AVTRONSYS(艾维创) 推出新一代DXP系列高清混合矩阵-8页精选文档

AVTRONSYS（艾维创）推出新一代DXP系列高清混合矩阵AVTRONSYS 新推出的DXP高清混合矩阵切换器是一款高性能的高清视频信号交换设备。

提供HDMI、DVI、VGA、CVBS、S-Video、YPbPr、SDI信号本地直连输入，以及HDMI、DVI、VGA、SDI直连输出，DVI/HDMI 无缝输出。

除此之外，还提供双绞线(HDBaseT)输入输出板卡，配合双绞线传输器可通过双绞线延长输入与输出的信号传输距离到100M，另外还提供Fiber(光纤)输入输出板卡，配合光纤传输器通过单芯多模光纤延长输入与输出的信号传输距离到300M传输的单模收发器提升传输距离达40公里。

领先的全数字信号处理技术可保证信号无失真处理，将最优质的画面送至显示终端。

支持RS232接口，支持PC客户端控制，支持遥控控制。

可选型号：DXP1010（2U）、DXP1818（3U）、DXP3636（6U）、DXP7272（13.5U）......功能特点：支持本地视频回放功能支持HDMI/DVI输出卡无缝切换支持DDC信息直通支持现场DDC信息定制采用单卡单路架构，可支持不同视频接口混插支持HDMI音频分离功能采用LED灯形式形象直观的表示输入/输出通道对应的关系采用音频独立输出架构、支持音视频独立切换功能DXP系列输入/输出卡：型号：MIX01-INMIX-IN输入卡支持硬件/软件通道切换支持音频输入信号格式：AV / VGA / YPbPr接口数量：单路输入口最高分辨率：1920×1200@60HZ（VGA信号）带宽：380MHZ最小最大电平：模拟信号0.5-2.0Vpp阻抗：75Ω型号：DVI01-IN/OUTDVI输入/输出卡信号格式：DVI1.0规范中的DVI-D全数字TMDS信号?物理接口：24+5针/DVI-I/母接口(仅接收DVI-D信号）?接口数量：单路输入口/输出口最高分辨率：1920×1200@60HZDDC交换：支持最小/最大电平：TMDS 2.9V/3.3V阻抗：50Ω接口带宽：1.65Gbps，全数字（总共4.95Gbps）位时钟抖动：<0.15Tbit信号强度：TMDS 0.8VppEDID：可选默认EDID或者现场可编程最大输入/输出距离：小于20米型号：HDMI01-IN/OUTHDMI输入/输出卡物理接口：HDMI Type A接口数量：单路输入口/输出口最高分辨率：1920×1080P@60HDCP：支持EDID ：可选默认EDID或者现场可编程最大输入/输出距离：小于20米像素带宽：165MHZ,全数字接口带宽：1.65Gbps，全数字（总共4.95Gbps）位时钟抖动：<0.15Tbit最大传输延时：5nS（±1nS）阻抗：50Ω型号：SDI01-IN/OUTSDI输入/输出卡信号格式：SD/HD/3G-SDI SMPTE物理接口：BNC/母接口接口数量：单路输入口/输出口最高分辨率：1920×1080@60Hz阻抗：75Ω视频格式：270Mbps SDI/1.485Gbps HD-SDI /2.97Gbps 3G-SDI ?数据频率：270Mbps到2.97Gbps幅度：0.8Vp-p±10%上升/下降时间：400-700ps最大传输范围：3G:140m.HD200m.SD:400m回波损率：<-15dB，***************型号：HDBaseT02-IN/OUTHDBaseT输入/输出卡连接器：5类线RJ45 8针色深：10位或8位，自动地依照输入输出分辨率接口数量：双路输入口/输出口信号带宽：4.95Gbps图像分辨率：支持480i-1080p，640×480-1920×1080@60HZ 依照输入分辨率最大像素时钟：165MHz型号：Fiber01-IN/OUTFiber输入/输出卡接口类型：LC接口(单纤)接口数量：单路输入口/输出口最大接口带宽：4.95Gbps最大像素时钟：165MHz最高分辨率：支持1920×1080@60Hz最长传输距离：单模(SM波长：1310nm)：可达40公里；多模(MM波长：850nm)：可达300米传输功率：-5dBm（典型）最大光损耗：单模：13dB多模：7dB型号：Video01-OUTVIDEO输出卡连接器：BNC插座信号类型：模拟标清或高清接口数量：单路输出口阻抗：75Ω最大传播延时：5ns（±1ns）最高分辨率：输出1080P高清信号型号：VGA01-OUT-Scale VGA01-OUTVGA（直通/Scale)输出卡支持硬件/软件输出分辨率的选择【仅VGA(SCALE)输出卡】?信号格式：RGBHV / VGA接口数量：单路输出口连接器：15针VGA母接口最高分辨率：1920×1080@60HZ带宽：380MHZ信号电平：RGB 0.7Vpp；HV 5Vpp最小最大电平：模拟信号0.5-2.0Vpp阻抗：75Ω型号：XHDMI01-OUT XDVI01-OUTHDMI/DVI无缝切换输出卡信号格式：HDMI/DVI-I 1.3全数字TMDS信号?接口数量：单路输出口最高分辨率：1920×1200@60HZ最小/最大电平：TMDS 2.9V/3.3V阻抗：50Ω像素带宽：165MHZ,全数字位时钟抖动：<0.15Tbit。

