道康宁OE-6550参数
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【道康宁润滑剂】液压油 美国道康宁 MOLYKOTE®(摩力克 TM)特种润滑剂 美国道康宁 Dow Corning 大全Molykote 产品针对您的润滑问 题... 道康宁 MOLYKOTE Molykote G72/Molykote G/72 有机硅润滑脂 Molykote 产品-针对您的润滑问题的解决方案Dow Corning 4 compound Dow Corning 5 Dow Corning 7 compound、Dow Corning 7 Molykote 33 light/medium Molykote 41 Molykote 44 light/medium Molykote 55(M)/Molykote 55M Dow Corning 111 compound/Dow Corning 111 Dow Corning 4 Molykote 7348/Molykote7348 Dow Corning 340 导热硅脂/Dow Corning 340 Molykote G-5032/Molykote G5032 Molykote PG 21/Molykote PG21 Molykote PG54/Molykote PG 54 Dow Corning High-Vaccum Grease Molykote G-5008/Molykote G5008/Molykote G 500... Molykote 7508/Molykote7508 Molykote 7325/Molykote7325 Dow Corning 112 compound/Dow Corning112 Molykote 822M/Molykote 822 M道康宁 MOLYKOTE FORAFAC F1157/FORAFAC F 1157 氟碳表面活性 剂... FORAFAC F321/FORAFAC F321 FORAFAC 1268/FORAFAC® 1268 FORAFAC 1203/FORAFAC1203 FORAFAC 1157N/FORAFAC 1157 N道康宁 MOLYKOTE Molykote M-77 装配油膏/Molykote M-77 装配油 装配油膏膏... Molykote D Paste 装配油膏/Molykote DPaste 装配 油... 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道康宁SE4450道康宁高导热硅胶北京
北京瑞德佑业 I8OOII3O865 王雅蓉
道康宁DOW CORNING SE4450
产品描述:
产品规格︰ SE4450
道康宁高导热硅胶SE4450,绝缘、导热,此材料提供了对产生热的电子零件,如IC、电晶体、处理器等具有极佳的导热与传热效果,有膏油脂状,有兼具导热与接着两种功能之橡胶状的接着剂,也有用于灌注用双组份型的产品的导热材料规格化垫片状等应用方式提供选择,产品耐高低温-50C--+200C以上。
产品特点:1、良好的接著力2、高热传导性2、固化时间短2、耐高低温(-60 ~ -250oC)
比重: 2.7;硬度: (JIS A) 85;抗张强度 50Kgf / cm2;延伸性 30 %;绝缘强度: 25KV / mmVolume Resistivity2 x 1014 Ωcm;接着力(铝): 30Kgf / cm2
热传导系数:4.5x10-3 cal / cm.sec.oC
主要市场︰ CPU之热导管
参考单价︰价优
付款方式︰另议
最小订量︰ KG
交货日期︰现货供应
认可标准︰ SGS,UL,MSDS;RTV 液態矽橡膠。
6650nhn绝缘纸标准
6650NHN绝缘纸是一种柔软复合材料,由金黄色聚酰亚胺薄膜在其两面复合杜邦nomex? 464而组成,使用的粘合剂不含酸,耐高温。
其主要技术要求如下:
- 标称厚度:0.20、0.30、0.23、0.33mm;
- 厚度偏差:±0.03、±0.045、±0.035、±0.05mm;
- 定量:190±29、290±44、220±33、320±48g/m²;
- 拉伸强度:纵向不低于18kgf/10mm、横向不低于14kgf/10mm;
- 伸长率:纵向不低于15%、横向不低于15%;
- 常态粘结性:不分层;
- 热态粘结性:200±2℃下10min不分层、不起泡、不流胶。
6650NHN绝缘纸具有良好的介电性能和力学性能,在高温下和受潮后力学性能尤为突出,通常用于H级电机、电器的槽绝缘、匝间绝缘、衬垫和H级干式变压器的层间间隔绝缘等。
Product InformationLightingDow Corning® OE-2002 OpticalEncapsulant∙High transparency ∙1:1 mix ratio∙Polydimethylsiloxane Dow Corning® OE-2002 Optical Encapsulant is a two part , heat cure , high purity silicone encapsulant designed for optical applications.APPLICATIONS∙Encapsulant for LED packaging by dispensing processTYPICAL PROPERTIESSpecification Writers: This is a developmental material. No assurances are given as to processability, long-term performance characteristics or other production or application parameters. Therefore, the purchaser/user uses the product entirely at their risk without having been given any warranty or guarantee and agrees that the supplier shall not be liable for any damages, of whatever nature, arising out of such use. Commercialization and continued supply of this material are not assured.