【CN110049260A】双转换增益高动态范围图像传感器读出电路存储器存储结构【专利】

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NuMicro®FamilyArm® ARM926EJ-S BasedNuMaker-HMI-N9H30User ManualEvaluation Board for NuMicro® N9H30 SeriesNUMAKER-HMI-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (5)1.1Features (7)1.1.1NuMaker-N9H30 Main Board Features (7)1.1.2NuDesign-TFT-LCD7 Extension Board Features (7)1.2Supporting Resources (8)2NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION (9)2.1NuMaker-N9H30 Board － Front View (9)2.2NuMaker-N9H30 Board － Rear View (14)2.3NuDesign-TFT-LCD7 － Front View (20)2.4NuDesign-TFT-LCD7 － Rear View (21)2.5NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB Placement (22)3NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS (24)3.1NuMaker-N9H30 － GPIO List Circuit (24)3.2NuMaker-N9H30 － System Block Circuit (25)3.3NuMaker-N9H30 － Power Circuit (26)3.4NuMaker-N9H30 － N9H30F61IEC Circuit (27)3.5NuMaker-N9H30 － Setting, ICE, RS-232_0, Key Circuit (28)NUMAKER-HMI-N9H30 USER MANUAL3.6NuMaker-N9H30 － Memory Circuit (29)3.7NuMaker-N9H30 － I2S, I2C_0, RS-485_6 Circuit (30)3.8NuMaker-N9H30 － RS-232_2 Circuit (31)3.9NuMaker-N9H30 － LCD Circuit (32)3.10NuMaker-N9H30 － CMOS Sensor, I2C_1, CAN_0 Circuit (33)3.11NuMaker-N9H30 － RMII_0_PF Circuit (34)3.12NuMaker-N9H30 － RMII_1_PE Circuit (35)3.13NuMaker-N9H30 － USB Circuit (36)3.14NuDesign-TFT-LCD7 － TFT-LCD7 Circuit (37)4REVISION HISTORY (38)List of FiguresFigure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation Board (5)Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board (6)Figure 2-1 Front View of NuMaker-N9H30 Board (9)Figure 2-2 Rear View of NuMaker-N9H30 Board (14)Figure 2-3 Front View of NuDesign-TFT-LCD7 Board (20)Figure 2-4 Rear View of NuDesign-TFT-LCD7 Board (21)Figure 2-5 Front View of NuMaker-N9H30 PCB Placement (22)Figure 2-6 Rear View of NuMaker-N9H30 PCB Placement (22)Figure 2-7 Front View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 3-1 GPIO List Circuit (24)Figure 3-2 System Block Circuit (25)Figure 3-3 Power Circuit (26)Figure 3-4 N9H30F61IEC Circuit (27)Figure 3-5 Setting, ICE, RS-232_0, Key Circuit (28)Figure 3-6 Memory Circuit (29)Figure 3-7 I2S, I2C_0, RS-486_6 Circuit (30)Figure 3-8 RS-232_2 Circuit (31)Figure 3-9 LCD Circuit (32)NUMAKER-HMI-N9H30 USER MANUAL Figure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit (33)Figure 3-11 RMII_0_PF Circuit (34)Figure 3-12 RMII_1_PE Circuit (35)Figure 3-13 USB Circuit (36)Figure 3-14 TFT-LCD7 Circuit (37)List of TablesTable 2-1 LCD Panel Combination Connector (CON8) Pin Function (11)Table 2-2 Three Sets of Indication LED Functions (12)Table 2-3 Six Sets of User SW, Key Matrix Functions (12)Table 2-4 CMOS Sensor Connector (CON10) Function (13)Table 2-5 JTAG ICE Interface (J2) Function (14)Table 2-6 Expand Port (CON7) Function (16)Table 2-7 UART0 (J3) Function (16)Table 2-8 UART2 (J6) Function (16)Table 2-9 RS-485_6 (SW6~8) Function (17)Table 2-10 Power on Setting (SW4) Function (17)Table 2-11 Power on Setting (S2) Function (17)Table 2-12 Power on Setting (S3) Function (17)Table 2-13 Power on Setting (S4) Function (17)Table 2-14 Power on Setting (S5) Function (17)Table 2-15 Power on Setting (S7/S6) Function (18)Table 2-16 Power on Setting (S9/S8) Function (18)Table 2-17 CMOS Sensor Connector (CON9) Function (19)Table 2-18 CAN_0 (SW9~10) Function (19)NUMAKER-HMI-N9H30 USER MANUAL1 OVERVIEWThe NuMaker-HMI-N9H30 is an evaluation board for GUI application development. The NuMaker-HMI-N9H30 consists of two parts: a NuMaker-N9H30 main board and a NuDesign-TFT-LCD7 extensionboard. The NuMaker-HMI-N9H30 is designed for project evaluation, prototype development andvalidation with HMI (Human Machine Interface) function.The NuMaker-HMI-N9H30 integrates touchscreen display, voice input/output, rich serial port serviceand I/O interface, providing multiple external storage methods.The NuDesign-TFT-LCD7 can be plugged into the main board via the DIN_32x2 extension connector.The NuDesign-TFT-LCD7 includes one 7” LCD which the resolution is 800x480 with RGB-24bits andembedded the 4-wires resistive type touch panel.Figure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation BoardNUMAKER-HMI-N9H30 USER MANUAL Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board1.1 Features1.1.1 NuMaker-N9H30 Main Board Features●N9H30F61IEC chip: LQFP216 pin MCP package with DDR (64 MB)●SPI Flash using W25Q256JVEQ (32 MB) booting with quad mode or storage memory●NAND Flash using W29N01HVSINA (128 MB) booting or storage memory●One Micro-SD/TF card slot served either as a SD memory card for data storage or SDIO(Wi-Fi) device●Two sets of COM ports:–One DB9 RS-232 port with UART_0 used 75C3232E transceiver chip can be servedfor function debug and system development.