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OHTCOMTechnology Ltd.nRF51822模块规格说明书Datasheet of nRF51822 Modules2015.6.1目录1 简介 Introduction (3)2 nRF51822 M0 BLE模块介绍 specification for M0 Module . 4天线的连接 (7)程序的烧录 (8)表一 nRF51822 M0工作参数 (8)3 nRF51822 M1 BLE模块介绍 specification for M1 Module . 9程序的烧录 (11)表二 nRF51822 M1工作参数 (11)4 History (13)5 联系方式CONTACT US (14)NOTES:If you are customers from overseas, please contact sales@ for quotation and specifications of English version.1 简介IntroductionnRF51822 Mx BLE低功耗蓝牙模块目前包括nRF51822 M0、nRF51822 M1两款。
这两款BLE模块都是以nRF51822为主控芯片，封装不同的模块。
nRF51822 M0模块包含了LIS3DH3轴传感器，与百度手环使用相同的基础硬件，可以用来开发运动手环等穿戴设备。
nRF51822 M1模块单有一片nRF51822芯片，可以选择16kB RAM或者32kB RAM的不同版本，可以用来开发iBeacon、室内定位、穿戴设备，计算机控制等，应用更灵活，满足不同需求。
nRF51822 M0nRF51822 M12 nRF51822 M0 BLE模块介绍specification for M0 ModulenRF51822 M0采用BGA的nRF51822芯片封装并且集成了高低速晶振、LIS3DH三轴传感器，模块尺寸仅为10.5mm*8.5mm*1.5mm，为业界最小封装。
AN4605应用笔记STM32- nRF51822蓝牙低功耗（BLE）系统解决方案介绍本应用笔记介绍了蓝牙低功耗（BLE）嵌入式软件（X-CUBE-nRF51DRV）实现对STM32L0系列和nRF51822，并解释如何界面自己的应用程序，并创建BLE服务。
在X-CUBE-nRF51DRV主要特点如下：•与北欧提供的BLE型材兼容性•应用程序集成就绪•易于附加在STM32L0系列低功耗解决方案BLE•极低STM32L0 CPU负载（HRS 1秒更新率0.127％）•没有对STM32L0系列延迟要求•小STM32L0内存占用在X-CUBE-nRF51DRV软件是基于STM32CubeL0 HAL驱动程序（见第2节）。
同时提供了使用北欧BLE服务于客户STM32L0应用实例。
该参考硬件平台是STM32-nRF51822基于STM32Nucleo / 64上和Wavetek公司蓝牙LE与盾北欧BLE模块nRF51822。
注：X-CUBE-nRF51DRV可以移植到其它STM32系列。
目录1引用。
72 STM32Cube概述。
83，嵌入式软件的定义。
9 4入门。
114.1 BLE系统描述。
0.114.2特性。
0.114.3硬件/软件的快速设置。
125参考平台。
13 5.1接口描述。
13 5.2 UART 4线接口。
145.3重置系统。
145.3.1上电复位。
155.3.2系统复位。
155.4器件编程。
166嵌入式软件的描述。
186.1 UART接口。
186.1.1 BLE SD FW模块。
196.1.2低功耗经理。
206.1.3中断。
206.1.4语境经理。
206.1.5配置。
21当BLE功能使用6.1.6 STM32资源需求。
216.1.7集成。
226.1.8可移植性。
226.2定时器接口。
236.2.1 BLE SD FW模块。
256.2.2初始化。
256.2.3用户模块。
266.2.4中断。
46.2.5语境经理。
蓝牙nRF51822 应用（基于低功耗蓝牙技术的温湿度传感器节点的设计）关键字：低功耗蓝牙温湿度传感器nRF51822 SHT11随着兼容蓝牙4.0标准的智能手机逐步普及，低功耗蓝牙技术也面临着越来越广泛的应用。
本设计采用了nRF51822和SHT11设计了一种基于低功耗蓝牙技术的温湿度传感器节点，能够将节点位置的温度和湿度发送给主机用于显示，可广泛应用于家庭、车间、仓库的温湿度监控。
1.引言在智能家居和物联网飞速发展的背景下，基于蓝牙4.0标准的低功耗蓝牙（Bluetooth Low Energy，BLE）技术正被逐步地为人们重视。
随着兼容蓝牙4.0标准的智能手机逐步普及，低功耗蓝牙技术也面临着越来越广泛的应用。
本设计采用了基于BLE技术的nRF51822蓝牙SoC芯片和SHT11温湿度传感器设计了一种基于低功耗蓝牙技术的温湿度传感器节点，能够将节点位置的温度和湿度发送给主机用于显示，可广泛应用于家庭、车间、仓库的温湿度监控。
节点采用了低功耗设计，可用一枚纽扣电池供电，实际使用时间可达1年以上。
2.系统结构本设计的系统结构如图1所示，系统的处理器模块由nRF51822构成，温湿度传感器件采用SHT11，电源采用纽扣电池供电；由处理器模块、温湿度传感器模块、天线模块、电源模块构成的节点与主机通过2.4GHz的低功耗蓝牙信号通信，主机采用智能手机运行信息采集显示的APP。
多个节点可利用应用层协议与主机组成星形网络。
图1 系统结构图3.硬件电路温湿度传感器节点硬件的系统构成如图2所示。
图2 硬件系统结构图3.1 处理器模块处理器模块选用Nordic公司的nRF51822芯片。
nRF51822是具有CORTEX-M0低功耗内核，支持BLE、Gazell等多协议的低功耗高速率射频收发器的SoC。
其具有高集成度、低成本、处理能力强、低功耗、小体积等优势，非常适合低功耗蓝牙产品的应用。
该芯片具有以下特性：具有Cortex-M0内核，片上256KB FLASH，16KB RAM，片内包含支持BLE协议的2.4GHz射频收发器。
0、功能简介IC功能包括：256kB片上闪存和16kB RAM；数字和混合信号周边，包括SPI、2-wire、ADC以及正交解码器；16 PPI通道；撘配片上LDO时电源范围为1.8-3.6V，LDO旁路模式为1.75-1.95V ；片上下拉DC/DC转换器用于3V电池（例如，纽扣电池）；片上+/- 250 ppm 32kHZ RC振荡器，在蓝牙低功耗应用，不需外部32kHz晶体，可节省成本和电路板空间；6x6mm 48脚QFN封装，提供最多可达32个GPIO；完整的蓝牙协议堆栈（到配置文件的链接层）。
nRF51822的S110是可下载、免版税、预编译二进制蓝牙低功耗堆栈，可独立编程和更新。
功能包括：异步和事件驱动SVC的API；运行时保护；GATT、GAP和L2CAP级别API；周边和广播器角色；GATT客户端和服务器；和2.4GHz RF专用协议的非并行多协议操作；少于128kB的代码和6kB的RAM，为应用程序留有超过128kB的闪存和10kB的RAM；与使用上一代nRF8001的双芯片应用相比，运行S110堆栈的nRF51822削减了高达50%的功耗。
S110堆栈和nRF51822加上nRF518 SDK相互配合，nRF518包含全面的蓝牙低功耗配置文件、服务以及示例应用集合。
1、架构围绕两条内部总线展开：AHB,APB AHB (Advanced High Performance BUS)：CPU: ( Cortex-m0，NVIC,BBB，DAP)Memory : ( RAM, Flash)GPIO : P0(P0.0~P0.31)AHB to APB BridgeAPB (Advanced Peripheral BUS):左半边：Power：电源控制WDT：看门狗SPI0,SPI1TIMER0(32位),TIMER1(16位),TIMER2(16位)QDEC：正交译码器，CLOCK：提供两个时钟：HFCLK(16MHZ),LFCLK（32.768KHZ）TWI0,TWI1：两线接口，兼容I2C右半边：NVMC :非易失性存储控制器RADIO: 2.4GHZ 无线广播的数据率：250KBPS,1MBPS,2MBPS ECB: 加密功能（AES），产生HASH序列，数字签名，生成密钥流等RNG：产生随机数用于加密（基于内部热噪声），无需种子值。
nRF51 Development KitDeveloping with the MDK-ARM Microcontroller Development Kit User Guide v1.0Copyright © 2014 Nordic Semiconductor ASA. All rights reserved.Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.1 IntroductionThe nRF51 Development Kit combined with the nRF51 SDK forms a complete solution for product development based on nRF51 series chips.The nRF51 Development Kit is fitted with the nRF51422 chip, which is a powerful, highly flexible multi-protocol System on Chip (SoC) ideally suited for ANT™/ANT+, Bluetooth® low energy (BLE), and 2.4 GHz proprietary ultra-low power wireless applications.And, if you are not using the ANT protocol, you can use the nRF51822 chip in your end product - without any changes needed to your code.1.1Key featuresThe nRF51 DK board has the following key features:•nRF51422 flash based ANT/ANT+, Bluetooth