Improving the thermal stability of one-component
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增材制造镍基高温合金裂纹形成机理及控制方法1.增材制造过程中,镍基高温合金易于出现裂纹。
During additive manufacturing, nickel-based high-temperature alloys are prone to cracking.2.裂纹对零件的性能和可靠性会产生严重影响。
Cracks can severely affect the performance andreliability of the parts.3.裂纹主要形成于快速冷却过程中。
Cracks mainly form during rapid cooling.4.在增材制造过程中,要尽量避免快速冷却。
In additive manufacturing, it is important to avoid rapid cooling as much as possible.5.控制加热和冷却速度可以有效降低裂纹的发生率。
Controlling the heating and cooling rates can effectively reduce the occurrence of cracks.6.合适的预热可以减少材料的残余应力。
Proper preheating can reduce the residual stress in the material.7.合理的工艺参数设置对于裂纹的控制至关重要。
Proper process parameter setting is crucial for controlling cracks.8.对材料的选择也会影响裂纹的形成。
Material selection also affects the formation of cracks.9.使用精细的粉末和合适的喷嘴可以减少裂纹的产生。
Using fine powder and suitable nozzles can reduce the formation of cracks.10.合适的气氛保护可以有效预防氧化带来的损坏。
耐火材料中萤石加入量问题,并提供相关解释和实例。
耐火材料是指具有抗高温和耐磨损性能的材料,常用于高温工业设备和建筑物的部件。
而萤石是常见的耐火材料中的一种重要成分。
本文将详细探讨耐火材料中萤石的加入量对其性能的影响,并提供相关解释和实例。
首先,我们需要了解萤石的特性及其在耐火材料中的作用。
萤石,也被称为氟化钙,化学式为CaF2。
它具有很高的耐高温性能和化学稳定性,能够在高温环境下保持其结构稳定性。
此外,萤石还具有一定的导热性和导电性,并可降低耐火材料的脆性。
由于这些特性,萤石常被用作耐火材料的添加剂,以提升材料的综合性能。
然而,萤石的加入量并非越多越好,需要根据具体的应用和要求来确定。
通常,耐火材料中萤石的加入量在5到30之间。
以下是一些常见情况下的萤石加入量及其影响。
首先,考虑到防火材料的耐热性能,当需要增强耐火材料的耐高温性能时,可以适量增加萤石的加入量。
由于萤石具有高熔点和化学稳定性,其加入可以提升耐火材料的热稳定性和耐高温性能。
例如,对于用于高温炉窑内的耐火砖制造,适量加入萤石可以增强其耐火砖的耐高温性能,延长其使用寿命。
其次,考虑到耐火材料的热传导性能,当需要提高材料的导热性能时,适量加入萤石也是必要的。
萤石具有良好的导热性能,其热传导系数约为5.09 W/(m·K),高于大多数耐火材料的导热系数。
因此,在某些应用中,如炉膛壁和加热元件等需要良好的传热性能的部件,适量加入萤石可以提高耐火材料的热传导性能,促进热能的传递和利用。
此外,萤石的导电性能也可能影响耐火材料的应用性能。
当需要在高温环境下传导电流时,可适当增加萤石的含量。
比如,在电炉内部用于导电电极等部件,适量加入萤石可以增加耐火材料的导电性能,确保电能的传导和使用。
然而,过量的萤石加入量可能导致材料性能下降。
一方面,萤石的导热性能虽然好,但其热膨胀系数较大。
过量加入萤石可能导致材料的热膨胀系数增加,从而导致材料在高温情况下容易产生热应力和破裂。
高温稳定性英文High Temperature Stability in MaterialsIntroduction:High temperature stability is a crucial characteristic for various materials used in numerous industries. The ability of a material to retain its strength, shape, and structure while exposed to elevated temperatures ensures the reliability and efficiency of many applications. In this document, we will explore the concept of high temperature stability, discuss its importance, and examine various materials that exhibit excellent resistance to heat.Importance of High Temperature Stability:High temperature stability plays a vital role in the functioning and longevity of materials used in several key industries, including aerospace, automotive, power generation, and electronics. In the aerospace industry, for instance, high temperature stability is crucial for engine components. These components must withstand extreme temperatures generated during combustion while maintaining their structural integrity, ensuring overall safety and performance. Similarly, in power generation, materials with high temperature stability are necessary to withstand the high operating temperatures in gas turbines and power plants.Metals:Metals are commonly used materials due to their excellent high temperature stability. Many alloys, such asnickel-based superalloys, exhibit outstanding resistance to heat. These alloys are used in gas turbines, where they can withstand temperatures over 1000°C while retaining their mechanical strength. Additionally, refractory metals like tungsten and molybdenum are known for their exceptional high temperature stability. They are utilized in applications where extreme heat resistance is required, such as furnace components, rocket nozzles, and electrical contacts.Ceramics:Ceramic materials are widely known for their high temperature stability. They are composed of non-metallic compounds and have crystalline structures, which contribute to their excellent thermal stability. Silicon carbide (SiC) is one of the most widely-used ceramics in high temperature applications. Its combination of high strength, stiffness, and low thermal expansion make it suitable for use in furnace linings, heat exchangers, and automotive components. Other ceramics like aluminum oxide (Al2O3) and zirconia (ZrO2) also possess high temperature stability and find applications in the aerospace and electronics industries.Composites:Composite materials, which consist of two or more different materials combined together, offer an opportunity to enhance high temperature stability. Fiber-reinforced composites, such as carbon fiber-reinforced polymers (CFRP), provide a high strength-to-weight ratio and exhibit excellent resistance to heat. CFPR composites are used extensively in aerospace and automotive industries, where they findapplications in aircraft fuselages, engine nacelles, andhigh-performance sports vehicles.Polymers:Although polymers generally have lower heat resistance compared to metals and ceramics, some polymers have been specifically designed to exhibit high temperature stability. Polyimides, for example, are known for their excellent thermal stability and are used in the aerospace industry for insulation, electrical wiring, and engine components. Polyether ether ketone (PEEK) is another high-performance polymer with excellent strength and resistance to heat, making it ideal for applications in the oil and gas industry, aerospace, and medical devices.Future Developments:Advancements in materials science and engineering continue to push the boundaries of high temperature stability. Ongoing research focuses on improving existing materials and developing new ones with enhanced heat resistance properties. Nanotechnology is being applied to enhance the performance of materials at high temperatures by creating nanostructured materials with unique properties. Additionally, the development of advanced coatings and surface treatments aims to enhance high temperature stability in a wide range of materials, extending their lifespan and performance in extreme environments.Conclusion:High temperature stability is a crucial property for materials utilized in various industries. Metals, ceramics, composites, and polymers with excellent resistance to heatenable the reliability and efficiency of many applications. Ongoing research and advancements in materials science will further expand the range and capabilities of high temperature stable materials, facilitating innovation and progress in a wide array of industries.。
超高分子量聚乙烯英文Ultrahigh Molecular Weight PolyethyleneUltrahigh Molecular Weight Polyethylene (UHMWPE) is a remarkable polymer that has gained significant attention in various industries due to its exceptional properties. This unique material is characterized by its exceptionally long polymer chains, resulting in a molecular weight that is significantly higher than that of conventional polyethylene. This distinguishing feature bestows UHMWPE with a remarkable combination of physical and mechanical properties that make it a highly versatile and sought-after material.One of the most notable characteristics of UHMWPE is its exceptional wear resistance. The long polymer chains in UHMWPE create a highly ordered and tightly packed molecular structure, which provides superior resistance to abrasion and impact. This makes UHMWPE an ideal material for applications where wear and tear are a significant concern, such as in the production of bearings, gears, and other mechanical components.In addition to its exceptional wear resistance, UHMWPE also exhibits excellent toughness and impact resistance. The long polymer chainsin UHMWPE are able to absorb and dissipate energy efficiently, which helps to prevent the material from cracking or breaking under stress. This property makes UHMWPE a popular choice for applications where impact resistance is crucial, such as in the production of protective equipment, sports gear, and medical implants.Another key advantage of UHMWPE is its chemical resistance. The material is highly resistant to a wide range of chemicals, including acids, bases, and solvents. This makes UHMWPE an ideal choice for applications where exposure to harsh chemicals is a concern, such as in the production of chemical processing equipment and storage tanks.In addition to its physical and mechanical properties, UHMWPE also exhibits excellent thermal stability. The material can withstand high temperatures without degrading, making it suitable for use in applications where exposure to heat is a concern, such as in the production of industrial machinery and equipment.One of the most significant applications of UHMWPE is in the medical field. The material's exceptional biocompatibility, low friction, and wear resistance make it an ideal choice for the production of medical implants, such as artificial joints and bone replacement components. UHMWPE is also used in the production of medicalequipment, such as surgical instruments and prosthetic limbs.In the industrial sector, UHMWPE is widely used in the production of a wide range of products, including conveyor belts, chute liners, and wear-resistant components for machinery. The material's low coefficient of friction and excellent abrasion resistance make it an ideal choice for these applications, where minimizing wear and tear is crucial.Another important application of UHMWPE is in the production of sports and recreational equipment. The material's high impact resistance and low weight make it a popular choice for the production of items such as skis, snowboards, and protective gear for various sports.Despite its many advantages, UHMWPE is not without its challenges. The material's high molecular weight and complex molecular structure can make it difficult to process and manufacture. Additionally, the cost of UHMWPE can be higher than that of other polymer materials, which can limit its use in certain applications.Despite these challenges, the demand for UHMWPE continues to grow, driven by the material's exceptional properties and its wide range of applications. As research and development in the field of polymer science continue to advance, it is likely that new andinnovative applications for UHMWPE will emerge, further solidifying its position as a critical material in a wide range of industries.In conclusion, Ultrahigh Molecular Weight Polyethylene is a remarkable polymer that has captured the attention of scientists, engineers, and industry professionals around the world. Its unique combination of physical, mechanical, and chemical properties make it an invaluable material in a wide range of applications, from medical implants to industrial equipment. As the demand for UHMWPE continues to grow, it is clear that this material will play an increasingly important role in shaping the future of technology and innovation.。
高熵合金的结构调控及储能研究1.高熵合金是一种由五种或更多组元组成的合金材料。
High-entropy alloy is an alloy material composed of five or more elements.2.高熵合金具有优异的力学性能和耐高温性能。
High-entropy alloys have excellent mechanical properties and high temperature resistance.3.结构调控是改善高熵合金性能的关键。
Structural control is the key to improving the performance of high-entropy alloys.4.通过合金元素的选择和比例调控,可以实现高熵合金的微观结构调控。
By controlling the selection and proportion of alloy elements, the microstructure of high-entropy alloys can be controlled.5.增强高熵合金的微观结构均匀性可以提高其力学性能。
Enhancing the microstructure homogeneity of high-entropy alloys can improve their mechanical properties.6.调控高熵合金的晶格缺陷可以提高其热稳定性。
Controlling the lattice defects of high-entropy alloys can improve their thermal stability.7.高熵合金可以作为储能材料,用于制备高性能的储能器件。
High-entropy alloys can be used as energy storage materials to prepare high-performance energy storage devices.8.通过合金化和微观结构调控,可以实现高熵合金的储能性能优化。