新品发布NEW PRODUCTS今日电子 · 2018年5月 · 准，在-40～+125℃的温度范围内具有±20×10-6的稳定性。

作为业界首款双输出M E M S振荡器，D S A2311可用于替代电路板上的两个晶体或振荡器。

该器件解决了电路板的空间限制问题，在节省成本的同时还简化了设计流程，使客户能够更好地管理供货并整合物料清单。

D S A2311采用简洁的2.5mm×2.0mm封装，非常适合那些需要使用带有多个控制器的复杂电路板的应用，例如，信息娱乐系统和相机模块等。

Microchip Technology最高分辨率的35mm CCD图像传感器全新的4300万像素（M P）分辨率的电荷耦合器件（C C D）图像传感器，光学格式是便利的35m m，扩展应用于要求严格高分辨率工业成像实力。

K A I-43140适用于需要极高分辨率的图像捕获及出色的图像均匀性的应用，例如，生产线终端检测的高清（H D）和超高清（UHD）平板显示器及航拍等。

K A I-43140采用一个新型4.5μm Interline Transfer CCD（ITCCD）像素，相较于先前5.5μm的设计，分辨率提高50％，同时保持关键的成像性能。

该器件具有真正的电动“全局”快门，通过使用灵活的1、2或4输出读取架构，支持高达4f p s的全分辨率帧速率。

KAI-43140的封装和引脚定义与流行的29M P K A I-29050和K A I-29052理能力。

M A X32652片上集成3M B闪存和1M B S R A M，工作频率高达120 M H z，为I o T设备提供高度集成的解决方案，能够实现更高的处理能力和智能化管理。

集成高速外设，例如，高速USB 2.0、安全数字(SD)存储卡和控制器、薄膜晶体管(T F T)显示屏，以及完整的安全引擎，使M A X32652可以充当IoT设备的高级大脑，运行功耗极低。

1. Windows Server 2016 version 1709 or newer2. Windows 10 version 1803 or newer3. Windows Embedded Standard 7 Service Pack 1 or newer4. Windows Embedded Compact 7, formerly known as Windows CE5. Linux on x86 processors with glibc-2.12.2 (or newer) and libstdc++.so.6.0.14 (or newer) or Linux on arm processors with glibc-2.13(or newer) and libstdc++.so.6.0.17 (or newer)Feature comparisonWhen installing AVEVA Edge in your computer, it installs the development environment (AVEVA Edge STUDIO), along with the AVEVA Edge Runtime Editions compiled to support specific platforms. You can consult the Technical Reference Manual (Help) from AVEVA Edge STUDIO on how to deploy runtime editions in remote stations. The following table describes the features supported by each AVEVA Edge Runtime Edition. You can use the same development environment (AVEVA Edge STUDIO) to create projects for any AVEVA Edge Runtime Edition. In other words, the projects are the same for any platform. Each Runtime Edition of AVEVA Edge has been compiled to support specific platforms, with the capabilities and limitations described below. This document focuses only on the main capabilities of each feature.Consult the Technical Reference Manual (Help) for additional details on capabilities and limitations of each runtime edition.1. Encryption supported by SCADA and Embedded HMI, but not supported by Compact HMI2. The vast majority of the built-in functions are supported by all Runtime Editions. However, specific functionsare Not supported on specific platforms. The complete reference is available in the Technical reference manual at “Appendix: Built-in Scripting Language > List of available functions”3. Even though the ODBC worksheets (legacy) are not supported, the Database/ERP worksheets are supported4. The image of the operating system must support Remote DCOM5. The vast majority of the native communication drivers are supported by many runtime editions. However,specific native drivers are not supported on specific platforms. The complete reference is available through the actual product (Project Explorer > Comm > Drivers > Add/Remove Drivers). Moreover, IoT View supports main driver sheets only6. Studio Mobile Access Tabular supported for both Embedded HMI and Compact HMI. Studio Mobile Access(HTML5) supported by Embedded HMI, but not by Compact HMI7. The screens can be converted to a different resolution by using the command “Home > Convert resolution”8. Fill effects are supported for rectangle objects9. The following formats are supported: BMP, JPG, and PNG, as long as the image of the device supports theseformats as well10. The style type Ellipse is supported, but the style types Arc, Chord, and Ring are not supported11. The Hint field will update the Hint System Tag. The graphical tooltip will not be automatically displayed onCompact HMI runtime nor on SMA Thin Clients12. The Command events “On Down”, “While Down”, and “On Up” are supported. The remaining commandevents are not supported13. The rotation animation is supported for closed polygons, but not for pictures14. Compact HMI does not support “Zoom and Pan gestures on project screens” and “Gestures withRotation animation”15. The Hardware from the WiBu manufacturer is supported by all Runtime Editions (excluding IoT View)16. Local mode only. Distributed and LDAP modes not supported17. Alarm Online and Alarm History supported. Alarm history can be saved to Proprietary and Database formats18. Trend Logger history can be saved to Proprietary, Database, and Historian (AVEVA Insight CSV/JSON)formats. Historian on-premises is not supported19. Project Symbols are supported, as long as their shapes, active objects, and/or animations are supportedby the target platform20. Built-in language only21. Push button, List box and Smart message are supported now22. The ActiveX control must be compiled to the target platform23. Built-in language, Open/Close Screen, and Set/Reset/Toggle Tag supported. VB Script not supported.24. Trend Control Object supported on SMA with Tagname Data Source only. Grid Control suppported withDatabase Data source only25. Sub-set of DB/ERP functions supported. DB/ERP worksheet not supported26. Limited by license and external and physical constraints (hardware and operating system)27. Email (SMTP Client) is supported by IoT View via exec() built in function calling a CURL script28. Event history can be saved to Proprietary and Database formats29. Native integration through the ITMEViewApp object for AVEVA System Platform is available for AVEVA EdgeSCADA and AVEVA Edge Embedded HMI only. Integration via MQTT SparkplugB (requiring a third-party MQTT Broker) is available for AVEVA Edge SCADA, AVEVA Edge Embedded HMI, and AVEVA Edge IoT View 30. The Trend Logger task from AVEVA Edge SCADA and AVEVA Edge Embedded HMI can save data natively intoan external AVEVA Historian. AVEVA Edge IoT View has a native OPC UA Server, which can expose tag values to any third-party system that provides an OPC UA Client, including the AVEVA Historian (on premise)31. The UNLIMITED option is available only when AVEVA Edge IoT View is purchased in a subscription model(AVEVA Flex)© 2021 AVEVA Group plc and its subsidiaries. All rights reserved. AVEVA and the AVEVA logo are a trademark or registered trademark of AVEVA Group plc in the U.S. and other countries.。