low energy SoC solution•2.4 GHz compatible with nRF24L devices•Buttons and LEDs for user interaction•I/O interface for Arduino form factor plug-in modules•SEGGER J-Link OB Debugger with debug out functionality•Virtual COM Port interface via UART•Drag and drop Mass Storage Device (MSD) programming•mbed enabled1.2Required toolsBelow is a list of hardware and software tools that is required if you plan to explore all the features on this development kit. All the tools may not be required for all use cases.Nordic Tools DescriptionnRFgo Studio nRFgo Studio is our tool to program and configure devices. It supports the programming ofnRF51 SoftDevices, applications, and bootloaders. The different programming modes areavailable on individual tabs in the nRF51 programming module. Studio is used for thefollowing:•Bluetooth Direct Test Mode (DTM) testing•Erasing flash memory•Programming a SoftDevice•Programming an application•Programming the bootloadernRFgo Studio supports programming of SEGGER J-Link based nRF51 devices.For more information, see the help in nRFgo Studio.nRF51 Tools nRF51 Tools is a package that contains JLinkARM, JLink CDC, nRFjprog, and mergehex.The nRFjprog is a command line tool for programming nRF51 series chips. It is also useful in aproduction setup.nRF51 Tools will be installed together with nRFgo Studio.nRF51 SDK The nRF51 Software Development Kit (SDK) provides source code of examples and librariesforming the base of your application development. The nRF51 SDK includes:•Example code•ANT profile examples•Bluetooth profile examples•Drivers•LibrariesFor more information, see the documentation packaged with the nRF51 SDK.Master Control Panel The Master Control Panel is the software tool that is used with the nRF51 Dongle (PCA10031) to act as a Bluetooth low energy peer device. You can test your application’s wireless connectionwith this tool.The Master Control Panel supports programming of SEGGER J-Link based nRF51 devices.For more information, see the help files in the Master Control Panel.nRF Master Control Panel for Android 4.3nRF Master Control Panel for Android 4.3 is a powerful generic tool that allows you to scan and explore your Bluetooth Smart devices and communicate with them on an Android phone. MCP supports a number of Bluetooth SIG adopted profiles including the Device Firmware Update (DFU) profile from Nordic Semiconductor.S110 SoftDevice Bluetooth low energy Peripheral/Broadcaster protocol stack. For more information, see the S110 nRF51822 SoftDevice Specification and the nRF51 SDK documentation.S120 SoftDevice Bluetooth low energy Central protocol stack solution supporting up to eight simultaneous Central role connections. For more information, see the S120 nRF51822 SoftDevice Specificationand the nRF51 SDK documentation.S130 SoftDevice Bluetooth Smart concurrent multi-link protocol stack solution supporting simultaneous Central/ Peripheral/Broadcaster/Observer role connections. For more information, see the S130nRF51822 SoftDevice Specification and the nRF51 SDK documentation.S210 SoftDevice ANT protocol stack. For more information, see the S210 nRF51422 SoftDevice Specification and the nRF51 SDK documentation.S310 SoftDevice ANT and Bluetooth low energy Peripheral controller and host multiprotocol stack. For more information, see the S310 nRF51422 SoftDevice Specification and the nRF51 SDK documentation.1.3DocumentationBelow is a list of the core documentation for the nRF51 Series and the nRF51x22 chip.Note: See our website for additional documentation such as Application Notes and White Papers.Third party toolsDescriptionKeil MDK-ARM Development Kit Keil MDK-ARM Development Kit is a development environment specifically designed formicrocontroller applications that lets you develop using the nRF51 SDK application and example files.SEGGER J-Link Software The J-Link software is required to debug using the J-Link hardware that is packaged with this development kit.ANTware IIANTWare is an application used for the control of ANT wireless devices. It is an excellent tool for first time ANT developers to explore the capabilities of ANT as a low power wireless solution, and for experienced users to easily setup and monitor advanced ANT networks. ANTWare II improves upon past versions with a slick new interface, streamlined functions, and a variety of new features.DocumentDescriptionnRF51 Series Reference ManualThe nRF51 Series Reference Manual is a functional description