树脂基复合材料的多尺度结构调控1.树脂基复合材料的多尺度结构调控对材料性能具有重要影响。
The multiscaling structure regulation of resin-based composite materials has significant influence on material properties.2.通过调控纳米级尺度结构可以改善复合材料的力学性能。
Regulating the nanoscale structure can improve the mechanical properties of composite materials.3.优化微观结构可以提高树脂基复合材料的耐热性能。
Optimizing the microstructure can enhance the thermal resistance of resin-based composite materials.4.多尺度结构调控需要综合考虑材料的力学、热学和电学性能。
Multiscaling structure regulation requires comprehensive consideration of the mechanical, thermal, and electrical properties of the materials.5.纳米级结构的调控可以提高材料的强度和韧性。
Regulating the nanoscale structure can improve the strength and toughness of the materials.6.微观结构对树脂基复合材料的导电性能有显著影响。
The microstructure has a significant influence on the electrical conductivity of resin-based composite materials.7.调控介观结构有助于改善复合材料的耐磨性能。
应用化工Appeoed ChemocaeIndustey第50卷第5期2021年5月Vol. 50 No. 5May2021环氧化天然胶乳/天然胶乳并用提高探空气球胶膜气密性的研究赵立广V ,郭平3,宋亚忠V ,丁丽V,李建伟V ,桂红星(1-中国热带农业科学院橡胶研究所,海南海口 5711992海南省天然橡胶栽培与加工工程研究中心,海南海口 571199;3-中国化工株洲橡胶研究设计院有限公司,湖南株洲412000)摘要:为了提高探空气球的气密性,采用25%,40%和50% 3种不同环氧化程度的环氧化天然胶料(ENRL )与天 然胶料(NRL )并用制备硫化胶膜,研究了 ENRL 环氧化程度和用量对硫化胶膜气密性、物理力学性能以及并用胶 乳的黏度、稳定性的影响。
结果表明,并用胶乳硫化胶膜的气密性会随着ENRL 环氧化程度和用量的提高而提高, 相应的气球体积保持率也会大大提高;此外,并用胶乳热稳定性良好,但ENRL 用量和环氧化程度较高时机械稳定性较差,黏度值也较高;ENRL 用量较低时,能在一定程度上提高硫化胶膜的拉伸强度、撕裂强度和定伸应力;ENRL 用量较高时会明显降低胶膜硬度,断裂伸长率也会有所提高。
关键词:环氧化天然胶乳;气密性;稳定性;探空气球;体积保持率中图分类号:TQ331.2 文献标识码:A 文章编号:1671 -3206(2021)05 -1267 -05Sthdy on improving the air tightness of sounding balloonfilm by nathral rpbbee latex and uss eroxinized natsrairpbbee latex simultaneouslyZHAO Li-guang 1,2 , GUO Ping 3 ,SONG Ya-zhoog 1,2 ,DING L- - , LI Jian-gei 1 - , GUI Hong-xing 1,2( 1.RubbeeReseaech InstotuteChoneseAcademyooTeopocaeAgeocuetueaeScoencesHaokou 571199%Chona ; 2.Haonan NatueaeRubbeeCuetoeatoon and Peoce s ongEngoneeeongReseaech CenteeHaokou 571199%Chona ;3. S onochem Zhuehou RubbeeReseaech and Desogn InstotuteCo.Ltd.Zhuehou 412000%Chona )Abstract : In order to improve the air tightnes s of the sounding bll , NRL and ENRL with dOferent epoxi dation deareas (25% ,40% and 50% ) were mixed to prepare vulcanized film , and the OW c -s of epoxida- toon degeeesand dosageooENRLon aoetoghtne s physocaeand mechanocaepeopeetoesootheeuecanoeedooem %aswe e aseoscosotyand staboeotyootheeateiweeestudoed.Theeesuetsshowed thattheaoetoghtne s ootheeuecanoeed eateiooem wo e onceeasewoth theonceeaseooENRLepoiodatoon degeeeand dosageand the co e spondongba e oon eoeumeeetentoon eatewasgeeateyonceeased aeso.In addotoon %thetheemaestaboeotyootheeateiosgood %butthemechanocaestaboeotyospooeand theeoscosotyoshogh when theENRLdosageand epoiodatoon degeeeaeehogh.When thedosageooENRLoseoweethetensoeesteength % t eaesteength andconstanteeongatoon stee s ooeuecanoeed ooem can beompeoeed toaceetaon eitent.When thedosageooEN- RLoshogheethehaedne s ootheooem osobeoouseyeeduced and theeeongatoon atbeeak osaesoompeoeed.Key words : epoiodatoon natueaeeatei ; aoetoghtne s ; staboeoty ; weatheeba e oon ; eetentoon eateooeoeume探空气球为携带探空设备探测高空气象要素的 自由气球[1],对气象学和气候监测具有重要作用⑵。
Characteristics and surface energy of silicon-doped diamond-like carbon films fabricated by plasma immersion ion implantation and depositionG.J.Wan a,b ,P.Yang b ,Ricky K.Y .Fu a ,Y .F.Mei a ,T.Qiu a,c ,S.C.H.Kwok a ,Joan P.Y .Ho a ,N.Huang b ,X.L.Wu a,c ,Paul K.Chu a,*aDepartment of Physics and Materials Science,City University of Hong Kong,Tat Chee Avenue,Kowloon,Hong Kong,ChinabCollege of Materials Science and Engineering,Southwest Jiaotong University,Chengdu 610031,ChinacDepartment of Physics,Nanjing University,Nanjing 210093,ChinaReceived 16June 2005;received in revised form 28July 2005;accepted 29September 2005Available online 21November 2005AbstractDiamond-like carbon (DLC)films doped with different silicon contents up to 11.48at.%were fabricated by plasma immersion ion implantation and deposition (PIII-D)using a silicon cathodic arc plasma source.The surface chemical compositions and bonding configurations were determined by X-ray photoelectron spectroscopy (XPS)and Raman spectroscopy.The results reveal that the sp 3configuration including Si–C bonds increases with higher silicon content,and oxygen incorporates more readily into the silicon and carbon interlinks on the surface of the more heavily silicon-doped DLC films.Contact angle measurements and calculations show that the Si-DLC films with higher silicon contents tend to be more hydrophilic and possess higher surface energy.The surface states obtained by silicon alloying and oxygen incorporation indicate increased silicon oxycarbide bonding states and sp 3bonding states on the surface,and it can be accounted for by the increased surface energy particularly the polar contribution.D 2005Elsevier B.V .All rights reserved.P ACS:81.05.Uw;68.35.Md;52.77.Dq;M 81.70.Àq;68.03.CdKeywords:Si-doped DLC;Surface energy;Plasma immersion ion implantation and deposition;Contact angle1.IntroductionDiamond-like carbon (DLC)films have favorable proper-ties from the scientific and engineering points of view,but there are challenges in industrial applications due to the high residual compressive stress,poor adhesion to the substrate,poor thermal stability,and hydrophobic surface properties [1].Alloying DLC films with Si has been reported to address some of the problems,for instance,improving the thermal stability,reducing internal stress,and enhancing wear and corrosion resistance as well as other mechanical properties [2,3].However,the effects of silicon on the DLC properties largely depend on the fabrication conditions and have not been clearly established.For example,silicon-doped DLC (Si-DLC)films produced by plasma-enhanced chemicalvapor deposition (PECVD)are likely saturated with hydrogen yielding some unsatisfying results in some applications as the Si–H bonds in the silicon containing precursor may not be broken down completely [2,4].There have been few reports about Si-DLC films fabricated by elemental doping methods such as cathodic arc deposition,but in general,promising results have been obtained compared to those achieved by PECVD,particularly pertaining to the mechanical properties and thermal stability [3,5,6].In this work,we employed plasma immersion ion implantation and deposition (PIII&D)in concert with a cathodic arc plasma source to produce Si-DLC films.The technique offers a number of advantages such as pure silicon plasma,high ionization efficiency,easy control of the implantation/deposition parameters by adjust-ing the bias voltages,and non-line-of-sight operation,making it an effective alternative for treating components possessing complex shapes [7].Our literature search has not identified previous work on the fabrication of Si-DLC films employing this hybrid method.In many applications,the surface0925-9635/$-see front matter D 2005Elsevier B.V .All rights reserved.doi:10.1016/j.diamond.2005.09.042*Corresponding author.Tel.:+852********;fax:+852********/+852********.E-mail address:paul.chu@.hk (P.K.Chu).Diamond &Related Materials 15(2006)1276–1281/locate/diamondproperties,particularly the surface free energy and surface tension,are very important.They affect important surface properties such as hydrophilicity,adhesion to the substrate, and adsorption behavior in many circumstances.In this paper,we report the characterization as well as surface energy investigation of the Si-DLC films produced by this hybrid technique.2.Experimental detailsFilm deposition was conducted in our plasma immersion ion implantation and deposition(PIII&D)equipment that has been described in detail elsewhere[7–9].P-type silicon (100)wafers were used as the substrate.The silicon plasma was generated by a cathodic arc plasma source composed of a pure silicon cathode.The triggering voltage was¨3kV and the main arc current was maintained at around120A. The arc duration time was about250A s and the repetition frequency was60Hz.The emitted silicon plasma drifted through a90-curved magnetic duct to eliminate deleterious macro-particles and was subsequently attracted to the silicon substrate biased at aÀ100V DC(direct current).At the same time,acetylene gas was bled into the PIII&D chamber as the carbon precursor.The streaming silicon plasma collided with the C2H2molecules causing partial ionization, and the films were deposited by reaction of ionized silicon with ionized acetylene and some unionized molecules. Different C2H2gas flows were used to control the silicon doping content and the instrumental conditions are summa-rized in Table1.Raman spectra were acquired on a Renishaw RM3000micro-Raman system with a laser source wavelength of514nm and the spectra were collected by scanning from800to2200cmÀ1.X-ray photoelectron spectroscopy(XPS)was performed using a PHI 5600equipped with a monochromatic Al K a X-ray source(1486.6 eV)to determine the surface composition and chemical states.The surface free energy was determined by a contact angle test using the sessile drop method on the JY-82contact angle goniometer at ambient humidity and temperature.Doubly distilled water and five additional test liquids,glycerin, formamide,diiodomethane,glycol,and tritolyl phosphate, were used to determine the hydrophilicity as well as surface energy of the samples.In each test,six measurements were conducted on each sample taken from five different fields on the deposited wafer to obtain good statistics.The surface energy of the films was calculated using the Zimans and Good method[10]by combining the Young equation and the Van Oss equation of the work of adhesion[11,12]:W a¼2c p l c p sÀÁ1=2þ2c d l c d sÀÁ1=2¼c l1þcos hðÞ;ð1Þwhere W a is work of adhesion,h is the contact angle,c l,c l d and c l p are the surface tension and its dispersive and polar components of the liquid phases,respectively,and c s d and c s p are the dispersive and polar components of the solid phases, respectively.Eq.(1)can be further simplified as:c l1þcos hðÞ2c dlÀÁ1=2¼c d sÀÁ1=2þc p sÀÁ1=2c p lcl1=2ð2ÞBy using the archival relative surface tension component values of the test liquids shown in Table2[10–12]and solving Eq.