专业矩阵切换器该系列按键适用于8x8规模以下矩阵1) 指示灯COM: 串口通讯指示灯，当发送串口命令时该灯闪烁RUN: 运行指示灯，一直处于常亮状态说明设备运行正常2) 显示屏OUTPUT（输出通道号） 1 2 3 4 5 6 7 8INPUT（输入通道号） 1 2 3 4 5 6 7 83) 按键在前面板上的键盘：:INPUT/OUTPUTINPUT/OUTPUT0 —9: 数字键，用于输出通道，设备地址和场景的选择。

ALL: 输入通道号＋All，可将该输入切换到所有输出通道。

序号名称功能1 Audio 用于选择切换音频模式2 Video 用于选择切换视频模式3 AFV 用于选择切换音视频模式4 STO Store,用于存储场景5 REC Recall，用于恢复场景6 LOCK 锁定键盘或解除键盘锁定7 FUN 更换设备地址8 TAKE 确定操作4)设备地址的修改：“FUN”+“1-9”+TAKE5) 切换指令操作方法:“输出通道”+ “功能键”+“输入通道”+“TAKE”；6)“功能键”是指：AFV : 表示音视频信号同时切换，Video: 表示只切换视频信号或VGA信号，Audio: 表示只切换音频信号，* “输出通道”是指：要连接的下级设备当前所连接的通道，面板上的“0-9”号数字键。

* “输入通道”是指：要切换的信号源当前所连接的通道，面板上的“0-9”号数字键。

* “TAKE”是指：表示确认操作。

现在以8系列为例说明：例1：将第6路音视频输入信号切换到第8路通道输出，操作如下：“8” + A V + “6” + “TAKE”例2：将7路视频输入信号切换到第8路通道输出，操作如下：“8” + “Video” +“7” + “TAKE”例3：将第2路音视频输入信号切换到所有通道输出，操作如下：“ALL”+ “A V”+2”+ “TAKE”SA VE存储指令操作方法: 例如：将当前状态存储到4，操作如下：“STO” + “4” + “TAKE”RECALL调用指令操作方法:例如：将存储单元4的切换状态调用为当前状态，操作如下：“RECALL” + “4” + “TAKE”232串口接线说明矩阵上232串口使用的通用DB9接口，如下：2脚为TXD3脚为RXD5脚为GND与电脑直接用直通线连接即可。