of all the modules and peripherals supported by the nRF51 series.nRF51x22 Product SpecificationThe nRF51x22 Product Specification contains all specifications specific to the chip.S110 nRF51822 SoftDevice SpecificationThe S110 nRF51822 SoftDevice Specification contains information about the SoftDevice features and performance.S120 nRF51822 SoftDevice SpecificationThe S120 nRF51822 SoftDevice Specification contains information about the SoftDevice features and performance.S130 nRF51822 SoftDevice SpecificationThe S130 nRF51822 SoftDevice Specification contains information about the SoftDevice features and performance.S210 nRF51422 SoftDevice SpecificationThe S210 nRF51422 SoftDevice Specification contains information about the SoftDevice features and performance.S310 nRF51422 SoftDevice SpecificationThe S310 nRF51422 SoftDevice Specification contains information about the SoftDevice features and performance.nRF51 SDK DocumentationThe nRF51 SDK documentation includes user guides, descriptions, and reference material to help you understand the protocols, examples, and other components of the SDK.nRF51x22 Product Anomaly NotificationThe nRF51x22 Product Anomaly Notification - list of anomalies relevant for the chip.ANT Message Protocol and UsageThe ANT Message Protocol and Usage document describes the ANT protocol in detail and contains the fundamental knowledge you need in order to develop successfully with ANT.nRF51 Development Kit Hardware FilesThe nRF51 Development Kit includes firmware source code, documentation, hardware schematics, and layout files. Included are the following files:•Altium Designer files •Schematics •PCB layout files •Production files•Assembly drawings •Drill files •Gerber files•Pick and Place files •Bill of Materials1.4Development Kit release notesDate Kit version Description October 2014 1.0•First release.2 Kit contentIn addition to hardware, the nRF51 Development Kit consists of firmware source code, documentation, hardware schematics, and layout files which are available from .Figure 1 nRF51 Development Kit content1 x3V CR2032Lithium battery5 x nRF51422 samples1 x nRF51 Development Kit board (PCA10028)3 GettingstartedThis section shows you how to get access to the tools, libraries, and documentation.Connect your nRF51 Development Kit to a computer.1.Connect your nRF51 DK board to a computer with a USB cable.2.The status light (LD5) will come on, indicating it has power.3.After a few seconds, the computer will recognize the nRF51 DK board as a standard USB drive.Figure 2 Windows exampleGet started with the toolchain and examples.1.Download and install nRFgo Studio (which includes the nRF Tools package; JLinkARM, JLink CDC,nRFjprog, and mergehex) from .2.Download and install the latest Keil MDK-ARM from /arm.3.Download and install the latest nRF51 SDK found on .4.Read the information in the Readme.txt file that is installed together with the SDK.After the installation, the SDK documentation is found here:Online: /nRF51_SDK/doc/index.html.Offline: <keil_location>/ARM/Pack/NordicSemiconductor/nRF_Examples/<version>/documentationThe nRF51 DK board is equipped with a boot/reset button (SW5). This button is connected to the interface MCU on the board and have two functions:•Reset button for the nRF device.•Enter boot loader mode of the interface MCU.During normal operation the button will function as a reset button for the nRF device. To enter boot loader mode of the Interface MCU, the button must be pressed while the board is powered until the LED LD5 starts to blink. This is done by pressing the reset button and power cycle the board, either by disconnecting and reconnecting the USB cable or toggle the power switch (SW6).4.2Virtual COM portThe on-board Interface MCU features a Virtual COM port via UART.•Flexible baudrate setting up to 1 Mbps•Dynamic Hardware Flow Control (HWFC) handling•Tri-stated UART lines while no terminal is connectedTable 1 shows an overview of the UART connections on nRF51422 and the interface MCU.nRF51422Interface MCUDefault GPIO UART UARTP0.08RTS CTSP0.09TXD RXDP0.10CTS RTSP0.11RXD TXDTable 1 Relationship of UART connections on nRF51422 and Interface MCUThe UART signals are routed directly to the Interface MCU. The UART pins connected to the Interface MCU is tri-stated when no terminal is connected to the Virtual COM port on the computer.Note: The terminal used must send a DTR signal in order to configure the UART Interface MCU pins. The P0.08 (RTS) and P0.10 (CTS) can be used freely when HWFC is disabled on the nRF51422.4.3Interface MCU FirmwareThe on board Interface MCU is factory programmed with an mbed compliant bootloader, this feature enables the ability to swap interface FW between the factory preloaded SEGGER J-Link OB and the nRF51 mbed interface FW, see section 4.1 “IF Boot/Reset button” on page8 on how to enter the bootloader.To swap Interface MCU FW, simply drag the Interface image (.bin) into the mounted bootloader drive on the connected computer and power cycle the board.Both the nRF51 mbed interface FW and the J-Link OB image can be downloaded from.Note: If you have swapped to the mbed image and want to revert back to the J-Link image, download the latest SEGGER J-Link software from and open a debug sessionto update to the latest J-Link OB firmware version.Note: The J-Link serial number is linked to the Interface MCU and will not change even when swapping the Interface MCU FW, so it can be useful to write the serial number on a sticker onthe board.5 HardwaredescriptionThis chapter describes the nRF51 Development Kit board (PCA10028).Figure 5 nRF51 DK board bottom5.2Block diagramFigure 6nRF51 DK board block diagramFigure 7 Power supply optionsThe 5 V from the USB is regulated down to 3.3 V through an on-board voltage regulator. The battery and external power supply are not regulated. The power sources are routed through a set of diodes (D1A, D1B, and D1C) for reverse voltage protection, where the circuit is supplied from the source with the highest voltage.Note: When not USB powered, the Interface MCU is in dormant state and will draw an additional current of ~ 20 μA in order to maintain the reset button functionality. This will affect boardcurrent consumption, but will not affect the nRF51 current measurements as described inSection 5.7 “Measuring current” on page18.5.4Connector interfaceAccess to the nRF51422 GPIOs is available at connectors P2, P3, P4, P5, and P6 on the nRF51 DK board.In addition there is access to ground and power on the P1 connector.Figure 10 nRF51 DK board connectorsThe signals are also available on bottom side connectors P7, P8, P9, P10, P11, and P12. By mounting pin lists on the connector footprints, the nRF51 DK board can be used as a shield for Arduino motherboards or other boards that follows the Arduino standard.For easy access to GPIO, power, and ground, the signals can also be found on the through-hole connectors P13-P17.Note: Some pins have default settings.•P0.08, P0.09, P0.10, and P0.11 are by default used by the UART connected to theInterface MCU. See Section 4.2 “Virtual COM port” on page9 for more information.•P0.17 - P0.24 are by default connected to the buttons and LED.See Section 5.5 “Buttons and LEDs” on page16 for more information.•P0.26 and P0.27 are by default used for the 32 kHz crystal and are not available on theconnectors. See Section 5.6 “32.768 kHz crystal” on page17 for more information.When the nRF51 DK board is used as a shield together with an Arduino standard motherboard, the Arduino signals is routed like shown in Figure 11.Figure 11 Arduino signals routing on the nRF51 DK board5.5Buttons and LEDsThe four buttons and four LEDs on nRF51 DK board are connected to dedicated I/Os on the nRF51422 chip. The connections are shown in Table 3.Part GPIO ShortButton 1P0.17-Button 2P0.18-Button 3P0.19-Button 4P0.20-LED 1P0.21SB5LED 2P0.22SB6LED 3P0.23SB7LED 4P0.24SB85.632.768 kHz crystalnRF51422 can use an optional 32.768 kHz crystal (X2) for higher accuracy and lower average power consumption. On the DK board, P0.26 and P0.27 are by default used for the 32.768 kHz crystal and are not available as a GPIO on the connectors.Note: When using ANT/ANT+, the 32.768 kHz crystal (X2) is required for correct operation.5.7Measuring currentThe current drawn by the nRF51422 device can be monitored on the nRF51 DK board. To measure the current, you must first prepare the board by cutting the shorting of solder bridge SB9.There are two ways of measuring the current consumption:1.Connect an ampere-meter between the pins of connector P22. This will monitor the currentdirectly.Figure 16 Current measurement with ampere-meter2.Mount a resistor on the footprint for R6. The resistor should not be larger than 10 Ω. Connect anoscilloscope in differential mode or similar with two probes on the pins of the P1 connector andmeasure the voltage drop. The voltage drop will be proportional with the current consumption.Note: The