(2)with the contact angles measured from more than two test liquid/solid interfaces,we can obtain c s d and c s p.The surface tension is defined to be the sum of the dispersive c s d and polar c s p contributions.In our experiments,six test liquid/solid interfaces were chosen to obtain good statistics.3.Results and discussionRaman spectroscopy is a common and powerful tool to study the structural properties of DLC due to the high scattering efficiency of the carbon-to-carbon bonding states.Fig.1shows the Raman spectra acquired between800and2200cmÀ1from the Si-DLC films.All the spectra reveal a typical DLC structure characterized by one band composed of the main G(graphite) peaks and D(disordered)shoulder.This is in contrast toTable1PECVD instrumental parametersSample number F C2H2(sccm)Pressure(Torr)Bias voltage(V)Silicon arc sourceTriggervoltageMain arccurrent#120 4.0Â10À4À100(DC)3kV120A (250A s,60Hz)#215 3.2Â10À4 #310 1.8Â10À4 #45 1.0Â10À4Table2Surface tension parameters of the test liquids at20-CLiquid c LV c p LV c d LVDouble distilled water72.851.021.8Glycol48.319.029.3Diiodomethane50.8 2.348.5Formamide58.218.739.5Tritolyl phosphate40.9 1.739.2Glycerin63.426.437.0Intensity/a.u.Wavenumber / cm-1Fig.1.Raman spectra of Si-DLC films produced by PIII&D.G.J.Wan et al./Diamond&Related Materials15(2006)1276–12811277graphite that typically shows two separate peaks at¨1550and ¨1350cmÀ1[13].The Raman line shape changes to being less asymmetrical corresponding to the changes in the diamond-like structure with higher silicon content at decreased C2H2partial pressure.All the main peaks show obvious low frequency shift compared to graphite,and a slight shift to a lower frequency for the G peaks can be observed.This is consistent with the increase in the diamond-like structure.On the other hand,the shift of the G band may be partially related to the de-straining action of silicon,and the shift of the D band arises from increased disorder due to increases in the averaged bond lengths[14].Detailed deconvolution of the Raman spectra intothe two peaks is useful to discern the DLC structure,for example,the sp3to sp2ratio,graphite cluster size,and extent of disorder[13].Table3lists the fitted results of the Raman spectra of the Si-DLC films.The ratio of the Raman signal I D/ I G is one important empirical factor to evaluate the carbon–carbon bonding states in the DLC film,and a smaller I D/I G value is commonly correlated with an increased sp3to sp2ratio [13,15].We observe the decreased I D/I G trend with silicon doping increasing from samples#1to#2and#4and a small deviation in sample#3showing slightly higher I D/I G ratio than sample#2.Nonetheless,it should be noted that the aforementioned relationship between the D and G bands in the Raman spectra is established for pure DLC films and not Si-DLC films,which should be more complicated.For instance, the Raman peak at approximately1450cmÀ1associated with Si–C bonds can also affect the intensity and position of the G peak,albeit at a lower scattering efficiency[2],but on the other hand,the conspicuous second-order peak of the Si substrate at approximately960cmÀ1,of which the intensity is proportional to the optical transparency of the film,produces errors in the deconvolution by affecting the background of the D peaks[3]. This may be the reason why some of the specific fitting parameters appear to be scattered.From this point of view,XPS may offer a more reliable analysis in this case because it provides more accurate information on the surface structures and bonding states of the films.In fact,it has been shown to disclose the structure of DLC and Si-DLC films more effectively[14,16,17].The surface compositions of the Si-DLC films derived from the C1s,Si2p,and O1s photoelectron core level XPS spectra are listed in Table4.Our results indicate that the Si dose is indeed increased by reducing the mass flow,that is,partial pressure of C2H2.It can also be observed that the oxygen content is negligibly low in the silicon doped film with the smallest silicon concentration,which is related to the small oxygen concentration in most DLC films,and that oxygen incorporation increases with higher silicon doping.The C1s spectrum is most useful in identifying the chemical states of the Si-DLC films.The surface chemical states of carbon in the Si-DLC films include mainly C_C(sp2),C–C(sp3),Si–C(sp3), and C_O.As shown in Fig.2,peak deconvolution is conducted by fixing the energies of the four bonding states at 283.3T0.1,284.2T0.1,285.1T0.1and286.5T0.1eV,respec-tively[14–18].The sp3fraction and two different sp3to sp2 ratios calculated by sp3([Si–C]+[C–C])/sp2([C_C])for the Si-DLC film,and sp3([C–C])/sp2([C_C])for amorphous carbon reveal detailed bonding state changes in the films,as shown in Table4.The results are plotted in Fig.3as a function of the C2H2flow conditions.We can see that the sp3to sp2ratio of the former increases from samples#1to#4monotonically, and the latter increases from sample#1to#2first and then decreases slightly with silicon doping increasing.It can be concluded that silicon is likely incorporated in the film by replacing carbon atoms to form sp3bonds.At low silicon doping level,the sp3fraction for interlinks of DLC increases, as there are more induced disordered states of carbon–carbon bonds(including sp3)by Si alloying.In contrast,at a high silicon doping concentration,Si incorporation can reduce the sp3fraction of interlinks of DLC by replacing carbon in the sp3 matrix,while the overall sp3fraction including[Si–C]and[C–C]in the films increases,as shown in Table4and Fig.3.The configurations of silicon and carbon on the surface are likely more complicated due to the oxygen incorporating effects.To reveal more details,the Si2p and O1s XPS spectra were recorded.As shown in Fig.4,the Si2p peaks of the Si-DLC films prepared under high C2H2partial pressure with the smallest amount of silicon are relatively symmetric and centered around100.5eV due to Si–C bonding only[18,19].The results indicate that no oxidation has occurred and very little oxygen is present on the surface.With increasing silicon concentration, the Si2p peaks of samples(#2,#3,#4increasingly)are more asymmetrical exhibiting a higher-shift shoulder that can be ascribed to silicon oxycarbide(SiO x C y:SiOC3,SiO2C2SiO3C) bonding states[19,20].It shows that some of the silicon atoms (or silicon carbide)on the surface combine readily with oxygen by the natural oxidation process.This can be further confirmed by the marked oxygen composition changes with higher silicon concentration.As shown in the O1s spectra in Fig.4,oxygen forms both C_O(531.2T0.2eV)and SiO x C y(532.3T0.2eV) bonds and the latter becomes more noticeable at higher silicon concentration[20].It should also be noted that oxidation willTable3The fitting results of Raman spectra of Si-DLC films prepared by PIII&DSample no.D-peak(cmÀ1)G-peak(cmÀ1)FWHM(D)FWHM(G)I D/I G#11289.51500.6200.00187.470.452 #21275.21487.6199.17193.550.393 #31291.71495.8198.35187.200.410 #41258.21478.3162.38204.900.284Table4Compositions of the Si-DLC films obtained by XPS,sp3to sp2ratio and sp3 fraction calculated by deconvoluting of C1s spectra of the prepared films Samples Si(at.%)O(at.%)C(at.%)sp3([Si–C]+[C–C])/sp2([C_C])sp3([C–C])/sp2([C_C])sp3fraction a#1 2.89 1.495.710.2890.2380.218 #27.76 3.0589.190.4400.2610.294 #310.01 5.1184.880.5580.2500.338 #411.48 5.2983.230.6070.2490.357a sp3fraction represents(sp3[Si–C]+sp3[C–C])/(sp2[C_C]+ sp2[C_O]+sp3[Si–C]+sp3[C–C]).G.J.Wan et al./Diamond&Related Materials15(2006)1276–1281 1278not affect the aforementioned conclusions on the sp 3fraction,as silicon is known to form only the sp 3bonding state even as silicon oxycarbide species.The surface energy results reveal important thermodynamic properties of the films.In general,the higher the surface energy of the solid substrate relative to the surface tension of the liquids,the better is the hydrophilicity and the smaller is the contact angle as well as the better the adhesion to the substrate.Surface energy arises from the imbalance of the force between atoms ormolecules at the interface.Several types of van der Waals interactions contribute to the surface energy that is dictated by two factors,dispersive c d and polar c p [10].Fig.5shows the contact angles with water,surface energy,ratio of c p /c d and Si doping concentrations in the Si-DLC films as a function of the flow of C 2H 2and deposition conditions.The water contact angles decrease and the surface tension increases monotonically with higher silicon concentrations indicating that our Si-DLCa cbdBinding energy (eV)288.0 288.0 284.0284.0 Binding energy (eV)Binding energy (eV)288.0 288.0 284.0284.0 Binding energy (eV)Fig.2.Deconvoluted C1s core level photoelectron spectra of Si-DLC films produced by PIII&D:(a)sample #1,(b)sample #2,(c)sample #3,and (d)sample #4.24681012S i c o n t e n t / a t . %s p 2 / s p 2 r a t i oF C2H2Fig.3.sp 3/sp 2ratio,silicon concentrations calculated by XPS of Si-DLC films and the relationship with C 2H 2flow conditions.I n t e n s i t y / a .u .Binding Energy / eVC=OFig.4.XPS Si2p and O1s core level spectra of Si-DLC films prepared by PIII&D.G.J.Wan et al./Diamond &Related Materials 15(2006)1276–12811279films with higher silicon concentration tend to be more hydrophilic.With regard to the surface energy,the two components vary and contribute differently.There is no obvious change in the dispersive components with higher silicon doping concentration,as the doses are relatively low without changing substantially the main interlinks of the carbon atoms as well as density of the films.The dispersive contribution is built up from a single interaction,which is generated by the movement of electrons around an atom or molecule depending largely on the kind and density of the materials.This effect should be insignificant in Si–C bonds compared to other bonding states because silicon and carbon are isoelectronic.The polar components increase obviously with higher silicon concentra-tions as shown in Fig.5.Thus,the increased surface tension mainly arises from the higher polar contribution.The polar component is built up from different forces/interactions,like hydrogen bonds,covalent bonds and dipole–dipole interactions.The difference in the polar contribution to the total surface energy plays a critical role in determining the hydrophilicity for a polar liquid like water [10,21].The increased polar contribution of the Si-DLC with increased Si contents is accordingly related to the surface bonding states obtained by silicon alloying and oxygen incorporation.It should be noted that the Si-doped amorphous carbon materials reported in the literature appear to exhibit contra-dicting surface energy trends with increased silicon doping content,but it is well established that the surface properties depend critically on the preparation methods.To our knowl-edge [22,23],Si-DLC films produced by PECVD show decreased surface energy and are more hydrophobic with higher silicon concentrations.This is mainly ascribed to the substantially decreased dispersive component arising from excessive hydrogen bonding with silicon to form Si–H as well as increased defects such as vacancies that reduce the film density and change the electron distribution largely compared to silicon replacing carbon.Si-DLC films fabricated by a pure silicon doping method like cathodic arc or sputtering show consistent results and produce relatively high polar componentscompared to other DLC films or some metals (Ni,Ti,Al)doped DLC [24].P.Zhang et al.conclude that the adsorption of oxygen on the surface plays an important role on the polar component of the metal doped DLC (a-C:Me)films including Si-DLC,and Si–O bonds contribute to the high polar component of a-C:Si films [24].Similar results are observed in our case.The increased polar component of our prepared samples can be accounted for mainly by the surface states characterized by silicon oxycarbide bonding states.They are more polar than the silicon to carbon and carbon to carbon bonding states.The increased sp 3configuration interlinks may contribute partly to it.More probably,some silicon atoms at the surface can readily form chemical bonds with oxygen without the hydrogen passivating effects as revealed in cases by PECVD.4.ConclusionSilicon-doped DLC films were produced by plasma immersion ion implantation and deposition (PIII&D)and cathodic arc plasma deposition.We observe increased sp 3fraction configurations as well as more oxidation taking place on the Si-DLC films with higher silicon contents.The samples exhibit increased surface energy and become more hydrophilic with increased silicon doping content due to surface states obtained by silicon alloying as well as oxygen incorporation.This trend is dissimilar to that observed from films deposited using conventional PECVD.Our results address potentially the drawbacks of PECVD DLC in many applications.The increased surface energy of films prepared by this novel method should be beneficial to film adhesion particularly for DLC coatings in microelectronic and some biological applica-tions.For instance,the more hydrophilic surface may enable the DLC film to produce a more effective anti-bacterial coating with F conditioning _bio-films in vivo [25,26],and potentially better anti-thrombosis properties in blood contacting applica-tions by reducing fibrinogen interactions with the film surface [22,27].AcknowledgementsWe would like to thank Dr.Wilson K.W.Wong of City University of Hong Kong for assistance in the XPS analysis.This work was financially supported by Hong Kong Research Grants Council (RGC)Competitive Earmarked Research Grant (CERG)#CityU 1120/04E,Hong Kong RGC and NSFC Joint Scheme N _CityU101/03,as well as NSFC No.30370407of China.References[1]J.Robertson,Prog.Solid State Chem.21(1991)199.