目录第一章简介 (3)1.1A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80系列介绍 (3)1.2A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80特色和设计理念 (3)1.3A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80系统配置要求 (3)1.4A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80启动和退出 (4)1.4.1 AVTRONSYS Visual Logical DesignV2.80的启动 (4)1.4.2 AVTRONSYS Visual Logical DesignV2.80的退出 (4)第二章A VTRONSYS VISUAL LOGICAL DESIGNV2.80工作环境 (5)2.1A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80工作环境介绍 (5)2.1.2 AVTRONSYS Visual Logical DesignV2.80的菜单栏 (6)2.1.3 AVTRONSYS Visual Logical DesignV2.80的工具栏 (12)2.1.4 AVTRONSYS Visual Logical DesignV2.80的状态栏 (12)第三章A VTRONSYS VISUAL LOGICAL DESIGNV2.80的工程操作 (13)3.1A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80普通工程操作 (13)3.1.1 AVTRONSYS Visual Logical DesignV2.80建立工程 (13)3.1.3 AVTRONSYS Visual Logical DesignV2.80加入模块 (14)3.2宏工程操作 (15)3.2.1建立一个宏工程 (15)3.2.2 加入模块 (16)第四章A VTRONSYS VISUAL LOGICAL DESIGNV2.80设备操作 (17)第五章A VTRONSYS VISUAL LOGICAL DESIGNV2.80逻辑模块操作 (20)5.1A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80菜单 (20)5.2A VTRONSYS V ISUAL L OGICAL D ESIGN V2.80快捷键 (24)第一章简介1.1 AVTRONSYS Visual Logical DesignV2.80系列介绍A VTRONSYS系统的控制主机采用了Motorola公司最新的32位嵌入式处理器，并且运行实时的嵌入式操作系统，因此具有强大的数据处理能力和稳定可靠的机器性能，可广泛使用于工业、商业、教育、专业广播、医疗、娱乐及家庭等场合。

With the ability to test electrical and optical Ethernet links as well T1and E1 interfaces, the SmartClass 4800 allows technicians to test all common business class interfaces. T echnicians can test the quality of voice services regardless of whether they are delivered via VoIP or PRI. The industry’s smallest handheld instrument can test throughout the service life cycle, including service activation, troubleshooting, and maintenance. Advanced Ethernet test features such as TrueSpeed VNF per RFC 6349 and, J-Profiler help field technicians test their networks faster and more accurately than ever before.Key Benefitsy Optimized for field use witha multitouch screen, scripted workflows, and clear resultsy Supports efficient best practices with repeatable methods and proceduresKey Featuresy Electrical (10/100/1000) and optical (100M, 1GE, 10GE) Ethernet interfacesy Automated, enhanced RFC 2544 and SAMComplete testing per ITU-T Y.1564y Integrated burst testing approach per MEF 34 and RFC 6349 TrueSpeed VNF™ TCP throughput testingy Compatible with VIAVI fiber microscopes, and optical power metersy Supports the Datacom Expansion Module (DEM), which expands the testing of legacy technologies, specifically Datacom serial interfacesApplicationsy Business services installations, service activation and troubleshootingy Mobile and backhaul characterization, validation, and troubleshootingBrochureVIAVISmartClass 4800Tool of choice for all-in-one service testingOptimized for business services installation teams, the SmartClass 4800 is the modern tool for ensuring data and voice services achieve expected key performance indicators (KPI).Best Practice Workflow (Single and Multiple Services):1. J-QuickCheck: Basic Connectivity and Throughput Test2. Single-Service: Enhanced RFC 25443. Multi-Service: Y.1564 SAMComplete For Ethernet KPI Verification4. J-Proof Layer 2 Control Plane Transparency Test5. RFC 6349 TrueSpeed VNF:Layer 4 TCP ThroughputThis test workflow is applicable to Ethernet Business Services and Wireless Backhaul network topologies.TrueSAM Saves Valuable Service Activation TimeT est better and quicker with automated tests combined into one ultimate installation tool:y J-QuickCheck — a fast, automated test (RFC 2544, Y .1564) for validating end-to-end and auto-negotiation configurationy Enhanced RFC 2544 — an automated turn-up test for validating key performance indicators (KPIs)/concurrently measuring SLAs such as throughput, frame delay , delay variation, frame loss, and committed burst size (CBS) — optionaly Y .1564 SAMComplete — an automated service verification test that speeds the installation of multiple classes of services (COS)y TrueSpeed VNF per RFC 6349 — an automated, standards-based test that can save up to 25% of operating expenses (OpEx) and reveals the reason for slow file downloads, eliminating finger-pointingy Interoperable with VIAVI Fusion for throughput testing, including TrueSpeed VNF and Fusion QT-600Optimized for Field TechniciansThe SmartClass 4800 makes testing Ethernet and voice services easy: y All test interfaces are readily availabley Compact form factor for easy portability: 7 x 9.5 x 3 in (17.8 x 24.1 x 7.62 cm) y Large 7 in multi-touch displayy T ablet-like interface for easy navigation through test information and advanced workflows y Integrated WiFi and Bluetooth lets you easily connect test sets and offload resultsCompatible with VIAVI Solutions Fiber Test ToolsThe SmartClass 4800 is compatible with :y The P5000i and FiberChek fiber microscope for connector end-face inspection and analysis y MP-Series optical power meters for optical power and loss measurementsOptimized for Easy Field Usey Fixed test interfaces eliminate loose pluggable modules y LEDs indicate plug-ins for testsy A streamlined user interface provides simple pass/fail, green/red results y Extended battery life enables longer test times y Boots up rapidly from power-on to test startSmartClass 4800SmartClass 4800PEthernetEthernetEthernetEthernet LAN/WANPart of the Leading T-BERD/MTS Test PortfolioStrataSyncEmpower Y our AssetsStrataSync is a hosted, cloud-enabled solution for managing assets, configurations, and test data on VIAVI instruments. It ensures that all instrument software is current and the latest options are installed. StrataSync lets you manage inventory , test results, andperformance data anywhere with browser-based ease while it also improves technician and instrument efficiency. StrataSync manages and tracks test instruments, collects and analyzes results from the entire network, and it informs and trains the workforce.VIAVI StrataSync enabledCommon Application BaseSame user interface + same results + same methods and proceduresActivate services more quickly andaccuratelyReduce mean time to repair (MTTR) on network problemsT est the widest range of traditional and emerging telecom interfacesEnables Network Evolution — Today and TomorrowThe SmartClass 4800 meets leading-edge, carrier-grade Ethernet requirements: y Ensures reliability with link and service OAM (IEEE 802.3ah, 802.1ag, and ITU-T Y .1731)y Validates network scalability with VLAN, Q-in-Q, MAC-in-MAC, MPLS, and VPLS tunnelling technologiesy Full-featured VoIP and IP video turn-up and troubleshooting tests y Supports packet transport network (PTN) evolution with MPLS-TPtechnologyEnhanced RFC 2544 with J-QuickCheck SAMComplete per ITU-T Y .1564Fusion TrueSpeed VNF per RFC 6349© 2021 VIAVI Solutions Inc.Product specifications and descriptions in this document are subject to change without notice.Patented as described at /patentsSmartClass4800-br-tfs-tm-ae 30168388 911 0821C ontact Us+1 844 GO VIAVI(+1 844 468 4284)To reach the VIAVI office nearest you, visit /contact。

