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ANP银胶 presentation

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Ultrafine(<10nm) metal nanoparticles dispersed in polar or non-polar hydrocarbon solvents ¢Â ¢Â ¢Â Diverse Metal inks such as Gold, Silver, Palladium, Metal Alloy Inks Available. High solid % ( upto 65 %) enables fine patterning with high metal contents. High temperature curing metal inks for glass application available (Ex: PDP and other applications) ¢Â Low temperature curing metal inks for plastic substrate application available. (Ex: RFID and Flexible Circuit Board applications) Diverse dispersing solvent systems offers widen opportunity of applications. (Ex: Tetradecane, Toluene, Alcohols and etc.) Low Viscosity with high solid inks make diverse coating and patterning methods usable. (Ex: Ink-jet Printing , gravure patterning, Flexography and etc) ¢Â Direct fine dot or wire patterning is possible on the desk top by ink jet technology.
Polar Polar Polar nonpol ar nonpol ar nonpol ar
Properties
Low temp. Use No Metal Evapo ration at High Temp. Enhanced Adhes ion on Glass Mid.Te mp. Curing No Metal Evapo ration at High Temp. Enhanced Adhes ion on Glass
Applications
PDP Electrode, MLCC, PCB Board, RFID
Silver-Jet Ink Material
Products
Silver Jet Ink Series
(DGH / DGP / DGA DGW) Silver-Palladium Jet Ink (DGH)
Applic ations
STI ( Sha dow Trenc h Is olation ) CMP Metal CMP
Advanced Nano Products
Product s TRB Paste TiO2 photocatalyst Hydrophobic & Antibiotic coating solution
Applic ations
Electrode & EMI film for LCD, Touch panel , PDP, O rganic EL
Advanced Nano Products
Product s
Ceria Slurry(CeO2) Al2O3 Slurry ZrO2 Slurry
As d e s ign ru le cam e into m uch narrow er for the l atest chip fabrication CMP slurry bec ame critica l proc es s material en suring its re liability & the highe s t lev e l of p e rformance . ANP has d e velop e d C e ria slurr y to m e et such strong d e mands of the sl urry providing high selectiv ity, f ast re moval rate of oxid e, low def e ct ives & good s tability for STI CMP, which current Silica s lurry ca n’t achieve such a level of perform ance.
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ANP Metal Jet Ink Products
Silver Jet Inks
DGP-45-LT DGP-45-HT DGP-45-HTG DGH-55-LT DGH-55-HT DGH-55-HTG
Solid%
45% 45% 45% 5 > 0% 5 > 0% 5 > 0%
Solvents
Advanced Nano Products
Silver-Jet Ink Material
Products
Silver Jet Ink Series
(DGH / DGP / DGA DGW) Silver-Palladium Jet Ink (DGH)
ANP’s Silverjet Ink has been developed to provide an ink jet patterning application such as PDP electrode, MLCC, PCB etc. It can be reduced the production cost for the process as well as high concentration over 50% enables submicron patterning with high metal contents.
Applic, MLCC, PCB Board, RFID
Printable Electronic Market Research
(So urce: N anoMarkets, R e se arch Repor t s e pt. 2005 )
ANP Metal Jet Ink Products
Applic ations
Heat blocki ng wi ndow f ilm ( automobil e, resi den tial & offic e b uilding gl ass), Air cl eaner system , Pig ments, Sani tary ware & ceram ic tiles
Applic ations
LCD, Touch panel , TV brown tube, PC m onitor, Plastic/ Glass / Fil m / Sh eet coatin g, Sem iconductor packaging m aterial, OHP fi lm, MLCC electrode & etc.
ANP’s TRB pastes have been developed to provide a high IR shielding & visible light applications in automobile, residential & office building window glass films. TiO2 photocatalyst, available for the application to air cleaner systems, pigments, sanitary wares & ceramic tiles improving the comfortable circumstance in our daily lives.
ANP’s Silverjet Ink has been developed to provide an ink jet patterning application such as PDP electrode, MLCC, PCB etc. It can be reduced the production cost for the process as well as high concentration over 50% enables submicron patterning with high metal contents.
IT innovat ion dr iver
Nano Technology
NT is r e plac ing th e co nven tional micron scale technol ogy and accelerat ing the i nnovation of overall indust ries such a s elect ronics, com munic ation, new material, energy, environm ent & life sciences. ’ we lfare in the field of life scienc & me dic al applianc e e Improve energy eff iciency & environment al heal th & safety
Electronic display m aterial Products
ITO Sol ITO Coating solution ATO Sol ATO Coating solution Ag-Pd / Au Sol Ag-Pd / Au Paste Y2O3 Sol