(2)Cure at 150C for 3hours.DESCRIPTIONDow Corning® brand silicone LED(light emitting diode) encapsulants aredesigned to meet the challengingneeds of the LED market, includinghigh adhesion, high purity, moistureresistance, thermal stability and opticaltransmittance. Silicone materialscan absorb stresses caused by thermalcycling inside the package, protectingthe chip and the bonding wires. Withthe electronics industry quicklymoving toward lead-free processing,silicone encapsulants, with theirdemonstrated, excellent stability atreflow temperatures, are a natural fitfor LED applications.HOW TO USEThese products are also compatible with commercially available equipment and industry standard Processes. These materials can be dispensed depending on the product and application.USEFUL TEMPERATURE RANGESFor most uses, silicone encapsulants and resins should be operational over a temperature range of -45 to 200 °C (-49 to 392 °F) for long periods of time. However, at both the low- and high-temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations. For low-temperature performance, thermal cycling to conditions such as -55 °C (-67 °F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance are configuration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone elastomer is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.COMPATIBILITYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the curedgel indicates incompatibility andinhibition of cure.HANDLINGPRECAUTIONSPRODUCT SAFETYINFORMATION REQUIRED FORSAFE USE IS NOT INCLUDED INTHIS DOCUMENT. BEFOREHANDLING, READ PRODUCTAND MATERIAL SAFETY DATASHEETS AND CONTAINERLABELS FOR SAFE USE,PHYSICAL AND HEALTHHAZARD INFORMATION. THEMATERIAL SAFETY DATASHEET IS AVAILABLE ON THEDOW CORNING WEBSITE AT, OR FROMYOUR DOW CORNING SALESAPPLICATION ENGINEER, ORDISTRIBUTOR, OR BY CALLINGDOW CORNING CUSTOMERSERVICE.USABLE LIFE ANDSTORAGEShelf life is indicated by the “UseBefore” date found on the productlabel. Dow Corning two-part productsshould be stored at or below 25 °C(77 °F). Containers should be kepttightly closed at all times to extendshelf life. Check the product label forspecific storage conditions.PACKAGINGINFORMATIONMultiple packaging sizes are availablefor this product. Please contact yourlocal distributor or Dow Corningrepresentative for information onpackaging size and availability.LIMITATIONSThis product is neither tested norrepresented as suitable for medical orpharmaceutical uses.HEALTH ANDENVIRONMENTALINFORMATIONTo support customers in their productsafety needs, Dow Corning has anextensive Product Stewardshiporganization and a team of ProductSafety and Regulatory Compliance(PS&RC) specialists available in eacharea.For further information, please see ourwebsite, or consultyour local Dow Corningrepresentative.LIMITED WARRANTYINFORMATION – PLEASEREAD CAREFULLYThe information contained herein isoffered in good