Multi-layer Floorplanning for Reliable System-on-Package
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湖南理工学院南湖学院题目:岳阳市某单位综合楼作者:学号:系别:土木建筑工程系专业:土木工程指导老师:职称:讲师完成时间:某理工学院办公楼设计摘要:本设计的题目为岳阳市某单位综合楼。
其中该设计分为建筑设计、结构设计和施工组织设计。
第一部分:建筑设计,本工程的建筑设计方案简单,采用对称布置,呈矩形。
能充分满足了单位办公的需求,建筑立面造型独特,表现了学院办公楼建筑的特点。
第二部分:结构设计,本工程的结构设计围绕安全、经济两个重点展开,采用多层框架结构。
其中选取一榀框架对其梁和柱的计算采用电算加手算,整个计算过程力求正确,基础采用柱下独立基础,并进行了楼梯和楼板的设计计算,过程详见计算书。
第三部分:施工组织设计,本工程施工组织设计详细阐述了施工布置、施工准备、施工方法、质量控制、安全生产等五个方面,明确了工程人员职则。
并根据劳动定额及计算工程量确定日工作人数,绘制施工进度计划表。
关键词:办公楼建筑设计结构设计施工组织设计框架结构计算Institute technonogy office building of the DesignSummary: The topic originally designed is the office building of institute of some job. The designs hadbeen divided into the architectural design, design and operatiol of the structure and organize the design.First part : Architectural design, the architectural design of this project is simple ,adopt and fix up asymmetrically, take the form of rectangle word. Can fully meet the demand that the institute handles official business, the elevation model of the buikding is unique; have displayed the characteristic of the building of office building of the institute.Second part: Structural design, project this structural design launch around security , economy two focal points, adopt the multi-layer frame structure. Choose one pin frame adopt electricity is it add to roof beam and calculation of post their hand charge to regard as among them, the whole computational process strives to be correct, the foundation adopts the independent foundation under the post, the design carrying on the stair floor is calculated, the course sees and calculates the book.The third part : Construct and organize and design, this construction organizes the design to explain and construct such five respects as assigning , preparation of construction , construction method , quality control , safety in production ,etc. in detail , have defined project duties of personnel . And confirm the working number of people on day according to the work norm and project amount of calculation, draw the planning chart of the construction speed.Keyword: Office building Architectural design Structural design Construct and organize and design the frame structure calculating目录第一部分:结构设计计算书一、设计概况 (4)二、结构计算书(基本情况) (5)三、框架侧移刚度计算 (7)四、荷载标准值计算 (10)五、确定结构计算简图 (13)六、恒荷载作用下框架内力分析 (16)七、活荷载作用下框架内力分析 (17)八、水平地震作用计算(横向水平地震) (26)九、横向风荷载作用下框架结构内力和侧移计算 (36)十、横向框架内力组合 (43)十一、框架截面设计与配筋计算 (52)十二、基础设计 (62)十三、楼梯设计 (66)十四、楼板设计 (70)第二部分:施工组织设计(内容附后) (75)参考文献 (82)致谢词 (83)结构设计计算书.一、设计概况1.建设项目名称:岳阳市某单位综合楼2.建设地点:岳阳市某地3.设计资料:3.1.地质水文资料:①.该场地地形平整,无滑坡、无液化土层等不良地质现象。
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pressure level: 65 dB at 77°F (25°C)Power supply: 100–240V AC 50/60HzMax. thermal output: 1568 BTU/hMax. current draw per system:4.6 A at 460W/100VAC,2.3 A at 460W/200VACMax. power consumption: 460 WattsT ypical power consumption: 338 WattsMax. operating specifications:Operating temperature: 32°F to 113°F (0°C to45°C)Operating humidity: 5 to 90% (RH), non-condensing Max. non-operating specifications:Storage temperature: –40°F to 158°F (–40°C to70°C)Storage humidity: 5 to 95% (RH), non-condensingRedundancyHot swappable redundant powerHot swappable redundant fansPerformance GeneralSwitch fabric capacity:1.44Tbps (full-duplex)720Gbps (half-duplex)Forwarding Capacity: 1080 MppsLatency: 2.8 usPacket buffer memory: 16MBCPU memory: 4GBOS9 Performance:MAC addresses: 160KARP table 128KIPv4 routes: 128KIPv6 hosts: 64KIPv6 routes: 64KMulticast routes: 8KLink aggregation: 16 links per group, 128 groupsLayer 2 VLANs: 4KMSTP: 64 instancesVRF-Lite: 511 instancesLAG load balancing: Based on layer 2, IPv4 or IPv6headers Latency: Sub 3usQOS data queues: 8QOS control queues: 12Ingress ACL: 16KEgress ACL: 1KQoS: Default 3K entries scalable to 12KIEEE compliance with Dell Networking OS9802.1AB LLDP802.1D Bridging, STP802.1p L2 Prioritization802.1Q VLAN T agging, Double VLAN T agging,GVRP802.1Qbb PFC802.1Qaz ETS802.1s MSTP802.1w RSTP802.1X Network Access Control802.3ab Gigabit Ethernet (1000BASE-T)802.3ac Frame Extensions for VLAN T agging802.3ad Link Aggregation with LACP802.3ae 10 Gigabit Ethernet (10GBase-X) withQSA802.3ba 40 Gigabit Ethernet (40GBase-SR4,40GBase-CR4, 40GBase-LR4) on opticalports802.3u Fast Ethernet (100Base-TX)802.3x Flow Control802.3z Gigabit Ethernet (1000Base-X) with QSA 802.3az Energy Efficient EthernetANSI/TIA-1057 LLDP-MEDForce10 PVST+Max MTU 9216 bytesRFC and I-D compliance with Dell Networking OS9General Internet protocols768 UDP793 TCP854 T elnet959 FTPGeneral IPv4 protocols791 IPv4792 ICMP826 ARP1027 Proxy ARP1035 DNS (client)1042 Ethernet Transmission1305 NTPv31519 CIDR1542 BOOTP (relay)1812 Requirements for IPv4 Routers1918 Address Allocation for Private Internets 2474 Diffserv Field in IPv4 and Ipv6 Headers 2596 Assured Forwarding PHB Group3164 BSD Syslog3195 Reliable Delivery for Syslog3246 Expedited Assured Forwarding4364 VRF-lite (IPv4 VRF with OSPF, BGP,IS-IS and V4 multicast)5798 VRRPGeneral IPv6 protocols1981 Path MTU Discovery Features2460 Internet Protocol, Version 6 (IPv6)Specification2464 Transmission of IPv6 Packets overEthernet Networks2711 IPv6 Router Alert Option4007 IPv6 Scoped Address Architecture4213 Basic Transition Mechanisms for IPv6Hosts and Routers4291 IPv6 Addressing Architecture4443 ICMP for IPv64861 Neighbor Discovery for IPv64862 IPv6 Stateless Address Autoconfiguration 5095 Deprecation of T ype 0 Routing Headers in IPv6IPv6 Management support (telnet, FTP, TACACS, RADIUS, SSH, NTP)VRF-Lite (IPv6 VRF with OSPFv3, BGPv6, IS-IS) RIP1058 RIPv1 2453 RIPv2OSPF (v2/v3)1587 NSSA 4552 Authentication/2154 OSPF Digital Signatures Confidentiality for 2328 OSPFv2 OSPFv32370 Opaque LSA 5340 OSPF for IPv6IS-IS1142 Base IS-IS Protocol1195 IPv4 Routing5301 Dynamic hostname exchangemechanism for IS-IS5302 Domain-wide prefix distribution withtwo-level IS-IS5303 3-way handshake for IS-IS pt-to-ptadjacencies5304 IS-IS MD5 Authentication5306 Restart signaling for IS-IS5308 IS-IS for IPv65309 IS-IS point to point operation over LANdraft-isis-igp-p2p-over-lan-06draft-kaplan-isis-ext-eth-02BGP1997 Communities2385 MD52545 BGP-4 Multiprotocol Extensions for IPv6Inter-Domain Routing2439 Route Flap Damping2796 Route Reflection2842 Capabilities2858 Multiprotocol Extensions2918 Route Refresh3065 Confederations4360 Extended Communities4893 4-byte ASN5396 4-byte ASN representationsdraft-ietf-idr-bgp4-20 BGPv4draft-michaelson-4byte-as-representation-054-byte ASN Representation (partial)draft-ietf-idr-add-paths-04.txt ADD PATHMulticast1112 IGMPv12236 IGMPv23376 IGMPv3MSDP, PIM-SM, PIM-SSMSecurity2404 The Use of HMACSHA- 1-96 within ESPand AH2865 RADIUS3162 Radius and IPv63579 Radius support for EAP3580 802.1X with RADIUS3768 EAP3826 AES Cipher Algorithm in the SNMP UserBase Security Model4250, 4251, 4252, 4253, 4254 SSHv24301 Security Architecture for IPSec4302 IPSec Authentication Header4303 ESP Protocol4807 IPsecv Security Policy DB MIBdraft-ietf-pim-sm-v2-new-05 PIM-SMwData center bridging802.1Qbb Priority-Based Flow Control802.1Qaz Enhanced Transmission Selection (ETS)Data Center Bridging eXchange (DCBx)DCBx Application TLV (iSCSI, FCoE)Network management1155 SMIv11157 SNMPv11212 Concise MIB Definitions1215 SNMP Traps1493 Bridges MIB1850 OSPFv2 MIB1901 Community-Based SNMPv22011 IP MIB2096 IP Forwarding T able MIB2578 SMIv22579 T extual Conventions for SMIv22580 Conformance Statements for SMIv22618 RADIUS Authentication MIB2665 Ethernet-Like Interfaces MIB2674 Extended Bridge MIB2787 VRRP MIB2819 RMON MIB (groups 1, 2, 3, 9)2863 Interfaces MIB3273 RMON High Capacity MIB3410 SNMPv33411 SNMPv3 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DATASHEETOverview IC Compiler™ II is the industry leading place and route solution that delivers best-in-class quality-of-results (QoR) for next-generation designs across all market verticals and process technologies while enabling unprecedented productivity. IC Compiler II includes innovative for flat and hierarchical design planning, early design exploration, congestion aware placement and optimization, clock tree synthesis, advanced node routing convergence, manufacturing compliance, and signoff closure.IC Compiler II is specifically architected to address aggressive performance, power, area (PPA), and time-to-market pressures of leading-edge designs. Key technologies include a pervasively parallel optimization framework, multi-objective global placement, routing driven placement optimization, full flow Arc based concurrent clock and data optimization, total power optimization, multi-pattern and FinFET aware flow and machine learning (ML) driven optimization for fast and predictive design closure. Advanced Fusion technologies offer signoff IR drop driven optimization, PrimeTime ® delay calculation within IC Compiler II, exhaustive path-based analysis (PBA) and signoff ECO within place and route for unmatched QoR and design convergence. F U S I O N D E S I G N P L A T F O R M PrimeTime, StarRC, PrimePower,IC Validator, RedHawk Analysis Fusion Fusion Compiler IC Compiler II Design Compiler NXT TestMAX F o r m a l i t y ECO Fusion S i g n o f f F u s i o n S i g n o f f F u s i o n Test Fusion Figure 1: IC Compiler II Anchor in Synopsys Design PlatformAccelerating DesignClosure on AdvancedDesignsIC Compiler II Industry Leading Place