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末町金属银胶操作流程

末町金属银胶操作流程

末町金属银胶操作流程1.打磨银胶模具表面。

Polish the surface of the silver paste mold.2.在模具表面涂抹防粘涂层。

Apply anti-stick coating to the surface of the mold.3.准备合适的银胶材料。

Prepare suitable silver paste material.4.在模具上均匀涂抹银胶。

Spread the silver paste evenly on the mold.5.将模具放入烘箱进行干燥。

Place the mold in the oven for drying.6.检查银胶干燥情况。

Check the drying condition of the silver paste.7.将干燥的银胶模具取出。

Take out the dried silver paste mold.8.进行手工修整，去除多余的银胶。

Hand-trim to remove excess silver paste.9.清洗干净修整后的银胶模具。

Clean the trimmed silver paste mold.10.检查模具表面是否有瑕疵。

Check for any defects on the surface of the mold.11.准备镀银的设备和材料。

Prepare silver plating equipment and materials. 12.在模具上进行镀银处理。

Silver plating process on the mold.13.检查镀银效果。

Check the silver plating effect.14.清洗干净镀银后的模具。

Clean the silver-plated mold thoroughly.15.进行质量检验。

Perform quality inspection.16.包装合格的银胶模具。

第三节 银胶绝缘胶使用作业规范

第三节 银胶绝缘胶使用作业规范

第三節銀膠﹑絕緣膠使用作業規范一. 1.銀膠的作用:導電﹑固定﹑連接晶片与支架.2.絕緣膠的作用:固定晶片在支架碗中央,并起到隔离支架与晶片導通.(只适用單晶雙線)二.銀膠的組成部份含有:銀粉﹑環氧樹脂﹑玻璃砂﹑稀釋劑.三. 銀膠﹑絕緣膠的儲存條件1.銀膠:冰箱-20℃以下/2月2.絕緣膠: 冰箱-20℃以下/6月四.現使用的銀膠型號有：銀膠型號:826-1 826-1DS (USA) T 3007-N (JAPAN)絕緣膠型號:OPD-11-H (元稼)五.銀膠的使用方式1.解凍:從冰箱取出后須于室溫(25℃)狀態下解凍MIN=30分鐘,以實際解凍完全(瓶体外無水珠)為准.(注意:此過程中不能打開瓶蓋)2.攪拌:解凍完成后,打開瓶蓋,使用專用的攪拌捧同一方向緩慢由底部向上攪拌3～5分鐘到均勻.3.分裝:攪拌后,依實際當天所需使用的銀膠量再分裝到專用的小銀膠筒中,每次使用時需要重复攪拌動作.4.使用方法:分裝好的銀膠筒中銀膠可直接使用,每次添加時需先少許攪拌1～2分鐘.銀膠筒中銀膠使用壽命為MAX=12小時(密封保存)5.使用時間(室溫﹢25℃狀態下)A.在手動為銀膠露于室內空气中的時間(即從銀膠添加到半成品銀膠入烤小于6小時).(點膠和背膠)B.自動和手動點膠作業,在使用過程中需每隔2小時對自動點膠座和手動針筒添加少許新銀膠,足夠兩小時使用量即可.背膠机上銀膠需在4小時添加一次.點膠座﹑針筒和背膠机需在24小時內清洗一次.六.銀膠的烘烤條件1.手動:150℃±5℃/2小時(MIN) 銀膠須按整批進出烤,烘烤中不得隨意打開烤箱,以免影響溫度變化造成銀膠烘烤不良.2.自動: 200℃±5℃/15分鐘(MIN)3.絕緣膠烘烤條件: 150℃±5℃/1小時(MIN)七.注意事項1.對銀膠解凍﹑烘烤﹑進出烤﹑烤箱溫度/時間作記錄并确認.2.絕緣膠的解凍和使用條件与銀膠條件一樣.（具体參見制造規格）3.絕緣膠不可与銀膠混烤,需用專用烤箱,并需用酸性清洗劑清洗烤箱,以免絕緣膠在烘烤過程中受堿性的污染,導致晶片焊接不良,影響其效果.4.烘烤時間必須准确,否則易產生歐姆接触,導致VFHIGH和亮度色澤不均.。

