Programmable Cellular Logic Past, Present, and Future
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衡器常用词汇英汉对照衡器常用词汇英汉对照1计量器具--measuring instruments2 软件--software3 大称量汽车衡--great weighting truck scale4 适用范围--scope of application5 砝码--weight6 称重传感器--load cell7 数字化--numeric convert8 数字式--digital9 智能化--intelligentize10 称重板--weigh-birge11 有限元法--FEM12 补偿--compensation13应变计--strain gages14传感器--transduce15 弹性元件--spring element16力学模型--mechanics mode17 温度补偿--temperature compensation18双秤台--double scales19 网络型--networkmode20 视频监控--video monitor21 扩音器--loudspeaker22 大屏幕--large screen23 零点温度性能--zero temperature characteristic24 量程温度系数--span temperature coefficient25 满量程输入范围--span input26 高分辨率--high resolution27电子汽车衡--electric truck scale28 软件分析--soft analysis29 滤波--filter30 CAN总线-CAN Bus32 组态软件--configuration33 自动配料--automatic matching34 监控系统--monitoring and controlling35 称重系统--weighing system36 点对点--peer to peer37 皮带给料--belt feeding38 定量包装机--weighting and packing machine39 给料称重系统--compound weighing system40 重力式--gravimetric41 容积式--cubage42 非自动式--non-automatic43 自动式--antomatic44 间歇式--intermittence45连续式--continuous46 标准--standard specification47 测力分析--force analysis48 装配--assembly49 工业制造--industry manufacture50 力值保持--force hold51 质量--quality52配料--batching53 电子衡器--electronic weighing instrument55 防雷击系统--the system of protection against struck by lighting56 免标定--calibration free57 量程系数--span parameter58方管结构--quadrate pipe structure59 板式结构--the overall steel plate structure60 移动式结构--movable structure61 不锈钢防腐型--strainless steel and anti-erosion62电子钢瓶秤--chlorine tank scale63 U型电子秤--the U-shaped electronic scale64电子缓冲秤--the electronic cushioning scale65移动式叉车秤--the movable fork scale66带框架结构--have frame67 电子平台秤--floor scales68无框架结构--no frame69 升降移动式结构--movable and with rising and falling structure 70移动式超低台面结构--movable and ultra low floor structure71 整体U型梁结构--the unitary U-shaped beam structure72 短面台组合结构--composed by short platforms73 模拟量输出分辨率--anlog output resolution74 采样频率--sampling frequence75零点跟踪范围--zero tracing76 防抖强度--anti-shaking intensity77 S型称重传感器--S-beam load cells78双剪切量称重传感器--double ended shear beam load cells79 单点称重传感器--single point load cells80 压式称重传感器--cmpression load cells81 轮辐式称重传感器--low profile compression disk load cells82 测力传感器--force transducer load cells83 功能--function84 数字--digital85 信号处理--siginal processing86 串口通信--connection to serial interface87 测量范围--measuring range88 输入灵敏度--input sensitivity89 信号--siginal90 反馈--sense91 型号--type92 保护等级--protection class93 最大量程--maximum capacity94 绝缘电阻--insulation resistance95 激励电压--excitation voltage96 接线盒--junction box97 称重模块--weighing modules98 标准--standard99 测量--measure100 集成电路--integrate circuit101 电阻--resistor102 输入电阻--input resistance103 输出电阻--output resistance104 电缆线--cable105 应变片--Strain gages106 称重仪表--weigh apparatus107 仪表--apparatus108 线性--linear109 称量--capacity110 感量--resolution111 去皮--tare112 至零--zero113 校准--calibration114 故障--beakdown115 检修--overhaul116 使用--maintenance117 维护--repair118 电子吊秤--electronic crane scale 119 天平--scale120 衡量--measurement121 准确度--accuracy122 控制器--controller123 举升压力--lifting pressure124 外壳尺寸--size125 环境温度--temperature126 相对湿度--relative humidity127 电源电压--voltage128 最小分度值--minimum scale interval 129 称重控制上线--bound of weight。
1模拟芯片(Analog ICs)放大器(Amplifiers) 比较器(Comparators) 显示驱动器(Display Drivers)过滤器(Filters)杂类(Miscellaneous) 数据选择器(Multiplexers)稳压器(Regulators)定时器(Timers) 基准电压(Voltage Reference)2电容(Capacitors)可动态显示充放电电容(Animated) 音响专用轴线电容(Audio Grade Axial)轴线聚苯烯电容(Axial Lead Polypropene) 轴线聚苯烯电容(Axial Lead Polystyrene) 陶瓷圆片电容(Ceramic Disc) 去耦片状电容(Decoupling Disc) 普通电容(Generic) 高温径线电容(High Temp Radial)高温径线电解电容(High Temperature Axial Electrolytic)金属化聚酯膜电容(Metallised Polyester Film) 金属化聚烯电容(Metallised Polypropene)金属化聚烯膜电容(Metallised Polypropene Film) 云母射频Mica RF Specific小型电解电容(Miniture Electrolytic) 多层陶瓷(Multilayer Ceramic)Multilayer Ceramic COG Multilayer Ceramic NPO Multilayer Ceramic X5R Multilayer Ceramic X7R Multilayer Ceramic Y5V Multilayer Ceramic Z5U多层金属化聚酯膜电容(Multilayer Metallised Polyestern Film)聚脂膜电容(Mylar Film) 镍栅电容(Nickel Barrier) 无极性电容(Non Polarised) Poly Film Chip聚脂层电容(Polyester Layer) 径线电解电容(Radial Electrolytic)树脂蚀刻电容(Resin Dipped) 钽珠电容(Tantalum Bead) 钽SMD(Tantalum SMD) 薄膜电容(Thin film) 可变电容(Variable)VX轴线电解电容(VX Axial Electolytic)3 CMOS 4000系列(CMOS 4000 series)加法器(Adders) 缓冲器/驱动器(Buffers&Drivers) 比较器(Comparators)计数器(Counters) 解码器(Decoders) 编码器(Encoders)触发器/锁存器(Flip-Flop&Latches) 分频器/定时器(Frequency Dividers & Timers)门电路/反相器(Gates&Inverters) 存储器(Memory) 杂类逻辑芯片(Misc.Logic)数据选择器(Multiplexers) 多谐振荡器(Multivibrators) 振荡器(Oscillators)锁相环(Phrase-Locked-Loop,PLL) 寄存器(Registers) Signal Switches4连接器(Connectors)音频接口(Audio) D 型接口(D-Type) 双排插座(DIL)FFC / FPC连接器(FFC/FPC Connectors)插头(Header Blocks)头/插座(Headers/Receptacles)IDC头(IDC Headers)杂项(Miscellaneous)PCB转接器(PCB Transfer)PCB Transition Connectors带线(Ribbon Cable)(Ribbon Cable /Wire Trap Con)单排插座(SIL)连线端子(Terminal Blocks)USB PCB装配(USB for PCB Mounting)5数据转换器(Data Converter)模/数转换器(A/D converters) 数/模转换器(D/A converters) 光传感器(Light Sensors)采样保持器(Sample & Hold) 温度传感器(Temperature Sensore)6调试工具(Debugging Tools)断点触发器(Breakpoint Triggers) 逻辑探针(Logic Probes) 逻辑激励源(Logic Stimuli)7二极管(Diodes)整流桥(Bridge Rectifiers) 普通二极管(Generic) 整流管(Rectifiers)肖特基二极管(Schottky) 开关管(Switching) 瞬态抑制管(Transient Suppressors)隧道二极管(Tunnel) 变容二极管(Varicap) 齐纳击穿二极管(Zener)8 ECL 10000系列(ECL 10000 Series)各种常用集成电路9机电(Electromechanical)各种直流和步进电机10电感(Inductors)铁氧体磁珠(Ferrite Beads) 固定电感器(Fixed Inductors) 普通电感(Generic)贴片式电感(SMT Inductors) 表面贴装电感器(Surface Mount Lnductors)严格的公差RF电感器(Tight Tolerance RF inductor) 变压器(Transformers)11拉普拉斯变换(Laplace Primitives)一阶模型(1st Order) 二阶模型(2st Order) 控制器(Controllers)非线性模式(Non-Linear) 算子(Operators) 极点/零点(Poles/Zones)符号(Symbols)12 Mechanics无子分类13存储芯片(Memory Ics)动态数据存储器(Dynamic RAM) 电可擦除可编程存储器(EEPROM)可擦除可编程存储器(EPROM) I2C总线存储器(I2C Memories)存储卡(Memory Cards) SPI总线存储器(SPI Memories)静态数据存储器(Static Memories) UNI/O Memories14微处理器芯片(Microprocess ICs)6800 系列(6800 Family) 8051 系列(8051 Family) ARM 系列(ARM Family)AVR 系列(AVR Family) BASIC Stamp Modules DSPIC33 FamilyHC11 系列(HCF11 Family) I86 Family MSP430 Family CPU 外设(Peripherals) PIC10 系列(PIC10 Family)PIC12 系列(PIC12 Family) PIC16 系列(PIC16 Family) PIC18 系列(PIC18 Family) PIC24 系列(PIC18 Family) Stellaris FamilyTMS320 Piccolo FamilyZ80系列(Z80 Family)15杂类(Miscellaneous)含天线、ATA/IDE硬盘驱动模型、单节与多节电池、串行物理接口模型、晶振、动态与通用保险、模拟电压与电流符号、交通信号灯16建模源(Modelling Primitives)模拟(仿真分析)(Analogy-SPICE) 数字(缓冲器与门电路)(Digital--Buffers&Gates)数字(杂类)(Digital--Miscellaneous) 数字(组合电路)(Digital--Combinational)数字(时序电路)(Digital--Sequential) 混合模式(Mixed Mode)可编程逻辑器件单元(PLD Elements) 实时激励源(Realtime Actuators)实时指示器(Realtime Indictors)17运算放大器(Operational Amplifiers)二路运放(Dual) 理想运放(Ideal) 大量使用的运放(Macromodel)八路运放(Octal) 四路运放(Quad) 单路运放(Single) 三路运放(Triple)18光电子类器件(Optoelectronics)(14-Segment Displays) (16-Segment Displays) 七段数码管(7-Segment Displays)英文字符与数字符号液晶显示器(Alphanumeric LCDs)条形显示器(Bargraph Displays) 点阵显示屏(Dot Matrix Display)图形液晶(Grphical LCDs) 灯泡(Lamp) 液晶控制器(LCD Controllers)液晶面板显示(LCD Panels Displays) 发光二极管(LEDs) 光耦元件(Optocouplers)串行液晶(Serial LCDs)19 PICAXEPICAXE ICs20可编程逻辑电路与现场可编程门阵列(PLD&FPGA)无子分类21电阻(Resistors)0.6W金属膜电阻(0.6W Metal Film) 10W 绕线电阻(10Watt Wirewound)2W 金属膜电阻(2Watt Metal Film) 3W绕线电阻(3 Watt Wirewound)7W绕线电阻(7 Watt Wirewound) 贴片电阻(Chip Resistor)贴片电阻(Chip Resistor 1/10W 0.1%) 贴片电阻(Chip Resistor 1/10W 1%)贴片电阻(Chip Resistor 1/10W 5%) 贴片电阻(Chip Resistor 1/16W 0.1%)贴片电阻(Chip Resistor 1/16W 1%) 贴片电阻(Chip Resistor 1/16W 5%)贴片电阻(Chip Resistor 1/2W 5%) 贴片电阻(Chip Resistor 1/4W 1%)贴片电阻(Chip Resistor 1/4W 10%) 贴片电阻(Chip Resistor 1/4W 5%)贴片电阻(Chip Resistor 1/8W 0.05%) 贴片电阻(Chip Resistor 1/8W 0.1%)贴片电阻(Chip Resistor 1/8W 0.25%) 贴片电阻(Chip Resistor 1/8W 0.5%)贴片电阻(Chip Resistor 1/8W 1%) 贴片电阻(Chip Resistor 1/8W 5%)贴片电阻(Chip Resistor 1W 5%) 贴片防浪涌电阻(Chip Resistor anti-surge 5%)通用电阻符号(Generic) 高压电阻(High Voltage) 负温度系数热敏电阻(NTC)集成电阻(Resistor Network) 排阻(Resisters Packs) 滑动变阻器(Variable)可变电阻(Varistors)22仿真源(Simulator Primitives)触发器(Flip-Flop) 门电路(Gates) 电源(Sources)23扬声器与音响设备(Speaker&Sounders)无子分类24开关与继电器(Switch&Relays)键盘(Keypads) 普通继电器(Generic Relays) 专用继电器(Specific Relays)按键与拨码(Switchs)25开关器件(Switching Devices)双端交流开关元件(DIACs) 普通开关元件(Generic) 可控硅(SCRs) 三端可控硅(TRIACs) 26热阴极电子管(Thermionic Valves)二极真空管(Diodes) 三极真空管(Triodes)四极真空管(Tetrodes) 五极真空管(Pentodes)27转换器(Transducers)Distance Humidity/Temperature Light Dependent Resistor(LDR)压力传感器(Pressures) 温度传感器(Temperature)28晶体管(Transistors)双极性晶体管(Bipolar) 普通晶体管(Generic)绝缘栅场效应管(IGBY/Insulated Gate Bipolar Transistors 结型场效应晶体管(JFET)金属-氧化物半导体场效应晶体管(MOSFET) 射频功率LDMOS晶体管(RF Power LDMOS) 射频功率VDMOS晶体管(RF Power VDMOS) 单结晶体管(Unijunction)29 TTL 74系列(TTL 74 series)加法器Adders 缓冲器Buffers & Drivers 比较器Comparators 计数器Counters解码器Decoders 编码器Encoders Flip-Flops & LatchesGates & lnverters杂类逻辑芯片(Misc.Logic) 多路复用器Multiplexers 多谐振荡器Multivibrators寄存器Registers30 TTL 74增强型低功耗肖特基系列(TTL 74ALS Series)31 TTL 74增强型肖特基系列(TTL 74AS Series)32 TTL 74高速系列(TTL 74F Series)33 TTL 74HC系列/CMOS工作电平(TTL 74HC Series)34 TTL 74HCT系列/TTL工作电平(TTL 74HCT Series)35 TTL 74低功耗肖特基系列(TTL 74LS Series)36 TTL 74肖特基系列(TTL 74S Series)AND 与门ANTENNA 天线BATTERY 直流电源BELL 铃,钟BVC 同轴电缆接插件BRIDEG 1 整流桥(二极管) BRIDEG 2 整流桥(集成块) BUFFER 缓冲器BUZZER 蜂鸣器CAP 电容CAPACITOR 电容CAPACITOR POL 有极性电容CAPVAR 可调电容CIRCUIT BREAKER 熔断丝COAX 同轴电缆CON 插口CRYSTAL 晶体整荡器DB 并行插口DIODE 二极管DIODE SCHOTTKY 稳压二极管DIODE VARACTOR 变容二极管DPY_3-SEG 3段LED DPY_7-SEG 7段LED DPY_7-SEG_DP 7段LED(带小数点) ELECTRO 电解电容FUSE 熔断器INDUCTOR 电感INDUCTOR IRON 带铁芯电感INDUCTOR3 可调电感JFET N N沟道场效应管JFET P P沟道场效应管LAMP 灯泡LAMP NEDN 起辉器LED 发光二极管METER 仪表MICROPHONE 麦克风MOSFET MOS管MOTOR AC 交流电机MOTOR SERVO 伺服电机NAND 与非门NOR 或非门NOT 非门NPN NPN三极管NPN-PHOTO 感光三极管OPAMP 运放OR 或门PHOTO 感光二极管PNP 三极管NPN DAR NPN三极管PNP DAR PNP三极管POT 滑线变阻器PELAY-DPDT 双刀双掷继电器RES1.2 电阻RES3.4 可变电阻RESISTOR BRIDGE ? 桥式电阻RESPACK ? 电阻SCR 晶闸管PLUG ? 插头PLUG AC FEMALE 三相交流插头SOCKET ? 插座SOURCE CURRENT 电流源SOURCE VOLTAGE 电压源SPEAKER 扬声器SW ? 开关SW-DPDY ? 双刀双掷开关SW-SPST ? 单刀单掷开关SW-PB 按钮THERMISTOR 电热调节器TRANS1 变压器TRANS2 可调变压器TRIAC ? 三端双向可控硅TRIODE ? 三极真空管VARISTOR 变阻器ZENER ? 齐纳二极管DPY_7-SEG_DP 数码管SW-PB 开关7407 驱动门 1N914 二极管74Ls00 与非门 74LS04 非门 74LS08 与门 74LS390 TTL 双十进制计数器7SEG 4针BCD-LED 输出从0-9 对应于4根线的BCD码7SEG 3-8译码器电路BCD-7SEG转换电路 AlterNATOR 交流发电机 AMMETER-MILLI mA安培计AND 与门 BATTERY 电池/电池组 BUS 总线 CAP 电容 CAPACITOR 电容器CLOCK 时钟信号源 CRYSTAL 晶振 Compim 串口D-FLIPFLOP D触发器 FUSE 保险丝GROUND 地 LAMP 灯 LED-RED 红色发光二极管LM016L 2行16列液晶可显示2行16列英文字符,有8位数据总线D0-D7,RS,R/W,EN三个控制端口(共14线),工作电压为5V。
