DENKI KAGAKU KOGYO K.K.
日本电气化学工业有限公司
DENKA
The field suitable for Hybrid IC
适用与混合集成电路领域
Classification of printed circuit board 印刷线路板的分类
Flexiuble substrate 柔性基板
Ceramic substrate 陶瓷基片
Insulated Metal Substrate 绝缘金属基材
Substrate with thick film circuit.厚膜陶瓷线路板
Substrate with thin circuit.薄膜陶瓷线路板 Substrate Multi-layer 多层陶瓷线路板 Metal Base Substrate ( Al, Cu, Fe) 金属基材(铝,铜,铁)
Metal Core Substrate (Al, Cu, Fe)金属芯基材(铝,铜,铁)
Metal Base Substrate with Multi-Layer (FR-4)多层环氧树脂金属基材
Paper based material (phenol) 纸基板(酚基材)
Glass cloth based material (epoxy, polyimide)玻璃基材（环氧树脂，聚酰亚胺）
Rigid substrate 刚性基板
Organic substrate 有机基板
Composite (combination with different materials)复合材料（与不同的材料结合）
Thermoplastic resin 热塑性树脂
Film material (polyimide, polyester)薄膜材料（聚酰亚胺，聚酯）
Comparison of properties with each substrate 每种基材的性能对照
*Al base type基本类型
Typical structure of IMS 标准层的典型结构
Conductor (Cu foil, etc.) 导体（铜箔等）
Insulator绝缘层Metal Base（Al, Cu, Fe, etc.)
金属基材（铝，铜，铁等）
Typical structure of HIC 典型的混合集成电路结构
Ni plating 镍层
Al wire铝丝
Plastic case塑胶外壳Semiconductor
半导体Chip resistance
贴片电阻Resin树脂
Lead terminal
引线端子
Insulator
绝缘层Aluminum board 铝板IMS 标准层
Development performance of IMS 标准层的发展方向
Improvement of Insulator 绝缘层的改善
→Higher thermal conductivity, higher reliability and higher heat resistance.
更高的导热系数，高可靠性和高耐热性.
R a t e d v o l t a g e (V )额定电压
Field of each substrate 每种基材的领域 K-1 一般型
性型
TH-1高耐热高导型
B-1超高导热型
Industrial machine 工业机器
Air conditioner
500
空调设备
HITT PLATE(IMS)
高导热铝基板
Alumina substrate 氧化铝层
AlN substrate 氮化铝层
Audio 音频
50
100
Rated current(A)
额定电流
Market request 市场需求
Cost down, down sizing and Higher thermal conductivity 低成本小型化高导热系数
Thermal 2W/mK conductivity 导热系数
4W/mK
8W/mK
T h e r m a l c o n d u c t i v i t y (W /m K ) 导热系数
Lineup of HITT PLATE’s insulator 绝缘高导热铝基板的应用范围
Heat cycle reliability 长期可靠性
T h e r m a l r e s i s t a n c e ºC /W 热变电阻
Comparison of HITT PLATE 高导热铝基板对照
1.2 1 0.8 0.6 0.4 0.2
Alumina substrate
氧化铝层
50 100 150 200 600 650
Thickness of insulator 绝缘层厚度
The results of thermal resistance by thermal viewer
IMS B-1(8W/mK) type IMS B-1类型
(0.125mmt) 热变电阻耐热测试的结果
Alumina DBC氧化铝合基板
(0.635mm)
Test sample
测试样品
基材substrate
TO-220
Low低High高（2SC2233) Max.temp.最高温度
℃℃