目录一、AVTRONS YS(艾维创)灯光控制系统 (3)1.1AVTRONSYS(艾维创)系统介绍 (3)1.2主要目的： (3)1.3主要功能： (3)1.4实现的功能及节能效果 (3)1.4.1客房 (3)1.4.2大堂/咖啡厅 (4)1.4.3宴会厅/会议室 (4)1.4.4公共通道/电梯厅 (4)1.4.5泛光照明/园林照明 (5)1.4.6停车场/地下车库 (5)1.4.7触摸屏 (5)二、为什么要选择A VTRONS YS(艾维创)控制系统产品| (6)2.1AVTRONSYS(艾维创)领先的技术 (6)2.2AVTRONSYS(艾维创)灯光控制系统产品的突出特点 (6)2.2.1定时／延时自动执行与安全性 (6)2.2.2智能调光 (6)2.2.3节能降耗 (6)2.2.4灯光情景控制 (6)2.2.5时尚的智能解决方案 (7)2.3应用环境 (7)2.4系统连接图 (7)三、系统设计概述 (8)3.1需求分析 (8)3.2系统概述 (8)3.3系统设计依据 (8)3.4系统设计原则 (9)四、AVTRONS YS(艾维创)领先的智能控制技术 (10)4.1AVTRONSYS(艾维创)智能控制系统特点 (10)4.1.1 丰富的控制界面 (10)4.2AVTRONSYS(艾维创)中央控制系统的应用领域和适用场所 (12)五、AVTRONS YS(艾维创)控制系统操作流程 (13)六、控制系统主要设备简介 (18)6.1控制系统产品配置一览表 (18)6.2AVTRONSYS(艾维创)产品 (18)6.2.1 触摸屏分类及主要性能参数 (18)6.2.2 主机分类及主要性能参数 (20)6.2.3 外围设备 (20)七、售后服务 (23)7.1相关说明 (23)7.2保修条款 (23)7.3售后服务联系方式 (24)八、系统培训 (25)8.1用户培训 (25)8.2承建商工程师培训 (25)8.3设计及安装工程师培训 (25)8.4AVTRONSYS(艾维创)应用工程师培训 (26)九、公司资质及其相关资料 (27)一、AVTRONSYS(艾维创)灯光控制系统1.1 A VTRONSYS(艾维创)系统介绍A VTRONSYS(艾维创)开发出一套自动开关、控制及监控系统——A VTRONSYS(艾维创)灯光控制系统。