–One DB9 RS-232 port with UART_2 used 75C3232E transceiver chip for userapplication●22 GPIO expansion ports, including seven sets of UART functions●JTAG interface provided for software development●Microphone input and Earphone/Speaker output with 24-bit stereo audio codec(NAU88C22) for I2S interfaces●Six sets of user-configurable push button keys●Three sets of LEDs for status indication●Provides SN65HVD230 transceiver chip for CAN bus communication●Provides MAX3485 transceiver chip for RS-485 device connection●One buzzer device for program applicationNUMAKER-HMI-N9H30 USER MANUAL●Two sets of RJ45 ports with Ethernet 10/100 Mbps MAC used IP101GR PHY chip●USB_0 that can be used as Device/HOST and USB_1 that can be used as HOSTsupports pen drives, keyboards, mouse and printers●Provides over-voltage and over current protection used APL3211A chip●Retain RTC battery socket for CR2032 type and ADC0 detect battery voltage●System power could be supplied by DC-5V adaptor or USB VBUS1.1.2 NuDesign-TFT-LCD7 Extension Board Features●7” resolution 800x480 4-wire resistive touch panel for 24-bits RGB888 interface●DIN_32x2 extension connector1.2 Supporting ResourcesFor sample codes and introduction about NuMaker-N9H30, please refer to N9H30 BSP:https:///products/gui-solution/gui-platform/numaker-hmi-n9h30/?group=Software&tab=2Visit NuForum for further discussion about the NuMaker-HMI-N9H30:/viewforum.php?f=31 NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUAL2 NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION2.1 NuMaker-N9H30 Board － Front View Combination Connector (CON8)6 set User SWs (K1~6)3set Indication LEDs (LED1~3)Power Supply Switch (SW_POWER1)Audio Codec(U10)Microphone(M1)NAND Flash(U9)RS-232 Transceiver(U6, U12)RS-485 Transceiver(U11)CAN Transceiver (U13)Figure 2-1 Front View of NuMaker-N9H30 BoardFigure 2-1 shows the main components and connectors from the front side of NuMaker-N9H30 board. The following lists components and connectors from the front view:NuMaker-N9H30 board and NuDesign-TFT-LCD7 board combination connector (CON8). This panel connector supports 4-/5-wire resistive touch or capacitance touch panel for 24-bits RGB888 interface.Connector GPIO pin of N9H30 FunctionCON8.1 - Power 3.3VCON8.2 - Power 3.3VCON8.3 GPD7 LCD_CSCON8.4 GPH3 LCD_BLENCON8.5 GPG9 LCD_DENCON8.7 GPG7 LCD_HSYNCCON8.8 GPG6 LCD_CLKCON8.9 GPD15 LCD_D23(R7)CON8.10 GPD14 LCD_D22(R6)CON8.11 GPD13 LCD_D21(R5)CON8.12 GPD12 LCD_D20(R4)CON8.13 GPD11 LCD_D19(R3)CON8.14 GPD10 LCD_D18(R2)CON8.15 GPD9 LCD_D17(R1)CON8.16 GPD8 LCD_D16(R0)CON8.17 GPA15 LCD_D15(G7)CON8.18 GPA14 LCD_D14(G6)CON8.19 GPA13 LCD_D13(G5)CON8.20 GPA12 LCD_D12(G4)CON8.21 GPA11 LCD_D11(G3)CON8.22 GPA10 LCD_D10(G2)CON8.23 GPA9 LCD_D9(G1) NUMAKER-HMI-N9H30 USER MANUALCON8.24 GPA8 LCD_D8(G0)CON8.25 GPA7 LCD_D7(B7)CON8.26 GPA6 LCD_D6(B6)CON8.27 GPA5 LCD_D5(B5)CON8.28 GPA4 LCD_D4(B4)CON8.29 GPA3 LCD_D3(B3)CON8.30 GPA2 LCD_D2(B2)CON8.31 GPA1 LCD_D1(B1)CON8.32 GPA0 LCD_D0(B0)CON8.33 - -CON8.34 - -CON8.35 - -CON8.36 - -CON8.37 GPB2 LCD_PWMCON8.39 - VSSCON8.40 - VSSCON8.41 ADC7 XPCON8.42 ADC3 VsenCON8.43 ADC6 XMCON8.44 ADC4 YMCON8.45 - -CON8.46 ADC5 YPCON8.47 - VSSCON8.48 - VSSCON8.49 GPG0 I2C0_CCON8.50 GPG1 I2C0_DCON8.51 GPG5 TOUCH_INTCON8.52 - -CON8.53 - -CON8.54 - -CON8.55 - -NUMAKER-HMI-N9H30 USER MANUAL CON8.56 - -CON8.57 - -CON8.58 - -CON8.59 - VSSCON8.60 - VSSCON8.61 - -CON8.62 - -CON8.63 - Power 5VCON8.64 - Power 5VTable 2-1 LCD Panel Combination Connector (CON8) Pin Function●Power supply switch (SW_POWER1): System will be powered on if the SW_POWER1button is pressed●Three sets of indication LEDs:LED Color DescriptionsLED1 Red The system power will beterminated and LED1 lightingwhen the input voltage exceeds5.7V or the current exceeds 2A.LED2 Green Power normal state.LED3 Green Controlled by GPH2 pin Table 2-2 Three Sets of Indication LED Functions●Six sets of user SW, Key Matrix for user definitionKey GPIO pin of N9H30 FunctionK1 GPF10 Row0 GPB4 Col0K2 GPF10 Row0 GPB5 Col1K3 GPE15 Row1 GPB4 Col0K4 GPE15 Row1 GPB5 Col1K5 GPE14 Row2 GPB4 Col0K6GPE14 Row2GPB5 Col1 Table 2-3 Six Sets of User SW, Key Matrix Functions●NAND Flash (128 MB) with Winbond W29N01HVS1NA (U9)●Microphone (M1): Through Nuvoton NAU88C22 chip sound input●Audio CODEC chip (U10): Nuvoton NAU88C22 chip connected to N9H30 using I2Sinterface–SW6/SW7/SW8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5and J5)–SW6/SW7/SW8: 2-3 short for I2S function and connected to NAU88C22 (U10).