current measurements will become unreliable when a Serial terminal is connected to the Virtual COM port.5.8RF measurementsThe nRF51 DK board is equipped with a small size coaxial connector for conducted measurements of the RF signal (J1). The connector is of SWF type from Murata (part no. MM8130-2600) with an internal switch. By default, when there is no cable attached, the RF signal is routed to the on-board PCB trace antenna. A test probe is available from Murata, part no. MXHS83QE3000, which has a standard SMA connection on the other end for connecting instruments. When connecting the test probe, the internal switch in the SWF connector will disconnect the PCB antenna and connect the RF signal from the nRF51 device to the test probe.Figure 18 Connecting a spectrum analyzerThe connector and test probe will add loss to the RF signal which should be taken into account when doing measurements, see Table 4.Table 4 Typically loss in connector and test probeFrequency (MHz)Loss (dB)2440 1.04880 1.773202.6The P20 also features a debug out connection in order to program shield mounted targets, as for the Debug out P19 header the Interface MCU will detect the supply voltage on the mounted shield and program/ debug the shield target.If the Interface MCU detects target power on both P19 and P20 it will default to program/debug the target connected to P19Page 21nRF51 Development Kit User Guide v1.0Liability disclaimerNordic Semiconductor ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out of the application or use of any product or circuits described herein.Life support applicationsNordic Semiconductor’s products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.Contact detailsFor your nearest distributor, please visit .Information regarding product updates, downloads, and technical support can be accessed through your My Page account on our homepage.Revision historyARM statementKeil, μVision, and Cortex are trademarks of ARM Limited. All other brands or product names are the property of their respective holders.DateVersion DescriptionOctober 2014 1.0•First release.Main office:Phone: +47 72 89 89 00Fax: +47 72 89 89 89 Otto Nielsens veg 127052 Trondheim NorwayMailing address:Nordic Semiconductor P .O. Box 23367004 TrondheimNorway。
nrf51822数据⼿册_引脚图_参数Copyright ? 2014 Nordic Semiconductor ASA. All rights reserved.Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.nRF51822Multiprotocol Bluetooth ? low energy/2.4 GHz RF System on Chip Product Specification v3.3Key Features2.4 GHz transceiver-93 dBm sensitivity in Bluetooth low energy mode250 kbps, 1 Mbps, 2 Mbps supported data ratesTX Power -20 to +4 dBm in 4 dB stepsTX Power -30 dBm Whisper mode13 mA peak RX, 10.5 mA peak TX (0 dBm)9.7 mA peak RX, 8 mA peak TX (0 dBm) with DC/DCRSSI (1 dB resolution)ARM Cortex-M0 32 bit processor275 µA/MHz running from flash memory150 µA/MHz running from RAMSerial Wire Debug (SWD)S100 series SoftDevice readyMemory256 kB or 128 kB embedded flash program memory16 kB or 32 kB RAMOn-air compatibility with nRF24L seriesFlexible Power ManagementSupply voltage range 1.8 V to 3.6 V4.2 µs wake-up using 16 MHz RCOSC0.6 µA at 3 V OFF mode1.2 µA at 3 V in OFF mode + 1 region RAM retention2.6 µA at 3 V ON mode, all blocks IDLE8/9/10 bit ADC - 8 configurable channels31 General Purpose I/O PinsOne 32 bit and two 16 bit timers with counter modeSPI Master/SlaveLow power comparatorTemperature sensorTwo-wire Master (I2C compatible)UART (CTS/RTS)CPU independent Programmable Peripheral Interconnect (PPI)Quadrature Decoder (QDEC)AES HW encryptionReal Timer Counter (RTC)Package variantsQFN48 package, 6 x 6 mmWLCSP package, 3.50 x 3.83 x 0.50 mmWLCSP package, 3.50 x 3.83 x 0.35 mmWLCSP package, 3.83 x 3.83 x 0.50 mmWLCSP package, 3.83 x 3.83 x 0.35 mmWLCSP package, 3.50 x 3.33 x 0.50 mm Applications Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad ?Interactive entertainment devices ?Remote control ?Gaming controller ?Beacons ?Personal Area Networks Health/fitness sensor and monitor devices Medical devices Key-fobs + wrist watches Remote control toysLiability disclaimerNordic Semiconductor ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out of the application or use of any product or circuits described herein.Life support applicationsNordic Semiconductor’s products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.Contact detailsFor your nearest distributor, please visit .Information regarding product updates, downloads, and technical