and Route SystemKey BenefitsProductivity• The highest capacity solution that supports 500M+ instances with a scalable and compact data model• A full suite of design planning features including transparent hierarchical optimization• Out-of-the-box simple reference methodology for easy setup• Multi-threaded and distributed computing for all major flow steps• Golden signoff accuracy with direct access to PrimeTime delay calculationPPA• Unified TNS driven optimization framework• Congestion, timing, and power-driven logic re-synthesis• IEEE 1801 UPF/multi-voltage support• Arc-based concurrent clock and data optimization• Global minima driven total power optimizationAdvanced Nodes• Multi-pattern and FinFET aware design flow• Next generation advanced 2D placement and legalization• Routing layer driven optimization, auto NDR, and via pillar optimization• Machine learning driven congestion prediction and DRC closure• Highest level of foundry support and certification for advanced process nodes• IC Validator in the loop signoff driven DRC validation and fixingAdvanced Fusion Technology• Physically aware logic re-synthesis• IR drop driven optimization during all major flow steps• PrimeTime delay calculation based routing optimization for golden accuracy• Integrated PrimeTime ECO flow during routing optimization for fastest turnaround timeEmpowering Design Across Diversified ApplicationsThe dizzying pace of innovation and highly diversified applications across the design spectrum is forcing a complete rethink of the place and route systems to design and implement differentiated designs in a highly competitive semiconductor market on schedule. Designers on emerging process nodes must meet aggressive PPA and productivity goals. It essentially means efficient and intelligent handling of 100s of millions of place-able instances, multiple levels of hierarchy, 1000s of hard macros, 100s of clocks, wide busses, and 10s of modes and corners power domains and complex design constraints and process technology mandates. Emphasis on Designer ProductivityIC Compiler II is architected from the ground up for speed and scalability. Its hierarchical data model consumes 2-3X less memory than conventional tools, boosting the limits of capacity to 500M placeable instances and beyond. Adaptive abstraction and on-the-fly data management minimize memory requirements and enable fast responsive data manipulation. Near-linear multi-core threading of key infrastructural components and core algorithms such as database access and timing analysis speed up optimization at all phases of design. Patented, lossless compact modeling and independent R and C extraction allow handling more modes and corners (MCMM scenarios) with minimal runtime impact.IC Compiler II has built-in Reference Methodology(RM) that ensures fast flow bring up. This RM Flow is Foundry Process/Design Type specific to ensure a robust starting point and seamless bring up. IC Compiler II has direct access to the Golden PrimeTime delay calculation engine to minimize ECO iterations.IC Compiler II’s new data model enables designers to perform fast exploration and floorplanning with complex layout requirements. IC Compiler II can create bus structures, handle designs with n-levels of physical hierarchy, and support Multiply Instantiated Blocks (MIBs) in addition to global route driven pin assignment/feedthrough flow, timing driven macro placement, MV area design planning.A design data mismatch inferencing engine analyzes the quality of inputs and drives construct creation on the fly, delivering design insights even with “incomplete” data early in the design cycle. Concurrent traversal of logical and physical data models enables hierarchical Data-Flow Analysis (DFA) and fast interactive analysis through multi-level design hierarchies and MIBs. Data flow and feedthrough paths highlighted in Figure 2 allow analysis and manipulation through n-levels of hierarchy to complete early design exploration and prototyping.Figure 2: Fast interactive analysis through multiple-levels of physical hierarchy and MIBPipeline-register-planning shown in Figure 3, provides guidance for optimal placement to meet the stringent timing requirementsof high-performance designs. Interactive route editor integrated which is advanced node aware shown in Figure 4, allows intricate editing and routing functions, including the creation of special signal routes, buses, etc.Figure 3: Pipeline register placement enables superior QoR for designs with complex busesAchieving Best Performance, Power, Area, and TATIC Compiler II features a new optimization framework built on global analytics. This Unified TNS Driven Optimization framework is shared with Design Compiler NXT synthesis to enable physically-aware synthesis, layer assignment, and route-based optimization for improved PPA and TAT. Multi-Corner Multi-Mode (MCMM) and Multi-Voltage (MV) aware, level-based analytical algorithms continuously optimize using parallel heuristic algorithms. Multi-factor costing functions deliver faster results on both broad and targeted design goals. Concurrent PPA driven logic remapping, rewiring, and legalization interleaved with placement minimizes congested logic, resulting in simple localized logic cones that maximize routability and QoR.IC Compiler II minimizes leakage with fast and efficient cell-by-cell power selection across HVT, SVT and LVT cells and varying channel lengths. Activity-driven power optimization uses VCD/ SAIF, net toggle rates, or probability functions to drive placement decisions and minimize pin capacitances. Multi-bit register banking optimizes clock tree structures, reduces area, and net length, while automatically managing clock, data, and scan chain connections.Advanced modeling of congestion across all layers highlighted in Figure 4 provides accurate feedback throughput the flow from design planning to post- route optimization.Figure 4: Intelligent and accurate analysis for congestion and powerIC Compiler II introduces a new Concurrent Clock and Data (CCD) analysis and optimization engine that is built-in to every flow step resulting in meeting both aggressive performance and minimizing total power footprint. ARC-based CCD optimization performs clock tree traversal across all modes/corners in path-based fashion to ensure optimal delay budgeting.Robust support for clock distribution enables virtually any clock style, including mesh, multi-source, or H-tree topologies. Advanced analysis and debugging features perform accurate clock QoR analysis and debugging as highlighted in Figure 5.Figure 5: Accurate clock QoR analysis and debugging (a & b) Abstracted clock graph and schematic.(c) Latency clock graph. (d) Colored clock tree in layout.IC Compiler II features many innovative technologies that make it the ideal choice for high-performance, energy-efficient Arm®processor core implementation, resulting in industry-best milliwatts/megahertz (mW/MHz) for mobile and other applications across the board. Synopsys and Arm work closely together to offer optimized implementation of popular Arm cores for IC Compiler II,with reference flows available for Arm Cortex®-A high-performance processors and Mali GPUs. In addition, Arm offers off-the-shelf Artisan® standard cell and memory models that have been optimally tuned and tested for fast deployment in an IC Compiler II environment. Continuous technology innovation and close collaboration makes IC Compiler II the leading choice for Arm-based high- performance design.Highest Level of Advanced Node Certification and SupportIC Compiler II provides advanced node design enablement across major foundries and technology nodes—including 16/14nm,12/10nm, 7/5nm, and sub-5nm geometries. Zroute digital router technology ensures early and full compliance with the latest design rules required for these advanced node technologies. Synopsys collaborates closely with all the leading foundries to ensure that IC Compiler II is the first to deliver support for early prototype design rules and support for the final production design rules. IC Compiler II design technologies maximize the benefits of new process technologies and offer optimal return on investment for cutting-edge silicon applications.IC Compiler II advanced node design support includes multi-pattern/FinFET aware placement and routing, Next-generation advanced 2D placement and legalization, routing layer driven optimization, auto NDR, and via pillar optimization. IC Validator in the loop provides signoff DRC feedback during Implementation.Foundry fill Track based fillFigure 6: IC Validator In-Design metal fill color aware metal fill, optimized for density and foundry requirementsMachine learning driven congestion prediction and DRC closure allow for fastest routing convergence with best PPA. Multiple sets of training data are used to extract key predictive elements that guide the pre-route flow.Advanced Fusion TechnologyThe Fusion Design Platform™ delivers unprecedented full-flow QoR and time-to-results (TTR) to accelerate the next wave of semiconductor industry innovation. The industry’s first AI-enhanced, cloud-ready Design Platform with Fusion Technology™ isbuilt from Synopsys’ market-leading, massively-parallel digital design tools, and augmented with innovative capabilities to tacklethe escalating challenges in cloud computing, automotive, mobile, and IoT market segments and accelerate the next wave of industry innovation.Fusion Technology redefines conventional EDA tool boundaries across synthesis, place-and-route, and signoff, sharing integrated engines across the industry’s premier digital design products. It enables designers to accelerate the delivery of their next-generation designs with the industry-best QoR and the TTR.©2019 Synopsys, Inc. All rights reserved. Synopsys is a trademark of Synopsys, Inc. in the United States and other countries. A list of Synopsys trademarks isavailable at /copyright.html . All other names mentioned herein are trademarks or registered trademarks of their respective owners.。