MSCSM70VM19C3AGDatasheet Vienna Rectifier Phase Leg SiC PowerModuleApril20201Revision History (1)Revision1.0 (1)Product Overview (2)2.1Features (3)2.2Benefits (3)2.3Applications (3)Electrical Specifications (4)3.1SiC MOSFET Characteristics(per SiC MOSFET) (4)3.2SiC Schottky Diode Ratings Characteristics (6)3.3Diode Characteristics (7)3.4Thyristor Characteristics (7)3.5Thermal and Package Characteristics (8)3.6Typical SiC MOSFET Performance Curve (9)3.7Typical SiC Diode Performance (11)3.8Typical Diode Curves (12)Package Specification (13)Table1•Absolute Maximum Ratings (4)Table2•Electrical Characteristics (4)Table3•Dynamic Characteristics (5)Table4•Body Diode Ratings and Characteristics (5)Table5•Absolute Maximum Ratings (6)Table6•SiC Schottky Diode Ratings and Characteristics (6)Table7•Absolute Maximum Ratings (7)Table8•Electrical Characteristics (7)Table9•Absolute Maximum Ratings (7)Table10•Electrical Characteristics (8)Table11•Package Characteristics (8)Figure1•MSCSM70VM19C3AG Electrical Schematic (2)Figure2•MSCSM70VM19C3AG Pinout Location (2)Figure3•Maximum Thermal Impedance (9)Figure4•Output Characteristics at TJ=25°C (9)Figure5•Output Characteristics at TJ=175°C (9)Figure6•Normalized RDS(on)vs.Temperature (9)Figure7•Transfer Characteristics (9)Figure8•Capacitance vs.Drain Source Voltage (10)Figure9•Gate Charge vs.Gate Source Voltage (10)Figure10•Body Diode Char,TJ=25°C (10)Figure11•3rd Quadrant Char,TJ=25°C (10)Figure12•Body Diode Char,TJ=175°C (10)Figure13•3rd Quadrant Char,TJ=175°C (10)Figure14•Switching Energy vs.Current (11)Figure15•Turn-on Energy vs.Rg (11)Figure16•Operating Frequency vs.Drain Current (11)Figure17•Turn-off Energy vs.Rg (11)Figure18•Maximum Thermal Impedance (11)Figure19•Forward Characteristics (12)Figure20•Capacitance vs.Reverse Voltage (12)Figure21•Maximum Thermal Impedance (12)Figure22•Forward Characteristics (12)Figure23•Package Outline (13)1Revision HistoryThe revision history describes the changes that were implemented in the document.The changes are listed by revision,starting with the most current publication.1.1Revision 1.0Revision 1.0is the first publication of this document,published in April 2020.Revision HistoryThe MSCSM70VM19C3AG is Vienna Rectifier phase leg700V/124A full Silicon Carbide power module.Figure1•MSCSM70VM19C3AG Electrical SchematicFigure2•MSCSM70VM19C3AG Pinout LocationAll ratings at T J=25°C unless otherwise specified.Caution:These devices are sensitive to electrostatic discharge.Proper handling procedures should befollowed.2.1FeaturesThe following are key features of the MSCSM70VM19C3AG device:•SiC Power MOSFET◦Low RDS(on)◦High temperature performance•Silicon carbide(SiC)Schottky diode(CR2and CR3)◦Zero reverse recovery◦Zero forward recovery◦Temperature-independent switching behavior◦Positive temperature coefficient on VF•Kelvin emitter for easy drive•Very low stray inductance•High level of integration•Aluminum nitride(AlN)substrate for improved thermal performance 2.2BenefitsThe following are benefits of the MSCSM70VM19C3AG device:•Outstanding performance at high frequency operation•Direct mounting to heatsink(isolated package)•Low junction-to-case thermal resistance•Solderable terminals both for power and signal for easy PCB mounting•Low profile•RoHS compliant2.3ApplicationsThe MSCSM70VM19C3AG device is designed for the following applications:•Plasma and induction heating•Uninterruptible power supplies3Electrical SpecificationsThis section shows the electrical specifications of the MSCSM70VM19C3AG device.3.1SiC MOSFET Characteristics (per SiC MOSFET)This section describes the electrical characteristics of the MSCSM70VM19C3AG (Q1and Q2)device.Table 1•Absolute Maximum RatingsUnit Maximum Ratings ParameterSymbol V 700Drain-source voltage V DSS A1241T C =25°C Continuous drain currentI D981T C =80°C250Pulsed drain current I DM V –10/25Gate-source voltage V GS mΩ19Drain-source ON resistance R DSon W 365T C =25°CPower dissipationP DNote:1.Specification of SiC MOSFET device but output current must be limited due to size of power connectors.Table 2•Electrical CharacteristicsUnit Max TypMinTest Conditions CharacteristicSymbol μA 100V GS =0V;V DS =700V Zero gate voltage drain current I DSS mΩ1915T J =25°C V GS =20V I D =40ADrain–source on resistanceR DSon18.8T J =175°CV 2.41.9V GS =V DS ,I D =4mA Gate threshold voltage V GS(th)nA150V GS =20V,V DS =0VGate–source leakage currentI GSSTable 3•Dynamic CharacteristicsUnit MaxTyp MinTest Conditions Characteristic Symbol pF4500V GS =0V V DS =700V f =1MHzInput capacitance C iss 510Output capacitance C oss 29Reverse transfer capacitance C rss nC215V GS =–5/20V V Bus =470V Total gate charge Q g 58Gate–source charge Q gs I D =40A 35Gate–drain charge Q gd ns 40V GS =–5/20V V Bus =400V Turn-on delay time T d(on)35Rise time T r I D =80A 50Turn-off delay time T d(off)TJ =150°CR Gon =27Ω;R Goff =4.7Ω20Fall time T f µJ 545T J =150°C V GS =–5/20V Turn on energy E on V Bus =400V µJ 186T J =150°CTurn off energyE offI D =80A R Gon =27ΩR Goff =4.7ΩΩ0.69Internal gate resistanceR Gint °C/W0.41Junction-to-case thermal resistanceR thJCTable 4•Body Diode Ratings and CharacteristicsUnit MaxTyp MinTest Conditions Characteristic Symbol V3.4V GS =0V ;I SD =40A Diode forward voltageV SD3.8V GS =–5V ;I SD =40Ans 38I SD =40A ;V GS =–5V V R =400V ;di F /dt =1000A/µsReverse recovery time t rr nC 318Reverse recovery charge Q rr A14.8Reverse recovery currentI rr3.2SiC Schottky Diode Ratings CharacteristicsThis section shows the SiC Schottky diode (CR2and CR3)ratings and characteristics of the device.Table 5•Absolute Maximum RatingsUnit Max Ratings ParameterSymbol V 700Peak repetitive reverse voltage V RRM A 50T C =80°C DC forward current I F W174T C =25°CPower dissipationP DTable 6•SiC Schottky Diode