献给调音师、录音师、DJ的音频专业术语英汉对照表AAC automatic ampltiude control 自动幅度控制AB AB制立体声录音法Abeyancd 暂停,潜态A-B repeat A-B重复ABS absolute 绝对的,完全的,绝对时间ABS american bureau of standard 美国标准局ABSS auto blank secrion scanning 自动磁带空白部分扫描Abstime 绝对运行时间A.DEF audio defeat 音频降噪,噪声抑制,伴音静噪ADJ adjective 附属的,附件ADJ Adjust 调节ADJ acoustic delay line 声延迟线Admission 允许进入,供给ADP acoustic data processor 音响数据处理机ADP(T) adapter 延配器,转接器ADRES automatic dynamic range expansion system动态范围扩展系统ADRM analog to digital remaster模拟录音、数字处理数码唱盘ADS audio distribution system 音频分配系统A.DUB audio dubbing 配音,音频复制,后期录音ADV advance 送入,提升,前置量ADV adversum 对抗ADV advancer 相位超前补偿器Adventure 惊险效果AE audio erasing 音频(声音)擦除AE auxiliary equipment 辅助设备Aerial 天线AES audio engineering society 美国声频工程协会AF audio fidelity 音频保真度AF audio frequency 音频频率AFC active field control 自动频率控制AFC automatic frequency control 声场控制Affricate 塞擦音AFL aside fade listen 衰减后(推子后)监听A-fader 音频衰减AFM advance frequency modulation 高级调频AFS acoustic feedback speaker 声反馈扬声器AFT automatic fine tuning 自动微调AFTAAS advanced fast time acoustic analysis system 高级快速音响分析系统After 转移部分文件Afterglow 余辉,夕照时分音响效果Against 以……为背景AGC automatic gain control 自动增益控制AHD audio high density 音频高密度唱片系统AI advanced integrated 预汇流AI amplifier input 放大器输入AI artificial intelligence 人工智能AI azimuth indicator 方位指示器A-IN 音频输入A-INSEL audio input selection 音频输入选择Alarm 警报器ALC automatic level control 自动电平控制ALC automatic load control自动负载控制Alford loop 爱福特环形天线Algorithm 演示Aliasing 量化噪声,频谱混叠Aliasing distortion 折叠失真Align alignment 校正,补偿,微调,匹配Al-Si-Fe alloy head 铁硅铝合金磁头Allegretto 小快板,稍快地Allegro 快板,迅速地Allocation 配置,定位All rating 全(音)域ALM audio level meter 音频电平表ALT alternating 震荡,交替的ALT alternator 交流发电机ALT altertue 转路ALT-CH alternate channel 转换通道,交替声道Alter 转换,交流电,变换器AM amperemeter 安培计,电流表AM amplitude modulation 调幅(广播)AM auxiliary memory 辅助存储器Ambience 临场感,环绕感ABTD automatic bulk tape degausser磁带自动整体去磁电路Ambient 环境的Ambiophonic system 环绕声系统Ambiophony 现场混响,环境立体声AMLS automatic music locate system自动音乐定位系统AMP ampere 安培AMP amplifier 放大器AMPL amplification 放大AMP amplitude 幅度,距离Amorphous head 非晶态磁头Abort 终止,停止(录制或播放)A-B TEST AB比较试听Absorber 减震器Absorption 声音被物体吸收ABX acoustic bass extension 低音扩展AC accumulator 充电电池AC adjustment caliration 调节-校准AC alternating current 交流电,交流AC audio coding 数码声,音频编码AC audio center 音频中心AC azimuth comprator 方位比较器AC-3 杜比数码环绕声系统AC-3 RF 杜比数码环绕声数据流(接口)ACC Acceleration 加速Accel 渐快,加速Accent 重音,声调Accentuator 预加重电路Access 存取,进入,增加,通路Accessory 附件(接口),配件Acryl 丙基酰基Accompaniment 伴奏,合奏,伴随Accord 和谐,调和Accordion 手风琴ACD automatic call distributor 自动呼叫分配器ACE audio control erasing 音频控制消磁A-Channel A(左)声道Acoumeter 测听计Acoustical 声的,声音的Acoustic coloring 声染色Acoustic image 声像Across 交叉,并行,跨接Across frequency 交叉频率,分频频率ACST access time 存取时间Active 主动的,有源的,有效的,运行的Active crossover 主动分频,电子分频,有源分频Active loudsperker 有源音箱Armstrong MOD 阿姆斯特朗调制ARP azimuth reference pulse 方位基准脉冲Arpeggio 琶音Articulation 声音清晰度,发音Artificial 仿……的,人工的,手动(控制)AAD active acoustic devide 有源声学软件ABC auto base and chord 自动低音合弦Architectural acoustics 建筑声学Arm motor 唱臂唱机Arpeggio single 琶音和弦,分解和弦ARL aerial 天线ASC automatic sensitivity control 自动灵敏度控制ASGN Assign 分配,指定,设定ASP audio signal processing 音频信号处理ASS assembly 组件,装配,总成ASSEM assemble 汇编,剪辑ASSEM Assembly 组件,装配,总成Assign 指定,转发,分配Assist 辅助(装置)ASSY accessory 组件,附件AST active servo techonology 有源伺服技术A Tempo 回到原速Astigmatism methord 象散法B band 频带B Bit 比特,存储单元B Button 按钮Babble 多路感应的复杂失真Back 返回Back clamping 反向钳位Back drop 交流哼声,干扰声Background noise 背景噪声,本底噪声Backing copy 副版Backoff 倒扣,补偿Back tracking 补录Back up 磁带备份,支持,预备Backward 快倒搜索Baffle box 音箱BAL balance 平衡,立体声左右声道音量比例,平衡连接Balanced 已平衡的Balancing 调零装置,补偿,中和Balun 平衡=不平衡转换器Banana jack 香蕉插头Banana bin 香蕉插座Banana pin 香蕉插头Banana plug 香蕉插头Band 频段,Band pass 带通滤波器Bandwidth 频带宽,误差,范围Band 存储单元Bar 小节,拉杆BAR barye 微巴Bargraph 线条Barrier 绝缘(套)Base 低音Bass 低音,倍司(低音提琴)Bass tube 低音号,大号Bassy 低音加重BATT battery 电池Baud 波特(信息传输速率的单位)Bazooka 导线平衡转接器BB base band 基带BBD Bucket brigade device 戽链器件(效果器)B BAT Battery 电池BBE 特指BBE公司设计的改善较高次谐波校正程度的系统BC balanced current 平衡电流BC Broadcast control 广播控制BCH band chorus 分频段合唱BCST broadcast (无线电)广播BD board 仪表板Beat 拍,脉动信号Beat cancel switch 差拍干扰消除开关Bel 贝尔Below 下列,向下Bench 工作台Bend 弯曲,滑音Bender 滑音器BER bit error rate 信息差错率BF back feed 反馈BF Backfeed flanger 反馈镶边BF Band filter 带通滤波器BGM background music 背景音乐Bias 偏置,偏磁,偏压,既定程序Bidirectional 双向性的,8字型指向的Bifess Bi-feedback sound system 双反馈系统Big bottom 低音扩展,加重低音Bin 接收器,仓室BNG BNC连接器(插头、插座),卡口同轴电缆连接器Binaural effect 双耳效应,立体声Binaural synthesis 双耳合成法Bin go 意外现象Bit binary digit 字节,二进制数字,位Bitstream 数码流,比特流Bit yield 存储单元Bi-AMP 双(通道)功放系统Bi-wire 双线(传输、分音)Bi-Wring 双线BK break 停顿,间断BKR breaker 断电器Blamp 两路电子分音Blanking 关闭,消隐,断路Blaster 爆裂效果器Blend 融合(度)、调和、混合Block 分程序,联动,中断Block Repeat 分段重复Block up 阻塞Bloop (磁带的)接头噪声,消音贴片BNC bayonet connector 卡口电缆连接器Body mike 小型话筒Bond 接头,连接器Bongo 双鼓Boom 混响,轰鸣声Boomy 嗡嗡声(指低音过强)Boost 提升(一般指低音),放大,增强Booth 控制室,录音棚Bootstrap 辅助程序,自举电路Both sides play disc stereo system双面演奏式唱片立体声系统Bottoming 底部切除,末端切除Bounce 合并Bourclon 单调低音Bowl 碗状体育场效果BP bridge bypass 电桥旁路BY bypass 旁通BPC basic pulse generator 基准脉冲发生器BPF band pass filter 带通滤波器BPS band pitch shift 分频段变调节器BNC bayonet connector 卡口电缆连接器Body mike 小型话筒Bond 接头,连接器Bongo 双鼓Boom 混响,轰鸣声Boomy 嗡嗡声(指低音过强)Boost 提升(一般指低音),放大,增强Booth 控制室,录音棚Bootstrap 辅助程序,自举电路Bottoming 底部切除,末端切除Bounce 合并Bourclon 单调低音Bowl 碗状体育场效果BP bridge bypass 电桥旁路BY bypass 旁通BPC basic pulse generator 基准脉冲发生器BPF band pass filter 带通滤波器BPS band pitch shift 分频段变调节器BR bregister 变址寄存器BR Bridge 电桥Break 中止(程序),减弱Breathing 喘息效应B.Reso base resolve 基本解析度Bridge 桥接,电桥,桥,(乐曲的)变奏过渡Bright 明亮(感)Brightness 明亮度,指中高音听音感觉Brilliance 响亮BRKRS breakers 断路器Broadcast 广播BTB bass tuba 低音大喇叭BTL balanced transformer-less 桥式推挽放大电路BTM bottom 最小,低音BU backup nuit 备用器件Bumper 减震器Bus 母线,总线Busbar 母线Buss 母线Busy 占线BUT button 按钮,旋钮BW band width 频带宽度,带度BYP bypass 旁路By path 旁路BZ buzzer 蜂音器C cathode 阴极,负极C Cell 电池C Center 中心C Clear 清除C Cold 冷(端)CA cable 电缆Cable 电缆Cabinet 小操纵台CAC coherent acoustic coding 相干声学编码Cache 缓冲存储器Cal calando 减小音量CAL Calendar 分类CAL Caliber 口径CAL Calibrate 标准化CAL Continuity accept limit 连续性接受极限Calibrate 校准,定标Call 取回,复出,呼出Can 监听耳机,带盒CANCL cancel 删除CANCL Cancelling 消除Cancel 取消Cannon 卡侬接口Canon 规则Cap 电容Capacitance Mic 电容话筒Capacity 功率,电容量CAR carrier 载波,支座,鸡心夹头Card 程序单,插件板Cardioid 心型的CATV cable television 有线电视Crispness 脆声Category 种类,类型Cartridge 软件卡,拾音头Carrkioid 心型话筒Carrier 载波器Cart 转运Cartridge 盒式存储器,盒式磁带Cascade 串联Cassette 卡式的,盒式的CAV constant angular velocity 恒角速度Caution 报警CBR circuit board rack 电路板架CC contour correction 轮廓校正CCD charge coupled device 电荷耦合器件CD compact disc 激光唱片CDA current dumping amplifier 电流放大器CD-E compact disc erasable 可抹式激光唱片CDG compact-disc plus graphic 带有静止图像的CD唱盘CD constant directional horn 恒定指向号角CDV compact disc with video 密纹声像唱片CE ceramic 陶瓷Clock enable 时钟启动Cell 电池,元件,单元Cellar club 地下俱乐部效果Cello 大提琴CEMA consumer electronics manufacturer'sassociation (美国)消费电子产品制造商协会CENELEC connector 欧洲标准21脚AV连接器Cent 音分Central earth 中心接地CES consumer electronic show(美国)消费电子产品展览会CF center frequency 中心频率Cross fade 软切换CH channel 声道,通道Chain 传输链,信道Chain play 连续演奏Chamber 密音音响效果,消声室CHAN channel 通道Change 交换Chapter 曲目Chaper skip 跳节CHAE character 字符,符号Characteristic curve 特性曲线Charge 充电Charger 充电器Chase 跟踪Check 校验CHC charge 充电CH - off 通道切断Choke 合唱Choose 选择Chromatic 色彩,半音Church 教堂音响效果CI cut in 切入CIC cross interleave code 交叉隔行编码CIRC circulate 循环Circuit 电路CL cancel 取消Classic 古典的Clean 净化CLR clear 归零Click 嘀哒声Clip 削波,限幅,接线柱CLK clock 时钟信号Close 关闭,停止CLS 控制室监听Cluster 音箱阵效果CLV ceiling limit value 上限值CMP compact 压缩CMPT compatibility 兼容性CMRR common mode rejection ratio 共模抑制比CNT count 记数,记数器CNTRL central 中心,终殃CO carry out 定位输出Coarse 粗调Coax 同轴电缆Coaxial 数码同轴接口Code 码,编码Coefficient 系数Coincident 多信号同步Cold 冷的,单薄的Color 染色效果COM comb 梳状(滤波)COMB combination 组合音色COMBI combination 组合,混合COMBO combination 配合,组合Combining 集合,结合COMM communication 换向的,切换装置Command 指令,操作,信号COMMON 公共的,公共地端Communieation speed 通讯速度选择COMP comparator 比较器COMP compensate 补偿Compact 压缩Compander 压缩扩展器Compare 比拟Compatibility 兼容Compensate 补偿Complex 全套设备Copmoser 创意者,作曲者Compressor 压缩器COMP-EXP 压扩器Compromise (频率)平衡Computer 计算机,电脑CON concentric cable 同轴电缆CON console 操纵台CON controller 控制器Concentric 同轴的,同心的Concert 音乐厅效果Condenser Microphone 电容话筒Cone type 锥形(扬声器)CONFIG 布局,线路接法Connect 连接,联络CORR correct 校正,补偿,抵消Configuration 线路布局Confirmation 确认Consent 万能插座Console 调音台Consonant 辅音Constant 常数CONT continuous 连续的(音色特性)CONT control 控制,操纵Contact 接触器Content 内容Continue 连续,继续Continue button 两录音卡座连续放音键Contour 外形,轮廓,保持Contra 次八度Contrast 对比度Contribution 分配Controlled 可控的Controller 控制器CONV conventional 常规的CONV convert 变换CONV convertible 可转换的Copy 复制Correlation meter 相关表Coupler 耦合Cover 补偿Coverage 有效范围CP clock pulse 时钟脉冲CP control program 控制程序CPU 终殃处理器CR card reader 卡片阅读机CRC cyclic redundancy check 循环冗余校验Create 建立,创造Crescendo 渐强或渐弱Crispness 清脆感CRM control room 控制室CROM control read only memory 控制只读存储器Crossfader 交叉渐变器Cross-MOD 交叉调制Crossover 分频器,换向,切断Cross talk 声道串扰,串音Crunch 摩擦音C/S cycle/second 周/秒CSS content scrambling system 内容加密系统CST case style tape 盒式磁带CT current 电流CTM close talking microphone 近讲话筒CU counting unit 计数单元Cue 提示,选听Cue clock 故障计时钟Cueing 提示,指出Cursor 指示器,光标Curve (特性)曲线Custom 常规CUT 切去,硬切换D double 双重的,对偶的D drum 鼓,磁鼓DA delayed action 延迟作用D/Adigital/analog 数字/模拟DAB digital audio broadcasting 数字音频广播Damp 阻尼DASH digital audio stationar head 数字固定磁头Dashpot 缓冲器,减震器DAT digital audio tape 数字音频磁带,数字录音机DATA 数据DATAtron 数据处理机DATE 日期DB(dB) decibel 分贝DB distribution 分线盒DBA decibel asolute 绝对分贝DBA decibel adjusted 调整分贝DBB dynamic bass boost 动态低音提升DBK decibels referred to one kilowatt 千瓦分贝DBm decibel above one milliwatt in 600 ohms 毫瓦分贝DBS direct broadcast satellite 直播卫星DBX 压缩扩展式降噪系统DC distance controlled 遥控器DCA digital command assembly 数字指令装置DCE data circuit terminating equipment数据通讯线路终端设备DCF digital comb filter 数字梳状滤波器DCH decade chorus 十声部合唱DCP date central processor 数据中心处理器DD direct drive 直接驱动DD dolby digital 数字杜比DDC direct digital control 直接数字控制DDS digital dynamic sound 数字动态声DDT data definition table 数据定义表Dead 具有强吸声特性的房间的静寂DEC decay 衰减,渐弱,余音效果Decibel 分贝Deck 卡座,录音座,带支加的,走带机构Deemphasis 释放Deep reverb 纵深混响De-esser 去咝声器DEF defeat 消隐,静噪Delete 删除Delivery end 输入端DEMO demodulator 解调器Demo 自动演奏Demoder 解码器Density 密度,声音密度效果Detune 音高微调,去谐DepFin 纵深微调Depth 深度Denoiser 降噪器Design 设计Destroyer 抑制器DET detector 检波器Deutlichkeit 