人工智能–多层感知器基础知识解读今天我们重点探讨一下多层感知器MLP。
感知器(Perceptron)是ANN人工神经网络的一个概念,由Frank Rosenblatt于1950s第一次引入。
单层感知器(Single Layer Perceptron)是最简单的ANN人工神经网络。
它包含输入层和输出层,而输入层和输出层是直接相连的。
单层感知器仅能处理线性问题,不能处理非线性问题。
今天想要跟大家探讨的是MLP多层感知器。
MLP多层感知器是一种前向结构的ANN人工神经网络,多层感知器(MLP)能够处理非线性可分离的问题。
MLP概念:MLP多层感知器(MulTI-layerPerceptron)是一种前向结构的人工神经网络ANN,映射一组输入向量到一组输出向量。
MLP可以被看做是一个有向图,由多个节点层组成,每一层全连接到下一层。
除了输入节点,每个节点都是一个带有非线性激活函数的神经元。
使用BP反向传播算法的监督学习方法来训练MLP。
MLP是感知器的推广,克服了感知器不能对线性不可分数据进行识别的弱点。
相对于单层感知器,MLP多层感知器输出端从一个变到了多个;输入端和输出端之间也不光只有一层,现在又两层:输出层和隐藏层。
基于反向传播学习的是典型的前馈网络,其信息处理方向从输入层到各隐层再到输出层,逐层进行。
隐层实现对输入空间的非线性映射,输出层实现线性分类,非线性映射方式和线性判别函数可以同时学习。
MLP激活函数MLP可使用任何形式的激活函数,譬如阶梯函数或逻辑乙形函数(logisTIc sigmoid funcTIon),但为了使用反向传播算法进行有效学习,激活函数必须限制为可微函数。
由于具有良好可微性,很多乙形函数,尤其是双曲正切函数(Hyperbolictangent)及逻辑乙形函数,被采用为激活函数。
Title:Unleashing Creativity:Exploring the World of Interior DesignIntroduction:In this essay,I will delve into the captivating world of interior design and share my experience in creating functional,aesthetically pleasing,and personalized spaces.From conceptualization to execution,interior design allows me to unleash my creativity and transform ordinary spaces into extraordinary havens.Body:Understanding Client Needs:Interior design begins with understanding the needs and preferences of the client.I communicate closely with clients to grasp their vision, lifestyle,and functional requirements.This understanding forms the foundation for creating spaces that cater to their unique needs and reflect their personality and style.Space Planning and Layout:Effective space planning is key to optimizing the functionality and flow of a space.I analyze the layout,dimensions,and purpose of each room, considering factors such as traffic flow,natural light,and the desired ambiance.By strategically arranging furniture,fixtures,and architectural elements,I create harmonious and well-utilized spaces.Color and Material Selection:Color and material selection play a crucial role in setting the mood and ambiance of a space.I carefully choose colors that complement eachother and align with the desired style and atmosphere.Additionally,I select materials,such as flooring,wall finishes,and textiles,that enhance the overall design aesthetic and provide durability and visual interest.Furniture and Accessories:Selecting the right furniture and accessories is essential in creating a cohesive and inviting interior.I consider the scale,style,and functionality of each piece,ensuring they align with the overall design concept.Accessories,such as artwork,lighting fixtures,rugs,and decorative accents,add personality and create focal points within the space.Lighting Design:Lighting design is a critical aspect of interior design.I carefully plan the placement of natural and artificial lighting sources to create a balance of illumination and ambiance.Proper lighting enhances the functionality of the space,highlights architectural features,and sets the desired mood for each room.Attention to Detail:Attention to detail is paramount in interior design.I pay close attention to the finishing touches,such as trim work,hardware selection,and styling,to create a polished and cohesive look.Every element,from window treatments to the arrangement of accessories,is thoughtfully considered to ensure a harmonious and visually appealing space.Conclusion:Interior design is a dynamic and creative process that allows me to transform ordinary spaces into extraordinary havens.From understanding client needs to space planning,color and material selection to furniture and accessory choices,interior design involves careful consideration of each element to create functional,aesthetically pleasing,and personalized spaces.Through my designs,I aim to create environments that inspire,nurture,and reflect the unique personality and style of the inhabitants.The world of interior design is a realm of endless possibilities,and I am excited to continue unleashing my creativity to create spaces that leave a lasting impression.。
河北科技师范学院本科毕业设计外文翻译多层住宅建筑给排水设计的几个问题院(系、部)名称:专业名称:学生姓名:学生学号:指导教师:年月日河北科技师范学院教务处制The multilevel residential housing is given and drains off water severalquestions designedSummary :This text give and drain off water on multilevel residential housing design supply water the exertion of the tubular product , Way of laying of pipeline, water gauge produce family set up, establishment and air conditioner condensation water of pot-type boiler discharge issue goes on the discussion , And put forward some concrete views.Keyword:Skyscraper, supply water the tubular product , the pipeline is laid, The water gauge, the solar water heaterThe skyscraper is simple with its auxiliary facility, the fabrication cost is low, the characteristic such as being convenient of estate management, Receive the welcomes of the real estate developer and vast resident of small and medium-sized cities very much. How project planning and design of inhabited region, scientific and technological industry of comfortable house, lead the request according to 2000, Improve the design level of the house, build out a comfortable living space for each household, It is each designers duty. As the heart of the house --The kitchen, bathroom, is that the function is complicated, hygiene, safe and comfortable degree are expected much, It is miscellaneous to build, the space expecting much in technology. So, the designer must consider synthetically with the idea and method of global design that the kitchen, bathroom give installation of the drainage pipeline and equipment,etc. . Give and drain off water on skyscraper design supply water exertion, to lay pipeline of tubular product, water gauge produce family set up, establishment and empty of pot-type boiler now Transfer condensation water discharge issue discuss together with colleagues.(1)supply water tubular product select problem for use Traditional watersupply tubular product adopt zinc-plated steel tube generally, because zinc-plated steel tube exchange the corrosion, Use short-lived , use for and send domestic water can satisfied with water quality sanitary standard shortcoming, Ministry of Construction is popularizing the application of the feed pipe of plastics energetically . A lot of districts and cities have already expressed regulations: Forbid designing and using the zinc-plated steel tube , use widely the feed pipe of plastics. The plastics supply water In charge of compared with metal pipeline, light, it is fine to able to bear the intensity of keeping, Send obstruction little liquid , able to bear chemistry better to corrode performance, it is convenient to install, The steel energy-conservation of the province, merit of having long performance life etc.. Supply water and use plastics pipeline: Hard polyvinyl chloride( PVC-U), high density polyethylene( HDPE), pay and unitepolyethylene( PEX) , modify the polypropylene( PP-R, PP-C), gather butene( PB), aluminium mould and compound and in charge of and the steel is moulded and compound and is managed etc.. Choice of tubular product economic comparative course of technology, technology should from pressure, temperature, environment for use, install method,etc. go on and consider, Combine owners at the same time request and the house of grade,carry on and fix after being consider synthetically technology not economic. The above plastics supply water tubular product can supply water tubular product as house life. The economic and functional house conciliating Strand room in the face of the masses of with low- and medium-level incomes resident, can select for use hygiene grades of hard polyvinyl chloride in charge of as feed pipe mainly, In order to reduce the fabrication cost; Medium-to-high grade commodity apartment available aluminium Mould and compound and in charge of or other plastics supply water the tubular product as the feed pipe. House mix hot water temperature that water order exceed 600 C, so above-mentioned tubular product in charge of except hard polyvinyl chloride and aluminium plastics compound and in charge of( PE-AL-PE), Mostly the tubular product can be regarded as the hot water pipeline of the house.