Nordic nRF51822介绍

OHTCOMTechnology Ltd.nRF51822模块规格说明书Datasheet of nRF51822 Modules2015.6.1目录1 简介 Introduction (3)2 nRF51822 M0 BLE模块介绍 specification for M0 Module . 4天线的连接 (7)程序的烧录 (8)表一 nRF51822 M0工作参数 (8)3 nRF51822 M1 BLE模块介绍 specification for M1 Module . 9程序的烧录 (11)表二 nRF51822 M1工作参数 (11)4 History (13)5 联系方式CONTACT US (14)NOTES:If you are customers from overseas, please contact sales@ for quotation and specifications of English version.1 简介IntroductionnRF51822 Mx BLE低功耗蓝牙模块目前包括nRF51822 M0、nRF51822 M1两款。

这两款BLE模块都是以nRF51822为主控芯片，封装不同的模块。

nRF51822 M0模块包含了LIS3DH3轴传感器，与百度手环使用相同的基础硬件，可以用来开发运动手环等穿戴设备。

nRF51822 M1模块单有一片nRF51822芯片，可以选择16kB RAM或者32kB RAM的不同版本，可以用来开发iBeacon、室内定位、穿戴设备，计算机控制等，应用更灵活，满足不同需求。

nRF51822 M0nRF51822 M12 nRF51822 M0 BLE模块介绍specification for M0 ModulenRF51822 M0采用BGA的nRF51822芯片封装并且集成了高低速晶振、LIS3DH三轴传感器，模块尺寸仅为10.5mm*8.5mm*1.5mm，为业界最小封装。

【蓝牙BLE系列】NRF51822NRF2810NRF52832NRF2840方案对比NRF51822简介nRF51822是一款功能强大，高度灵活的多协议的SoC，非常适用于蓝牙低功耗和2.4GHz的无线应用。

该SoC是基于ARM Cortex M0为内核的微处理器，拥有256KB/128KB 的片上FLASH存储空间，32KB/16KB的RAM空间。

2.4G无线射频支持蓝牙低功耗，同时兼容nRF24L系列的产品。

其应用领域：手机配件，穿戴式设备，无线充电监控，PC外设，消费电子遥控器，智能家居，智能射频标签，玩具和电子游戏等。

芯片特性✧单芯片，高度灵活的2.4GHz多协议设备✧32位ARM Cortex M0CPU内核✧256KB/128KB闪存+32KB/16KB RAM✧支持蓝牙低功耗协议栈✧线程安全和运行时保护✧事件驱动API支持✧空中链路兼容nRF24L系列✧三种速率：2Mbps/1Mbps/250Kbps✧+4dBm输出功率✧-93dBm灵敏度，蓝牙低功耗✧灵活的电源管理系统✧可配置的I/O✧工作温度范围：-40℃至+105℃NRF52810简介nRF52810是一款支持蓝牙5，ANT和 2.4GHz的高性能多协议的SoC。

该SoC提供了对蓝牙5的支持，同时微处理器内核为ARM Cortex M4，具有192KB的FLASH和24KB的RAM空间，能够提供更多的高级应用的支持。

即使在低功耗的应用之中也是表现得非常出色的。

其应用领域：蓝牙5连接处理器，工业传感器和执行器，穿戴设备，智能家居传感器，电脑外设，体育和健身传感器，智能手表，互动游戏和楼宇自动化等。

芯片特性✧单芯片，高度灵活的2.4GHz多协议SoC✧32位ARM Cortex-M4处理器✧电压范围：1.7V至3.6V✧192kB闪存+24kB RAM✧支持并发蓝牙低功耗/ANT协议操作✧+4dBm的输出功率✧-96dBm灵敏度，蓝牙低功耗✧线程安全和运行时保护✧事件驱动API支持✧空中链路兼容nRF24L和nRF24AP系列✧两种速率：2Mbps/1Mbps✧自动的电源管理系统✧可配置的I/O✧1个主/从SPI✧1x双线接口（I²C）✧UART（RTS/CTS）✧1个PWM（4个通道）✧AES HW加密✧8通道10/12位ADC✧正交解码器64级模拟比较器✧实时时钟（RTC）✧数字麦克风接口（PDM）NRF52832简介nRF52832是一款功能强大，高度灵活的超低功耗多协议的SoC，非常适合蓝牙低功耗（BLE，以前成为智能蓝牙），ANT和 2.4GHz的无线应用。