清晰度DEV device 装置,仪器DEX dynamic exciter 动态激励器DF damping factor 动态滤波器DFL dynamic filter 动态滤波DFS digital frequency synthesizer 数字频率合成器DI data input 数据输入Diagram 图形,原理图Dial 调节度盘Difference 不同,差别DIFF differential 差动Diffraction 衍射,绕射Diffuse 传播Diffusion 扩散DIG digit 数字式Digital 数字的,数字式,计数的Digitalyier 数字化装置DIM digital input module 数字输入模块DIM diminished 衰减,减半音Dimension 范围,密度,尺寸,(空间)维,声像宽度Din 五芯插口(德国工业标准)DIN digital input 数字输入DIR direct 直接的,(调音台)直接输出,定向的Direct box 指令盒,控制盒Direct sound 直达声Directory 目录Direction 配置方式Directional 方向,指向的Directivity 方向性DIS display 显示器DISC disconnect 切断,开路DISC discriminator 鉴相器Disc 唱盘,唱片,碟Disc holder 唱片抽屉Disc recorder 盘片式录音机Dischage 释放,解除Disco 迪斯科,迪斯科音乐效果Discord 不谐和弦Disk 唱盘,碟DISP display 显示器,显示屏Dispersion 频散特性,声音分布Displacement 偏转,代换Distortion 失真,畸变DIST distance 距离,间距DIST district 区间Distributer 分配器,导向装置DITEC digital television camera 数字电视摄像机Dim 变弱,变暗,衰减DIV divergence 发散DIV division 分段DIV divisor 分配器Diversity 分集(接收)Divider 分配器Divx 美国数字视频快递公司开发的一种每次观看付费的DVD DJ Disc Jocker 唱片骑士DJ dust jacket 防尘罩DJ delay 延迟DLD dynamic linear drive 动态线性驱动DLLD direct linear loop detector 直接线性环路检波器DME digital multiple effector 数字综合效果器DMS date multiplexing system 数据多路传输系统DMS digital multiplexing synchronizer数字多路传输同步器DMX data multiplex 数据多路(传输)DNL dynamic noise limiter 动态噪声抑制器DNR dynamic noise reduction 动态降噪电路DO dolly out 后移DO dropout 信号失落DOB dolby 杜比DOL dynamic optimum loudness 动态最佳响度Dolby 杜比,杜比功能Dolby Hx Pro dolby Hx pro headroom extension system 杜比Hx Pro动态余量扩展系统Dolby NR 杜比降噪Dolby Pro-logic 杜比定向逻辑Dolby SR-D dolby SR digital 杜比数字频谱记录Dolby Surround 杜比环绕Dome loudspeaker 球顶扬声器Dome type 球顶(扬声器)DOP doppler 多普勒(响应)Double 加倍,双,次八度Doubler 倍频器,加倍器Double speed 倍速复制D.OUT direct output 直接输出Down 向下,向下调整,下移,减少DPCM differential pulse code modulation 差动脉冲调制DPD direct pure MPX decoder 直接纯多路解调器DPL dolby pro logic 杜比定向逻辑DPL duplex 双工,双联DPLR doppler 多普勒(系统)D.Poher effect 德.波埃效应Dr displacement corrector 位移校准器,同步机DR distributor 分配器DR drum 磁鼓Drain 漏电,漏极DRAM direct read after write 一次性读写存储器Drama 剧场效果DRAW 只读追忆型光盘Dr.Beat 取字时间校准器DRCN dynamic range compression and normalization 动态范围压缩和归一化Drive 驱动,激励Dr.Rhythm 节奏同步校准器DRPS digital random program selector数字式节目随机选择器DDrum 鼓Drum machine 鼓机Dry 干,无效果声,直达声DS distortion 失真DSC digital signal converter 数字信号转换器DSL dynamic super loudness 低音动态超响度,重低音恢复DSM dynamic scan modulation 动态扫描速度调制器DSP digital signal processor 数字信号处理器DSP display simulation program 显示模拟程序DSP digital sound processor 数字声音处理器DSP digital sound field processor 数字声场处理器DSP dynamic speaker 电动式扬声器DSS digital satellite system 数字卫星系统DT data terminal 数据终端DT data transmission 数据传输DTL direct to line 直接去线路DTS digital theater system 数字影剧院系统DTS digital tuning system 数字调谐系统DTV digital television 数字电视Dual 对偶,双重,双Dub 复制,配音,拷贝,转录磁带Dubbing mixer 混录调音台Duck 按入,进入Dummyload 假负载DUP Duplicate 复制(品)Duplicator 复制装置,增倍器Duration 持续时间,宽度Duty 负载,作用范围,功率Duty cycle 占空系数,频宽比DUX duplex 双工DV device 装置,器件DVC digital video cassette 数字录象带DVD digital video disc 数字激光视盘DX 天线收发开关,双重的,双向的DYN dynamic 电动式的,动态范围,动圈式的Dynamic filter 动态滤波(特殊效果处理)器Dynamic Microphone 动圈话筒Dynamic range 动态范围Dynode 电子倍增器电极early warning 预警E earth 真地,接地E error 错误,差错(故障显示)EA earth 地线,真地EAR early 早期(反射声)Earphone 耳机Earth terminal 接地端EASE electro-acooustic simulators for engineers工程师用电声模拟器,计算机电声与声学设计软件Eat 收取信号EBU european broadcasting union 欧洲广播联盟EC error correction 误差校正ECD electrochomeric display 电致变色显示器Echo 回声,回声效果,混响ECL extension zcompact limitter 扩展压缩限制器ECM electret condenser microphone 驻极体话筒ECSL equivalent continuous sound level 等级连续声级ECT electronec controlled transmission 电控传输ED edit editor 编辑,编辑器Edit 编辑Edge tone 边棱音EDTV enhanced definition television增强清晰度电视(一种可兼容高清晰度电视)E-DRAW erasable direct after write 可存可抹读写存储器EE errors excepted 允许误差EFF effect efficiency 效果,作用Effector 操纵装置,效果器Effects generator 效果发生器EFM 8/14位调制法EFX effect 效果EG envelope generator 包络发生器EIA electronec industries association(美国)电子工业协会EIAJ electronic industries association Japan 日本电子工业协会EIN einstein 量子摩尔(能量单位)EIN equivalent input noise 等效输入噪声EIO error in operation 操作码错误Eject 弹起舱门,取出磁带(光盘),出盒EL electro luminescence 场致发光ELAC electroacoustic 电声(器件)ELEC electret 驻极体Electret condenser microphone 驻极体话筒ELF extremely low frequency 极低频ELEC electronec 电子的Electroacoustics 电声学EMI electro magnetic interference 电磁干扰Emission 发射EMP emphasispo 加重EMP empty 空载Emphasis 加重EMS emergency switch 紧急开关Emulator 模拟器,仿真设备EN enabling 启动Enable 赋能,撤消禁止指令Encoding 编码End 末端,结束,终止Ending 终端,端接法,镶边ENG engineering 工程Engine 运行,使用ENG land 工程接地Enhance 增强,提高,提升ENS ensemble 合奏ENS envelope sensation 群感Eensemble 合奏Eensemble 合奏ENT enter 记录Enter 记入,进入,回车Entering 插入,记录Entry 输入数据,进入ENV envelope 包络线Envelopment 环绕感EOP electronic overload protection 电子过载保护EOP end of program 程序结束EOP end output 末端输出EOT end of tape 磁带尾端EP extend playing record 多曲目唱片EP extended play 长时间放录,密录EPG edit pulse generator 编辑脉冲发生器EPS emergency power supply 应急电源EQ equalizer 均衡器,均衡EQ equalization 均衡EQL equalization 均衡Equal-loudness contour 等响曲线Equipped 准备好的,已装备Equitonic 全音Equivalence 等效值ER erect 设置ER error 错误,误差ERA earphone 耳机Eraser 抹去,消除Erasing 擦除,清洗Erasure 抹音Erase 消除,消Er early 早期的ERCD extended resolution CD 扩展解析度CD EREQ erect equalizer均衡器(频点)位置(点频补偿电路的中点频率)调整ERF early reflection 早期反射(声)Ernumber 早期反射声量Error 错误,出错,不正确ES earth swith 接地开关ES electrical stimulation 点激励Escqpe 退出ETER eternity 无限Euroscart 欧洲标准21脚AV连接器Event 事件EVF envelope follower包络跟随器(音响合成装置功能单元)EX exciter 激励器EX exchange 交换EX expanding 扩展EXB expanded bass 低音增强EXC exciter 激励器EXCH exchange 转换Exclusive 专用的Excursion 偏移,偏转,漂移,振幅EXP expender 扩展器,动态扩展器EXP export 输出Exponential horn tweeter 指数型高音号角扬声器Expression pedal表达踏板(用于控制乐器或效果器的脚踏装置)EXT extend 扩展EXT exterior 外接的(设备)EXT external 外部的,外接的EXT extra 超过EXTN extension 扩展,延伸(程控装置功能单元)Extract 轨道提出EXTSN extension 扩展,延伸(程控装置功能单元)F fast 快(速)F feedback 反馈F forward 向前F foot 脚踏(装置)F frequency 频率F function 功能Ffactor 因子,因素,系数,因数Fade 衰减(音量控制单元)Fade in-out 淡入淡出,慢转换Fader 衰减器Fade up 平滑上升Failure 故障Fall 衰落,斜度Faraday shield 法拉第屏蔽,静电屏蔽FAS full automatic search 全自动搜索Fast 快速(自动演奏装置的速度调整钮)Fastener 接线柱,闭锁Fat 浑厚(音争调整钮)Fattens out 平直输出Fault 故障,损坏Fader 衰减器,调音台推拉电位器(推子)Fading in 渐显Fading out 渐显False 错误Fancier 音响发烧友Far field 远场FatEr 丰满的早期反射FB feedback 反馈,声反馈FB fuse block 熔丝盒F.B fiver by 清晰FBO feedback outrigger 反馈延伸FCC federal communications commission。
Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium) 铝Aluminum – oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS) 砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子Optical quenching光猝灭Optical transition 光跃迁Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Passination 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo) resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor聚合物半导体Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi – Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可靠性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT) 热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压Wafer 晶片Wave equation 波动方程Wave guide 波导Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。
以下为<专业音响中英文对照>摘自网络专业音响中英文对照A 安培,电流的单位。
ABC 1、自动低音补偿。
2、自动亮度控制。
absolutc pitch 绝对音调、绝对音高。
absorption coefficient 吸声系数absorption loss 吸收损失ac 交流电ac bias 交流偏磁ac voltage 交流电压accentuation 加重、提升access 接近、入口、存取accessory 附属的,附件(形容词)accesspries 附属的、附件、配件、附属设备accmpanimenl 伴奏accordion 手风琴accrescendo 渐强accumulator 1、蓄电池2、累加器、存储器a-channel A通道acoustic 声学的、音响的acoustic backing 吸声衬垫acoustic box 助声箱acoustic color 音色acoustic effect 音响效果acoustic clasticty 声弹性acoustic feedback 声反馈acousticrefeneration 声波的一部分从声频放大系统同这个系统的前置部分或输入电路的机械耦合。
acoustic fidelity 声保真度acoustic filter 声过滤器acoustic generater 声发生器acoustic pressure 声压acoustic reflectivity 声反射率acoustic resonance 声共振acoustics 声学、音响学acoustic system 声系统acoustic trealment 声处理acoustic wave 声波acoustical couping 声耦合acoustical-electrical transducer 声-电转换器actinodielectric 光电介质actionoelectrictiy 光电效应actionoelectricity 光电action 动作、作用activtaion 激活、活化active 有功的、主动的、有源的actual sound 同期声A-D 模拟(电路)-数字(电路)abapter 接续器、连接头、适配器ADC 摸数转换器ADJ 调节、调整ADSR 这是合成器的包络波控制的四个阶段ADT 自动声迹(音)加倍A.DUB 声频复制、配音A.EDIT 自动编辑AES 声频工程师协会af 声频、音频afa 音频放大器A-fade 衰减AFC 自动频率控制AFL 调音台中指监听的声音处在衰减器后面的状态after sound 余音agc 自动增益控制age 老化A-IN 声频输入的缩写A-INSEL 声频输入的选择air coloum 空气拄alarm 告警、警报alc 自动电平控制alignment 调整、校准、校正alkaline cell 碱性电池allen screw 爱林螺钉alligator 接线夹、鳄鱼夹alpha α值alternating current 交流电流alternating current/direct current 交流/直流alternating current erasing head 交流抹音头alternating votltage 交流电压alternation 半周期alternator 交流发电机altitude 高度alto 女低音am 调幅ambience 环境声音ambient noise 环境噪声ambient sound 环境声ambient temperature 环境温度ambiophony 主体混响、环境立体声amp 安培、安;放大器ampere 安培ampere-hour 安培小时amplification 放大amplifier 放大器amplitude 幅度、振幅amplitude distortion 幅度失真amplitude modulation 调幅、幅度调制analog 模拟analog signal 模拟信号analog-to-digital conversion 摸(拟)-数(字)变换器analyser 分析仪、分析器anechoic 无回声的、消声anechoic enclosure 无回声密闭室、消声室anechoic room 无回声室、消声室angle 角、相角angle of incidence 入射角angle of lag(or lerd) 滞后角(或超前角)angular frequency 角频率ANL 自动嗓声限制anode 阳极anode current 阳极电流anodevoltage 阳极电压ANRS 自动嗓声抑制系统、自动降噪系统ANSI 美国国家标准协会antenna 天线antinodes 波腹antinoise microphone 抗噪声传声器antiphase 反相antiresonance 并联谐振antiresonant ciruit 并联谐振电路antiresonant frequency 并联谐振频率APRS 英国专业录音室协会AQL 可接受的质量水平、容许品质等级arpeggio 琶音articulation 清晰度artificial ear 人工耳artificial echo 人工回声artificial voice 仿真口声ASL 美国标准协会assign 分配、指定asynchronous 不同步、异步atmosphere microphone 专门收录空气中的环境声的传声器attack time 启动时间、上升时间ATE 自动测试设备attenuation netwoke 衰减网络attenuator 衰减器audibility 可听度audible 可听的audible tones 正常人耳能够觉察的声音,通常能认同频率范围为30到15000赫兹audio amplifier 音频放大器audio band 音频段audio componet 音频成分andio control cngineer 调音师、录音师audio cue channel 录象机声频提示通道audio equipment 声频设备、伴音设备audio frequency 声频、音频audio-frequency choke 音频扼流圈audio-frequency noise 音频嗓声audio-frequency oscillator 音频振荡器audio-frequency transformer 音频变压器audiogram 闻阀图、听觉阀图audio head 录音头、拾音头、还音头audio-level meter 音频电平表audio patch bay 音频配线架audiophile 音频爱好者、发烧友、讲究音质者audio signal 音频信号audio spectrum 音频频谱audio tape 录音磁带audio-visual 视听的、视听系统auditorium 观众厅aural 听觉的auto-man 自动-人工automatic 自动的automatic bass compensation 自动低音补偿automatic frequency control 自动频率控制(缩写AFC) automatic gain conltrol 自动增益控制(缩写AGC)automatic record changer 自动换片器automatic rewind 自动倒带automatic shutoff 自动停止automatic track shift 自动声道转换装置automatic tuning 自动调谐automatic volume compression 自动音量压缩automatic volume control 自动音量控制autotranstormer 自耦变压器aux 辅助插口auxiliary circuit 辅助电路A-V 视听(装置)、音频-视频AV COMPU 计算机控制AV系统average 平均average value 平均值AWG 美国线规(表示导线直径,号数越大,直径越细)axial lead 轴向引线axis 轴azimuth 方位角、方位b 巴。