support can be accessed through your My Page account on our home page.RoHS and REACH statementNordic Semiconductor's products meet the requirements of Directive 2002/95/EC of the EuropeanParliament and of the Council on the Restriction of Hazardous Substances (RoHS) and the requirements of the REACH regulation (EC 1907/2006) on Registration, Evaluation, Authorization and Restriction of Chemicals. The SVHC (Substances of Very High Concern) candidate list is continually being updated.Complete hazardous substance reports, material composition reports and latest version of Nordic's REACH statement can be found on our website .Main office:Phone: +47 72 89 89 00Fax: +47 72 89 89 89 Otto Nielsens veg 127052 Trondheim NorwayMailing address:Nordic Semiconductor P .O. Box 23367004 TrondheimNorwayDatasheet StatusRevision History StatusDescription Objective Product Specification (OPS)This product specification contains target specifications for product development.Preliminary Product Specification (PPS)This product specification contains preliminary data; supplementary datamay be published from Nordic Semiconductor ASA later.Product Specification (PS)This product specification contains final product specifications. NordicSemiconductor ASA reserves the right to make changes at any timewithout notice in order to improve design and supply the best possibleproduct.DateVersion Description July 2016 3.3Added documentation for the nRF51822 CTAA version of the chip.Added content:Section 9.5 “CTAA WLCSP package” on page 71Section 11.9 “CTAA WLCSP package” on page 118Updated content:Feature list on the front page.Section 2.2.3 “CEAA, CFAC, CTAA, and CTAC WLCSP ball assignment and functions”on page 17Section 3.2.1 “Code organization” on page 22Section 3.2.2 “RAM organization” on page 22Section 3.3 “Memory Protection Unit (MPU)” on page 23Section 7.1.2 “CTAA and CTAC light sensitivity” on page 39Section 7.2 “CTAA and CTAC mechanical strength” on page 39Section 10.6 “Code ranges and values” on page 76Section 10.7 “Product options” on page 78Chapter 11 “Reference circuitry” on page 79. Added resistor R1 on the schematicsfor all variants.January 2016 3.2Added documentation for the nRF51822 CTAC version of the chip.Added content:Section 4.10.1 “Enable 4 Mbps SPIS bit rate” on page35Section 7.2 “CTAA and CTAC mechanical strength” on page39Section 9.6 “CTAC WLCSP package” on page72Section 11.10 “CTAC WLCSP package” on page124Updated content:Feature list on the front page.Section 2.2.3 “CEAA, CFAC, CTAA, and CTAC WLCSP ball assignment and functions”on page17Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Chapter 6 “Absolute maximum ratings” on page38Section 7.1 “WLCSP light sensitivity” on page39Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41Section 8.1.5 “32.768 kHz crystal oscillator (32k XOSC)” on page43Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page44Section 8.2 “Power management” on page45Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57 Section 10.6 “Code ranges and values” on page76Section 10.7 “Product options” on page78October 2014 3.1Added documentation for the following versions of the chip:nRF51822-QFAC AA0nRF51822-QFAC Ax0nRF51822-CDAB AA0nRF51822-CDAB Ax0nRF51822-CFAC AA0nRF51822-CFAC Ax0(The x in the build codes can be any number between 0 and 9.)Added content:Section 2.2.2 “CDAB WLCSP ball assignment and functions” on page14Section 9.2 “CDAB WLCSP package” on page68Section 9.4 “CFAC WLCSP package” on page70Updated content:Feature list on the front page.Section 2.2.3 “CEAA and CFAC WLCSP ball assignment and functions” on page17 Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Section 8.2 “Power management” on page45Section 8.3 “Block resource requirements” on page49Section 8.12 “Analog to Digital Converter (ADC) specifications” on page61Section 10.6 “Code ranges and values” on page76Section 10.7 “Product options” on page78August 2014 3.0Update to reflect the changes in build code:nRF51822-QFAA Hx0nRF51822-CEAA Ex0nRF51822-QFAB Cx0(The x in the build codes can be any number between 0 and 9.)If you are working with a previous revision of the chip, read version 2.x of the document. Added content:Section 8.5.3 “Radio current consumption with DC/DC enabled” on page51Section 11.1.1 “PCB layout example” on page80Updated content:Feature list on the front page.Section 2.1 “Block diagram” on page11Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Section 3.4 “Power management (POWER)” on