蓝牙nRF51822 应用（基于低功耗蓝牙技术的温湿度传感器节点的设计）关键字：低功耗蓝牙温湿度传感器nRF51822 SHT11随着兼容蓝牙4.0标准的智能手机逐步普及，低功耗蓝牙技术也面临着越来越广泛的应用。

本设计采用了nRF51822和SHT11设计了一种基于低功耗蓝牙技术的温湿度传感器节点，能够将节点位置的温度和湿度发送给主机用于显示，可广泛应用于家庭、车间、仓库的温湿度监控。

1.引言在智能家居和物联网飞速发展的背景下，基于蓝牙4.0标准的低功耗蓝牙（Bluetooth Low Energy，BLE）技术正被逐步地为人们重视。

随着兼容蓝牙4.0标准的智能手机逐步普及，低功耗蓝牙技术也面临着越来越广泛的应用。

本设计采用了基于BLE技术的nRF51822蓝牙SoC芯片和SHT11温湿度传感器设计了一种基于低功耗蓝牙技术的温湿度传感器节点，能够将节点位置的温度和湿度发送给主机用于显示，可广泛应用于家庭、车间、仓库的温湿度监控。

节点采用了低功耗设计，可用一枚纽扣电池供电，实际使用时间可达1年以上。

2.系统结构本设计的系统结构如图1所示，系统的处理器模块由nRF51822构成，温湿度传感器件采用SHT11，电源采用纽扣电池供电；由处理器模块、温湿度传感器模块、天线模块、电源模块构成的节点与主机通过2.4GHz的低功耗蓝牙信号通信，主机采用智能手机运行信息采集显示的APP。

多个节点可利用应用层协议与主机组成星形网络。

图1 系统结构图3.硬件电路温湿度传感器节点硬件的系统构成如图2所示。

图2 硬件系统结构图3.1 处理器模块处理器模块选用Nordic公司的nRF51822芯片。

nRF51822是具有CORTEX-M0低功耗内核，支持BLE、Gazell等多协议的低功耗高速率射频收发器的SoC。

其具有高集成度、低成本、处理能力强、低功耗、小体积等优势，非常适合低功耗蓝牙产品的应用。

该芯片具有以下特性：具有Cortex-M0内核，片上256KB FLASH，16KB RAM，片内包含支持BLE协议的2.4GHz射频收发器。

0、功能简介IC功能包括：256kB片上闪存和16kB RAM；数字和混合信号周边，包括SPI、2-wire、ADC以及正交解码器；16 PPI通道；撘配片上LDO时电源范围为1.8-3.6V，LDO旁路模式为1.75-1.95V ；片上下拉DC/DC转换器用于3V电池（例如，纽扣电池）；片上+/- 250 ppm 32kHZ RC振荡器，在蓝牙低功耗应用，不需外部32kHz晶体，可节省成本和电路板空间；6x6mm 48脚QFN封装，提供最多可达32个GPIO；完整的蓝牙协议堆栈（到配置文件的链接层）。

nRF51822的S110是可下载、免版税、预编译二进制蓝牙低功耗堆栈，可独立编程和更新。

功能包括：异步和事件驱动SVC的API；运行时保护；GATT、GAP和L2CAP级别API；周边和广播器角色；GATT客户端和服务器；和2.4GHz RF专用协议的非并行多协议操作；少于128kB的代码和6kB的RAM，为应用程序留有超过128kB的闪存和10kB的RAM；与使用上一代nRF8001的双芯片应用相比，运行S110堆栈的nRF51822削减了高达50%的功耗。