AAAC automatic ampltiude control 自动幅度控制AB AB制立体声录音法Abeyancd 暂停,潜态A—B repeat A—B重复ABS absolute 绝对的,完全的,绝对时间ABS american bureau of standard 美国标准局ABSS auto blank secrion scanning 自动磁带空白部分扫描Abstime 绝对运行时间A.DEF audio defeat 音频降噪,噪声抑制,伴音静噪ADJ adjective 附属的,附件ADJ Adjust 调节ADJ acoustic delay line 声延迟线Admission 允许进入,供给ADP acoustic data processor 音响数据处理机ADP(T) adapter 延配器,转接器ADRES automatic dynamic range expansion system 动态范围扩展系统ADRM analog to digital remaster 模拟录音、数字处理数码唱盘 ADS audio distribution system 音频分配系统A.DUB audio dubbing 配音,音频复制,后期录音ADV advance 送入,提升,前置量ADV adversum 对抗ADV advancer 相位超前补偿器Adventure 惊险效果AE audio erasing 音频(声音)擦除AE auxiliary equipment 辅助设备Aerial 天线AES audio engineering society 美国声频工程协会AF audio fidelity 音频保真度AF audio frequency 音频频率AFC active field control 自动频率控制AFC automatic frequency control 声场控制Affricate 塞擦音AFL aside fade listen 衰减后(推子后)监听A—fader 音频衰减AFM advance frequency modulation 高级调频AFS acoustic feedback speaker 声反馈扬声器AFT automatic fine tuning 自动微调AFTAAS advanced fast time acoustic analysis system 高级快速音响分析系统After 转移部分文件Afterglow 余辉,夕照时分音响效果Against 以……为背景AGC automatic gain control 自动增益控制AHD audio high density 音频高密度唱片系统AI advanced integrated 预汇流AI amplifier input 放大器输入AI artificial intelligence 人工智能AI azimuth indicator 方位指示器A-IN 音频输入A—INSEL audio input selection 音频输入选择Alarm 警报器ALC automatic level control 自动电平控制ALC automatic load control自动负载控制Alford loop 爱福特环形天线Algorithm 演示Aliasing 量化噪声,频谱混叠Aliasing distortion 折叠失真Align alignment 校正,补偿,微调,匹配Al-Si-Fe alloy head 铁硅铝合金磁头Allegretto 小快板,稍快地Allegro 快板,迅速地Allocation 配置,定位All rating 全(音)域ALM audio level meter 音频电平表ALT alternating 震荡,交替的ALT alternator 交流发电机ALT altertue 转路ALT—CH alternate channel 转换通道,交替声道Alter 转换,交流电,变换器AM amperemeter 安培计,电流表AM amplitude modulation 调幅(广播)AM auxiliary memory 辅助存储器Ambience 临场感,环绕感ABTD automatic bulk tape degausser 磁带自动整体去磁电路 Ambient 环境的Ambiophonic system 环绕声系统Ambiophony 现场混响,环境立体声AMLS automatic music locate system 自动音乐定位系统AMP ampere 安培AMP amplifier 放大器AMPL amplification 放大AMP amplitude 幅度,距离Amorphous head 非晶态磁头Abort 终止,停止(录制或播放)A-B TEST AB比较试听Absorber 减震器Absorption 声音被物体吸收ABX acoustic bass extension 低音扩展AC accumulator 充电电池AC adjustment caliration 调节-校准AC alternating current 交流电,交流AC audio coding 数码声,音频编码AC audio center 音频中心AC azimuth comprator 方位比较器AC-3 杜比数码环绕声系统AC—3 RF 杜比数码环绕声数据流(接口)ACC Acceleration 加速Accel 渐快,加速Accent 重音,声调Accentuator 预加重电路Access 存取,进入,增加,通路Accessory 附件(接口),配件Acryl 丙基酰基Accompaniment 伴奏,合奏,伴随Accord 和谐,调和Accordion 手风琴ACD automatic call distributor 自动呼叫分配器ACE audio control erasing 音频控制消磁A—Channel A(左)声道Acoumeter 测听计Acoustical 声的,声音的Acoustic coloring 声染色Acoustic image 声像Across 交叉,并行,跨接Across frequency 交叉频率,分频频率ACST access time 存取时间Active 主动的,有源的,有效的,运行的Active crossover 主动分频,电子分频,有源分频Active loudsperker 有源音箱Armstrong MOD 阿姆斯特朗调制ARP azimuth reference pulse 方位基准脉冲Arpeggio 琶音Articulation 声音清晰度,发音Artificial 仿……的,人工的,手动(控制)AAD active acoustic devide 有源声学软件ABC auto base and chord 自动低音合弦Architectural acoustics 建筑声学Arm motor 唱臂唱机Arpeggio single 琶音和弦,分解和弦ARL aerial 天线ASC automatic sensitivity control 自动灵敏度控制 ASGN Assign 分配,指定,设定ASP audio signal processing 音频信号处理ASS assembly 组件,装配,总成ASSEM assemble 汇编,剪辑ASSEM Assembly 组件,装配,总成Assign 指定,转发,分配Assist 辅助(装置)ASSY accessory 组件,附件AST active servo techonology 有源伺服技术A Tempo 回到原速Astigmatism methord 象散法BB band 频带B Bit 比特,存储单元B Button 按钮Babble 多路感应的复杂失真Back 返回Back clamping 反向钳位Back drop 交流哼声,干扰声Background noise 背景噪声,本底噪声Backing copy 副版Backoff 倒扣,补偿Back tracking 补录Back up 磁带备份,支持,预备Backward 快倒搜索Baffle box 音箱BAL balance 平衡,立体声左右声道音量比例,平衡连接 Balanced 已平衡的Balancing 调零装置,补偿,中和Balun 平衡=不平衡转换器Banana jack 香蕉插头Banana bin 香蕉插座Banana pin 香蕉插头Banana plug 香蕉插头Band 频段,Band pass 带通滤波器Bandwidth 频带宽,误差,范围Band 存储单元Bar 小节,拉杆BAR barye 微巴Bargraph 线条Barrier 绝缘(套)Base 低音Bass 低音,倍司(低音提琴)Bass tube 低音号,大号Bassy 低音加重BATT battery 电池Baud 波特(信息传输速率的单位)Bazooka 导线平衡转接器BB base band 基带BBD Bucket brigade device 戽链器件(效果器)B BAT Battery 电池BBE 特指BBE公司设计的改善较高次谐波校正程度的系统 BC balanced current 平衡电流BC Broadcast control 广播控制BCH band chorus 分频段合唱BCST broadcast (无线电)广播BD board 仪表板Beat 拍,脉动信号Beat cancel switch 差拍干扰消除开关Bel 贝尔Below 下列,向下Bench 工作台Bend 弯曲,滑音Bender 滑音器BER bit error rate 信息差错率BF back feed 反馈BF Backfeed flanger 反馈镶边BF Band filter 带通滤波器BGM background music 背景音乐Bias 偏置,偏磁,偏压,既定程序Bidirectional 双向性的,8字型指向的Bifess Bi—feedback sound system 双反馈系统Big bottom 低音扩展,加重低音Bin 接收器,仓室BNG BNC连接器(插头、插座),卡口同轴电缆连接器Binaural effect 双耳效应,立体声Binaural synthesis 双耳合成法Bin go 意外现象Bit binary digit 字节,二进制数字,位Bitstream 数码流,比特流Bit yield 存储单元Bi-AMP 双(通道)功放系统Bi-wire 双线(传输、分音)Bi-Wring 双线BK break 停顿,间断BKR breaker 断电器Blamp 两路电子分音Blanking 关闭,消隐,断路Blaster 爆裂效果器Blend 融合(度)、调和、混合Block 分程序,联动,中断Block Repeat 分段重复Block up 阻塞Bloop (磁带的)接头噪声,消音贴片BNC bayonet connector 卡口电缆连接器Body mike 小型话筒Bond 接头,连接器Bongo 双鼓Boom 混响,轰鸣声Boomy 嗡嗡声(指低音过强)Boost 提升(一般指低音),放大,增强Booth 控制室,录音棚Bootstrap 辅助程序,自举电路Both sides play disc stereo system 双面演奏式唱片立体声系统Bottoming 底部切除,末端切除Bounce 合并Bourclon 单调低音Bowl 碗状体育场效果BP bridge bypass 电桥旁路BY bypass 旁通BPC basic pulse generator 基准脉冲发生器 BPF band pass filter 带通滤波器BPS band pitch shift 分频段变调节器BNC bayonet connector 卡口电缆连接器Body mike 小型话筒Bond 接头,连接器Bongo 双鼓Boom 混响,轰鸣声Boomy 嗡嗡声(指低音过强)Boost 提升(一般指低音),放大,增强Booth 控制室,录音棚Bootstrap 辅助程序,自举电路Bottoming 底部切除,末端切除Bounce 合并Bourclon 单调低音Bowl 碗状体育场效果BP bridge bypass 电桥旁路BY bypass 旁通BPC basic pulse generator 基准脉冲发生器 BPF band pass filter 带通滤波器BPS band pitch shift 分频段变调节器BR bregister 变址寄存器BR Bridge 电桥Break 中止(程序),减弱Breathing 喘息效应B.Reso base resolve 基本解析度Bridge 桥接,电桥,桥,(乐曲的)变奏过渡 Bright 明亮(感)Brightness 明亮度,指中高音听音感觉Brilliance 响亮BRKRS breakers 断路器Broadcast 广播BTB bass tuba 低音大喇叭BTL balanced transformer-less 桥式推挽放大电路 BTM bottom 最小,低音BU backup nuit 备用器件Bumper 减震器Bus 母线,总线Busbar 母线Buss 母线Busy 占线BUT button 按钮,旋钮BW band width 频带宽度,带度BYP bypass 旁路By path 旁路BZ buzzer 蜂音器CC cathode 阴极,负极C Cell 电池C Center 中心C Clear 清除C Cold 冷(端)CA cable 电缆Cable 电缆Cabinet 小操纵台CAC coherent acoustic coding 相干声学编码Cache 缓冲存储器Cal calando 减小音量CAL Calendar 分类CAL Caliber 口径CAL Calibrate 标准化CAL Continuity accept limit 连续性接受极限Calibrate 校准,定标Call 取回,复出,呼出Can 监听耳机,带盒CANCL cancel 删除CANCL Cancelling 消除Cancel 取消Cannon 卡侬接口Canon 规则Cap 电容Capacitance Mic 电容话筒Capacity 功率,电容量CAR carrier 载波,支座,鸡心夹头Card 程序单,插件板Cardioid 心型的CATV cable television 有线电视Crispness 脆声Category 种类,类型Cartridge 软件卡,拾音头Carrkioid 心型话筒Carrier 载波器Cart 转运Cartridge 盒式存储器,盒式磁带Cascade 串联Cassette 卡式的,盒式的CAV constant angular velocity 恒角速度Caution 报警CBR circuit board rack 电路板架CC contour correction 轮廓校正CCD charge coupled device 电荷耦合器件CD compact disc 激光唱片CDA current dumping amplifier 电流放大器CD-E compact disc erasable 可抹式激光唱片CDG compact-disc plus graphic 带有静止图像的CD唱盘 CD constant directional horn 恒定指向号角CDV compact disc with video 密纹声像唱片CE ceramic 陶瓷Clock enable 时钟启动Cell 电池,元件,单元Cellar club 地下俱乐部效果Cello 大提琴CEMA consumer electronics manufacturer'sassociation(美国)消费电子产品制造商协会CENELEC connector 欧洲标准21脚AV连接器Cent 音分Central earth 中心接地CES consumer electronic show (美国)消费电子产品展览会CF center frequency 中心频率Cross fade 软切换CH channel 声道,通道Chain 传输链,信道Chain play 连续演奏Chamber 密音音响效果,消声室CHAN channel 通道Change 交换Chapter 曲目Chaper skip 跳节CHAE character 字符,符号Characteristic curve 特性曲线Charge 充电Charger 充电器Chase 跟踪Check 校验CHC charge 充电CH — off 通道切断Choke 合唱Choose 选择Chromatic 色彩,半音Church 教堂音响效果CI cut in 切入CIC cross interleave code 交叉隔行编码CIRC circulate 循环Circuit 电路CL cancel 取消Classic 古典的Clean 净化CLR clear 归零Click 嘀哒声Clip 削波,限幅,接线柱CLK clock 时钟信号Close 关闭,停止CLS 控制室监听Cluster 音箱阵效果CLV ceiling limit value 上限值CMP compact 压缩CMPT compatibility 兼容性CMRR common mode rejection ratio 共模抑制比 CNT count 记数,记数器CNTRL central 中心,中央 CO carry out 定位输出 Coarse 粗调Coax 同轴电缆Coaxial 数码同轴接口Code 码,编码Coefficient 系数Coincident 多信号同步Cold 冷的,单薄的Color 染色效果COM comb 梳状(滤波)COMB combination 组合音色COMBI combination 组合,混合COMBO combination 配合,组合Combining 集合,结合COMM communication 换向的,切换装置Command 指令,操作,信号COMMON 公共的,公共地端Communieation speed 通讯速度选择 COMP comparator 比较器COMP compensate 补偿Compact 压缩Compander 压缩扩展器Compare 比拟Compatibility 兼容Compensate 补偿Complex 全套设备Copmoser 创意者,作曲者Compressor 压缩器COMP—EXP 压扩器Compromise (频率)平衡Computer 计算机,电脑CON concentric cable 同轴电缆CON console 操纵台CON controller 控制器Concentric 同轴的,同心的Concert 音乐厅效果Condenser Microphone 电容话筒Cone type 锥形(扬声器)CONFIG 布局,线路接法Connect 连接,联络CORR correct 校正,补偿,抵消Configuration 线路布局Confirmation 确认Consent 万能插座Console 调音台Consonant 辅音Constant 常数CONT continuous 连续的(音色特性) CONT control 控制,操纵Contact 接触器Content 内容Continue 连续,继续Continue button 两录音卡座连续放音键Contour 外形,轮廓,保持Contra 次八度Contrast 对比度Contribution 分配Controlled 可控的Controller 控制器CONV conventional 常规的CONV convert 变换CONV convertible 可转换的Copy 复制Correlation meter 相关表Coupler 耦合Cover 补偿Coverage 有效范围CP clock pulse 时钟脉冲CP control program 控制程序CPU 中央处理器CR card reader 卡片阅读机CRC cyclic redundancy check 循环冗余校验Create 建立,创造Crescendo 渐强或渐弱Crispness 清脆感CRM control room 控制室CROM control read only memory 控制只读存储器 Crossfader 交叉渐变器Cross-MOD 交叉调制Crossover 分频器,换向,切断Cross talk 声道串扰,串音Crunch 摩擦音C/S cycle/second 周/秒CSS content scrambling system 内容加密系统CST case style tape 盒式磁带CT current 电流CTM close talking microphone 近讲话筒CU counting unit 计数单元Cue 提示,选听Cue clock 故障计时钟Cueing 提示,指出Cursor 指示器,光标Curve (特性)曲线Custom 常规CUT 切去,硬切换DD double 双重的,对偶的D drum 鼓,磁鼓DA delayed action 延迟作用D/Adigital/analog 数字/模拟DAB digital audio broadcasting 数字音频广播Damp 阻尼DASH digital audio stationar head 数字固定磁头Dashpot 缓冲器,减震器DAT digital audio tape 数字音频磁带,数字录音机DATA 数据DATAtron 数据处理机DATE 日期DB(dB) decibel 分贝DB distribution 分线盒DBA decibel asolute 绝对分贝DBA decibel adjusted 调整分贝DBB dynamic bass boost 动态低音提升DBK decibels referred to one kilowatt 千瓦分贝DBm decibel above one milliwatt in 600 ohms 毫瓦分贝 DBS direct broadcast satellite 直播卫星DBX 压缩扩展式降噪系统DC distance controlled 遥控器DCA digital command assembly 数字指令装置DCE data circuit terminating equipment 数据通讯线路终端设备 DCF digital comb filter 数字梳状滤波器DCH decade chorus 十声部合唱DCP date central processor 数据中心处理器DD direct drive 直接驱动DD dolby digital 数字杜比DDC direct digital control 直接数字控制DDS digital dynamic sound 数字动态声DDT data definition table 数据定义表Dead 具有强吸声特性的房间的静寂DEC decay 衰减,渐弱,余音效果Decibel 分贝Deck 卡座,录音座,带支加的,走带机构Deemphasis 释放Deep reverb 纵深混响De-esser 去咝声器DEF defeat 消隐,静噪Delete 删除Delivery end 输入端DEMO demodulator 解调器Demo 自动演奏Demoder 解码器Density 密度,声音密度效果Detune 音高微调,去谐DepFin 纵深微调Depth 深度Denoiser 降噪器Design 设计Destroyer 抑制器DET detector 