Ratings and CharacteristicsUnit Max TypMinTest ConditionsCharacteristicSymbol V 700Peak repetitive reverse voltage V RRM μA20015T J =25°C V R =700VReverse leakage currentI RRM250T J =175°CV1.81.5T J =25°C I F =50ADiode forward voltageV F1.9T J =175°CnC 133V R =400VTotal capacitive charge Q C pF248f =1MHz,V R =200V Total capacitanceC216f =1MHz,V R =400V°C/W 0.86Junction-to-case thermal resistanceR thJC3.3Diode CharacteristicsThis section shows the electrical characteristics and ratings of the CR1diode.Table 7•Absolute Maximum RatingsUnit Max Ratings ParameterSymbol V 1600Peak repetitive reverse voltage V RRM A200T C =80°C DC forward current I F 1600T J =25°Ct =10msNon-repetitive forward surge currentI FSMW400T C =25°CPower dissipationP D Table 8•Electrical CharacteristicsUnit Max TypMinTest Conditions Characteristic Symbol μA 50V R =1600V Reverse current I R V1.211T J =25°C I F =77AForward voltageV F1.10.9T J =125°CV 0.83On–state voltage V T mΩ2.2On–state slope resistancer T °C/W 0.31Junction-to-case thermal resistanceR thJC3.4Thyristor CharacteristicsThis section shows the electrical characteristics and ratings of the thyristor (Q3).Table 9•Absolute Maximum RatingsUnit Max Ratings ParameterSymbol V 1600Repetitive peak reverse voltage V DRM mA 3Repetitive peak reverse current I DRM A60T C =90°C RMS on–state current I TRMS 520T J =45°Ct =10msSurge on–state current I TSM V 10Peak reverse gate voltage V RGM W 357T C =25°CPower dissipationP DTable 10•Electrical CharacteristicsUnit MaxTyp MinTest Conditions Characteristic Symbol V1.41T J =25°C I T =60AOn–state VoltageV T 0.85T J =125°C Direct on state threshold voltage V TO mΩ10T J =125°C On–state Slope resistance r T V 1.5T J =25°CGate trigger voltage V GT mA 50Gate trigger currentI GT °C/W0.35Junction-to-case thermal resistanceR thJC3.5Thermal and Package CharacteristicsThis section shows the thermal and package characteristics of the device.Table 11•Package CharacteristicsUnit MaxMin CharacteristicSymbol V 4000RMS Isolation Voltage,any terminal to case t =1min,50/60Hz V ISOL °C150–40Q3,CR1Operating junction temperature rangeT J175–40Q1,Q2,CR2,CR3T Jmax –25–40Recommended junction temperature under switching conditions T JOP 125–40Storage temperature range T STG 125–40Operating case temperature T C N.m 32M4To HeatsinkMounting torque Torque g110Package weightWeight3.6Typical SiC MOSFET Performance CurveThis section shows the typical performance curves of the MSCSM70VM19C3AG SiC MOSFET.Figure3•Maximum Thermal ImpedanceFigure4•Output Characteristics at T J=25°CFigure6•Normalized RDS(on)vs.TemperatureFigure9•Gate Charge vs.Gate Source VoltageFigure11•3rd Quadrant Char,T J=25°CFigure10•Body Diode Char,T J=25°CFigure12•Body Diode Char,T J=175°CFigure15•Turn-on Energy vs.RgFigure16•Operating Frequency vs.Drain Current3.7Typical SiC Diode PerformanceThis section shows the typical performance curves of the MSCSM70VM19C3AG SiC diodes(CR2and CR3).Figure18•Maximum Thermal ImpedanceFigure20•Capacitance vs.Reverse Voltage3.8Typical Diode CurvesThis section shows the typical performance curves of the MSCSM70VM19C3AG CR1diode.Figure21•Maximum Thermal ImpedanceFigure22•Forward CharacteristicsThis section shows the package outline of the MSCSM70VM19C3AG device.All dimensions are in millimeters.Figure23•Package OutlineSee application note1906-Mounting Instructions for SP3F Power Modules on Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and rmation contained in this publication is provided for the sole purpose of designing with and using Microsemi rmation regarding device applications and the like is provided only for your convenience and may be superseded by updates.Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi.It is your responsibility to ensure that your application meets with your specifications.THIS INFORMATION IS PROVIDED "AS IS."MICROSEMI MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,WRITTEN OR ORAL,STATUTORY OR OTHERWISE,RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY ,PERFORMANCE,NON-INFRINGEMENT,MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT,SPECIAL,PUNITIVE,INCIDENTAL OR CONSEQUENTIAL LOSS,DAMAGE,COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION OR ITS USE,HOWEVER CAUSED,EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE.TO THE FULLEST EXTENT ALLOWED BY LAW,MICROSEMI’S TOTAL LIABILITY ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES,IF ANY ,YOU PAID DIRECTLY TO MICROSEMI FOR THIS e of Microsemi devices in life support,mission-critical equipment or applications,and/or safety applications is entirely at the buyer’s risk,and the buyer agrees to defend and indemnify Microsemi from any and all damages,claims,suits,or expenses resulting from such use.No licenses are conveyed,implicitly or otherwise,under any Microsemi intellectual property rights unless otherwisestated.Microsemi2355W.Chandler Blvd.Chandler,AZ 85224USAWithin the USA:+1(480)792-7200Fax:+1(480)792-7277 ©2020Microsemi and its corporate affiliates.All rights reserved.Microsemi and the Microsemi logo are trademarks of Microsemi Corporation and its corporate affiliates.All other trademarks and service marks are the property of their respective owners.Microsemi Corporation,a subsidiary of Microchip Technology Inc.(Nasdaq:MCHP),and its corporate affiliates are leading providers of smart,connected and secure embedded control solutions.Their easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market.These solutions serve more than 120,000customers across the industrial,automotive,consumer,aerospace and defense,communications and computing markets.Headquartered in Chandler,Arizona,the company offers outstanding technical support along with dependable delivery and quality.Learn more at .MSCC-0344-DS-01076Legal。

