半导体专业词汇--汇总

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Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body. Any lead with dam bar step dimensions exceeding 0.1mm is rejectable. end plug (S) manager of XX department XX Electronics CO.Ltd X-ray yield X-ray X-ray inspection safety curtain safety stock safety glasses ammoniam water Press the emergency button. lot for lot lifted bond lifted wedge cavity plate,cavity block PPM (parts per million) Pareto chart plate mold semiconductor insufficient ball size off loader wrong orentation molding wrong orientation molding molding molding mold chase mold chase molding mismatch packing packing packing box packing defect criteria shipping box carrying cost carrying cost rate safety time holdup time shelf life scrap remark backside metal (Au/Ag) back side back marking chip package chips specific gravity specific gravity hydrometer closed loop MRP closing time bending side rail edge die reject die around slice edge side rail edge die Tape & Reel tape/real peel back force test braid flat cable,ribbon cable flat ball variation discoloration discolor(yellowish,blcken,water mark) discoloration/oxidation/lifting deformed
SOP:离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。 SOP:由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。 S形尾塞 XX部门经理 XX电子有限公司 X管率 X射线 X-射线检验 安全光幕 安全库存量 安全眼镜 氨水 按下紧急按钮。 按需订货 昂球 昂楔 凹模 百万分之一 柏拉图 板状模组模具 半导体 半球 半自动框架输送机 包反 包反 包封 包封 包封模具 包封模具 包封偏差 包装 包装 包装盒(内箱) 包装盒缺点 包装外箱 保管费 保管费率 保险期 保压时间 保质期 报废 备注 背金/银 背面 背面打印 崩角 崩碎 比重 比重 比重计 闭环物料需求计划 闭模时间 边筋翘起 边晶 边晶 边框 边沿芯片 编带 编带 编带拉力测试 编织层 扁平电缆 扁球 变差 变色 变色(发黄,发黑,发花,水渍,酸斑) 变色、氧化、浮起 变形
变形 标杆瞄准 标签 标签、封装、QA允收章 标签内容错误 标签内容与内盒产品不符合 标签位置不对、标签贴反 标准 标准操作程序(作业指导书) 标准产品成本 标准单位运转工时 标准工资率 标准机器设置工时 表面安装 表面粗糙 表面贴装式 表面污染 别忘了在不良产品上作记号 冰箱 冰柱状 丙酮 饼夹 波峰焊 玻璃棒 玻璃转换温度 薄膜气泡 薄片,锯齿状 补焊 补零 补足欠交 不得有任何金属层腐蚀 不合格 不合格品 不活动报告 不良品 不良数管制图 不相同盖印 不粘 不正确的周期码 布线错误 布线图 步进夹子 步骤 部分盖印 擦痕 擦伤 擦锡 材料 材料清单 财务部 采购订单跟踪 采购订单价格 采购计划法 采购计划员 采购员 参数 残料率 残渣、废屑 仓库库位类型 仓位备注 仓位代码 仓位数量 仓位状况 操作规程(操作说明书/操作手册) 操作员 测镀 测浇口 测克 测克拉力 测克拉力机
中文 1号极限开关 232 bus的使用寿命已到或线路短路或断路 488 bus的使用寿命已到或线路短路或断路 5S(整理、整顿、清扫、清洁、修养) 5u之pp质滤心 ABC分类法 AUTO模 A板 BT指示剂 B板 CO2气泡机
英文 LS1(limit suitch 1) 232 bus error 488bus error 5S(Seiri-Seiton-Seiso-Seiketsu-Shitsuke) cartridge p.p 5u ABC classification automatic molding system A plate eriochrome black t indicator B plate CO2 bubbler Any device having a chip out greater than 0.5mm in width DIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收 (or depth) and 1.25mm in length is rejectable. The product is rejectable when pad support protrudes more DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。 than 0.25mm from the end of the package body.(sop:0.15mm). Any device showing bent leads (in case of doubts use the DIP:不符合脚量规之脚弯拒收。 applicable gauge) is rejectable. Non-uniform solder such that a lead exceeds the dimensions DIP:不均匀的镀层表面,使得小脚厚度大于0.4mm或宽度大于0.5mm或 of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is 大脚以上厚度大于0.75mm,拒收。 rejectable. Lead finish on the leads shall be smooth and continuous DIP:从脚尖端到肩膀弯脚处,脚的镀层表面须均匀且连续。 from lead tip up to and over bend of lead. Ejector marks more than above the surface or more than DIP:顶出孔不得高于胶体面或低于胶体表面0.5mm。 0.5mm below the surface of the device is rejectable. Lifting, peeling or flaking of the lead finish is rejectable DIP:离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。 excluding 0.5mm from the body. Package leads shall be free from attached foreign material DIP:小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm except for foreign material located above the seating plane 直径圆面积之沾污。 of the lead, not bigger than 0.15mm in diameter. Any lead with dam bar step dimensions exceeding 0.25mm DIP:由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。 is rejectable. driver board error Driver board的使用寿命已到或线路短路或断路 EDTA-2NA standard solution EDTA-2NA 标准溶液 eprom error Eprom的使用寿命已到或线路短路或断路 leasing mix bed resin bottle, kbs 94 KBS 94 混床树脂筒 stack loader L/F存放架 Lead frame reverse will cause reverse bending. L/F放反将导致反弯脚。 Lead Frame Auto Loader Machine L/F排放机 solde stipper for plastic package,TLS-85a L/F用剥锡剂 TLS-85a solde stipper for plastic package, TLS-85b L/F用剥锡剂 TLS-85b solder stipper for plastic package,TLS-86 L/F用剥锡剂 TLS-86 end plug (L) L形尾塞 end plug(L) L型尾塞 MPU error MPU的使用寿命已到或线路短路或断路 nitrogen gas flow rate N2流量 poprtation curve OC曲线 P.P Band P.P 打包袋 PDCA(Plan-Do-Check-Action) PDCA管理循环 PIN1 identification PIN1标示 The PIN1 identification must be present and in accordance PIN1标示要有且与规格所订的尺寸一致。 with the specified dimensions. anode bag p.p. PP材质阳极袋 QA mark QA允收章 QFP plastic tray QFP用的塑胶承载盘 RAM read/write error即RAM error RAM的使用寿命已到或线路短路或断路 Non-uniform lead finish such that a lead exceeds the SOP:不均匀的镀层表面,使得脚的宽度大于0.5mm或脚厚度大于0.25mm specified dimensions 0.5mm or leadl thickness exceeds 。 0.25mm is rejectable. Any devices having a chip out greater than 0.2mm width(or SOP:产品边缘上的裂角宽或深大于m,长大于0.6mm或露出体材料 depth) and 0.6mm in length or exposed lead frame material 拒收。 is rejectable. Ejector marks more than above the surface or more than SOP:顶出孔低于胶体表面0.2mm,或是高于胶体表面拒收。 0.2mm below the surface of the device is rejectable. Lead coplanarity shall be within 0.1mm of one another in the SOP:脚浮不得超过0.1mm。 vertical direction. SOP:脚上不得有任何外务物之沾污,但如果是废胶则不能大于50%脚 Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface. 宽为直径的圆面积。