[2]A.L.Baia Neto,R.A.Santos,F.L.Freire Jr.,S.S.Camargo Jr.,R.Carius,F.Finger,W.Beyer,Thin Solid Films 293(1997)206.[3]C.S.Lee,K.R.Lee,K.Y .Eun,K.H.Yoon,J.H.Han,Diamond Relat.Mater.11(2002)198.[4]P.Papakonstantinou,J.F.Zhao,P.Lemoine, E.T.McAdams,J.A.McLaughlin,Diamond Relat.Mater.11(2002)1074.S u r f a c e e n e r g y / m N .m -1F C2H2C o n t a c t a n g l e /D e g r e eγp / γdS i c o n t e n t / a t .%Fig. 5.Water contact angles,surface energy,c p /c d ratio and Si doping concentrations of the Si-DLC films and the relationship with flow rate of C 2H 2.G.J.Wan et al./Diamond &Related Materials 15(2006)1276–12811280[5]J.R.Shi,X.Shi,Z.Sun,E.Liu,H.S.Yang,L.K.Cheah,X.Z.Jin,J.Phys.,Condens.Matter11(1999)5111.[6]W.J.Wu,M.H.Hon,Surf.Coat.Technol.111(1999)134.[7]P.K.Chu,S.Qin,C.Chan,N.W.Cheung,rson,Mater.Sci.Eng.,RRep.17(1996)207.[8]P.K.Chu,J.Vac.Sci.Technol.,B22(1)(2004)289.[9]R.K.Y.Fu,Y.F.Mei,G.J.Wan,G.G.Siu,Paul K.Chu,Y.X.Huang,X.B.Tian,S.Q.Yang,J.Y.Chen,Surf.Sci.573(2004)426.[10]R.J.Good,J.Adhes.Sci.Technol.2(6)(1992)1269.[11]C.J.Van Oss,M.K.Chaudhury,R.J.Good,Chem.Rev.88(1988)927.[12]M.Amaral,M.A.Lopes,J.D.Santos,R.F.Silva,Biomaterials23(2002)4123.[13]A.C.Ferrari,J.Robertson,Phys.Rev.,B61(20)(2000)14095.[14]J.F.Zhao,P.Lemoine,Z.H.Liu,J.P.Quinn,P.Maguire,J.A.Mc Laughlin,Diamond 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高分子材料固化技术Polymer materials have become ubiquitous in modern society due to their versatility and ease of processing. These materials are used in a wide range of applications, from packaging and construction to electronics and healthcare. One of the key processes involved in the production of polymer materials is curing, which involves converting the material from a liquid or soft state to a solid state through chemical reactions. This curing process plays a crucial role in determining the properties and performance of the final polymer product.高分子材料因其多样性和易加工性而在现代社会中无处不在。
这些材料用于各种应用领域,从包装和建筑到电子产品和医疗保健。
在高分子材料的生产过程中,一个关键的过程是固化,通过化学反应将材料从液体或软态转变为固态。
这个固化过程对最终高分子产品的性能和性质起着至关重要的作用。
The curing of polymer materials can be achieved through various methods, including thermal curing, photo curing, and chemical curing. Thermal curing involves heating the polymer material to a specific temperature, which activates the curing reaction. Photocuring, on the other hand, uses ultraviolet (UV) light to initiate the curing reaction, making it a fast and efficient process. Chemical curing, also known as crosslinking, involves the use of chemical additives to promote the curing reaction. Each curing method has its advantages and limitations, depending on the specific requirementsof the polymer material being processed.高分子材料的固化可以通过多种方法实现,包括热固化、光固化和化学固化。
涂层浸渍工艺英文Here is an essay on the topic of "Coating and Impregnation Processes" in English, with the content exceeding 1000 words as requested. The essay does not include a title and has no extra punctuation marks in the main text.The manufacturing and engineering industries rely heavily on various coating and impregnation processes to enhance the properties and performance of materials and components. These processes involve the application of a protective or functional layer on the surface of a substrate, or the infusion of a substance into the porous structure of a material. The choice of the appropriate coating or impregnation method depends on the specific requirements of the application, the nature of the substrate, and the desired properties to be achieved.One of the most common coating processes is painting. Paints are applied to the surface of a material, typically a metal or a polymer, to provide protection against environmental factors such as corrosion, weathering, or chemical attack. The paint film can also serve an aesthetic purpose, improving the appearance and visual appeal of the coated object. The painting process can be carried out using a variety of techniques, including brush application, roller application,spray painting, or electrostatic painting, depending on the size, shape, and complexity of the substrate.Another widely used coating process is electroplating, which involves the deposition of a thin layer of a metal onto the surface of a conductive substrate. Electroplating is commonly used to improve the wear resistance, corrosion resistance, and aesthetic appeal of the coated surface. The process involves immersing the substrate in an electrolytic solution containing dissolved metal ions, and then applying an electrical current to facilitate the deposition of the metal onto the surface of the substrate.Chemical vapor deposition (CVD) is a coating process that involves the decomposition of gaseous precursors on the surface of a heated substrate, leading to the formation of a thin film. This process is widely used in the semiconductor industry to deposit various materials, such as silicon, silicon dioxide, or metal films, on semiconductor wafers. CVD can also be used to coat tools, cutting edges, and other industrial components to improve their hardness, wear resistance, and thermal stability.Physical vapor deposition (PVD) is another coating technique that involves the deposition of a thin film onto a substrate through the condensation of vaporized material. PVD processes include sputtering, evaporation, and ion plating, and they are often used toapply hard, wear-resistant coatings on cutting tools, dies, and other industrial components.In addition to surface coatings, impregnation processes are also widely used in various industries. Impregnation involves the infusion of a substance, such as a resin or a lubricant, into the porous structure of a material. This process can be used to enhance the mechanical, thermal, or electrical properties of the material, or to introduce specific functionalities, such as water resistance or fire retardancy.One common impregnation process is resin infusion, which is widely used in the composite manufacturing industry. In this process, a thermoset resin, such as epoxy or polyester, is infused into a reinforcement material, such as fiberglass or carbon fiber, to create a strong and lightweight composite component. The impregnation of the reinforcement with the resin improves the overall mechanical properties of the composite, making it suitable for a wide range of applications, including aerospace, automotive, and marine structures.Another impregnation process is the treatment of wood with preservatives, such as copper chromium arsenate (CCA) or borate-based formulations. These preservatives are infused into the porous structure of the wood, providing protection against decay, insect attack, and weathering, which significantly extends the useful life ofthe wood in outdoor applications.Impregnation processes can also be used to introduce lubricants or other functional substances into porous materials, such as sintered metals or ceramics. This is particularly important in the production of self-lubricating bearings and other mechanical components, where the impregnated lubricant helps to reduce friction and wear during operation.The choice of the appropriate coating or impregnation process depends on a variety of factors, including the properties of the substrate, the desired performance characteristics of the final product, and the specific requirements of the application. In many cases, a combination of different coating and impregnation techniques may be used to achieve the desired result.For example, in the production of cutting tools, the substrate, which is typically made of a hard metal such as tungsten carbide, may be first coated with a thin layer of a wear-resistant material, such as titanium nitride or aluminum oxide, using a PVD process. The coated tool may then be further impregnated with a solid lubricant, such as molybdenum disulfide, to improve its lubrication properties and extend its useful life.Similarly, in the production of composite structures for aerospaceapplications, the reinforcement materials may be first impregnated with a thermosetting resin using a resin infusion process, and then the resulting composite may be coated with a protective layer, such as a polyurethane or a fluoropolymer coating, to improve its resistance to weathering, UV radiation, and chemical attack.The development and optimization of coating and impregnation processes is an ongoing area of research and innovation, driven by the constantly evolving needs of various industries. As new materials and applications emerge, the demand for more advanced and specialized coating and impregnation technologies will continue to grow, contributing to the advancement of manufacturing and engineering capabilities worldwide.。
纳米二氧化硅对成核、结晶和热塑性能的影响外文文献翻译(含:英文原文及中文译文)文献出处:Laoutid F, Estrada E, Michell R M, et al. The influence of nanosilica on the nucleation, crystallization andtensile properties of PP–PC and PP–PA blends[J]. Polymer, 2013, 54(15):3982-3993.英文原文The influence of nanosilica on the nucleation, crystallization andtensileproperties of PP–PC and PP–PA blendsLaoutid F, Estrada E, Michell R M, et alAbstractImmiscible blends of 80 wt% polypropylene (PP) with 20 wt% polyamide (PA) or polycarbonate (PC) were prepared by melt mixing with or without the addition of 5% nanosilica. The nanosilica produced a strong reduction of the disperse phase droplet size, because of its preferential placement at the interface, as demonstrated by TEM. Polarized Light Optical microscopy (PLOM) showed that adding PA, PC or combinations of PA-SiO2 or PC-SiO2 affected the nucleation density of PP. PA droplets can nucleate PP under isothermal conditions producing a higher nucleation density than the addition of PC or PC-SiO2. PLOM was found to be more sensitive to determine differences in nucleation than non-isothermal DSC. PP developed spherulites, whose growth was unaffected by blending, while its overall isothermal crystallizationkinetics was strongly influenced by nucleation effects caused by blending. Addition of nanosilica resulted in an enhancement of the strain at break of PP-PC blends whereas it was observed to weaken PP-PA blends. Keywords:Nanosilica,Nucleation,PP blends1 OverviewImmiscible polymer blends have attracted attention for decades because of their potential application as a simple route to tailor polymer properties. The tension is in two immiscible polymerization stages. This effect usually produces a transfer phase between the pressures that may allow the size of the dispersed phase to be allowed, leading to improved mixing performance.Block copolymers and graft copolymers, as well as some functional polymers. For example, maleic anhydride grafted polyolefins act as compatibilizers