S110堆栈和nRF51822加上nRF518 SDK相互配合，nRF518包含全面的蓝牙低功耗配置文件、服务以及示例应用集合。

1、架构围绕两条内部总线展开：AHB,APB AHB (Advanced High Performance BUS)：CPU: ( Cortex-m0，NVIC,BBB，DAP)Memory : ( RAM, Flash)GPIO : P0(P0.0~P0.31)AHB to APB BridgeAPB (Advanced Peripheral BUS):左半边：Power：电源控制WDT：看门狗SPI0,SPI1TIMER0(32位),TIMER1(16位),TIMER2(16位)QDEC：正交译码器，CLOCK：提供两个时钟：HFCLK(16MHZ),LFCLK（32.768KHZ）TWI0,TWI1：两线接口，兼容I2C右半边：NVMC :非易失性存储控制器RADIO: 2.4GHZ 无线广播的数据率：250KBPS,1MBPS,2MBPS ECB: 加密功能（AES），产生HASH序列，数字签名，生成密钥流等RNG：产生随机数用于加密（基于内部热噪声），无需种子值。

16 ----2.4 GHz radio (无线发射机)The RADIO包括了一个2.4G的接收机和一个发射机，它兼容了Nordic的所有2Mbps，1Mbps和250kpbs模式增加了1Mbps的蓝牙低功耗模式。

The RADIO使用EasyDMA，EasyDMA包含一个自动压包和解包工具，以及CRC发生器和CRC校验使对它进行非常简单的配置，更多信息查看上图。

The RADIO包含了一个设备地址匹配单元和一个内部框架分隔单元。

它可以被用作简化地址白名单和帧间距分隔。

在低功耗蓝牙和仿真中使用。

The RADIO也包含一个信号轻度指示器（RSSI）和一个位计数器，当一个预先设定的位通过RADIO被发送或者接受完成时，位计数器会引发一个事件。

16.1 功能描述16.1.1 EasyDMAEasyDMA在CPU RAM以内读写数据包，不能通过RAM以外的地址后者代码段读取数据包。

根据上面的框图，the RADIO's EasyDMA利用PACKETPTR指针接受和发送数据包。

CPU必须配置每一次的发送机的发送和接受模式直接的转换，MAXLEN 寄存器配置发射机在同一个数据包中的接收或发送的最大字节数。

此功能可以被用来确定无线发送接机所分配的数据包是否被覆盖或者越界。

16.1.2 包配置（Packet configuration）一个无线数据报文，包含以下部分：报头（PREAMBLE），地址（ADDRESS），长度（LENGTH），S0，S1，PAYLOAD（有效载荷：可理解为有效数据。

）和CRC。

无线发射机发送上述部分时的顺序展示在下图，从左到右，第一个发送的是PREAMBLE 位。

报头（PREAMBLE）总是根据第一个 ADDRESS位的值在0xAA或者0x55两个数字之间取值。

如果ADDRESS是0则PREAMBLE位为0xAA，否则为0x55.下图展示了无线数据包在内存中储存实例无线电字节顺序：ADDRESS和PAYLOAD低位总是优先的存储方式，CRC总是高位优先的存储方式，,S0,LENGHT,S1和PAYLOAD可以通过PCNF1的ENDIAN位。