faith and is believed tobe accurate. However, becauseconditions and methods of use of ourproducts are beyond our control, thisinformation should not be used insubstitution for customer’s tests toensure that our products are safe,effective, and fully satisfactory for theintended end use. Suggestions of useshall not be taken as inducements toinfringe any patent.Dow Corning’s sole warranty is thatour products will meet the salesspecifications in effect at the time ofshipment.Your exclusive remedy for breach ofsuch warranty is limited to refund ofpurchase price or replacement of anyproduct shown to be other than aswarranted.TO THE FULLEST EXTENTPERMITTED BY APPLICABLELAW, DOW CORNINGSPECIFICALLY DISCLAIMSANY OTHER EXPRESS ORIMPLIED WARRANTY OFFITNESS FOR A PARTICULARPURPOSE ORMERCHANTABILITY.DOW CORNING DISCLAIMSLIABILITY FOR ANYINCIDENTAL ORCONSEQUENTIAL DAMAGES.HOW CAN WE HELP YOUTODAY?Tell us about your performance,design and manufacturing challenges.Let us put our silicon-based materialsexpertise, application knowledge and processing experience to work for you.For more information about our materials and capabilities, visit .To discuss how we could work together to meet your specific needs, email electronics@ or go to /contactus for a contact close to your location. Dow Corning has customer service teams, science and technology centers, application support teams, sales offices and manufacturing sites around the globe.We help you invent the future. 。
常用硅烷偶联剂介绍1. KH550KH550硅烷偶联剂CAS号:919-30-2一、国外对应牌号A-1100 (美国联碳),Z-6011 (美国道康宁),KBM-903 (日本信越)。
本品有碱性,通用性强,适用于环氧、PBT、酚醛树脂、聚酰胺、聚碳酸酯等多种热塑性和热固性树脂。
二、化学名称分子式:名称:Y氨丙基二乙氧基硅烷3-三乙氧基甲硅烷基-1-丙胺别名:【3-Triethoxysilylpropylami ne APTES 】,Y氨丙基三乙氧基硅烷或3-氨基丙基三乙氧基硅烷|【3-Aminpropyltriethoxysilane AMEO 】分子式: NH2(CH 2)3Si(OC2H5)3分子量: 221.37分子结构:三、物理性质:外观:无色透明液体密度(p 25C ): 0.946沸点:217 C折光率nD25: 1.420溶解性:可溶于有机溶剂,但丙酮、四氯化碳不适宜作释剂;可溶于水。
在水中水解,呈碱性。
本品应严格密封,存放于干燥、阴凉、避光的室内。
四、KH550主要用途:本品应用于矿物填充的酚醛、聚酯、环氧、PBT、聚酰胺、聚碳酸酯等热塑性和热固体树脂,能大幅度提高增强塑料的干湿态抗弯强度、抗压强度、剪切强度等物理力学性能和湿态电气性能,并改善填料在聚合物中的润湿性和分散性。
本品是优异的粘结促进剂,可用于聚氨酯、环氧、腈类、酚醛胶粘剂和密封材料,可改善颜料的分散性并提高对玻璃、铝、铁金属的粘合性,也适用于聚氨酯、环氧和丙烯酸乳胶涂料。
在树脂砂铸造中,本品增强树脂硅砂的粘合性,提咼型砂强度抗湿性。
在玻纤棉和矿物棉生产中,将其加入到酚醛粘结剂中,可提高防潮性及增加压缩回弹性。
在砂轮制造中它有助于改进耐磨自硬砂的酚醛粘合剂的粘结性及耐水性。
2. KH560一、国外对应牌号:A-187 (美国联碳公司)。
KBM -403 (日本信越化学工业株式会社)二、化学名称及分子式化学名称:Y缩水甘油醚氧丙基三甲氧基硅烷分子式:CH2CH(O)CH 2O(CH2)3Si(OCH 3)3结构式:分子量:236.3376三、物理性质:物理形态:液体。
产品名称:二甲基硅油
产品货号:道康宁二甲基硅油PMX200
产品说明:
道康宁二甲基硅油PMX200
型号:XIAMETER
道康宁PMX200硅油技术指标
品名道康宁PMX200二甲基硅油
粘度25℃cst0.6510100100010000100000
比重25℃0.7600.9350.9650.9700.9750.977
屈折率25℃ 1.375 1.399 1.403 1.403 1.403 1.403
黏度温度系数D0.310.550.590.60.610.61
流动点℃-68-65-55-50-46-40
引火点℃-1165300>315>315>315
膨张率cc/cc℃0.001350.001060.000950.000940.000940.00094
热导率cal/cm·sec℃ 2.4X10 3.3X10 3.8X10 3.8X10 3.8X10 3.8X10
表面张力15.920.120.921.221.321.3
多种粘度:0.65 cst 50CST,100CST,350CST,500CST,1000CST,12500CST,60000CST...
