPU（cooperative CPU，协处理器）COD（Cache on Die，芯片内核集成缓存）COM（Component Object Model，组件对象模式）COMDEX（Computer Distribution Exposition，计算机代理分销业展览会）compressed textures（压缩纹理）Concurrent Command Engine，协作命令引擎COO（Chief Organizer Officer，首席管理官）Copper（铜）CP（command processor，指令处理器）CPA（Close Page Auto recharge，接近页自动预充电）CPE（Customer Premise Equipment，用户预定设备）CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列）CPI（count per inch，每英寸计数）CPI（cycles per 包含uction，周期/指令）CPLD（Complex Programmable Logic Device，复杂可程序化逻辑组件）CPRM（Content Protection for record able media，记录媒体内容保护）CPS（Certification Practice Statement，使用证明书）CPU（Center Processing Unit，中央处理器）CRC（Cyclical Redundancy Check，循环冗余检查）CRM（Customer Relationship Management，顾客关系管理）CRT（Cathode Ray Tube，阴极射线管）CRT（Cooperative Redundant Threads，协同多余线程）CS（Channel Separation，声道分离）CSA（Canadian Standards Association，加拿大标准协会）CSA（Communication Streaming Architecture，通讯流架构）CSC（Colorspace Conversion，色彩空间转换）CSD（Circuit Switched Data，电路切换数据通话）CSE（Configuration Space Enable，可分配空间）CSG（constructive solid geometry，建设立体几何）CSP（Chip Scale Package，芯片比例封装）CSP（Chip Size Package，芯片尺寸封装）CSS（Cascading Style Sheets，层叠格式表）CSS（Common Command Set，通用指令集）CSS（Content Scrambling System，内容不规则加密）CTI（Computer Telephone Integration，计算机电话综合技术）CTO（Chief Technology Officer，首席技术官）CTR（CAS to RAS，列地址到行地址延迟时间）CTS（Carpal Tunnel Syndrome，计算机腕管综合症）CTS（Clear to Send，清除发送）CVS（Compute Visual Syndrome，计算机视觉综合症）CXT（Chooper eXTend，增强形K6-2内核）DA（Digital to Analog，数字到模拟转换）DAB（digital audio broadcast，数字音频广播）DAC（Digital to Analog Converter，数模传换器）DAC（Dual Address Cycle，双重地址周期）DAE（digital Audio Extraction，数据音频抓取）DAN（Dance，跳舞类游戏）DAO（Disc At Once，整盘刻录）DAO-RAW（Disc At Once Read after Write，整盘刻录-写后读）DASP（Dynamic Adaptive Speculative Pre-Processor，动态适应预测预处理器）Data Forwarding（数据前送）dB（decibel，分贝）DB（Deep Buffer，深度缓冲）DB（Device Bay，设备插架）DBBS（Dynamic Bass Boost System，动态低音增强系统）DBI（dynamic bus inversion，动态总线倒置）DBS（Direct Broadcast Satellite，直接卫星广播）DBS-PC（Direct Broadcast Satellite PC，人造卫星直接广播式PC）DC（Digital Camera，数码相机）DC（Dreamcast，世嘉64位游戏机）DCA（Defense Communication Agency，国防部通信局）DCC（Digital Compact Cassette，数字盒式磁带）DCC（Digital Content Creation，数字内容创造）DCD（Directional Corelational De-interlacing，方向关联解交错）DCD（Document Content De脚本ion for XML，XML文件内容描述）DCE（Data Circuit Terminal Equipment，数据通信设备）DCLK（Dot Clock，点时钟）DCOM（Distributing Component Object Model，构造物体模块）DCT（Display Compression Technology，显示压缩技术）DCT（DRAM Controller，DRAM控制器）DD（Double Side，双面内存）DDBGA（Die Dimension Ball Grid Array，内核密度球状矩阵排列）DDC（Display Data Channel，显示数据通道）DDC（Dynamic Depth Cueing，动态深度暗示）图像DDE（dynamic data exchange，动态数据交换）DDMA（Distributed DMA，分布式DMA）DDP（Digital Display Port，数字输出端口）DDR SDRAM（Double Date Rate，上下行双数据率SDRAM）DDR（Double Date Rate，上下行双数据率）DDS（Direct Draw Surface，直接绘画表面）DDSS II（Double Dynamic Suspension System II，第二代双层动力悬吊系统）DDSS（Dolby Digital Surround Sound，杜比数字环绕声）DDSS（Double Dynamic Suspension System，双悬浮动态减震系统）DDT（Dynamic Deferred Transaction，动态延期处理）DDWG（Digital Display Working Group，数字化显示工作组）DEC（Direct Etching Coatings，表面蚀刻涂层）Decal（印花法）Decode（指令解码）Deflection Coil（偏转线圈）DES（ata Encryption Standard，数据加密标准）DFL（Dynamic Focus Lens，动态聚焦）DFP（Digital Flat Panel，数字平面显示标准）DFPG（Digital Flat Panel Group，数字平面显示标准工作组）DFS（Digital Flex Scan，数字伸缩扫描）DFS（Dynamic Flat Shading，动态平面描影）DHCP（Dynamic Host Configuration Protocol，动态主机分配协议）DHHF（Dual Head - High Fidelity，高精度第四代双头）DHT（Dolby Headphone Technology，杜比耳机技术）DIB（Dual Independent Bus，双重独立总线）DIC（Digital Image Control，数字图像控制）DID（Device ID，设备ID）Digital Multiscan II（数字式智能多频追踪）DIL（dual-in-line）DIMM（Dual In-line Memory Modules，双重内嵌式内存模块）Directional Light（方向性光源）DiscWizard（磁盘控制软件）DIT（Disk Inspection Test，磁盘检查测试）Dithering（抖动）DIVA（Data IntensiVe Architecture，数据加强架构）DIY（Do it Yourself，自己装机）DLL（Delay-Locked Loop，延时锁定循环电路）dll（dynamic link library，动态链接库）DLP（digital Light Processing，数字光处理）DLS（Downloadable Sounds Level，可下载音色）DLS-2（Downloadable Sounds Level 2，第二代可下载音色）DM（Displacement mapping，位移贴图）DMA（Direct Memory