nrf51822数据⼿册_引脚图_参数Copyright ? 2014 Nordic Semiconductor ASA. All rights reserved.Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.nRF51822Multiprotocol Bluetooth ? low energy/2.4 GHz RF System on Chip Product Specification v3.3Key Features2.4 GHz transceiver-93 dBm sensitivity in Bluetooth low energy mode250 kbps, 1 Mbps, 2 Mbps supported data ratesTX Power -20 to +4 dBm in 4 dB stepsTX Power -30 dBm Whisper mode13 mA peak RX, 10.5 mA peak TX (0 dBm)9.7 mA peak RX, 8 mA peak TX (0 dBm) with DC/DCRSSI (1 dB resolution)ARM Cortex-M0 32 bit processor275 µA/MHz running from flash memory150 µA/MHz running from RAMSerial Wire Debug (SWD)S100 series SoftDevice readyMemory256 kB or 128 kB embedded flash program memory16 kB or 32 kB RAMOn-air compatibility with nRF24L seriesFlexible Power ManagementSupply voltage range 1.8 V to 3.6 V4.2 µs wake-up using 16 MHz RCOSC0.6 µA at 3 V OFF mode1.2 µA at 3 V in OFF mode + 1 region RAM retention2.6 µA at 3 V ON mode, all blocks IDLE8/9/10 bit ADC - 8 configurable channels31 General Purpose I/O PinsOne 32 bit and two 16 bit timers with counter modeSPI Master/SlaveLow power comparatorTemperature sensorTwo-wire Master (I2C compatible)UART (CTS/RTS)CPU independent Programmable Peripheral Interconnect (PPI)Quadrature Decoder (QDEC)AES HW encryptionReal Timer Counter (RTC)Package variantsQFN48 package, 6 x 6 mmWLCSP package, 3.50 x 3.83 x 0.50 mmWLCSP package, 3.50 x 3.83 x 0.35 mmWLCSP package, 3.83 x 3.83 x 0.50 mmWLCSP package, 3.83 x 3.83 x 0.35 mmWLCSP package, 3.50 x 3.33 x 0.50 mm Applications Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad ?Interactive entertainment devices ?Remote control ?Gaming controller ?Beacons ?Personal Area Networks Health/fitness sensor and monitor devices Medical devices Key-fobs + wrist watches Remote control toysLiability disclaimerNordic Semiconductor ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out of the application or use of any product or circuits described herein.Life support applicationsNordic Semiconductor’s products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.Contact detailsFor your nearest distributor, please visit .Information regarding product updates, downloads, and technical support can be accessed through your My Page account on our home page.RoHS and REACH statementNordic Semiconductor's products meet the requirements of Directive 2002/95/EC of the EuropeanParliament and of the Council on the Restriction of Hazardous Substances (RoHS) and the requirements of the REACH regulation (EC 1907/2006) on Registration, Evaluation, Authorization and Restriction of Chemicals. The SVHC (Substances of Very High Concern) candidate list is continually being updated.Complete hazardous substance reports, material composition reports and latest version of Nordic's REACH statement can be found on our website .Main office:Phone: +47 72 89 89 00Fax: +47 72 89 89 89 Otto Nielsens veg 127052 Trondheim NorwayMailing address:Nordic Semiconductor P .O. Box 23367004 TrondheimNorwayDatasheet StatusRevision History StatusDescription Objective Product Specification (OPS)This product specification contains target specifications for product development.Preliminary Product Specification (PPS)This product specification contains preliminary data; supplementary datamay be published from Nordic Semiconductor ASA later.Product Specification (PS)This product specification contains final product specifications. NordicSemiconductor ASA reserves the right to make changes at any timewithout notice in order to improve design and supply the best possibleproduct.DateVersion Description July 2016 3.3Added documentation for the nRF51822 CTAA version of the chip.Added content:Section 9.5 “CTAA WLCSP package” on page 71Section 11.9 “CTAA WLCSP package” on page 118Updated content:Feature list on the front page.Section 2.2.3 “CEAA, CFAC, CTAA, and CTAC WLCSP ball assignment and functions”on page 17Section 3.2.1 “Code organization” on page 22Section 3.2.2 “RAM organization” on page 22Section 3.3 “Memory Protection Unit (MPU)” on page 23Section 7.1.2 “CTAA and CTAC light sensitivity” on page 39Section 7.2 “CTAA and CTAC mechanical strength” on page 39Section 10.6 “Code ranges and values” on page 76Section 10.7 “Product options” on page 78Chapter 11 “Reference circuitry” on page 79. Added resistor R1 on the schematicsfor all variants.January 2016 3.2Added documentation for the nRF51822 CTAC version of the chip.Added content:Section 4.10.1 “Enable 4 Mbps SPIS bit rate” on page35Section 7.2 “CTAA and CTAC mechanical strength” on page39Section 9.6 “CTAC WLCSP package” on page72Section 11.10 “CTAC WLCSP package” on page124Updated content:Feature list on the front page.Section 2.2.3 “CEAA, CFAC, CTAA, and CTAC WLCSP ball assignment and functions”on page17Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Chapter 6 “Absolute maximum ratings” on page38Section 7.1 “WLCSP light sensitivity” on page39Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41Section 8.1.5 “32.768 kHz crystal oscillator (32k XOSC)” on page43Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page44Section 8.2 “Power management” on page45Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57 Section 10.6 “Code ranges and values” on page76Section 10.7 “Product options” on page78October 2014 3.1Added documentation for the following versions of the chip:nRF51822-QFAC AA0nRF51822-QFAC Ax0nRF51822-CDAB AA0nRF51822-CDAB Ax0nRF51822-CFAC AA0nRF51822-CFAC Ax0(The x in the build codes can be any number between 0 and 9.)Added content:Section 2.2.2 “CDAB WLCSP ball assignment and functions” on page14Section 9.2 “CDAB WLCSP package” on page68Section 9.4 “CFAC WLCSP package” on page70Updated content:Feature list on the front page.Section 2.2.3 “CEAA and CFAC WLCSP ball assignment and functions” on page17 Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Section 8.2 “Power management” on page45Section 8.3 “Block resource requirements” on page49Section 8.12 “Analog to Digital Converter (ADC) specifications” on page61Section 10.6 “Code ranges and values” on page76Section 10.7 “Product options” on page78August 2014 3.0Update to reflect the changes in build code:nRF51822-QFAA Hx0nRF51822-CEAA Ex0nRF51822-QFAB Cx0(The x in the build codes can be any number between 0 and 9.)If you are working with a previous revision of the chip, read version 2.x of the document. Added content:Section 8.5.3 “Radio current consumption with DC/DC enabled” on page51Section 11.1.1 “PCB layout example” on page80Updated content:Feature list on the front page.Section 2.1 “Block diagram” on page11Section 3.2.1 “Code organization” on page22Section 3.2.2 “RAM organization” on page22Section 3.3 “Memory Protection Unit (MPU)” on page23Section 3.4 “Power management (POWER)” on page24Section 3.6 “Clock management (CLOCK)” on page28Section 3.8 “Debugger support” on page31Section 4.2 “Timer/counters (TIMER)” on page33Chapter 5 “Instance table” on page37Chapter 7 “Operating conditions” on page39Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page42Section 8.1.4 “16 MHz RC oscillator (16M RCOSC)” on page43Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page44Section 8.1.7 “32.768 kHz Synthesized oscillator (32k SYNT)” on page44Section 8.2 “Power management” on page45Section 8.3 “Block resource requirements” on page49Section 8.4 “CPU” on page49Section 8.5.6 “Radio timing parameters” on page55Section 8.5.7 “Antenna matching network requirements” on page55Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications”on page56Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57Section 8.12 “Analog to Digital Converter (ADC) specifications” on page61Section 8.13 “Timer (TIMER) specifications” on page62Section 8.15 “Temperature sensor (TEMP)” on page62Section 8.22 “Non-Volatile Memory Controller (NVMC) specifications” on