( 2) pipeline lay problem 1. give and drain off water it set up there arent one that in charge of1)Will install it in the corner place of the kitchen, bathroom tomorrow. Adopting this kind of way of laying more in the design of house in the past, it is convenient for it to construct, But will reveal the pipeline and hinder the room beautifully tomorrow Watch, the households will mostly be hidden with the light quality material in the equipment two times.2)Will install it in the overcast angle place of the outer wall of the building tomorrow. Way this suitable for southern weather warm district only, the minimum temperature in winter cant be lower than zero degrees Centigrade, In case water pipe water-logging freeze ice is bloated to split pipeline, influence household use. Pipeline lay in outer wall, influence building to be beautiful, too inconvenient on manage and maintain in the future.3)Lay it in the pipeline well. This way makes the room clean and beautiful , but the pipeline well has taken up the area of the bathroom, And pipeline construct, maintain relatively more difficult. Bathroom set up concentrate pipeline well, concentrate pipeline on assign in the well feed pipe, drain pipe, This is that the civilized importance lives in the kitchen of comfortable house, bathroom Embodiment. I think : Should consider the establishment of the pipeline well of the bathroom in the medium-to-high grade building conceptual design of commodity apartment, Improve quality of using of bathroom promptly so , can solve hardpolyvinyl chloride drain pipe rivers noise heavy problem, Improve the environmental quality level of the room; Whether for bathroom in the areas for little economic and functional house and Overcome difficulties room, warm area give and drain off water and set up and in charge of and can consider and lay in the outer wall in the South, In order to increase using the space of the bathroom; Pipeline install and in the room, should influence kitchen, bathroom every sanitary equipment use of function tomorrow2. supply water and prop up there arent tube House supply water prop up and in charge of pipe diameter one ≤ 32mm, de of battle,, little plastics feed pipe of pipe diameter is the crooked state, So the house supplies water and is propped up and in charge of being recommended and adopted and set up secretly. Supply water to prop up to manage darkly There are thes way had:1)Set up in the brick wall secretly. Wall turn on and in charge of trough in brick when constructing, in charge of trough width tube +20 mm, de of external diameter,, degree of depth tube external diameter de, The pipeline is imbedded and managed directly Trough, and with in charge of card fix in trough of inning charge of son.2)Whether pipe diameter supply water and prop up and last de ≤ 20mm,can set up at floor secretly piece make level by layer. Turn on and in charge of trough in floor( ground) the board when constructing, it wides trough have to be de +10 mm deeply 1/2 of the de, Half pipeline imbed and in charge of trough, and with in charge of card fix in trough of inning charge of tube. Aluminium mould compound and in charge of and pay and unite polypropylene in charge of pipeline adopt metal pipe fittings connection, Must strengthen and in charge of trough size when adopting and set up secretly, and rivers some flood peak loss relatively heavy. Assign the relative house that concentrated to the kitchen, bathroom interior hygiene utensil, Can adopt and divide Water device go on and join , divide water device whether one more than branch in charge of and connect, every hygiene utensil supply water and prop up and in charge of and connects and publishes from the water dividing device separately. Can already prevent the tube burying the pipeline secretly from being connected like this Permeate the question. Can reduce some flood peak lost, decrease the fabrication cost of pipe networks3)Drain off water and prop up the tube to lay House room drain off water and in charge of and should set up at the time of inning this each, drain off water and in charge of permeating sideways like this canning prevent the sewage from waiting for the pollutant to enter the neighbor family sideways, Will not influence the neighbor either when the pipeline is maintained Normal life of one. Kitchen wash water drainage of basin propped up and in charge of generallying inserts draining off water to stand to manage this layer of floor sideways; Floordrain drain off water propped up and in charge of laying the room of lower floor. A lot of colleagues think now: Whether kitchen the ground it lay ceramic tile of,whose name is clean in when need develop with water,not strong in meaning to set up floor drain, So kitchen set up ground floor drain, avoid and drain off water and prop up and in charge of and enter neighbor family sideways already so, Can increase using the space of the kitchen . Bathroom drain off water and prop up and in charge of and lay concrete measure have in this layer sideways inside:1)Improve the bathroom ground . Ground tendency high 150mm, adopt back row type take stool pot, washing basin, bath tub, water drainage of floor drain in charge of and bury in cushion layer secretly sideways.2)Adopt the sinking type bathroom. Bathroom sink 350mm the floor, hygiene utensil drain off water and in charge of and bury on sinking space secretly sidewaysTwo method these can realize water drainage of bathroom prop up and in charge of earths surface to bury underground this one without entering the neighbor family sideways. Bury pipeline when installing, construction quality must check on strictly, can construct bathroom ground after confirming qualified secretly, So as not to leave the hidden danger in giving in the future using. Bathroom ground construct and can pack coal ash light quality material , also can adopt and lay bricks impracticable to lay plate making construct ground, Ground must make waterproof to deal with, method can waterproof to deal with according to roofing, make two oil one rubber and plastic ointment waterproof cloth.3) water gauge the open air set up problem The water gauge is had indoors, not only the work load of checking meter is very heavy , but also make the security and privacy of the house reduce greatly . So house divide into households of water gauge or divide households of figure of water gauge Show that should be set up in the open air. Skyscraper water gauge the open air set up following several kinds of forms: Whether 1.adopt far it pass by water gauge Change the ordinary water gauge into and pass the water gauge far, is joined the water gauge and data gathering machine by a signal line, And then reach intelligence to manage( the computer). Its merit lies in saving a large amount of people Strength comes to check meter, the data are accurate, the shortcoming is that the fabrication cost is high. Whether 2.adopt magnetic stripe card of by water gauge Users buy the electronic card of the running water Company in advance , then insert it in the storing device of the water gauge, Card amount of money deduct automatically on the water, this way user need to prepay the water rate, The price of the water gauge is relatively high.3. adopt it set up at the open air water gauge not ordinary1)The water gauge is set up in the stair have a rest in the alcove of the platform. Household watersupply to prop up and manage and enter the kitchen, bathroom after the water gauge is measured. Way this realize water gauge produce room set up, equivalence low project have , supply water and set up and in charge of and set up with water gauge office results in aesthetic problems in stair. It suitable for the South warm district kitchen, bathroom assign close to the houses of positions of staircase.2)The water gauge concentrates on being set up among the water gauges( meter box). Person who give when supplying water, set up water gauge in ground floor( meter box) on falling, every household watersupply to prop up and is in charge of applying having in the pipeline well, Southern area can overcast horn place lay along the outer wall in building too; Person who give when supplying water, can set up water gauge in roof( meter box) under upgoing. This way increases and supplies water to prop up In charge of and lay length, pipeline lay and influence building to be beautiful along outer wall. Water gauge produce way choice that family assign, must combine house kitchen, bathroom plane assign characteristic and concrete request of developer, Carry on to several feasibility scheme the above economic technology fix after comparing. Property well-managed medium-to-high grade commodity apartment of housing district, can adopt and pass the water gauge far , It is that the water gauge will use the developing direction in the future; Estate management perfect medium- to-high grade commodity apartment of housing district, can adopt magnetic stripe card water gauge( Company have this kind district of business can design in running water) Or concentrate on setting up it among the water gauges( case); Southern area unit type house can set up rest platform office in stair with ordinary water gauge, In order to reduce the fabrication cost.4) establishment question of the pot-type boiler Should reserve and install hot water supply terms of facility, set up hot water supply facilities with when the design of house. Have and concentrate house that hot water supply on , should consider house assign with installation position and cold hot water pipeline of hot water device. The pot-type boiler generally has three kinds, such as gas, electricity, solar energy,etc.. Whether last kitchen gas heater and electric heater or Bathroom inside, give when draining off water design shoulding reserve installation position and cold hot water interface of pipeline