Access，直接内存存取）DMAC（Direct Memory Access Controller，直接内存存取控制器）DME（Direct Memory Execute，直接内存执行）DMF（Distribution Media Format）DMI（Desktop Management Interface，桌面管理接口）DMT（Discreet Monitor Timing，智能型显示器调速）DMT（Discrete Multi - Tone，不连续多基频模式）DMT（Dynamic Multithreading Architecture，动态多线程结构）DNA（Distributed Internet Application，分布式因特网应用程序）DNS（Domain Name System，域名解析系统）DOA2 HC（Deal or Live 2 hardcore，生与死2完整版）DOC（Disk On Chip，芯片磁盘）DOCSIS（Data Over Cable Service Interface Specifications，线缆服务接口数据规格）DOF（Depth of Field，多重境深）DOJ（Department of Justice，反不正当竞争部门）DOM（Document Object Model，文档目标模型）DoS（Denial of Service，拒绝服务）DOS（Disk Operating System，磁盘操作系统）DOSD（Digital On Screen Display，同屏数字化显示）Dot Pitch（点距）dot texture blending（点型纹理混和）DOT（Dynamic Overcooking Technology，动态超频技术）DOT3（Dot product 3 bump mapping，点乘积凹凸映射）Double Buffering（双缓冲区）DP（Dual Processor，双处理器）DPBM（Dot Product Bump Mapping，点乘积凹凸映射）DPC（Desktop PC，桌面PC）dpi（dot per inch，每英寸的打印像素）DPMS（Display Power Management Signaling，显示能源管理信号）DPP（Direct print Protocol，直接打印协议DQL（Dynamic Quadra pole Lens，动态四极镜）DQS（Bidirectional data strobe，双向数据滤波）DQUICK（DVD Qualification and Integration Kit，DVD资格和综合工具包）DRA（deferred rendering architecture，延迟渲染架构）DRAM（Dynamic Random Access Memory，动态随机存储器）DRCG（Direct Rambus Clock Generator，直接Rambus时钟发生器）DRDRAM（Direct RAMBUS DRAM，直接内存总线DRAM）DRF（Digital radio frequency，数字无线电频率）DRI（Direct Rendering Infrastructure，基层直接渲染）DRM（Digital rights management，数字版权保护）DRM（Digital Rights Management，数字适当管理）DRSL（Differential Rambus Signaling Level，微分RAMBUS信号级）DRSL（Direct Rambus Signaling Level，直接RAMBUS信号级）DS3D（DirectSound 3D Streams）DSD（Direct Stream Digital，直接数字信号流）DSL（Data Strobe Link，数据选通连接DSL（Down Loadable Sample，可下载的取样音色）DSM（Dedicated Stack Manager，专门堆栈管理）DSM（Distributed shared memory，分布式共享内存）DSMT（Dynamic Simultaneous Multithreading，动态同步多线程）DSO（Dynamic Sound-stage Organizer，动态声音层组建）DSP（Delivery Service Partner，交付服务合伙人）DSP（Digital Signal Processing，数字信号处理）DSP（Digital Sound Field Processing，数字音场处理）DSP（Dual Streams Processor，双重流处理器）DST（Depleted Substrate Transistor，衰竭型底层晶体管）DST（Drive Self Test，磁盘自检程序）DSTN（Double layers Super Twisted Nematic，双层超扭曲向列，无源矩阵LCD）DSVD（Digital Simultaneous Voice and Data）DTD（Document Type Definition，文件类型定义）DTE（Data Terminal Equipment，数据终端设备）DTL（Developer Tool，发展工具包）DTR（Disk Transfer Rate，磁盘传输率）DTS（Digital Theater System，数字剧院系统）DTT（DeskTop Theater，桌面剧院）DTV（Digital TV，数字电视）DTV（Dual Threshold Voltage，双重极限电压）DTXS（Decryption Transform for XML Signature，XML签名解密转换）DUN（Dial-Up Networking，拨号网络）DUV（Deep Ultra-Violet，纵深紫外光）DV（Digital Vidicon，数码摄录机）DVB（Digital Video Broadcasting，数字视频广播DVC（Digital Vibrance Control，数字振动控制）DVD（Digital Video/Versatile Disk，数字视频/万能光盘）DVD-R（DVD Recordable，可记录DVD盘）DVD-RAM（Digital Video/Versatile Disk - Random Access Memory，随机存储数字视频/万能光盘）DVD-RW（DVD Rewritable，可重复刻录DVD盘）DVFM（Dynamic Voltage and Frequency Management，动态电压和频率管理）DVI（Digital Video Interface，数字视频接口）DVI（Digital Visual Interface，数字化视像接口）DVMT（Dynamic Video Memory Technology，动态视频内存技术）DVMT（Dynamic Video Memory Technology，动态视频内存技术）DWDM（Dense WaveLength Division Multiplex，波长密集型复用技术）DxR（DynamicXTended Resolution，动态可扩展分辨率）DXTC（Direct X Texture Compress，DirectX纹理压缩）Dynamic Z-buffering（动态Z轴缓冲区）E（Economy，经济，或Entry-level，入门级）E3（Electronic Entertainment Expo，电子娱乐展览会）EAP（Extensible Authentication Protocol，扩展证明协议）EAX（Environmental Audio Extensions，环境音效扩展技术）EB（Expansion Bus，扩展总线）EBGA（Enhanced Ball Grid Array，增强形球状网阵排列）EBL（electron beam lithography，电子束平版印刷）EBR（Excess Burst Rate，超额突发速率）EC（Early Childhood，学龄前儿童）EC（Embedded Controller，嵌入式控制器）ECC（Elliptic Curve Crypto，椭圆曲线加密）ECC（Error Checking and Correction，错误检查修正）ECD（Electro Chromic Display，电铬显示器）ECP（Extended Capabilities Port，延长能力端口）ED（Execution driven，执行驱动）EDA（Electronic Design Automatic，电子设计自动化）E-DDC（Enhanced Display Data Channel，增强形视频数据通道协议）EDEC（Early Decode，早期解码）Edge Anti-aliasing（边缘抗锯齿失真）EDO（Enhanced Data-Out RAM，数据增强输出内存）EE（Emotion Engine，情感引擎）E-EDID（Enhanced Extended Identification