检波器Deutlichkeit 清晰度DEV device 装置,仪器DEX dynamic exciter 动态激励器DF damping factor 动态滤波器DFL dynamic filter 动态滤波DFS digital frequency synthesizer 数字频率合成器 DI data input 数据输入Diagram 图形,原理图Dial 调节度盘Difference 不同,差别DIFF differential 差动Diffraction 衍射,绕射Diffuse 传播Diffusion 扩散DIG digit 数字式Digital 数字的,数字式,计数的Digitalyier 数字化装置DIM digital input module 数字输入模块DIM diminished 衰减,减半音Dimension 范围,密度,尺寸,(空间)维,声像宽度 Din 五芯插口(德国工业标准)DIN digital input 数字输入DIR direct 直接的,(调音台)直接输出,定向的Direct box 指令盒,控制盒Direct sound 直达声Directory 目录Direction 配置方式Directional 方向,指向的Directivity 方向性DIS display 显示器DISC disconnect 切断,开路DISC discriminator 鉴相器Disc 唱盘,唱片,碟Disc holder 唱片抽屉Disc recorder 盘片式录音机Dischage 释放,解除Disco 迪斯科,迪斯科音乐效果Discord 不谐和弦Disk 唱盘,碟DISP display 显示器,显示屏Dispersion 频散特性,声音分布Displacement 偏转,代换Distortion 失真,畸变DIST distance 距离,间距DIST district 区间Distributer 分配器,导向装置DITEC digital television camera 数字电视摄像机Dim 变弱,变暗,衰减DIV divergence 发散DIV division 分段DIV divisor 分配器Diversity 分集(接收)Divider 分配器Divx 美国数字视频快递公司开发的一种每次观看付费的DVD DJ Disc Jocker 唱片骑士DJ dust jacket 防尘罩DJ delay 延迟DLD dynamic linear drive 动态线性驱动DLLD direct linear loop detector 直接线性环路检波器DME digital multiple effector 数字综合效果器DMS date multiplexing system 数据多路传输系统DMS digital multiplexing synchronizer数字多路传输同步器DMX data multiplex 数据多路(传输)DNL dynamic noise limiter 动态噪声抑制器DNR dynamic noise reduction 动态降噪电路DO dolly out 后移DO dropout 信号失落DOB dolby 杜比DOL dynamic optimum loudness 动态最佳响度Dolby 杜比,杜比功能Dolby Hx Pro dolby Hx pro headroom extension system 杜比Hx Pro 动态余量扩展系统Dolby NR 杜比降噪Dolby Pro—logic 杜比定向逻辑Dolby SR—D dolby SR digital 杜比数字频谱记录Dolby Surround 杜比环绕Dome loudspeaker 球顶扬声器Dome type 球顶(扬声器)DOP doppler 多普勒(响应)Double 加倍,双,次八度Doubler 倍频器,加倍器Double speed 倍速复制D。
........(一) Personnel 员工chorus 合唱队组员Production Team 制作队artist 艺人executive producer 执行制作人understudy 替角musical director 音乐总监antagonist 第二主要演员choreographer 编舞者protagonist 主要演员technical director 技术总监principal 主要演员stage designer 舞台设计师supernumerary 编外演员production property master 道具负责joker 丑角人master of ceremony 司仪sound designer 音响设计师double cast 双复演员,双重角色costume designer 服装设计师Backstage Crew 后台人员lighting designer 灯光设计师property crew 道具人员scenic designer 布景设计师makeup artist 化妆师scripter writer 编剧作家wardrobe manager 衣箱经理production carpenter 制作木工Hair (Person) 头发师production electrician 制作电工Lobby Crew 前台工作人员production supervisor 制作监督员house crew 剧场工作人员publicist 公关House manager 前台负责人,剧场负责Administrative Team 行政队人company representative 公司代表usher 剧场引座员Company manager 公司经理ticket collector 收票员union representative 工会代表patron/sponsor 赞助者production manager 制作经理Lighting Designer 灯光设计师business manager 业务经理Assistant Designer 助理灯光设计师publicist 宣传人员(三) Electric 电legal counsel 法律顾问open circuit 开路,断路(二) Running Crew panic switch 紧急开关stage hand 舞台工作人员 ,置景工 ,舞台装alternating current (~)(AC) 交流电卸工direct current (DC, =) 直流电stage crew 舞台工作人员current/ electric current (el) (A) 电流light board operator /programmer 灯primary current 主要电流,原电流光控制盘操作者secondary current 次电流Electric crew 电工phase (elec.) 相head electrician/ master electrician 电3-phrase current 三相工领队Amp/Ampere 安培head fly man 吊杆操作领队circuit/ circuitry (elec.) 电路flyboy/ riggers/ fly man 吊杆操作者main circuit 主电路Fly floor teams 飞动设施操作人员circuit breaker 断路器projectionist 放映人员company switch, auxiliary power gofer 办杂事的职员source ,additional electricity 辅助电源,prompter 提词人额外电力scene shift 搬移道具人员connect (to) (with, up) 连接Followspot operator 追光师connected in parallel 并联Weight loader 配重操作人员connected in series 串联........ disconnect 切断electronic control 电子控制fuse 保险丝fuse box 保险丝箱distribution panel 配电盘distributingmain 配电干线distribution block 接线板distribution board wiring 配电板线路distribution board 配电板distribution box heater 配电箱加热器distribution box 配电箱,分线盒,配电盒distribution cabinet 分配阀箱distribution cable 配电电缆distribution capacity 分配电容distribution center 配电中心distribution circuit 配电线路ground (US)/earth (UK) 接地 ;地线grounded (elec.) 已接地线impedance 扼流线圈(阻抗)increase (to) 增大 ;增加input voltage 输入电压output voltage 输出电压lead (UK)/cable/ leg 电缆load (elec.) 负担neutral (elec.) 不带电的ohm 欧姆 (电阻单位 )overload (elec.) , "pop the breaker" 超载power (elec.) (W) 电力AC to DC adapter(rectifier) 适配器(整流器)reduce (to) ,"break down to" ,"kill(off) " 减少kill(off) 关闭turn off (to)/kill 关掉/切short circuit/shorted out/burned up 短路strap 束住Cable fixing straps 光缆固定带turn on (to)/bring dim to 使硅箱数字到Dip in intensity亮度暗下voltage伏特数tie line绑住绳wattage功率(四) Cable电缆cabling走线Twofers(pigtail)二合一电缆Threefers(Martingale)三合一电缆Wire Gauge 线材号数Adapter 适配器Connect (To) 连接(向)Control Cable 控制电缆Extension Cable/Cord延长线Optical fiber光学纤维Connectors电接线器plug 插头 (男性 )receptacle/socket(female)插座 (女性 ) outlet (elec.)插座(一般是用来插电线的插座)new style twist lock美国舞台插座old style twist lock美国舞台插座stage pin美国舞台常见插座Edison美国家庭插座dips (UK) (elec.)/floor pocket (US) 英国舞台常见插座drop box 地面插座floor pocket 地面框wall box/pocket 墙框Camlock 接头3pin DMX XLR 数据缆4 pin 彩色卷轴使用数据缆5pin dmx cable dmx 数据缆(五)舞台配套设施fan (elec.) 风扇ghost light 当剧院不在使用时用的灯remote control "r-fu(arfoo)" 远程控制器resistance device 阻器件transformer (elec) 变压器ballast 照明设备用镇流器walking talking/intercom 对讲机bubble machine 泡沫机ventilator fan 控制鼓风机unique hazer 控制烟雾机smoke machine 烟机subtitle machine 字幕机........(六) Tools 工具wire stripper 电线剥离器,剥皮钳tie wrap 可能关闭的线条Allen key 艾伦内六角扳手crescent wrench 月牙扳手glue 胶,胶水tape 胶布 ;double-face tape 双面胶sellotape/clear tape 透明胶 (Brit props) (专利名)gaffer tape 电工胶带electrical tape/ insulating tape 绝缘胶布paste 糨糊pliers 钳子scissors 剪刀tape measure 卷尺(七) Hanging position 悬挂位置truss 桁架grid ;gridiron栅顶俗称葡萄架,舞台上部为安装悬吊装备的专用工作层。
品质管理电子产品的英文术语大全从事品质工作以来积累的常用英语,希望对有需要的朋友有所帮助!品质专业英语大全零件材料类的专有名词CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit(记忆集成电路)RAM: Random Access Memory(随机存取存储器)DRAM: Dynamic Random Access Memory(动态随机存取存储器)SRAM: Staic Random Access Memory(静态随机存储器)ROM: Read-only Memory(只读存储器)EPROM:Electrical Programmable Read-only Memory(电可抹只读存诸器)EEPROM: Electrical Erasbale Programmable Read-only Memory(电可抹可编程只读存储器)CMOS: Complementary Metal-Oxide-Semiconductor(互补金属氧化物半导体)BIOS: Basic Input Output System(基本输入输出系统)Transistor:电晶体LED:发光二极体Resistor:电阻Variator:可变电阻Capacitor:电容Capacitor array:排容Diode:二极体Transistor:三极体Transformer:变压器(ADP)Oscillator:频率振荡器(0sc)Crystal:石英振荡器XTAL/OSC:振荡产生器(X)Relay:延时器Sensor:感应器Bead core:磁珠Filter:滤波器Flat Cable:排线Inductor:电感Buzzer:蜂鸣器Socket:插座Slot:插槽Fuse:熔断器Current:电流表Solder iron:电烙铁Magnifying glass:放大镜Driver:螺丝起子Oven:烤箱TFT:液晶显示器Oscilloscope:示波器Connector:连接器PCB:printed circuit board(印刷电路板)PCBA: printed circuit board assembly(电路板成品)PP:并行接口HDD:硬盘FDD:软盘PSU:power supply unit(电源供应器)SPEC:规格Attach:附件Case: 机箱,盖子Cover:上盖Base:下盖Bazel:面板(panel)Bracket:支架,铁片Lable:贴纸Guide:手册Manual:手册,指南Card:网卡Switch:交换机Hub:集线器Router:路由器Sample:样品Gap:间隙Sponge:海绵Pallet:栈板Foam:保利龙Fiber:光纤Disk:磁盘片PROG:程序Barcode:条码System:系统System Barcode:系统条码M/B:mother board:主板CD-ROM:光驱FAN:风扇Cable:线材Audio:音效K/B:Keyboard(键盘)Mouse:鼠标Card reader:读卡器Screw:螺丝Thermal pad:散热垫Heat sink:散热片Rubber:橡胶垫Rubber foot:脚垫Bag:袋子Washer:垫圈Sleeve:袖套Config:机构Label hi-pot:高压标签Firmware label:烧录标签Metal cover:金属盖子Plastic cover:塑胶盖子Tape for packing:包装带Bar code:条码Tray:托盘Collecto:集线夹Holder:固定器,L铁Connecter:连接器IDE:集成电路设备,智能磁盘设备SCSI:小型计算机系统接口Gasket:导电泡棉AGP:加速图形接口PCI:周边组件扩展接口LAN:局域网USB:通用串形总线架构Slim:小型化COM:串型通讯端口LPT:打印口,并行口Power cord:电源线I/O:输入,输出Speaker:扬声器EPE:泡棉Carton:纸箱Button:按键,按钮Foot stand:脚架部门名称的专有名词QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制。
Tempo:每分钟的节拍速度,例如tempo 140就是每分钟140拍Tick:一拍Bar:棒,一棒是指4拍,也用来形容歌词,往往Hip-Hop音乐中,一句词就是one bar (4拍) Level:音量Pitch:音高Record:动词是指录音,名词是指一首歌,一张唱片Arm for Record:准备录音,也就是通常按下音频编辑软件的”录音”键Play:播放Pause:占停Stop:停止Loop:循环播放Metronome:计拍器Note: 音调(参照下面的音调键盘对照表)Melody: 旋律Chord: 和弦Track: 音轨,分Audio Track (音轨) 还有MIDI Track (MIDI信号轨)Audio: 音频Stereo: 立体声Mono: 单声道Instrument: 乐器VST-Plug-ins: 音乐插件,也就是软件里面代替乐器的东西MIDI: 全称是Musical Instrument Digital Interface,说白了就是旋律信号, 打个比方来说,写字的时候,你的笔是你用的乐器,笔里的墨水是发出来的声音,你写字的过程(一笔一画的)就是MIDI了。
也就是说要是MIDI写(弹)得不好,写出来的字(发出来的声)也就难听。
MIDI Controller: MIDI控制器,可以输入MIDI信号的电子琴键盘或者是鼓板,例如Axiom 49, Korg Kontrol, M-Audio Key station或者是Akai MPK, Akai MPD等等的Synthesizer: 电子琴,跟MIDI 控制器的不同就是,Synthesizer自身带有声音,而MIDI 控制器必须要连接电脑上的软件才能发出声音来。
参考一下Roland Fantom, Moog little phatty, Yamaha Motif等。
Sound Module: 音色库,就是synthesizer去掉了键盘部分,只是一个带有按钮的盒子,里面含有各种声音。
Words and Expressionsfollow v.遵循memory n.存储器register n.寄存器access v.访问overlap v. 重叠pipelining n. 流水线操作multiplier n. 乘法器accumulator n. 累加器shifter n.移位器reference n. 寻址mantissa n.尾数exponent n. 指数cycle n. 机器周期customize v.定制,用户化package v.封装digital signal processor 数字信号处理器von Neumann architecture 冯·诺伊曼结构shared single memory 单一共享存储器program instruction 程序指令harvard architecture 哈佛结构fetch from 从…获取circular buffer 循环缓冲区,环形缓冲区address generator 地址产生器fixed point 定点floating point 浮点binary point 二进制小数点available precision 可用精度dynamic range 动态范围scale range 量程smallest Resolvable Difference 最小分辨率scientific notation 科学计数法assembly language 汇编语言multi-function instructions 多功能指令parallel architecture 并行结构looping scheme 循环机制sampling frequency 采样频率on-chip memory 片内存储器well-matched 非常匹配software tools 软件开发工具low level programming language 低级编程语言high level programming language 高级编程语言third party software 第三方软件board level product 板级产品data register 数据寄存器ALU=Arithmetic Logical Unit 运算逻辑单元program sequencer 程序定序器peripheral sections 外设single integrated circuit 单片集成电路cellular telephone 蜂窝电话printed circuit board 印刷电路板licensing agreement 专利使用权转让协定custom devices 定制器件extra memory 附加存储器stand alone 单机third party developer 第三方开发商multimedia operations 多媒体操作merged into 融合calculation-intensive algorithm运算密集型算法Unit 5 Digital Signal ProcessorsDigital signal processing tasks can be performed by all processors. Specialized digital signal processors(DSPs), however, perform these tasks most efficiently and most quickly. While traditional processors follow the Von Neumann architecture[]1model, which assumes a shared single memory to be used for both program instructions and data, DSPs use the Harvard or modified Harvard architecture []2, which includes multiple program and data memories, along with multiple buses to access them. This arrangement means that much less waiting is required when instructions or numbers are fetched from memory. In fact at least one of each can be fetched simultaneously. Such overlapping of tasks is called pipelining. In addition to multiple memories and buses, all DSPs have fast multipliers, accumulators, and shifters, and many have hardware support for circular buffers. Address generators can speed up