银胶

银胶


大功率LED封装
大功率LED封装由于结构和工艺复杂，并直接影响 到LED的使用性能和寿命，一直是近年来的研究热点， 特别是大功率白光LED封装更是研究热点中的热点。 LED封装的功能主要包括： 1、机械保护，以提高可靠性； 2、加强散热，以降低芯片结温，提高LED性能； 3、光学控制，提高出光效率，优化光束分布； 4、供电管理，包括交流/直流转变，以及电源控制等。
国内外研究状况及前景：
目前，中国台湾生产导电胶的单位主要有冠品化学股份有限公司，国 外企业有美国Epoxy的公司、Ablistick公司，Loctite公司、3M公司，日 本的日立公司、Three-Bond公司等。 已商品化的导电胶种主要有导电胶膏、导电胶浆、导电涂料、导电胶 带等组分有单、双组分。导电胶一般用于微电子封装、印刷电路板、导电 线路粘接等各种电子领域中。现今国内的导电胶无论从品种和性能上与国 外都有较大差距。导电胶作为锡膏的换代产品有着广阔的前景,但是目前 与锡膏或锡焊相比仍存在着成本高的问题，而且导电稳定性和耐久性仍有 待于提高。 今后的研究方向首先是对现有粘接体系的改进，如对环氧树脂的稀释、 复合和改性，使其既有着良好的力学性能又与导电粒子有良好的配合和适 宜的润湿作用。通过对固化动力学的研究，分析固化过程中活性基团的变 化以及交联网络的形成过程中导电粒子聚集态的变化规律，优化固化体系。 第二是制备出导电率高、性能稳定、耐腐蚀和环境影响的导电粒子，降低 成本，并提高导电胶的稳定性和可靠性。第三是发展新型的固化方式，提 高其工艺性，实现低温或者室温固化，如固化、电子束固化等。这方面的 研究工作虽已开展，但大多仍局限于研究阶段，还有很多工作仍待进行。
1,背光模组用LED及照明用高导热银胶 5,高反射印刷银胶
定义
导电胶是一种固化或干燥后具有一定导电性 能的胶黏剂,它通常以基体树脂和导电填料即导 电粒子为主要组成成分，通过基体树脂的粘接作 用把导电粒子结合在一起，形成导电通路，实现 被粘材料的导电连接。 由于银粉导电性优良且化学稳定性高，它在 空气中氧化速度极慢，在胶层中几乎不会被氧化， 即使氧化了，生成的银氧化物仍具有一定的导电 性，因而在市场中以银粉为导电填料的导电胶应 用范围最广，尤其是在对可靠性要求高的电气装 置上应用最多。 导电银胶主要由环氧树脂、银粉、固化剂、 促进剂及其他添加剂等构成。
presentation范文模板

presentation范文模板

presentation范文模板英文回答：Presentation is an important skill that is often required in various aspects of life, such as academic settings, professional environments, and even social gatherings. It allows individuals to effectively communicate their ideas, opinions, and information to an audience. In this presentation, I will discuss the importance of presentation skills and provide some tips on how to deliver a successful presentation.First and foremost, presentation skills are crucial in academic settings. Whether it's presenting a research paper, a project, or a case study, being able to effectively present your findings is essential. A well-delivered presentation not only showcases your knowledge and understanding of the subject matter but also engages the audience and keeps them interested in what you have to say. For example, when I was in college, I had to present mythesis to a panel of professors. By using visual aids,clear and concise language, and engaging body language, I was able to effectively convey my research findings and receive positive feedback.中文回答：演讲是一项重要的技能，通常在生活的各个方面都需要，比如学术环境、职业环境，甚至社交聚会。