●CMOS Sensor connector (CON10, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11)–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON10)Connector GPIO pin of N9H30 FunctionCON10.1 - VSSCON10.2 - VSSNUMAKER-HMI-N9H30 USER MANUALCON10.3 - Power 3.3VCON10.4 - Power 3.3VCON10.5 - -CON10.6 - -CON10.7 GPI4 S_PCLKCON10.8 GPI3 S_CLKCON10.9 GPI8 S_D0CON10.10 GPI9 S_D1CON10.11 GPI10 S_D2CON10.12 GPI11 S_D3CON10.13 GPI12 S_D4CON10.14 GPI13 S_D5CON10.15 GPI14 S_D6CON10.16 GPI15 S_D7CON10.17 GPI6 S_VSYNCCON10.18 GPI5 S_HSYNCCON10.19 GPI0 S_PWDNNUMAKER-HMI-N9H30 USER MANUAL CON10.20 GPI7 S_nRSTCON10.21 GPG2 I2C1_CCON10.22 GPG3 I2C1_DCON10.23 - VSSCON10.24 - VSSTable 2-4 CMOS Sensor Connector (CON10) FunctionNUMAKER-HMI-N9H30 USER MANUAL2.2NuMaker-N9H30 Board － Rear View5V In (CON1)RS-232 DB9 (CON2,CON6)Expand Port (CON7)Speaker Output (J4)Earphone Output (CON4)Buzzer (BZ1)System ResetSW (SW5)SPI Flash (U7,U8)JTAG ICE (J2)Power ProtectionIC (U1)N9H30F61IEC (U5)Micro SD Slot (CON3)RJ45 (CON12, CON13)USB1 HOST (CON15)USB0 Device/Host (CON14)CAN_0 Terminal (CON11)CMOS Sensor Connector (CON9)Power On Setting(SW4, S2~S9)RS-485_6 Terminal (CON5)RTC Battery(BT1)RMII PHY (U14,U16)Figure 2-2 Rear View of NuMaker-N9H30 BoardFigure 2-2 shows the main components and connectors from the rear side of NuMaker-N9H30 board. The following lists components and connectors from the rear view:● +5V In (CON1): Power adaptor 5V input ●JTAG ICE interface (J2) ConnectorGPIO pin of N9H30Function J2.1 - Power 3.3V J2.2 GPJ4 nTRST J2.3 GPJ2 TDI J2.4 GPJ1 TMS J2.5 GPJ0 TCK J2.6 - VSS J2.7 GPJ3 TD0 J2.8-RESETTable 2-5 JTAG ICE Interface (J2) Function●SPI Flash (32 MB) with Winbond W25Q256JVEQ (U7); only one (U7 or U8) SPI Flashcan be used●System Reset (SW5): System will be reset if the SW5 button is pressed●Buzzer (BZ1): Control by GPB3 pin of N9H30●Speaker output (J4): Through the NAU88C22 chip sound output●Earphone output (CON4): Through the NAU88C22 chip sound output●Expand port for user use (CON7):Connector GPIO pin of N9H30 FunctionCON7.1 - Power 3.3VCON7.2 - Power 3.3VCON7.3 GPE12 UART3_TXDCON7.4 GPH4 UART1_TXDCON7.5 GPE13 UART3_RXDCON7.6 GPH5 UART1_RXDCON7.7 GPB0 UART5_TXDCON7.8 GPH6 UART1_RTSCON7.9 GPB1 UART5_RXDCON7.10 GPH7 UART1_CTSCON7.11 GPI1 UART7_TXDNUMAKER-HMI-N9H30 USER MANUAL CON7.12 GPH8 UART4_TXDCON7.13 GPI2 UART7_RXDCON7.14 GPH9 UART4_RXDCON7.15 - -CON7.16 GPH10 UART4_RTSCON7.17 - -CON7.18 GPH11 UART4_CTSCON7.19 - VSSCON7.20 - VSSCON7.21 GPB12 UART10_TXDCON7.22 GPH12 UART8_TXDCON7.23 GPB13 UART10_RXDCON7.24 GPH13 UART8_RXDCON7.25 GPB14 UART10_RTSCON7.26 GPH14 UART8_RTSCON7.27 GPB15 UART10_CTSCON7.28 GPH15 UART8_CTSCON7.29 - Power 5VCON7.30 - Power 5VTable 2-6 Expand Port (CON7) Function●UART0 selection (CON2, J3):–RS-232_0 function and connected to DB9 female (CON2) for debug message output.–GPE0/GPE1 connected to 2P terminal (J3).Connector GPIO pin of N9H30 Function J3.1 GPE1 UART0_RXDJ3.2 GPE0 UART0_TXDTable 2-7 UART0 (J3) Function●UART2 selection (CON6, J6):–RS-232_2 function and connected to DB9 female (CON6) for debug message output –GPF11~14 connected to 4P terminal (J6)Connector GPIO pin of N9H30 Function J6.1 GPF11 UART2_TXDJ6.2 GPF12 UART2_RXDJ6.3 GPF13 UART2_RTSJ6.4 GPF14 UART2_CTSTable 2-8 UART2 (J6) Function●RS-485_6 selection (CON5, J5, SW6~8):–SW6~8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5 and J5) –SW6~8: 2-3 short for I2S function and connected to NAU88C22 (U10)Connector GPIO pin of N9H30 FunctionSW6:1-2 shortGPG11 RS-485_6_DISW6:2-3 short I2S_DOSW7:1-2 shortGPG12 RS-485_6_ROSW7:2-3 short I2S_DISW8:1-2 shortGPG13 RS-485_6_ENBSW8:2-3 short I2S_BCLKNUMAKER-HMI-N9H30 USER MANUALTable 2-9 RS-485_6 (SW6~8) FunctionPower on setting (SW4, S2~9).SW State FunctionSW4.2/SW4.1 ON/ON Boot from USB SW4.2/SW4.1 ON/OFF Boot from eMMC SW4.2/SW4.1 OFF/ON Boot from NAND Flash SW4.2/SW4.1 OFF/OFF Boot from SPI Flash Table 2-10 Power on Setting (SW4) FunctionSW State FunctionS2 Short System clock from 12MHzcrystalS2 Open System clock from UPLL output Table 2-11 Power on Setting (S2) FunctionSW State FunctionS3 Short Watchdog Timer OFFS3 Open Watchdog Timer ON Table 2-12 Power on Setting (S3) FunctionSW State FunctionS4 Short GPJ[4:0] used as GPIO pinS4Open GPJ[4:0] used as JTAG ICEinterfaceTable 2-13 Power on Setting (S4) FunctionSW State FunctionS5 Short UART0 debug message ONS5 Open UART0 debug message OFFTable 2-14 Power on Setting (S5) FunctionSW State FunctionS7/S6 Short/Short NAND Flash page size 2KBS7/S6 Short/Open NAND Flash page size 4KBS7/S6 Open/Short NAND Flash page size 8KBNUMAKER-HMI-N9H30 USER MANUALS7/S6 Open/Open IgnoreTable 2-15 Power on Setting (S7/S6) FunctionSW State FunctionS9/S8 Short/Short NAND Flash ECC type BCH T12S9/S8 Short/Open NAND Flash ECC type BCH T15S9/S8 Open/Short NAND Flash ECC type BCH T24S9/S8 Open/Open IgnoreTable 2-16 Power on Setting (S9/S8) FunctionCMOS Sensor connector (CON9, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11).