of water heater in advance in building, Install by oneself when convenient users fit up. Solar energy and hot water It is simple and convenient and safe for device to use, need fuel and electric power is low to run theexpenses, Have long performance life, pollution-free, received by the masses of users favourably very much, Many houses have been small in recent years The district all install the solar water heater at the time of designing and construct. Solar water heater install and at the roof, need to set up the cold hot water pipeline among bathroom and water heater of the roofing like this generally, Consider installation of solar water heater when the design of house, household can only lay cold and hot pipeline along the building outer wall when installing in the future, Increase household degree of difficulty when installing like this , increase pipeline make the investment, influence building beautiful. Give when draining off water the design needing to solicit the developers suggestion first in building, Interconnected system one design, construct the solar water heater in unison; Reserve solar water heater and cold hot water installation position of pipeline in advance only. The cold hot water pipeline of the solar water heater can be laid In the pipeline well; Set up pipeline house of well , can set up one UPVC drain pipe of de110 as solar water heater hot water sleeve pipe of pipeline close to corner of person who take a shower in bathroom, Set up a de110 *75 three direct links in each hygiene interval ground, as connecting the entry of cold and hot water pipe5) air conditioner condensation ink discharge the issue In recent years, air conditioner enter huge numbers of families gradually, condensation water amorphous to discharge the building outer wall of pollution air conditioner have, Have influenced a beautiful important problem of biotope already. Building give when draining off water design shoulding consider air conditioner condensation ink discharge in a organized way. Concrete method can machine set up the water drain pipe of the condensation by the position outside reserving air conditioner, Drain off water and set up and in charge of and select PVC-U drain pipe de40 for use , reserve three direct links of draining off water highly in each air conditioner, It is convenient for air conditioner to drain off water hose insert directly.译文来源:美国PE杂志建筑给排水工程师2010年第10期多层住宅建筑给排水设计的几个问题摘要:本文就多层住宅建筑给排水设计中给水管材的选用,管道的敷设方式,水表出户设置,家用热水器的设置及空调冷凝水排放等问题进行探讨,并提出一些具体看法。
第七章平面规划(floorplanning)7.1 简介在上一章,我们从完全抽象的组件中,建构出结构。
这一章要检视芯片的更细部。
我们将假设区块图是固定的,现在我们将学习芯片层次的布局与电路设计。
和设计单一NAND闸的布局比较起来,设计问题的大小需要我们发展不同的方法。
但基本的目标在于----面积、延迟、和功率----则是相同的。
7.2 平面规划方法平面规划是芯片层次的布局设计。
当设计一个叶端电路单元时,我们使用晶体管和取道来当作基本的组件;平面规划则是使用加法器、缓存器、和FSM来当作建构区块。
平面规划与叶端电路单元间的不同处在于平面规划所使用的组件,比起连接这些组件的导线大的多。
这个大尺寸不匹配强制我们不同地分析布局,并在设计期间做不同的取舍。
许多芯片由不同形状与尺寸的电路单元所组成,如图7-1所示。
在平面规划期间,我们叫这些布局电路单元为「区块」(block),因为我们把它们当作建构区块来建构出平面规划。
在「砖泥」(bricks-and-mortar)风格的布局中,电路单元可能有着完全不同的尺寸与形状。
布局程序必须指明将这些组件安置在芯片上的位置与方向,在组件间保留充足的空间作为必要导线之用。
我们将会看到,更复杂的导线区域的交通图案,使得在砖泥布局中的绕线,比在标准电路单元(standard cell)布局中,还要难的多。
(有些人使用标准电路单元来指任何的布局,包括使用已经设计好的组件的砖泥布局。
因为标准电路单元被广泛使用之故,所以你要确定你了解文中使用的意义。
)下一个例子呈现了一个大型芯片的平面规划。
图7-1:使用不同风格建构的典型布局。
-------------------------------------------------------------------------------------------------例7-1:IBM Power 2 Super Chip的平面规划Power 2 Super Chip (P2SC)是一个大型的微处理器。
Cat ® Cold Planers are designed for small paving jobs in residential and commercial applications, and are primarily used to economically restore asphalt and concrete surfaces. They are ideal for milling imperfections prior to resurfacing, removing deteriorated pavement, removing traffic lane stripes and jobs where the use of dedicated planers is limited.Features:Self-leveling designSelf-leveling design automatically levels itself when placed on the ground for consistent depth control without operator adjustments and excellent spoil retention.Two wear resistant skid platesTwo wear resistant skid plates remain parallel to the ground for optimum stability.Hydraulic side-shiftHydraulic side-shift permits close planing to curbs, walls and other obstructions.Independent left/right depth controlIndependent left/right depth control allows maximum drum depths to be adjusted independently on each skid. The gauges are easily viewable from the cab. Independent depth control is mechanical on the PC104B and PC205B models; hydraulic independent depth control is standard on the PC305B-PC412B models.Max Pro Pressure GaugeMax Pro Pressure Gauge provides operator feedback to adjust speed for maximum productivity in changing material loads. Gauge displays planer performance in real-time conditions and is visible from the cab. Standard on XHP models.Float, spring tilt and hydraulic tiltFloat enables planers to follow the contour of the surface. Float is activated by a knob and is only available on high flow and XHP planers. Spring tilt and hydraulic tilt enable planers to oscillate for angled cuts. Tilt is hydraulically controlled on high flow models and spring controlled on standard flow planers.Direct drive systemDirect drive system on the standard flow models features a variable speed, uni-directional, gerotor style hydraulic motor. Direct drive system on high flow and XHP models features a hydraulic radial piston motor to ensure maximum cutting rate and drum torque for optimal production performance and efficiency.Optional concrete bits, extreme life bits and water sprinkler kitsOptional concrete bits, extreme life bits and water sprinkler kits are available for all models.Cat XT™ and medium pressure hose,couplings and O-ring face sealsCat XT and medium pressure hose, couplings and O-ring face seals provide superior, leak-free performance andreliability. All hoses are wrapped with nylon woven cordura sleeving for added operator protection. Hydraulic quick disconnects enable fast tool changes.Quick couplerRugged, opposing edge design holds the work tool securely and allows the operator to quickly change fromone high performance Cat Work Tool to another.Cat®B Series Cold PlanersS KID S TEER L OADERS M ULTI T ERRAIN L OADERS C OMPACT T RACK L OADERS C OMPACT W HEEL L OADERS2 B Series Cold Planers for SSL/MTL/CTL/CWLCat ®B Series Cold PlanersMax-pro gauge provides operatorfeedback to maximize productivity and replace conical bitsFloat feature allows planer to Multiple bits available:• All Purpose – Standard • Concrete• Heavy Duty Concrete • Heavy Duty Asphaltskid shoesAvailable water-Low-profile design improves SSL quickchangesSelf-pivoting planer adjusts to be flat on ground regardlessof coupler orientationtorque straight to the groundCat® B Series Cold Planers SpecificationsADBCB Series Cold Planers for SSL/MTL/CTL/CWL 3Cat ®B Series Cold PlanersAEHQ6789-03 (03-16)Replaces AEHQ6789-02For more complete information on Cat products, dealer services, and industry solutions, visit us on the web at © 2016 Caterpillar All rights reservedMaterials and specifications are subject to change without notice. Featured machines in photos may include additional equipment. See your Cat dealer for available options.CAT, CATERPILLAR, , their respective logos, “Caterpillar Yellow” and the “Power Edge” trade dress, as well as corporate and product identity used herein, are trademarks of Caterpillar and may not be used without permission.SpecificationsBACDPC310B PC310B XDPC408BPC412BA Overall width mm (in)1858(73)1858(73)1858(73)1858(73)B Maximum drum width mm (in)1000(39)1000(39)750(30)1200(47)C Lengthmm (in)1140(45)1500(59)1270(50)1140(45)D Overall heightmm(in)965(38)1175(46)1100(43)965(38)Weightkg (lb)1050(2,310)1760(3,880)1050(2,315)1170(2,580)Optimum hydraulic flow L/min (gpm)125(33)125(33)150(40)150(40)Optimum hydraulic pressure bar (psi)280280280280(4,000)(4,000)(4,000)(4,000)Drum torque/max. pressure N·m (lb·ft)3350(2,470)4985(3,675)3724(2,746)4108(3,030)Drum speed @ max. flow rpm 166111143161Conical bits78/1000 mm (40 in) drum 66/1000 mm (40 in) drum 60/750 mm (30 in) drum 90/1200 mm (47 in) drum Standard bit typeAll purposeAll purpose All purpose All purpose Maximum depth of cutmm (in)130(5)220(9)170(7)130(5)Optional drum widths/depthsmm (in)————80/200(3/8)——152/200(6/8)203/200(8/8)305/200(12/8)350/200(14/8)400/200(16/8)450/200(18/8)610/178(24/7)Tilt angle range±6.5°±5.5°±6.5°±6.5°Side-shift travelmm (in)650(26)650(26)650(26)550(22)。
解决多层级优化问题的方法Optimizing multi-level problems can be a challenging task that requires strategic thinking and creative solutions. One approach to addressing these complex issues is to break them down into smaller, more manageable components. By systematically analyzing each level of the problem, it becomes possible to identify key areas for improvement and develop targeted strategies for optimization. This method allows for a more focused and structured approach to tackling complex problems, ultimately leading to more effective and sustainable solutions.解决多层次优化问题可能是一项具有挑战性的任务,需要战略思维和创造性解决方案。
应对这些复杂问题的一种方法是将它们拆分为更小、更易管理的组成部分。
通过系统分析问题的每个层次,我们可以确定关键改进领域并制定有针对性的优化策略。
这种方法可以实现更加专注和有条理的方法来应对复杂问题,最终导致更加有效和可持续的解决方案。