in both chemical affinities. They can reduce the droplet volume at the interface by preventing the two polymers from coalescing. In recent years, various studies have emphasized that nanofillers, such as clay carbon nanotubes and silica, can be used as a substitute for organic solubilizers for incompatible polymer morphology-stabilized blends. In addition, in some cases, nanoparticles in combination with other solubilizers promote nanoparticle interface position.The use of solid particle-stabilized emulsions was first discovered in 1907 by Pickering in the case of oil/emulsion containing colloidalparticles. In the production of so-called "Pickling emulsions", solid nanoparticles can be trapped in the interfacial tension between the two immiscible liquids.Some studies have attempted to infer the results of blending with colloidal emulsion polymer blends. Wellman et al. showed that nanosilica particles can be used to inhibit coalescence in poly(dimethylsiloxane)/polyisobutylene polymers. mix. Elias et al. reported that high-temperature silicon nanoparticles can migrate under certain conditions. The polypropylene/polystyrene and PP/polyvinyl acetate blend interfaces form a mechanical barrier to prevent coalescence and reduce the size of the disperse phase.In contrast to the above copolymers and functionalized polymers, the nanoparticles are stable at the interface due to their dual chemical nature. For example, silica can affect nanoparticle-polymer affinities locally, minimizing the total free energy that develops toward the system.The nanofiller is preferentially placed in equilibrium and the wetting parameters can be predicted and calculated. The difference in the interfacial tension between the polymer and the nanoparticles depends on the situation. The free-diffusion of the nanoparticle, which induces the nanoparticles and the dispersed polymer, occurs during the high shear process and shows that the limitation of the viscosity of the polymer hardly affects the Brownian motion.As a result, nanoparticles will exhibit strong affinity at the local interface due to viscosity and diffusion issues. Block copolymers need to chemically target a particular polymer to the nanoparticle may provide a "more generic" way to stabilize the two-phase system.Incorporation of nanosilica may also affect the performance of other blends. To improve the distribution and dispersion of the second stage, mixing can produce rheological and material mechanical properties. Silica particles can also act as nucleating agents to influence the crystallization behavior. One studies the effect of crystalline silica on crystalline polystyrene filled with polybutylene terephthalate (polybutylene terephthalate) fibers. They found a stable fibril crystallization rate by increasing the content of polybutylene terephthalate and silica. On the other hand, no significant change in the melt crystallization temperature of the PA was found in the PA/ABS/SiO2 nanocomposites.The blending of PP with engineering plastics, such as polyesters, polyamides, and polycarbonates, may be a useful way to improve PP properties. That is, improving thermal stability, increasing stiffness, improving processability, surface finish, and dyeability. The surface-integrated nano-silica heat-generating morphologies require hybrid compatibilization for the 80/20 weight ratio of the thermal and tensile properties of the blended polyamide and polypropylene (increasedperformance). Before this work, some studies [22] that is, PA is the main component). This indicates that the interfacially constrained hydrophobic silica nanoparticles obstruct the dispersed phase; from the polymer and allowing a refinement of morphology, reducing the mixing scale can improve the tensile properties of the mixture.The main objective of the present study was to investigate the effect of nanosilica alone on the morphological, crystalline, and tensile properties of mixtures of nanosilica alone (for mixed phases with polypropylene as a matrix and ester as a filler. In particular, PA/PC or PA/nano The effect of SiO 2 and PC/nanosilica on the nucleation and crystallization effects of PP as the main component.We were able to study the determination of the nucleation kinetics of PP and the growth kinetics of the particles by means of polarization optical microscopy. DSC measures the overall crystallization kinetics.Therefore, a more detailed assessment of the nucleation and spherulite growth of PP was performed, however, the effect of nanosilica added in the second stage was not determined. The result was Akemi and Hoffman. And Huffman's crystal theory is reasonable.2 test phase2.1 Raw materialsThe polymer used in this study was a commercial product: isotactic polypropylene came from a homopolymer of polypropylene. The Frenchformula (B10FB melt flow index 2.16Kg = 15.6g / 10min at 240 °C) nylon 6 from DSM engineering plastics, Netherlands (Agulon Fahrenheit temperature 136 °C, melt flow index 240 °C 2.16kg = 5.75g / 10min ) Polycarbonate used the production waste of automotive headlamps, its melt flow index = 5g / 10min at 240 °C and 2.16kg.The silica powder TS530 is from Cabot, Belgium (about 225 m/g average particle (bone grain) about 200-300 nm in length, later called silica is a hydrophobic silica synthesis of hexamethyldisilane by gas phase synthesis. Reacts with silanols on the surface of the particles.2.2 ProcessingPP_PA and PP-PC blends and nanocomposites were hot melt mixed in a rotating twin screw extruder. Extrusion temperatures range from 180 to 240 °C. The surfaces of PP, PA, and PC were vacuumized at 80°C and the polymer powder was mixed into the silica particles. The formed particles were injected into a standard tensile specimen forming machine at 240C (3 mm thickness of D638 in the American Society for Testing Materials). Prior to injection molding, all the spherulites were in a dehumidified vacuum furnace (at a temperature of 80°C overnight). The molding temperature was 30°C. The mold was cooled by water circulation. The mixture of this combination is shown in the table.2.3 Feature Description2.31 Temperature Performance TestA PerkineElmer DSC diamond volume thermal analysis of nanocomposites. The weight of the sample is approximately 5 mg and the scanning speed is 20 °C/min during cooling and heating. The heating history was eliminated, keeping the sample at high temperature (20°C above the melting point) for three minutes. Study the sample's ultra-high purity nitrogen and calibrate the instrument with indium and tin standards.For high temperature crystallization experiments, the sample cooling rate is 60°C/min from the melt directly to the crystal reaching the temperature. The sample is still three times longer than the half-crystallization time of Tc. The procedure was deduced by Lorenzo et al. [24] afterwards.2.3.2 Structural CharacterizationScanning electron microscopy (SEM) was performed at 10 kV using a JEOL JSM 6100 device. Samples were prepared by gold plating after fracture at low temperature. Transmission electron microscopy (TEM) micrographs with a Philips cm100 device using 100 kV accelerating voltage. Ultra-low cut resection of the sample was prepared for cutting (Leica Orma).Wide-Angle X-Ray Diffraction Analysis The single-line, Fourier-type, line-type, refinement analysis data were collected using a BRUKER D8 diffractometer with copper Kα radiation (λ = 1.5405A).Scatter angles range from 10o to 25°. With a rotary step sweep 0.01° 2θ and the step time is 0.07s. Measurements are performed on the injection molded disc.This superstructure morphology and observation of spherulite growth was observed using a Leica DM2500P polarized light optical microscope (PLOM) equipped with a Linkam, TP91 thermal stage sample melted in order to eliminate thermal history after; temperature reduction of TC allowed isothermal crystallization to occur from the melt. The form is recorded with a Leica DFC280 digital camera. A sensitive red plate can also be used to enhance contrast and determine the birefringence of the symbol.2.3.3 Mechanical AnalysisTensile tests were carried out to measure the stretch rate at 10 mm/min through a Lloyd LR 10 K stretch bench press. All specimens were subjected to mechanical tests for 20 ± 2 °C and 50 ± 3% relative humidity for at least 48 hours before use. Measurements are averaged over six times.3 results3.1 Characterization by Electron MicroscopyIt is expected that PP will not be mixed with PC, PA because of their different chemical properties (polar PP and polar PC, PA) blends with 80 wt% of PP, and the droplets and matrix of PA and PC are expectedmorphologies [ 1-4] The mixture actually observed through the SEM (see Figures 1 a and b).In fact, because the two components have different polar mixtures that result in the formation of an unstable morphology, it tends to macroscopic phase separation, which allows the system to reduce its total free energy. During shearing during melting, PA or PP is slightly mixed, deformed and elongated to produce unstable slender structures that decompose into smaller spherical nodules and coalesce to form larger droplets (droplets are neat in total The size of the blend is 1 ~ 4mm.) Scanning electron microscopy pictures and PP-PC hybrid PP-PA neat and clean display left through the particle removal at cryogenic temperatures showing typical lack of interfacial adhesion of the immiscible polymer blend.The addition of 5% by weight of hydrophobic silica to the LED is a powerful blend of reduced size of the disperse phase, as can be observed in Figures 1c and D. It is worth noting that most of the dispersed phase droplets are within the submicron range of internal size. The addition of nano-SiO 2 to PA or PC produces finer dispersion in the PP matrix.From the positional morphology results, we can see this dramatic change and the preferential accumulation at the interface of silica nanoparticles, which can be clearly seen in FIG. 2 . PP, PA part of the silicon is also dispersed in the PP matrix. It can be speculated that thisformation of interphase nanoparticles accumulates around the barrier of the secondary phase of the LED, thus mainly forming smaller particles [13, 14, 19, 22]. According to fenouillot et al. [19] Nanoparticles are mixed in a polymer like an emulsifier; in the end they will stably mix. In addition, the preferential location in the interval is due to two dynamic and thermodynamic factors. Nanoparticles are transferred to the preferential phase, and then they will accumulate in the interphase and the final migration process will be completed. Another option is that there isn't a single phase of optimization and the nanoparticles will be set permanently in phase. In the current situation, according to Figure 2, the page is a preferential phase and is expected to have polar properties in it.3.2 Wide-angle x-ray diffractionThe polymer and silica incorporate a small amount of nanoparticles to modify some of the macroscopic properties of the material and the triggered crystal structure of PP. The WAXD experiment was performed to evaluate the effect of the incorporation of silica on the crystalline structure of the mixed PP.Isotactic polypropylene (PP) has three crystalline forms: monoclinic, hexagonal, and orthorhombic [25], and the nature of the mechanical polymer depends on the presence of these crystalline forms. The metastable B form is attractive because of its unusual performance characteristics, including improved impact strength and elongation atbreak.The figure shows