用途:道康宁公司内部使用的中间体,电子方面的应用,稀释剂,硅氧烷制造中间体,加工
助剂,一般用途如:润滑、脱模,仪表,液压,减震,制动,热传导,电绝缘等。
广泛用于液体洗涤剂,如餐具洗涤剂、洗发香波、泡沫浴剂、洗手剂等。
也可作为纺织印染、石油、皮革及食品机械等行业的润湿剂、助染剂、清洗剂、发泡剂、脱脂剂等。
包装:25公斤/小桶,200公斤/大桶。
LED MaterialsDow Corning ®OE-6550FEATURESTwo part, 1:1 mix ratio, high RI, optically clear silicone elastomerTYPICAL PROPERTIESSpecification Writers: These values are not intended for use in preparingspecifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product.PropertyUnit Value Viscosity (Part A or Base cP 1000 mPa-sec 1000 Pa-sec 1Viscosity (Part B or Catalyst) cP 25000 mPa-sec 25000 Pa-sec 25Viscosity (Mixed) cP 4000 mPa-sec 4000 Pa-sec 4Specific Gravity (Uncured Part A or - 1.16 Base)Specific Gravity (Uncured Part B or - 1.12 Catalyst)Working Time at 25ºC (Pot Life - hr >8 hours)Heat Cure Time @ 150ºC minutes 60Durometer Shore A (JIS) - 62Refractive Index - 1.54Transparency at 450 nm, 1 mm thick % 100Impurity (Na+) ppm 0.1Impurity (K+) ppm 0.2Impurity (Cl-) ppm 1Shelf Life @ 35ºC months 12 • Low viscosity • Medium hardness POTENTIAL USES • Seal and protect LEDs APPLICATION METHODS • Compatible with commercially • available equipment and industry • standard processesProduct Information购买更多工业用品,请访问:震坤行工业超市 STORAGE AND SHELF LIFEShelf life is indicated by the “Use Before” date found on the product label. Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life. Check the product label for specific storage conditions. DESCRIPTIONDow Corning® brand silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, including high adhesion, high purity, moisture resistance, thermal stability and optical transmittance. Silicone materials can absorb stresses caused by thermal cycling inside the package, protecting the chip and the bonding wires. And with the electronics industry quickly moving toward lead-free processing, silicone encapsulants, with their demonstrated, excellent stability at reflow temperatures, are a natural fit for LED applications.PREPARING SURFACES Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.PROCESSING/CURING These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application. Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment. ADHESIONDow Corning LED materials are specially designed for adhesion to commonly used LED substrates. Surface treatments such as chemical Etching or plasma treatment may providea reactive surface and improve adhesionto these types of substrates. In general,increasing the cure temperature and/orcure time will improve the ultimateadhesion.USEFUL TEMPERATURERANGESFor most uses, silicone encapsulants andresins should be operational over atemperature range of -45 to 200°C (-49to 392°F) for long periods of time.However, at both the low- and high-temperature ends of the spectrum,behavior of the materials andperformance in particular applicationscan become more complex and requireadditional considerations. For low-temperature performance, thermalcycling to conditions such as -55°C(-67°F) may be possible, but performanceshould be verified for your parts orassemblies. Factors that may influenceperformance are configuration and stresssensitivity of components, cooling ratesand hold times, and prior temperaturehistory. At the high-temperature end, thedurability of the cured siliconeencapsulants and resins is time andtemperature dependent. As expected, thehigher the temperature, the shorter thetime the material will remain useable.COMPATIBILITYCertain materials, chemicals, curingagents and plasticizers can inhibit thecure of addition cure adhesives. Mostnotable of these include: Organotin andother organometallic compounds,Silicone rubber containing organotincatalyst, Sulfur, polysulfides,polysulfones or other sulfur containingmaterials, unsaturated hydrocarbonplasitcizers, and some solder fluxresidues. If a substrate or material isquestionable with respect to potentiallycausing inhibition of cure, it isrecommended that a small scalecompatibility test be run to ascertainsuitability in a given application. Thepresence of liquid or uncured product atthe interface between the questionablesubstrate and the cured gel indicatesincompatibility and inhibition of cure.SAFE HANDLINGINFORMATIONPRODUCT SAFETY INFORMATIONREQUIRED FOR SAFE USE IS NOTINCLUDED IN THIS DOCUMENT.BEFORE HANDLING, READPRODUCT AND MATERIALSAFETY DATA SHEETS ANDCONTAINER LABELS FOR SAFEUSE, PHYSICAL AND HEALTHHAZARD INFORMATION. THEMATERIAL SAFETY DATASHEET IS AVAILABLE ON THEDOW CORNING WEBSITE AT, ORFROM YOUR DOW CORNINGREPRESENTATIVE, ORDISTRIBUTOR, OR BY CALLINGYOUR GLOBALDOW CORNING CONNECTION.For More InformationTo learn more about these and otherproducts available from Dow Corning,please visit the Dow Corning Electronicswebsite at /electronics.LIMITATIONSThis product is neither tested norrepresented as suitable for medical orpharmaceutical uses.HEALTH ANDENVIRONMENTALINFORMATIONTo support Customers in their productsafety needs, Dow Corning has anextensive Product Stewardshiporganization and a team of ProductSafety and Regulatory Compliance(PS&RC) specialists available in eacharea.For further information, please see ourwebsite, orconsult your local Dow Corningrepresentative.LIMITED WARRANTY INFORMATION - PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer's tests to ensure that Dow Corning's products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.Dow Corning's sole warranty is that the product will meet the Dow Corning sales specifications in effect at the time of shipment.Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.DOW CORNING SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY.DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. We help you invent the future.™。