–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON9).Connector GPIO pin of N9H30 FunctionCON9.1 - VSSCON9.2 - VSSCON9.3 - Power 3.3VCON9.4 - Power 3.3V NUMAKER-HMI-N9H30 USER MANUALCON9.5 - -CON9.6 - -CON9.7 GPI4 S_PCLKCON9.8 GPI3 S_CLKCON9.9 GPI8 S_D0CON9.10 GPI9 S_D1CON9.11 GPI10 S_D2CON9.12 GPI11 S_D3CON9.13 GPI12 S_D4CON9.14 GPI13 S_D5CON9.15 GPI14 S_D6CON9.16 GPI15 S_D7CON9.17 GPI6 S_VSYNCCON9.18 GPI5 S_HSYNCCON9.19 GPI0 S_PWDNCON9.20 GPI7 S_nRSTCON9.21 GPG2 I2C1_CCON9.22 GPG3 I2C1_DCON9.23 - VSSCON9.24 - VSSTable 2-17 CMOS Sensor Connector (CON9) Function●CAN_0 Selection (CON11, SW9~10):–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11) –SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensor connector (CON9, CON10)SW GPIO pin of N9H30 FunctionSW9:1-2 shortGPI3 CAN_0_RXDSW9:2-3 short S_CLKSW10:1-2 shortGPI4 CAN_0_TXDSW10:2-3 short S_PCLKTable 2-18 CAN_0 (SW9~10) Function●USB0 Device/HOST Micro-AB connector (CON14), where CON14 pin4 ID=1 is Device,ID=0 is HOST●USB1 for USB HOST with Type-A connector (CON15)●RJ45_0 connector with LED indicator (CON12), RMII PHY with IP101GR (U14)●RJ45_1 connector with LED indicator (CON13), RMII PHY with IP101GR (U16)●Micro-SD/TF card slot (CON3)●SOC CPU: Nuvoton N9H30F61IEC (U5)●Battery power for RTC 3.3V powered (BT1, J1), can detect voltage by ADC0●RTC power has 3 sources:–Share with 3.3V I/O power–Battery socket for CR2032 (BT1)–External connector (J1)●Board version 2.1NUMAKER-HMI-N9H30 USER MANUAL2.3 NuDesign-TFT-LCD7 －Front ViewFigure 2-3 Front View of NuDesign-TFT-LCD7 BoardFigure 2-3 shows the main components and connectors from the Front side of NuDesign-TFT-LCD7board.7” resolution 800x480 4-W resistive touch panel for 24-bits RGB888 interface2.4 NuDesign-TFT-LCD7 －Rear ViewFigure 2-4 Rear View of NuDesign-TFT-LCD7 BoardFigure 2-4 shows the main components and connectors from the rear side of NuDesign-TFT-LCD7board.NuMaker-N9H30 and NuDesign-TFT-LCD7 combination connector (CON1).NUMAKER-HMI-N9H30 USER MANUAL 2.5 NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB PlacementFigure 2-5 Front View of NuMaker-N9H30 PCB PlacementFigure 2-6 Rear View of NuMaker-N9H30 PCB PlacementNUMAKER-HMI-N9H30 USER MANUALFigure 2-7 Front View of NuDesign-TFT-LCD7 PCB PlacementFigure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement3 NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS3.1 NuMaker-N9H30 － GPIO List CircuitFigure 3-1 shows the N9H30F61IEC GPIO list circuit.Figure 3-1 GPIO List Circuit NUMAKER-HMI-N9H30 USER MANUAL3.2 NuMaker-N9H30 － System Block CircuitFigure 3-2 shows the System Block Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-2 System Block Circuit3.3 NuMaker-N9H30 － Power CircuitFigure 3-3 shows the Power Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-3 Power Circuit3.4 NuMaker-N9H30 － N9H30F61IEC CircuitFigure 3-4 shows the N9H30F61IEC Circuit.Figure 3-4 N9H30F61IEC CircuitNUMAKER-HMI-N9H30 USER MANUAL3.5 NuMaker-N9H30 － Setting, ICE, RS-232_0, Key CircuitFigure 3-5 shows the Setting, ICE, RS-232_0, Key Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-5 Setting, ICE, RS-232_0, Key Circuit3.6 NuMaker-N9H30 － Memory CircuitFigure 3-6 shows the Memory Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-6 Memory Circuit3.7 NuMaker-N9H30 － I2S, I2C_0, RS-485_6 CircuitFigure 3-7 shows the I2S, I2C_0, RS-486_6 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-7 I2S, I2C_0, RS-486_6 Circuit3.8 NuMaker-N9H30 － RS-232_2 CircuitFigure 3-8 shows the RS-232_2 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-8 RS-232_2 Circuit3.9 NuMaker-N9H30 － LCD CircuitFigure 3-9 shows the LCD Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-9 LCD Circuit3.10 NuMaker-N9H30 － CMOS Sensor, I2C_1, CAN_0 CircuitFigure 3-10 shows the CMOS Sensor,I2C_1, CAN_0 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit3.11 NuMaker-N9H30 － RMII_0_PF CircuitFigure 3-11 shows the RMII_0_RF Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-11 RMII_0_PF Circuit3.12 NuMaker-N9H30 － RMII_1_PE CircuitFigure 3-12 shows the RMII_1_PE Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-12 RMII_1_PE Circuit3.13 NuMaker-N9H30 － USB CircuitFigure 3-13 shows the USB Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-13 USB Circuit3.14 NuDesign-TFT-LCD7 － TFT-LCD7 CircuitFigure 3-14 shows the TFT-LCD7 Circuit.Figure 3-14 TFT-LCD7 CircuitNUMAKER-HMI-N9H30 USER MANUAL4 REVISION HISTORYDate Revision Description2022.03.24 1.00 Initial version NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUALImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, anymalfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomicenergy control instruments, airplane or spaceship instruments, the control or operation ofdynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all typesof safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify the damagesand liabilities thus incurred by Nuvoton.。