a common form of injection molding of the original PP crystal, reflecting the appearance at 2θ = 14.0, 16.6, 18.3, 21.0 and 21.7 corresponding to (110), (040), (130), (111) and (131) The face is an α-ipp.20% of the PA incorporation into PP affects the recrystallization of the crystal structure appearing at 2θ = 15.9 °. The corresponding (300) surface of the β-iPP crystal appears a certain number of β-phases that can be triggered by the nucleation activity of the PA phase in PP (see evidence The following nucleation) is the first in the crystalline blend of PA6 due to its higher crystallization temperature. In fact, Garbarczyk et al. [26] The proposed surface solidification caused by local shear melts the surface of PA6 and PP and forms during the injection process, promoting the formation of β_iPP. According to quantitative parameters, KX (Equation (1)), which is commonly used to evaluate the amount of B-crystallites in PP including one and B, the crystal structure of β-PP has 20% PP_PA (110), H(040) and Blends of H (130) heights (110), (040) and (130). The height at H (300) (300) for type A peaks.However, the B characteristic of 5 wt% silica nanoparticles incorporated into the same hybrid LED eliminates reflection and reflection a-ipp retention characteristics. As will be seen below, the combination of PA and nanosilica induces the most effective nucleatingeffect of PP, and according to towaxd, this crystal formation corresponds to one PP structure completely.The strong reductive fracture strain observations when incorporated into polypropylene and silica nanoparticles (see below) cannot be correlated to the PP crystal structure. In fact, the two original PP and PP_PA_SiO2 hybrids contain α_PP but the original PP has a very high form of failure when the strain value.On the other hand, PP-PC and PP-PC-Sio 2 blends, through their WAXD model, can be proven to contain only one -PP form, which is a ductile material.3.3 Polarized Optical Microscopy (PLOM)To further investigate the effect of the addition of two PAs, the crystallization behavior of PC and silica nanoparticles on PP, the X-ray diffraction analysis of its crystalline structure of PP supplements the study of quantitative blends by using isothermal kinetic conditions under a polarizing microscope. The effect of the composition on the nucleation activity of PP spherulite growth._Polypropylene nucleation activityThe nucleation activity of a polymer sample depends on the heterogeneity in the number and nature of the samples. The second stage is usually a factor in the increase in nucleation density.Figure 4 shows two isothermal crystallization temperatures for thePP nucleation kinetics data. This assumes that each PP spherulite nucleates in a central heterogeneity. Therefore, the number of nascent spherulites is equal to the number of active isomerous nuclear pages, only the nucleus, PP-generated spherulites can be counted, and PP spherulites are easily detected. To, while the PA or PC phases are easily identifiable because they are secondary phases that are dispersed into droplets.At higher temperatures (Fig. 4a), only the PP blend inside is crystallized, although the crystals are still neat PP amorphous at the observed time. This fact indicates that the second stage of the increase has been able to produce PP 144 °C. It is impossible to repeat the porous experiment in the time of some non-homogeneous nucleation events and neat PP exploration.The mixed PP-PC and PP-PC-SiO 2 exhibited relatively low core densities at 144 °C, (3 105 and 3 106 nuc/cm 3) suggesting that either PC nanosilica can also be considered as good shape Nuclear agent is used here for PP.On the other hand, PA, himself, has produced a sporadic increase in the number of nucleating events in PP compared to pure PP, especially in the longer crystallization time (>1000 seconds). In the case of the PP-PA _Sio 2 blend, the heterogeneous nucleation of PP is by far the largest of all sample inspections. All the two stages of the nucleating agent combined with PA and silica are best employed in this work.In order to observe the nucleation of pure PP, a lower crystallization temperature was used. In this case, observations at higher temperatures found a trend that was roughly similar. The neat PP and PP-PC blends have small nucleation densities in the PP-PC-SiO 2 nanocomposite and the increase also adds further PP-PA blends. The very large number of PP isoforms was rapidly activated at 135°C in the PP-PA nanoparticle nanometer SiO 2 composites to make any quantification of their numbers impossible, so this mixed data does not exist from Figure 4b.The nucleation activity of the PC phase of PP is small. The nucleation of any PC in PP can be attributed to impurities that affect the more complex nature of the PA from the PC phase. It is able to crystallize at higher temperatures than PP, fractional crystallization may occur and the T temperature is shifted to much lower values (see References [29-39]. However, as DSC experiments show that in the current case The phase of the PA is capable of crystallizing (fashion before fractionation) the PP matrix, and the nucleation of PP may have epitaxy origin.The material shown in the figure represents a PLOAM micrograph. Pure PP has typical α-phase negative spherulites (Fig. 5A) in the case of PP-PA blends (Fig. 5B), and the PA phase is dispersed with droplets of size greater than one micron (see SEM micrograph, Fig. 1) . We could not observe the spherulites of the B-phase type in PP-PA blends. Even according to WAXD, 20% of them can be formed in injection moldedspecimens. It must be borne in mind that the samples taken using the PLOAM test were cut off from the injection molded specimens but their thermal history (direction) was removed by melting prior to melting for isothermal crystallization nucleation experiments.The PA droplets are markedly enhanced by the nucleation of polypropylene and the number of spherulites is greatly increased (see Figures 4 and 5). Simultaneously with the PP-PA blend of silica nanoparticles, the sharp increase in nucleation density and Fig. 5C indicate that the size of the spherulites is very small and difficult to identify.The PP-PC blends showed signs of sample formation during the PC phase, which was judged by large, irregularly shaped graphs. Significant effects: (a) No coalesced PC phase, now occurring finely dispersed small droplets and (B) increased nucleation density. As shown in the figure above, nano-SiO 2 tends to accumulate at the interface between the two components and prevent coalescence while promoting small disperse phase sizes.From the nucleation point of view, it is interesting to note that it is combined with nanosilica and as a better nucleating agent for PP. Combining PCs with nanosilica does not produce the same increase in nucleation density.Independent experiments (not shown here) PP _ SiO 2 samplesindicate that the number of active cores at 135 °C is almost the same as that of PP-PC-SiO2 intermixing. Therefore, silica cannot be regarded as a PP nucleating agent. Therefore, the most likely explanation for the results obtained is that PA is the most important reason for all the materials used between polypropylene nucleating agents. The increase in nucleation activity to a large extent may be due to the fact that these nanoparticles reduce the size of the PA droplets and improve its dispersion in the PP matrix, improving the PP and PA in the interfacial blend system. Between the regions. DSC results show that nano-SiO 2 is added here without a nuclear PA phase.4 Conclusion5% weight of polypropylene/hydrophobic nanosilica blended polyamide and polypropylene/polycarbonate (80E20 wt/wt) blends form a powerful LED to reduce the size of dispersed droplets. This small fraction of reduced droplet size is due to the preferential migration of silica nanoparticles between the phases PP and PA and PC, resulting in an anti-aggregation and blocking the formation of droplets of the dispersed phase.The use of optical microscopy shows that the addition of PA, the influence of PC's PA-Sio 2 or PC-Sio 2 combination on nucleation, the nucleation density of PP polypropylene under isothermal conditions is in the following approximate order: PP <PP-PC <PP -PC-SiO 2<<PP-PA<<< PP-PA-SiO 2. PA Drip Nucleation PP Production of nucleation densities at isothermal temperatures is higher than with PC or PC Sio 2D. When nanosilica is also added to the PP-PA blend, the dispersion-enhanced mixing of the enhanced nanocomposites yields an intrinsic factor PP-PA-Sio2 blend that represents a PA that is identified as having a high nucleation rate, due to nanoseconds Silicon oxide did not produce any significant nucleation PP. PLOAM was found to be a more sensitive tool than traditional cooling DSC scans to determine differences in nucleation behavior. The isothermal DSC crystallization kinetics measurements also revealed how the differences in nucleation kinetics were compared to the growth kinetic measurements.Blends (and nanocomposites of immiscible blends) and matrix PP spherulite assemblies can grow and their growth kinetics are independent. The presence of a secondary phase of density causes differences in the (PA or PC) and nanosilica nuclei. On the other hand, the overall isothermal crystallization kinetics, including nucleation and growth, strongly influence the nucleation kinetics by PLOAM. Both the spherulite growth kinetics and the overall crystallization kinetics were successfully modeled by Laurie and Huffman theory.Although various similarities in the morphological structure of these two filled and unfilled blends were observed, their mechanical properties are different, and the reason for this effect is currently being investigated.The addition of 5% by weight of hydrophobic nano-SiO 2 resulted in breaking the strain-enhancement of the PP-PC blend and further weakening the PP-PA blend.中文译文纳米二氧化硅对PP-PC和PP-PA共混物的成核,结晶和热塑性能的影响Laoutid F, Estrada E, Michell R M, et al摘要80(wt%)聚丙烯与20(wt %)聚酰胺和聚碳酸酯有或没有添加5%纳米二氧化硅通过熔融混合制备不混溶的共聚物。
英文回答:The encapsulation technology of the cryogenic infrared focal plane detectorponent plays a vital role in ensuring the stability and performance of the detector under extreme temperature conditions. One of the principal challenges in the development of such encapsulation technology is the necessity of providing a hermetic seal for the detectorponents while preserving their sensitivity to infrared radiation. This can be achieved through the utilization of various materials and processes, such as low-temperature bonding techniques, the selection of suitable packaging materials with low outgassing rates, and the implementation of advanced assembly methods to minimize thermal stress on the detector. Furthermore, these encapsulation techniques must also consider the requirements forpactness, light weight, andpatibility with the overall system design. It is essential that the encapsulation process be optimized to minimize the impact on the overall performance of the detector and to ensure long-term reliability in harsh operating environments.低温红外焦平面探测器的封装技术在确保探测器在特殊温度条件下的稳定性和性能方面发挥着至关重要的作用。
SMA树脂在玻纤增强塑料中的应用分析摘要:玻纤增强塑料是一种重要的工程材料,具有高强度、低重量、良好的耐腐蚀性能和电气绝缘性能等优点。
然而,传统玻纤增强塑料在高温环境下容易发生变形和融化的问题,限制了其在高温环境下的广泛应用。
SMA (形状记忆合金)树脂作为一种新型材料,具有良好的热稳定性和形状记忆效应。
本文将对SMA树脂在玻纤增强塑料中的应用进行详细的分析与探讨。