page24Section 3.6 “Clock management (CLOCK)” on page28Section 3.8 “Debugger support” on page31Section 4.2 “Timer/counters (TIMER)” on page33Chapter 5 “Instance table” on page37Chapter 7 “Operating conditions” on page39Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page42Section 8.1.4 “16 MHz RC oscillator (16M RCOSC)” on page43Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page44Section 8.1.7 “32.768 kHz Synthesized oscillator (32k SYNT)” on page44Section 8.2 “Power management” on page45Section 8.3 “Block resource requirements” on page49Section 8.4 “CPU” on page49Section 8.5.6 “Radio timing parameters” on page55Section 8.5.7 “Antenna matching network requirements” on page55Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications”on page56Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57Section 8.12 “Analog to Digital Converter (ADC) specifications” on page61Section 8.13 “Timer (TIMER) specifications” on page62Section 8.15 “Temperature sensor (TEMP)” on page62Section 8.22 “Non-Volatile Memory Controller (NVMC) specifications” on page65Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page66Section 9.2 “CDAB WLCSP package” on page68Section 10.7.2 “Development tools” on page78Chapter 11 “Reference circuitry” on page79October 2013 2.0This version of the document will target the nRF51822 QFAA G0 revision of the chip. If you are working with a previous revision of the chip, read version 1.3 or earlier of thedocument.Updated the following sections:Key Feature list on the front page,Chapter 1 “Introduction” on page10,Section 2.1 “Block diagram” on page11,Section 2.2 “Pin assignments and functions” on page12,Section 3.2 “Memory” on page21,Section 3.5 “Programmable Peripheral Interconnect (PPI)” on page27,Section 3.7 “GPIO” on page31,Section 4.1 “2.4 GHz radio (RADIO)” on page32,Section 4.2 “Timer/counters (TIMER)” on page33,Section 4.3 “Real Time Counter (RTC)” on page33,Section 4.10 “Serial Peripheral Interface (SPI/SPIS)” on page35,Section 4.12 “Universal Asynchronous Receiver/Transmitter (UART)” on page36,Section 4.14 “Analog to Digital Converter (ADC)” on page36,Section 4.15 “GPIO Task Event blocks (GPIOTE)” on page36,Chapter 5 “Instance table” on page37,Chapter 6 “Absolute maximum ratings” on page38,Chapter 8 “Electrical specifications” on page40,Section 8.1 “Clock sources” on page40,Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41,Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page42,Section 8.2 “Power management” on page45,Section 8.3 “Block resource requirements” on page49,Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications” on page56,Section 8.9 “Serial Peripheral Interface (SPI) Master specifications” on page58,Section 8.11 “GPIO Tasks and Events (GPIOTE) specifications” on page60,Section 8.13 “Timer (TIMER) specifications” on page62,Section 8.16 “Random Number Generator (RNG) specifications” on page63,Section 8.17 “AES Electronic Codebook Mode Encryption (ECB) specifications” on page63, Section 8.18 “AES CCM Mode Encryption (CCM) specifications” on page63,Section 8.19 “Accelerated Address Resolver (AAR) specifications” on page63,Section 8.21 “Quadrature Decoder (QDEC) specifications” on page64,Section 11.1 “PCB guidelines” on page79,Section 11.3 “QFAA QFN48 package” on page82, andSection 11.7 “CEAA WLCSP package” on page106.Added the following sections:Section 3.3 “Memory Protection Unit (MPU)” on page23,Section 4.5 “AES CCM Mode Encryption (CCM)” on page34,Section 4.6 “Accelerated Address Resolver (AAR)” on page34,Section 4.16 “Low Power Comparator (LPCOMP)” on page36,Section 8.5.7 “Antenna matching network requirements” on page55,Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57,Section 8.18 “AES CCM Mode Encryption (CCM) specifications” on page63,Section 8.19 “Accelerated Address Resolver (AAR) specifications” on page63, and Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page66.May 2013 1.3Updated schematics and BOMs in section 11.3 on page 61.April 2013 1.2Added chip variant nRF51822-CEAA. Updated feature list on front page. UpdatedSection 3.2.1 on page 15, Section 3.2.2 on page 15, Chapter 6 on page 28,Section 10.4 on page 52, and Section 10.5.1 on page 53.AddedSection 2.2.2 on page 10, Section 7.1 on page 29, Section 9.2 on page 50,and Section 11.3 on page 61.Removed PCB layouts in Chapter 11 on page 54.March 2013 1.1Added chip variant nRF51822-QFAB. Added 32 MHz crystal oscillator feature. Updated feature list on front page. Moved