photodetector的原理光电探测器（photodetector）是一种将光信号转换为电信号的器件。

它是光电技术中最重要的元件之一，广泛应用于通信、光谱分析、成像、光电测量等领域。

光电探测器的原理可以分为光电效应、半导体效应和内部增益效应三个部分。

一、光电效应光电效应是光电探测器的基本原理，它描述了当光照射到物质表面时，被照射物质中的电子被激发或者抛射出来的现象。

常见的光电效应有光电发射效应、外光电效应和内光电效应。

1.光电发射效应：光照射到金属表面时，使得金属中电子受到激发而从金属表面抛射出来。

这种效应主要根据普朗克的能量量子化理论和爱因斯坦的解释，即光的能量以粒子的形式存在，能量E与光的频率f之间有E=hf的关系。

需要注意的是，光电发射效应只适用于金属和类金属材料。

2.外光电效应：外光电效应也称为外光电倍增效应，是指当光照射在气体、液体或半导体等非金属材料上时，通过受激发的自由电子，使得材料表面电子被激发或抛射出来。

外光电效应的主要作用在于形成自由电子空穴对。

3.内光电效应：内光电效应是指当光照射在光电探测器的半导体材料上时，通过被激发的自由电子和空穴之间的再结合，产生电流。

内光电效应在半导体探测器中起到了主要的作用。

二、半导体效应半导体效应是光电探测器的重要原理，它主要应用于各种类型的光电探测器中。

在光照射下，半导体材料中能带发生变化，使得自由载流子的浓度发生改变，从而产生电压或电流信号。

半导体效应的工作原理依赖于光生电势效应和内部电场效应。

光生电势可以改变半导体中电子和空穴的浓度，从而产生电势差。

内部电场也会使得载流子运动方向发生偏转，形成电流。

根据不同的半导体材料和结构，可以分为以下几种典型的半导体光电探测器：1.PN结光电探测器：PN结光电探测器是一种常用的光电探测器。

其工作原理是利用PN结中的电子与空穴的结合效应，通过光生电流的变化来检测光信号。

2.PIN光电探测器：PIN结光电探测器是在PN结的基础上增加了掺杂度较低的中间区域，以增加探测器的响应速度和增益。

高频开关变换器的数字控制影印版高频开关变换器的数字控制影印版随着科技的不断发展，高频开关变换器作为一种重要的电力电子设备，已经被广泛应用于工业、通信、家电等领域。