Data，增强形扩充身份辨识数据）EEPROM（Electrically Erasable Programmable ROM，电擦写可编程只读存储器）eFB（embedded Frame Buffer，嵌入式帧缓冲）EFEAL（Extended Field Elliptical Aperture Lens，可扩展扫描椭圆孔镜头）EFF（Electronic Frontier Foundation（电子前线基金会）EFI（Extensible Firmware Interface，扩展固件接口）EFM（Eight to Fourteen Modulation，8位信号转换为14位信号）EFU（Elemntary Functional Unit，增强功能单元）EHCI（Enhanced Host Controller Interface，加强型主机端控制接口）EHSDRAM（Enhanced High Speed DRAM，增强型超高速内存）EIDE（enhanced Integrated Drive Electronics，增强形电子集成驱动器）EISA（Enhanced Industry Standard Architecture，增强形工业标准架构）EL DDR（Enhanced Latency DDR，增强反应周期DDR内存）Embedded Chips（嵌入式）EMBM（environment mapped bump mapping，环境凹凸映射）Embosing（浮雕）EMC（Electron Magnetic Compatibility，电磁兼容）EMF（Electron Magnetic Field，电磁场）EMI（Electromagnetic Interference，电磁干扰）EMP（Emergency Management Port，紧急事件管理端口）EMS（Enhanced Memory System，增强内存系统）EMS（Enhanced Message Service，扩展型信息服务）EMS（Expanded Memory Specification，扩充内存规格）EOL（End of Life，最终完成产品）EOS（eBookMan Operating System，电子书操作系统）EPA（edge pin array，边缘针脚阵列）EPA（Environmental Protection Agency，美国环境保护局）EPF（Embedded Processor Forum，嵌入式处理器论坛）EPIC（explicitly parallel 包含uction code，并行指令代码）EPL（electron projection lithography，电子发射平版印刷）EPM（Enhanced Power Management，增强形能源管理）EPM（enterprise project manage）EPOC（Electronic Piece of Cheese，小型电子块）EPOC（Elevated Package Over CSP，CSP架空封装）EPP（Enhanced Parallel Port，增强形平行接口）EPROM（erasable，programmable ROM，可擦写可编程ROM）EPV（Extended Voltage Protection，扩展电压保护）ERD（Emergency Repair Disk，应急修理磁盘）ERP（Enterprise Requirement Planning，企业需求计划）ERP（Enterprise Resource Planning，企业资源计划）ERP（estimated retail price，估计零售价）ES（Energy Star，能源之星）ES（Engineering Sample，工程样品）eSATA（External Serial ATA，扩展型串行ATA）ESCD（Extended System Configuration Data，可扩展系统配置数据）ESD（electro-static discharge，静电释放）ESDJ（Easy Setting Dual Jumper，简化CPU双重跳线法）ESDRAM（Enhanced SDRAM，增强型SDRAM）ESER（EAC Secure Extract Ripping，EAC安全抓取复制）ESP（Electronic-Shock Protection，电子抗震系统）ESP（Embedded System Platform，嵌入式系统平台）ESP（Encapsulating Security Payload，压缩安全有效载荷）ESR（Equivalent Series Resistance，等价系列电阻）ESRAM（Enhanced SRAM，增强型SRAM）ETC（etc，其它类游戏，包括模拟飞行）eTM（embedded Texture Buffer，嵌入式纹理缓冲）ETRI（Electronics and Telecommunications Research Institute，电子和电信研究协会）EULA（End-User License Agreement，最终用户释放协议）EUV（Extreme Ultra Violet，紫外光）EUV（extreme ultraviolet lithography，极端紫外平版印刷）EVF（Electronic Viewfinder，电子取景窗）E-WDM（Enhanced Windows Driver Model，增强型视窗驱动程序模块）Execute Buffers（执行缓冲区）Extended Burst Transactions（增强式突发处理）Extended Stereo（扩展式立体声）Factor Alpha Blending（因子阿尔法混合）FADD（Floationg Point Addition，浮点加）FAQ（Frequently Asked Questions，常见问题回答）Fast Z-clear（快速Z缓冲清除）FAT（File Al本地 Tables，文件分配表）FB（fragment buffer，片段缓冲）FBC（Frame Buffer Cache，帧缓冲缓存）FBGA（Fine-Pitch Ball Grid Array，精细倾斜球状网阵排列）FBGA（flipchip BGA，轻型芯片BGA）F-Buffer（Fragment Stream FIFO Buffer，片段流先入先出缓冲区）FC（Famicom，任天堂8位游戏机）FC（Fibre Channel，光纤通道）FC-BGA（Flip-Chip Ball Grid Array，反转芯片球形栅格阵列）FCC（Federal Communications Commission，联邦通信委员会）FC-PGA（Flip-Chip Pin Grid Array，反转芯片针脚栅格阵列）FCRAM（Fast Cycle RAM，快周期随机存储器）FDB（Fluid Dynamic Bearing，非固定动态轴承）FDB（fluid-dynamic bearings，动态轴承）FDBM（Fluid dynamic bearing motors，液态轴承马达）FDC（Floppy Disk Controller，软盘驱动器控制装置）FDD（Floppy Disk Driver，软盘驱动器）FDIV（Floationg Point Divide，浮点除）FDM（Frequency Division Multi，频率分离）FED（Field Emission Displays，电场显示器）FEMMA（Foldable Electronic Memory Module Assembly，折叠电子内存模块装配）FEMMS（Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态FFB（Force Feed Back，力反馈）FFJ（Force Feedback Joystick，力量反馈式操纵杆）FFT（fast Fourier transform，快速热欧姆转换）FGM（Fine-Grained Multithreading，高级多线程）FID（FID（Frequency identify，频率鉴别号码）FIFO（First Input First Output，先入先出队列）FIR（finite impulse response，有限推进响应）FireWire（火线，即IEEE1394标准）FISC（Fast Instruction Set Computer，快速指令集计算机）FL（fragment list，片段列表）FL（Function Lookup，功能查找）Flat（平面描影）FlexATX（Flexibility ATX，可扩展性ATX）flip double buffered（反转双缓存）flip-chip（芯片反转）FLIR（Forward Looking Infra-Red，前视红外）FLOPs（Floating Point Operations Per Second，浮点操作/秒）Flow-control（流控制）FLS（Front Light