subsection ‘Calculating current when the DC/DCconverter is enabled’ from chapter 8 to the nRF51 Series Reference Manual.UpdatedChapter 1 on page 6, Section 2.2 on page 8, Section 3.2 on page 12,Section 3.5 on page 16, Section 3.5.1 on page 17, Section 4.2 on page 21, Chapter 5 onpage 24, Section 8.1 on page 27, Section 8.1.2 on page 28, Section 8.1.5 on page 30,Section 8.2 on page 32, Section 8.3 on page 34, Section 8.5.3 on page 36, Section 8.8 onpage 40, Section 8.9 on page 41, Section 8.10 on page 42, Section 8.14 on page 43,Chapter 10 on page 47, Section 11.2 on page 51, Section 11.3 on page 54, andSection 11.4 on page 57.AddedSection 3.5.4 on page 19, Section 8.1.3 on page 29, andSection 11.1 on page 50.November 2012 1.0Changed from PPS to PS. Updated the feature list on the front page.UpdatedTable 11 on page 25, Table 12 on page 26, Table 14 on page 28,Table 15 on page 28, Table 16 on page 29, Table 17 on page 29,Table 18 on page 30, Table 19 on page 31, Table 21 on page 32,Table 22 on page 32, Table 23 on page 33,Table 27 on page 36,Table 28 on page 37, Table 29 on page 37, Table 31 on page 38,Table 32 on page 38, Table 35 on page 39, Table 38 on page 40,Table 39 on page 40, Table 55 on page 47, Figure 9 on page 48, andTable 57 on page 50.Table of contents1Introduction (10)1.1Required reading (10)1.2Writing conventions (10)2Product overview (11)2.1Block diagram (11)2.2Pin assignments and functions (12)3System blocks (20)3.1CPU (20)3.2Memory (21)3.3Memory Protection Unit (MPU) (23)3.4Power management (POWER) (24)3.5Programmable Peripheral Interconnect (PPI) (27)3.6Clock management (CLOCK) (28)3.7GPIO (31)3.8Debugger support (31)4Peripheral blocks (32)4.1 2.4 GHz radio (RADIO) (32)4.2Timer/counters (TIMER) (33)4.3Real Time Counter (RTC) (33)4.4AES Electronic Codebook Mode Encryption (ECB) (33)4.5AES CCM Mode Encryption (CCM) (34)4.6Accelerated Address Resolver (AAR) (34)4.7Random Number Generator (RNG) (34)4.8Watchdog Timer (WDT) (34)4.9Temperature sensor (TEMP) (35)4.10Serial Peripheral Interface (SPI/SPIS) (35)4.11Two-wire interface (TWI) (35)4.12Universal Asynchronous Receiver/Transmitter (UART) (36)4.13Quadrature Decoder (QDEC) (36)4.14Analog to Digital Converter (ADC) (36)4.15GPIO Task Event blocks (GPIOTE) (36)4.16Low Power Comparator (LPCOMP) (36)5Instance table (37)6Absolute maximum ratings (38)7Operating conditions (39)7.1WLCSP light sensitivity (39)7.2CTAA and CTAC mechanical strength (39)8Electrical specifications (40)8.1Clock sources (40)8.2Power management (45)8.3Block resource requirements (49)8.4CPU (49)8.5Radio transceiver (50)8.6Received Signal Strength Indicator (RSSI) specifications (55)8.7Universal Asynchronous Receiver/Transmitter (UART) specifications (56)8.8Serial Peripheral Interface Slave (SPIS) specifications (57)8.9Serial Peripheral Interface (SPI) Master specifications (58)8.10I2C compatible Two Wire Interface (TWI) specifications (59)8.11GPIO Tasks and Events (GPIOTE) specifications (60)8.12Analog to Digital Converter (ADC) specifications (61)8.13Timer (TIMER) specifications (62)8.14Real Time Counter (RTC) (62)8.15Temperature sensor (TEMP) (62)8.16Random Number Generator (RNG) specifications (63)8.17AES Electronic Codebook Mode Encryption (ECB) specifications (63) 8.18AES CCM Mode Encryption (CCM) specifications (63)8.19Accelerated Address Resolver (AAR) specifications (63)8.20Watchdog Timer (WDT) specifications (64)8.21Quadrature Decoder (QDEC) specifications (64)8.22Non-Volatile Memory Controller (NVMC) specifications (65)8.23General Purpose I/O (GPIO) specifications (66)8.24Low Power Comparator (LPCOMP) specifications (66)9Mechanical specifications (67)9.1QFN48 package (67)9.2CDAB WLCSP package (68)9.3CEAA WLCSP package (69)9.4CFAC WLCSP package (70)9.5CTAA WLCSP package (71)9.6CTAC WLCSP package (72)10Ordering information (73)10.1Chip marking (73)10.2Inner box label (73)10.3Outer box label (74)10.4Order code (74)10.5Abbreviations (75)10.6Code ranges and values (76)10.7Product options (78)11Reference circuitry (79)11.1PCB guidelines (79)11.2Reference design schematics (81)11.3QFAA QFN48 package (82)11.4QFAB QFN48 package (88)11.5QFAC QFN48 package (94)11.6CDAB WLCSP package (100)11.7CEAA WLCSP package (106)11.8CFAC WLCSP package (112)11.9CTAA WLCSP package (118)11.10CTAC WLCSP package (124)12Glossary (130)万联芯城专注电⼦元器件配单服务，只售原装现货库存，万联芯城电⼦元器件全国供应，专为终端⽣产，研发企业提供现货物料，价格优势明显，BOM配单整单采购可享优惠价，提交BOM表报价，最快可当天发货，电⼦元器件现货销售，满⾜客户物料需求，万联芯城凭借丰富的电⼦元器件供应链体系已在业内打下良好的品牌⼝碑，完整PDF资料点击进⼊万联芯城。