accesses to memory locations referenced by registers.DSPs are available in two major classes: fixed point and floating point. The fixed point class represents real numbers in a fixed number of bits. The position of the binary point (similar to the decimal point) can be controlled by the programmer, and determines the range of numbers that can be represented. As the range increases, though, the available precision goes down, since fewer bits lie to the right of the binary point. In 16 bits, the formats 16.0, 15.1, 14.2, 13.3, 12.4, 11.5, 10.6, 9.7, 8.8, 7.9, 6.10, 5.11, 4.12, 3.13, 2.14, and 1.15 are possible. The dynamic range, calculated as 20log (Full Scale Range/Smallest2= 96.3 dB.Resolvable Difference), remains the same for all 16-bit formats, 20log16Figure 6.3 Van Neumann architectureFigure 6.4 Harvard architectureFloating point DSPs represent real numbers using a mantissa and an exponent , similar to scientific notation : Many combine mantissa and exponent into a 32-bit number. The dynamic range for floating point devices is calculated from the largest and smallest multipliers E 2, where E is the exponent. Thus, for a representation that uses 24 bits for the mantissa and 8 bits for the signed exponent, the dynamic range is 20 log (1281272/2-) = 1535.3 dB. A large dynamic range means the system has great power to represent a wide range of input signals, from very small to very large.Assembly language is the command language for DSPs. DSPs often have specialized instructions that make programming for common DSP tasks more convenient and more efficient. For example, most DSPs offer multi-function instructions that exploit their parallel architecture . Other constructs that are frequently offered are efficient looping schemes , since so many DSP operations involve a great deal of repetition.Choosing a DSP for a particular application is not always easy. The first decision is on whether tochoose a fixed point or a floating point device []3. Generally, fixed point devices are cheaper and quicker,but floating point devices are more convenient to program and more suited to calculation-intensive algorithms . Second, the data width of the DSP determines how accurately it can represent numbers. Speed is another issue, not only how many cycles occur in each second, but also how many instructions execute in each cycle and how much work each of these instructions accomplishes. One way to assess the minimum requirements for the DSP is to estimate how many instructions must be executed for each received sample. When this number is multiplied by the sampling frequency , the minimum required number of instructions per second is obtained.The specific hardware and software features offered by a particular DSP can make one choice betterthan another, as can the amount of on-chip memory available []4. Sometimes DSPs are chosen becausewell-matched supporting hardware, particularly A/D and D/A converters, is obtainable. Frequently, the quality and convenience of the software tools, for both low level and high level programming languages, are also major factors, as is the availability of third party software. As always, cost is a factor. In fact, quite often, the DSP that is fastest and offers the most features, but also fits the budget, is the one selected.DSPs can be purchased in three forms, as a core, as a processor, and as a board level product. In DSP, the term "core" refers to the section of the processor where the key tasks are carried out, including the data registers, multiplier, ALU, address generator, and program sequencer. A complete processor requires combining the core with memory and interfaces to the outside world. While the core and these peripheral sections are designed separately, they will be fabricated on the same piece of silicon, making the processor a single integrated circuit.Suppose you build cellular telephones and want to include a DSP in the design. You will probably want to purchase the DSP as a processor, that is, an integrated circuit that contains the core, memory and other internal features. To incorporate this IC in your product, you have to design a printed circuit board where it will be soldered in next to your other electronics. This is the most common way that DSPs are used.Now, suppose the company you work for manufactures its own integrated circuits. In this case, you might not want the entire processor, just the design of the core. After completing the appropriate licensing agreement, you can start making chips that are highly customized to your particular application. This gives you the flexibility of selecting how much memory is included, how the chip receives and transmits data, how it is packaged, and so on.Custom devices of this type are an increasingly important segment of the DSP marketplace.There are several dozen companies that will sell you DSPs already mounted on a printed circuit board. These have such features as extra memory, A/D and D/A converters, EPROM sockets, multiple processors on the same board, and so on. While some of these boards are intended to be used as stand alone computers, most are configured to be plugged into a host, such as a personal computer. Companies that make these types of boards are called Third Party Developers. The best way to find them is to ask the manufacturer of the DSP you want to use. Look at the DSP manufacturer's website; if you don't find a list there, send them an e-mail. They will be more than happy to tell you who are using their products and how to contact them.Keep in mind that the distinction between DSPs and other microprocessors is not always a clear line. For instance, look at how Intel describes the MMX technology addition to its Pentium processor: "Intel engineers have added 57 powerful new instructions specifically designed to manipulate and process video, audio and graphical data efficiently. These instructions are oriented to the highly parallel, repetitivesequences often found in multimedia operations . "In the future, we will undoubtedly see more DSP-like functions merged into traditional microprocessors and microcontrollers. The Internet and other multimedia applications are a strong driving force for these changes. These applications are expanding so rapidly, in twenty years it is very possible that the Digital Signal Processor may be the "traditional" microprocessor.Notes1. “冯·诺伊曼结构”取名字美国杰出的数学家—约翰·冯·诺伊曼(John Von Neumann,1903~1957)。
Programmable Cellular Logic:Past,Present,and FutureRussell TessierLaboratory for Computer ScienceMassachusetts Institute of TechnologyCambridge,Massachusetts02139September10,1994AbstractIn recent years there has been renewed interest in the use offlexible arrays offine-grained computational elements to perform logical functions.This interest has been sparked by the tech-nological advancement of very large-scale integrated circuits in the form offield-programmablegate arrays(FPGAs).Although logic mapping to regular arrays of gates in integrated chip formhas only been practical for the past ten years or so,a number of reconfigurable architectures weredesigned and analyzed during the1960’s and early1970’s.This paper makes a historical analysis of these structures and discusses changes in technology and architectural trends as they pertain to cellular arrays since the1960’s.Direct comparisons ofvarious cellular array architectural features with contemporary programmable logic features aremade as well as an analysis of potential future directions for FPGA development based in part onknowledge gained from the study of cellular arrays.1IntroductionSince the inception of integrated circuit technology in the late1950’s there has been interest in map-ping reconfigurable implementations of switching functions to a silicon substrate.A simple,reconfig-urable logic block in the form of an integrated circuit is recognized as a straightforward mechanism for enhancing system testability andflexibility.The introduction of batch fabrication technology in the1960’s introduced limited feasibility for mapping these functions to regular arrays of logic cells implemented as integrated circuits.These structures,called cellular arrays,typically consisted of a fixed interconnection of cellular elements of a limited logical variety.While a great deal of theoretical research was done in determining cell parameters such as cell size,interconnect,and logic mapping, integrated circuit technology was not yet advanced enough to support these ideas.Interest in logical arrays of cellular elements was renewed with the introduction of thefirstfield-programmable gate array(FPGA)in1986[26].To this point in time,FPGAs have most typically been used as reconfigurable“glue”logic chips in digital systems.Only recently have these devices been recognized as computation elements.A B C A B C 1111O O 1−Dimensional2−Dimensional Figure 1:Typical Cellular Array StructuresThe goal of this paper is to constrast cellular array architectures and implementations from the 1960’s and early 1970’s with FPGA architectures of today and indicate potential future directions of FPGA development based in part on prior work done with cellular arrays.It will be seen that while technology has changed dramatically in the past thirty years,some of the features that made cellular arrays attractive are the same ones that fuel interest in today’s reprogrammable logic devices.After the issues of reconfigurable logic have been examined,a proposal for a potential integrated system based on this logic will be presented.2BackgroundThe largest motivating factor behind cellular array development in the 1960’s was a desire to reduce circuit costs and increase chip testability by increasing the amount of available logic per chip when compared to discrete MSI solutions [8].Rather than partitioning a wafer into discrete logic packages,the goal was to locate a number of dies in a single integrated package.As seen in Figure 1,most cellular arrays consisted of either a one-dimensional cascade or two-dimensional mesh of discrete logic cells.Arrays of cells consisting of several logic gates and perhaps a storage element were classified as microcellular arrays [8]while arrays with cells of large numbers of gates (typically more than five)were known as