DFG841技术规范

DFG841 磨片设备技术规范指标 features 1)For wafer ..φ8 ".. It is possible to grind to the wafer of maximum φ8 "in consideration of the large caliber of the wafer in recent years. 2)Fine finish of grinding side roughness Ra 0.01μm or less is possible. Past [sa-fe] according to the wheel technology and a high rigidity and the superprecision machine technology of the disco lasting for half a century. Fine finish that exceeds the common sense of [isukurainta] has been achieved. 3)Automatic management making by in-process measurement about grinding thickness The work thickness under grinding is measured, and the corrected complete, closed loop mechanism is adopted. [Sonota] It summons, the wheel is worn out, the influence such as the expansion and contraction of the spindle is not received easily, and a highly accurate finish thickness is managed. It can do. 4)Stiffness enhancement of chuck table, high rigidity, and adoption of low vibration spindle The turntable was abolished, and the chuck table was installed in strong [beddohe]. A new spindle of a high rigidity and the low vibration is adopted for the spindle that has a big influence on the processing of work and good. The grinding result can be obtained it is ..good... 5)Enhancement of safe design and various security functions Assume the worker protection to be the first by interlocking when the cover opens and shuts and adopting the UL recognition product, and, and, [Su] pin dollar air, the grinding water, and ..piling up.. flowing quantity etc. of cooling water are always observed, and the pole of the damage to the device at the emergency. Power is suppressed. The generation of static electricity is suppressed because it equips it with the ionizer as a countermeasure against static electricity. 6)Lightness and space-saving design Lightening was aimed at in consideration of the clean room installation. Moreover, the moved distance of work is made the shortest, and [se]. The miniaturization of the device was aimed at with [mufuro-]. 7)Enhancement of washing function The transportation pad is washed by water while standing by.

8)Improvement of operativeness It simplifies and color CRT display of the input with the dedicated keyboard will be displayed based on the experience of the conventional model. A Japanese mode and an English mode can ..(on the recognition inclination.. be changed by depending appropriate guidance display and Japanese syllabary Chinese character display. There are the ability) etc. 9)Abundant options Monitoring function by enhance by "Auto setup" etc. and "Each part monitor function" and "FA pairs High performance that many kinds, that is, extendibility improvement such as respondent" and various options can essentially satisfy [Wo] of ..becoming it.. device is offered.

4Basic configuration 1)Spindle 2)Z axis index part 3)[We-hachiyatsukute-buru] 4)[Haitoge-ji] of measurement of thickness of wafer 5)[We-nohenohendoringu] 6)Wafer washing part 7)Operation panel and CRT display part 8)Electrical equipment 9)Attached unit such as vacuum coolant units and [ea-fuirutore-shon]

5Basic specification (Pressures are all the gauge pressures). Wafer diameter and thickness that can be ground 5-1 MAXφ200mm (φ4-8 inch) and 1mm

5-2 grinding method Inn feeding grinding by wafer rotation

5-3 various modes Full auto mode and manual mode

0 0000000～300 min^-1(0～300 rpm) 4)Unit 1 of chuck rotational speed instruction Min^-1(1 rpm) 5)Size φ200 mm of wafer that can be adsorbed (..inch of size φ4-8 of wafer.. universal) 6)Two numbers of chuck tables 7)[Chatsukute-buru] washing water, air Fukiage [ge], and oil stone washing 8)Spark out frequency 0-999-rotation setting Whetstone 5-7 use φ200 mm (φ8 inch) diamond wheel

5-8 wafer transportation device 1)Two cassette storage number cassettes 2)Cassette department [furo-se-mufuro-] 3)[Supinnayunitto] water washing and two sided dryness

5-9 throughput 60 pieces/H(Drive continuously)(φ6 inch and rough processing # 360 and finish machining of grinding amount 200μm # 1400 and amount 20μm of grinding). 46 pieces/H(Drive continuously)(φ6 inch and rough processing # 360 and finish machining of grinding amount 200μm # 2000 and amount 20μm of grinding).

5-10 operations 1)Console display Data and the alarm states of the number of sheets of grinding and the measured thickness, etc. are displayed in both sides with CRT. 14-inch color 2)The main keyboard An auto beginning, a stop, various mode choices, the data inputs, and both sides are selected. It composes of a function key, ten keys, a supplementary key, and the cursor key, etc. 3)Manual keyboard It uses it for the manual operation and the maintenance, etc. of each part. It is possible to move to the machine front and the side, and operation [ka]. It is possible to operate it easily near the place.