Screen，前发光屏幕）Flyback Transformer（回转变压器）FM（Flash Memory，快闪存储器）FM（Frequency Modulation，频率调制）FMA（full-motion animated backdrops）FMAC（Floating-Point Multiply-Accumulators，浮点累积乘单元）FMC（Frictionless Memory Control，无阻内存控制）FMD ROM（Fluorescent Material Read Only Memory，荧光质只读存储器）FMT（fine-grained multithreading，纯消除多线程）FMUL（Floationg Point Multiplication，浮点乘）Fog table quality（雾化表画质）Fog（雾化效果）FPD（flat panel display，平面显示器）FPM（Fast Page Mode，快页模式内存）FPRs（floating-point registers，浮点寄存器）FPS（First Person Shooters，第一人称射击游戏）FPS（FourPointSurround，创新的四点环绕扬声器系统）fps（frames per second，帧/秒）FPU（Float Point Unit，浮点运算单元）FR（Frames Rate，游戏运行帧数）FR（Frequence Response，频率响应）Frames rate is King（帧数为王）FRC（Frame Rate Control（帧比率控制）FRC（Frame Rate Control，帧率控制）FRICC（Federal Research Internet Coordinating Committee，联邦调查因特网协调委员会）FRJS（Fully Random Jittered Super-Sampling，完全随机移动式超级采样）Front Buffer（前置缓冲）FSAA（Full Scene/Screen Anti-aliasing，全景/屏幕抗锯齿）FSB（Front Side Bus，前端总线）FSE（Frequency Shifter Effect，频率转换效果）FSR（force sensor resistance，动力感应电阻）FSTN（Film compensated Super Twisted liquid crystal，带补偿膜超扭曲相列）FSUB（Floationg Point Subtraction，浮点减）FTC（Federal Trade Commission，联邦商业委员会）FTG（Fighting Game，格斗类游戏）FTP（File Transfer Protocol，文件传输协议）Fur（软毛效果）FW（Fast Write，快写，AGP总线的特殊功能）FWH（Firmware Hub，固件中心）GART（Graphic Address Remappng Table，图形地址重绘表）GB（Game Boy，任天堂4位手提游戏机）GB（Garibaldi架构，Garibaldi基于ATX架构，但是也能够使用WTX构架的机箱）GBA（Game Boy Advanced，任天堂增强型手提游戏机）GBC（Game Boy Color，任天堂手提16色游戏机）GBL（GameBoy Light，GB夜光型）GBP（GameBoy Pocket，GB口袋型）GDC（Game Developer Conference，游戏发展商会议）GDI（Graphics Device Interface，图形设备接口）GFD（Gold finger Device，金手指超频设备）GG（Game Gear，世嘉彩色手提游戏机）GHC（Global History Counter，通用历史计数器）Ghost（（General Hardware Oriented System Transfer，全面硬件导向系统转移）GI（Global Illumination，球形光照）GIC（Gold Immersion Coating，化金涂布技术）GIF（Graphics Interchange Format，图像交换格式）GIF（Graphics Interface unit，图形接口单元）GLV（grating-light-valve，光栅亮度阀）GM（General Midi，普通MIDI）GM（Glass Mould，玻璃铸制）GMCH（Graphics & Memory Controller Hub，图形和内存控制中心）GMR（giant magnetoresistive，巨型磁阻）Gouraud Shading，高洛德描影，也称为内插法均匀涂色GPA（Graphics Performance Accelerator，图形性能加速卡）GPF（General protect fault，一般保护性错误）GPIs（General Purpose Inputs，普通操作输入）GPL（GNU Public License，GNU公众授权）GPRS（General Packet Raice，整合封包无线服务）GPRs（General Purpose Registers，通用寄存器）GPS（Global Positioning System，全球定位系统）GPT（Graphics Performance Toolkit，图形性能工具包）GPU（Graphics Processing Unit，图形处理器）GS（Graphic Synthesizer，图形合成器）GS（Graphics Synthesizer，图形合成器）GSM（Galvanization Superconductive Material，电镀锌超导材料）GTF（General Timing Formula，普通调速方程式）GTL（Gunning Transceiver Logic，发射接收逻辑电路）GTS（Giga Textel Sharder，十亿像素填充率）Guard Band Support（支持保护带）GUI（Graphics User Interface，图形用户界面）GVPP（Generic Visual Perception Processor，常规视觉处理器）GWS（graphics workstations，图形工作站）HAL（Hardware Abstraction Layer，硬件抽像化层）HCF（Host Controller，主体控制处理）HCI（Host Controller Interface，主机控制接口HCL（Hardware Compatibility List，硬件兼容性列表）HCRP（Hardcopy Cable Replacement Profile，硬复制电缆复位协议子集）HCT（Hardware Compatibility Test，硬件兼容性测试HDA（Head Disk Assembly，头盘组件）HDA（high-efficiency Audax High Definition Aerogel，高效高清楚气动）HDIT（High Bandwidth Differential Interconnect Technology，高带宽微分互连技术）HDMI（High Definition Multimedia Interface，高精度多媒体接口）HDR（High Dynamic Range，高级动态范围）HDRL（high dynamic-range lighting，高动态范围光线）HDSL（High bit rate DSL，高比特率数字订阅线路）HDSS（Holographic Data Storage System，全息数据存储系统）HDTV（high definition television，高清晰度电视）HDVP（High-Definition Video Processor，高精度视频处理器）HE（Home Edition，家庭版）HEL（Hardware Emulation Layer（硬件模拟层）HID（Human Interface Device，人机对话接口设备）Hierarchical Z（Z分级）HiFD（high-capacity floppy disk，高容量软盘）Hi-fi（high fidelity，高精度设备）high triangle count（复杂三角形计数）HLL（high level language，高级语言）HLLCA（High-Level Language Computing Architecture，高级语言计算架构）HL-PBGA（表面黏著，高耐热、轻薄型塑胶球状网阵封装HLSL（High Level Shading Language，高级描影语言）HMC（hardware motion compensation，硬件运动补偿）HMC（holographic media card，全息媒体卡）HMD（holographic media disk，全息媒体磁盘）Home PNA（Home Private Network Adapter，家庭私人网络适配器）HOS（Higher-Order Surfaces，高次序表面）HPC（Hand