In order to effectively optimize multi-level problems, it is important to consider the interconnected nature of the various components. Each level of the problem may impact and be impacted by otherlevels, creating a complex web of relationships that must be carefully navigated. By understanding these interdependencies and interactions, it becomes possible to develop holistic solutions that address the problem from a comprehensive perspective. This holistic approach allows for a more thorough and nuanced understanding of the problem, enabling more effective and sustainable optimization strategies.为了有效地优化多层次问题,重要的是考虑各个组成部分之间的相互关系。
Multi-layer Floorplanning for Reliable System-on-PackagePun Hang Shiu and Sung Kyu LimSchool of Electrical and Computer EngineeringGeorgia Institute of Technology, Atlanta, GA 30332-0250{pshiu,limsk}@Abstract - Physical design automation for the new emerging mixed-signal System-on-Package (SOP) technology requires a new kind of floorplanner—it must place both active components such as digital IC, analog ICs, memory modules, MEMS, and opto-electronic modules, and embedded passive components such as capacitors, resistors, and inductors in a multi-layer packaging substrate while considering various signal integrity issues. We propose a new interconnect-centric multi-layer floorplanner named MF-SOP, which is based on a multiple objective stochastic Simulated Annealing method. The contribution of this work is first to formulate this new kind of floorplanning problem and then to develop an effective algorithm that handles various design constraints unique to SOP. The related experiments show that the area reduction of MF-SOP compared to its 2-D counterpart is on the order of O(k) and wirelength reduction is 48% average for k-layer SOP, while satisfying design constraints.I. INTRODUCTIONThe next generation electronic packaging technology called System-on-Package (SOP) [1,2] integrates both active components such as digital IC, analog ICs, memory modules, MEMS, and opto-electronic modules, and embedded passive components such as capacitors, resistors, and inductors all into a single high speed/density multi-layer packaging substrate. SOP is more advanced than PCB, MCM [3], or SIP (System-in-Package) [4] since MCM handles the integration of digital ICs only and SIP handles digital components and passive elements only. Figure 1 shows the heterogeneous components integrated into the multi-layer substrate of System-on-Package. Moreover, the SOP design paradigm facilitates rapid reengineering via reuse libraries. Therefore, SOP promises a high return on investment at a very low risk within shorter time-to-market cycle compared to the System-On-Chip (SOC) paradigm.A high performance mixed signal system employs a lot of passive components—up to 30 passive components per an IC. For example, Sony Handy Cam DCR-PC7 has 43 ICs and 1329 passive elements. Such passive components continue to take up much circuit board real estate. Therefore, rigorous attempts have been made to replaces them with so-called embedded passive components (EPC), which are small and flat enough to be inserted between package layers. EPCs allow devices to get smaller or designers to fit more functionality in the same space; eliminate the costs currently needed to purchase and solder on discrete devices; allow for more design flexibility; and derive electrical benefits from the different current path that would be traveled.EPCs can also be used for simultaneous switching noise reduction, cross talk reduction, network matching, and signal integrity. The complexity of a radio frequency front-end IC is considerably simpler with high quality passive components. However, EPC placement needs to be done carefully while considering design constraints. First, the quality and functionality of RF circuits is extremely sensitive to any unforeseen parasitic. Thus, making interconnect as short as possible reduces parasitic and thus helps the performance and quality of radio frequency (RF) SOP. Second, decoupling capacitors perform well when they are close to the source of simultaneous switching noise. Hence, high performance mixed-signal systems benefit from close vicinity capacitors,(a) digital IC with passives (b) analog IC with passives (c) Opto & memory componentsFigure 1 Mixed signal components integrated into multi-layer substrate of System-on-Package (courtesy of Packaging Research Center at Georgia Institute of Technology). (a) digital IC with its passive elements (only the footprint of a bare digital die is shown), (b) analog IC with its passive elements, and (c) opto-electronic and memory components with their passives. The passive elements are implemented in the active component layer for illustrative purpose. Some interconnections are not shown for simplicity.which effectively stabilize supply and ground noise. The physical layout resource environment of SOP is multi-layer in nature—the top layer is mainly used to accommodate active components, the middle layers are mainly for passive components, and the I/O pins are located at the bottom of the SOP package. Therefore, all layers are used for both placement and routing unlike PCB or MCM. Therefore, the existing design tools for PCB or MCM can not be used directly for the design of SOP. The existing work on multi-layer floorplanning is very few. Authors in [5] solved multi-layer floorplanning for vertically stacked digital systems. However, this work does not address the mixed-signal integration issues existing in SOP technology. Therefore, SOP technology requires a new kind of multi-layer floorplanner—it must place both active components and passive components in a multi-layer packaging substrate while considering various signal integrity issues. We propose a new interconnect-centric multi-layer floorplanner named MF-SOP, which is based on a multiple objective stochastic Simulated Annealing method. The contribution of this work is first to formulate this new kind of floorplanning problem and then to develop an effective algorithm that handles various design constraints unique to SOP. The related experiments show that the area reduction of MF-SOP compared to its 2-D counterpart is on the order of O(k ) and wirelength reduction is 48% average for k-layer SOP, while satisfying design constraints.This paper organization is as follows. The problem formulation is given in Section II. SOP constraints are described in Section III. Experimental results and conclusions are given in Section IV and V , respectively.II. PROBLEM FORMULATION A. Blocks in SOP Floorplanning The major difference between 2-dimensional IC floorplanning and multi-layer SOP floorplanning lies in addressing the following issues related to the blocks to be floorplanned: 1. size/shape of the active and passive blocks 2. restrictions on block placement into certain layers (= layer constraint ) 3. geometric constraints among active blocks (= geometric constraint ) 4. geometric constraints between active and passiveblocks (= geometric constraint )First, most of the active components in SOP including digital IC, analog IC, memory module, opto-electronic modules, and MEMS have rectangular shape. Their area lies in a range of [mm 2, cm 2]. Figure 2 shows the shape of typical EPCs (embedded passive components). We assume rectangular shape for these EPCs. Their area lies in a range of [µm 2, mm 2]. Since both active and passive components have rigid shape, we do not consider “soft blocks” in our floorplanning. Second, most of the active components are required to be placed on the top layer due to heat dissipation requirement. However, some active components that do not generate too much heat can be placed in the middle layers. EPCs can be placed at any layers, but using middle layers is the most beneficial in reducing the overall footprint area of SOP. However, some EPCs are required to be placed on the top layer due to thermal and/or noise issues. Third, some active components need to be placed nearby together or apart from each other due to several reasons including signal/power integrity, performance optimization, etc. Lastly, most EPCs need to be placed closer to the related active components. Handling the layer constraints is straightforward, but the geometric constraints are harder to satisfy. Section III discusses in detail how to deal with these geometric constraints in our multi-layer SOP floorplanner.B. Problem DefinitionA multi-layer SOP floorplan consists of a set B={b i | 0≤ i < n } of n blocks and a set L={l i | 0≤ i <k } of k layers. A block is either an active component or embedded passive component (EPC). We assume rectangular shape for all these blocks. Each floorplan f i has a set of blocksB i , which is a non-empty proper subset of B . A SOP floorplan F is represented by a set },...,,{110−=k f f f F , where a floorplan f i is a 2-dimensional placement of blocks in B i . In other words, f i = {(x j , y j )| 0 ≤ j < n (l i )}, where n (l i ) is the number of blocks in layer l i and (x j , y j ) is the coordinate of the lower left corner of block b j . A SOP floorplan F is feasible if (i) F is free of overlap among block location, (ii) F satisfies the layer and geometric constraints specified by the user. The width, height, and area of block b i are denoted w (b i ), h (b i ), and a (b i ), respectively. Similarly, those of a floorplan f i and SOP floorplan F aredenoted w (f i ), h (f i ), a (f i ), w (F ), h (F ), and area (F ). w (f i) andh (f i ) are the width and height of the minimum size rectanglethat contains all blocks in f i , which can be computed bylongest path length calculation [6]. a (f i ) is w (f i )×h (f i ). w (F ) isthe maximum among all w (f i ), and h (F ) is the maximum among all h (f i). area (F ) is w (F )×h (F ).Among many proposed methods to represent 2-dimensional floorplanning, we extend the sequence pair (SP) [7] to represent the multi-layer SOP floorplan solution. Our multi-layer sequence pair is represented by (SP 0|SP 1|…|SP k-1), where SP icontains the positive and negative sequence for theblocks contained in layer i . In [5], the authors use BSG [8] structure to represent multi-layer floorplan. However, BSGhas larger solution space with lots of redundancy. O-tree(a) capacitor (b) resistor (c) inductorFigure 2 Embedded passive components. Top and side views of typical RLC shapes are shown.