1.简介1.1玻纤增强塑料的特点1.2SMA树脂的特点2.SMA树脂在玻纤增强塑料中的应用2.1提高玻纤增强塑料的热稳定性2.2提高玻纤增强塑料的力学性能2.3提高玻纤增强塑料的耐腐蚀性能2.4提高玻纤增强塑料的电气绝缘性能3.SMA树脂在玻纤增强塑料中的制备方法3.1混合法3.2共混法3.3涂覆法4.SMA树脂玻纤增强塑料的应用案例4.1在汽车行业中的应用案例4.2在航空航天行业中的应用案例4.3在电子电器行业中的应用案例5.SMA树脂玻纤增强塑料的未来发展趋势结论:Abstract:Glass fiber reinforced plastics (GFRP) are important engineering materials with advantages such as high strength, low weight, good corrosion resistance, and electrical insulation properties. However, traditional GFRP tends to deform and melt under high temperature conditions, limiting its extensive application in high-temperature environments. Shape Memory Alloy (SMA) resin, as a new type of material, exhibits excellent thermal stability and shape memory effect. This paper analyzes and discusses the application of SMA resin in GFRP in detail.1. Introduction1.1 Characteristics of glass fiber reinforced plastics1.2 Characteristics of SMA resin2. Application of SMA resin in GFRP2.1 Improving the thermal stability of GFRP2.2 Enhancing the mechanical properties of GFRP2.3 Improving the corrosion resistance of GFRP2.4 Enhancing the electrical insulation properties of GFRP3. Preparation methods of SMA resin GFRP3.1 Mixing method3.2 Co-blending method3.3 Coating method4. Application cases of SMA resin GFRP4.1 Application cases in the automotive industry4.2 Application cases in the aerospace industry4.3 Application cases in the electronics industry5. Future development trends of SMA resin GFRPConclusion:The application of SMA resin in GFRP shows promising prospects and has achieved significant results in different fields. Future research should focus on further improving the preparation process of SMA resin and enhancing its performance to meet the high-performance requirements of GFRP in different industries.。
专利名称:STORAGE ELEMENT AND MEMORY发明人:HOSOMI, MASANORI,OHMORI,HIROYUKI,IKARASHI, MINORU,YAMAMOTO,TETSUYA,HIGO, YUTAKA,YAMANE,KAZUTAKA,OISHI, YUKI,KANO, HIROSHI申请号:EP08790730申请日:20080630公开号:EP2172969A4公开日:20130313专利内容由知识产权出版社提供摘要:A memory capable of improving the thermal stability without increasing the write current is provided. The memory is configured to include: a storage element 3 which has a storage layer 17 that holds information according to a magnetization state of a magnetic substance and in which a magnetization fixed layer 31 is provided on the storage layer 17 with an intermediate layer 16 interposed therebetween, the intermediate layer 16 is formed of an insulator, the direction of magnetization M1 of the storage layer 17 is changed by injecting electrons spin-polarized in a lamination direction such that the information is recorded in the storage layer 17, and distortion is applied to the storage layer 17 from an insulating layer which exists around the storage layer 17 and has a smaller coefficient of thermal expansion than the storage layer 17; and a wiring line for supplying a current flowing in the lamination direction of the storage element 3. Description of Reference Numerals and Signs 3: STORAGE ELEMENT 4, 21: CONTACT LAYER 11: BASE LAYER 12: ANTIFERROMAGNETIC LAYER 13, 15: FERROMAGNETIC LAYER 14: NON-MAGNETIC LAYER 16: TUNNEL INSULATING LAYER 17: STORAGE LAYER 18: CAPLAYER 22, 23, 25, 42, 44: INSULATING LAYER 24: BIT LINE 31: MAGNETIZATION FIXED LAYER 41: INSULATING LAYER (WITH A RELATIVELY SMALL COEFFICIENT OF THERMAL EXPANSION) 43: LINER LAYER 45: ELEMENT SEPARATION LAYER申请人:SONY CORPORATION更多信息请下载全文后查看。
超声波耦合剂英语Ultrasonic Coupling AgentsUltrasonic technology has become an indispensable tool in various industries, from medical diagnostics to industrial inspection. At the heart of these applications lies the crucial role of ultrasonic coupling agents. These specialized liquids or gels play a vital function in facilitating the efficient transfer of ultrasonic energy from the transducer to the target surface, ensuring accurate and reliable measurements or treatments.The primary purpose of an ultrasonic coupling agent is to bridge the gap between the transducer and the object being examined or treated. This interface is often characterized by air gaps or uneven surfaces, which can significantly impede the transmission of ultrasonic waves. By applying a thin layer of a coupling agent, these impediments are minimized, allowing the ultrasonic energy to pass through with minimal loss and distortion.One of the key properties of an effective ultrasonic coupling agent is its ability to match the acoustic impedance of the transducer and the target material. Acoustic impedance is a measure of the resistance tothe flow of sound waves in a medium, and it is determined by the density and speed of sound in that medium. When the acoustic impedance of the coupling agent closely matches that of the transducer and the target material, the ultrasonic energy can be efficiently transferred, reducing reflections and ensuring optimal signal quality.In addition to impedance matching, ultrasonic coupling agents must possess several other important characteristics. They should have a low viscosity to facilitate easy application and uniform coverage, and they should be non-toxic, non-irritating, and compatible with the materials they come into contact with. Coupling agents should also be thermally stable, able to withstand the heat generated during high-intensity ultrasonic applications, and resistant to degradation over time.The choice of an appropriate ultrasonic coupling agent depends on the specific application and the materials involved. In medical imaging, for example, water-based gels are commonly used due to their compatibility with the human body and their ability to conform to the contours of the skin. In industrial applications, such as non-destructive testing, silicone-based or oil-based coupling agents may be preferred for their ability to withstand higher temperatures and pressures.The development of advanced ultrasonic coupling agents has been an ongoing area of research and innovation. Scientists and engineers are constantly exploring new formulations and materials to improve the performance, durability, and versatility of these critical components. For instance, the incorporation of nanoparticles or other additives can enhance the thermal stability, acoustic impedance matching, and even the antimicrobial properties of coupling agents.Moreover, the application of ultrasonic technology is continuously expanding, driving the need for specialized coupling agents tailored to emerging applications. In the medical field, the use of high-intensity focused ultrasound (HIFU) for non-invasive treatment of various conditions, such as cancer and chronic pain, has created a demand for coupling agents that can withstand the intense energy levels without compromising their effectiveness.In the industrial sector, the growing use of ultrasonic technology for applications like structural health monitoring, material characterization, and process control has also led to the development of specialized coupling agents. These agents must be able to withstand harsh environments, resist chemical degradation, and maintain their performance under varying temperature and pressure conditions.As the reliance on ultrasonic technology continues to grow, the role of ultrasonic coupling agents becomes increasingly crucial. These unsung heroes of the ultrasonic world play a vital role in enabling the accurate, reliable, and safe use of this powerful technology across a wide range of industries. By continuously improving the performance and versatility of coupling agents, researchers and manufacturers are paving the way for even more innovative and impactful applications of ultrasonic technology in the years to come.。
Li元素对Al-Mg-Si合金微观组织演变与力学性能的影响摘要:本文以Al-Mg-Si合金为研究对象,研究Li元素对Al-Mg-Si合金微观组织演变及力学性能的影响。
利用透射电子显微镜(TEM)、高分辨率透射电镜(HRTEM)、扫描电镜(SEM)等多种手段对Al-Mg-Si合金和Al-Mg-Si-Li合金的微观组织结构进行了观察和分析。
结果表明,Li元素的添加对Al-Mg-Si合金的组织演变及力学性能均有较大的影响。
在微观组织方面,Li元素的加入使合金中析出的亚稳定Mg2Si相数量明显减少,Si 元素的析出形貌也发生了改变;同时,Li元素促进了Al-Mg-Si合金中的弥散Mg2Si相的形成,增强了合金的强度和硬度。
在力学性能方面,Li元素的添加使Al-Mg-Si-Li合金的屈服强度、抗拉强度和延伸率更高,在与Al-Mg-Si合金相同条件下,Li元素的添加可提高合金的力学性能。
关键词:Li元素,Al-Mg-Si合金,微观组织结构,力学性能,强度,硬度,延伸率Abstract:In this paper, Al-Mg-Si alloy was taken as theresearch object to investigate the influence of Li element on the microstructure evolution and mechanicalproperties of Al-Mg-Si alloy. The microstructure ofAl-Mg-Si alloy and Al-Mg-Si-Li alloy was observed and analyzed by transmission electron microscopy (TEM), high-resolution transmission electron microscopy (HRTEM), and scanning electron microscopy (SEM). The results showed that the addition of Li element had a significant impact on the microstructure evolution and mechanical properties of Al-Mg-Si alloy. In terms of microstructure, the addition of Li elementsignificantly reduced the amount of unstable Mg2Si phase precipitated in the alloy, and changed the precipitated morphology of Si element. At the same time, Li element promoted the formation of dispersed Mg2Si phase in Al-Mg-Si alloy, and enhanced the strength and hardness of the alloy. In terms of mechanical properties, the addition of Li element increased the yield strength, tensile strength and elongation of Al-Mg-Si-Li alloy. Under the same conditions as Al-Mg-Si alloy, the addition of Li element can improve the mechanical properties of the alloy.Keywords: Li element, Al-Mg-Si alloy, microstructure, mechanical properties, strength, hardness, elongationIn addition to its impact on microstructure and mechanical properties, the addition of Li element alsoaffects the corrosion resistance of Al-Mg-Si alloy. It has been observed that the corrosion resistance of Al-Mg-Si alloy can be improved with the addition of Li element, especially in aggressive environments.Furthermore, the addition of Li element also affects the thermal stability of Al-Mg-Si alloy. It has been reported that the addition of Li element can significantly improve the thermal stability of Al-Mg-Si alloy, restraining the coarsening of precipitates during high temperature exposure.Overall, the addition of Li element can bring significant benefits to the properties of Al-Mg-Si alloy, including improved microstructure, mechanical properties, corrosion resistance and thermal stability. However, the optimal amount of Li element and the detailed mechanisms of its effects need to be further investigated and optimized for different applicationsTo further improve the thermal stability of Al-Mg-Si alloy, there are a few approaches that can be taken. One method is to increase the amount of Si in the alloy, as Si can act as a stabilizing element for precipitates. However, increasing the Si content too much can lead to the formation of undesirable phases, such as β-AlFeSi, which can reduce the alloy'smechanical properties.Another approach is to incorporate other elements that can retard the coarsening of precipitates. For example, Scandium (Sc) has been found to be effective at inhibiting precipitate coarsening by forming a stable Sc-rich intermetallic phase, which reduces thediffusion rate of Mg and Si atoms. However, Sc is an expensive and rare element, making it challenging to adopt on an industrial scale.One more approach is the use of nano-sized reinforcing particles/disperse phase. For example, reinforcing Al-Mg-Si with nano-sized particles such as Al2O3 can improve its mechanical properties and thermalstability. This is because the nano-sized particlesact as pinning points for precipitates, preventing them from coarsening during high-temperature exposure. However, the challenge with this approach is the homogenous dispersion of nano-sized particles in the matrix of the alloy, which can be technically challenging.In summary, there are various ways to improve the thermal stability of Al-Mg-Si alloy, including adjusting the alloy's