macrocellular arrays.This report focuses primarily on microcellular arrays due to their similarity to many contemporary reprogrammable architectures.Two-input cell Maitra cascades [12]and variants [6]are examples of one-dimensional linear cellular arrays.These cascades supported decomposition of switching functions to cells of one of six possible functions of two input variables such as and,or,and xor.Cascades with two intercell leads were foundto implement every switching function at a worst case growth rate of O(n),where n is the number of input variables.Linear cascades offixed cell types could be aligned vertically to form a two-dimensional mesh. The result of each vertical cascade could be summed together in either sum-of-products[11],product-of-sums[20],or Reed-Muller form[13]to generate afinal result.Virtually all arrays and cascades used unidirectional logicflow(e.g top to bottom or left to right).Outputs along the bottom and left edge of the array could be used as feedback inputs for synchronous arrays or as inputs for neighboring arrays.Although logic minimization techniques could be applied to some functions mapped to these array styles[14],array growth rates of at least O(),where n is the number of input variables,were found in these types of array structures.Most research in cellular arrays was aimed toward determining efficient cell sizes,interconnec-tion,and mapping heuristics.Not only were these parameters constrained by theoretical limits,they were also constrained by technological limitations of the period.This may explain a tendency toward veryfine grain cell structures.Only a handful of designs were actually implemented in silicon[11], [8].Some of these architectures used mechanical switches or light controlled photocells to program interconnections between cells or the function of the cells themselves.Specialized configurations of reprogrammable logic were recognized as appropriate for certain types of applications.For example,a programmable array of elements was constructed for sorting a set of binary numbers[15]and determining threshold values of input sequences[16].Some forms of content-addressed memory may also be considered specialized arrays of reconfigurable cells.In many respects cellular arrays may be considered the stepping stone for modern technologies other than FPGAs such as programmable logic arrays(PLAs),systolic arrays[24],and cellular pro-cessors for special purpose applications.Contemporary FPGAs are logic devices capable of holding thousands of mapped gates of logic. Like cellular arrays,FPGAs are characterized by discrete logic cells embedded in an interconnection structure.Look-up table(LUT)based FPGAs[26]have cells which contain universal logic functions of a number of inputs that produce a single output.Look-up tables are typically configured by SRAM storage loaded when power is applied to the device.Other programmable devices contain intercon-nected blocks of and-or logic.While cellular arrays and FPGAs are similar in nature in many respects there are some distinct differences in design and structure.The following sections examine some of the assumptions made by cellular array researchers in the1960’s and evaluates them from a historical perspective.Where ap-propriate,comparisons will be made to contemporary FPGA architectures.For each issue,comments will be made as to possible future research directions as FPGA architectures evolve.3Interconnection and Logic MappingSome assumptions made by cellular array designers are not consistent with today’s view of technology. Contemporary FPGA interconnection structures differ from most cellular array counterparts in that FPGA interconnect is generally programmable while cellular array interconnect was primarilyfixed. Due to technological constraints,virtually all cellular arrays used point-to-point nearest-neighbor in-terconnect(usually unidirectional)while most FPGAs mix an assortment of local interconnect between neighboring cells and global busses that interconnect cells some distance away.In fact,one could claim that the largest difference between cellular array designers and FPGA designers is that while cellular array designers were concerned with optimizing the functionality of cells to reduce logic within afixedBusFigure2:Cobweb Cellular Array Interconnectinterconnection structure,FPGA designers are concerned with optimizing the cell structure itself to reduce routing interconnection.Due to advancements in logic minimization methods and VLSI technology it is not suprising that most cellular array architectures are not scalable by today’s standards.While linear cascades of two-input elements are interesting from a theoretical point of view,it would make little sense to implement them in today’s technology.Structures such as horizontal arrays of minterms were chosen from a ease of implementation standpoint rather than any theoretical rationale.Although such an implementation grows at O(n)with respect to the number of input variables,it was easy to implement in a regular array.While the circuit implementation of logic is largely dependent on the nature of the logic to be im-plemented,some generalizations can be made.Many cellular array mappings can today be recognized as mappings of the results of two-level logic minimization techniques[27].Such results are classified as two-level logic because they can be rearranged into a form equivalent to sum-of-products format (eg.ab+cdf+ac).While this type of representation is generally efficient for a small numbers of input variables(¡10)larger input counts can lead to area inefficiency.While nearest-neighbor only cell interconnect was easy to implement,it did lead to large numbers of cells being used as pass-through interconnect thus wasting logic area.Early research in cellular arrays showed that adding additional routing capacity to nearest-neighbor interconnect could reduce cell count.Minnick[7]showed that nearest neighbor array cell counts could be reduced by30%by augmenting cells with connections to neighbors and adding horizontal busses as shown in Figure2. While adding additional lines reduced cell count,it also made the problem of mapping logic to the array untenable without manual intervention.O = F(H,G)H inputs G inputs Figure 3:Increased Functional ComplexityX BusesA B C D FPGA Cell Out Figure 4:Typical FPGA Cell and InterconnectThe method of implementation described above breaks down for large circuits with many inputs.As seen in Figure 3,complex functions could be decomposed into less complicated switching func-tions in neighboring array “tiles”[5].Due to the unidirectional nature of signal flow in the array this technique could leave large portions of the array unused.Some designers suggested feeding syn-chronous array outputs back into the array [11]along array edges although this technique is clearly not scalable.The mapping techniques used for large cellular arrays are ineffiecint due to properties of logic locality.Minimal representations of logic circuits can typically be represented by tree-like clumps of logic rather than fixed uni-directional grids.While small circuits have enough locality to fit effi-ciently into such representations,larger circuit representations become more sparse and necessitate more interconnection resources to connect to neighboring logical bundles.Thus,by allowing a choice between localized and more global interconnect FPGAs can represent logic more efficiently.The mapping of logic to a fixed cellular array interconnection is in direct contrast to logic mapping in today’s programmable FPGA architectures.A typical example of an interconnection of cells for an FPGA is shown in Figure 4.Each cell may consist one or more look-up tables and an associated D flip flop.Each cell output may be connected to signals existing between nearest neighbors andFigure5:Decomposed Logic Treea variety of global busses interconnecting distant cells.This satisfies the need for both local and global interconnect.Typically,today’s architectures separate the translation of logic to discrete cell arrays into three stages:the mapping of logic to cells,the placement of cells in the array,and the routing of interconnection between the cells.Switching functions arefirst decomposed into“trees”of logic(Figure5).Trees with appropriate numbers of inputs may be mapped to a look-up table.This technique,referred to as multi-level logic minimization,typically creates a reduced gate count version of the circuit when compared to two-level implementations.For look-up table based architectures a mapping is made to cover all sub-trees containing the appropriate number of inputs and outputs.Once logic has been mapped to blocks,algorithms such as simulated annealing are used tofind a placement requiring minimal routing.Routing of the interconnection network is performed as afinal step.Recent research[10]has shown that the use of veryfine-grained cell sizes,such as those consisting of one or two gates,are actually poor choices for reducing chip area and delay in reprogrammable devices targetted toward random types of logic(non-pipelined,etc).This is due to an increased number of cells necessary to implement logic and their associated intermediate routing resources.For example, a four input look-up table is considered to be equivalent to approximately100NAND gates of logic. Thus the NAND cell would have to be more than100times smaller in area than the SRAM-based look-up table to overcome this inefficiency and make up for additional required routing between the gates.Additional routing wires add more capacitance to the connections thus adding to circuit delay. In this case small scale locality can be used as a benefit to clump associated circuitry together.It is interesting to note that some non-reprogrammable FPGA architectures have cell structures that implement two-level logic in the form of a sum-of-product plane with a moderate number of inputs [4].This type of structure takes advantage of the locality of limited two-level implementations while allowing the building of larger structures through a more general-purpose interconnection array.Much of the future of reconfigurable logic depends on the improvement of high level synthesis tools for