FDA18N50中文资料

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©2006 Fairchild Semiconductor Corporation1www.fairchildsemi.comFDA18N50 Rev. A

FDA18N50 500V N-Channel MOSFETOctober 2006UniFETTM

FDA18N50500V N-Channel MOSFET

Features•19A, 500V, RDS(on) = 0.265Ω @VGS = 10 V•Low gate charge ( typical 45 nC)•Low Crss ( typical 25 pF)•Fast switching•100% avalanche tested•Improved dv/dt capabilityDescriptionThese N-Channel enhancement mode power field effecttransistors are produced using Fairchild’s proprietary, planarstripe, DMOS technology.

This advanced technology has been especially tailored tominimize on-state resistance, provide superior switchingperformance, and withstand high energy pulse in the avalancheand commutation mode. These devices are well suited for highefficient switched mode power supplies and active power factorcorrection.

Absolute Maximum Ratings

Thermal Characteristics

DGSGSDTO-3PFDA Series

SymbolParameterFDA18N50UnitVDSSDrain-Source Voltage500VIDDrain Current- Continuous (TC = 25°C)- Continuous (TC = 100°C)1911.4AA

IDMDrain Current- Pulsed(Note 1)76AVGSSGate-Source voltage±30VEASSingle Pulsed Avalanche Energy(Note 2)945mJIARAvalanche Current(Note 1)19AEARRepetitive Avalanche Energy(Note 1)23mJdv/dtPeak Diode Recovery dv/dt(Note 3)4.5V/nsPDPower Dissipation(TC = 25°C)- Derate above 25°C2391.92WW/°C

TJ, TSTGOperating and Storage Temperature Range-55 to +150°C

TLMaximum Lead Temperature for Soldering Purpose,1/8” from Case for 5 Seconds300°C

SymbolParameterMin.Max.UnitRθJCThermal Resistance, Junction-to-Case--0.52°C/WRθCSThermal Resistance, Case-to-Sink Typ.0.24--°C/WRθJAThermal Resistance, Junction-to-Ambient--40°C/W

元器件交易网www.cecb2b.com2www.fairchildsemi.com

FDA18N50 Rev. A

FDA18N50 500V N-Channel MOSFETPackage Marking and Ordering Information

Electrical Characteristics TC = 25°C unless otherwise noted

NOTES:1. Repetitive Rating: Pulse width limited by maximum junction temperature2. L = 4.7mH, IAS = 19A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C3. ISD ≤ 19A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%5. Essentially Independent of Operating Temperature Typical Characteristics

Device MarkingDevicePackageReel SizeTape WidthQuantityFDA18N50FDA18N50TO-3PN--30

SymbolParameterConditionsMin.Typ.MaxUnitsOff CharacteristicsBVDSSDrain-Source Breakdown VoltageVGS = 0V, ID = 250µA500----V∆BVDSS/ ∆TJBreakdown Voltage Temperature CoefficientID = 250µA, Referenced to 25°C--0.5--V/°C

IDSSZero Gate Voltage Drain CurrentVDS = 500V, VGS = 0VVDS = 400V, TC = 125°C--------110µAµA

IGSSFGate-Body Leakage Current, ForwardVGS = 30V, VDS = 0V----100nAIGSSRGate-Body Leakage Current, ReverseVGS = -30V, VDS = 0V-----100nAOn CharacteristicsVGS(th)Gate Threshold VoltageVDS = VGS, ID = 250µA3.0--5.0VRDS(on)Static Drain-SourceOn-ResistanceVGS = 10V, ID = 9.5A--0.2200.265Ω

gFSForward TransconductanceVDS = 40V, ID = 9.5A(Note 4)--25--S

Dynamic CharacteristicsCissInput CapacitanceVDS = 25V, VGS = 0V,f = 1.0MHz--22002860pFCossOutput Capacitance--330430pFCrssReverse Transfer Capacitance--2540pFSwitching Characteristicstd(on)Turn-On Delay TimeVDD = 250V, ID = 19ARG = 25Ω(Note 4, 5)--55120nstrTurn-On Rise Time--165340nstd(off)Turn-Off Delay Time--95200nstfTurn-Off Fall Time--90190nsQgTotal Gate ChargeVDS = 400V, ID = 19AVGS = 10V(Note 4, 5)--4560nCQgsGate-Source Charge--12.5--nCQgdGate-Drain Charge--19--nCDrain-Source Diode Characteristics and Maximum RatingsISMaximum Continuous Drain-Source Diode Forward Current----19AISMMaximum Pulsed Drain-Source Diode Forward Current----76AVSDDrain-Source Diode Forward VoltageVGS = 0V, IS = 19A----1.4VtrrReverse Recovery TimeVGS = 0V, IS = 19AdIF/dt =100A/µs (Note 4)--500--nsQrrReverse Recovery Charge--5.4--µC

元器件交易网www.cecb2b.com3www.fairchildsemi.com

FDA18N50 Rev. A

FDA18N50 500V N-Channel MOSFETTypical Performance Characteristics

Figure 1. On-Region CharacteristicsFigure 2. Transfer Characteristics

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward VoltageDrain Current and Gate VoltageVariation vs. Source Current and Temperatue

Figure 5. Capacitance CharacteristicsFigure 6. Gate Charge Characteristics

10-110010110-1100101102 VGSTop : 15.0 V

10.0 V 8.0 V 7.0 V 6.5 V 6.0 VBottom : 5.5 V

* Notes : 1. 250µs Pulse Test

2. TC = 25oC

ID, Drain Current [A]

VDS, Drain-Source Voltage [V]24681012100101

102

150oC25oC-55oC* Notes : 1. VDS = 40V 2. 250µs Pulse Test

ID, Drain Current [A]

VGS, Gate-Source Voltage [V]

05101520253035404550556065700.10.20.30.40.50.6VGS = 20VVGS = 10V