held PC，手持电脑设备）HPDR（High-Precision Dynamic-Range，高精度动态范围）HPF（High-Pass Filter，高通滤波器）HPNA（home phoneline networking，家庭电话线网络）HPS（High Performance Server，高性能服务器）HPTC（high performance technical computing，高性能技术运算）HPW（High Performance Workstation，高性能工作站）HRAA（High Resolution Anti-aliasing，高分辨率抗锯齿）HRTF（Head Related Transfer Function，头部关联传输功能）HSCSD（High-Speed Circuit-Switched Data，高速巡回开关数据）HSDRAM（High Speed DRAM，超高速内存）HSF（Host Signal，主体信号处理）HSI（High Speed Interconnect，高速内连）HSLB（High Speed Link Bus，高速链路总线）HSP（Host Signal Processing，主体信号处理）HSR（Hidden Surface Removal，隐藏表面移除）HT（Hyper Transport，超级传输）HTA（Hypertext Application，超文本应用程序）。

常用计算机英语词汇表(A-Z)3DNow!〔3D no waiting〕3DPA〔3D Positional Audio，3D定位音频〕3DS〔3D SubSystem，三维子系统〕ABS〔Auto Balance System，自动平衡系统〕AC〔Audio Codec，音频多媒体数字信号编解码器〕ACOPS: Automatic CPU OverHeat Prevention System〔CPU过热预防系统〕ACPI〔Advanced Configuration and Power Interface，先进设置和电源办理〕AE〔Atmospheric Effects，雾化效果〕AFR〔Alternate Frame Rendering，交替衬着技术〕AGAS〔Anti Glare Anti Static Coatings，防强光、防静电涂层〕AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线布局AGU〔Address Generation Units，地址产成单元〕AH: Authentication Header，鉴定文件头AHA〔Accelerated Hub Architecture，加速中心架构〕AL: Artificial Life〔人工生命〕ALU〔Arithmetic Logic Unit，算术逻辑单元〕AMR〔Audio/Modem Riser，音效/数据主机板附加直立插卡〕AMR〔Audio／Modem Riser；音效／调制解调器主机板附加直立插卡〕Anisotropic Filtering〔各向异性过滤〕API〔Application Programming Interfaces，应用程序接口〕APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)APM〔Advanced Power Management，高级能源办理〕APPE〔Advanced Packet Parsing Engine，增强形帧解析引擎〕ARP〔Address Resolution Protocol，地址解析协议〕ASC〔Anti Static Coatings，防静电涂层〕ASC〔Auto-Sizing and Centering，自动调效屏幕尺寸和中心位置〕ASCII〔American Standard Code for Information Interchange，美国国家尺度信息交换代码〕ASIC: Application Specific Integrated Circuit〔特殊应用积体电路〕ASK IR〔Amplitude Shift Keyed Infra-Red，长波形可移动输入红外线〕ASMO〔Advanced Storage Magneto-Optical，增强形光学存储器〕ASPI〔Advanced SCSI Program Interface，高级SCSI编程接口。

差分LC VCO的设计方法第28卷第4期2005年12月电子器件ChineseJournalofElectronDevicesV o1.28No.4Dec.2005DesignMethodinOptimizationDifferentialLCVCOMANJia—han,ZHAoKUn (InstituteofMicroelectronicofChineseAcademyofSciences,Beijing100029,China) Abstract:AnanalysisoftWOfamousoscillatorphase—noisemodulesderivestherelationsbetweenphase—noiseandcircuitparameters.Andhence,adesignstrategytooptimizethephasenoiseofVCO, suchasdesigninghighQinductor,adjustingtailcurrentandsizingthedimensionsofnMOSandpMO S,ispre—sented.Attheendofthispaper.a2.4GHzfullyintegratedVCOdesignismentioned.Thesimul ationre—sultdescribesthatthephasenoiseoftheVCOis一120.4dBc/*********************************methodiSvalid.Keywords:integratedLCVCO;noise;phasenoise;phase—lockedloopEEACC:2220;1220差分LCVCO的设计方法满家汉,赵坤(中国科学院微电子研究所,北京100029)摘要:通过分析振荡器的两种典型相位噪声模型,给出了振荡器相位噪声与电路参数的关系.在此基础上,提出了优化VCO相位噪声的设计方法:设计高Q值电感;调整尾电流的大小;调整nMOS管和pMOS管的尺寸.文章最后给出了一个2.4GHz全集成VCO的设计,仿真结果表明在2.4GHz时VCO的相位噪声为一120.4dBc/Hz@600kHz,证明该方法对于VCO的设计具有较好的指导作用.关键词:集成LC压控振荡器;噪声;相位噪声;锁相环中图分类号:TN75文献标识码:A文章编号:1005—9490(2005)04—0809—04近年来,无线通讯技术的迅速发展和无线通讯市场的不断扩大使得射频IC的设计成为微电子领域中的热点.作为射频IC的关键组成部分,压控振荡器(VCO)的设计自然成为了研究的热点,尤其是如何利用CMOS工艺设计实现高性能的集成VCO.相关的研究工作一直在不断进行,近十年来出现了大量的相关文章.其内容包括:片上电感的设计[引,片上可变电容的设计.],设计集成VCOc和振荡器噪声模型分析It-9]等.上述文章大多关注具体的设计问题,对于设计方法的研究则略显不足.本文通过分析振荡器的噪声模型和振荡器内部的非线性因素,结合仿真结果,给出差分集成LCVCO的一种设计方法.1LC振荡器噪声模型的分析振荡器的噪声模型对于振荡器的设计有很大的指导作用.到目前为止,对于振荡器的噪声机理已经进行了大量的研究.在这些噪声模型中,Leeson模型[7],Razavi模型[8和Hajimiri模型[9]是三个比较着名的噪声模型.由于Razavi模型是针对无电感振荡器提出的,因此本文主要讨论Leeson模型和Ha一收稿日期:2005—03—14作者简介:满家汉(1976一),男,河北省深县人,硕士研究生,研究方向为频率综合器的设计,man—****************;赵坤(1977一),男(汉族),河南省安阳人.博士研究生,研究方向为频率综合器的设计和建模.810电子器件第28卷jimiri模型.1.1Leeson模型Leeson模型是一个非常着名的相位噪声模型.考虑图1所示的LC振荡器的等效电路,其中是iX/Af回路中电阻的等效噪声源.,lfl无噪声负tgI'tl卞;中—Ra图lLC振荡嚣的等效电路当电路处于稳定的振荡状态时,整个谐振回路的阻抗为:z[j((U.+A~o)]一一jR'tOo(1)根据振荡器相位噪声的定义,可以得到相位噪声的表达式:cu一1一()由于等式(2)并不能反映1/尸噪声,因此需要修正,得到等式(3)El0]:L(A~o一(+百2FkT).[+(~00㈣其中:a是由闪烁噪声水平决定的一个常数,是过噪声因子.