chemical composition, incorporating small amounts of other elements or nano-scale reinforcing particles, and optimizing heat treatment and processing parameters. Further research in this field will be essential for developing the optimal Al-Mg-Si alloy for different applications, such as the transportation industry, where lightweight materials with excellent thermal stability are highly desirableIn addition to the aforementioned methods, there are other ways to improve the thermal stability of Al-Mg-Si alloy. One approach is to use multi-component alloys. For example, the addition of small amounts of Scandium (Sc) can significantly enhance the thermal stability of Al-Mg-Si alloys. Sc can form nano-scale precipitates, which not only provide effective pinning sites for dislocations, but also inhibit the coarsening of the MgSi particles. The addition of Sc can also promote the formation of a fine-grained microstructure, which further enhances the strength and thermal stability of the alloy.Another approach is to introduce nano-scalereinforcing particles into the Al-Mg-Si alloy. These reinforcing particles, such as nanoparticles, nanotubes, or nanowires, can significantly strengthen the alloy without sacrificing its thermal stability. For example, carbon nanotubes (CNTs) have beenreported to improve the thermal stability of Al-Mg-Si alloys by reducing the thermal expansion coefficient, enhancing the strength and wear resistance, and inhibiting the coarsening of the MgSi particles.Optimizing heat treatment and processing parameters is also crucial for improving the thermal stability ofAl-Mg-Si alloy. Heat treatment can influence the microstructure and mechanical properties of the alloy by controlling the precipitation of MgSi particles, dislocation density, and grain size. For example, solution treatment followed by artificial aging can promote the formation of fine and uniformlydistributed MgSi particles, thereby enhancing the strength and thermal stability of the alloy. Meanwhile, cold rolling, extrusion, or forging can refine the grain size and improve the texture and strength of the alloy.In conclusion, the thermal stability of Al-Mg-Si alloy can be improved by adjusting the chemical composition, introducing small amounts of other elements or nano-scale reinforcing particles, and optimizing heat treatment and processing parameters. These methods can enhance the strength, wear resistance, and dimensional stability of the alloy, and expand its applications in different industries. However, further research isneeded to fully understand the underlying mechanisms and develop more effective strategies for improving the thermal stability of Al-Mg-Si alloy总之,通过改变化学成分、引入微小的其他元素或纳米级别的增强颗粒,并优化热处理和加工参数,可以改善Al-Mg-Si合金的热稳定性,并扩大其在不同行业的应用。
Wood Sci Technol(2011)45:383–388DOI10.1007/s00226-010-0321-yO R I G I N A LImproving the thermal stability of one-component polyurethane adhesives by addingfiller materialSebastian Clau b•Karin Allenspach•Joseph Gabriel•Peter NiemzReceived:27March2009/Published online:30March2010ÓSpringer-Verlag2010Abstract The aim of the current study is to improve the thermal stability of one-component moisture-curing polyurethane adhesives.The approach here tends to add suitablefiller materials to the adhesive and to study the resulting effects.The investigation covers mechanical tests to determine the shear strength of the glued wood joints according to EN302-1(2004).Furthermore,the distribution of thefiller material within the adhesive is shown by means of environmental scanning electron microscopy combined with energy-dispersive X-ray spectroscopy analysis.The thermal stability of the glued wood joints could be significantly improved by adding chalk with a volume fraction of30%to the adhesive.IntroductionOne-component polyurethane adhesives(1C PUR)are increasingly used for the bonding of wood.The properties of the reacted polymers(like elasticity,strength, temperature,and moisture resistance)are influenced by the prepolymer as well as by additives like surfactant,catalyst,and especiallyfiller material.Filler materials are non-volatile,non-gluing matters,which are insoluble in the mon fillers arefibres(glassfibre,mica),powders(cellulose,aluminium oxide,silica), sheet-like materials(talc),cubic materials(chalk,barytes)(Zeppenfeld and Grunwald2005)or nowadays nano-particles(Park et al.2009)or functionalised nanoclays(Dodiuk et al.2006).S.Clau b(&)ÁK.AllenspachÁP.NiemzETH Zurich,Institute for Building Materials,Schafmattstrasse6,8093Zurich,Switzerlande-mail:sclauss@ethz.chJ.GabrielPurbond,Industriestrasse17a,6203Sempach Station,SwitzerlandIn the past,several investigations on different types of adhesives andfillers have been carried out.The mechanical properties of polyvinyl acetate depending on morphology and chemical structure of thefiller material(calcium carbonate)were investigated by Kovacˇevic´et al.(1996).The influence of the samefiller on the rheological and adhesion properties of a water-based polyurethane dispersion was investigated by Mun˜oz Mila´n et al.(2005).Mansouri and Pizzi(2007)improved the performance of urea–formaldehyde and phenol–formaldehyde resin by adding micronised polyurethane powder.Sepulcre-Guilabert et al.(2001)proposed natural ultramicronised calcium carbonate and mixtures of fumed silica with natural ultramicronised calcium carbonate asfiller for solvent-based PUR.Investigations on the structure–property relationships of1C PUR adhesives for wood,including adhesives withfibrousfillers,and their sensitivity to low wood moisture content(WMC)were carried out by Beaud et al.(2006).In contrast, Richter and Schierle(2002)and Schro¨dter and Niemz(2006)investigated the adhesive performance of1C PUR under high moisture and temperature conditions. It can be concluded that the bonding strength of1C PUR adhesives decreases with increasing WMC and temperature,respectively.The investigations mentioned above show that the adhesion of joints produced with adhesives containingfillers was noticeably increased.The goal of this study is to investigate if comparable improvements are also achievable for the use of1C PUR adhesives under high temperature exposure.Materials and methodsThree laboratory adhesives were produced by Purbond(Sempach Station,Switzer-land)with a varyingfiller material content.Thereby chalk was mixed into the adhesive using volume fractions of15and30%.The adhesives’parameters are listed in Table1.All bondings were carried out with beech wood(Fagus sylvatica L.).The raw density q at an equilibrium moisture content x of(12±1)% amounted to(745±34)kg/m3.The one-sided application of the adhesives was carried out with a spread of150g/m2and a pressing pressure of0.7MPa.To investigate the influence of thefiller material content on the shear strength,15 specimens of each group were tempered in a drying chamber for1h at100and 150°C,respectively.Another group of specimens was conditioned at different relative humidities(35,65,85,95%RH)at a temperature of20°C.Table1Adhesives’structural propertiesAdhesive A B CFiller content(%)01530 Isocyanat(%)151515 Open time(min)606060 Viscosity(mPas)6,5809,34013,960The shear strength was determined according to EN302-1(2004).The specimens were tested using a displacement-controlled universal testing machine (Zwick Z100)under standard climatic conditions(20°C,65%RH).The shear strain e was evaluated with a video-extensometer.After recording the stress–strain curve until failure,the wood failure percentage was estimated visually in steps of 10%.In addition,an environmental scanning electron microscope(ESEM)was used, and the bondline was analysed by means of energy-dispersive X-ray spectroscopy (EDX)to investigate the penetration depth and distribution of the adhesives within the wood.The EDX analysis allows for chemical characterisation of the specimens and thereby to distinguish between adhesive,wood andfiller material,which contains a high amount of calcium.Results and discussionThe shear strength of the glued wood joints increased significantly with a higher content offiller material.The graphs in Fig.1indicate an increase of strength at standard climatic conditions,but also after temperature exposure.The maximum increase amounted to52%at100°C using30%filler.The wood failure percentage was also increased compared to adhesives withoutfiller(Table2)as a consequenceTable2Mean shear strength and median wood failure percentage of adhesive joints at varying climatic conditionsConditions AdhesiveA B CT(°C)RH(%)x(%)s(MPa)WF(%)s(MPa)WF(%)s(MPa)WF(%)150–0.09.42(1.30)010.89(3.28)5013.61(2.28)70100– 1.710.86(2.18)012.26(2.41)7016.24(2.43)70 2035 6.513.48(1.85)10016.35(1.47)10017.72(1.90)90 206511.812.29(1.85)5012.74(2.38)2016.37(1.54)30 208516.59.10(2.02)208.98(2.49)010.81(1.43)0 209521.4 5.58(2.70)0 5.44(1.87)0 6.44(2.54)0s mean tensile shear strength,standard derivation in brackets,WF median wood failure percentage,T temperature,RH relative humidity,x mean wood moisture contentof the better adhesion between wood and adhesive,which subsequently exceeded the wood strength.The effect of thefiller material decreased with increasing WMC.At6.5%wood moisture,the maximum overall increase of shear strength amounted to31%at30%filler material.Schro¨dter and Niemz(2006)determined maximum compression shear strength at about12%WMC within a similar investigation on commercially available1C PUR adhesives.From this,it follows that after the drying process, internal compression stresses arise within the bondline,which have a positive effect in the case of tensile load.In contrast to the specimens exposed to high temperatures,the average increase in shear strength at21.4%WMC was relatively low(15%);however,there was no significance at the5%level(Fig.2).This means that thefiller material had no substantial effect on the shear strength at high WMC.The limiting factor for the adhesive bond is the moisture resistance of the adhesive itself,independent of its filler material content.Hydrolytic effects are a possible explanation for the lower shear strength.The main reason for the increased shear strength is the reduced penetration into the cell lumina,which is clearly shown by the combined ESEM/EDX micrograph (Fig.3).On the left side(30%filler),a completelyfilled bondline and empty pores document a good bond.The adhesive withoutfiller(right side)on the other hand, shows a poorly bonded adherend.The adhesivefilled out pores even500l m away from the bondline;however,the joint starved instead.Already Suchsland(1958) advised that there is no relationship between the penetration depth and the bonding quality as long as the adhesivefills out the topmost surface forming cell layer.Because calcium carbonate was used asfiller material,the element calcium can be easily used for detecting the substance with EDX.It turned out that thefiller material was homogeneously dispersed within the adhesive matrix(Fig.3,picture detail)and no separations could be detected.Fig.3ESEM micrograph of1C PUR adhesive with30%filler(left),withoutfiller(right)and EDX mapping of calcium(picture detail)ConclusionChalk turned out to be a suitablefiller material,which is easily addable to the adhesive,well miscible and cost efficient and it significantly improves the thermal stability of glued wood joints in the aimed temperature range.For future studies,it would be of particular interest tofind suitable alternativefiller materials and to determine the optimalfiller material content regarding costs and bonding properties. 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