为了更好地满足现代社会对能源转换的需求，高频开关变换器的数字控制技术也日益受到关注。

高频开关变换器是一种将直流电能转换为交流电能的重要装置。

其核心部件是功率开关器件，通过控制这些开关器件的通断状态，可以实现电能的变换和调节。

然而，传统的模拟控制方式存在着调整精度低、抗干扰能力差等问题，已经不能满足现代化生产和生活的需求。

为了解决这些问题，数字控制技术被引入到高频开关变换器中。

数字控制是指通过数字信号处理器（DSP）或微控制器（MCU）等数字电子器件，对功率开关器件进行精确的控制和调节。

相比于模拟控制，数字控制具有调整精度高、系统稳定性好、抗干扰能力强等优点。

数字控制使得高频开关变换器的工作性能得到了显著提升。

首先，数字控制技术可以实现对开关器件的精确控制，可以根据负载变化实时调整开关频率和占空比，提高了传输效率和电能利用率。

其次，数字控制还可以实现对输出电压、电流等参数进行精确调节，满足不同应用场景的需求。

此外，数字控制还可以实现对开关器件的保护，提高了系统的可靠性和稳定性。

然而，在实际应用过程中，数字控制也面临一些挑战。

首先，数字控制需要对器件进行精确测量和采样，因此需要高精度的AD/DA转换器和传感器等辅助设备。

其次，数字控制还需要可靠的通信接口和算法支持，以实现与外部控制系统的互联互通。

综上所述，数字控制技术在高频开关变换器中的应用，为其性能提升和功能拓展提供了新的思路。

随着科技的不断进步，数字控制技术将会进一步发展和完善，为高频开关变换器的应用带来更多的便利和创新。

光电转换模块主要参数1. 什么是光电转换模块？光电转换模块是一种能够将光能转换为电能的器件。

它通常由光敏元件和电子元件组成，能够将光信号转换为电信号，并输出给其他电路或设备进行进一步处理。

2. 光电转换模块的主要参数2.1 光敏元件参数光敏元件是光电转换模块的核心组成部分，它能够将光信号转换为电信号。

以下是光敏元件的主要参数：2.1.1 光敏元件类型常见的光敏元件类型有光电二极管（Photodiode）、光敏电阻（Photoresistor）、光电二极管阵列（Photodiode Array）等。

不同类型的光敏元件在光电转换过程中具有不同的特性和应用场景。

2.1.2 光敏元件灵敏度光敏元件的灵敏度指的是它对光信号的响应程度。

通常用光电流或光电阻值来表示，单位为安培/瓦特（A/W）或欧姆（Ω）。

灵敏度越高，光电转换效率越高。

2.1.3 光敏元件响应频率光敏元件的响应频率指的是它能够响应的光信号的频率范围。

不同类型的光敏元件具有不同的响应频率范围，一般在几十赫兹到几百兆赫兹之间。

2.2 电子元件参数电子元件是光电转换模块中用于信号处理和输出的部分。

以下是电子元件的主要参数：2.2.1 增益增益是指光电转换模块输出电信号的放大倍数。

它能够将光敏元件输出的微弱信号放大到合适的幅度，以便后续电路或设备能够正确处理。

2.2.2 噪声噪声是指光电转换模块输出信号中的随机干扰成分。

它可以由光敏元件、电子元件以及外界环境等多种因素引起。

噪声水平越低，模块的信噪比越高，输出信号质量越好。

2.2.3 功耗功耗是指光电转换模块在工作过程中消耗的电能。

较低的功耗可以延长模块的使用寿命，并减少对电源的需求。

2.3 其他参数除了光敏元件和电子元件的参数外，还有一些其他参数也需要考虑：2.3.1 工作温度范围光电转换模块的工作温度范围指的是它能够正常工作的温度范围。

一般来说，模块的工作温度范围应适应实际应用场景的要求。

2.3.2 尺寸和重量尺寸和重量是光电转换模块的物理参数，对于一些特殊应用场景（如微型设备）来说，尺寸和重量可能是非常重要的考虑因素。

DR平板探测器参数解释1.调制传递函数（MTF）MTF的涵义:就是描述系统再现成像物体空间频率范围的能力，理想的成像系统要求100%再现成像物体细节，但现实中肯定存在不同程度的衰减，所以MTF始终<1，它说明成像系统不能把输入的影像全部再现出来，换句话说，凡是经过成像系统所获得的图像都不同程度损失了影像的对比度。

MTF值越大，成像系统再现成像物体细节能力越强。

系统的MTF是必须要测定的。

要评价数字X线摄影系统的固有成像质量，必须计算出不受主观影响的、系统所固有的预采样MTF2.空间分辨率DR的空间分辨率指图像空间范围内的解像力或解像度，以能够分辨清楚图像中黑白相间线条的能力来表示。

黑白相间的线条简称线对一对黑白相间的线条称之为一个线对，分辨率的线性表达单位是线对l毫米（LPlmm）。

在单位宽度范围内能够分辨清楚线对数越多，表示图像空间分辨率越高。

图像分辨率可用分辨率测试卡直接测出。

但空间分辨率的提高不是无限的，其与探测器对X线光子的检测灵敏度、动态范围信噪比等有密切关系。

厂商在DR宣传材料中标注的分辨率很多都是根据像素大小计算出来的而不是临床上真正关心的系统分辨率。

但在实际临床X线成像过程中影响分辨率的因素有很多；例如X线焦点、SID （胶片距）、患者运动、曝光时间、探测器感光灵敏度、像素大小、计算机图像处理、显示器性能等。