由于没有给出如何减小a和F的具体方法,因此Leeson模型对于设计振荡器的指导作用相对有限.?1.2Hajimiri模型Leeson模型所存在的不足主要源于建模时所假设的条件:即振荡器是LTI系统,这个假设跟实际情况不相符.Hajimiri模型则是建立在时变系统的基础上,因此从最终的结果来看,Hajimiri模型可以更好地反映振荡器相位噪声与电路的关系.Hajimiri模型认为系统是时变的,振荡器的相位噪声来源于噪声的注入.考虑图2所示的LC谐振回路,其中(f)是噪声源.噪声源会随机地在谐振回路中注入噪声,从而改变振荡器的幅度和相位.根据噪声注入时间的不同,噪声对于幅度和相位的作用也不同.如图2(a)所示,当噪声在振幅达到最大值时注入,只改变信号的振幅;如图2(b)所示,当噪声在信号过零点时注入,则只改变信号的相位.对于振荡器来说,在噪声注入时,幅度响应和相位响应存在着很大的不同.由于稳定的振荡器存在着一种限幅机制[9],因此噪声引起的幅度的变化会不断衰减;而噪声所引起的相位变化则保持不变.振荡器对于上述两种情况的响应如图3所示.其中h(￡,r)和h(￡,r)和分别是相位和幅度的冲击响应函数.图2噪声注入对于输出信号的影响圉3振荡器的相位响应和幅度响应由于限幅机制的存在,在实际分析噪声时不再考虑注入电流对幅度的影响,只考虑电流对相位的影响.Hajimiri模型的另一个假设是系统为线性.表面上看,这与振荡器是一个非线性系统相矛盾的现象.实际上,Hajimiri模型真正关心的是注入电流与相位变化之间是否存在线性关系,而并非关心整个系统是否为线性系统.根据文献Eg]的仿真结果,可以验证注入电流与相位变化之间为线性关系.因此前面给出的线性假设是可以被保证的.根据前面的分析可知,振荡器相位的冲击响应是在时刻r发生的阶跃,其表达式如下:矗.(￡,r)一—F(o—J0r)"(￡一r)(4)q一其中:r(z)被称为冲击敏感性函数(ISF).它是一个无量纲,且与频率和幅度无关的周期函数,其周期为2n.q是谐振回路中电容上最大的电荷变化量.根据上面分析,可以得到相位变化的表达式:r∞1r∞6t)一lh(￡,r)(r)dr一二lr((Uor)i(r)drJ一∞qrilttIJ一∞(5)利用傅立叶展开将ISF函数展开,可表示为:r(r)一Co+∑CnCOS((Uor+)(6)—n=—l由等式(5)和(6)可以看出,噪声经过不同的系数C的加权并求和,最后可以得到噪声对于振荡器输出的相位影响.振荡器的输出可以表示为A?COS[cU￡+(￡)],由此可以得到振荡器的相位噪声表达第4期满家汉,赵坤:差分LCVCO的设计方法8ll式:CMOS工乙.患?㈩振荡器的1/尸噪声是由低频的闪烁噪声引起的,用闪烁噪声替代等式(7)中的噪声源,可以得到1/尸区域的相位噪声表达式:熹?一差??c~l/j8图5差分LCVCO的电路原理图图4表示噪声转化为输出信号的相位变化及相3.I片上电感的设计位噪声的过程..:2LCVCO设计的基本原则根据图1所示的振荡器等效电路和前面的定义,可以得到如下关系:Vk—Ibia,/gnk(9)g:C,an]~Vk—Ck坚≈I—bias—QL(10)根据文献[12]的分析,当满足振荡条件时,大部分噪声来自于MOS管,可以近似得到下式::/△/≈_砉-?4kTY(gd.+gpd.)(11)g~,uC.()将等式(11)(12)代人等式(7),近似得到关系:.【一VmJ(13)根据上面分析可以得到以下结论:①增大尾电流(即增大幅度),可以显着的改善相位噪声.②增大QL值,可以改善相位噪声.③减小MOS管的宽,可以改善1/尸噪声.MOS器件的闪烁噪声的表达式如下n]:=g.cWCo~WL(14):==——g-吣∞l4'其中:K是一个与工艺有关的常量由上式可以看出,减小MOS管的宽可以使闪烁噪声下降,从而使1/尸噪声下降.3LCVCo的设计流程由于采用互补结构的差分LCVCO具有较好的相噪特性,因此本文选取图5所示的结构作为分析的对象.差分LCVCO的设计采用0.25m1P5M电感的大小会影响其它电路参数的取值,因此必须先确定电感的数值.片上电感的数值完全由物理尺寸决定.调整片上电感的尺寸(包括内径,圈数, 线宽,线间距和厚度)使其达到所需的电感值.在调整这些物理尺寸时,需要注意以下两种效应:①电流的趋肤效应;②涡漩电流效应.根据趋肤效应,高频电流只从一定厚度的表层金属流过.等式(15)给出了频率与所需金属厚度的关系(式中:是金属的电导率):一√(15)金属过厚,并不能有效的提高电感的Q值.根据涡漩电流效应,片上电感需要做成中空的,以减少损耗.在实际设计时,可以利用电感设计工具A—SITIC[2计算不同电感的电感值和Q值.由于电感的Q值在很大程度上影响了VCO的相位噪声特性,因此需要仔细设计,使其在VCO的中心频率处达到最大Q值.3.2可变电容的设计在当前CMOS工艺条件下,主要利用PN结和变容MOS管实现可变电容.PN结可变电容的调节范围较小,而变容MOS管的调节范围较大.在具体设计中,根据可变电容的变化范围来确定变容器件的实现方法.根据中心频率,电感值和频率调节范围,利用下面的不等式确定可变电容的变化范围.1Ck.≤—(16)btankcumx1Ck.≥—(17)ntankcu商"3.3尾电流的设计根据前面的分析,增大尾电流可以增加输出信号的摆幅,减小振荡器的相位噪声.但实际上由于受到电源的限制,输出幅度不可能一直保持线性增大. 根据文献[12],振荡器的幅度变化范围存在两个区域:电流受限区域和电压受限区域.当输出摆幅较小时,输出摆幅与尾电流呈线性关系;当输出摆幅足够大时,输出幅度的增长受到电源电压和MOS管的812电子器件第28卷影响而被限制.当电源电压为2.5V时,通过仿真得到输出幅度和相位噪声随尾电流的变化关系,分别如图6和图7所示.之馨班邕掣-Iu.1曲.】设銎-I蔓'I.1-l图6输出幅度与尾电流的关系图7相住噪声和尾电流的关系由图6和图7可以看出,当处于电流受限区域时,相位噪声随着尾电流的增加而迅速改善;当处于电压受限区域时,尾电流的增加对于相位噪声的改善不明显.这主要有两个原因:①进入电压受限区域后,信号增大的幅度有限;②过大的尾电流导致噪声的增加.另外,过大的输出幅度会使提供尾电流的MOS管进入线性区,这时电流源会失去对电源噪声的隔离作用,从而使VCO的噪声特性进一步恶化.综合考虑相位噪声,功耗和电源噪声这些因素,在设计VCO时尾电流并非越大越好.根据图6和图7的仿真结果,在本设计中,当尾电流值为3mA～4 ITIA时,VCO达到最佳性能.3.4MOS管的设计图5所示的差分LCVCO的振荡条件是:g一gk(18)考虑振荡器的启振条件,必须满足下面的不等式:g≥ag础(19)其中系数a一般取2到3.为了确保电路可以正常工作,g必须足够大.但是根据前面的分析,当g增大时,噪声也会随之变大.在设计时必须对MOS管尺寸的选择进行权衡.4LCVCO的设计本文的设计目标是实现一个2.4OHz的集成LCVCO.设计采用0.25mCMOS工艺,电源电压为2.5V.根据上面的分析,权衡功耗和相位噪声指标,选择尾电流为4mA.图8为最终的版图.提取版图寄生参数进行后仿真,得到以下(表1)的结果:裹12.4GHzVCO后仿真结果相位噪声一120.4dBe/Hz@600kHz振荡频率2.4GHz功耗i0.5mW5小结本文通过分析振荡器的噪声模型,给出了振荡图8VCO版图器相位噪声与电路参数之间的关系.在此基础上提出了一种有效的设计方法,简化了VCO的设计.最后利用文章中提出的方法,设计出一个具有较高性能的2.4GHz集成LCVCO.参考文献:[1]CraninckxJandSteyaertM.A1.8-GHzlow--phase—noise CMOSVCOusingoptimizedhollowspiralinductors[J].IEEE JSolid—StateCircuits.Mayl997.32t736-744.[2]Niknejad.Analysis,Simulation,andApplicationsofPassive DevicesonConductiveSubstractes[,D].PhDthesis.Universi—tyofCaliforniaatBerkeley,2000.[3]MagetJ,TieboutM,KrausR,MOSV aractorsWithn?andp-TypeGatesandTheirInfluenceonanLC—VCOinDigital CMOS[J].IEEEJSolid—StateCircuits,July2000,38:l139一ll47.[4]AndreaniPtMattissonStOntheUseofMOSV aractorsin RFVCO's[J].IEEEJ.Solid—StateCircuits,June2000,35: 905—9l0.[5]HungCandKennethKO,Apackaged1.卜GHzCMOSVCO withphasenoiseof126dBe/Hzata600-kHzoffset[J]. 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一.