mapping logic.Work in the area of compiling hardware description languages has enjoyed moderate success although a number of improvements remain.Rather than providing minimization at a low level,the compilation of high level structures to reconfigurable devices should provide for iden-tification of recognizable circuit constructs in high-level form and subsequently map these constructs to previously optimized versions of the structure created for a specific target device.This higher-levelview is analagous to a software compiler generating optimized code for a specific construct in a high-level language.This technique creates structures already optimized for a specific architecture and can be used to reduce the need for additional logic resources and routing overhead.Structures amenable to direct compilation include adders,counters,and comparators.Hardware compilers such as Synopsys[3]are just beginning to use libraries of optimized structures appropriate under different timing and logic area consideration.FPGA devices using only local communication have been designed with mixed results in terms of logic mapping efficiency[21]indicating that at least some non-nearest neighbor interconnection is advantageous.High-level recognition of specific functional structures may lead to the embedding of special-purpose functional blocks within the cellular interconnection structure.The cost of placing these blocks as non-reconfigurable logic should be balanced with their overall usefulness from a sys-tem perspective.For example,the embedding of a full adder that is smaller and faster than an adder implementation in cellular blocks is not efficient if it is rarely used.4TestabilityOne of the largest motivating factors in the development of cellular arrays was a desire to overcome batch fabrication defects by configuring around damaged cells on a silicon substrate.Logic mapping software could be informed of silicon wafer defects and map logic to unaffected cells[8].Proposals[17]for adding additional logic to cells to allow for in-circuit testability compensated for frequent chip failures.IC test capabilities have progressed to the point that test patterns of all possible SRAM-based FPGA configurations can be generated following FPGA manufacture without the need for special circuitry in cells[22].It is currently more cost effective to discard faulty dies and chips rather than selling the parts with software to configure around errors.As reconfigurable devices become more complex and costly to produce it may make sense to reinvestigate this option.Before programming the user could use software to analyze the device for faults.Device functionality could then configure the device to ignore non-functional cells and interconnect while allowing the remaining functional cells to be used to the best possible capacity.Although some FPGAs allow for limited testability of devices through hardware support such as JTAG boundary scan,no current devices contain special circuitry for in-circuit test of all cells.It seems unlikely at this time that there is need for portions of a reconfigurable device to check other the viability of neighboring cells.Upon detection of a chip failure external to the chip,a test of the entire chip contents should be made instead.5ProgrammabilitySuprisingly,even though the technology supporting cellular arrays has changed radically in the past thirty years,most of the techniques for programming the devices have stayed the same.The technique Maitra[12]proposed of using afinal layer of metalization for programming the functionality of cells is directly analagous to mask-programmable gate array(MPGA)techniques sup-ported today[22].While MPGA designers select an interconnection pattern for afixed set of gates, cellular cascade designers could select a cell function for afixed interconnect cell interconnect.In an alternate approach,cutpoint cellular logic[11]was programmed by passing a larger-than-normal current through configuration fuses in each cell through external connections.This is practi-cally the same method used by Actel for programming discrete anti-fuses that configure cell function-ality[1].Several cellular array designers proposed a programming“arm”technique for configuring devices. This mechanism involves passing information from a source external to the chip through cells that have already been programmed to unprogrammed cells.[23][17].Essentially,each cell in the array was initially configured to set a load path to its neighbor on which configuration data could pass.After the last cell in the array had been configured,the“arm”could be retracted leaving cells programmed with itsfinal functionality.This was also considered an effective way to test cell functionality and route around it if necessary.A similar approach suggested in[18]and used by Xilinx and others today is the formation of a dedicated shift chain of configuration bits for all cellular storage elements.This approach has the drawback of requiring logic to be reconfigured simultaneously.For the future one could consider having multiple storage bits associated with each programmable location.When an external stimulus is applied all or part of the configuration is switched to the alter-nate one.Additionally,it should be possible to reconfigure a portion of the device without affecting the remaining configuration.This might be done by treating groups of configuration bits as addressable byte memory locations accessible from outside the chip.6FPGA Computational ExtensionsRecently,reconfigurable logic has been recognized as being useful not only as combinational“glue”logic in digital systems but also as computational elements in their own right.Just as special purpose cellular array systems for sorting and arithmetic were proposed in the1960’s,a number of special purpose systems for performing tasks such as recognizing genetic patterns[9]have been developed as special purpose coprocessors for microprocessor environments[19].Virtually all of these systems re-quire the user to hand develop algorithms in either hardware description languages or using schematic capture programs.Before reconfigurable hardware can be widely used in microprocesor systems a great deal of work must be done to develop better software support.Note the microprocessor system shown in Figure 6.System performance might be accelerated by the development of software to configure a special purpose coprocessor to perform tasks frequently performed in software and costly to implement on a microprocessor.These tasks may be identified by a software profiler with a group of instructions in the instruction stream replaced by a bus access to the reconfigurable hardware configured to perform the same functionality.Consider,for example,a microprocessor system without any special purpose coprocessors that occasionally is required to perform special purpose operations such as signal processing applications.A configuration compiler could be used to identify tasks in sequential code that require long computa-tion time on a sequential processor and then generate a configuration for the associated reconfigurable hardware to perform the task instead.This requires the compiler to perform the following steps:1.Search through code attempting to identify sections that are performed frequently and exhibitparallelism that may be accelerated by reconfigurable hardware.2.Transform the selected software code into a reconfigurable hardware configuration that performsthe desired task.3.Replace the appropriate lines of code in the program with a call to the reconfigurable hardware.Figure6:Microprocessor System with Reconfigurable Coprocessor Of the tasks listed above,item2is by far the hardest.Certain types of tasks such as pipelined systolic operations are relatively straightforward to implement as a sequence of operations on recon-figurable hardware while operations such as loops may require the addition of extra control logic to coordinate dataflow.It is possible to implement a sequence of operations in many different ways in reconfigurable logic.One could consider creating a small microcoded engine with functional units and a control unit more closely resembling a processor architecture or,alternatively,one could implement an operation as a linear sequence of functions with less control overhead.Choices are further blurred by the capability to trade function evaluation time for space inside reconfigurable devices.For example,arithmetic operations inside reconfigurable hardware may be serialized to use fewer functional resources but require greater computation time.The use of reconfigurable logic for computation will be greatly enhanced with the introduction of devices containing multiple configuration bits for each configurable point in the device.This feature will allow a processor to generate several configurations to accelerate computation and select between them rapidly as they are needed by the software.7ConclusionSince the introduction of integrated circuits,engineers have searched for ways to implement and use reconfigurable logic.While initial efforts focused primarily on the development of hardware technol-ogy,more recent efforts have focused on improving software techniques for mapping logic to reconfig-urable devices.While hardware features of reconfigurable logic such as grain size and interconnection structure have remained fairly stable for the past ten years,software techniques of mapping to this logic have changed radically and will continue to do so.As software techniques improve reconfigurable devices will become more viable resources for special purpose computation.While today designers must hand code and optimize special purpose operations targetted for reconfigurable hardware,it is possible to envision a sophisticated compiler performing a similiar task.As outlined in this paper,it is clear that many tradeoffs exist in the con-struction of such a tool.References[1]Actel Corporation ACT Family Field Programmable Gate Array Data Book,April1992.[2]Concurrent Logic,Inc.CLi6000Series Field-Programmable Gate Arrays,May1992.Revision1c.[3]Synopsys,Inc.Synopsys User’s Manual,June1993[4]Altera,Inc.Altera Data 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