page65Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page66Section 9.2 “CDAB WLCSP package” on page68Section 10.7.2 “Development tools” on page78Chapter 11 “Reference circuitry” on page79October 2013 2.0This version of the document will target the nRF51822 QFAA G0 revision of the chip. If you are working with a previous revision of the chip, read version 1.3 or earlier of thedocument.Updated the following sections:Key Feature list on the front page,Chapter 1 “Introduction” on page10,Section 2.1 “Block diagram” on page11,Section 2.2 “Pin assignments and functions” on page12,Section 3.2 “Memory” on page21,Section 3.5 “Programmable Peripheral Interconnect (PPI)” on page27,Section 3.7 “GPIO” on page31,Section 4.1 “2.4 GHz radio (RADIO)” on page32,Section 4.2 “Timer/counters (TIMER)” on page33,Section 4.3 “Real Time Counter (RTC)” on page33,Section 4.10 “Serial Peripheral Interface (SPI/SPIS)” on page35,Section 4.12 “Universal Asynchronous Receiver/Transmitter (UART)” on page36,Section 4.14 “Analog to Digital Converter (ADC)” on page36,Section 4.15 “GPIO Task Event blocks (GPIOTE)” on page36,Chapter 5 “Instance table” on page37,Chapter 6 “Absolute maximum ratings” on page38,Chapter 8 “Electrical specifications” on page40,Section 8.1 “Clock sources” on page40,Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page41,Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page42,Section 8.2 “Power management” on page45,Section 8.3 “Block resource requirements” on page49,Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications” on page56,Section 8.9 “Serial Peripheral Interface (SPI) Master specifications” on page58,Section 8.11 “GPIO Tasks and Events (GPIOTE) specifications” on page60,Section 8.13 “Timer (TIMER) specifications” on page62,Section 8.16 “Random Number Generator (RNG) specifications” on page63,Section 8.17 “AES Electronic Codebook Mode Encryption (ECB) specifications” on page63, Section 8.18 “AES CCM Mode Encryption (CCM) specifications” on page63,Section 8.19 “Accelerated Address Resolver (AAR) specifications” on page63,Section 8.21 “Quadrature Decoder (QDEC) specifications” on page64,Section 11.1 “PCB guidelines” on page79,Section 11.3 “QFAA QFN48 package” on page82, andSection 11.7 “CEAA WLCSP package” on page106.Added the following sections:Section 3.3 “Memory Protection Unit (MPU)” on page23,Section 4.5 “AES CCM Mode Encryption (CCM)” on page34,Section 4.6 “Accelerated Address Resolver (AAR)” on page34,Section 4.16 “Low Power Comparator (LPCOMP)” on page36,Section 8.5.7 “Antenna matching network requirements” on page55,Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page57,Section 8.18 “AES CCM Mode Encryption (CCM) specifications” on page63,Section 8.19 “Accelerated Address Resolver (AAR) specifications” on page63, and Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page66.May 2013 1.3Updated schematics and BOMs in section 11.3 on page 61.April 2013 1.2Added chip variant nRF51822-CEAA. Updated feature list on front page. UpdatedSection 3.2.1 on page 15, Section 3.2.2 on page 15, Chapter 6 on page 28,Section 10.4 on page 52, and Section 10.5.1 on page 53.AddedSection 2.2.2 on page 10, Section 7.1 on page 29, Section 9.2 on page 50,and Section 11.3 on page 61.Removed PCB layouts in Chapter 11 on page 54.March 2013 1.1Added chip variant nRF51822-QFAB. Added 32 MHz crystal oscillator feature. Updated feature list on front page. Moved subsection ‘Calculating current when the DC/DCconverter is enabled’ from chapter 8 to the nRF51 Series Reference Manual.UpdatedChapter 1 on page 6, Section 2.2 on page 8, Section 3.2 on page 12,Section 3.5 on page 16, Section 3.5.1 on page 17, Section 4.2 on page 21, Chapter 5 onpage 24, Section 8.1 on page 27, Section 8.1.2 on page 28, Section 8.1.5 on page 30,Section 8.2 on page 32, Section 8.3 on page 34, Section 8.5.3 on page 36, Section 8.8 onpage 40, Section 8.9 on page 41, Section 8.10 on page 42, Section 8.14 on page 43,Chapter 10 