模具加工方法英语词汇barrel 滚筒(加工)bending 波纹加工broaching 拉刀切削centering 定中心cutting 切削cylindrical lathe cutting 外圆车削electric discharge machine 放电加工electrolytic grinding 电解研磨embossing 压花加工facing 面车削filing 锉刀修润hand finishing 手工修润hemming 卷边加工hobbing 滚齿加工joggling 摇动加工lapping 抛光/研磨修润laser beam machining 雷射加工lathe cutting 车床车削planning 刨削加工polishing 抛亮光reaming 铰孔修润rough machining 粗切削rounding 圆形加工sawing 锯削scaling 去除钢碇缺陷shaping 成形加工skiving 外表研磨 slotting 切缝切削taper turning 锥度车削thread cutting 螺纹切削ultrasonic machining 超音波加工up cut milling 逆铣加工二.模具砂轮用语英语词汇abrasive 砂轮Al2O3 氧化铝borazon 氧化硼立方晶buffing wheel 抛光布轮diamond 钻石dresser 砂轮整修机dressing 修整endless grinding belt 循环式研磨带finishing allowance 加工余量grain 磨粒grinding disc 研磨盘jamp up 孔眼堵塞mesh 网筛目resinoid grinding wheel 半树脂型砂轮 slitting 切缝量vitrified 陶瓷的三.模具锻铸造相关英语词汇accretion 炉瘤acid converter 酸性转炉acid lining cupola 酸性熔铁炉acid open-hearth furnace 酸性平炉aerator 松砂机air set mold 常温自硬铸模airless blasting cleaning 离心喷光all core molding 集合式铸模all round die holder 通用模座assembly mark 铸造合模记号back pouring 补浇注backing sand 背砂base bullion 粗金属锭base permeability 原砂透气度belling 压凸billet 坏料bleed 漏铸blocker 预锻模膛blocking 粗胚锻件blow hole 铸件气孔board drop hammer 板落锤bottom pour mold 底浇bottom pouring 底注boxless mold 脱箱砂模break-off core 缩颈砂心brick molding 砌箱造模法buckle 剥砂面camber 错箱camlachie cramp 铸包cast blade 铸造叶片casting flange 铸造凸缘casting on flat 水平铸造chamotte sand 烧磨砂charging hopper 加料漏斗cleaning of casting 铸件清理closed-die forging 合模锻造core pound 砂心黏结剂core template 砂心模板core vent 砂蕊排气孔corner gate 压边浇口counter blow hammer 对击锻造counter lock 止口镶嵌方式depression 外缩凹孔die approach 模口角度draw out 锻造拔长draw plate 起模板draw spike 起模长针dummying 预锻embedded core 加装砂心erosion 冲砂fettling 铸件清理filling core 埋入砂心filling in 填砂film play 液面花纹finishing slag 炼後熔渣flash gutter 锻模飞边槽flask molding 砂箱造模forging roll 辊锻机formboard 进模口板gutter 锻模飞边槽hammer man 锻工heading machine 顶镦机impacter 卧式锻造机inblock cast 整体铸造ingot 铸锭ingot blank 铸坯inlay casting 镶铸法investment casting 失模铸造isothermal forging 恒温锻造loose piece 木模活块molding pit 铸模地坑pouring process 浇注法recasting 重铸roll forging 轧锻rolled surface 轧制外表rough sand 粗砂roughing forge 粗锻sand crushing 塌箱seamless forging 无缝锻造separate 别离shave 崩砂shrinkage fit 收缩配合shut height 闭合高度sieve mesh 筛孔sintering of sand 铸砂烧贴slag 熔渣slag inclusion 夹渣stickness 黏模性strip layout 带状胚料排样法tap casting 顶注top gate 顶注浇口unworked casting 不加工铸件upender 翻转装置upending 顶锻uphill casting 底铸white cast iron 白口铸件四.模具线切割放电加工相关英语词汇abnormal glow 不规那么辉光放电arc discharge 电弧放电belt 皮带centreless 无心chrome bronze 铭铜clearance angle 後角corner shear drop 直角压陷deflection 桡曲度discharge energy 放电能量dressing 修整dwell 保压flange 凸缘gap 间隙graphite 石墨graphite contraction allowance 电极缩小余量graphite holder 电极夹座hair crack 发裂horn 电极臂jump 跳刀magnetic base 磁性座master graphite 标准电极pipe graphite 管状电极pulse 脉冲rib working 肋部加工roller electrode 滚轮式电极rotary surface 旋转面shank 柄部sharp edge 锐角部tough bronze 韧铜traverse 摇臂tungsten bronze 钨青铜waviness 波形起伏working allowance 加工余量working dischard 加工废料五.模具冲压机械与周边英语词汇back shaft 支撑轴blank determination 胚料展开bottom slide press 下传动式压力机board drop hammer 板落锤brake 煞车 buckle 剥砂面camlachie cramp 铸包chamotte sand 烧磨砂charging hopper 加料漏斗clearance 间隙closed-die forging 合模锻造clump 夹紧clutch 离合器clutch brake 离合器制动器clutch boss 离合器轮壳clutch lining 离合器覆盖coil car 带卷升降运输机coil cradle 卷材进料装置coil reel stand 钢材卷料架column 圆柱connection screw 连杆调节螺钉core pound 砂心黏结剂counter blow hammer 对击锻锤cradle 送料架crank 曲柄轴crankless 无曲柄式cross crank 横向曲轴cushion 缓冲depression 外缩凹孔dial feed 分度送料die approach 模口角度die assembly 合模die cushion 模具缓冲垫die height 冲压闭合高度die life 模具寿命die opening 母模逃孔die spotting press 调整冲模用压力机double crank press 双曲柄轴冲床draght angle 逃料倾斜角edging 边锻伸embedded core 加装砂心feed length 送料长度feed level 送料高度filling core 埋入砂心filling in 填砂film play 液面花纹fine blanking press 精细下料冲床forging roll 辊锻机finishing slag 炼後熔渣fly wheel 飞轮fly wheel brake 飞轮制动器foot press 脚踏冲床formboard 进模口板frame 床身机架friction 摩擦friction brake 摩擦煞车gap shear 凹口剪床gear 齿轮gib 滑块引导部gripper 夹具gripper feed 夹持进料gripper feeder 夹紧传送装置hammer 槌机hand press 手动冲床hand rack pinion press 手动齿轮齿条式冲床hand screw press 手动螺旋式冲床hopper feed 料斗送料idle stage 空站inching 微调尺寸isothermal forging 恒温锻造key