PCA85162TQ9001,1;中文规格书,Datasheet资料

BD809 (NPN), BD810 (PNP)Plastic High Power Silicon TransistorThese devices are designed for use in high power audio amplifiers utilizing complementary or quasi complementary circuits.Features•DC Current Gain − h FE = 30 (Min) @ I C = 2.0 Adc •Pb −Free Packages are Available*MAXIMUM RATINGSRatingSymbol Value Unit Collector −Emitter Voltage V CEO 80Vdc Collector −Base Voltage V CBO 80Vdc Emitter −Base Voltage V EBO 5.0Vdc Collector Current I C 10Adc Base CurrentI B 6.0Adc Total Device Dissipation @ T C = 25°C Derate above 25°CPD 90720W W/°C Operating and Storage Junction Temperature RangeT J , T stg−55 to +150°CTHERMAL CHARACTERISTICSCharacteristicsSymbol Max Unit Thermal Resistance, Junction −to −Caseq JC1.39°C/WStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.10 AMPEREPOWER TRANSISTORS80 VOLTS 90 WATTSTO −220AB CASE 221A −09STYLE 1MARKING DIAGRAMBD8xx =Device Code x = 09 or 10A =Assembly Location Y =YearWW =Work WeekG=Pb −Free PackageSee detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.ORDERING INFORMATIONELECTRICAL CHARACTERISTICS (T C = 25°C unless otherwise noted)CharacteristicSymbol Min Max Unit Collector −Emitter Sustaining Voltage (Note 1)(I C = 0.1 Adc, I B = 0)BV CEO 80−−VdcCollector Cutoff Current(V CB = 80 Vdc, I E = 0)I CBO − 1.0mAdc Emitter Cutoff Current(V BE = 5.0 Vdc, I C = 0)I EBO −2.0mAdcDC Current Gain(I C = 2.0 A, V CE = 2.0 V)(I C = 4.0 A, V CE = 2.0 V)h FE3015−−Collector −Emitter Saturation Voltage (Note 1)(I C = 3.0 Adc, I B = 0.3 Adc)V CE(sat)− 1.1Vdc Base −Emitter On Voltage (Note 1)(I C = 4.0 Adc, V CE = 2.0 Vdc)V BE(on)−1.6VdcCurrent −Gain Bandwidth Product(I C = 1.0 Adc, V CE = 10 Vdc, f = 1.0 MHz)f T1.5−MHz1.Pulse Test: Pulse Width x 300 m s, Duty Cycle x2.0%.Figure 1. Active Region DC Safe Operating Area(see Note 1)10V CE , COLLECTOR-EMITTER VOLTAGE (VOLTS)310.10.3I C , C O L L E C T O R C U R R E N T (A M P )9080002550100125150175Figure 2. Power −Temperature Derating CurveT C , CASE TEMPERATURE (°C)P D , P O W E R D I S S I P A T I O N (W A T T S )7510706050403020V C E , C O L L E C T O R -E M I T T E R V O L T A G E (V O L T S )V C E , C O L L E C T O R -E M I T T E R V O L T A G E (V O L T S )Figure 3. DC Current GainIC , COLLECTOR CURRENT (AMP)h F E , D C C U R R E N T G A I NNPN BD809PNP BD810I C , COLLECTOR CURRENT (AMP)h F E , D C C U R RE N T G A I N50010050200205.010Figure 4. Collector Saturation Region2.0I B , BASE CURRENT (mA)1.81.61.41.201.00.20.60.80.4 2.01.81.61.41.201.00.20.60.80.4I B , BASE CURRENT (mA)2.81.61.22.400.80.42.0I C , COLLECTOR CURRENT (AMP)V , V O L T A G E (V O L T S )Figure 5. “On” VoltagesI C , COLLECTOR CURRENT (AMP)V , V O L T A G E (V O L T S )2.81.61.22.400.80.42.0Figure 6. Thermal Responset, PULSE WIDTH (ms)1.00.010.70.50.30.20.10.070.050.030.02r (t ), N O R M A L I Z E D E F F E C T I V E T R A N S I E N T T H E R M A L R E S I S T A N C ENote 1:There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I C − V CE limits of the transistor that must be observed for reliable operation, i.e., the transistor must not be subjected to greater dissipation than the curves indicate.The data of Figure 1 is based on T J(pk) = 150°C; T C is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T J(pk)v 150°C. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.ORDERING INFORMATIONDevicePackage Shipping †BD809TO −22050 Units / Rail BD809G TO −220(Pb −Free)BD810TO −22050 Units / Rail BD810GTO −220(Pb −Free)†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSTO −220CASE 221A −09ISSUE AGNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.5700.62014.4815.75B 0.3800.4059.6610.28C 0.1600.190 4.07 4.82D 0.0250.0360.640.91F 0.1420.161 3.61 4.09G 0.0950.105 2.42 2.66H 0.1100.161 2.80 4.10J 0.0140.0250.360.64K 0.5000.56212.7014.27L 0.0450.060 1.15 1.52N 0.1900.210 4.83 5.33Q 0.1000.120 2.54 3.04R 0.0800.110 2.04 2.79S 0.0450.055 1.15 1.39T 0.2350.255 5.97 6.47U 0.0000.0500.00 1.27V 0.045--- 1.15---Z---0.080--- 2.04FSEATING PLANESTYLE 1:PIN 1.BASE2.COLLECTOR3.EMITTER4.COLLECTORON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息:ONSEMIBD809G BD810G BD810。

元器件交易网DIP24:plastic dual in-line package; 24 leads (600 mil)SOT101-1SO24:plastic small outline package; 24 leads; body width 7.5 mm SOT137-1SSOP24:plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1TSSOP24:plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1HVQFN24:plastic thermal enhanced very thin quad flat package; no leads; 24 terminals;body 4 x 4 x 0.85 mm SOT616-1DefinitionsShort-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.DisclaimersLife support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.Contact informationFor additional information please visit.Fax: +31 40 27 24825For sales offices addresses send e-mail to:© Koninklijke Philips Electronics N.V. 2004All rights reserved. Printed in U.S.A.Date of release: 09-04Document order number:9397 750 14125。