[9]or B*-tree [10] can be extended for multi-layer floorplan and has a smaller solution space than both BSG and SP. However, SP requires a simpler perturbation implementation than O-tree or B*-tree. Thus, we choose SP as our multi-layer SOP floorplan solution representation. For a faster area evaluation for a given multi-layer SP, we use longest common subsequences (LCS) [6] method. A recent effort [11,12,13] uses various floorplanning representations to impose design constraints for 2-dimensional constraints.Authors in [7] propose three types of moves for solution perturbation during Simulated Annealing: M1 (swap two modules in positive sequence), M2 (swap two modules from both positive and negative sequence), and M3 (rotate). We add two moves M4 and M5 to search the solution of multi-layer floorplanning effectively: M4 is similar to M3, except that the two blocks are from positive sequences in different layers. M5 selects a block from layer i and moves it to another layer j . The location in positive and negative sequence from SP j is again randomly chosen.C. Cost FunctionWe use the following cost function to measure the quality of an SOP floorplan solution F .)()()()()(4321F penalty c F via c F wire c F area c F C +++= where area (F ), wire (F ), via (F ), and penalty (F ) respectively denote the area, wirelength, total number of vias, and the penalty related to constraint violation for F . The first term area (F ) is the final footprint area of SOP package, where area (F ) = w (F )×h (F ). The minimization of this objective results in a minimal overall SOP package area. The second term wire (F ) is the half-perimeter bounding box (HPBB) based estimation of wirelength. We ignore the height (z-dimension) of the bounding cube and use only the x and y -dimension for the computation of the wirelength of a net. Instead, the z-dimension has a direct impact on via (F ). If a net n spans from layer i to layer j , then via (n ) = |i – j |. The sum of via(n ) for all nets is via(F ). Our following Section III discusses in detail how penalty (F ) is computed. penalty (F ) = 0 when there is no constraint violation in F .We observe from related experiments that adding the following components to C (F ) results in a more compact multi-layer floorplan: total flatten area flat (F ) and dimension deviation dev (F ). flat (F ) is the sum of all floorplans, flat (F ) = ∑a (f i ). The minimization of this objective results in a highly compact floorplan for each layer. dev (F ) measures how much the upper right corner (URC) of a floorplan deviates from the average URC. We compute the average URC (u x , u y ) by u x = Σu x (f i )/k , where u x (f i ) denotes the x-coordinate of the URC of a floorplan f i . We compute u y (f i ) using y-coordinates instead. Let d (f i ) = |u x – u x (f i )|+ |u y – u y (f i )| be the dimension deviation of a floorplan of f i . Then dev (F ), the dimension deviation of SOP floorplan F is simply the sum of all d (f i ). The minimization of this objective results in a more dimension-balanced floorplan among all layers. It may seem redundant to have all three area-related objectives area (F ), flat (F ), and dev (F ) in C (F ). However, our related experiments indicate that each of these three objectives contribute to the minimization of not only the final footprint area area (F ) butalso the wirelength estimation wire (F ).III. GEOMETRIC CONSTRAINTS FOR MULTI-LAYER SOP FLOORPLANNINGA. SOP Geometric ConstraintsWe categorize the geometric constraints among active and passive components introduced in Section II.A into the following 6 types:1. noise : decoupling capacitors are placed nearby I/Os oractive components2. thermal : some active/passive components are placed incertain layers3. power : digital and analog ICs are placed in differentvoltage islands4. timing : blocks from a critical path are placed closer5. interface : I/O blocks are placed near the bottom layer6. cluster : functionally dependant blocks are placed closetogetherTable I describes these 6 geometric constraint types we consider in SOP floorplanning. A prior timing analysis or signal integrity analysis is performed by the user 1 to identify (i) the source of timing, noise, thermal, and power supply problem, and (ii) ways to fix these problems in a form of constraint. Each constraint is then translated into a geometric form so that our multi-level floorplanner attempts to satisfy this geometric constraint. Our strategy is to quantify the amount of violation of the constraints specified, and guide Simulated Annealing-based optimization so that the amount of violation is minimized or completely removed if possible. Our strategy for effective solution space search during Simulated Annealing is as follows:1. construction of initial solution: we first assign allblocks under layer constraints to the target layers and fix them during the annealing. For the remaining blocks, we randomly and evenly distribute them into1We assume in this paper that the geometric constraints are specified by the user as an input to our multi-layer SOP floorplanner. The related timing and signal integrity analysis are time-consuming, and our ongoing research effort attempts to integrate STA (Static Timing Analysis), SIA (Signal Integrity Analysis), and TPA (Thermal and Power Analysis) engines into our floorplanner so that the geometric constraints are also automatically generated.TABLE I. Geometric Constraints for SOP Floorplanningtype method syntax meaning noise point [b i |(x ,y ,z )] b i touches (x ,y ,z ) thermal layer [B i |l ] B i in layer lpower region [B i |(x ,y ,w ,h )] B i intersects withregion (x ,y ) and(x +w ,y +h )timing abutment [B i ] B i abuttedinterface boundary [B i |TBLR/l ]B i near boundaryof layer l cluster group [B i |(x ,y ,z )]B i within adistance of (x ,y ,z )all layers.2. solution perturbation: we perform more inter-layermoves (M4 and M5 discussed in Section II.A) during high temperature annealing and more intra-layer moves (M1, M2, and M3) during low temperature annealing.3. weighting constants in C (F ): we focus more onpenalty(F ) and via(F ) during high temperature annealing and more on area(F ) and wire(F ) during low temperature annealing.B. Illustration of SOP Geometric ConstraintAn example of region constraint is given in Figure 3(a). First, consider r 1=[{b 0,b 1}|(x ,y ,w ,h )]. Since both b 0 and b 1 are intersecting with the region defined by (x ,y ,w ,h ), we see that r 1 is satisfied and the penalty is zero. Now consider r 2=[{b 1,b 2}|(x ,y ,w ,h )]. Since b 2 is completely outside the region, r 2 is not satisfied and its penalty is computed by the sum of p x and p y . An example of group constraint is given in Figure 3(b). First, consider g 1=[{b 0,b 1}|(x ,y ,z )]. Since the distance between b 0 and b 1 is within the 3-dimensional distance (x ,y ,z ), we see that g 1 is satisfied and the penalty is zero. Now consider g 2=[{b 0,b 2}|(x ,y ,z )]. Since the z -distance between b 0 and b 2 is bigger than z , g 2 is not satisfied and its penalty is p z .C. Penalty ComputationThe penalty computation for constraint violation is summarized in Table II. Penalty computation for x -dimension (p x ) is shown only, but other dimensions (p y ) and (p z ) can be computed similarly using y /z-coordinates and height/layer information. The overall penalty p =p x + p y + p z . Note that p z contributes to our via cost and usually carries more weights than p x or p y . The point, layer, and region constraints are intersection-based —these constraints are violated if there is no intersection between the blocks and the region given. The abutment, boundary, and group constraints are distance-based —these constraints are violated if the distance among the blocks is bigger than the given threshold. We specify absolute coordinates for the intersection-based constraints, whereas relative distance information is given in distance-based constraints. Finally, the overall penalty function penalty (F ) for a given SOP floorplanning solution F is the sum of the penalty among all constraints given.In an example shown in Figure 4, we use the following 6 constraints for 4-layer SOP floorplanning with 10 blocks: p =[b 0|(10,10,3)], l =[{b 1}|0], r =[{b 2}|(3,3,5,5)], a =[{b 3,b 4}], b =[{b 6}|L], g =[{b 7,b 8}|(5,5,5)]. This example considers all six types of SOP constraints given in Table I. Figure 4 shows a solution F that includes several constraint violations. In the top layer (layer 0) we have two active components b 0 and b 5 while other layers contain embedded passive