clutch 键槽离合器knockout 脱模装置knuckle mechanic 转向机构land 模具直线刀面部loader 供料器 unloader 卸料机loop controller 闭回路控制器lower die 下模micro inching device 微寸动装置microinching equipment 微动装置moving bolster 活动工作台notching press 冲缺口压力机opening 排料逃孔overload protection device 防超载装置pinch roll 导正滚轮pinion 小齿轮pitch 节距pressfit 压入progressive 连续送料pusher feed 推杆式送料pusher feeder 料片押片装置quick die change system 快速换模系统regrinding 再次研磨releasing 松释动作reversed blanking 反转下料robot 机器人roll forming machine 辊轧成形roll forming machine 辊轧成形机roll release 脱辊roller feed 辊式送料roller leveler 辊式矫直机rotary bender 卷弯成形机safety guard 安全保护装置scrap cutter 废料切刀scrap press 废料冲床seamless forging 无缝锻造shave 崩砂shear angle 剪角sheet loader 薄板装料机shot 单行程工作shrinkage fit 收缩配合shut height 闭合高度sieve mesh 筛孔sintering of sand 铸砂烧贴slide balancer 滑动平衡器slug hole 逃料孔spin forming machine 旋压成形机spotting 合模stack feeder 堆叠拨送料机stickness 黏模性straight side frame 冲床侧板stretcher leveler 拉伸矫直机strip feeder 料材送料装置stripping pressure 弹出压力stroke 冲程take out device 取料装置toggle press 肘杆式压力机transfer feed 连续自动送料装置turrent punch press 转塔冲床two speed clutch 双速离合器uncoiler 闭卷送料机unloader 卸载机vibration feeder 振动送料机wiring press 嵌线卷边机六.模具冲模加工英语词汇barreling 滚光加工belling 压凸加工bending 弯曲加工blanking 下料加工bulging 撑压加工burring 冲缘加工cam die bending 凸轮弯曲加工coining 压印加工pressing 压缩加工pression bending 押弯曲加工crowning 凸面加工curl bending 卷边弯曲加工curling 卷曲加工cutting 切削加工dinking 切断蕊骨double shearing 叠板裁断drawing 引伸加工drawing with ironing 抽引光滑加工embossing 浮花压制加工extrusion 挤制加工filing 锉削加工fine blanking 精细下料加工finish blanking 光制下料加工finishing 精整加工flanging 凸缘加工folding 折边弯曲加工folding 摺叠加工forming 成形加工impact extrusion 冲击挤压加工indenting 压痕加工ironing 引缩加工knurling 滚花lock seaming 固定接合louvering 百叶窗板加工marking 刻印加工necking 颈缩加工notching 冲口加工parting 分断加工piercing 冲孔加工progressive bending 连续弯曲加工progressive blanking 连续下料加工progressive drawing 连续引伸加工progressive forming 连续成形加工reaming 铰孔加工restriking 二次精冲加工riveting 铆接加工roll bending 滚筒弯曲加工roll finishing 滚压加工rolling 压延加工roughing 粗加工scrapless machining 无废料加工seaming 折弯重叠加工shaving 缺口修整加工shearing 切断加工sizing 精压加工/矫正加工slitting 割缝加工spinning 卷边?接stamping 锻压加工swaging 挤锻压加工trimming 整缘加工upsetting 锻粗加工wiring 抽线加工七.模具常用刀具工作法英语词汇adjustable spanner 活动扳手angle cutter 角铣刀arbour 心轴backing 衬垫belt sander 带式打磨机buffing 抛光chamfering machine 倒角机chamfering tool 去角刀具chisel 扁錾chuck 夹具pass 两角规concave cutter 凹面铣刀convex cutter 凸形铣刀cross joint 十字接头cutting edge clearance 刃口余隙角drill stand 钻台edge file 刃用锉刀file 锉刀flange joint 凸缘接头grinder 砂轮机hammer 铁锤hand brace 手摇钻hatching 剖面线hexagon headed bolt 六角头螺栓hexagon nut 六角螺帽index head 分度头jack 千斤顶jig 治具kit 工具箱lapping 研磨metal saw 金工锯nose angle 刀角pinchers 钳子pliers 铗钳 plug 柱塞头polisher 磨光器protable driller 手提钻孔机punch 冲头sand paper 砂纸scraper 刮刀screw driver 螺丝起子scribing 划线second out file 中纹锉spanner 扳手spline broach 方栓槽拉刀square 直角尺square sleeker 方形镘刀square trowel 直角度stripping 剥离工具T-slot T形槽tool for lathe 车刀tool point angle 刀刃角tool post 刀架tosecan 划线盘trimming 去毛边waffle die flattening 压纹效平wiper 脱模钳wrench 螺旋扳手八.模具外表处理英语词汇age hardening 时效硬化ageing 老化处理air hardening 气体硬化air patenting 空气韧化annealing 退火anode effect 阳极效应anodizing 阳极氧化处理atomloy treatment 阿托木洛伊外表austempering 奥氏体等温淬火austenite 奥斯田体/奥氏体bainite 贝氏体banded structure 条纹状组织barrel plating 滚镀barrel tumbling 滚筒打光blackening 染黑法blue shortness 青熟脆性bonderizing 磷酸盐皮膜处理box annealing 箱型退火box carburizing 封箱渗碳bright electroplating 辉面电镀bright heat treatment 光辉热处理bypass heat treatment 旁路热处理carbide 炭化物carburized case depth 浸碳硬化深层carburizing 渗碳cementite 炭化铁chemical plating 化学电镀chemical vapor deposition 化学蒸镀coarsening 结晶粒粗大化coating 涂布被覆cold shortness 低温脆性emtite 渗碳体controlled atmosphere 大气热处理corner effect 锐角效应creeping discharge 蠕缓放电decarburization 脱碳处理decarburizing 脱碳退火depth of hardening 硬化深层diffusion 扩散diffusion annealing 扩散退火electrolytic hardening 电解淬火embossing 压花etching 外表蚀刻ferrite 肥粒铁first stage annealing 第一段退火flame hardening 火焰硬化flame treatment 火焰处理full annealing 完全退火gaseous cyaniding 气体氧化法globular cementite 球状炭化铁grain size 结晶粒度granolite treatment 磷酸溶液热处理graphitizing 石墨退火。