第1章Protel DXP基础知识教学提示：本章介绍Protel DXP的基础知识，其中包括Protel的发展简史、组成和特点；演示启动Protel DXP的各种方法；介绍主窗口的菜单栏、工具栏、面板控制栏和状态栏，最后在上机指导中介绍Protel DXP使用中的一些个性化设置。

教学目标：了解Protel DXP的组成、特点；熟练掌握Protel DXP的启动操作，Protel DXP主窗口中的菜单栏、工具栏、面板控制栏和状态栏的设置方法，并结合本书的附录了解菜单栏的使用方法。

1.1 Protel DXP简介Protel DXP是一款EDA(Electronic Design Automation，电子系统设计自动化)设计软件，主要用于电路设计、电路仿真和印制电路板(PCB)的设计，同时还提供了超高速集成电器硬件描述语言(VHDL)的设计工具进行现场可编程门阵列(FPGA)设计。

1.1.1 Protel的发展简史Protel公司于1985年在澳大利亚的悉尼成立，同年推出第一代DOS版设计软件——1988年Protel 软件的雏形TANGO软件包问世，它支持原理图及PCB的设计和打印输出。

同年，Protel公司在美国的硅谷设立研发中心，开发的升级版Protel for DOS引入中国内地后，因其方便、易学、实用的特点得到了广泛的应用。

进入20世纪90年代以后，随着个人计算机硬件性能的提高和Windows操作系统的推出，Protel公司于1991年发布了世界上第一个基于Windows环境的EDA工具，奠定了其在桌面EDA系统的领先地位。

1998年，Protel公司推出Protel 98，将原理图设计、PCB设计、无网格布线器、可编程逻辑器件设计和混合电路模拟仿真集成于一体化设计环境中。

随后又推出了Protel 99及Protel 99SE 等产品。

2002 年，该公司更名为 Altium 公司，又推出 Protel DXP(Design Explorer)。