系统中的每一个子系统发生变化都会影响整个系统的分辨率（所谓”木桶效应“）。

尤其要注意的是监视器分辨率，DR系统探测器本身的分辨率一般高于系统所配监视器的分辨率。

目前临床所用最高档CRT型和LCD型显示器显示像素为2K×2.5K。

这些监视器都是当作选件卖的，而 DR系统本身所带监视器都为128O×1O24或1600×1200的普通计算机用监视器。

从提高工作效率讲，屏读电子闯片是发展方向。

所以在追求高分辨率的时候不要忘记监视器这一环。

3．X线照射剂量和影像噪声在实际的成像条件下、噪声将始终干扰目标的检测。

BLC9G27LS-151AVPower LDMOS transistorRev. 3 — 24 May 2017Product data sheet 1. Product profile1.1General description150W LDMOS packaged asymmetrical Doherty power transistor for base stationapplications at frequencies from 2496MHz to 2690MHz.Table 1.Typical performanceTypical RF performance at T case = 25 ︒C in the Doherty demo board.Test signal f V DS P L(AV)G pηD ACPR(MHz)(V)(W)(dB)(%)(dBc)1-carrier W-CDMA2496 to 26902828.215.548-30 [1][1]Test signal: 3GPP test model 1; 1 to 64 DPCH; PAR=7.2dB at 0.01% probability on CCDF.1.2Features and benefits⏹Excellent ruggedness⏹High efficiency⏹Low thermal resistance providing excellent thermal stability⏹Decoupling leads to enable improved video bandwidth⏹Lower output capacitance for improved performance in Doherty applications⏹Designed for low memory effects providing excellent pre-distortability⏹Internally matched for ease of use⏹Integrated ESD protection⏹Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances(RoHS)1.3Applications⏹RF power amplifier for LTE base stations and multi carrier applications in the2496MHz to 2690MHz frequency range2. Pinning informationTable 2.Pinning[1]Connected to flange.3. Ordering informationTable 3.Ordering informationType number PackageName Description Version BLC9G27LS-151AV-air cavity plastic earless flanged package; 6 leads SOT1275-14. Limiting valuesTable 4.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max UnitV DS drain-source voltage-65VV GS gate-source voltage-5+13VT stg storage temperature-65+150︒CT j junction temperature[1]-225︒C[1]Continuous use at maximum temperature will affect the reliability, for details refer to the online MTFcalculator.5. Thermal characteristicsTable 5.Thermal characteristicsSymbol Parameter Conditions Typ UnitR th(j-case)thermal resistance from junction to case T case=80︒C; I Dq=280mA;V GS(amp) peak = 0.85 VP L = 28.2 W0.314K/WP L = 44.7 W0.270K/W6. CharacteristicsTable 6.DC characteristicsT j = 25 ︒C unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitMain deviceV(BR)DSS drain-source breakdown voltage V GS=0V;I D=0.5mA65--VV GS(th)gate-source threshold voltage V DS=10 V; I D=50mA 1.52 2.5VV GSq gate-source quiescent voltage V DS=28 V; I D=300mA 1.75 2.3 2.85VI DSS drain leakage current V GS=0V;V DS=32V-- 1.4μA-10.9-AI DSX drain cut-off current V GS=V GS(th)+3.75 V;V DS=10VI GSS gate leakage current V GS=11V;V DS=0V--140nAg fs forward transconductance V DS=10V;I D=50 mA-0.53-S-285460mΩR DS(on)drain-source on-state resistance V GS=V GS(th) + 3.75V;I D=1.75APeak deviceV(BR)DSS drain-source breakdown voltage V GS=0V;I D=1.1mA65--VV GS(th)gate-source threshold voltage V DS=10 V; I D=110mA 1.52 2.5VV GSq gate-source quiescent voltage V DS=28 V; I D=660mA 1.65 2.2 2.75VI DSS drain leakage current V GS=0V;V DS=32V-- 1.4μA-23.8-AI DSX drain cut-off current V GS=V GS(th)+3.75 V;V DS=10VI GSS gate leakage current V GS=11V;V DS=0V--140nAg fs forward transconductance V DS=10V;I D=110mA- 1.16-S-130215mΩR DS(on)drain-source on-state resistance V GS=V GS(th) + 3.75V;I D=3.85ATable 7.RF characteristicsTest signal: 1-carrier W-CDMA; PAR = 7.2 dB at 0.01% probability on the CCDF;3GPP test model1; 1 to 64 DPCH; f1=2496MHz; f2=2690MHz; RF performance at V DS=28V;I Dq=280mA (main); V GS(amp)peak=0.8V; T case=25︒C; unless otherwise specified; in anasymmetrical Doherty production test circuit at frequencies from 2496MHz to 2690 MHz.Symbol Parameter Conditions Min Typ Max UnitG p power gain P L(AV)=28W14.415.6-dBRL in input return loss P L(AV)=28W--11-7dBηD drain efficiency P L(AV)=28W4146-%ACPR adjacent channel power ratio P L(AV)=28W--30-25dBcTable 8.RF characteristicsTest signal: pulsed CW; t p=100μs; δ=10%; f=2690MHz; RF performance at V DS = 28 V;I Dq=280mA(main); V GS(amp)peak=0.8V; T case = 25 ︒C; unless otherwise specified; tested in anasymmetrical Doherty production test circuit at frequencies from 2496MHz to 2690MHz.Symbol Parameter Conditions Min Typ Max UnitP L(3dB)output power at 3 dB gain compression135155-W7. Test information7.1Ruggedness in Doherty operationThe BLC9G27LS-151AV is capable of withstanding a load mismatch corresponding to aVSWR=10: 1 through all phases under the following conditions: V DS=28V;I Dq=200mA (main); V GS(amp)peak=0.85V; P L=50 W(1-carrier W-CDMA);f=2496MHz.7.2Impedance informationTable 9.Typical impedance of main deviceMeasured load-pull data of main device; I Dq = 300 mA (main); V DS = 28 V.f Z S [1]Z L [1]P L [2]ηD [2]G p [2](MHz)(Ω)(Ω)(W)(%)(dB)Maximum power load2496 6.2 - j7.7 3.3 - j7.771.555.818.12600 6.1- j5.9 3.3 - j7.771.355.718.52690 3.6 - j5.4 3.3 - j7.766.954.919.1Maximum drain efficiency load2496 6.2 - j7.7 6.4 - j5.752.863.520.32600 6.1- j5.9 6.0 - j5.952.164.321.12690 3.6 - j5.4 5.0 - j5.048.561.821.5[1]Z S and Z L defined in Figure1.[2]at 3 dB gain compression.Table 10.Typical impedance of peak deviceMeasured load-pull data of peak device; I Dq = 600 mA (peak); V DS = 28 V.f Z S [1]Z L [1]P L [2]ηD [2]G p [2](MHz)(Ω)(Ω)(W)(%)(dB)Maximum power load24967.2 - j8.6 4.1- j9.1146.958.217.626008.0- j6.3 4.1- j9.1141.156.017.92690 6.0 - j2.8 5.0 - j10.0137.355.718.3Maximum drain efficiency load24967.2 - j8.6 5.8- j6.2115.565.319.526008.0- j6.3 5.4 - j5.5103.264.220.22690 6.0 - j2.8 4.8 - j5.998.562.820.6[1]Z S and Z L defined in Figure1.