components. First, the point constraint p =[b 0|(10,10,3)] is not satisfied in F since b 0 is in layer 0 instead of layer 3 although b 0 contains the point (10,10) in x /y dimension. This increases the via cost by 3. Second, the layer constraint l =[{b 1}|0] is not satisfied since b 1 is in layer 2 instead of layer 0. This also increases the via cost by 2. Third, the region constrain r =[{b 2}|(3,3,5,5)] is satisfied in F since b 2 intersects with the given region (= rectangle labeled r ). Thus the penalty is zero. Fourth, the abutment constraint a =[{b 3,b 4}] is satisfied in F since b 3 and b 4 in layer 3 are abutted. Thus the penalty is zero. Fifth, the boundary constraint b =[{b 6}|L] is satisfied in F since b 6 is inTABLE II. Penalty Computation for x -dimension (p x ). Penalty for y (p y ) and z (p z ) dimensions can be computed similarly using y /z-coordinates and height/layer information. The overall penalty p = p x + p y + p z .method syntax penalty (p x ) point p =[b i |(x ,y ,z )] min{|x -x i |, |x -(x i +w i)|} layer l =[B i |l ] ∑|l (b i )-l |region r =[B i |(x ,y ,w ,h )]∑min{|x -(x i +w i )|,|(x +w )-x i )|} abutment a =[B i ]∑[(x i +w i )-x j ], b i andb i separated boundary b =[B i |TBLR/l ]∑[w (f i )-(x i +w i)] for Rboundary group g=[B i |(x ,y ,z )]∑[x -|(x i +w i )-xj |], if|(x i +w i )-x j |> xFigure 3 Constraint Examples. (a) region constraint r 1=[{b 0,b 4}|(x ,y ,w ,h )] and r 2=[{b 3,b 4}|(x ,y ,w ,h )]. r 1 is satisfied and r 2 has penalty of p x +p y . (b) group constraint g 1=[{b 0,b 2}|(x ,y ,z )] and g 2=[{b 0,b 7}|(x ,y ,z )]. g 1 is satisfied and g 2 has penalty of p z . y -dimension is not shown.(a) 4-level SOP (b) top-view (c) layer 0(d) layer 1 (e) layer 2 (f) layer 3Figure 4. A 4-layer SOP floorplanning with 10 blocks with the following 6 geometric constraints: p =[b 0|(10,10,3)], l =[{b 1}|0], r =[{b 2}|(3,3,5,5)], a =[{b 3,b 4}], b =[{b 6}|L], g =[{b 7,b 8}|(5,5,5)].contact with the left boundary of layer 2. Thus the penalty is zero. Lastly, the group constraint g=[{b7,b8}|(5,5,5)] is satisfied in F since the distance between b7 and b8 in all three dimension is smaller than the size of the given cube (= rectangle labeled g). Thus the penalty is zero.IV. EXPERIMENTAL RESULTSWe implemented our algorithm MF-SOP in C++/STL and ran on a Dell Dimension 8800 Linux box. We used GSRC floorplanning benchmark circuits. We report the area, wirelength, inter-layer via, and runtime for 4-layer SOP in all of our experiments. Figure 5 shows 4-layer SOP floorplanning for n100 (GSRC benchmark circuit). Table III shows the comparison among (i) single-layer floorplanning, (ii) 4-layer SOP floorplanning without geometric constraints, and (iii) 4-layer SOP floorplanning with geometric constraints. We summarize our observations here:pared to the single layer floorplanning, the finalpackage area for 4-layer floorplanning is reduced by75% on the average (order of O(k) reduction). Thisindicates that the floorplan for all 4 layers is highlycompact and their shapes are similar. The impact ofgeometric constraint on final area was notsignificant—79800 vs 81354. This shows theeffectiveness our MF-SOP in obtaining high qualitymulti-layer SOP floorplanning solutions in thepresence of complex design constraints in SOP.2.the wirelength reduction for 4-layer floorplanning is40% on the average compared to the single-layer case.Since the wirelength in z-direction is not considered(this is actually our via cost), the 40% saving mainlycomes from the final package area reduction. Theimpact of geometric constraint on final wirelength wasnot significant—418560 vs 422960.3.The impact of geometric constraint on via results wasnot significant—1953 vs 1893. In some cases MF-SOPwas able to find a solution with smaller wirelength andvia. This again shows the effectiveness our MF-SOP inhandling complex design constraints in SOP.4.The runtime has been increased by 10x with 4-layerfloorplanning. The runtime slightly increased whenMF-SOP considers geometric constraints. There areseveral factors that contribute to the runtime increase:(i) we need highly compact floorplan for all 4 layersand their shapes need to be similar, (ii) we need tominimize 2-dimensional wirelength and via costsimultaneously.Table IV shows the total number of initial and final constraints used in Table III. We also report the number of failed constraints for each constraint type in each circuit. We randomly select constraints from 6 types for each circuit, and we impose more constraints for bigger circuits. We summarize our observations here:1.We observe that abutment (a), boundary (b), and group(g) constraints are easier to satisfy than point (p), layer(l), and region (r) constraints. We note that thedistance-based constraints are easier to handle than theintersection-based constraints. This indicates thatspecifying the absolute location is a stronger constraintrather than the relative distance.2.Point constraint was the hardest to satisfy, followed byboundary constraint. Layer constraint is alwayssatisfied since our initial solution satisfy the layerconstraint before Simulated Annealing, and we lock allblocks under layer constraints and do not move.V. CONCLUSIONSIn this paper, we proposed a new multi-layer floorplanner MF-SOP for the new emerging mixed-signal System-on-Package (SOP) technology. MF-SOP places both active components such as digital IC, analog ICs, memory modules, MEMS, and opto-electronic modules, and embedded passive components such as capacitors, resistors, and inductors in a multi-layer SOP substrate. MF-SOP considers 6 types of geometric constraints in order to address various signal, thermal, and power integrity issues existing in the design of reliable SOP. Our ongoing research effort attempts to integrate STA (Static Timing Analysis), SIA (Signal Integrity Analysis), and TPA (Thermal and Power Analysis) engines into our floorplanner so that the geometric constraints are also automatically generated. The goal is to develop built-in STA/SIA/TPA that runs fast but with high fidelity so that they will not slow down the optimization process while guiding the optimization for high quality multi-layer SOP floorplanning solution.REFERENCETable IV. Total number of initial and final constraints usedin Table III. We also report the number of failed constraintsfor each constraint type.# of constraints failed constraint typesckts initial final p l r a b gn10 6 1 1 0 0 0 0 0n10b 6 1 1 0 0 0 0 0n10c 6 1 1 0 0 0 0 0n30 10 1 1 0 0 0 0 0n30b 10 5 1 0 2 0 2 0n30c 10 3 1 0 1 0 1 0n50 12 0 0 0 0 0 0 0n50b 12 1 1 0 0 0 0 0n50c 12 3 1 0 0 0 1 1n100 14 2 1 0 0 0 1 0n100b 14 4 2 0 1 0 1 0n100c 14 3 2 0 0 0 1 0n200 14 2 2 0 0 0 0 0n200b 14 3 2 0 0 0 1 0n200c 14 2 2 0 0 0 0 0n300 14 2 2 0 0 0 0 0total 182 34 21 0 4 0 8 1[1] Rao Tummala and Vijay Madisetti, “System on Chip or System on Package?”, IEEE Design & Test of Computers, pp 48-56, 1999. 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Nakatake, et al., ``Mod1ule placement on BSG-structure and IC layout applications,'' ACM/IEEE international conference on Computer-Aided Design, Nov. 1996.[9] P. N. Guo, C.K. Cheng and T. Yoshimura, "An O-tree Representation of Non-Slicing Floorplan and its Application", Proc.36 th ACM/IEEE DAC, 1999, pp. 268-273.[10] Y.-C. Chang, Y.-W. Chang, G.-M. Wu and S.-W. Wu, "B*-Trees: A New Representation for NonSlicing Floorplans," Proc. IEEE/ACM Design Automation Conf., pp. 458-463, 2000.[11] E. F. Y. Young, C. C. N. Chu, M. L. Ho, ``A unified method to handle different kinds of placement constraints in floorplan design,'' Design Automation Conference, 2002. pp. 661-667[12] F. Y. Young, D. F. Wong, H. H. Yang, ``Slicing floorplans with boundary constraints,'' Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on , V olume: 18 Issue: 9 , Sep 1999 pp. 1385-1389[13] Xiaoping Tang, D. F. Wong, ``Floorplanning width Alignment and Performance Constraints,'' Design Automation Conference, 2002.Table III. Comparison among (i) single-layer floorplanning, (ii) 4-layer SOP floorplanning without geometric constraints, and (iii) 4-layer SOP floorplanning with geometric constraints. We report the package area, wirelength, total number of vias used, and total runtime. Table IV shows the type of constraints used in this experiment.k=1 k=4, no constraint k=4, constraintarea wire area wire via areawirevia n10 258152 18164 98000 8693 118 73738 6209 118n10b 251778 15128 94912 7309 133 78690 6252 133n10c 268865 19880 125928 11720 119 70596 6397 119n30 245115 54586 75749 27288 349 66505 23830 349n30b 234574 45931 67670 23674 350 56156 20248 350n30c 233867 55979 88795 24259 390 71638 24166 390n50 231431 104395 64829 59411 485 61254 49463 485n50b 237266 94790 67130 56629 511 72500 46726 511n50c 234567 106562 59823 58182 515 62160 53446 515n100 210378 180413 55081 117407 885 53320 105350 885n100b 185868 169767 49608 100657 806 52425 101895 806n100c 208616 185215 54273 109932 852 52974 109925 855n200 214349 393644 55722 251626 1585 56810 260678 1585n200b 208960 336236 53799 240673 1714 54707 235781 1714n300 206954 394358 51684 262042 1532 52416 255327 1585ave 329589 658162 79800 418560 1953 81354 422960 1893ratio 1.00 1.00 0.24 0.64 1.00 0.25 0.64 0.97runtime 132 **** ****(b) layer 0 (c) layer 1 (d) layer 2 (e) layer 3Figure 5. 4-layer SOP floorplanning for n100 (GSRC benchmark circuit).。