on page 47, Section 11.2 on page 51, Section 11.3 on page 54, andSection 11.4 on page 57.AddedSection 3.5.4 on page 19, Section 8.1.3 on page 29, andSection 11.1 on page 50.November 2012 1.0Changed from PPS to PS. Updated the feature list on the front page.UpdatedTable 11 on page 25, Table 12 on page 26, Table 14 on page 28,Table 15 on page 28, Table 16 on page 29, Table 17 on page 29,Table 18 on page 30, Table 19 on page 31, Table 21 on page 32,Table 22 on page 32, Table 23 on page 33,Table 27 on page 36,Table 28 on page 37, Table 29 on page 37, Table 31 on page 38,Table 32 on page 38, Table 35 on page 39, Table 38 on page 40,Table 39 on page 40, Table 55 on page 47, Figure 9 on page 48, andTable 57 on page 50.Table of contents1Introduction (10)1.1Required reading (10)1.2Writing conventions (10)2Product overview (11)2.1Block diagram (11)2.2Pin assignments and functions (12)3System blocks (20)3.1CPU (20)3.2Memory (21)3.3Memory Protection Unit (MPU) (23)3.4Power management (POWER) (24)3.5Programmable Peripheral Interconnect (PPI) (27)3.6Clock management (CLOCK) (28)3.7GPIO (31)3.8Debugger support (31)4Peripheral blocks (32)4.1 2.4 GHz radio (RADIO) (32)4.2Timer/counters (TIMER) (33)4.3Real Time Counter (RTC) (33)4.4AES Electronic Codebook Mode Encryption (ECB) (33)4.5AES CCM Mode Encryption (CCM) (34)4.6Accelerated Address Resolver (AAR) (34)4.7Random Number Generator (RNG) (34)4.8Watchdog Timer (WDT) (34)4.9Temperature sensor (TEMP) (35)4.10Serial Peripheral Interface (SPI/SPIS) (35)4.11Two-wire interface (TWI) (35)4.12Universal Asynchronous Receiver/Transmitter (UART) (36)4.13Quadrature Decoder (QDEC) (36)4.14Analog to Digital Converter (ADC) (36)4.15GPIO Task Event blocks (GPIOTE) (36)4.16Low Power Comparator (LPCOMP) (36)5Instance table (37)6Absolute maximum ratings (38)7Operating conditions (39)7.1WLCSP light sensitivity (39)7.2CTAA and CTAC mechanical strength (39)8Electrical specifications (40)8.1Clock sources (40)8.2Power management (45)8.3Block resource requirements (49)8.4CPU (49)8.5Radio transceiver (50)8.6Received Signal Strength Indicator (RSSI) specifications (55)8.7Universal Asynchronous Receiver/Transmitter (UART) specifications (56)8.8Serial Peripheral Interface Slave (SPIS) specifications (57)8.9Serial Peripheral Interface (SPI) Master specifications (58)8.10I2C compatible Two Wire Interface (TWI) specifications (59)8.11GPIO Tasks and Events (GPIOTE) specifications (60)8.12Analog to Digital Converter (ADC) specifications (61)8.13Timer (TIMER) specifications (62)8.14Real Time Counter (RTC) (62)8.15Temperature sensor (TEMP) (62)8.16Random Number Generator (RNG) specifications (63)8.17AES Electronic Codebook Mode Encryption (ECB) specifications (63) 8.18AES CCM Mode Encryption (CCM) specifications (63)8.19Accelerated Address Resolver (AAR) specifications (63)8.20Watchdog Timer (WDT) specifications (64)8.21Quadrature Decoder (QDEC) specifications (64)8.22Non-Volatile Memory Controller (NVMC) specifications (65)8.23General Purpose I/O (GPIO) specifications (66)8.24Low Power Comparator (LPCOMP) specifications (66)9Mechanical specifications (67)9.1QFN48 package (67)9.2CDAB WLCSP package (68)9.3CEAA WLCSP package (69)9.4CFAC WLCSP package (70)9.5CTAA WLCSP package (71)9.6CTAC WLCSP package (72)10Ordering information (73)10.1Chip marking (73)10.2Inner box label (73)10.3Outer box label (74)10.4Order code (74)10.5Abbreviations (75)10.6Code ranges and values (76)10.7Product options (78)11Reference circuitry (79)11.1PCB guidelines (79)11.2Reference design schematics (81)11.3QFAA QFN48 package (82)11.4QFAB QFN48 package (88)11.5QFAC QFN48 package (94)11.6CDAB WLCSP package (100)11.7CEAA WLCSP package (106)11.8CFAC WLCSP package (112)11.9CTAA WLCSP package (118)11.10CTAC WLCSP package (124)12Glossary (130)万联芯城专注电⼦元器件配单服务，只售原装现货库存，万联芯城电⼦元器件全国供应，专为终端⽣产，研发企业提供现货物料，价格优势明显，BOM配单整单采购可享优惠价，提交BOM表报价，最快可当天发货，电⼦元器件现货销售，满⾜客户物料需求，万联芯城凭借丰富的电⼦元器件供应链体系已在业内打下良好的品牌⼝碑，完整PDF资料点击进⼊万联芯城。