[2]at 3 dB gain compression.7.3Recommended impedances for Doherty designTable 11.Typical impedance of main device at 1:1 loadMeasured load-pull data of main device; I Dq = 300 mA (main); V DS = 28 V.f Z S [1]Z L [1]P L [2]ηD [3]G p [3](MHz)(Ω)(Ω)(dBm)(%)(dB) 2496 6.2 - j7.7 3.7 - j7.048.141.518.5 2600 6.1- j5.9 3.7 - j7.148.042.018.7 2690 3.6 - j5.4 3.7 - j7.248.042.019.3[1]Z S and Z L defined in Figure1.[2]at 3 dB gain compression.[3]at P L(AV)=44.5 dBm.Table 12.Typical impedance of main device at 1:2.5 loadMeasured load-pull data of main device; I Dq = 300 mA (main); V DS = 28 V.f Z S [1]Z L [1]P L [2]ηD [3]G p [3](MHz)(Ω)(Ω)(dBm)(%)(dB) 2496 6.2 - j7.7 6.8 - j12.946.25520.7 2600 6.1- j5.9 6.0 - j14.146.75421.3 2690 3.6 - j5.4 5.5- j13.745.95321.8[1]Z S and Z L defined in Figure1.[2]at 3 dB gain compression.[3]at P L(AV)=44.5 dBm.7.4VBW in Doherty operationThe BLC9G27LS-151AV shows 100MHz (typical) video bandwidth in Doherty demo board in 2600MHz at V DS=28V;I Dq=250 mA and V GS(amp)peak=0.8V.7.5Test circuit[1]American Technical Ceramics type 600F or capacitor of same quality [2]Murata or capacitor of same qualityTable 13.List of components See Figure 2 for component ponentDescriptionValue RemarksC1, C2, C3, C4, C6, C7, C8multilayer ceramic chip capacitor 9.1pF [1]C5multilayer ceramic chip capacitor 4.3pF [1]C9, C11multilayer ceramic chip capacitor 1 μF, 50V [2]C10, C12, C13, C14, C15, C16multilayer ceramic chip capacitor 10 μF, 50V [2]C17, C18electrolytic capacitor 1000 μF, 100V R1resistor 51 ΩSMD 0805R2. R3resistor9.1 ΩSMD 08057.6Graphical data 7.6.1Pulsed CW7.6.21-Carrier W-CDMA7.6.32-Tone VBW8. Package outlineFig 9.Package outline SOT1275-19. Handling informationTable 14.ESD sensitivityESD model ClassCharged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002C2A [1]Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001 2 [2][1]CDM classification C2A is granted to any part that passes after exposure to an ESD pulse of 500V, but failsafter exposure to an ESD pulse of 750V.[2]HBM classification 2 is granted to any part that passes after exposure to an ESD pulse of 2000V, but failsafter exposure to an ESD pulse of 4000V.10. AbbreviationsTable 15.AbbreviationsAcronym Description3GPP3rd Generation Partnership ProjectCCDF Complementary Cumulative Distribution FunctionCW Continuous WaveDPCH Dedicated Physical CHannelESD ElectroStatic DischargeLDMOS Laterally Diffused Metal-Oxide SemiconductorLTE Long Term EvolutionMTF Median Time to FailurePAR Peak-to-Average RatioSMD Surface Mounted DeviceVBW Video BandWidthVSWR Voltage Standing Wave RatioW-CDMA Wideband Code Division Multiple Access11. Revision historyTable 16.Revision historyDocument ID Release date Data sheet status Change notice SupersedesBLC9G27LS-151AV v.320170524Product data sheet-BLC9G27LS-151AV v.2 Modifications:•Table2 on page2: change simplified outline•Table3 on page2: change version to SOT1275-1•Figure9 on page10: change package outline drawing to SOT1275-1BLC9G27LS-151AV v.220161202Product data sheet-BLC9G27LS-151AV v.1 BLC9G27LS-151AV v.120160226Product data sheet--12. Legal information12.1 Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product statusinformation is available on the Internet at URL .12.2 DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. 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Contents1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1 General description . . . . . . . . . . . . . . . . . . . . . 11.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 11.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pinning information. . . . . . . . . . . . . . . . . . . . . . 23 Ordering information. . . . . . . . . . . . . . . . . . . . . 24 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 25 Thermal characteristics . . . . . . . . . . . . . . . . . . 26 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 37 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 47.1 Ruggedness in Doherty operation . . . . . . . . . . 47.2 Impedance information. . . . . . . . . . . . . . . . . . . 47.3 Recommended impedances for Doherty design 57.4 VBW in Doherty operation . . . . . . . . . . . . . . . . 57.5 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67.6 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 77.6.1 Pulsed CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77.6.2 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 87.6.3 2-Tone VBW. . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 109 Handling information. . . . . . . . . . . . . . . . . . . . 1110 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1111 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1212 Legal information. . . . . . . . . . . . . . . . . . . . . . . 1312.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1312.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1312.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1312.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1413 Contact information. . . . . . . . . . . . . . . . . . . . . 1414 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© Ampleon Netherlands B.V.2017.All rights reserved.For more information, please visit: For sales office addresses, please visit: /sales。